JPH025448A - Ceramic package - Google Patents

Abstract

PURPOSE:To reduce in size a ceramic package by burying a resistor and a capacitor in a ceramic body. CONSTITUTION:In a ceramic package having a cavity 10 provided between a ceramic body 1 and a sealing cap 8, a semiconductor chip 2, a resistor 4 and a capacitor 5 contained therein, the chip 2 is placed in the cavity 10, and the resistor 4 and the capacitor 5 are buried in a low temperature sintered ceramic body 1 with a thick film material. Thus, the cavity 10 is reduced to decrease in size the package.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to semiconductor packages.

In particular, it relates to a low temperature sintered ceramic package.

[Conventional Technique #i] Conventionally, this type of ceramic package has a cavity portion in which a semiconductor chip, a resistor, a capacitor, etc. are mounted.

FIG. 2 shows an example of a conventional ceramic package.

In the figure, 1 is a ceramic (alumina) main body.

2 is a semiconductor chip, which is mounted on the ceramic body l.

3a and 3b are conductor patterns wired on the ceramic body l.

Reference numeral 4 denotes a thick film resistor (or chip resistor), which is provided on the conductor pattern 3a.

5 is a capacitor, which is provided on the conductor pattern 3b.

6a and 6b are the semiconductor chip 2 and the conductor patterns 3a and 3
This is a bonding wire for connection with b.

7a and 7b are input/output pins for taking out external signals, 8 is a sealing cap, and 9a and 9b are sealing portions of the cap 8.

Reference numeral 10 denotes a cavity portion, which is formed between the ceramic body 1 and the sealing cap 8.

In the conventional ceramic package as described above,
Semiconductor chip 2. Resistor 4. And the capacitor 5 was provided in the cavity part 10.

[Division to be solved Jllf! ] In the above-mentioned conventional ceramic package, since the resistor 4 and capacitor 5 are provided in the cavity 10 along with the semiconductor chip 2, there is a problem that the cavity 10 becomes large and the package becomes large. Ta.

The present invention has been made in view of the above-mentioned problems.
The purpose is to provide a ceramic package that can be made smaller.

[Means for Solving the Problems] In order to achieve the above object, the present invention provides a ceramic package including a cavity portion between a ceramic body and a sealing cap, and incorporating a semiconductor chip, a resistor, and a capacitor. The chip is mounted in the cavity, and the resistor and capacitor are embedded in the ceramic body.

[Example] Hereinafter, an example of the present invention will be described with reference to the drawings.

FIG. 1 is a longitudinal sectional view showing an embodiment of a ceramic package according to the present invention. In this figure, parts that are the same as or correspond to those of the conventional ceramic package shown in FIG. 2 are given the same reference numerals.

The feature of this embodiment is that, as shown in FIG. 1, a semiconductor chip 2 is mounted in a cavity 10, and a resistor 4 and a capacitor 5 are embedded in a low-temperature sintered ceramic body 1 using a thick film material. At the point.

With this configuration, in this embodiment, the cavity portion IO is small, and therefore the package is small.

In addition, as the cavity portion 10 has become smaller, the conductor patterns 3a, 3 wired on the ceramic body l have become smaller.
b is also smaller.

[Effects of the Invention] As explained above, the present invention has the advantage that a ceramic package can be miniaturized by embedding a resistor and a capacitor within a ceramic body.

[Brief explanation of the drawing]

FIG. 1 is a longitudinal sectional view of an embodiment of a ceramic package according to the present invention, and FIG. 2 is a longitudinal sectional view of a conventional ceramic package. 1: Ceramic body 3a, 3b 6a, 6b 7a, 7b 9a, 9b Two-handed conductor chip: Conductor pattern: Resistor: Capacitor: Bonding wire: Input/output bin: Sealing cap: Sealing part: Cavity department agent Patent attorney Kihei Watanabe

Claims (1)

[Claims] In a ceramic package that includes a cavity between a ceramic body and a sealing cap and has a built-in semiconductor chip, a resistor, and a capacitor, the semiconductor chip is mounted in the cavity, and the resistor and capacitor are mounted in the ceramic package. A ceramic package characterized by being embedded within the main body.