JPH08316301A - Storage container - Google Patents

Abstract

(57) [Summary] [Purpose] To provide a storage container that can prevent defective storage. [Structure] A storage recess 12 for storing the PGA IC 1 is formed in a square hole shape in a main body 11 of the PGA IC storage container 10, and the PGA IC is formed in each corner of the storage recess 12.
An escape hole 14 that forms an escape space 15 that escapes the corner portion 5 of the first sealing body 4 is provided. Each corner portion 5 of the sealing body 4 of the PGA / IC 1 while being accommodated in the accommodation recess 12
Is loosely fitted in each escape space 15 of the storage recess 12, so that each corner portion 5 of the sealing body 4 does not fit into each corner portion of the storage recess 12. [Effect] The PGA / IC can be prevented from being disturbed due to interference between the storage recess and the corners of the PGA / IC.
Can be taken out smoothly from the storage recess. Since the storage interference due to the fitting of the corner of the PGA / IC into the corner of the storage recess can be avoided, the PGA / IC can be smoothly stored in the storage recess.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a storage container, in particular, a large number of semiconductor devices provided with a rectangular package in which external terminals such as pins and outer leads are arranged on the lower surface or lower side surface of a sealing body. For things to be stored in, for example,
A semiconductor integrated circuit device having a pin grid array package (hereinafter referred to as PGA IC) and a semiconductor integrated circuit device having a ball grid array package (hereinafter referred to as BGA IC). It is related to what is effective in storing.

[0002]

2. Description of the Related Art As a conventional storage container for storing PGA / IC, a storage recess is integrally formed on a top surface of a plate-shaped main body into a square hole shape matching the outer shape of a sealed body of PGA / IC. There is a tray in which the support portion for mounting the PGA / IC sealing body is projected in the shape of a square flat plate on the bottom surface of the storage recess. And PGA
When the IC is stored in the storage recess of the tray, the pin is prevented from abutting on the bottom surface of the storage recess by the sealing body being placed and supported on the support portion, and the IC is sealed. The outer periphery of the stopper body is opposed to the inner periphery of the accommodating recess to prevent lateral movement.

In the conventional PGA / IC storage tray, there are so-called R chamfers and C at four corners of the storage recess.
Chamfers such as chamfers are formed respectively. The first reason why the chamfered portion is formed in the corner portion of the storage recess is that if the corner portion of the storage recess is formed in an edge shape, breakage such as cracking or chipping easily occurs in the corner portion. To prevent. The second reason is that when the tray is integrally molded, it is extremely difficult to mold the corner portion of the storage recess with the edge shape from the standpoint of mold releasability and the like. Therefore, this molding should be performed easily. It is in.

An example of a tray for accommodating PGA / IC is disclosed in Japanese Patent Laid-Open No. 3-169043.

[0005]

However, in the tray described above, the chamfered portion is formed at the corner of the storage recess, so that the PGA.I stored in the storage recess is formed.
There is a case where each corner portion of the sealing body of C is tightly fitted in each chamfered portion, which makes it impossible to take out the PGA / IC from the storage recessed portion, or conversely, it becomes difficult to store it. There was a problem that storage failure occurred.

An object of the present invention is to provide a storage container capable of preventing storage failure.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0008]

The typical ones of the inventions disclosed in the present application will be outlined below.

That is, in the storage container, each relief portion is formed in each corner portion of the storage recess formed in the shape of a square hole so as to store the semiconductor device having the square package, and each escape portion is formed. The escape space for escaping the corner portion of the sealing body in the package of the semiconductor device housed by each section is opened.

[0010]

According to the above-mentioned means, since each corner portion of the sealing body of the semiconductor device is loosely fitted into the escape space of the storage recess in the state of being stored in the storage recess, each corner of the sealing body is in a loose state. The part does not fit into each corner of the storage recess. Therefore, there is no possibility that the semiconductor device housed in the housing recess interferes with the respective corners of the housing recess and is prevented from being taken out. Moreover, when the semiconductor device is housed in the housing recess, There is no possibility that the corner portion interferes with each corner portion of the storage recess to prevent the storage.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a PGA IC which is an embodiment of the present invention.
FIG. 3A is a partially cutaway perspective view showing a storage container for use in a partially omitted perspective view, and FIG.
FIG. 2A is a plan view showing the entire storage container,
FIG. 3B is a partially omitted and partially cut perspective view showing a vacuum forming mold used in the method for forming the storage container.

In the present embodiment, the storage container according to the present invention is configured to store a large number of semiconductor integrated circuit devices (PGA ICs) having a pin grid array package. PGA I as a stored item
C1 includes a pin grid array package (hereinafter, referred to as a package) 2. The package 2 includes a sealing body 4 and pins 3 as external terminals. The sealing body 4 is made of resin or ceramic and is formed into a substantially square flat plate shape, and a large number of pins 3 are provided on the outer peripheral portion of one main surface (hereinafter referred to as the lower surface) of the sealing body 4. Are arranged at equal intervals in the circumferential direction on the virtually formed double square frame line, and are projected at right angles. A semiconductor pellet (not shown) in which an integrated circuit is formed is sealed inside the sealing body 4, and the integrated circuit formed in the semiconductor pellet is an inner lead or a bonding wire (neither is shown in the figure). ), Each pin 3 electrically draws it out of the sealing body 4.

The PGA / IC storage container 10 is provided with a main body 11 formed in a rectangular sheet shape. The main body 11 uses a sheet made of resin such as vinyl chloride resin, which is used in a vacuum forming method described later. It is integrally molded by a suitable means.

On the upper surface of the main body 11, a plurality of accommodating recesses 12 formed in the shape of square holes are regularly arranged in the vertical and horizontal directions like a grid and are bulged in the same shape. Each storage recess 12 has a plane shape of PGA · I.
It is formed into a square that is slightly larger than the square of the package 2 of C1 and its depth is set to be slightly larger than the total height of the package 2 of PGA IC1.

A support portion 13 formed in a square flat plate shape on the bottom surface of the storage recess 12 is arranged concentrically with the storage recess 12 in the central portion of the storage recess 12 and protrudes vertically upward. It is bulged. Support part 13
The outer shape of the square is set to be appropriately smaller than the outer shape of the sealing body 4, and the height of the supporting portion 13 is set to be as large as possible without interfering with the pin 3 of the PGA IC1.
In order that the pin 3 can be floated from the bottom surface of the storage recess 12 in a state in which the sealing body 4 is placed on the PGA 3,
-It is set larger than the length of pin 3 of IC1.

Further, one escape hole 14 as an escape portion is provided at each of the four corner portions of the storage recess 12 and the main body 1 is provided.
1 is bulged and molded integrally with each other. Escape hole 14
Is formed in a circular shape in a plan view, and is disposed so that the center of the circle is substantially aligned with the intersection of both sides in the corner portion of the storage recess 12 and is recessed. Therefore,
An escape space 15 for escaping the corner portion 5 of the sealing body 4 of the PGA / IC 1 is formed by the hollow portion of the escape hole 14 outside the corner portion of the storage recess 12. That is, the escape space 15 is formed by a circular space of 270 degrees formed outside the sealing body 4 in the escape hole 14.

For example, by using the vacuum forming die 20 shown in FIG. 2B, each relief hole 14 is formed in the main body 1
Vacuum forming can be performed simultaneously with 1. In this vacuum forming die 20, a housing recess forming part 22 for forming the housing recess 12 is recessed in the upper surface of a main body 21, and the forming part 22 is formed.
A support portion molding portion 23 for molding the support portion 13 is provided at the center of the projecting portion. Escape hole forming portions 24 for forming the escape holes 14 are respectively recessed in the respective corner portions of the storage recess forming portion 22. These molding parts 22, 23, 2
Each of the vacuum suction ports 25 is opened at 4, and each vacuum suction port 25 is fluidly connected to a vacuum suction path (not shown) of the vacuum forming die 20.

When the heated and softened resin sheet 26 is placed on the upper surface of the main body 21 of the vacuum forming die 20, the inside of the storage recess forming portion 22 is evacuated by the vacuum suction port 25. The resin sheet 26 is used to form the molding parts 22, 2
The storage container 10 is integrally formed because the storage container 10 is closely attached to the storage containers 3 and 24. Then, after the resin sheet is cured, the storage container 10 as a molded product is released from the vacuum molding die 20. In order to facilitate this mold release, each molding portion 22, 23, 24 is formed with a taper for die cutting. Corresponding to this taper, a taper is formed on the rising side surface of the storage recess 12, the support 13, and the escape hole 14 of the storage container 10, respectively.

Next, a method of using the PGA / IC storage container 10 having the above-described structure and its operation will be described.

When the PGA IC 1 is stored in the storage container 10, the PGA IC 1 is inserted into the storage recess 12 with the pin 3 side facing downward, and the sealing body 4 is placed on the support portion 13. To be done. At this time, the four corner portions 5 of the sealing body 4 are loosely fitted in the respective escape spaces 15 formed by the four escape holes 14 of the storage recess 12. Therefore, the respective corner portions 5 of the sealing body 4 do not interfere with the respective corner portions of the storage recess 12, and the PGA / IC 1 is stored in the storage recess 1.
It will be stored smoothly in 2. Therefore, PGA
-Even when the IC 1 is automatically inserted into the storage container 10, it is possible to prevent the occurrence of a storage operation error.

In this way, the storage recess 1 of the storage container 10
In the PGA / IC 1 housed in the regular position in 2, the sealing body 4 is placed on the support portion 13, and the group of pins 3 is formed on the support portion 1.
3 and the inner peripheral surface of the storage recess 12 are arranged in a space. Since the height of the support portion 13 is set to be larger than the length of the pin 3, the lower end of the pin 3 is in a state of being floated from the bottom surface of the storage recess 12, so that the deformation of the pin 3 can be prevented. Further, each of the corner portions 5 of the sealing body 4 is housed in the escape space 15 so as to be separated from the inner peripheral surface of the housing recess 12, but the corner portions on the four side surfaces of the sealing body 4 are formed. Each of the central portions excluding 5 is in a state of being extremely close to each central portion except the corner portions on the four side surfaces of the storage recess 12. Therefore, the PGA / IC 1 housed in the housing recess 12 is in a state in which lateral movement is prevented because the four sides of the sealing body 4 are regulated by the four sides of the housing recess 12.

When the PGA IC1 is stored in all of the plurality of storage recesses 12 formed in the storage container 10,
A lid (not shown) is placed on the upper surface of the main body 11 of the storage container 10 to cover the upper opening of the storage recess 12. Then, the storage containers 10 with the PGA / IC 1 filled and covered with the lids are stacked in a plurality of layers by stacking a plurality of storage containers 10 vertically.

PGA IC1 stored in the storage container 10
When taking out, the upper surface of the sealing body 4 of the PGA / IC 1 housed in the housing recess 12 may be vacuum sucked and held by a vacuum suction collet (not shown) and lifted vertically. At this time, since the respective corner portions 5 of the sealing body 4 are loosely fitted in the clearance spaces 15 formed in the respective corner portions of the storage recess 12, the corner portions 5 of the sealing body 4 and the storage recess 12 have corners. The PGA / IC1 can be smoothly taken out from the storage recess 12 without interfering with each other. Therefore, even when the PGA / IC 1 is taken out from the storage container 10 by an automatic machine, it is possible to prevent the occurrence of a work error.

According to the above embodiment, the following effects can be obtained. (1) Each relief hole 1 is formed in each corner of the storage recess 12 formed in a square hole shape so as to store the PGA / IC 1.
4 are respectively formed, and each escape portion 14 forms a PGA
Each of the corner portions 5 of the PGA / IC1 sealing body 4 in the state of being accommodated in the accommodation recess 12 allows each of the corner portions 5 of the encapsulating body 4 of the IC 1 to escape from the accommodation recess 12 by opening an escape space 15 for escaping the corner 5 of the sealing body 4 of IC1. Since the space 15 is loosely fitted, it is possible to prevent the situation in which the respective corner portions 5 of the sealing body 4 are fitted into the respective corner portions of the storage recess 12 from occurring.

(2) Due to the above (1), the storage recess 12
Since it is possible to prevent the situation in which the PGA-IC1 stored in the IC is interfered with the corners of the storage recess 12 from being prevented from being taken out, the PGA-IC1 can be prevented.
The IC 1 can be smoothly taken out from the storage recess 12.

(3) According to (1) above, PGA / IC
When storing 1 in the storage recess 12, it is possible to prevent a situation in which each corner portion 5 of the sealing body 4 interferes with each corner portion of the storage recess 12 to prevent the storage, and thus the PGA. The IC 1 can be smoothly stored in the storage recess 12.

FIG. 3 shows a PGA.I according to a second embodiment of the present invention.
It has shown the accommodating container for C, (a) is a partial omission partial perspective view with a part omitted, (b) is an expanded partial front sectional view of the accommodating state along the bb line of (a).

The second embodiment is different from the first embodiment in that
An escape portion for forming the escape space 15 is constituted by a through hole 14A which is formed in a circular shape and penetrates a corner portion of the housing recess 12 in the main body 11. Incidentally, the through hole 14A as the escape portion can be opened by punching the main body 11 after the storage recess 12 and the support portion 13 are formed. The operational effects of the second embodiment are similar to those of the first embodiment.

FIG. 4 shows a BGA.I according to a third embodiment of the present invention.
The storage container for C is shown, (a) is a partial omission partial perspective view with a part omitted, (b) is an expanded partial front sectional view.

The third embodiment differs from the first embodiment in that
A point that the semiconductor integrated circuit device (BGA IC) 1A having a ball grid array package is configured to accommodate a large number, a point that the main body 11A is formed in a plate, and an accommodation recess. An annular groove 16 that escapes the outer peripheral portion of the sealing body 4A is provided on the outer peripheral portion of the bottom surface of the casing 12.

The BGA IC 1A as an object to be stored has a ball grid array package (hereinafter referred to as a BGA package) 2A, and the BGA package 2A is composed of a sealing body 4A and a ball 3A which is an external terminal. Has been done. The sealing body 4A is made of resin or ceramic and is formed into a substantially square flat plate shape.
A large number of balls 3A are arranged at equal intervals in the circumferential direction on a double square frame line virtually formed on the outer peripheral portion of one main surface (hereinafter, referred to as a lower surface) of the sealing body 4A, Each is projected in a hemispherical shape. A semiconductor pellet (not shown) in which an integrated circuit is formed inside the sealing body 4A.
So that the integrated circuit formed in the semiconductor pellet is electrically pulled out to the outside of the sealing body 4A by each ball 3A via an inner lead or a bonding wire (neither is shown). Has become.

The main body 11A, which is a rectangular flat plate in which the accommodating recess 12 and the supporting portion 13 are integrally molded, has a mold molding method such as an injection molding method, a compression molding method, or an extrusion molding method.
The clearance hole 14 for forming the clearance space 15 can be integrally molded with the storage recess 12.

In the third embodiment, when the BGA / IC 1A is accommodated in the accommodating recess 12, the sealing body 4A has an escape space 15 formed by escape holes 14 at four corners.
Since the lower edge portion of the sealing body 4A faces the annular groove 16 while being loosely fitted in, the edge portions are not interfered with by the inner peripheral surface of the accommodating concave portion 12, Will be stored in. Therefore, according to the third embodiment, the same operational effect as that of the first embodiment can be obtained.

Although the invention made by the present inventor has been specifically described based on the embodiments, the invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, the escape hole 14 and the through hole 14A as the escape portion are not limited to be formed in a circular shape, but may be formed in a rectangular shape or the like. In short, the corner portion of the storage recess 12 has a corner portion of the sealing body. It suffices if the escape space 15 for escaping can be formed.

Further, the shape of the storage concave portion and the support portion is not limited to a square shape, but may be a rectangular shape or the like corresponding to the package of the semiconductor device which is the storage target article.

Further, in the BGA / IC, etc., the supporting portion 13 can be omitted.

In the above description, the PGA, which is the field of application of the invention mainly made by the present inventor, was the background.
-The explanation has been given of the case of applying to the storage container of IC and BGA / IC, but the present invention is not limited to this.
FN IC (Quad Flat Non-Leaded
Package IC), QFJ IC (Quad Flat J-Leaded Package IC), SOJ IC
It can be applied to general storage containers for storing semiconductor devices such as (small outline J-leaded package IC).

[0039]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

Relief portions are formed in the respective corners of the accommodating recess formed in the shape of a square hole so as to accommodate a semiconductor device having a square package, and the semiconductor device accommodated by each escape portion is formed. By forming the escape spaces for escaping the corners of the sealing body in the package, the corners of the semiconductor device sealing body are located in the escape spaces of the storage recess in the state of being stored in the storage recess. Therefore, it is possible to prevent the respective corner portions of the sealing body from being fitted into the respective corner portions of the accommodation recess, and as a result, the semiconductor device accommodated in the accommodation recess can be accommodated in the respective corner portions of the accommodation recess. It is possible to avoid a situation in which the removal is hindered by interfering with, and when the semiconductor device is stored in the storage recess,
It is possible to prevent a situation in which each corner portion of the sealing body interferes with each corner portion of the storage recess to hinder the storage from occurring.

[Brief description of drawings]

FIG. 1 shows a PGA / IC storage container according to an embodiment of the present invention, in which (a) is a partially cutaway perspective view,
(B) is an enlarged partial front sectional view of the stored state.

FIG. 2A is a plan view showing the entire storage container,
FIG. 3B is a partially omitted and partially cut perspective view showing a vacuum forming mold used in the method for forming the storage container.

FIG. 3 shows a storage container for PGA / IC that is Embodiment 2 of the present invention, in which (a) is a partially cutaway perspective view,
(B) is an enlarged partial front sectional view of the housed state taken along line bb of (a).

FIG. 4 shows a BGA / IC storage container according to a third embodiment of the present invention, in which (a) is a partially omitted perspective view.
(B) is an enlarged partial front sectional view of the stored state.

[Description of sign]

DESCRIPTION OF SYMBOLS 1 ... PGA / IC (article to be stored), 2 ... pin grid array package, 3 ... pin (external terminal), 4 ... sealing body, 5 ... corner part, 10 ... storage container for PGA / IC,
11 ... Main body, 12 ... Storage recess, 13 ... Supporting part, 14 ... Escape hole (escape part), 14A ... Through hole (escape part), 15 ... Escape space, 16 ... Annular groove, 20 ... Vacuum forming mold, 21 ... Molding die main body, 22 ... Storage recess molding part, 23 ... Support part molding part,
24 ... Escape hole forming part, 25 ... Vacuum suction port, 26 ... Resin sheet, 1A ... BGA / IC (stored article), 2A ... Ball grid array package, 3A ... Ball (external terminal), 4A ... Sealing Stop body.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kazuya Tsuboi 5-20-1, Kamimizumoto-cho, Kodaira-shi, Tokyo Inside Hitate Cho-LS Engineering Co., Ltd. (72) Inventor, Yusuke Enomoto Tokyo 5-20-1 Kamimizuhonmachi, Kodaira-shi Incorporated company Hitachi Ltd. Semiconductor Division

Claims (4)

[Claims] 1. A storage container in which a storage recess for storing a semiconductor device having a rectangular package is formed in a rectangular hole shape in a main body, wherein each corner of the storage recess has a sealing body of the package. A storage container, wherein escape portions that open an escape space for escaping each corner portion are formed in a diagonally outward direction. 2. The storage container according to claim 1, wherein the escape portion is formed by an escape hole integrally formed in a side wall of a corner portion of the storage recess. 3. The storage container according to claim 1, wherein the escape portion is formed by a through hole integrally formed in a side wall of a corner portion of the storage recess. 4. The annular groove for escaping the outer peripheral portion of the sealing body is laid on the outer peripheral portion on the bottom surface of the storage recess, and the annular groove is provided. Storage container.