JPH08306229A - Thick-film paste - Google Patents
Thick-film pasteInfo
- Publication number
- JPH08306229A JPH08306229A JP7111736A JP11173695A JPH08306229A JP H08306229 A JPH08306229 A JP H08306229A JP 7111736 A JP7111736 A JP 7111736A JP 11173695 A JP11173695 A JP 11173695A JP H08306229 A JPH08306229 A JP H08306229A
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- paste
- glass
- thick
- film paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims abstract description 24
- 239000000843 powder Substances 0.000 claims abstract description 20
- 239000000203 mixture Substances 0.000 claims abstract description 12
- 239000011261 inert gas Substances 0.000 claims abstract description 7
- 239000000919 ceramic Substances 0.000 claims abstract description 4
- 239000006025 fining agent Substances 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 7
- 239000011148 porous material Substances 0.000 abstract description 7
- 229910052799 carbon Inorganic materials 0.000 abstract description 6
- 229910000410 antimony oxide Inorganic materials 0.000 abstract description 4
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 abstract description 4
- GOLCXWYRSKYTSP-UHFFFAOYSA-N Arsenious Acid Chemical compound O1[As]2O[As]1O2 GOLCXWYRSKYTSP-UHFFFAOYSA-N 0.000 abstract 1
- GCPXMJHSNVMWNM-UHFFFAOYSA-N arsenous acid Chemical compound O[As](O)O GCPXMJHSNVMWNM-UHFFFAOYSA-N 0.000 description 10
- 238000010304 firing Methods 0.000 description 10
- 239000003245 coal Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000007670 refining Methods 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 208000012868 Overgrowth Diseases 0.000 description 1
- GHPGOEFPKIHBNM-UHFFFAOYSA-N antimony(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Sb+3].[Sb+3] GHPGOEFPKIHBNM-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- WUOBERCRSABHOT-UHFFFAOYSA-N diantimony Chemical compound [Sb]#[Sb] WUOBERCRSABHOT-UHFFFAOYSA-N 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
Landscapes
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Glass Compositions (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Conductive Materials (AREA)
- Inorganic Insulating Materials (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は不活性ガス雰囲気中で焼
成される厚膜ペーストに関する。FIELD OF THE INVENTION This invention relates to thick film pastes which are fired in an inert gas atmosphere.
【０００２】[0002]
【従来の技術】従来から、厚膜回路の表面層や内部層を
構成する絶縁体、誘電体、抵抗体、および導体は、厚膜
ペーストの焼成体からなっており、さらには、これら厚
膜ペーストの焼成は不活性ガス雰囲気中において行われ
ていた。2. Description of the Related Art Conventionally, an insulator, a dielectric, a resistor, and a conductor which form a surface layer and an internal layer of a thick film circuit are made of a fired body of a thick film paste. Firing of the paste was performed in an inert gas atmosphere.
【０００３】[0003]
【発明が解決しようとする課題】ところで、これら厚膜
ペーストは含有するビヒクル等にガラス粉末、もしくは
セラミック粉末からなる粉末組成物を含んで構成されて
いる。このような粉末組成物を含んでいる厚膜ペースト
を焼成すると、粉末組成物等の中に含まれている炭素が
厚膜焼成体中に多量に残留したり、含有炭素が焼失する
ことにより焼成体中にポアが発生した。By the way, these thick film pastes are constituted by containing a powder composition composed of glass powder or ceramic powder in a vehicle or the like contained therein. When a thick film paste containing such a powder composition is fired, a large amount of carbon contained in the powder composition or the like remains in the thick film fired body, or the carbon contained therein is burned off to cause firing. Pore occurred all over the body.
【０００４】このような残炭量の増加やポアの発生は、
）電気的特性の劣化、）密着強度の劣化、）耐湿
特性、耐高温特性等の物理的や化学的信頼性の劣化、
）焼成外観不良といった種々の問題を引き起こすので
たいへん都合の悪いものであった。The increase in the amount of residual coal and the generation of pores are as follows.
) Deterioration of electrical characteristics,) Deterioration of adhesion strength,) Deterioration of physical and chemical reliability such as humidity resistance and high temperature resistance,
) It is very inconvenient because it causes various problems such as poor firing appearance.
【０００５】したがって、本発明においては、炭素の残
留やポアの発生を抑えて、各種厚膜特性や焼成外観を向
上させることを目的としている。Therefore, it is an object of the present invention to suppress carbon residue and generation of pores and improve various thick film characteristics and firing appearance.
【０００６】[0006]
【課題を解決するための手段】このような目的を達成す
るために、本発明においては、ガラス粉末、もしくはセ
ラミック粉末からなる粉末組成物を含み、かつ、不活性
ガス雰囲気中で焼成される厚膜ペーストにおいて、前記
粉末組成物に、この粉末組成物に対してガラス清澄剤を
０．０１重量％以上含有させたことに特徴を有してい
る。In order to achieve such an object, the present invention includes a powder composition comprising a glass powder or a ceramic powder, and a thickness to be baked in an inert gas atmosphere. The film paste is characterized in that the powder composition contains a glass fining agent in an amount of 0.01% by weight or more based on the powder composition.
【０００７】[0007]
【実施例】以下、本発明の実施例を詳細に説明する。各
実施例では厚膜ペーストの一つであるオーバーグレーズ
ペーストにおいて本発明を実施している。EXAMPLES Examples of the present invention will be described in detail below. In each example, the present invention is carried out in an overglaze paste which is one of thick film pastes.
【０００８】オーバーグレースペーストを構成している
粉末組成物の一つであるガラス成分に、ガラス清澄剤の
一つである亜砒酸（Ａｓ2Ｏ3）を前記ガラス成分に対し
て０．０１重量％〜１０重量％の割合で含有させた実施
例品1-1〜1-4、亜砒酸をガラス成分に対して０．００１
重量％含有させた参考品1、および亜砒酸を全く含有し
ない参考品2をそれぞれ作成し、これらオーバーグレー
スペーストを絶縁基板上に塗布したのち、不活性ガス
（Ｎ2，Ａｒガス等）雰囲気において温度４８０℃，焼
き付け時間４５分の条件で焼き付けた。0.01% by weight of arsenous acid (As 2 O 3 ), which is one of the glass refining agents, is added to the glass component which is one of the powder compositions constituting the overgray paste. Example products 1-1 to 1-4 contained at a ratio of 10 to 10% by weight, and arsenous acid was added to 0.001 with respect to the glass component.
A reference product 1 containing 1% by weight and a reference product 2 containing no arsenous acid were prepared, and these overgray pastes were coated on an insulating substrate, and then the temperature was changed in an inert gas (N 2 , Ar gas, etc.) atmosphere. Baking was performed under conditions of 480 ° C. and a baking time of 45 minutes.
【０００９】そして、このようにして形成したペースト
焼結体に、残炭量（重量％）、焼成外観、logＩＲ、密
着強度（密着強度はテープ剥離試験で測定する）、ΔＲ
％（オーバーグレース形成した１ＭΩ／□抵抗の耐湿負
荷試験抵抗変化率）の各種測定を行った。その結果を表
１に示す。Then, in the paste sintered body thus formed, the amount of residual carbon (% by weight), appearance of firing, logIR, adhesion strength (adhesion strength is measured by a tape peel test), ΔR
% (Variation of resistance change in humidity resistance load test of 1 MΩ / □ resistance formed by overglazing) was measured. Table 1 shows the results.
【００１０】[0010]
【表１】 [Table 1]
【００１１】この測定結果から明らかなように、亜砒酸
をガラス成分に対して０．０１重量％以上含有している
実施例品1-1〜1-4は、残炭量が参考品1,2に比べて減少
している。また、残炭量の減少やそれに伴うポア発生の
減少により、logＩＲ、密着強度、ΔＲ％といった各種
厚膜特性が参考品1,2に比べて向上しているうえ、焼成
外観もよくなっている。なお、亜砒酸の含有量は、好ま
しくは、実施例1〜3のごとくガラス成分に対して０．１
重量％以上であればよく、そうすれば、各種厚膜特性や
焼成外観がさらに向上することになる。As is clear from the measurement results, the products 1-1 to 1-4 of the examples containing arsenous acid in an amount of 0.01% by weight or more with respect to the glass component have residual carbon content of the reference products It has decreased compared to. In addition, due to the decrease in the amount of residual coal and the accompanying decrease in pores, various thick film characteristics such as logIR, adhesion strength, and ΔR% are improved compared to Reference Products 1 and 2, and the appearance of firing is also improved. . The content of arsenous acid is preferably 0.1 with respect to the glass component as in Examples 1 to 3.
It is sufficient if the content is at least wt%, which will further improve various thick film characteristics and firing appearance.
【００１２】また、亜砒酸を含有しているガラス成分
は、絶縁基板や厚膜ペースト自身の還元を抑制する働き
を有しており、このようなガラス成分を含有する厚膜ペ
ーストは還元抑制材料としても効果を発揮する。Further, the glass component containing arsenous acid has a function of suppressing the reduction of the insulating substrate and the thick film paste itself, and the thick film paste containing such a glass component is used as a reduction suppressing material. Is also effective.
【００１３】次に、オーバーグレースペーストを構成し
ている粉末組成物の一つであるガラス成分に、ガラス清
澄剤の一つである酸化アンチモン（Ｓｂ2Ｏ3）を前記ガ
ラス成分に対して０．０１重量％〜１０重量％の割合で
含有させた実施例品2-1〜2-4、酸化二アンチモンをガラ
ス成分に対して０．００１重量％含有させた参考品3、
および酸化アンチモンを全く含有しない参考品４をそれ
ぞれ作成し、これらオーバーグレースペーストを絶縁基
板上に塗布したのち、不活性ガス（Ｎ2，Ａｒガス等）
雰囲気において温度４８０℃，焼き付け時間４５分の条
件で焼き付けた。Next, the glass component, which is one of the powder compositions constituting the overgray paste, and the antimony oxide (Sb 2 O 3 ) which is one of the glass refining agents, are added to the glass component in an amount of 0. Example products 2-1 to 2-4 containing 0.01% by weight to 10% by weight, reference product 3 containing 0.001% by weight of diantimony oxide to the glass component,
And Reference Product 4 containing no antimony oxide at all, and after applying these overgray pastes on an insulating substrate, an inert gas (N 2 , Ar gas, etc.)
Baking was performed under the conditions of a temperature of 480 ° C. and a baking time of 45 minutes in the atmosphere.
【００１４】そして、このようにして形成したペースト
焼結体に、残炭量（重量％）、焼成外観、logＩＲ、密
着強度（亜砒酸添加の場合の同様の試験方法）、ΔＲ％
（亜砒酸添加の場合と同様の試験方法）の各種測定を行
った。その結果を表２に示す。Then, in the paste sintered body thus formed, the amount of residual carbon (% by weight), firing appearance, logIR, adhesion strength (similar test method in the case of adding arsenous acid), ΔR%
Various measurements were performed (the same test method as in the case of adding arsenous acid). The results are shown in Table 2.
【００１５】[0015]
【表２】 [Table 2]
【００１６】この測定結果から明らかなように、酸化ア
ンチモンをガラス成分に対して０．０１重量％以上含有
している実施例品2-1〜2-4は、亜砒酸を含有している前
述の実施例と同様、残炭量が減少しており、さらには、
残炭量の減少やそれに伴うポア減少により、logＩＲ、
密着強度、ΔＲ％といった各種厚膜特性が参考品に比べ
て向上しており、さらには焼成外観もよくなっている。As is apparent from the measurement results, the products 2-1 to 2-4 of Examples containing 0.01% by weight or more of antimony oxide with respect to the glass component contained arsenous acid as described above. Similar to the example, the amount of residual coal is decreasing, and further,
LogIR, due to the decrease in the amount of residual coal and the accompanying decrease in pores
Various thick film characteristics such as adhesion strength and ΔR% are improved compared to the reference product, and the firing appearance is also improved.
【００１７】また、前述の実施例の亜砒酸と同様に、酸
化アンチモンを含有しているガラス成分は、絶縁基板や
厚膜ペースト自身の還元を抑制する働きを有しており、
このようなガラス成分を含有する厚膜ペーストは還元抑
制材料としても効果を発揮する。Further, like the arsenous acid in the above-mentioned embodiment, the glass component containing antimony oxide has a function of suppressing the reduction of the insulating substrate and the thick film paste itself,
The thick film paste containing such a glass component also exhibits an effect as a reduction suppressing material.
【００１８】なお、これらの実施例では、オーバーグレ
ースペーストにおいて本発明を実施していたが、本件出
願者は、このほか、導電ペースト、抵抗ペースト、誘電
体ペースト、絶縁体ペーストなどの各種厚膜ペーストに
おいて本発明を実施しても同様の効果が得られることを
確認している。In these examples, the present invention was carried out in the overgrowth space, but the applicant of the present invention also applied various thick films such as conductive paste, resistance paste, dielectric paste and insulator paste. It has been confirmed that the same effect can be obtained by implementing the present invention in a paste.
【００１９】[0019]
【発明の効果】以上のように本発明によれば、ガラス成
分に所定量のガラス清澄剤を含有させることによる残炭
量の減少と、さらには残素量の減少に伴うポアの減少に
より、各種厚膜特性の向上と焼成外観の向上とを達成で
きた。As described above, according to the present invention, by reducing the amount of residual coal by containing a predetermined amount of glass refining agent in the glass component, and further by reducing the pores due to the reduction of residual amount, It was possible to achieve improvement of various thick film characteristics and improvement of the firing appearance.
【００２０】また、ガス清澄剤を含有しているガラス成
分は、絶縁基板や厚膜ペースト自身の還元を抑制する働
きを有しており、このようなガラス成分を備えたため
に、厚膜ペーストは還元抑制材料としての効果を発揮す
ることができるようになった。Further, the glass component containing the gas refining agent has a function of suppressing reduction of the insulating substrate and the thick film paste itself. It has become possible to exert the effect as a reduction suppressing material.
Claims (1)
らなる粉末組成物を含み、かつ、不活性ガス雰囲気中で
焼成される厚膜ペーストであって、 前記粉末組成物に、この粉末組成物に対してガラス清澄
剤を０．０１重量％以上含有させたことを特徴とする厚
膜ペースト。1. A thick film paste comprising a powder composition comprising glass powder or ceramic powder, which is fired in an inert gas atmosphere, wherein the powder composition comprises: A thick film paste containing 0.01% by weight or more of a glass fining agent.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7111736A JPH08306229A (en) | 1995-05-10 | 1995-05-10 | Thick-film paste |
| KR1019960015120A KR960043038A (en) | 1995-05-10 | 1996-05-08 | Thick film paste |
| CN96108945A CN1143254A (en) | 1995-05-10 | 1996-05-10 | Thick film pulp |
| DE19618992A DE19618992A1 (en) | 1995-05-10 | 1996-05-10 | Thick film paste with low residual carbon content, giving good appearance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7111736A JPH08306229A (en) | 1995-05-10 | 1995-05-10 | Thick-film paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08306229A true JPH08306229A (en) | 1996-11-22 |
Family
ID=14568887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7111736A Pending JPH08306229A (en) | 1995-05-10 | 1995-05-10 | Thick-film paste |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPH08306229A (en) |
| KR (1) | KR960043038A (en) |
| CN (1) | CN1143254A (en) |
| DE (1) | DE19618992A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009231543A (en) * | 2008-03-24 | 2009-10-08 | Kyocera Corp | Multilayer wiring board and method for manufacturing the same |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51121798A (en) * | 1975-04-18 | 1976-10-25 | Hitachi Ltd | Thick film resistor |
| IE42714B1 (en) * | 1975-06-23 | 1980-10-08 | Gen Electric | Improvements in varistors |
| JPS5479494A (en) * | 1977-12-07 | 1979-06-25 | Matsushita Electric Ind Co Ltd | Thick film varister |
| JPS5479496A (en) * | 1977-12-07 | 1979-06-25 | Matsushita Electric Ind Co Ltd | Thick film varister |
| SU945907A1 (en) * | 1980-11-14 | 1982-07-23 | Предприятие П/Я А-3219 | Resistive material |
| JPS6033228A (en) * | 1983-07-27 | 1985-02-20 | Hitachi Ltd | Glass composition for silicon carbide ceramics |
-
1995
- 1995-05-10 JP JP7111736A patent/JPH08306229A/en active Pending
-
1996
- 1996-05-08 KR KR1019960015120A patent/KR960043038A/en not_active Ceased
- 1996-05-10 DE DE19618992A patent/DE19618992A1/en not_active Ceased
- 1996-05-10 CN CN96108945A patent/CN1143254A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009231543A (en) * | 2008-03-24 | 2009-10-08 | Kyocera Corp | Multilayer wiring board and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1143254A (en) | 1997-02-19 |
| KR960043038A (en) | 1996-12-21 |
| DE19618992A1 (en) | 1996-11-14 |
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