JP2000260931A - Semiconductor device and manufacturing method thereof - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To make it possible to freely replace a plurality of connectable semiconductor devices and to improve the mounting density on a mounting board. SOLUTION: A package body 4 in which a semiconductor chip 1 is incorporated and which can be connected to each other is formed on an outer periphery, and a package body 4 is provided so as to be exposed at a connection section 4b of the package body 4 and is provided. An outer lead 2a electrically connected to the pad 1b, an inner lead 2b connected to the outer lead 2a, a tab 2c supporting the semiconductor chip 1, a pad 1b of the semiconductor chip 1 and the inner lead And a bonding wire 3 electrically connecting the outer leads 2a to each other when the plurality of package bodies 4 are mechanically connected to each other via the connecting portion 4b. It is a structure that can be detachably connected.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing technique, and more particularly to a technique effective when applied to a module product or a system product having a plurality of semiconductor devices.

[0002]

2. Description of the Related Art The technology described below studies the present invention,
Upon completion, they were examined by the inventor, and the outline is as follows.

A module product or a system product (for example, a system LSI (Large Scal
e), a memory module or a system board, etc.), a wiring pattern is formed on a mounting substrate (or a module substrate), thereby forming a surface corresponding to each of the semiconductor chips incorporated in each semiconductor device. The electrodes are electrically connected.

Therefore, in a system LSI, each function is integrated into one chip on a silicon semiconductor wafer, and a semiconductor device having this semiconductor chip mounted thereon is used as a system product.

In a memory module, a plurality of semiconductor devices each having a memory chip are mounted on a module substrate to form a module product.

Further, in a system board, a plurality of semiconductor devices each having a semiconductor chip having a different function are solder-mounted on a mounting board, and this is used as a system product.

[0007] The memory module is described in, for example, “September of Electronic Materials”, September 1, 1993, Industrial Research Institute, Inc., pp. 33-39.

[0008]

However, in the memory module and the system board of the above-mentioned technology, since each semiconductor device is electrically connected by a wiring pattern formed on the mounting board (module board), A wiring area for forming this wiring pattern is required on the mounting board, and as a result, it is difficult to improve the mounting density of the semiconductor device on the mounting board.

Further, in the case of a system LSI, since each function such as a memory unit, a CPU (Central Processing Unit) unit, and a gate array unit is integrated into one chip, a semiconductor chip is enlarged. Therefore, in order to suppress the chip size, it is necessary to employ a miniaturization process. However, if the miniaturization process is employed, the possibility of occurrence of defect failure due to minute foreign matter is considered to be high. In a chip-based system LSI, when some functions in the chip fail, it is impossible to reproduce the system LSI, which causes a problem of lowering the yield of the system LSI and increasing the cost.

An object of the present invention is to provide a semiconductor device which can be exchanged and which improves the mounting density on a mounting board, and a method of manufacturing the same.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0012]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

That is, a semiconductor device according to the present invention is provided with a package body in which a semiconductor chip is incorporated and a mutually connectable connecting portion is formed on an outer periphery, and is provided to be exposed at the connecting portion of the package body. An outer lead, which is an external terminal electrically connected to a surface electrode of a semiconductor chip and electrically connected thereto, and when different package bodies are connected to each other via the connecting portion, the outer leads correspond to the corresponding semiconductor chips. A wiring portion for electrically connecting the surface electrodes to each other via the outer leads, and when the different package bodies are mechanically connected to each other via the connecting portion, the outer leads are electrically connected to each other. It can be detachably connected so as to be connected to each other.

This makes it possible to block the semiconductor device and to replace the combined semiconductor device.

As a result, the semiconductor devices can be mechanically combined and mounted on the mounting substrate, and when mounting a plurality of semiconductor devices on the mounting substrate, the wiring for electrically connecting the semiconductor devices to each other can be obtained. There is no need to provide a pattern on the mounting board.

Therefore, the mounting density of the semiconductor device on the mounting board can be improved.

Further, a method of manufacturing a semiconductor device according to the present invention
Forming a package body including a semiconductor chip therein and arranging outer leads electrically connected to a surface electrode of the semiconductor chip at outer connection portions that can be connected to each other; When the main bodies are mechanically connected to each other via the connecting portion, the corresponding surface electrodes of the semiconductor chips can be detachably connected so as to be electrically connected to each other via the outer leads. It is for assembling a semiconductor device.

[0018]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a view showing an example of an embodiment of the internal structure of a semiconductor device according to the present invention, wherein (a) and (c) are plan views showing through a package body, and (b) is a view showing (a). A)
FIG. 2D is a cross-sectional view showing a cross section taken along the line BB of FIG. 1C, FIG. 2 is a side view showing an example of a side structure of the semiconductor device shown in FIG. 1, and FIG. FIG. 4 is an enlarged partial perspective view showing an example of the structure of the outer lead of the semiconductor device shown in FIG. 4, FIG. 4 is an assembly process diagram showing an example of the embodiment of the method for manufacturing the semiconductor device shown in FIG. 1, and FIG. FIG. 3 is a perspective view showing an example of the structure of a memory module manufactured by the method described above.

The semiconductor device of the present embodiment is used for a module product or a system product which is assembled by mounting a plurality of semiconductor devices such as a memory module, a system LSI or a system board.

The configuration of the semiconductor device according to the present embodiment includes a package body 4 in which the semiconductor chip 1 is incorporated and a connection portion 4b that can be connected to each other is formed on the outer periphery, and the connection portion 4b of the package body 4 is exposed. And an outer lead 2a provided correspondingly to the pad 1b (surface electrode) of the semiconductor chip 1 and electrically connected thereto.
a, an inner lead 2b formed so as to be connected to the semiconductor chip 1, a tab 2c (chip supporting portion) for supporting the semiconductor chip 1, a pad 1b of the semiconductor chip 1, and an inner lead 2 corresponding thereto.
and a bonding wire 3 for electrically connecting the outer leads 2a to each other when the plurality of package bodies 4 are mechanically connected to each other via the connecting portion 4b. It can be detachably connected.

That is, the semiconductor device of the present embodiment
A plurality of semiconductor devices can be mechanically connected to each other by connecting portions 4b formed on the respective outer peripheries. The plurality of semiconductor devices can be combined into a block to be mounted on the mounting board 5 and be mounted on the semiconductor substrate. It is used for system products, module products, and the like by establishing electrical connection between devices.

Therefore, the number of the semiconductor devices to be connected in one system product or module product is variously changed according to the function and the use thereof.
The number of connections is not particularly limited.

In the present embodiment, a case where the memory module 30 shown in FIG. 5 is assembled will be described as an example.

Here, in the semiconductor device of the present embodiment,
Since the shape of the package body 4 is a substantially rectangular parallelepiped, and its planar shape is a rectangle, as shown in FIG. 1, an uneven connecting portion 4 b is formed on the left and right side surfaces 4 a in the longitudinal direction of the package body 4. The side surfaces 4a of the plurality of package bodies 4 are connected to each other by fitting the concave-convex connecting portions 4b to each other.

In FIG. 1, the semiconductor device shown in FIG. 1A is a package 10 and the semiconductor device shown in FIG.

Therefore, all the concave and convex connecting portions 4b of the package 10 and the package 11 are formed so that the opening width of the concave portion is slightly narrower than the width of the convex portion, so that when the convex portion is fitted into the concave portion. Are formed so that the projections and the recesses are fitted to such an extent that they are not easily separated from each other.

Further, like the package 10 shown in FIG. 2 or the package 11 shown in FIG. 3, the outer leads 2a of the respective semiconductor devices are arranged at an equal pitch and are exposed on the left and right side surfaces 4a of the package body 4. It is bent and accommodated in the groove of the side surface 4a so as to protrude slightly therefrom.

Thus, for example, as shown in FIG.
Connection portion 4b on right side surface 4a of package 10
When the connection portion 4b of the left side surface 4a of the package 11 is fitted, the outer leads 2a provided respectively are in contact with each other, and electrical connection can be performed.

However, since the connection at the connecting portion 4b is merely mechanically fitting the respective convex portions into the concave portions, when the two semiconductor devices are separated from each other, a direction in which the two semiconductor devices are separated from each other is used. Can be relatively easily separated.

In the semiconductor chip 1 incorporated in the semiconductor device according to the present embodiment, when the plurality of package bodies 4 are connected to each other via the connecting portions 4b, the corresponding pads 1b of the mutual semiconductor chips 1 are connected to each other. Are formed in the internal wiring of the semiconductor chip 1 to electrically connect the semiconductor chip 1 through the outer leads 2a.

That is, when forming internal wiring in each chip area in the state of a semiconductor wafer in a pre-process of a semiconductor manufacturing process, the wiring for electrically connecting semiconductor devices is also formed together. It is.

In the packages 10 and 11 shown in FIG. 1, the inner lead 2b and the outer lead 2a arranged at the uppermost position and the lowermost position (both right and left sides) in the figure are connected to the power supply line 6 (Vss or Vcc). And the other inner leads 2b and outer leads 2
a is a terminal for a signal system or a control system.

Therefore, when the package 10 and the package 11 are connected via the connecting portions 4b of the respective side surfaces 4a, the outer leads 2a of the power supply system, signal system, control system, etc. come into contact and are electrically connected. Is done.

In each semiconductor device, the semiconductor chip 1 is mounted on a tab 2c, and the tab 2c is supported by a tab suspension lead 2d.

The inner lead 2b and the outer lead 2
a, the tab 2c, and the tab suspension lead 2d are integrally formed as a lead frame (not shown), and are assembled using the lead frame when assembling the packages 10 and 11, and a cutting process after the package body 4 is formed. Then, the outer leads 2a are cut and separated from the lead frame.

Here, the lead frame is, for example,
It is a thin plate member formed of copper or an iron-nickel alloy or the like. Therefore, the inner lead 2b, the outer lead 2a, the tab 2c, and the tab suspension lead 2d
It is formed of copper or an iron-nickel alloy.

The bonding wire 3 is, for example,
Gold wire.

Further, the package 10 and the package 11
The package body 4 is formed, for example, by a molding method using an epoxy-based thermosetting resin.

Next, a method of manufacturing the semiconductor device according to the present embodiment will be described based on the assembly process shown in FIG.

First, in step S1, a plurality of semiconductor chips 1 (also referred to as semiconductor pellets) having a semiconductor integrated circuit (element) formed on the main surface 1a are prepared.

Here, the semiconductor chip 1 has a plurality of (for example, a package 10 and a package 11) in its internal wiring.
The wiring which electrically connects the corresponding pads 1b of the semiconductor chip 1 through the outer leads 2a of the semiconductor devices is formed.

That is, when forming the internal wiring in each chip region in a state of a semiconductor wafer in a process prior to a semiconductor manufacturing process, the wiring for electrically connecting semiconductor devices (package 10 and package 11) to each other. Are also formed together.

On the other hand, a lead frame in which a plurality of inner leads 2b, outer leads 2a connected thereto, tabs 2c as chip supporting portions capable of supporting the semiconductor chip 1, and tab suspension leads 2d for supporting the same are formed. Is prepared (step S2).

Thereafter, the semiconductor chip 1 and the lead frame are supplied, and in step S3, the semiconductor chip 1 is supplied.
Is mounted on the tab 2c of the lead frame.

At this time, a die bonding material (for example, a resin-based paste material) is applied to the chip supporting surface of the tub 2c, and the semiconductor chip 1 is placed on the tub 2c from above to mount the chip.

Subsequently, in step S4, the pads 1b (surface electrodes) of the semiconductor chip 1 and the corresponding inner leads 2b are electrically connected by wire bonding.

Here, the semiconductor chip 1 is subjected to wire bonding using a bonding wire 3 such as a gold wire.
Is electrically connected to the inner lead 2b.

Thereafter, in step S5, the semiconductor chip 1 and the inner leads 2 are sealed with a resin by molding.
b and the bonding wires 3 are sealed.

At this time, the package 10 and the package 11
The package main body 4 is formed by forming uneven connecting portions 4b on the left and right side surfaces 4a of the respective outer circumferences so that the package body 4 can be connected to each other.

The package 10 and the package 11 are formed such that the irregularities on the side surfaces 4a are alternately arranged.

In this state, the outer leads 2a protrude from the side surfaces 4a of the respective package bodies 4.

Thereafter, in step S6, the outer leads 2a electrically connected to the pads 1b of the semiconductor chip 1 are cut and formed.

That is, the side surface 4a of each semiconductor device
The outer lead 2a projecting from the outer side is cut off at a predetermined location to separate it from the lead frame, and as shown in FIG. Like
The outer lead 2a is bent downward at a predetermined position.

Thus, when the package 10 and the package 11 are mechanically connected to each other via the connecting portions 4b, the corresponding pads 1b of the semiconductor chips 1 are connected to the outer leads 2a. The package main body 4 can be formed so as to be electrically connected via a connector and detachably connected.

Thereafter, in step S7, a predetermined inspection and sorting are performed, and non-defective packages 10 and 11
And get.

In the semiconductor device (package 10 and package 11) of the present embodiment, since the uneven connecting portions 4b are formed on the side surfaces 4a of the package body 4, the mutually uneven connecting portions 4b are formed. (The one convex part is fitted in the other concave part)
Are mechanically connected to each other, thereby assembling the memory module 30 as a module product.

FIG. 5 shows a package 1 which is a semiconductor device of the present embodiment manufactured by a similar method.
1 shows a memory module 30 assembled using 0, 11, 12, 13, and 14.

Here, the packages 13 and 14 arranged at the ends of the five semiconductor devices are the other packages 1.
The outer shapes are different from those of 0, 11, and 12.

That is, each of the packages 13 and 14 has the uneven connecting portion 4b formed only on one side surface 4a.
However, both sides 4 of the packages 13 and 14
The connecting portion 4b having an uneven shape may be formed on the portion a.

Further, the memory module 30 shown in FIG.
The mounting substrate 5 has a concave portion for mounting the five semiconductor devices connected and blocked on the package supporting surface 5b, and a plurality of substrate terminals 5a are formed at both ends of the concave portion. I have.

A connector terminal 5c for electrical connection with an external device is formed at one outer peripheral end of the package supporting surface 5b in the longitudinal direction.

As a result, the five packages 10, 11, 12, 13, and 14, which are mechanically connected by the respective connecting portions 4b and blocked, are mounted on the mounting substrate 5,
Thereby, the memory module 30 can be assembled.

According to the semiconductor device of this embodiment and the method of manufacturing the same, the following operation and effect can be obtained.

That is, a semiconductor device which can be detachably connected so that the outer leads 2a are electrically connected to each other when the plurality of package bodies 4 are mechanically connected to each other via the connecting portion 4b. As a result, the semiconductor device can be blocked.

Therefore, since connection and mounting are performed without using solder or the like, when a failure or the like occurs in a semiconductor device, only a defective semiconductor device can be replaced.

Further, since a plurality of semiconductor devices can be mechanically combined and mounted on the mounting substrate 5, when mounting the plurality of semiconductor devices on the mounting substrate 5, the semiconductor devices are electrically connected to each other. There is no need to provide a wiring pattern on the mounting board 5.

As a result, the mounting density of the semiconductor device on the mounting board 5 can be improved.

As shown in FIG. 5, when assembling the memory module 30 by combining five semiconductor devices, even if one semiconductor device fails, the semiconductor device can be easily replaced. It is not necessary to make the 30 itself defective, and the cost can be reduced.

Further, in the memory module 30, the number of semiconductor devices to be combined can be easily changed, and as a result, the increase or decrease of the memory capacity can be freely changed.

Further, since the wiring for electrically connecting the corresponding pads 1b of the semiconductor chips 1 to each other via the outer leads 2a is formed in the internal wiring of the semiconductor chip 1, the wiring of the semiconductor device 1 can be reduced. In the post-process,
It can be manufactured with existing equipment, and the semiconductor device can be easily assembled.

Although the invention made by the inventor has been specifically described based on the embodiments of the present invention, the present invention is not limited to the above embodiments of the invention, and does not depart from the gist of the invention. It is needless to say that various changes can be made.

For example, various arrangements of the inner leads 2b in the semiconductor device described in the above embodiment are conceivable, but the package 1 shown in FIG.
FIG. 6 shows a further enhanced power supply line 6 at 0 and 11.

Here, the package 15 shown in FIG.
The package 16 shown in FIG. 6B has the power supply line 6 reinforced, and has two lead frames (one is the same as the lead frame used in the above embodiment, and the other is Is the inner lead 2b of the power supply line 6.
And a lead frame on which outer leads 2a are formed)
The inner leads 2b and the outer leads 2a for the power supply line 6 are provided in a hierarchical structure.

In the semiconductor device having this structure, the semiconductor device arranged at the end of the plurality of semiconductor devices connected and blocked is electrically connected to the power supply pad 1b by the bonding wire 3. The outer lead 2a and the reinforcing power supply line 6 routed from the upper layer are brought into contact with each other by mechanical connection, whereby five reinforcing power supply lines 6 are formed in the upper layer over the entire semiconductor device which is blocked. Is arranged.

Therefore, after the chip mounting, a lead frame for the power supply line 6 is arranged on the upper layer,
After performing wire bonding for all the pads 1b, molding is performed.

The semiconductor device shown in FIG.
The five packages 10, 11, 12, 13, and 14 are connected to each other via the connecting portion 4 b, whereby the blocks are fitted into the frame 7.

[0095] The device is mounted on the mounting board 5 as shown in FIG.

Further, in the above-described embodiment and the other embodiments, the case where the planar shape of the semiconductor device is substantially rectangular has been described, but the shape of the semiconductor device is shown in FIG.
As in the semiconductor device (package 17, 18, 19, 20) of another embodiment shown in FIG.
A substantially right-angled isosceles triangle may be used.

FIG. 8 shows an example of a system LSI manufactured by combining four semiconductor devices (packages 17, 18, 19, 20).
FIG. 9 shows, as a representative of the four semiconductor devices shown in FIG. 8A, a transparent view of the internal structure of the package 17. (Vss or Vcc) are formed.

That is, in each semiconductor device, 2
An uneven connecting portion 4b is formed on the side surface 4a of the two short sides,
The connecting portions 4b are connected to each other to combine the semiconductor devices.

When assembling a system LSI by combining a plurality of semiconductor devices, the assembly is facilitated, and after assembly, even if some semiconductor devices fail, only the failed semiconductor device is removed. And exchange can be easily performed.

As a result, it is possible to reproduce the system LSI, thereby improving the yield of the system LSI and reducing the cost.

Further, a system board may be assembled by combining a plurality of semiconductor devices. When assembling the system board, a wiring pattern for electrically connecting the semiconductor devices is mounted on the mounting board 5 (see FIG. 5). Since there is no need to provide them, the mounting density of the semiconductor device on the mounting board 5 can be improved as in the case of the above-described embodiment.

[0085]

Advantageous effects obtained by typical ones of the inventions disclosed in the present application will be briefly described.
It is as follows.

(1). When a plurality of package bodies are mechanically connected to each other via a connecting portion, the semiconductor device is configured to be removably connectable so that the outer leads are electrically connected to each other. Can be combined. Accordingly, the semiconductor device can be exchanged, and it is not necessary to provide a wiring pattern for electrically connecting the semiconductor devices on the mounting substrate. As a result, the mounting density of the semiconductor device on the mounting substrate can be improved.

(2). When assembling a system LSI by combining a plurality of semiconductor devices, it is easy to assemble the system LSI, and after assembly, even if some semiconductor devices fail, it is easy to replace only the failed semiconductor device. This makes it possible to reproduce the system LSI. Therefore, it is possible to improve the yield of the system LSI and reduce the cost.

(3). When assembling a memory module by combining a plurality of semiconductor devices, the number of semiconductor devices to be combined can be easily changed, and as a result,
The increase or decrease of the memory capacity can be freely changed.

[Brief description of the drawings]

FIGS. 1A, 1B, 1C, and 1D are views showing an example of an embodiment of the internal structure of a semiconductor device according to the present invention;
(A), (c) is a plan view showing through the package body,
(B) is a sectional view showing an AA section of (a), and (d) is a sectional view showing a BB section of (c).

FIG. 2 is a side view showing an example of a side structure of the semiconductor device shown in FIG. 1;

FIG. 3 is an enlarged partial perspective view showing an example of a structure of an outer lead of the semiconductor device shown in FIG.

FIG. 4 is an assembly process diagram showing one example of an embodiment of a method of manufacturing the semiconductor device shown in FIG. 1;

FIG. 5 is a perspective view showing an example of a structure of a memory module manufactured by combining the semiconductor device of the present invention.

FIGS. 6A and 6B are plan views showing the structure of a semiconductor device according to another embodiment of the present invention.

FIG. 7 is a plan view showing a structure of a modified example of a module product manufactured by combining the semiconductor device of the present invention.

FIGS. 8A and 8B are diagrams showing a structure of a system LSI manufactured by combining semiconductor devices according to other embodiments of the present invention, wherein FIG. 8A is combined with four semiconductor devices; Plan view of system LSI, (b) is (a)
It is sectional drawing which shows CC cross section.

FIG. 9 is a plan view showing an internal structure of one of four semiconductor devices of another embodiment shown in FIG. 8 through a package body thereof.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Semiconductor chip 1a Main surface 1b Pad (surface electrode) 2a Outer lead 2b Inner lead 2c Tab (chip supporting part) 2d Tab suspension lead 3 Bonding wire 4 Package body 4a Side surface 4b Connecting part 5 Mounting substrate 5a Substrate terminal 5b Package supporting surface 5c Connector terminal 6 Power supply line 7 Frame 10, 11, 12, 13, 14, 15, 16, 17, 1
8, 19, 20 Package (Semiconductor Device) 30 Memory Module

Continued on the front page F term (reference) 4M109 AA01 BA01 CA21 DA07 GA02 5F067 AA02 AB04 BC06 BC16 CB02 CB03 DF01

Claims (6)

[Claims] 1. A package body in which a semiconductor chip is incorporated and a mutually connectable connecting part is formed on an outer periphery; and a package body is provided to be exposed at the connecting part of the package body.
An outer lead electrically connected to and corresponding to the surface electrode of the semiconductor chip, and when the plurality of package bodies are mechanically connected to each other via the connecting portion, the outer leads are mutually connected. A semiconductor device which can be detachably connected so as to be electrically connected. 2. The semiconductor device according to claim 1, wherein the uneven connecting portions are formed on side surfaces of the package main body, and the plurality of uneven connecting portions are fitted into each other. A semiconductor device having side surfaces connected to each other. 3. The semiconductor device according to claim 1, wherein when the plurality of package bodies are connected to each other via the connection portion, the corresponding surface electrodes of the semiconductor chips are connected to each other. A wiring electrically connected to the semiconductor chip via the outer lead is formed in an internal wiring of the semiconductor chip. 4. A step of forming a package body including a semiconductor chip therein and having outer leads electrically connected to outer peripheral connection portions that can be connected to each other corresponding to surface electrodes of the semiconductor chip. Then, when the plurality of package bodies are mechanically connected to each other via the connecting portion, the corresponding surface electrodes of the semiconductor chips are electrically connected to each other via the outer leads. A method for manufacturing a semiconductor device, comprising: assembling a semiconductor device that can be detachably connected. 5. A step of preparing a lead frame including a plurality of inner leads, an outer lead connected thereto, and a chip supporting portion capable of supporting a semiconductor chip, and preparing a semiconductor chip having a semiconductor integrated circuit formed on a main surface. And mounting the semiconductor chip on the chip supporting portion of the lead frame; electrically connecting a surface electrode of the semiconductor chip and the corresponding inner lead; and Forming a package body having a connection portion which can be connected to each other on the outer periphery by resin-sealing the corresponding surface electrodes with the semiconductor chip which can be electrically connected to each other via the outer leads. And separating the outer leads electrically connected to the front electrodes of the semiconductor chip from the lead frame. Exposing the outer leads to the connecting portion of the package body, and arranging the plurality of package bodies mechanically through the connecting portion. A method of manufacturing a semiconductor device, comprising: assembling a semiconductor device capable of being detachably connected so that the surface electrodes to be electrically connected to each other via the outer leads. 6. The method for manufacturing a semiconductor device according to claim 4, wherein the uneven connecting portions are formed on side surfaces of the package body, and the uneven connecting portions are fitted to each other. Wherein the side surfaces of the package body can be connected to each other.