JPH11111910A - Multi-chip mount semiconductor device and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To mount a semiconductor chip which is relatively large in area with respect to the package size. SOLUTION: The respective rear surface of the first and second lead frames 15 being made into circuits in advance are stuck to the top and bottom sides of a nonconductive tape 11, and further semiconductor chips 14a and 14b are mounted severally the first and second lead frames 15, and then these are encapsulated with resin to make it into a package. Hereby, the lead frame face for mounting the semiconductor chip becomes at least two times as large as the conventional one, keeping the size of the package made of molded resin small, so that it becomes possible to easily mount a semiconductor chip of relatively large area.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-chip mounted semiconductor device in which a large number of semiconductor chips are mounted and packaged on a lead frame previously formed into a circuit, and a method of manufacturing the same.

[0002]

2. Description of the Related Art FIG. 2 is a sectional view showing an example of the structure of a conventional semiconductor IC. Central lead frame (mounting base) 1
A semiconductor chip 2 is mounted thereon, and the semiconductor chip 2 and the outer lead frame 1 are electrically connected by bonding wires 3. The lead frame 1, the semiconductor chip 2, and the bonding wires 3 are packaged with their surroundings sealed with a mold resin 4.

In such a conventional semiconductor IC manufacturing technology and mounting technology, the area for mounting the semiconductor IC on the IC substrate is reduced by reducing the outer shape of the IC package and increasing the number of external terminals of the semiconductor IC. And the degree of high integration of the semiconductor chip built in the semiconductor IC. The miniaturization of the external shape of the IC package is determined by the layout limit of external terminals (minimum pitch, etc.), the layout limit of bonding terminals, and the bonding technology, and these are limited by the processing limits.

In such a situation, a large number of semiconductor chips are mounted on a pre-circuitized MCM lead frame 5 as in a multi-chip mounting (hereinafter sometimes abbreviated as MCM) technique as shown in FIG. Techniques have been developed for mounting circuit boards 2a and 2b (here, only two semiconductor chips are shown) to reduce the size of a circuit board.
However, since this method has a structure in which a large number of semiconductor chips are mounted on the same plane, only a semiconductor chip having a relatively small area with respect to the area of the package size can be mounted.

[0005]

SUMMARY OF THE INVENTION As described above, the semiconductor I
In order to reduce the area for mounting C on an IC substrate, a method called multi-chip mounting for reducing the size of a circuit board by simultaneously mounting a large number of semiconductor chips on a pre-circuitized lead frame has been developed. I have. However, this method has a problem that only a semiconductor chip having a relatively small area can be mounted with respect to the area of the package size, and the degree of freedom for mounting a large number of semiconductor chips having a relatively large area with respect to the area is small. Was.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems, and has as its object to easily mount a semiconductor chip having a relatively large area with respect to the package size while keeping the package size small. And a method for manufacturing the same.

[0007]

In order to achieve the above object, a first aspect of the present invention is characterized in that a tape-shaped non-conductive material and a circuit formed in advance are attached to one surface of the non-conductive material. A first lead frame, a pre-circuitized second lead frame attached to the other surface of the non-conductive material, and at least one or more first lead frames mounted on the first lead frame. One system semiconductor chip, and the second
At least one or more second-system semiconductor chips mounted on a lead frame of the second system, wires for electrically connecting the first-system semiconductor chip to the first lead frame, There is provided a wire for electrically connecting the semiconductor chip and the second lead frame.

According to the first aspect, the first lead frame and the second lead frame, which are preliminarily circuitized, are electrically insulated from each other in a sandwich shape with a tape-shaped non-conductive material therebetween. Have been. Even if the two lead frames are sandwiched in this manner, they do not cause an increase in the size. Therefore, the lead frame surface on which the semiconductor chip is mounted is at least twice as large as the conventional one while keeping the overall size substantially unchanged. I have. This allows
A semiconductor chip having a relatively large area is easily mounted.

A second aspect of the present invention is characterized in that a tape-shaped non-conductive material, a first circuitized lead frame attached to one surface of the non-conductive material, and the other of the non-conductive material. A pre-circuitized second lead frame attached to the surface of the first lead frame, at least one or more first-system semiconductor chips mounted on the first lead frame, and a second lead frame on the second lead frame. At least one or more second-system semiconductor chips mounted on the semiconductor chip, wires for electrically connecting the first-system semiconductor chip to the first lead frame, A wire electrically connecting the second lead frame;
The tape-shaped non-conductive material, first and second lead frames, and a package formed by resin-sealing the periphery of the first and second system semiconductor chips and wires are provided.

According to the second aspect of the present invention, the first lead frame and the second lead frame, which are preliminarily circuitized, are electrically insulated from each other in a sandwich shape with a tape-shaped non-conductive material therebetween. These components are packaged by sealing the periphery of these components with a resin. Even if the two lead frames are sandwiched in this manner, they do not cause an increase in size. Therefore, the package is kept small, and the lead frame surface for mounting the semiconductor chip is at least twice as large as the conventional one. I have. Thus, a semiconductor chip having a relatively large area with respect to the size of the package is easily mounted.

A feature of the third invention is that the back surface of the first lead frame, which is preliminarily circuitized, is attached to one surface of the tape-shaped non-conductive material, and the other surface of the non-conductive material is pre-circuited. Attaching the back surface of the second lead frame, mounting at least one semiconductor chip on the first lead frame, and mounting at least one semiconductor chip on the second lead frame. Process.

[0012]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view showing an embodiment of the semiconductor device of the present invention. On the upper and lower surfaces of the non-conductive tape 11, the back surfaces of the lead frames 12, 13, which are preliminarily circuitized, are attached. Semiconductor chip 14
a is mounted on a central lead frame (mounting base) 12, and the semiconductor chip 14a and the outer lead frame 12 are electrically connected by bonding wires 15. Similarly, the semiconductor chip 14b is mounted on a central lead frame 13 (mounting base), and the semiconductor chip 14b and the outer lead frame 13 are electrically connected by bonding wires 15.

The periphery of the non-conductive tape 11, the lead frames 12, 13, the semiconductor chips 14a, 14b, and the bonding wires 15 are sealed with a molding resin 16,
Packaged. In addition, the upper and lower lead frames 12, which are bonded to each other with a non-conductive tape 11,
Since the outer ends of the terminals 13 are insulated from each other, the terminals 13 can be used as separate external terminals.

Next, a method for manufacturing the semiconductor device of the present embodiment will be described. First, the back surface of a pre-circuitized lead frame 12 is attached to one surface of a tape-shaped non-conductive tape, and the pre-circuited lead frame 13 is mounted on the other surface of the non-conductive tape 11. Paste the back.

Subsequently, the semiconductor chip 14a is mounted on the lead frame 12 and the lead frame 13 is mounted.
The semiconductor chip 14b is mounted thereon. Thereafter, sealing is performed with a molding resin 16.

According to this embodiment, two systems of lead frames 12, 13 are bonded to the other surface of the non-conductive tape, and a plurality of semiconductor chips 14a, 14b are mounted on the respective lead frames 12, 13. Due to the mounting structure, the area for mounting the semiconductor chip can be at least twice as large as the conventional one while keeping the package size small, and the semiconductor chips 14a and 14b having a relatively large area with respect to the size can be easily manufactured. The circuit board can be mounted with a higher degree of integration than before, and the size and weight of the electric circuit can be further promoted.

In addition, as compared with the conventional package of one chip mount (see FIG. 2), the lead frames 12 and 13 have a sandwich structure with the non-conductive tape 11 interposed therebetween, so that the lead pitch is not reduced more than twice. External terminals can be held.

Furthermore, since the number of external terminals can be increased by bonding a lead frame, a tab type (TA
(B TYPE) frame can be easily performed.

[0019]

As described above in detail, according to the multi-chip mounted semiconductor device and the method of manufacturing the same of the present invention, a semiconductor chip having a relatively large area with respect to the package size can be obtained while keeping the package size small. Mounting can be performed, and accordingly, mounting on a substrate with a higher degree of integration than in the past becomes possible.

[Brief description of the drawings]

FIG. 1 is a sectional view showing one embodiment of a multi-chip mounted semiconductor device of the present invention.

FIG. 2 is a cross-sectional view showing a structural example of a conventional multi-chip mounted semiconductor device.

FIG. 3 is a cross-sectional view showing another example of the structure of a conventional multi-chip mounted semiconductor device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lead frame 2 Semiconductor chip 3 Bonding wire 4 Mold resin 5 Lead frame for MCM 11 Non-conductive tape 12, 13 Lead frame 14a, 14b Semiconductor chip 15 Bonding wire 16 Mold resin

Claims (3)

[Claims] 1. A tape-shaped non-conductive material, a first circuitized first lead frame attached to one surface of the non-conductive material, and a non-conductive material attached to the other surface of the non-conductive material. A pre-circuitized second lead frame, at least one or more first system semiconductor chips mounted on the first lead frame, and at least one semiconductor chip mounted on the second lead frame. A plurality of second-system semiconductor chips, wires for electrically connecting the first-system semiconductor chips and the first lead frame, and a second-system semiconductor chip and the second lead frame. And a wire for electrically connecting the semiconductor chip. 2. A tape-shaped non-conductive material, a first circuitized first lead frame attached to one surface of the non-conductive material, and a non-conductive material attached to the other surface of the non-conductive material. A pre-circuitized second lead frame, at least one or more first system semiconductor chips mounted on the first lead frame, and at least one semiconductor chip mounted on the second lead frame. A plurality of second-system semiconductor chips, wires for electrically connecting the first-system semiconductor chips and the first lead frame, and a second-system semiconductor chip and the second lead frame. A package formed by resin-sealing the tape-shaped non-conductive material, the first and second lead frames, the first and second system semiconductor chips, and the wires. Multi chip mounting a semiconductor device characterized by comprising: a di-, a. 3. A back surface of a pre-circuited first lead frame is attached to one surface of a tape-shaped non-conductive material, and a second circuit pre-circuited to the other surface of the non-conductive material.
Attaching at least one semiconductor chip on the first lead frame and mounting at least one semiconductor chip on the second lead frame. A method for manufacturing a multi-chip mounted semiconductor device, comprising: