JPH0244135B2 - CHITSUPUGATAARUMIDENKAIKONDENSA - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a chip-type aluminum electrolytic capacitor used in various electronic devices.

Conventional structure and its problems A conventional chip-type aluminum electrolytic capacitor of this type was constructed as shown in FIGS. 1a and 1b. That is, an anode foil formed by roughening aluminum foil and forming a dielectric oxide film through anodization, and a cathode foil formed by roughening aluminum foil are wound through a separator and impregnated with a driving electrolyte. This capacitor element 1 is housed in a cylindrical metal case 2 with a bottom, and the opening of the metal case 2 is sealed using an elastic sealing material 3 such as rubber. An electrolytic capacitor is constructed, and the lead wire 4 drawn out from the aluminum electrolytic capacitor is electrically and mechanically connected to the rubber terminal 5 by a method such as welding, and the entire part except the comb-shaped terminal 5 is molded with resin. Exterior 6 was applied to make it a completed product. When such chip-type aluminum electrolytic capacitors are mounted on a printed circuit board, they are coated with a molded resin exterior 6 as described above in order to provide soldering heat resistance.
Pressure is applied at a temperature of 150℃ for about 5 minutes at a pressure of 10Kg/ ^cm2 . Under such harsh conditions, the driving electrolyte of the electrolytic capacitor evaporates, causing a decrease in capacitance and a decrease in tanδ. This has resulted in deterioration of characteristics such as increase in size, and since the molded resin exterior 6 is applied, the product is extremely expensive. Furthermore, since it is a horizontal type, when mounted on a printed circuit board, it occupies a large area of the printed circuit board, which is a factor that hinders miniaturization of various devices.

In addition, in the case of mounting the above structure on a printed circuit board, as shown in FIG.
Preliminary solder 7 to improve solder wetting on the connection surface of
is temporarily fixed to the conductive pattern 9 portion of the printed circuit board 8 with adhesive 10, and solder connection is made using dip solder. However, even if the height of the preliminary solder 7 is different on the left and right sides and therefore dip soldering is performed, Connected at an angle as shown in Figure 3,
The dip solder 11 was not sufficiently applied between one comb-shaped terminal 5 and the conductive pattern 9, resulting in a gap, and there was a risk that the soldered portion would be destroyed by application of external force.

As described above, the inclination occurs during mounting, resulting in a serious problem in connection strength due to solder connections.

Purpose of the Invention The purpose of the present invention is to eliminate the above-mentioned conventional drawbacks, and provide a chip-type aluminum electrolytic capacitor that does not suffer from characteristic deterioration, is inexpensive, and allows for strong and stable solder connections during mounting. That is.

Structure of the Invention In order to achieve this object, the present invention stores a capacitor element together with a driving electrolyte in a bottomed cylindrical metal case, seals an opening of the metal case with a sealing member, and Shade in one direction from the member,
A capacitor unit configured with an anode lead wire protruding has an insulating plate having a through hole through which the lead wire passes through the end surface from which the lead wire is pulled out, and a space connected to the through hole formed on the outer surface. A ribbon solder or cream solder is inserted into the space, and the tip of the lead wire passing through the through hole is inserted into the space. With this structure, it is possible to mount it on a printed circuit board. This can prevent slanted installation and insufficient solder connections during actual installation.

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 4 and 5.

In the figure, reference numeral 12 designates a capacitor element similar to conventional capacitor elements, including an anode foil made by electrochemically roughening a high-purity aluminum foil and then anodizing it to form a dielectric oxide film; The cathode aluminum foil is wound with an insulating paper interposed therebetween, and the wound material is impregnated with a driving electrolyte. Further, this capacitor element 12 is housed in a cylindrical metal case 13 with a bottom. Further, negative and anode lead wires 14 are connected to the anode foil and the cathode foil of the capacitor element 12, respectively.

Then, the opening of the metal case 13 is sealed by attaching a sealing member 15 having a two-layer structure of an elastic body 15a and an inelastic body 15b, and drawing the opening of the metal case 13. Ori,
This constitutes a capacitor unit. Further, the negative and anode lead wires 14 connected to the capacitor element 12 pass through the sealing member 15 and are drawn out in one direction from the same end surface.
Reference numeral 16 denotes an insulating plate disposed so as to come into contact with the end surface from which the lead wire 14 of the capacitor unit is drawn out, and this insulating plate 16 is provided with a through hole 16a through which the lead wire 14 passes.

Further, a concave space 16b connected to the through hole 16a is provided on the outer surface of the insulating plate 16, and a ribbon solder or cream solder 17 is inserted or filled into the space 16b, and the through hole is filled with ribbon solder or cream solder 17. The leading end portion 14a of the lead wire 14 that has passed through the lead wire 16a is bent at a substantially right angle and is fitted into the space portion 16b. In this case, as shown in FIGS. 6a and 6b, even if the round bar lead wire 14 has its tip 14a flattened and bent, the round bar lead wire 14 remains as it is. Furthermore, ribbon solder 17 may be attached to the tip 14a of the lead wire 14.
You can also wrap it around it.

With this configuration, when mounting on a printed circuit board, as shown in FIG. Ribbon solder or cream solder 17 is melted through a furnace and soldered to the conductive pattern 19, or a dip solder process is performed to perform solder connection. In the case of this dip soldering process, the ribbon solder or cream solder 17 acts as a preliminary solder and the lead wire 14
It functions to improve the solder wetting of the tip portion 14a.

Effects of the Invention As described above, the chip-type aluminum electrolytic capacitor of the present invention adopts a metal case and can be vertically shaped, which is very advantageous in increasing the packaging density. Ribbon solder or cream solder is applied, so electronic components can be mounted stably without tilting or wobbling when mounted on a printed circuit board, and soldering can be performed stably overall, increasing soldering strength. It also becomes stable, and the solder joints will not be destroyed even if external force is applied.
Furthermore, the wetting during soldering is good and the soldering process can be performed efficiently.

In addition, since the exterior is made of a metal case, it has the advantage that compared to a molded exterior there is no deterioration in characteristics and it can be manufactured at a low cost, so it is of great industrial value.

[Brief explanation of the drawing]

Figures 1a and 1b are cross-sectional views and side views showing a conventional chip-type aluminum electrolytic capacitor, Figures 2 and 3 are front views showing the mounting process of the same capacitor on a printed circuit board, and Figure 4 is the invention according to the present invention. A perspective view showing a chip-type aluminum electrolytic capacitor according to one embodiment, FIG. 5 is a half-sectional front view of the same, FIGS. 6 a and b are perspective views showing an example of the shape of the lead wire, and FIG. FIG. 3 is a front view showing the mounting state on the board. 12... Capacitor element, 13... Metal case, 14... Lead wire, 14a... Tip, 15
... Sealing member, 16 ... Insulating plate, 16a ... Through hole, 16b ... Space, 17 ... Ribbon solder or cream solder.

Claims (1)

[Claims] 1. A capacitor element is housed together with a driving electrolyte in a bottomed cylindrical metal case, the opening of the metal case is sealed with a sealing member, and negative and anode lead wires are made to protrude in one direction from the sealing member. a capacitor unit having a through hole through which the lead wire is passed through an end surface from which the lead wire is drawn out;
and a chip type in which an insulating plate having a space connected to the through-hole is arranged on the outer surface, ribbon solder or cream solder is sandwiched in the space, and the tip of a lead wire passing through the through-hole is fitted. Aluminum electrolytic capacitor.