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JP2004289142A - Laminated solid electrolytic capacitor and laminated transmission line element - Google Patents

Laminated solid electrolytic capacitor and laminated transmission line element Download PDF

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JP2004289142A
JP2004289142A JP2004060044A JP2004060044A JP2004289142A JP 2004289142 A JP2004289142 A JP 2004289142A JP 2004060044 A JP2004060044 A JP 2004060044A JP 2004060044 A JP2004060044 A JP 2004060044A JP 2004289142 A JP2004289142 A JP 2004289142A
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transmission line
electrolytic capacitor
solid electrolytic
laminated
metal
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Tomoji Arai
智次 荒井
Yoshihiko Saiki
義彦 斎木
Takeshi Toida
剛 戸井田
Takayuki Inoi
隆之 猪井
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Tokin Corp
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NEC Tokin Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a laminated solid electrolytic capacitor and a laminated transmission line element, and these manufacturing method, which prevent the deformation of an anode part and the deterioration of element characteristics thereby, even in the case of a large number of lamination. <P>SOLUTION: In the laminated solid electrolytic capacitor element and the laminated transmission line element, the anode parts of adjacent elements are connected electrically and mechanically by a connector by conductive adhesives or a metal which can be soldered, through metal plates connected so as to pinch the upper and lower surfaces of the anode parts. On the other hand, cathode parts are connected electrically and mechanically by the conductive adhesives, or are connected electrically and mechanically by adhesive insulating sheet having a hollowed portion and the conductive adhesives with which the hollowed portion is filled, or are adhered by the adhesive insulating sheet and, after being laminated, are connected electrically by the conductive adhesives on the side surfaces of the cathode parts. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、積層型固体電解コンデンサ及び積層型伝送線路素子に関する。   The present invention relates to a multilayer solid electrolytic capacitor and a multilayer transmission line element.

従来、この種の固体電解コンデンサとして、図10に示されるものがある。図10を参照すると、従来の固体電解コンデンサ素子13は、アルミニウム、タンタル、ニオブ、チタン等の弁作用を有する金属の単体またはそれらの合金からなる金属板の表面をエッチング処理により粗面化したもの、あるいは弁作用を有する金属板と弁作用を有する金属粉末を焼結一体化したものから成る弁作用金属体15の表面に酸化皮膜を形成し、絶縁樹脂17を形成して領域を2つに分け、陰極部19となる領域に、固体電解質層、グラファイト層及び銀ペースト層を、あるいは固体電解質層、グラファイト層及び金属めっき層を、あるいは固体電解質層及び金属めっき層を順次形成した構造からなっている。   Conventionally, there is a solid electrolytic capacitor of this type shown in FIG. Referring to FIG. 10, a conventional solid electrolytic capacitor element 13 is obtained by roughening the surface of a metal plate made of a simple substance or an alloy thereof having a valve action such as aluminum, tantalum, niobium, and titanium by etching. Alternatively, an oxide film is formed on the surface of a valve metal body 15 formed by sintering and integrating a metal plate having a valve action and a metal powder having a valve action, and an insulating resin 17 is formed to form two regions. The solid electrolyte layer, the graphite layer, and the silver paste layer, or the solid electrolyte layer, the graphite layer, and the metal plating layer, or the solid electrolyte layer and the metal plating layer are sequentially formed in a region to be the cathode portion 19. ing.

図11は従来の伝送線路素子を示す断面図である。図11を参照すると、従来の伝送線路素子21は、アルミニウム、タンタル、ニオブ、チタン等の弁作用を有する金属の単体またはそれらの合金からなる金属板の表面をエッチング処理により粗面化したものあるいは弁作用を有する金属板と弁作用を有する金属粉末を焼結一体化したものから成る弁作用金属体15の表面に酸化皮膜を形成し、絶縁樹脂17を形成して領域を3つに分け、中央の陰極部19となる領域に、固体電解質層、グラファイト層及び銀ペースト層、あるいは固体電解質層、グラファイト層及び金属めっき層、あるいは固体電解質層及び金属めっき層を順次形成した構造からなっている。   FIG. 11 is a sectional view showing a conventional transmission line element. Referring to FIG. 11, a conventional transmission line element 21 is obtained by roughening the surface of a metal plate made of a simple substance or a metal alloy having a valve action such as aluminum, tantalum, niobium, or titanium by etching. An oxide film is formed on the surface of a valve metal body 15 formed by sintering and integrating a metal plate having a valve action and a metal powder having a valve action, and an insulating resin 17 is formed to divide the region into three parts. It has a structure in which a solid electrolyte layer, a graphite layer and a silver paste layer, or a solid electrolyte layer, a graphite layer and a metal plating layer, or a solid electrolyte layer and a metal plating layer are sequentially formed in a region to be the central cathode portion 19. .

これら固体電解コンデンサ素子または伝送線路素子において、小型・大容量化、低インピーダンス化を図るには複数個の固体電解コンデンサ素子または伝送線路素子を厚み方向に積層し電気的に接続して積層化するのが有効である。   In these solid electrolytic capacitor elements or transmission line elements, a plurality of solid electrolytic capacitor elements or transmission line elements are laminated in the thickness direction and electrically connected to each other in order to reduce the size, increase the capacity, and reduce the impedance. Is effective.

従来の積層化技術については、例えば、特許文献1に開示されている。図12は特許文献1に開示された従来の積層型固体電解コンデンサを示す断面図である。   A conventional laminating technique is disclosed in, for example, Patent Document 1. FIG. 12 is a sectional view showing a conventional multilayer solid electrolytic capacitor disclosed in Patent Document 1. As shown in FIG.

図12を参照すると、従来の積層型固体電解コンデンサ23は、陰極部19の間は導電性接着剤25で接続され、陽極は個別にリードフレーム27と抵抗溶接により接合する構成となっている。   Referring to FIG. 12, a conventional multilayer solid electrolytic capacitor 23 has a configuration in which a cathode portion 19 is connected with a conductive adhesive 25 and anodes are individually joined to a lead frame 27 by resistance welding.

しかしながら、従来の技術では、各素子の陽極をリードフレームに接続しているため、積層数を多くしようとすると最外部に積層した素子の陽極部の変形が大きくなり、素子の特性を劣化させる問題があり、実質的には積層数2個までが限界であった。   However, in the conventional technology, since the anode of each element is connected to the lead frame, when the number of stacked layers is increased, the deformation of the anode portion of the outermost stacked element becomes large, and the characteristics of the element deteriorate. And the limit was practically up to two laminations.

特開平11−135367号公報JP-A-11-135367

したがって、本発明の技術的課題は、多数の積層においても、陽極部の変形及びそれによる特性の劣化を防止した積層型固体電解コンデンサ及び積層型伝送線路素子を提供することにある。   Accordingly, it is an object of the present invention to provide a multilayer solid electrolytic capacitor and a multilayer transmission line element that prevent deformation of an anode portion and deterioration of characteristics due to the deformation even in a large number of layers.

本発明によれば、1つの端部をなす板状の陽極部と、該陽極部とは絶縁体によって区分された陰極部とを有する略平板形状の固体電解コンデンサ素子を複数個積み重ねて一体化した積層型固体電解コンデンサにおいて、前記固体電解コンデンサ素子の前記陽極部の2つの主面を挟み込むように接続された導電性部材を有し、隣接する固体電解コンデンサ素子の前記導電性部材どうしが、導電性接着剤、半田付け可能な金属及び溶接のいずれか一種により、電気的かつ機械的に接続されて積層されていることを特徴とする積層型固体電解コンデンサが得られる。   According to the present invention, a plurality of substantially flat solid electrolytic capacitor elements each having a plate-shaped anode portion forming one end and a cathode portion separated from the anode portion by an insulator are stacked and integrated. In the laminated solid electrolytic capacitor, having a conductive member connected to sandwich the two main surfaces of the anode portion of the solid electrolytic capacitor element, the conductive members of adjacent solid electrolytic capacitor elements, A multilayer solid electrolytic capacitor characterized by being electrically and mechanically connected and laminated by any one of a conductive adhesive, a solderable metal, and welding is obtained.

また、本発明によれば、前記積層型固体電解コンデンサにおいて、前記導電性部材は金属板、金属めっき層及び導電性ペースト層の内のいずれか一種であることを特徴とする積層型固体電解コンデンサが得られる。   According to the invention, in the multilayer solid electrolytic capacitor, the conductive member is any one of a metal plate, a metal plating layer, and a conductive paste layer. Is obtained.

また、本発明によれば、前記いずれかの積層型固体コンデンサにおいて、隣接する固体電解コンデンサ素子の前記陰極部は、導電性接着剤により接続されて積層されていることを特徴とする積層型固体電解コンデンサが得られる。   Further, according to the present invention, in any one of the multilayer solid capacitors, the cathode portions of adjacent solid electrolytic capacitor elements are connected and laminated by a conductive adhesive. An electrolytic capacitor is obtained.

また、本発明によれば、前記いずれかの積層型固体コンデンサにおいて、隣接する固体電解コンデンサ素子の前記陰極部は、くり抜き部を有する接着性絶縁シートと、前記くり抜き部に充填される導電性接着剤とにより接続されて積層されていることを特徴とする積層型固体電解コンデンサが得られる。   Further, according to the present invention, in any one of the multilayer solid capacitors, the cathode portion of the adjacent solid electrolytic capacitor element includes an adhesive insulating sheet having a hollow portion, and a conductive adhesive filling the hollow portion. And a laminated solid electrolytic capacitor characterized by being connected by an agent and laminated.

また、本発明によれば、前記積層型固体コンデンサにおいて、隣接する固体電解コンデンサ素子の前記陰極部は、接着性絶縁シートにより接着されて積層され、前記陰極部の側面において導電性接着剤により電気的接続がなされていることを特徴とする積層型固体電解コンデンサが得られる。   Further, according to the present invention, in the multilayer solid capacitor, the cathode portions of adjacent solid electrolytic capacitor elements are laminated by being bonded by an adhesive insulating sheet, and the side surfaces of the cathode portion are electrically connected by a conductive adhesive. Thus, a multilayer solid electrolytic capacitor characterized in that electrical connection is made is obtained.

また、本発明によれば、前記いずれか一つの積層型固体電解コンデンサにおいて、前記固体電解コンデンサ素子は、表面が粗化された弁作用を有する平板状の金属、または、弁作用金属板上に形成した弁作用金属粉末からなる焼結体に、酸化皮膜を形成し、陰極部となる所定部分に固体電解質層を形成し、該固体電解質層上にグラファイト層と、銀ペースト層及び金属めっき層のいずれか一種とを形成してなることを特徴とする積層型固体電解コンデンサが得られる。   Further, according to the present invention, in any one of the stacked solid electrolytic capacitors, the solid electrolytic capacitor element is a flat metal having a valve action whose surface is roughened, or on a valve action metal plate. An oxide film is formed on the formed sintered body made of the valve metal powder, a solid electrolyte layer is formed on a predetermined portion serving as a cathode, and a graphite layer, a silver paste layer, and a metal plating layer are formed on the solid electrolyte layer. And a multilayer solid electrolytic capacitor characterized by being formed with any one of the above.

また、本発明によれば、前記いずれか一つの積層型固体電解コンデンサにおいて、前記固体電解コンデンサ素子は、表面が粗化された弁作用を有する平板状の金属、または、弁作用金属板上に形成した弁作用金属粉末からなる焼結体に、酸化皮膜を形成し、陰極部となる所定部分に固体電解質層を形成し、該固体電解質層上に金属めっき層を形成してなることを特徴とする積層型固体電解コンデンサが得られる。   Further, according to the present invention, in any one of the stacked solid electrolytic capacitors, the solid electrolytic capacitor element is a flat metal having a valve action whose surface is roughened, or on a valve action metal plate. An oxide film is formed on a sintered body made of the formed valve metal powder, a solid electrolyte layer is formed on a predetermined portion serving as a cathode portion, and a metal plating layer is formed on the solid electrolyte layer. Is obtained.

また、本発明によれば、略平板形状を有し、両端部をなす2つの陽極部と、該陽極部の間に設けられた1つの陰極部とを有する伝送線路素子を複数個積み重ねて一体化した積層型伝送線路素子において、該伝送線路素子の陽極部の2つの主面を挟み込むように接続された導電性部材を有し、隣接する伝送線路素子の該導電性部材どうしが、導電性接着剤、半田付け可能な金属または溶接により、電気的かつ機械的に接続されて積層されていることを特徴とする積層型伝送線路素子が得られる。   Further, according to the present invention, a plurality of transmission line elements having a substantially flat plate shape and having two anode portions forming both end portions and one cathode portion provided between the anode portions are stacked and integrated. A stacked transmission line element having a conductive member connected so as to sandwich two main surfaces of an anode portion of the transmission line element, wherein the conductive members of adjacent transmission line elements are electrically conductive. A laminated transmission line element characterized by being electrically and mechanically connected and laminated by an adhesive, a solderable metal or welding is obtained.

また、本発明によれば、前記積層型伝送線路素子において、前記導電性部材は、金属板、金属めっき層,及び導電性ペースト層のいずれか一種からなることを特徴とする積層型伝送線路素子が得られる。   Further, according to the present invention, in the multilayer transmission line element, the conductive member is made of any one of a metal plate, a metal plating layer, and a conductive paste layer. Is obtained.

また、本発明によれば、前記積層型伝送線路素子において、隣接する伝送線路素子の前記陰極部は、導電性接着剤により接続されて積層されていることを特徴とする積層型伝送線路素子が得られる。   Further, according to the present invention, in the laminated transmission line element, the stacked transmission line element is characterized in that the cathode portions of adjacent transmission line elements are laminated by being connected by a conductive adhesive. can get.

また、本発明によれば、前記積層型伝送線路素子において、隣接する伝送線路素子の前記陰極部は、くり抜き部を有する接着性絶縁シートと前記くり抜き部に充填される導電性接着剤とにより接続されて積層されていることを特徴とする積層型伝送線路素子が得られる。   Further, according to the present invention, in the stacked transmission line element, the cathode portions of adjacent transmission line elements are connected by an adhesive insulating sheet having a hollow portion and a conductive adhesive filled in the hollow portion. Thus, a stacked transmission line element characterized by being stacked is obtained.

また、本発明によれば、前記積層型伝送線路素子において、隣接する伝送線路素子の前記陰極部は、接着性絶縁シートにより接着されて積層され、前記陰極部の側面において導電性接着剤により電気的接続がなされていることを特徴とする積層型伝送線路素子が得られる。   Further, according to the present invention, in the stacked transmission line element, the cathode portions of adjacent transmission line elements are laminated by being adhered by an adhesive insulating sheet, and the side surfaces of the cathode portion are electrically connected by a conductive adhesive. A stacked transmission line element characterized in that the connection is established.

また、本発明によれば、前記いずれか一つの積層型伝送線路素子において、前記伝送線路素子は、表面が粗化された弁作用を有する平板状の金属、または、弁作用金層板上に形成した弁作用金属粉末からなる焼結体に、酸化皮膜を形成し、陰極部となる所定部分に固体電解質層を形成し、該固体電解質層上にグラファイト層と、銀ペースト層及び金属めっき層の内のいずれか一つとを形成してなることを特徴とする積層型伝送線路素子が得られる。   Further, according to the present invention, in any one of the stacked transmission line elements, the transmission line element is formed on a flat metal plate having a valve action whose surface is roughened, or on a valve action metal plate. An oxide film is formed on the formed sintered body made of the valve metal powder, a solid electrolyte layer is formed on a predetermined portion serving as a cathode, and a graphite layer, a silver paste layer, and a metal plating layer are formed on the solid electrolyte layer. And a stacked transmission line element characterized by forming any one of the above.

また、本発明によれば、前記いずれか一つの積層型伝送線路素子において、前記伝送線路素子は、表面が粗化された弁作用を有する平板状の金属、または、弁作用金属板上に形成した弁作用金属粉末からなる焼結体に、酸化皮膜を形成し、陰極部となる所定部分に固体電解質層を形成し、該固体電解質層上に金属めっき層を形成してなることを特徴とする積層型伝送線路素子が得られる。   According to the invention, in any one of the stacked transmission line elements, the transmission line element is formed on a flat metal having a valve action whose surface is roughened, or formed on a valve action metal plate. The oxide film is formed on a sintered body made of the valve action metal powder, the solid electrolyte layer is formed on a predetermined portion serving as a cathode portion, and a metal plating layer is formed on the solid electrolyte layer. Thus, a laminated transmission line element can be obtained.

また、本発明によれば、略平板形状を有し、両端部をなす2つの陽極部と、該陽極部の間に設けられた1つの陰極部とを有する伝送線路素子を複数個積み重ねて一体化した構造を備えた積層型伝送線路素子の製造方法において、導電性部材を夫々備えた少なくとも2つの前記伝送線路素子を用意し、該伝送線路素子の陽極部の2つの主面を挟み込むように前記導電性部材を接続し、隣接する伝送線路素子の該導電性部材同士を、導電性接着剤、半田付け可能な金属または溶接により、電気的かつ機械的に接続して、積層することを特徴とする積層型伝送線路素子の製造方法が得られる。   Further, according to the present invention, a plurality of transmission line elements having a substantially flat plate shape and having two anode portions forming both end portions and one cathode portion provided between the anode portions are stacked and integrated. In a method for manufacturing a laminated transmission line element having a simplified structure, at least two transmission line elements each having a conductive member are prepared, and two main surfaces of an anode portion of the transmission line element are sandwiched therebetween. The conductive members are connected, and the conductive members of adjacent transmission line elements are electrically and mechanically connected to each other by a conductive adhesive, a solderable metal or welding, and laminated. Is obtained.

また、本発明によれば、1つの端部をなす板状の陽極部と、該陽極部とは絶縁体によって区分された陰極部とを有する略平板形状の固体電解コンデンサ素子を複数個積み重ねて一体化した構造を備えた積層型固体電解コンデンサの製造方法において、導電性部材を夫々備えた少なくとも2つの固体電解コンデンサ素子を用意し、前記固体電解コンデンサ素子の前記陽極部の2つの主面を挟み込むように前記導電性部材を接続し、隣接する固体電解コンデンサ素子の前記導電性部材どうしが、導電性接着剤、半田付け可能な金属及び溶接のいずれか一種により、電気的かつ機械的に接続して積層することを特徴とする積層型固体電解コンデンサの製造方法が得られる。   Further, according to the present invention, a plurality of substantially flat solid electrolytic capacitor elements each having a plate-shaped anode portion forming one end and a cathode portion separated from the anode portion by an insulator are stacked. In a method of manufacturing a multilayer solid electrolytic capacitor having an integrated structure, at least two solid electrolytic capacitor elements each including a conductive member are prepared, and two main surfaces of the anode section of the solid electrolytic capacitor element are provided. The conductive members are connected so as to be sandwiched therebetween, and the conductive members of adjacent solid electrolytic capacitor elements are electrically and mechanically connected by one of a conductive adhesive, a solderable metal, and welding. And a method for manufacturing a multilayer solid electrolytic capacitor characterized by stacking.

以上、説明したように、本発明によれば、積層数の多い場合にも、陽極部の変形及びそれによる素子特性の劣化を防止した積層型固体電解コンデンサ及び積層型伝送線路素子とそれらの製造方法とを提供することができる。   As described above, according to the present invention, even when the number of stacked layers is large, the stacked solid electrolytic capacitor and the stacked transmission line element which prevent the deformation of the anode portion and the deterioration of the element characteristics due to the deformation, and the manufacturing thereof. And methods can be provided.

以下、本発明の実施の形態について、図1(a)乃至図9(b)を参照しながら説明する。   Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1A to 9B.

(第1の実施の形態)
図1(a)は第1の実施の形態における伝送線路素子の断面図、図1(b)は第1の実施の形態の積層型伝送線路素子の断面図、図2は第1の実施の形態において金属板の別の取付け方法による伝送線路素子の正面図、図3は第1の実施の形態において金属板のもう一つ別の取付け方法による伝送線路素子の正面図、図4(a)は第1の実施の形態において金属板のさらにもう一つ別の取付け方法による伝送線路素子の折り曲げ前の平面図である。図4(b)は図4(a)の伝送線路素子をA方向から見た側面図、図4(c)は折り曲げ後の伝送線路素子の側面図、図5(a)は、本発明による、くり抜き部を有する接着性絶縁シートの平面図、図5(b)は、図5(a)の接着性絶縁シートを使用した、第1の実施の形態の積層型伝送線路素子の断面図、図6(a)は、本発明による、くり抜き部を有しない接着性絶縁シートの平面図、図6(b)は、図6(a)の接着性絶縁シートを使用した、第1の実施の形態の積層型伝送線路素子の断面図である。
(First Embodiment)
FIG. 1A is a cross-sectional view of a transmission line element according to the first embodiment, FIG. 1B is a cross-sectional view of a stacked transmission line element according to the first embodiment, and FIG. 2 is a first embodiment. FIG. 3 is a front view of a transmission line element according to another mounting method of a metal plate in the embodiment, FIG. 3 is a front view of a transmission line element according to another mounting method of a metal plate in the first embodiment, FIG. FIG. 5 is a plan view of a transmission line element before bending according to yet another method of attaching a metal plate in the first embodiment. 4 (b) is a side view of the transmission line element of FIG. 4 (a) viewed from the direction A, FIG. 4 (c) is a side view of the transmission line element after bending, and FIG. 5 (a) is according to the present invention. FIG. 5B is a cross-sectional view of the laminated transmission line element of the first embodiment using the adhesive insulating sheet of FIG. 5A. FIG. 6A is a plan view of an adhesive insulating sheet having no cutout according to the present invention, and FIG. 6B is a first embodiment using the adhesive insulating sheet of FIG. 6A. FIG. 4 is a cross-sectional view of a stacked transmission line element according to an embodiment.

図1(a)を参照すると、この断面図は、全体の外観形状が略平板状である伝送線路素子29の、2つの陽極部を通り、かつ主面に垂直な切断面において描かれている。ここで、伝送線路素子29の陽極部には金属板31が陽極部を上下面から挟み込むように抵抗溶接あるいは超音波溶接等により接続されている。なお、従来例を示す図11と実質的に同じ部分については、同じ符号を用いている。   Referring to FIG. 1A, this cross-sectional view is drawn on a cross section of the transmission line element 29 whose overall appearance is substantially flat, passing through two anode portions and perpendicular to the main surface. . Here, a metal plate 31 is connected to the anode portion of the transmission line element 29 by resistance welding, ultrasonic welding, or the like so as to sandwich the anode portion from above and below. Note that the same reference numerals are used for substantially the same portions as those in FIG. 11 showing the conventional example.

図1(b)を参照すると、この断面図は、全体の外観形状としては、直方体状である積層型伝送線路素子33に対して、図1(a)と同様の切断面において描かれている。   Referring to FIG. 1B, this cross-sectional view is drawn on a cut surface similar to that of FIG. 1A with respect to a laminated transmission line element 33 having a rectangular parallelepiped overall appearance. .

図1(b)において、伝送線路素子29が4個積層されている。なお、説明上、積層数4個としたが本第1の実施の形態と同様にして4個以上の積層も可能である。   In FIG. 1B, four transmission line elements 29 are stacked. Although the number of layers is four for the sake of explanation, four or more layers can be stacked in the same manner as in the first embodiment.

伝送線路素子29の陰極部19の間は導電性接着剤25により接続されている。また、最下層には両端に金属板からなる陽極端子35と中央に金属板からなる陰極端子37が導電性接着剤25により接続されている。   The cathode portions 19 of the transmission line elements 29 are connected by a conductive adhesive 25. In the lowermost layer, an anode terminal 35 made of a metal plate at both ends and a cathode terminal 37 made of a metal plate at the center are connected by a conductive adhesive 25.

このとき、隣接する上下の陽極部間(金属板31の間)の接続は導電性接着剤または半田付け可能な金属による接続体39により接続されている。ここで使用した金属板31は銅などの導電性の良い金属である。この際、陽極部と溶接される面には錫などの融点の低い金属で表面をめっき処理してもよい。   At this time, the connection between the adjacent upper and lower anode portions (between the metal plates 31) is made by a connection body 39 made of a conductive adhesive or a solderable metal. The metal plate 31 used here is a metal having good conductivity such as copper. At this time, the surface to be welded to the anode may be plated with a metal having a low melting point such as tin.

また、金属板31どうしが接続される面において、導電性接着剤により接続する場合には導電性接着剤と密着性の良い銀などの金属で表面をめっき処理してもよく、また、半田付け可能な金属で接続する場合には、その金属と相性の良い金属で表面をめっき処理しても良い。   When the surfaces to which the metal plates 31 are connected to each other are connected by a conductive adhesive, the surfaces may be plated with a metal such as silver having good adhesion to the conductive adhesive. When connecting with a possible metal, the surface may be plated with a metal compatible with the metal.

金属板31の陽極部との接続方法としては、2つの金属板により陽極部を上下面から挟み込むように接続する方法のほかに、図2のように折り曲げた金属板31で陽極部を挟み込むように矢印41で示すように嵌合し、超音波溶接、電気抵抗溶接して、陽極部と金属板31とを電気的に接続する方法もある。なお、このように折り曲げた金属板31を用いたときの、陽極部での断面形状は、図1(a)または図1(b)とは、わずかに異なり、コの字形となる。   As a method of connecting the metal plate 31 to the anode, besides a method of connecting the anode by two metal plates so as to sandwich the anode from the upper and lower surfaces, a method of connecting the anode by the metal plate 31 bent as shown in FIG. There is also a method in which the anode part and the metal plate 31 are electrically connected by fitting each other as shown by an arrow 41 and performing ultrasonic welding and electric resistance welding. When the metal plate 31 thus bent is used, the cross-sectional shape at the anode portion is slightly different from FIG. 1A or FIG.

また、図3のように陽極部の幅とほぼ同じ幅の帯状の金属板31を長手方向に突出するように接続したのち、矢印43で示すように、折り曲げる方法もある。   Alternatively, as shown in FIG. 3, there is a method in which a strip-shaped metal plate 31 having a width substantially equal to the width of the anode portion is connected so as to protrude in the longitudinal direction, and then bent as shown by an arrow 43.

さらに、図4(a)に平面図で示したように陽極部の幅より長い帯状の金属板31を超音波溶着、電気抵抗溶接等により、電気的に接続したのち、側面図で示した図4(b)のように、矢印51で示すように、陽極部を包み込むように折り曲げて、側面図で示した図4(c)のようにする方法も可能である。なお、図4(a)の矢印Aは、図4(b)及び図4(c)を描いたときの、素子を見る方向を示している。   Further, as shown in a plan view in FIG. 4A, a band-shaped metal plate 31 longer than the width of the anode portion is electrically connected by ultrasonic welding, electric resistance welding, or the like, and is a side view. As shown in FIG. 4 (b), as shown by an arrow 51, the anode part may be bent so as to wrap around the anode part, and a method shown in FIG. 4 (c) shown in a side view is also possible. Note that the arrow A in FIG. 4A indicates the direction in which the element is viewed when FIGS. 4B and 4C are drawn.

また、上下に隣接する2つの金属板31間の接続は、既述の、導電性接着剤または半田付け可能な金属による接続体39による接続のほかに溶接による接続も可能である。   The connection between the two vertically adjacent metal plates 31 can be made by welding in addition to the connection by the connecting body 39 made of a conductive adhesive or a solderable metal as described above.

陰極部19の間の接続方法としては、導電性接着剤25により接続する方法ついて既に述べたが、これ以外に図5(a)に示すような所定形状のくり抜き部45を有する接着性絶縁シート47を使用し、このくり抜き部45に導電性接着剤を充填し、陰極部間の接続をとる方法も有効である。なお、図5(b)の断面図に示すように、積層型伝送線路素子53が形成される。   As the connection method between the cathode portions 19, the connection method using the conductive adhesive 25 has already been described. In addition to this, an adhesive insulating sheet having a hollow portion 45 having a predetermined shape as shown in FIG. A method of using 47 and filling the hollow portion 45 with a conductive adhesive to establish a connection between the cathode portions is also effective. As shown in the cross-sectional view of FIG. 5B, a stacked transmission line element 53 is formed.

また、さらに図6(a)に示すように、くり抜き部を有しない接着性絶縁シート55により陰極部間を接着し、図6(b)に示すように、積層後、伝送線路素子の陰極部側面に図6(b)の紙面と平行な面に導電性接着剤を塗布し電気的な接続をとり、積層型伝送線路素子57を形成することも可能である。   Further, as shown in FIG. 6A, the cathode portions are adhered to each other with an adhesive insulating sheet 55 having no hollow portion, and as shown in FIG. It is also possible to form a laminated transmission line element 57 by applying a conductive adhesive on a side surface parallel to the paper surface of FIG.

以上、積層型伝送線路素子について述べたが、積層型固体電解コンデンサについても、陽極部が両側にあるか片側にあるかの違いであり、同様の構造が適応できる。   As described above, the multilayer transmission line element has been described, but the multilayer solid electrolytic capacitor is also different in whether the anode portion is on both sides or one side, and the same structure can be applied.

(第2の実施の形態)
次に、本発明の第2の実施の形態について説明する。
(Second embodiment)
Next, a second embodiment of the present invention will be described.

図7(a)は第2の実施の形態における伝送線路素子の断面図、図7(b)は第2の実施の形態の積層型伝送線路素子の断面図である。   FIG. 7A is a sectional view of a transmission line element according to the second embodiment, and FIG. 7B is a sectional view of a stacked transmission line element according to the second embodiment.

図7(a)を参照すると、伝送線路素子61の陽極部には金属めっき層59が陽極部の両主面に形成されている。   Referring to FIG. 7A, a metal plating layer 59 is formed on both main surfaces of the anode part of the transmission line element 61 on the anode part.

図7(b)を参照すると、積層型伝送線路素子63は、伝送線路素子61が4個積層されている。なお、説明上、積層数4個としたが本第2の実施の形態と同様にすれば、4個以上の積層も可能である。   Referring to FIG. 7B, the stacked transmission line element 63 has four transmission line elements 61 stacked. Although the number of laminations is four for the sake of explanation, four or more laminations are also possible in the same manner as in the second embodiment.

上下に隣接する2つの伝送線路素子61の陰極部間は導電性接着剤25により接続されている。また、最下層には両端に金属板からなる陽極端子35と中央に金属板からなる陰極端子37が導電性接着剤25により接続されている。   The cathode portions of two vertically adjacent transmission line elements 61 are connected by the conductive adhesive 25. In the lowermost layer, an anode terminal 35 made of a metal plate at both ends and a cathode terminal 37 made of a metal plate at the center are connected by a conductive adhesive 25.

他方、陽極部間(金属めっき層59の間)の接続は導電性接着剤または半田付け可能な金属による接続体39により接続されている。この他に金属めっき層59の間の接続は溶接による接続も可能である。   On the other hand, the connection between the anode portions (between the metal plating layers 59) is made by a connection body 39 made of a conductive adhesive or a solderable metal. In addition, the connection between the metal plating layers 59 can be connected by welding.

本第2の実施の形態においても第1の実施の形態と同様の陰極部間の接続方法が適用できる。   In the second embodiment, the same connection method between the cathode parts as in the first embodiment can be applied.

また、積層型固体電解コンデンサについても、本第2の実施の形態で説明した積層型伝送線路素子と同様の構造が適応できる。   The same structure as the multilayer transmission line element described in the second embodiment can be applied to the multilayer solid electrolytic capacitor.

(第3の実施の形態)
次に、本発明の第3の実施の形態について説明する。
(Third embodiment)
Next, a third embodiment of the present invention will be described.

図8(a)は第3の実施の形態における伝送線路素子の断面図、図8(b)は第3の実施の形態の積層型伝送線路素子の断面図である。   FIG. 8A is a cross-sectional view of a transmission line element according to the third embodiment, and FIG. 8B is a cross-sectional view of a stacked transmission line element according to the third embodiment.

図8(a)を参照すると、本第3の実施の形態で使用した伝送線路素子67の陽極部には導電性ペースト層65が陽極部の両面に形成されている。   Referring to FIG. 8A, a conductive paste layer 65 is formed on both surfaces of the anode part of the transmission line element 67 used in the third embodiment.

図8(b)は、本第3の実施の形態による積層型伝送線路素子69は、伝送線路素子67が4個積層されている。なお、説明上、積層数4個としたが本第3の実施の形態と同様にすれば、4個以上の積層も可能である。   FIG. 8B shows a stacked transmission line element 69 according to the third embodiment in which four transmission line elements 67 are stacked. Although the number of laminations is four for the sake of explanation, four or more laminations are possible if the same as in the third embodiment.

また、上下に隣接する2つの伝送線路素子67の陰極部間は導電性接着剤25により接続されている。また、最下層には両端に金属板からなる陽極端子35と中央に金属板からなる陰極端子37が導電性接着剤25により接続されている。   The cathodes of two vertically adjacent transmission line elements 67 are connected by the conductive adhesive 25. In the lowermost layer, an anode terminal 35 made of a metal plate at both ends and a cathode terminal 37 made of a metal plate at the center are connected by a conductive adhesive 25.

他方、陽極部間(導電性ペースト層65の間)の接続は導電性接着剤または半田付け可能な金属による接続体39により接続されている。   On the other hand, the connection between the anode portions (between the conductive paste layers 65) is made by a connection body 39 made of a conductive adhesive or a solderable metal.

本第3の実施の形態においても第1の実施の形態及び2と同様の陰極部間の接続方法が適用できる。また、積層型固体電解コンデンサについても、本第3の実施の形態と同様の構造が適応できる。   Also in the third embodiment, the same connection method between the cathode portions as in the first embodiment and the second embodiment can be applied. The same structure as that of the third embodiment can be applied to the multilayer solid electrolytic capacitor.

(第4の実施の形態)
図9(a)は第4の実施の形態における固体電解コンデンサ素子の断面図、図9(b)は第4の実施の形態の積層型固体電解コンデンサの断面図である。
(Fourth embodiment)
FIG. 9A is a sectional view of a solid electrolytic capacitor element according to the fourth embodiment, and FIG. 9B is a sectional view of a multilayer solid electrolytic capacitor according to the fourth embodiment.

図9(a)を参照すると、この断面図は、全体の外観形状が略平板状である固体電解コンデンサ素子71の、1つの陽極部を通り、かつ主面に垂直な切断面において描かれている。ここで、固体電解コンデンサ素子71の陽極部には金属板31が陽極部を上下面から挟み込むように抵抗溶接あるいは超音波溶接等により接続されている。なお、従来例を示す図10と実質的に同じ部分については、同じ符号を用いている。   Referring to FIG. 9A, this cross-sectional view is drawn on a cut surface passing through one anode portion and perpendicular to the main surface of a solid electrolytic capacitor element 71 whose overall appearance is substantially flat. I have. Here, the metal plate 31 is connected to the anode of the solid electrolytic capacitor element 71 by resistance welding, ultrasonic welding, or the like so as to sandwich the anode from upper and lower surfaces. Note that the same reference numerals are used for substantially the same portions as those in FIG. 10 showing the conventional example.

図9(b)を参照すると、この断面図は、全体の外観形状としては、直方体状である積層型固体電解コンデンサ73に対して、図9(a)と同様の切断面において描かれている。   Referring to FIG. 9B, this cross-sectional view is drawn on a cut surface similar to FIG. 9A with respect to a multilayer solid electrolytic capacitor 73 having a rectangular parallelepiped overall shape. .

図9(b)において、固体電解コンデンサ素子71が4個積層されている。なお、説明上、積層数4個としたが本実施の形態と同様にして4個以上の積層も可能である。   In FIG. 9B, four solid electrolytic capacitor elements 71 are stacked. Note that, for the sake of explanation, the number of laminations is four, but four or more laminations are possible as in the present embodiment.

固体電解コンデンサ素子71の陰極部19の間は導電性接着剤25により接続されている。また、最下層には両端に金属板からなる陽極端子35と中央に金属板からなる陰極端子37が導電性接着剤25により接続されている。   The cathode portions 19 of the solid electrolytic capacitor elements 71 are connected by a conductive adhesive 25. In the lowermost layer, an anode terminal 35 made of a metal plate at both ends and a cathode terminal 37 made of a metal plate at the center are connected by a conductive adhesive 25.

このとき、隣接する上下の陽極部間(金属板31の間)の接続は導電性接着剤または半田付け可能な金属による接続体39により接続されている。ここで使用した金属板31は銅などの導電性の良い金属である。この際、陽極部と溶接される面には錫などの融点の低い金属で表面をめっき処理してもよい。また、金属板31どうしが接続される面において、導電性接着剤により接続する場合には導電性接着剤と密着性の良い銀などの金属で表面をめっき処理してもよく、また、半田付け可能な金属で接続する場合には、その金属と相性の良い金属で表面をめっき処理しても良い。   At this time, the connection between the adjacent upper and lower anode portions (between the metal plates 31) is made by a connection body 39 made of a conductive adhesive or a solderable metal. The metal plate 31 used here is a metal having good conductivity such as copper. At this time, the surface to be welded to the anode may be plated with a metal having a low melting point such as tin. When the surfaces to which the metal plates 31 are connected to each other are connected by a conductive adhesive, the surfaces may be plated with a metal such as silver having good adhesion to the conductive adhesive. When connecting with a possible metal, the surface may be plated with a metal compatible with the metal.

金属板31の陽極部との接続方法としては、2つの金属板により陽極部を上下面から挟み込むように接続する方法のほかに、図2のように折り曲げた金属板31で陽極部を挟み込むように矢印41で示すように嵌合し、超音波溶接、電気抵抗溶接して、陽極部と金属板31とを電気的に接続する方法もある。なお、このように折り曲げた金属板31を用いたときの、陽極部での断面形状は、図9(a)または図9(b)とは、わずかに異なり、コの字形となる。   As a method of connecting the metal plate 31 to the anode, besides a method of connecting the anode by two metal plates so as to sandwich the anode from the upper and lower surfaces, a method of connecting the anode by the metal plate 31 bent as shown in FIG. There is also a method in which the anode part and the metal plate 31 are electrically connected by fitting each other as shown by an arrow 41 and performing ultrasonic welding and electric resistance welding. When the metal plate 31 thus bent is used, the cross-sectional shape at the anode portion is slightly different from FIG. 9A or FIG. 9B, and is U-shaped.

また、図3のように陽極部の幅とほぼ同じ幅の帯状の金属板31を長手方向に突出するように接続したのち、矢印43で示すように、折り曲げる方法もある。   Alternatively, as shown in FIG. 3, there is a method in which a strip-shaped metal plate 31 having a width substantially equal to the width of the anode portion is connected so as to protrude in the longitudinal direction, and then bent as shown by an arrow 43.

さらに、図4(a)に平面図で示したように陽極部の幅より長い帯状の金属板31を超音波溶着、電気抵抗溶接等により、電気的に接続したのち、側面図で示した図4(b)のように、矢印51で示すように、陽極部を包み込むように折り曲げて、側面図で示した図4(c)のようにする方法も可能である。   Further, as shown in a plan view in FIG. 4A, a band-shaped metal plate 31 longer than the width of the anode portion is electrically connected by ultrasonic welding, electric resistance welding, or the like, and is a side view. As shown in FIG. 4 (b), as shown by an arrow 51, the anode part may be bent so as to wrap around the anode part, and a method shown in FIG. 4 (c) shown in a side view is also possible.

また、上下に隣接する2つの金属板31間の接続は、既述の、導電性接着剤または半田付け可能な金属による接続体39による接続のほかに溶接による接続も可能である。   The connection between the two vertically adjacent metal plates 31 can be made by welding in addition to the connection by the connecting body 39 made of a conductive adhesive or a solderable metal as described above.

陰極部19の間の接続方法としては、導電性接着剤25により接続する方法ついて既に述べたが、これ以外に図5(a)に示すような所定形状のくり抜き部45を有する接着性絶縁シート47を使用し、このくり抜き部45に導電性接着剤を充填し、陰極部間の接続をとる方法も有効である。なお、図5(b)の積層型伝送線路素子53の断面図に示すものと同様の積層型固体コンデンサ73が形成される。   As the connection method between the cathode portions 19, the connection method using the conductive adhesive 25 has already been described. In addition to this, an adhesive insulating sheet having a hollow portion 45 having a predetermined shape as shown in FIG. A method of using 47 and filling the hollow portion 45 with a conductive adhesive to establish a connection between the cathode portions is also effective. Note that a multilayer solid-state capacitor 73 similar to that shown in the cross-sectional view of the multilayer transmission line element 53 in FIG. 5B is formed.

また、さらに図6(a)に示すように、くり抜き部を有しない接着性絶縁シート55により陰極部間を接着し、図6(b)に示すように、積層後、伝送線路素子の陰極部側面に図6(b)の紙面と平行な面に導電性接着剤を塗布し電気的な接続をとり、積層型固体電解コンデンサ73を形成することも可能である。   Further, as shown in FIG. 6A, the cathode portions are adhered to each other with an adhesive insulating sheet 55 having no hollow portion, and as shown in FIG. It is also possible to form a laminated solid electrolytic capacitor 73 by applying a conductive adhesive to a side surface parallel to the paper surface of FIG.

以上、積層型伝送線路素子及び積層型固体電解コンデンサにおいては、陽極部が両側にあるか片側にあるかの違いであり、同様の構造が適応できる。   As described above, the difference between the stacked transmission line element and the stacked solid electrolytic capacitor is whether the anode portion is on both sides or one side, and the same structure can be applied.

このように、第1の実施の形態から第4の実施の形態のいずれにおいても、小型、大容量、かつ低インピーダンスの固体電解コンデンサ素子または伝送線路素子が実現され、陽極部に応力が集中しない構造となっている。   As described above, in each of the first to fourth embodiments, a small, large-capacity, low-impedance solid electrolytic capacitor element or transmission line element is realized, and stress is not concentrated on the anode part. It has a structure.

以上の説明の通り、本発明に係る積層型固体電解コンデンサ及び積層型伝送線路素子は、パーソナルコンピュータ(PC)の中央情報処理装置の電源回路を始めとする電子機器及び電気機器の電源回路等の電源用コンデンサに、各種電子機器又は携帯電話のバックアップ装置に、適用することができる。   As described above, the multilayer solid electrolytic capacitor and the multilayer transmission line element according to the present invention can be used for a power supply circuit of a central information processing device of a personal computer (PC), such as a power supply circuit of an electronic device and an electric device. The present invention can be applied to a power supply capacitor, a backup device of various electronic devices or a mobile phone.

(a)は第1の実施の形態における伝送線路素子の断面図、(b)は第1の実施の形態の積層型伝送線路素子の断面図である。FIG. 2A is a cross-sectional view of a transmission line element according to the first embodiment, and FIG. 2B is a cross-sectional view of a stacked transmission line element according to the first embodiment. 本発明の第1の実施の形態において金属板の別の取付け方法による伝送線路素子の正面図である。It is a front view of the transmission line element by the other mounting method of the metal plate in the first embodiment of the present invention. 本発明の第1の実施の形態において金属板のもう一つ別の取付け方法による伝送線路素子の正面図である。It is a front view of the transmission line element by the other attachment method of the metal plate in the first embodiment of the present invention. (a)は第1の実施の形態において金属板のさらにもう一つ別の取付け方法による伝送線路素子の折り曲げ前の平面図、(b)は(a)の伝送線路素子をA方向から見た側面図、(c)は折り曲げ後の伝送線路素子の側面図である。(A) is a plan view of the transmission line element according to the first embodiment before bending the transmission line element by yet another mounting method, and (b) is a view of the transmission line element of (a) viewed from the A direction. FIG. 3C is a side view of the transmission line element after bending. (a)は、本発明による、くり抜き部を有する接着性絶縁シートの平面図、(b)は、(a)の接着性絶縁シートを使用した、第1の実施の形態の積層型伝送線路素子の断面図である。(A) is a plan view of an adhesive insulating sheet having a hollow portion according to the present invention, and (b) is a laminated transmission line element of the first embodiment using the adhesive insulating sheet of (a). FIG. (a)は、本発明による、くり抜き部を有しない接着性絶縁シートの平面図、(b)は、(a)の接着性絶縁シートを使用した、第1の実施の形態の積層型伝送線路素子の断面図である。(A) is a plan view of an adhesive insulating sheet having no cutout according to the present invention, and (b) is a laminated transmission line of the first embodiment using the adhesive insulating sheet of (a). It is sectional drawing of an element. (a)は第2の実施の形態における伝送線路素子の断面図、(b)は第2の実施の形態の積層型伝送線路素子の断面図である。(A) is a cross-sectional view of the transmission line element according to the second embodiment, and (b) is a cross-sectional view of the stacked transmission line element of the second embodiment. (a)は第3の実施の形態における伝送線路素子の断面図、(b)は第3の実施の形態の積層型伝送線路素子の断面図である。(A) is a cross-sectional view of the transmission line element according to the third embodiment, and (b) is a cross-sectional view of the stacked transmission line element of the third embodiment. (a)は第4の実施の形態における固体電解コンデンサ素子の断面図、(b)は第4の実施の形態の積層型固体電解コンデンサの断面図である。(A) is a sectional view of a solid electrolytic capacitor element according to the fourth embodiment, and (b) is a sectional view of a multilayer solid electrolytic capacitor according to the fourth embodiment. 従来の固体電解コンデンサ素子の断面図である。It is sectional drawing of the conventional solid electrolytic capacitor element. 従来の伝送線路素子の断面図である。It is sectional drawing of the conventional transmission line element. 従来の積層型固体電解コンデンサの断面図である。It is sectional drawing of the conventional laminated type solid electrolytic capacitor.

符号の説明Explanation of reference numerals

13 固体電解コンデンサ素子
15 弁作用金属体
17 絶縁樹脂
19 陰極部
21 伝送線路素子
23 積層型固体電解コンデンサ
25 導電性接着剤
27 リードフレーム
29 伝送線路素子
31 金属板
33 積層型伝送線路素子
35 陽極端子
37 陰極端子
39 接続体
41,43 矢印
45 くり抜き部
47 接着性絶縁シート
51 矢印
53 積層型伝送線路素子
55 接着性絶縁シート
57 積層型伝送線路素子
59 金属めっき層
61 伝送線路素子
63 積層型伝送線路素子
65 導電性ペースト層
67 伝送線路素子
69 積層型伝送線路素子
71 固体電解コンデンサ素子
73 積層型固体電解コンデンサ
DESCRIPTION OF SYMBOLS 13 Solid electrolytic capacitor element 15 Valve action metal body 17 Insulating resin 19 Cathode part 21 Transmission line element 23 Laminated solid electrolytic capacitor 25 Conductive adhesive 27 Lead frame 29 Transmission line element 31 Metal plate 33 Laminated transmission line element 35 Anode terminal 37 Cathode Terminal 39 Connector 41,43 Arrow 45 Cutout 47 Adhesive Insulating Sheet 51 Arrow 53 Laminated Transmission Line Element 55 Adhesive Insulating Sheet 57 Laminated Transmission Line Element 59 Metal Plating Layer 61 Transmission Line Element 63 Laminated Transmission Line Element 65 Conductive paste layer 67 Transmission line element 69 Laminated transmission line element 71 Solid electrolytic capacitor element 73 Laminated solid electrolytic capacitor

Claims (16)

1つの端部をなす板状の陽極部と、該陽極部とは絶縁体によって区分された陰極部とを有する略平板形状の固体電解コンデンサ素子を複数個積み重ねて一体化した積層型固体電解コンデンサにおいて、前記固体電解コンデンサ素子の前記陽極部の2つの主面を挟み込むように接続された導電性部材を有し、隣接する固体電解コンデンサ素子の前記導電性部材どうしが、導電性接着剤、半田付け可能な金属及び溶接のいずれか一種により、電気的かつ機械的に接続されて積層されていることを特徴とする積層型固体電解コンデンサ。   A multilayer solid electrolytic capacitor obtained by stacking and integrating a plurality of substantially plate-shaped solid electrolytic capacitor elements each having a plate-shaped anode portion forming one end and a cathode portion separated from the anode portion by an insulator. A conductive member connected so as to sandwich the two main surfaces of the anode portion of the solid electrolytic capacitor element, wherein the conductive members of adjacent solid electrolytic capacitor elements are electrically conductive adhesive, A multilayer solid electrolytic capacitor characterized by being electrically and mechanically connected and laminated by any one of a metal that can be attached and a weld. 請求項1記載の積層型固体電解コンデンサにおいて、前記導電性部材は金属板、金属めっき層及び導電性ペースト層の内のいずれか一種であることを特徴とする積層型固体電解コンデンサ。   2. The multilayer solid electrolytic capacitor according to claim 1, wherein the conductive member is any one of a metal plate, a metal plating layer, and a conductive paste layer. 請求項1又は2記載の積層型固体電解コンデンサにおいて、隣接する固体電解コンデンサ素子の前記陰極部は、導電性接着剤により接続されて積層されていることを特徴とする積層型固体電解コンデンサ。   3. The multilayer solid electrolytic capacitor according to claim 1, wherein said cathode portions of adjacent solid electrolytic capacitor elements are connected and laminated by a conductive adhesive. 請求項1又は2記載の積層型固体電解コンデンサにおいて、隣接する固体電解コンデンサ素子の前記陰極部は、くり抜き部を有する接着性絶縁シートと、前記くり抜き部に充填される導電性接着剤とにより接続されて積層されていることを特徴とする積層型固体電解コンデンサ。   3. The multilayer solid electrolytic capacitor according to claim 1, wherein the cathode portions of adjacent solid electrolytic capacitor elements are connected by an adhesive insulating sheet having a hollow portion and a conductive adhesive filled in the hollow portion. A multilayer solid electrolytic capacitor characterized by being laminated. 請求項1又は2記載の積層型固体電解コンデンサにおいて、隣接する固体電解コンデンサ素子の前記陰極部は、接着性絶縁シートにより接着されて積層され、前記陰極部の側面において導電性接着剤により電気的接続がなされていることを特徴とする積層型固体電解コンデンサ。   3. The multilayer solid electrolytic capacitor according to claim 1, wherein the cathode portions of adjacent solid electrolytic capacitor elements are laminated by being bonded by an adhesive insulating sheet, and are electrically connected by a conductive adhesive on a side surface of the cathode portion. 4. A multilayer solid electrolytic capacitor characterized by being connected. 請求項1から5までのいずれか一つに記載の積層型固体電解コンデンサにおいて、前記固体電解コンデンサ素子は、表面が粗化された弁作用を有する平板状の金属、または、弁作用金属板上に形成した弁作用金属粉末からなる焼結体に、酸化皮膜を形成し、陰極部となる所定部分に固体電解質層を形成し、該固体電解質層上にグラファイト層と、銀ペースト層及び金属めっき層のいずれか一種とを形成してなることを特徴とする積層型固体電解コンデンサ。   The multilayer solid electrolytic capacitor according to any one of claims 1 to 5, wherein the solid electrolytic capacitor element is a plate-like metal having a valve action whose surface is roughened, or a valve action metal plate. An oxide film is formed on a sintered body made of a valve action metal powder formed in the above, a solid electrolyte layer is formed on a predetermined portion serving as a cathode portion, and a graphite layer, a silver paste layer and metal plating are formed on the solid electrolyte layer. A multilayer solid electrolytic capacitor characterized by forming any one of layers. 請求項1から5までのいずれか一つに記載の積層型固体電解コンデンサにおいて、前記固体電解コンデンサ素子は、表面が粗化された弁作用を有する平板状の金属、または、弁作用金属板上に形成した弁作用金属粉末からなる焼結体に、酸化皮膜を形成し、陰極部となる所定部分に固体電解質層を形成し、該固体電解質層上に金属めっき層を形成してなることを特徴とする積層型固体電解コンデンサ。   The multilayer solid electrolytic capacitor according to any one of claims 1 to 5, wherein the solid electrolytic capacitor element is a plate-like metal having a valve action whose surface is roughened, or a valve action metal plate. An oxide film is formed on a sintered body made of a valve action metal powder formed as described above, a solid electrolyte layer is formed on a predetermined portion serving as a cathode portion, and a metal plating layer is formed on the solid electrolyte layer. Characteristic multilayer solid electrolytic capacitor. 略平板形状を有し、両端部をなす2つの陽極部と、該陽極部の間に設けられた1つの陰極部とを有する伝送線路素子を複数個積み重ねて一体化した積層型伝送線路素子において、該伝送線路素子の陽極部の2つの主面を挟み込むように接続された導電性部材を有し、隣接する伝送線路素子の該導電性部材どうしが、導電性接着剤、半田付け可能な金属または溶接により、電気的かつ機械的に接続されて積層されていることを特徴とする積層型伝送線路素子。   A stacked transmission line element in which a plurality of transmission line elements having a substantially flat plate shape and having two anode portions forming both ends and one cathode portion provided between the anode portions are stacked and integrated. A conductive member connected so as to sandwich the two main surfaces of the anode part of the transmission line element, wherein the conductive members of adjacent transmission line elements are connected by a conductive adhesive, a solderable metal, Alternatively, the stacked transmission line element is electrically and mechanically connected and stacked by welding. 請求項8記載の積層型伝送線路素子において、前記導電性部材は、金属板、金属めっき層,及び導電性ペースト層のいずれか一種からなることを特徴とする積層型伝送線路素子。   9. The multilayer transmission line device according to claim 8, wherein the conductive member is made of one of a metal plate, a metal plating layer, and a conductive paste layer. 請求項8又は9記載の積層型伝送線路素子において、隣接する伝送線路素子の前記陰極部は、導電性接着剤により接続されて積層されていることを特徴とする積層型伝送線路素子。   10. The stacked transmission line device according to claim 8, wherein the cathode portions of adjacent transmission line devices are connected and stacked by a conductive adhesive. 請求項8又は9記載の積層型伝送線路素子において、隣接する伝送線路素子の前記陰極部は、くり抜き部を有する接着性絶縁シートと前記くり抜き部に充填される導電性接着剤とにより接続されて積層されていることを特徴とする積層型伝送線路素子。   10. The stacked transmission line device according to claim 8, wherein the cathode portions of adjacent transmission line devices are connected by an adhesive insulating sheet having a hollow portion and a conductive adhesive filling the hollow portion. A laminated transmission line element characterized by being laminated. 請求項8又は9記載の積層型伝送線路素子において、隣接する伝送線路素子の前記陰極部は、接着性絶縁シートにより接着されて積層され、前記陰極部の側面において導電性接着剤により電気的接続がなされていることを特徴とする積層型伝送線路素子。   10. The stacked transmission line device according to claim 8, wherein said cathode portions of adjacent transmission line devices are laminated by being bonded by an adhesive insulating sheet, and are electrically connected by a conductive adhesive on a side surface of said cathode portion. A stacked transmission line element characterized in that: 請求項8から12の内のいずれか一つに記載の積層型伝送線路素子において、前記伝送線路素子は、表面が粗化された弁作用を有する平板状の金属、または、弁作用金層板上に形成した弁作用金属粉末からなる焼結体に、酸化皮膜を形成し、陰極部となる所定部分に固体電解質層を形成し、該固体電解質層上にグラファイト層と、銀ペースト層及び金属めっき層の内のいずれか一つとを形成してなることを特徴とする積層型伝送線路素子。   13. The laminated transmission line element according to claim 8, wherein the transmission line element is a plate-shaped metal having a valve action whose surface is roughened, or a valve action metal layer plate. An oxide film is formed on the sintered body made of the valve metal powder formed above, a solid electrolyte layer is formed on a predetermined portion serving as a cathode portion, and a graphite layer, a silver paste layer, and a metal layer are formed on the solid electrolyte layer. A laminated transmission line element, wherein the laminated transmission line element is formed by forming one of the plating layers. 請求項8から12の内のいずれか一つに記載の積層型伝送線路素子において、前記伝送線路素子は、表面が粗化された弁作用を有する平板状の金属、または、弁作用金属板上に形成した弁作用金属粉末からなる焼結体に、酸化皮膜を形成し、陰極部となる所定部分に固体電解質層を形成し、該固体電解質層上に金属めっき層を形成してなることを特徴とする積層型伝送線路素子。   The laminated transmission line element according to any one of claims 8 to 12, wherein the transmission line element is a plate-shaped metal having a valve action whose surface is roughened, or a valve action metal plate. An oxide film is formed on a sintered body made of a valve action metal powder formed as described above, a solid electrolyte layer is formed on a predetermined portion serving as a cathode portion, and a metal plating layer is formed on the solid electrolyte layer. Characteristic laminated transmission line element. 略平板形状を有し、両端部をなす2つの陽極部と、該陽極部の間に設けられた1つの陰極部とを有する伝送線路素子を複数個積み重ねて一体化した構造を備えた積層型伝送線路素子の製造方法において、導電性部材を夫々備えた少なくとも2つの前記伝送線路素子を用意し、該伝送線路素子の陽極部の2つの主面を挟み込むように前記導電性部材を接続し、隣接する伝送線路素子の該導電性部材同士を、導電性接着剤、半田付け可能な金属または溶接により、電気的かつ機械的に接続して、積層することを特徴とする積層型伝送線路素子の製造方法。   A laminated type having a structure in which a plurality of transmission line elements having a substantially flat plate shape and having two anode portions forming both ends and one cathode portion provided between the anode portions are stacked and integrated. In the method for manufacturing a transmission line element, at least two transmission line elements each having a conductive member are prepared, and the conductive members are connected so as to sandwich two main surfaces of an anode part of the transmission line element, The conductive members of adjacent transmission line elements are electrically and mechanically connected to each other by a conductive adhesive, a solderable metal or welding, and are laminated. Production method. 1つの端部をなす板状の陽極部と、該陽極部とは絶縁体によって区分された陰極部とを有する略平板形状の固体電解コンデンサ素子を複数個積み重ねて一体化した構造を備えた積層型固体電解コンデンサの製造方法において、導電性部材を夫々備えた少なくとも2つの固体電解コンデンサ素子を用意し、前記固体電解コンデンサ素子の前記陽極部の2つの主面を挟み込むように前記導電性部材を接続し、隣接する固体電解コンデンサ素子の前記導電性部材どうしが、導電性接着剤、半田付け可能な金属及び溶接のいずれか一種により、電気的かつ機械的に接続して積層することを特徴とする積層型固体電解コンデンサの製造方法。

A laminated structure having a structure in which a plurality of substantially flat solid electrolytic capacitor elements each having a plate-shaped anode part forming one end and a cathode part separated by an insulator are stacked and integrated. In the method for manufacturing a solid electrolytic capacitor, at least two solid electrolytic capacitor elements each including a conductive member are prepared, and the conductive member is sandwiched between two main surfaces of the anode section of the solid electrolytic capacitor element. Connected, the conductive members of adjacent solid electrolytic capacitor elements are electrically and mechanically connected and laminated by any one of conductive adhesive, solderable metal and welding. Of manufacturing a multilayer solid electrolytic capacitor to be manufactured.

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