JPH11105474A - Non-contact type ic card and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture a non-contact type IC card of a low cost with high production efficiency by embedding an IC module and receiving/oscillating coils between front and rear foam resin sheets integrated by superposing. SOLUTION: An IC module 3 and receiving/oscillating coils 4 are embedded between front and rear foam resin sheets 1 and 2 integrated by superposing. Since the sheets 1, 2 each has compression deformability peculiar for foam resin, trimming for containing the module 3 and the coils 4 and formation of a recess are not required, and the sheets 1, 2 of necessary thickness obtained by extrusion molding or the like are used as they are. And, at the time of heating and press-bonding in the state that the module 3 and the coils 4 are merely sandwiched between the sheets 1 and 2, a foam resin layer of the sandwiched part is compressed to form a recess at an inner surface side. Thus, the module 3 and the coils 4 can be embedded between the sheets 1 and 2 without difficulty. And, front and rear surfaces of the card become flat.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact type IC card having a built-in IC module and a coil for transmitting and receiving, and performing non-contact transmitting and receiving with an external device, and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, the use of plastic cards as information recording media has been rapidly expanding, and as a result, ICs having a larger recording capacity than conventional magnetic stripe cards have been used.
The demand for cards is increasing. As this IC card, there is a non-contact type IC card which has a built-in IC module and a coil for transmission and reception and can perform transmission and reception without contact with an external device.

Conventionally, to manufacture such a non-contact type IC card, a thick core sheet made of polyvinyl chloride or the like is trimmed into a required shape, and an IC module and a transmitting / receiving coil are fitted into the trimmed core sheet. Is filled with an adhesive filler, and a cover sheet having concealment properties is laminated on the front and back surfaces of the core sheet, followed by thermocompression bonding. A method is also proposed in which a storage recess is provided on one side of a card substrate made of ABS resin or the like, in which the IC module and the coil for receiving and transmitting are housed, and a cover material made of metal or ABS resin is fixed thereon. (Japanese Unexamined Patent Publication No. 9-123651).

[0004]

However, in the conventional method of manufacturing a conventional non-contact type IC card, the manufacturing process becomes very complicated due to trimming of a core sheet and filling of an adhesive filler. There is a problem that the production efficiency is low and the production cost is high. In addition, even in the conventional proposed method, a card substrate having a storage recess needs to be manufactured by injection molding, so that a badge is produced.
The IC module and the transmission / reception coil must be fitted into the storage recess of the card substrate, and the cover material must be fixed with an adhesive or the like, which is troublesome in operation, and also has the disadvantage of inferior production efficiency.

An object of the present invention is to provide a non-contact type IC card which can be manufactured at a high production efficiency and at a low cost, and a method of manufacturing the same.

[0006]

In order to achieve the above object, a non-contact type IC card according to the first aspect of the present invention is provided with the reference numerals in the drawings, and the non-contact type IC card is superimposed and integrated. The IC module (3) and the transmitting / receiving coil (4) are embedded between the foamed resin sheets (1) and (2). In this non-contact type IC card, since the foamed resin sheets (1) and (2) have a compressive deformation characteristic of foamed resin, the IC module (3) and the transmitting / receiving coil (4)
It is not necessary to perform trimming or formation of a concave portion for accommodating the foamed resin sheets (1) and (2) having a required thickness obtained by extrusion molding or the like.
If the IC module (3) and the transmission / reception coil (4) are simply sandwiched between them by heating and pressing, the foamed resin layer at the sandwiched portion is compressed and dented on the inner surface side, and the IC module (3) The receiving / transmitting coil (4) is easily inserted between both sheets (1) and (2), and the front and back of the card are flat.

According to a second aspect of the present invention, in the non-contact type IC card of the first aspect, the foamed resin sheets (1) and (2) are provided.
Has a foaming ratio of 1.3 to 2.5 times, so that both the compressive deformability for embedding the IC module (3) and the coil for transmitting / receiving (4) and the flatness of the front and back of the card are sufficient. Can be secured.

According to the third aspect of the present invention, the first or second aspect is provided.
Foamed resin sheet (1)
The resin component of (2) is a mixture of a polycarbonate and a copolymerized polyester resin in which 10 to 70% of the ethylene glycol component in polyethylene terephthalate is substituted with cyclohexanedimethanol. Since the foamed resin sheet made of this resin mixture has moderately high heat resistance and the property that burrs are unlikely to occur during punching, a card that is suitable for applications that may be exposed to high temperatures is required. Foam resin sheet (1) (2) that can be provided and has a design etc. printed in advance
Can be set in a range where the discoloration of the printing ink does not occur, and the deburring work after punching into a card shape can be omitted.

According to a fourth aspect of the present invention, in the non-contact type IC card of the third aspect, the weight ratio of the copolymerized polyester resin / polycarbonate is in the range of 20/80 to 90/10. Appropriate heat resistance and excellent punchability can be reliably provided.

According to a fifth aspect of the present invention, there is provided a method for producing a non-contact type IC card, wherein a resin composition containing a foaming agent is extruded into a sheet with foaming, and the foamed resin sheet (1) obtained.
An IC module (3) and a transmission / reception coil (4) are placed on top of it, and a similar foamed resin sheet (2) is placed thereon and heated and pressed, and the pressed sheet is punched into a card shape. I have. According to this method, the foamed resin sheets (1) and (2) can be manufactured continuously, and further, trimming for accommodating the IC module (3) and the transmitting / receiving coil (4) and the formation of the concave portion are unnecessary. Since the IC module (3) and the transmitting / receiving coil (4) need only be placed on the foamed resin sheet (1), the non-contact type IC is used.
Cards can be manufactured inexpensively with high production efficiency. Then
From the extrusion of both foamed resin sheets (1) and (2) to the punching out into a card shape and commercialization, it is possible to carry out the production on a consistent continuous production line.

According to a sixth aspect of the present invention, in the method for producing a non-contact type IC card according to the fifth aspect, the resin composition contains 0.5 to 50 parts by weight of an organic foaming agent per 100 parts by weight of the resin component.
Since 2 parts by weight are blended, the foamed resin sheets (1) and (2) obtained by extrusion molding are in an appropriate foaming state, and the IC module (3) and the transmitting / receiving coil (4) are securely embedded. Can be integrated.

[0012]

FIG. 1 is a sectional view of a non-contact type IC card according to the present invention. As shown in the figure, in this non-contact type IC card, an IC module (3) and a transmission / reception coil (4) are embedded between front and back foam resin sheets (1) and (2) which are superposed and integrated. It becomes. Then
In the embedded portions of the IC module (3) and the transmission / reception coil (4) in both sheets (1) and (2), the foamed resin layer is compressed and deformed, and the IC module (3) and the transmission / reception coil (4) The inner surface is recessed by an amount corresponding to the thickness.

The means for obtaining such a non-contact type IC card is not particularly limited, but the following manufacturing method is preferred. First, a resin composition containing a foaming agent is extruded with an extruder into a sheet having a required thickness with foaming, and a predetermined number of cards of the obtained foamed resin sheets (1) and (2) can be collected. That is, it is cut into a size corresponding to the press die. Then, as shown in FIG. 2A, one of the foamed resin sheets (1) is placed on the lower plate (5a) of the hot press machine (5), and the IC module (3) is placed on the sheet (1). ) And a plurality of sets of the transmitting and receiving coils (4) are placed in a predetermined vertical and horizontal arrangement, and the other foamed resin sheet (2) is laid thereon, and in this state, the upper plate (5b) is lowered to heat. Crimp. As a result, as shown in FIG. 2B, the upper and lower foamed resin sheets (1) and (2) are fused and integrated, and the IC module (3) and the transmitting / receiving coil (4) are sandwiched. Since the foamed resin layer is compressed and deformed, the IC module (3) and the transmission / reception coil (4) are not excessively pressured and are easily embedded in the foamed resin layer.

By punching the pressure-bonded sheet thus obtained into a card shape, a plurality of non-contact type IC cards shown in FIG. 1 can be obtained.

In the case of displaying a design, a character, or the like on the front and back surfaces of the card, a required surface is formed on the surface of the foamed resin sheet (1) (2) outside the card after the extrusion or after cutting into a predetermined size. Should be printed. Alternatively, printed non-foamed sheets may be simultaneously laminated on both sides during heat fusion.

When characters and the like are three-dimensionally displayed with irregularities or embossed on the sheet surface, desired characters and the like can be displayed by a stamping machine called an embosser after punching out a card.

The foamed resin sheets (1) and (2) are produced by extrusion molding accompanied by foaming in the above-mentioned production method. Instead of this, the foamed resin sheets (1) and (2) are formed into sheets by a combination of cast foaming and roll rolling. A sheet obtained by these methods can also be used, and the sheet obtained by these methods can be used after being subjected to calendering or embossing.

Further, in the above-mentioned manufacturing method, the heat pressing is performed between the upper and lower plates (5a) and (5b) of the hot press machine (5). May be performed. In this case, a foamed resin sheet (1) (2) obtained by extrusion molding
While cutting one sheet (1) continuously without cutting, the IC module (3) and the transmitting / receiving coil (4) are placed on the sheet (1) at a fixed position, and the downstream side thereof The other sheet (2) which is continuously supplied in step (1) may be covered, and the heat roll may be continuously performed by the heat roll further downstream.
Since both sheets (1) and (2) can be continuously supplied to the thermocompression bonding process from the extrusion process and a required display can be given by printing on the way, punching into a card form after thermocompression bonding can be performed. If a roll type machine or a machine having a reciprocating mechanism is used as the machine, it is possible to carry out from the extrusion of both sheets (1) and (2) to the card product on a continuous continuous production line.

The expansion ratio of the foamed resin sheets (1) and (2) is preferably in the range of 1.3 to 2.5 times. That is, if the expansion ratio is less than 1.3 times, the compressive deformation is insufficient, so that the IC module (3) and the transmitting / receiving coil ( Excessive pressure is applied to 4), causing breakage or performance deterioration, or IC
There is a concern that the embedded portions of the module (3) and the transmitting / receiving coil (4) may swell and lose commercial value as a non-contact type IC card. On the other hand, when the expansion ratio is more than 2.5 times, the extrudability deteriorates, it is difficult to obtain a uniform thickness, and the flatness of the sheet surface decreases.

The foamed resin sheets (1) and (2) are made of polyvinyl chloride resin, polyester resin, AB
S resin, polycarbonate, a mixture thereof, and the like. Among them, a copolymerized polyester resin (hereinafter abbreviated as PETG) in which 10 to 70% of an ethylene glycol component in polyethylene terephthalate is substituted with cyclohexane dimethanol, and polycarbonate ( (Hereinafter abbreviated as PC) (hereinafter referred to as PETG)
/ PC) is particularly recommended because it exhibits moderately high heat resistance and is excellent in punching workability in sheet form.

That is, there is a possibility that the IC card is left in a place where the temperature tends to be high, such as in a car stopped under the sunshine. Therefore, the foamed resin sheet (1)
Although (2) requires durability at high temperatures, a general-purpose polyvinyl chloride resin cannot provide a sufficient heat-resistant temperature. In the case of a resin material having extremely high heat resistance, such as PC, it is necessary to set the temperature of thermocompression bonding to a very high temperature (for example, 200 ° C. or more for PC). There is a problem that the ink of the printed pattern or the like is discolored at the time of heating and pressing, thereby impairing the commercial value. However, in the above-mentioned PETG / PC, higher heat resistance can be obtained than in a general-purpose polyvinyl chloride resin, and since it can be heated and pressed at a relatively low temperature, discoloration of the ink on the sheet surface can be avoided.

On the other hand, if burrs are generated when punching into a card form after the above-mentioned thermocompression bonding, a troublesome operation for removing the burrs is required. However, the above-mentioned PETG / PC hardly generates burrs, so that high production is required. Achieve efficiency.

PET which is one component of PETG / PC
G is a non-crystalline resin, whereas polyethylene terephthalate is a crystalline resin, and therefore has good heat-fusibility. Therefore, the foamed resin sheets (1) and (2) using PETG / PC are easily fused and integrated by sandwiching the IC module (3) and the receiving / transmitting coil (4) by heat and pressure. There is an advantage. This PETG is 10 to 70% of the ethylene glycol component in polyethylene terephthalate as described above.
Is replaced with cyclohexane dimethanol.However, in the case of a resin whose substitution amount is outside the above range, crystallization rapidly progresses with cooling after heating, and the property of losing fusibility appears. When used in place of PETG, integration by the above-mentioned thermocompression bonding becomes difficult.

It is recommended that the weight ratio of PETG / PC be in the range of 20/80 to 90/10. That is, when the PETG ratio is less than the above range, the temperature becomes close to that of PC alone, and it is necessary to set the temperature of the heat-compression bonding to a high temperature. On the other hand, when the ratio of PETG is more than the above range, heat resistance and punching workability become insufficient.

As a foaming agent to be blended with the resin composition as a raw material of the foamed resin sheets (1) and (2), any of existing foaming agents can be used. A high-temperature decomposition type foaming agent that decomposes at a temperature is recommended. An azo blowing agent is generally used in an organic system, but generates a small amount of ammonia gas during foaming. This is not suitable as it promotes the hydrolysis of PET. An inorganic foaming agent in which the generated gas is carbon dioxide is preferably used. As the inorganic foaming agent, carbonates such as sodium bicarbonate, organic acid salts such as oxalate, which decompose at a relatively high temperature, and the like are preferably used. The amount of generated decomposition gas is 150m
A relatively small one of 1 / g or less is suitable. Since the thickness of the sheet is small, if the generated gas is large, the sheet is perforated and the skin becomes defective. The amount of the foaming agent is as follows:
The amount is preferably in the range of 0.5 to 2 parts by weight with respect to 00 parts by weight. If the amount is too small, the foaming will be insufficient, and if it is too large, there is a concern that the extruded sheet will be perforated.

The above resin composition may contain a foaming agent together with a foaming agent in order to generate uniform and fine bubbles. The foaming accelerator may be appropriately selected depending on the type of the foaming agent to be used. For example, for an azo foaming agent, zinc white or zinc nitrate can be suitably used. The compounding amount of the foaming accelerator may be about the same as the foaming agent.

Various additives such as a pigment, a filler and an anti-blocking agent can be appropriately added to the resin composition as required. In particular, the pigment is usually blended to impart hiding power to the card base material, and a white pigment such as titanium oxide is particularly preferred. The amount of the pigment is preferably about 1 to 20 parts by weight based on 100 parts by weight of the resin component.

Further, in the non-contact type IC card according to the present invention, the foamed resin sheets (1) and (2) have a single-layered sheet form as described above, and also have a protective surface for the card.
It is also possible to adopt a configuration of a laminated sheet form in which a cover sheet made of a non-foamed resin is laminated on the outer surface for the purpose of decoration, rigidity imparting and the like.

[0029]

EXAMPLE A resin composition comprising 80 parts by weight of PETG (30% of the ethylene glycol component in polyethylene terephthalate replaced with cyclohexane dimethanol), 20 parts by weight of PC, 1 part by weight of an organic carbonate blowing agent, and 10 parts by weight of titanium oxide Using the product, a foamed resin sheet having a thickness of 0.7 mm and an expansion ratio of 1.8 times was produced by extrusion molding. Then, this sheet is cut into a size of 300 × 400 mm, one of which is placed on a lower plate of a hot press machine, and a plurality of sets including an IC module and a receiving coil are vertically placed on the foamed resin sheet. 5 rows and 3 rows are placed, another sheet of the foamed resin sheet is superimposed thereon, and the upper plate is lowered to 160 ° C., 20k
Thermocompression bonding was performed at gf / cm2. Then, the non-contact type IC having a thickness of 0.76 mm is punched out by punching out the pressure-bonded sheet into a card form of 86 × 54 mm by a punching machine.
A card was made.

The non-contact type IC card thus obtained is
The front and back foam resin sheets were completely integrated, the front and back surfaces were smooth, and the whole had a uniform thickness.

[0031]

According to the first aspect of the present invention, a non-contact type IC is provided.
Since the IC module and the transmission / reception coil are embedded between the front and back foam resin sheets as the card, a special case for providing the accommodating portion of the IC module and the transmission / reception coil in the conventional card base material is provided. A sheet obtained by extrusion molding or the like can be used as the foamed resin sheet as it is without any need for complicated processing, thereby providing a sheet that can be manufactured at high production efficiency and at low cost.

According to the second aspect of the present invention, as the non-contact type IC card, particularly, the foamed resin sheets on the front and back sides have good compressive deformability and surface properties.
The present invention provides a module in which the module and the transmission / reception coil can be easily embedded and has excellent surface flatness.

According to the third and fourth aspects of the present invention, since the foamed resin sheet is made of a specific resin component as the above-mentioned non-contact type IC card, it has excellent heat resistance and may be exposed to high temperatures. Provided are those that are sufficiently compatible with the intended use, have high quality without discoloration of a pattern or the like printed on the surface, and are more excellent in production efficiency.

According to the fifth aspect of the present invention, there is provided, as a method of manufacturing the above-mentioned non-contact type IC card, a means which can be manufactured at a particularly high production efficiency and at a low cost, and which can employ a continuous manufacturing line. .

According to the sixth aspect of the present invention, in the above manufacturing method, the foamed resin sheet obtained by extrusion molding is in an appropriate foaming state, so that the IC module and the receiving / transmitting coil are securely embedded and integrated. There is an advantage that you can.

[Brief description of the drawings]

FIG. 1 is a vertical sectional view of a non-contact type IC card according to the present invention.

FIGS. 2A and 2B show a heating and pressing step by a hot press in the production of the non-contact type IC card. FIG. 2A is a longitudinal sectional view before the heating and pressing, and FIG. is there.

[Explanation of symbols]

 1, 2,... Foam resin sheet 3... IC module 4... Coil for receiving and transmitting 5. ..Top plate

Continued on the front page (51) Int.Cl. ⁶ Identification symbol FI // C08L 67/02 G06K 19/00 H 69/00 K

Claims (6)

[Claims] 1. A non-contact type IC card in which an IC module and a transmitting / receiving coil are embedded between front and back foam resin sheets which are integrated by being overlapped. 2. The expansion ratio of the foamed resin sheet is 1.3 to 1.3.
2. The non-contact type IC card according to claim 1, wherein the ratio is 2.5 times. 3. The foamed resin sheet according to claim 1, wherein the resin component comprises a mixture of polycarbonate and a copolymerized polyester resin in which 10 to 70% of an ethylene glycol component in polyethylene terephthalate is substituted with cyclohexanedimethanol. Non-contact type IC card. 4. The non-contact type IC card according to claim 3, wherein the weight ratio of the copolymerized polyester resin / polycarbonate is in the range of 20/80 to 90/10. 5. A resin composition containing a foaming agent is extruded into a sheet with foaming, and I is formed on the foamed resin sheet.
A non-contact type I characterized by placing a C module and a coil for transmission / reception, superimposing a similar foamed resin sheet thereon, heat-pressing, and punching the pressure-bonded sheet into a card shape.
Manufacturing method of C card. 6. The method for producing a non-contact type IC card according to claim 5, wherein the resin composition comprises 0.5 to 2 parts by weight of a foaming agent per 100 parts by weight of the resin component.