JPH0325407Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] This invention relates to an adhesive sheet processing apparatus that processes a sheet assembly coated with an ultraviolet-sensitive adhesive by irradiating it with light containing ultraviolet rays.

[Prior Art] In the manufacturing process of semiconductor devices such as integrated circuits (ICs), there is a dicing process in which a semiconductor wafer is cut into chips. In this dicing process, the method of holding the semiconductor wafer is to place the semiconductor wafer in the center of the support frame, and use a sheet coated with adhesive to adhere the lower surfaces of the wafer to form an integrated sheet assembly. The frame is fixed and only the semiconductor wafer is cut using a cutter, leaving the sheet intact. This method has the advantage of preventing chips from chipping or scattering, but the adhesive must have a high adhesive strength in order to withstand the impact force during cutting. However, on the other hand, since the chips must be easily peeled off from the sheet after cutting, UV-sensitive adhesives have recently been used that have the property of decreasing adhesive strength when irradiated with UV rays. A semiconductor wafer is adhered to a sheet coated with this adhesive, and after being cut, it is irradiated with ultraviolet light. It is known that irradiation with ultraviolet rays in an inert gas atmosphere is more effective in reducing adhesive strength.

FIG. 2 schematically shows a conventional apparatus for processing a sheet assembly 10, in which a semiconductor wafer 2 is adhered to a film 1 coated with an ultraviolet-sensitive adhesive, by irradiating ultraviolet rays in an _N2 gas atmosphere. 3
4 is a ring-shaped support frame that is used to attract the seat assembly 10 by a suction mechanism when conveying the seat assembly 10;
This is a cover for creating an N ₂ gas atmosphere, and 5 is a vacuum suction mechanism having four suction pads 6 around the periphery, and this sheet assembly 10 is covered with the cover 4. Therefore, it is necessary to prevent the cover 4 from interfering with the loading/unloading mechanism 5a of the seat assembly 10, but for this purpose, a drive mechanism 4a is required to raise and lower the cover 4 up and down. Ta.

[Problems to be solved by the invention] As mentioned above, in the conventional apparatus, the entire processing apparatus becomes large in order to avoid interference between the mechanism that drives the cover up and down and the mechanism that conveys the sheet assembly. There were problems in that a large space was required for the seat assembly, and the mechanism for loading and unloading the seat assembly was complicated.

This idea was made to solve such conventional problems, and the sheet assembly, in which a semiconductor wafer is adhered to a sheet coated with an ultraviolet-sensitive adhesive, is processed in an inert gas atmosphere. Another object of the present invention is to provide a pressure-sensitive adhesive sheet processing device that is small in size, does not require a large space, and is efficient in carrying in and out of sheet assemblies.

[Means for Solving the Problems] In order to achieve the above object, the adhesive sheet processing apparatus of this invention has a substrate on which a sheet assembly is placed, which constitutes a lower part of a processing chamber, and a lower part of this processing chamber. The apparatus is provided with an inert gas supply means therein, and the transport mechanism is provided with a cover constituting the upper part of the processing chamber.

[Function] With the above configuration, the inert gas supply piping can be fixed to the substrate, and the conveyance and cover portion can be simultaneously moved in one movement.

[Example] Figures 1a and 1b are a plan view and a side view showing a schematic configuration of the main parts of a pressure-sensitive adhesive sheet processing apparatus showing an example of this invention.

In FIG. 1, 7 is a spring for increasing the flexibility of the part 6 when it is attracted, and 11 is a lamp for irradiating the sheet assembly 10 with light including ultraviolet rays, which irradiates the inside of the part 6. Lamp 1 as a light source
2. It has a reflecting mirror 13. Further, 14 is a substrate on which the sheet assembly 10 is processed, and a through hole 15 for transmitting light is provided in the center.
In addition, the peripheral portion is surrounded by a frame 17 for configuring the lower part of the processing chamber for light irradiation, and this frame 1
A pipe 18 for supplying N ₂ gas is provided that penetrates a part of the pipe 7 . Further, 20 constitutes a driving section,
A transport arm 22 that functions as a cap and is integrally formed with a cover that constitutes the upper part of the processing chamber, and a rail 2
1, and this transfer arm 22 is placed on the substrate 14 to form a processing chamber. 23 is a belt driven by a motor M, and 24 is a conveyor belt. Further, the same reference numerals as in FIG. 1 indicate the same or corresponding parts.

Now, a case will be described in which the sheet assembly 10 is conveyed to the substrate 14 after the dicing process is completed. The sheet assembly 10 that has moved on the belt 24 is sucked by a vacuum suction pad 6 by the conveyor arm 22 that forms the upper part of the processing chamber. Then, due to the rotation of the motor M, the conveyor arm 22 is moved to the belt 2.
3 to move the seat assembly 1 on the rail 21.
0 is placed on the center of the substrate 14. Sheet assembly 10 placed on a substrate 14 constituting the lower part of the processing chamber
, by supplying N ₂ gas from the pipe 18 _to
Create a gas atmosphere. Thereafter, light processing is performed from the lamp body 11, and the film 1 in the sheet assembly 10 is
The adhesion of is reduced.

In this embodiment, the processing chamber for light irradiation is constructed by overlapping the substrate 14 that forms the lower part of the processing chamber and the transport arm 22 with a cover that forms the upper part of the processing chamber. There is no need to provide a cover with the function of a cap and move it up and down.

[Effects of the invention] As explained above, in the adhesive sheet processing apparatus of this invention, the substrate on which the sheet assembly is placed constitutes the lower part of the processing chamber, and the lower part of the processing chamber is provided with an inert gas supply means. However, since the transport mechanism has a structure in which a cover constituting the upper part of the processing chamber is attached, there is no need for a drive mechanism for moving the cover up and down and the drive time required for it. is provided on the substrate, which is a fixed part, so the device can be made smaller and the cost can be reduced.

[Brief explanation of the drawing]

Figures 1a and b are a plan view and a side view showing a schematic configuration of the main parts of an adhesive sheet processing apparatus showing one embodiment of this invention, and Figure 2 is a diagram for explaining the outline of a conventional adhesive sheet processing apparatus. It is a diagram. In the figure, 10: sheet assembly, 14: substrate, 1
7: Frame body, 18: Piping, 22: Transfer arm.

Claims (1)

[Scope of utility model registration request] An ultraviolet sensitive device consisting of a light irradiator with a built-in lamp that emits light with wavelengths ranging from visible light to ultraviolet light, a substrate with a through hole placed above the light irradiator, and a material that transmits light. In an adhesive sheet processing apparatus comprising a conveyance mechanism that conveys a sheet assembly in which a semiconductor wafer is adhered to a sheet coated with a mold adhesive to the substrate, the substrate constitutes a lower part of the processing chamber, and An adhesive sheet processing apparatus comprising an inert gas supply means in a lower part of the chamber, and a cover constituting an upper part of the processing chamber is attached to the transport mechanism.