JPH01278011A - Layer-built solid electrolytic capacitor - Google Patents

Abstract

PURPOSE:To obtain rigid junction and good electrical connection between electrode sections in a layer-built solid electrolytic capacitor by inserting a projection of a plate of a different type metal into an aperture formed in a metal plate, welding them to produce a capacitor element, stacking a plurality of such capacitor elements while welding the different type metal plates at their projections. CONSTITUTION:A metal plate 11 which is to be one electrode terminal of a capacitor element and has no polymer layer or conductor layer of a heterocyclic compound formed thereon is provided with a notch 17. A plate of a different type metal 18 having a projection 18a fitted with the notch 17 is welded to the metal plate 11 to produce a capacitor element 1. A plurality of such capacitor elements 1 are joined together by bonding their capacitor sections 13 by means of a conductive adhesive 15 and welding the different type metal plates 18 at their projections 18a. In this manner, the electrode sections can be joined rigidly with good electrical connections.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a laminate solid electrolytic capacitor element formed by laminating a plurality of solid electrolytic capacitor elements each having a polymer layer of a heterocyclic compound such as virol, furan, or thiophene as a polymer layer. It relates to electrolytic capacitors.

[Prior art]

Figure 7 shows the structure of a conventional multilayer solid electrolytic capacitor, with (a) showing the structure of one capacitor element, and (b) showing the structure of multiple capacitor elements (in the figure). 3) is a diagram showing a stacked state.

As shown in FIG. 7(a), a conventional multilayer solid electrolytic capacitor has a strip-like structure on the entire surface of a predetermined portion of a metal plate 11, which is made of a metal such as aluminum, tantalum, titanium, etc., and has a dielectric oxide film formed thereon. The surface of the metal plate 11 is divided into two parts by forming an insulating band layer 12, and a polymer layer of a heterocyclic compound to serve as an electrolyte and a conductive layer for taking out electrode terminals are sequentially formed on one part. At the same time, a capacitor element 1 is formed by welding a metal plate 14 of a different type from the metal plate 11 to both sides of the other part.

Then, as shown in FIG. 7(b), this capacitor element 1
The multilayer solid electrolytic capacitor 2 is made by stacking a plurality of layers (three in the figure). In addition, during lamination, the capacitor parts 13 of the capacitor element 1 are bonded with a conductive adhesive 15 such as silver paste, and the metal plates 14 are bonded with a conductive adhesive 15 such as silver paste. Adhesive 1
It is joined at 6.

[Problem to be solved by the invention]

However, in the conventional multilayer solid electrolytic capacitor described above, the metal plate 14 must be joined by welding to both sides of the metal plate 11 on which a dielectric oxide film such as aluminum oxide is formed, and this welding is performed using a welding technique and construction method. There was a problem that it was difficult and became an obstacle to mass production.

The present invention has been made in view of the above-mentioned points, and an object of the present invention is to eliminate the above-mentioned problems and provide a multilayer solid electrolytic capacitor having a structure suitable for mass production.

[Means to solve the problem]

In order to solve the above-mentioned problems, the present invention provides a laminated capacitor element in which a dielectric oxide film, a polymer layer of a heterocyclic compound, and a conductive layer are sequentially formed on the surface of a metal plate on which a dielectric oxide film can be formed. In the method for manufacturing a multilayer solid electrolytic capacitor, as shown in FIG. ,
A dissimilar metal plate 18 having a notch 17 and a protrusion 18a that fits into the notch 17 is welded and fixed to constitute the capacitor element 1, and a plurality of capacitor elements 1 are assembled as shown in FIG. As shown in FIG. 1, the capacitor parts 13 are joined together using a conductive adhesive 15, and the dissimilar metal plates 18 are joined together by welding at the projections 18a.

Further, as shown in FIG. 4, a dissimilar metal plate 19 is fixed to the metal plate 11 that will become one of the electrode terminals by forming a burring hole 20, and both sides of the burring hole 20 are welded and fixed. A plurality of capacitor elements 1 are arranged in a capacitor section 13 as shown in FIG.
and the capacitor portion 13 are bonded using a conductive adhesive 15, and the metal plate 19 and the metal plate 11 are bonded using a conductive adhesive 21.

[Effect]

By configuring the multilayer solid electrolytic capacitor as described above, a dissimilar metal plate 1B is placed in the ← portion 17 of the metal plate 11.
Since the protrusion 18a is inserted and welded to form the capacitor element 1, when stacking a plurality of capacitor elements 1,
The dissimilar metal plates 18 can be welded together at the protruding portions 18a, and the electrode portions of the capacitor element 1 can be firmly joined together, and the electrical connection can also be improved.

Further, since the dissimilar metal plate 19 is fixed to the metal plate 11 by forming the burring holes 20 to form the capacitor element 1, when a plurality of capacitor elements 1 are stacked, the dissimilar metal plate 19 and the metal plate 11 are When the conductive adhesive 21 is used to bond the gap, the conductive adhesive 21 will be filled in the burring hole 20, and the adhesive surface of the conductive adhesive 21 will become larger.
The bond becomes stronger and the electrical connection also becomes better.

〔Example〕

Hereinafter, one embodiment of the present invention will be described based on the drawings.

FIG. 1 is a diagram showing the configuration of a capacitor element of a multilayer solid electrolytic capacitor according to the present invention, FIG. 1(a) is a perspective view showing the configuration of the capacitor element, and FIG. 1(b) is a dissimilar metal plate. It is a perspective view showing the shape of.

A capacitor element 1 used in the multilayer solid electrolytic capacitor according to the present invention is formed by forming a band-shaped insulating band 12 on the entire surface of a predetermined portion of a metal plate 11 on which a dielectric oxide film is formed. The surface is divided into two parts, and a polymer layer of a heterocyclic compound and a conductor layer for taking out electrode terminals are sequentially formed on one of the divided parts to form the capacitor part 13.
This is the configuration that formed the . Providing a rectangular notch 17 in the other metal plate 11 separated by the insulating band 12 of the capacitor element 1, and preparing a dissimilar metal plate 18 having a protrusion 18a having a shape and size that fits into the notch 17, Notch 1
7, insert the protrusion 18a into the protrusion IBa, and remove both sides of the protrusion IBa (
Part C) is welded to fix the dissimilar metal plate 18 to the metal plate 11. Thereby, the upper surface of the protrusion 18a and the upper surface of the metal plate 11 become the same surface.

The dissimilar metal plate 1B is welded to the metal plate 11 as described above,
As shown in FIG. 2, a plurality of capacitor elements 1 (three in the figure) are stacked to form a multilayer solid electrolytic capacitor 2.

When stacking the capacitor elements 1, as shown in FIG. 3, the capacitor parts 13 are bonded together using a conductive adhesive such as silver paste, and the dissimilar metal plates 18 are connected to the protruding parts. 18, the shape of the notch 17 is not limited to a rectangle, but may be semicircular, for example, and the number of openings where the top surface of the metal plate is flush with the top surface of the metal plate 11 is also one. It goes without saying that the number is not limited to , and a plurality of numbers may be used.

As the metal plate 11 of the capacitor element 1, a metal plate of, for example, aluminum, tantalum, titanium, etc., on which a dielectric oxide film can be formed is used. In addition, the insulating band 12
It is formed by applying an insulating paint such as a resin material. The polymer layer of a heterocyclic compound that becomes the electrolyte of the capacitor part 13 is formed by electrolytic oxidation polymerization of a polymer layer of pyrrole, furan, thiophene, etc., and the conductor layer for taking out the electrode terminal is made of graphite, for example. and coated with silver paste. Further, as the dissimilar metal plate 18, a metal plate made of a material different from that of the metal plate 11, such as a nickel plate, is used.

As described above, the notch 17 is formed in the other part of the metal plate 11 separated by the insulating band 12, and the protrusion 1 is formed in the notch 17.
When the capacitor element 1 is stacked by welding the dissimilar metal plates 18 having the protrusions 18a into the notches 17, the dissimilar metal plates 18 come into contact with each other at the protrusions 18a. The dissimilar metal plates 18 are welded together at this portion.

As described above, since the dissimilar metal plate 18 is welded to only one side of the metal plate 11, manufacturing is easier compared to conventional methods in which dissimilar metals are joined to both sides by welding. In addition, since the dissimilar metal plates 18 of one electrode part are welded together during lamination, even if the number of laminated plates increases, welding can be performed easily.
The bonding strength and electrical connection of the electrode parts are improved.

FIG. 4 is a diagram showing the configuration of another capacitor element used in the multilayer solid electrolytic capacitor according to the present invention. While forming the burring hole 20,
The dissimilar metal plate 19 is fixed to the metal plate 11 by welding the D portions on both sides of the burring hole 20. In addition, FIG. 5 is a diagram showing a cross section on the line BB in FIG. 4. Burring hole 20
By forming the dissimilar metal plate 199, the tip of the dissimilar metal plate 199 protrudes to the lower surface of the metal plate 11. However, by crushing the part of the dissimilar metal plate 199, the tip of the dissimilar metal plate 199 is firmly attached to the lower surface of the metal plate 11. Stick to it.

The dissimilar metal plates 19 are fixed to the metal plate 11 as described above, and a plurality of capacitor elements 1 (three in the figure) are laminated as shown in FIG. During the double-layer stacking, the capacitor portions 13 of the capacitor element 1 are bonded with a conductive adhesive 15, and the dissimilar metal plates 19 and the metal plates 11 are bonded with a conductive adhesive 21. At this time,
Since the conductive adhesive 21 is also filled in the burring holes 20, the surface to be bonded by the conductive adhesive 21 becomes larger, the bonding strength increases, and the electrical connection becomes good.

In addition, although the example which provided one burring hole 20 was shown in the said Example, the number of burring holes 20 is not limited to one, and it is natural that it may be plural.

〔Effect of the invention〕

As explained above, according to the present invention, the following excellent effects can be obtained.

■Protrusions of dissimilar metal plates are inserted into openings or notches of metal plates and welded to form capacitor elements, so when stacking multiple capacitor elements, dissimilar metal plates can be welded together at the protrusions. , the bonding of the electrode portions of the capacitor element becomes stronger, and the electrical connection of the electrode portions also becomes better.

■Also, since a capacitor element is formed by forming a burring hole in a dissimilar metal plate and fixing it to the metal plate, when stacking multiple capacitor elements, a conductive adhesive is used between the dissimilar metal plate and the metal plate. When bonding is performed, the conductive adhesive can completely fill the burring hole, the adhesive surface of the conductive adhesive becomes larger, the bond becomes stronger, and the electrical connection between the electrode parts is also improved.

■Also, since a dissimilar metal plate is fixed to the metal plate that becomes one electrode of the capacitor element as described above, it is easy to increase the number of laminated capacitor elements, making it easy to obtain a large-capacity multilayer solid electrolytic capacitor. It will be done.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing the configuration of a capacitor element of a multilayer solid electrolytic capacitor according to the present invention, where (a) is a perspective view showing the configuration of the capacitor element, and (b) is a diagram showing the shape of dissimilar metal plates. FIG. 2 is a perspective view showing the structure of a multilayer solid electrolytic capacitor according to the present invention, and FIG. 3 is A-
4 is a perspective view showing the configuration of a capacitor element used in a multilayer solid electrolytic capacitor according to the present invention;
FIG. 5 is a sectional view taken along the line B-B in FIG. 4, FIG. 6 is a sectional view showing the structure of another multilayer solid electrolytic capacitor according to the present invention, and FIG. 7 is a structure of a conventional multilayer solid electrolytic capacitor. , in which (a) is a diagram showing the configuration of one capacitor element, and (b) is a cross-sectional view of a multilayer solid electrolytic capacitor. In the figure, 1... capacitor element, 2... multilayer solid electrolytic capacitor, 11... metal plate, 12...
Insulating band, 13... Capacitor part, 14... Metal plate, 15.16... Conductive adhesive, 17... Notch, 18.19... Different metal plate, 20... Burring hole, 21... Conductive adhesive.

Claims (2)

[Claims] (1) A laminated solid electrolyte made by laminating a plurality of capacitor elements formed by sequentially forming a dielectric oxide film, a polymer layer of a heterocyclic compound, and a conductor layer on the surface of a metal plate on which a dielectric oxide film can be formed. In the method for manufacturing a capacitor, an opening or a notch is formed in a metal plate serving as one electrode terminal on which a polymer layer of a heterocyclic compound and a conductor layer of the capacitor element are not formed, and the opening or notch is A plurality of capacitor elements to which the dissimilar metal plates are fixed are attached by inserting the protrusion into the opening or notch and welding the protrusion to the conductor. A multilayer solid electrolytic capacitor characterized in that the layers are bonded using a conductive adhesive, and the dissimilar metal plates are bonded and laminated by welding. (2) A multilayer solid electrolyte made by laminating a plurality of capacitor elements formed by sequentially forming a dielectric oxide film, a polymer layer of a heterocyclic compound, and a conductor layer on the surface of a metal plate on which a dielectric oxide film can be formed. In the method for manufacturing a capacitor, a metal plate of a different type is fixed by burring to one metal plate serving as an electrode terminal on which a polymer layer of a heterocyclic compound and a conductive layer of the capacitor element are not formed, and the burring fixation is performed. A method of stacking a plurality of capacitor elements with the dissimilar metal plates fixed by welding and fixing the parts except for the dissimilar metal plates by using a conductive adhesive between the conductor layers and between the dissimilar metal plates and the metal plate serving as the electrode terminal. A multilayer solid electrolytic capacitor featuring: