JPH034021Y2 - - Google Patents
Info
- Publication number
- JPH034021Y2 JPH034021Y2 JP18174285U JP18174285U JPH034021Y2 JP H034021 Y2 JPH034021 Y2 JP H034021Y2 JP 18174285 U JP18174285 U JP 18174285U JP 18174285 U JP18174285 U JP 18174285U JP H034021 Y2 JPH034021 Y2 JP H034021Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- insulating plate
- utility
- electrolytic capacitor
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 39
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 27
- 238000007789 sealing Methods 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 239000006071 cream Substances 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 239000011888 foil Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000003792 electrolyte Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004826 seaming Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【考案の詳細な説明】
[考案の技術分野]
この考案はチツプ型の電解コンデンサに関する
ものである。[Detailed description of the invention] [Technical field of the invention] This invention relates to a chip-type electrolytic capacitor.
[考案の技術的背景とその問題点]
従来チツプ型の電解コンデンサとして知られて
いるものに、例えば特開昭59−211213号公報記載
の技術がある。すなわち第6図に示すように同一
方向に引出したリード線41を封口栓に挿通した
コンデンサ素子を金属ケース42に収容して該金
属ケース42の開口端縁を巻締める。[Technical background of the invention and its problems] A conventional chip-type electrolytic capacitor is known, for example, as described in Japanese Patent Laid-Open No. 59-211213. That is, as shown in FIG. 6, a capacitor element with lead wires 41 drawn out in the same direction inserted through a sealing plug is housed in a metal case 42, and the opening edge of the metal case 42 is tightened.
このようにして構成した電解コンデンサ本体の
封口栓上にリード線41が貫通する貫通孔を備
え、かつ該貫通孔につながる凹部43を設けた絶
縁板44を配置し、該凹部43にはリード線41
の先端部を折曲げ、凹部43内に収まるようにし
たものである。この構成においてはリード線41
の先端部が絶縁板44に設けた凹部43内に収納
されるので、プリント基板などに当接する面にお
いて凸部が全くない状態となるので、コンデンサ
としての傾きやぐらつきがなく安定している特徴
は有する。しかしながら、これらの電解コンデン
サではリード線43の折曲げた先端部にクリーム
はんだを塗布しこれを基板に当接して、またはプ
リント基板にクリームはんだを印刷し、該クリー
ムはんだ上に電解コンデンサのリード線41の折
曲げた先端部を当接して基板を加熱することによ
りクリームはんだを溶融するリフローはんだ付け
をしている。この溶融に際し凹部43内の空気は
熱せられて膨張し膨張した空気によつてコンデン
サが浮きチツプ型アルミ電解コンデンサをプリン
ト基板上にマウントし位置決めしたものがこの浮
きによつて移動するため、接続不完全や接続不良
を生ずる場合があつた。 An insulating plate 44 having a through hole through which the lead wire 41 passes and a recess 43 connected to the through hole is disposed on the sealing plug of the electrolytic capacitor main body constructed in this manner, and the recess 43 is provided with a recess 43 for the lead wire. 41
The tip is bent so that it fits within the recess 43. In this configuration, the lead wire 41
Since the tip of the capacitor is housed in the recess 43 provided in the insulating plate 44, there is no protrusion on the surface that contacts the printed circuit board, etc., so the capacitor is stable without tilting or wobbling. has. However, in these electrolytic capacitors, cream solder is applied to the bent tip of the lead wire 43 and it is brought into contact with the board, or cream solder is printed on the printed circuit board, and the lead wire of the electrolytic capacitor is placed on the cream solder. Reflow soldering is performed in which cream solder is melted by touching the bent tip of 41 and heating the board. During this melting, the air in the recess 43 is heated and expanded, and the expanded air causes the capacitor to float, and the chip-type aluminum electrolytic capacitor mounted and positioned on the printed circuit board moves due to this float, resulting in disconnection. There were cases where the connection was incomplete or the connection was defective.
[考案の目的]
この考案ははんだ付けの際の空気の膨張によつ
ても基板への接続不完全や接続不良を生ずること
のないチツプ型の電解コンデンサを提供すること
を目的としたものである。[Purpose of the invention] The purpose of this invention is to provide a chip-type electrolytic capacitor that does not cause incomplete or poor connection to the board even when air expands during soldering. .
[考案の概要]
この考案になる電解コンデンサは、リード線端
子同一方向形コンデンサ素子および該コンデンサ
素子のリード線を挿入した弾性封口栓を金属ケー
スに収容し封口したコンデンサ本体と、該弾性封
口栓上に配設され前記リード線を貫通した貫通孔
を有する絶縁板とを具備し、該絶縁板がその側面
から前記貫通孔に連通した前記リード線径より狭
幅の切込みおよび該狭幅の切込みに連設したリー
ド線径より広幅の切込みを有し、該広幅の切込み
上に前記リード線を折曲げたことを特徴とするも
のである。[Summary of the invention] The electrolytic capacitor of this invention consists of a capacitor body in which a lead wire terminal unidirectional capacitor element and an elastic sealing plug into which the lead wires of the capacitor element are inserted are housed and sealed in a metal case, and the elastic sealing plug. an insulating plate disposed above and having a through hole passing through the lead wire, the insulating plate having a width narrower than the diameter of the lead wire communicating with the through hole from the side thereof, and the narrow width notch. The lead wire is characterized in that it has a notch wider than the diameter of the lead wire connected to the lead wire, and the lead wire is bent onto the wide notch.
[考案の実施例]
第1図に示すようにアルミを粗面化し誘電体酸
化皮膜を生成したのちリード線1を有する引出端
子2を接続した陽極箔と、アルミ箔を粗面化しリ
ード線3を有する引出端子4を接続した陰極箔と
をコンデンサ紙を介して巻回してコンデンサ素子
5を構成する。該コンデンサ素子5に駆動用電解
液を含浸し、該コンデンサ素子5の引出端子2,
4を弾性封口栓6に挿入したのち、該コンデンサ
素子5および弾性封口栓6を金属ケース7に収容
し、該金属ケース7の開口端を巻締め、および開
口端近傍の胴体部を押圧して巻締め部8および押
圧部9を形成し封口する。前記駆動用電解液の含
浸はコンデンサ素子5の引出端子2,4を弾性封
口栓6に挿入した後に行つてもよい。また弾性封
口栓6の上面に剛体からなる端子板10を接着ま
たは載置すればリード線1,3に加わる引張力を
阻止することもできる。[Example of the invention] As shown in Fig. 1, an anode foil is formed by roughening aluminum to form a dielectric oxide film and then connecting an extraction terminal 2 having a lead wire 1, and a lead wire 3 by roughening the aluminum foil. A capacitor element 5 is constructed by winding a cathode foil with a lead terminal 4 connected thereto through capacitor paper. The capacitor element 5 is impregnated with a driving electrolyte, and the lead terminals 2,
4 is inserted into the elastic sealing plug 6, the capacitor element 5 and the elastic sealing plug 6 are housed in a metal case 7, the open end of the metal case 7 is tightened, and the body near the open end is pressed. A seaming portion 8 and a pressing portion 9 are formed and sealed. The impregnation with the driving electrolyte may be performed after the lead terminals 2 and 4 of the capacitor element 5 are inserted into the elastic sealing plug 6. Further, by adhering or placing a terminal plate 10 made of a rigid body on the upper surface of the elastic sealing plug 6, the tensile force applied to the lead wires 1 and 3 can be prevented.
以上のように構成したコンデンサ本体の巻締め
部8上、すなわち弾性封口栓6上にリード線1,
3を挿通した貫通孔11を形成してある絶縁板1
2を配するが、該絶縁板12は第2図に平面図、
第3図に正面図を示すようにその側面から前記貫
通孔11に達する狭幅の切込み13および該狭幅
の切込み13に連設した広幅の切込み14を形成
してある。該狭幅の切込み13は前記リード線
1,3の外径より狭幅の寸法を有し、広幅の切込
み14はリード線1,3の外径より広幅な寸法を
有する。このような絶縁板12から突き出ている
リード線1,3を前記狭幅の切込み13の上に折
曲げ一切断するが、広幅の切込み14はリード線
1,3より広幅であるため、リード線1,3は広
幅の切込み14の中に収まることとなる。該広幅
の切込み14の深さを略リード線1,3の外径と
同じ寸法にすれば、コンデンサを基板に接続する
ために基板に載置したとき安定性に優れた特徴を
有する。 The lead wire 1,
The insulating plate 1 has a through hole 11 through which the insulating plate 3 is inserted.
2, the insulating plate 12 is shown in plan view in FIG.
As shown in a front view in FIG. 3, a narrow cut 13 reaching the through hole 11 from the side surface and a wide cut 14 connected to the narrow cut 13 are formed. The narrow cut 13 has a dimension narrower than the outer diameter of the lead wires 1 and 3, and the wide cut 14 has a dimension wider than the outer diameter of the lead wires 1 and 3. The lead wires 1 and 3 protruding from the insulating plate 12 are bent and cut onto the narrow cut 13, but since the wide cut 14 is wider than the lead wires 1 and 3, the lead wires 1 and 3 will fit within the wide notch 14. If the depth of the wide notch 14 is approximately the same as the outer diameter of the lead wires 1 and 3, the capacitor will have excellent stability when placed on a board for connection to the board.
以上のように構成された電解コンデンサはリー
ド線1,3が狭幅の切込み13上に折曲げられて
も、リード線1,3より狭幅のため、切込み13
中に落込むことはないし、該電解コンデンサをク
リームはんだで基板に固定する場合、クリームは
んだを溶融させるための加熱時に生ずる絶縁板1
2と基板の電極間の膨張した空気を主として狭幅
の切込み13から逃がすので、従来の欠点であつ
た膨張した空気による電解コンデンサの浮き上り
や移動を防止できる。したがつて、基板の電極と
電解コンデンサとの接続不完全や接続不良の発生
を防止できるものである。また広幅の切込み14
を連設したことにより基板への固定の際の安定性
がよくなり、接続不良の減少に寄与する効果もあ
る。さらに狭幅の切込み13上にリード線1,3
を折曲げるため、クリームはんだがリード線1,
3の裏側すなわち狭幅の切込み13側まで流れ込
むので接触面積が大となり、接続強度が向上する
効果も有する。そして第4図に示すように絶縁板
22の切込み23,24を同一方向や第5図の如
く絶縁板32の切込み33,34を反対方向に設
けてもよいし、さらにこれらの切込み24,34
に連ねて、たとえばこれらと直角方向などに切込
みを設ければリード線の根元またはリード線間の
膨張した空気を容易に排出できる。なお、前記端
子板10はリード線1,3の折曲げに際して生ず
るリード線1,3への引張力を陽極箔や陰極箔と
引出端子2,4との接続部に伝えない効果を産む
ものである。 In the electrolytic capacitor configured as described above, even if the lead wires 1 and 3 are bent onto the narrow notch 13, the notch 13 is narrower than the lead wires 1 and 3.
When the electrolytic capacitor is fixed to the board with cream solder, the insulating plate 1 that is generated during heating to melt the cream solder.
Since the expanded air between the electrolytic capacitor 2 and the electrode of the substrate is mainly released through the narrow notch 13, it is possible to prevent the electrolytic capacitor from lifting or moving due to the expanded air, which was a drawback of the conventional method. Therefore, it is possible to prevent incomplete or poor connection between the electrodes of the substrate and the electrolytic capacitor. In addition, the wide cut 14
By arranging them in series, the stability when fixing to the board is improved, which also has the effect of contributing to the reduction of connection failures. Furthermore, the lead wires 1 and 3 are placed on the narrow cut 13.
In order to bend the lead wire 1, apply cream solder to the lead wire 1,
3, that is, to the side of the narrow cut 13, the contact area becomes large, which also has the effect of improving the connection strength. As shown in FIG. 4, the cuts 23 and 24 of the insulating plate 22 may be provided in the same direction, or as shown in FIG. 5, the cuts 33 and 34 of the insulating plate 32 may be provided in opposite directions.
If a notch is provided, for example, in a direction perpendicular to these, the expanded air at the base of the lead wire or between the lead wires can be easily discharged. The terminal plate 10 has the effect of not transmitting the tensile force to the lead wires 1, 3, which is generated when the lead wires 1, 3 are bent, to the connection portion between the anode foil or the cathode foil and the lead terminals 2, 4.
[考案の効果]
この考案によるチツプ型の電解コンデンサを使
用すれば、基板に固定する際に生ずる空気の膨張
による電解コンデンサの浮き上がりや位置の移動
を防止でき、接続不完全や接続不良をなくすこと
ができるとともに基板への固定に際して安定した
載置状態が容易に得られる効果を有する。[Effects of the invention] By using the chip-type electrolytic capacitor of this invention, it is possible to prevent the electrolytic capacitor from lifting up or shifting due to the expansion of air that occurs when it is fixed to a board, and to eliminate incomplete connections and poor connections. It has the effect that a stable mounting state can be easily obtained when fixing to the substrate.
第1図は本考案になる電解コンデンサの一実施
例を示す正断面図、第2図は本考案になる絶縁板
の実施例を示す平面図、第3図は同じく絶縁板の
正面図、第4図および第5図は本考案になる絶縁
板の他の実施例を示す平面図、第6図は従来の電
解コンデンサを示す斜視図である。
1,3……リード線、2,4……引出端子、5
……コンデンサ素子、6……弾性封口栓、7……
金属ケース、10……端子板、11……貫通孔、
12……絶縁板、13……狭幅の切込み、14…
…広幅の切込み。
Fig. 1 is a front cross-sectional view showing an embodiment of the electrolytic capacitor of the present invention, Fig. 2 is a plan view showing an embodiment of the insulating plate of the invention, and Fig. 3 is a front view of the insulating plate. 4 and 5 are plan views showing other embodiments of the insulating plate according to the present invention, and FIG. 6 is a perspective view showing a conventional electrolytic capacitor. 1, 3... Lead wire, 2, 4... Output terminal, 5
... Capacitor element, 6 ... Elastic sealing plug, 7 ...
Metal case, 10...Terminal board, 11...Through hole,
12...Insulating plate, 13...Narrow width notch, 14...
...Wide cut.
Claims (1)
び該コンデンサ素子のリード線を挿入した弾性
封口栓を金属ケースに収容し封口したコンデン
サ本体と、該弾性封口栓上に配設され前記リー
ド線を貫通した貫通孔を有する絶縁板とを具備
し、該絶縁板がその側面から前記貫通孔に連通
した前記リード線径より狭幅の切込みおよび該
狭幅の切込みに連設したリード線径より広幅の
切込みを有し、該広幅の切込み上に前記リード
線を折曲げたことを特徴とする電解コンデン
サ。 (2) 弾性封口栓上に端子板を接着または載置した
ことを特徴とする実用新案登録請求の範囲第(1)
項記載の電解コンデンサ。 (3) 切込みが一直線、同一方向または反対方向に
平行に設けられていることを特徴とする実用新
案登録請求の範囲第(1)項または第(2)項記載の電
解コンデンサ。 (4) 広幅の切込みがリード線径と略等しい深さを
有することを特徴とする実用新案登録請求の範
囲第(1)項〜第(3)項のいずれかに記載の電解コン
デンサ。 (5) 絶縁板の広幅の切込み上に折曲げたリード線
の先端部が板状であることを特徴とする実用新
案登録請求の範囲第(1)項〜第(4)項のいずれかに
記載の電解コンデンサ。[Scope of Claim for Utility Model Registration] (1) A capacitor body in which a capacitor element with lead wire terminals in the same direction and an elastic sealing plug into which the lead wires of the capacitor element are inserted are housed and sealed in a metal case, and an insulating plate having a through hole disposed therein and passing through the lead wire, the insulating plate having a cut width narrower than the diameter of the lead wire that communicates with the through hole from a side surface of the insulating plate, and communicating with the narrow cut width. 1. An electrolytic capacitor characterized in that the lead wire has a notch wider than the diameter of the lead wire provided, and the lead wire is bent onto the wide notch. (2) Utility model registration claim No. (1) characterized in that a terminal plate is adhered or placed on an elastic sealing plug
Electrolytic capacitors listed in section. (3) The electrolytic capacitor according to claim (1) or (2) of the utility model registration, characterized in that the cuts are provided in parallel in a straight line, in the same direction, or in opposite directions. (4) The electrolytic capacitor according to any one of claims (1) to (3) for utility model registration, wherein the wide cut has a depth substantially equal to the diameter of the lead wire. (5) Any one of claims (1) to (4) for registering a utility model, characterized in that the tip of the lead wire bent over a wide cut in an insulating plate is plate-shaped. Electrolytic capacitors listed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18174285U JPH034021Y2 (en) | 1985-11-25 | 1985-11-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18174285U JPH034021Y2 (en) | 1985-11-25 | 1985-11-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6289124U JPS6289124U (en) | 1987-06-08 |
| JPH034021Y2 true JPH034021Y2 (en) | 1991-02-01 |
Family
ID=31126894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18174285U Expired JPH034021Y2 (en) | 1985-11-25 | 1985-11-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH034021Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0683009B2 (en) * | 1988-07-22 | 1994-10-19 | 日本電波工業株式会社 | Insulation plate and piezoelectric vibrator |
-
1985
- 1985-11-25 JP JP18174285U patent/JPH034021Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6289124U (en) | 1987-06-08 |
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