JPH08167796A - Electronic component mounting method - Google Patents
Electronic component mounting methodInfo
- Publication number
- JPH08167796A JPH08167796A JP6311052A JP31105294A JPH08167796A JP H08167796 A JPH08167796 A JP H08167796A JP 6311052 A JP6311052 A JP 6311052A JP 31105294 A JP31105294 A JP 31105294A JP H08167796 A JPH08167796 A JP H08167796A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- mounting
- electronic components
- electronic
- supply unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
(57)【要約】
【目的】 装着ヘッドの移動量を小さくし、電子部品実
装時間を短縮する電子部品実装方法を提供することを目
的とする。
【構成】 プリント基板３上に実装される電子部品の座
標データから、同一の電子部品ごとにグループ分けを行
う。次に電子部品の数量が多い順に各グループの並び替
え、順位をつける。順位の一番高いグループの全電子部
品のプリント基板上でのＸ軸方向、Ｙ軸方向の分布を集
計し、それぞれＸ軸上、Ｙ軸上の平均値を中心座標とし
て求め、中心Ｙ座標から電子部品供給部１，２のうちの
距離の短い方を決定し、電子部品供給部１，２における
中心Ｘ座標から一番近い配列区画を配列位置として決定
する。これにより、装着ヘッドの移動距離を小さくする
ことができる。
(57) [Abstract] [Purpose] An object of the present invention is to provide an electronic component mounting method that reduces the amount of movement of the mounting head and shortens the electronic component mounting time. [Structure] Based on coordinate data of electronic components mounted on the printed circuit board 3, the same electronic components are grouped. Next, the groups are rearranged and ranked in descending order of the number of electronic components. The distribution of all electronic components in the highest ranking group in the X-axis direction and the Y-axis direction on the printed circuit board is totaled, and the average values on the X-axis and the Y-axis are calculated as the central coordinates, and the central Y-coordinate is calculated. The shorter one of the electronic component supply units 1 and 2 is determined, and the array section closest to the central X coordinate in the electronic component supply units 1 and 2 is determined as the array position. Thereby, the moving distance of the mounting head can be reduced.
Description
【０００１】[0001]
【産業上の利用分野】本発明はプリント基板などの基板
に対して電子部品を実装する電子部品実装機による電子
部品実装方法に関し、とくに、電子部品供給部および基
板が実装時に所定の設定位置に固定されており、電子部
品供給部の電子部品を装着ヘッドにより基板の実装位置
に移動して実装する電子部品実装機における、電子部品
供給部内の電子部品の配列順序または、電子部品実装順
序を設定する方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting method using an electronic component mounter for mounting electronic components on a substrate such as a printed circuit board. Set the arrangement order of the electronic components in the electronic component supply unit or the electronic component mounting order in the electronic component mounter that is fixed and moves the electronic components of the electronic component supply unit to the mounting position of the board by the mounting head It is about how to do it.
【０００２】[0002]
【従来の技術】基板に対して電子部品を実装する電子部
品実装機においては、図３に示すように、電子部品を供
給する電子部品供給部の位置が所定箇所に固定されてお
り、装着ヘッド４が電子部品供給部と基板との間で移動
して電子部品を実装するものがある。この種の電子部品
実装機における従来の電子部品実装方法について説明す
る。なお、図４は装着ヘッド４の移動状態を示す概略的
な平面図である。2. Description of the Related Art In an electronic component mounting machine for mounting electronic components on a substrate, as shown in FIG. 3, the position of an electronic component supply section for supplying electronic components is fixed at a predetermined position, and a mounting head is mounted. There is one in which the electronic component 4 moves between the electronic component supply unit and the substrate to mount the electronic component. A conventional electronic component mounting method in this type of electronic component mounting machine will be described. Note that FIG. 4 is a schematic plan view showing a moving state of the mounting head 4.
【０００３】電子部品供給用の複数の配列区画を有する
電子部品供給部１，２は所定箇所に固定されており、装
着ヘッド４を移動させて電子部品供給部１，２における
電子部品をプリント基板３に実装する。従来は、電子部
品の実装順序を決定する場合、プリント基板３上でもっ
とも近い各電子部品の実装位置同士を結んだ軌跡５を想
定し、その距離の総和が最短距離になるように電子部品
の実装順序を決定していた。Electronic component supply units 1 and 2 having a plurality of arrangement sections for supplying electronic components are fixed at predetermined positions, and the mounting head 4 is moved to move the electronic components in the electronic component supply units 1 and 2 to a printed circuit board. Implement in 3. Conventionally, when deciding the mounting order of electronic components, a trajectory 5 connecting the mounting positions of the closest electronic components on the printed circuit board 3 is assumed, and the electronic components are arranged so that the total distance becomes the shortest distance. The mounting order was decided.
【０００４】なお、各電子部品供給部１，２は複数の配
列区画を有し、電子部品供給部１，２において電子部品
が実装されて空となった区画には同種類の電子部品が順
次補給される。また、電子部品供給部１，２の各区画に
は、例えば実装順序に合わせて電子部品が配列されてい
る。It should be noted that each of the electronic component supply units 1 and 2 has a plurality of array sections, and the same type of electronic components are sequentially placed in the sections in which the electronic components have been mounted and emptied. Will be replenished. In addition, electronic components are arranged in each section of the electronic component supply units 1 and 2, for example, according to the mounting order.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、実際に
は電子部品は装着ヘッド４により電子部品供給部１，２
で吸着されてプリント基板３上に実装されており、図３
に示すように、装着ヘッド４は電子部品供給部１，２と
プリント基板３上の電子部品実装位置との間を交互に結
ぶ線分上を移動するにもかかわらず、上記従来の電子部
品実装方法では、実装順序はプリント基板３上の各電子
部品実装位置を結ぶ距離が最短となるようにしか考慮さ
れていないため、装着ヘッド４の移動量の総和は必ずし
も最小とはならず、その結果、電子部品の実装時間が長
くなることがあった。However, in practice, the electronic component is supplied by the mounting head 4 to the electronic component supply units 1 and 2.
3 and is mounted on the printed circuit board 3 as shown in FIG.
As shown in FIG. 4, the mounting head 4 moves on a line segment that alternately connects the electronic component supply units 1 and 2 and the electronic component mounting position on the printed circuit board 3, but the conventional electronic component mounting In the method, the mounting order is considered only so that the distance connecting the electronic component mounting positions on the printed circuit board 3 is the shortest, so the total amount of movement of the mounting head 4 is not necessarily the minimum, and as a result However, the mounting time of electronic parts may be long.
【０００６】本発明は上記従来の問題を解決するもの
で、電子部品の実装時間を短縮することができる電子部
品実装方法を提供することを目的とする。The present invention solves the above conventional problems, and an object of the present invention is to provide an electronic component mounting method capable of shortening the mounting time of electronic components.
【０００７】[0007]
【課題を解決するための手段】上記問題を解決するため
に本発明の第１の電子部品実装方法は、基板に実装され
る電子部品の実装位置の座標分布をデータとして取り込
み、各電子部品の種類ごとに基板上での座標データの平
均値を中心座標として算出し、電子部品供給部における
電子部品を供給する配列区画位置を、前記中心座標に接
近する位置に設定するものである。In order to solve the above problems, the first electronic component mounting method of the present invention takes in the coordinate distribution of the mounting positions of the electronic components mounted on the board as data, and acquires the electronic component of each electronic component. The average value of the coordinate data on the substrate for each type is calculated as the central coordinate, and the array partition position for supplying the electronic component in the electronic component supply unit is set to a position approaching the central coordinate.
【０００８】また、本発明の第２の電子部品実装方法
は、上記第１の電子部品実装方法において、基板におけ
る同一種類の電子部品の数量をデータとして取り込み、
電子部品供給部における電子部品の配列区画位置を、数
量の多い電子部品から優先して中心座標に接近する位置
に設定するものである。A second electronic component mounting method of the present invention is the same as the first electronic component mounting method, in which the number of electronic components of the same type on the board is fetched as data,
The arrangement partition position of the electronic components in the electronic component supply unit is set to a position closer to the central coordinates, with priority given to the electronic components having the larger number.
【０００９】また、本発明の第３の電子部品実装方法
は、基板における電子部品の実装位置から電子部品供給
部に配列された電子部品までの装着ヘッドの各移動距離
の総和が最小となるように、基板における電子部品の実
装順序を設定するものである。Further, according to the third electronic component mounting method of the present invention, the total sum of the respective moving distances of the mounting heads from the mounting position of the electronic components on the substrate to the electronic components arranged in the electronic component supply section is minimized. In addition, the mounting order of the electronic components on the board is set.
【００１０】また、本発明の第４の電子部品実装方法
は、電子部品をその電子部品に対応する装着ヘッドの種
類別にグループ分けを行い、同一グループの電子部品を
連続して装着して装着ヘッドの交換回数を最小にするも
のである。Further, according to the fourth electronic component mounting method of the present invention, the electronic components are divided into groups according to the types of mounting heads corresponding to the electronic components, and the mounting heads are mounted by successively mounting the electronic components of the same group. To minimize the number of replacements of.
【００１１】[0011]
【作用】上記第１の電子部品実装方法によれば、電子部
品供給部の電子部品の配列が基板上の各電子部品の分布
の中心に近くなって、各電子部品の実装点から電子部品
供給部に配列された各電子部品までの装着ヘッドの移動
距離の総和を小さくすることができるため、基板への電
子部品実装時間を短縮することができる。According to the first electronic component mounting method described above, the arrangement of the electronic components in the electronic component supply unit is close to the center of the distribution of the electronic components on the board, and the electronic components are supplied from the mounting point of each electronic component. Since it is possible to reduce the total movement distance of the mounting head to each electronic component arranged in the unit, it is possible to shorten the mounting time of the electronic component on the substrate.
【００１２】また、上記第２の電子部品実装方法によれ
ば、電子部品供給部における電子部品の配列区画位置
を、数量の多い電子部品から優先して中心座標に接近す
るように設定するため、各電子部品の実装点から電子部
品供給部に配列された各電子部品までの装着ヘッドの移
動距離の総和をより一層小さくすることができる。Further, according to the second electronic component mounting method, since the arrangement partition position of the electronic components in the electronic component supply unit is set so that the electronic components having the large quantity are preferentially approached to the central coordinates, It is possible to further reduce the total movement distance of the mounting head from the mounting point of each electronic component to each electronic component arranged in the electronic component supply unit.
【００１３】また、上記第３の電子部品実装方法によれ
ば、基板における電子部品の実装位置から電子部品供給
部に配列された電子部品までの装着ヘッドの各移動距離
の総和が最小となるように、基板における電子部品の実
装順序を設定することにより、基板への電子部品実装時
間を短縮することができる。Further, according to the third electronic component mounting method, the total sum of the movement distances of the mounting heads from the mounting position of the electronic component on the board to the electronic components arranged in the electronic component supply section is minimized. Further, by setting the mounting order of the electronic components on the board, it is possible to shorten the electronic component mounting time on the board.
【００１４】また、上記第４の電子部品実装方法によれ
ば、同一グループの電子部品を連続して装着して装着ヘ
ッドの交換回数を最小にすることにより、装着ヘッドの
交換時間を短縮できて、ひいては基板への電子部品実装
時間を短縮することができる。Further, according to the fourth electronic component mounting method, the mounting time of the mounting head can be shortened by successively mounting the electronic components of the same group and minimizing the number of times of mounting head replacement. As a result, it is possible to shorten the mounting time of electronic components on the board.
【００１５】[0015]
【実施例】以下、本発明の第一の実施例について図１を
参照しながら説明する。図１において、１，２は電子部
品供給部、３はプリント基板、４は装着ヘッドで、これ
らは従来と同じものであるため、詳細な説明は省略す
る。また、６は装着ヘッド４の電子部品を実装する際の
軌跡、ａ〜ｅは電子部品の実装位置を示す。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to FIG. In FIG. 1, reference numerals 1 and 2 denote an electronic component supply unit, 3 a printed circuit board, and 4 a mounting head, which are the same as conventional ones, and therefore detailed description thereof will be omitted. Further, 6 indicates a locus when mounting the electronic component of the mounting head 4, and a to e indicate mounting positions of the electronic component.
【００１６】上記構成要素からなる電子部品実装機の電
子部品実装方法について説明する。はじめに、プリント
基板３上に実装される各電子部品の座標データが取り込
まれる。取り込まれた座標データから、各電子部品を同
一の名称、形状コード毎にグループ分けする。次に、プ
リント基板３における電子部品の実装数量が多い順に各
グループの並び替えを行い、順位をつける。まず、順位
の一番高いグループにこのグループの全電子部品のプリ
ント基板３上でのＸ軸方向、Ｙ軸方向の座標分布を集計
し、それぞれＸ軸上、Ｙ軸上の平均値を中心座標として
算出する。An electronic component mounting method of the electronic component mounting machine having the above components will be described. First, the coordinate data of each electronic component mounted on the printed circuit board 3 is captured. Each electronic component is grouped by the same name and shape code from the captured coordinate data. Next, the groups are rearranged in order of increasing number of electronic components mounted on the printed circuit board 3 to give a rank. First, in the group having the highest rank, the coordinate distributions in the X-axis direction and the Y-axis direction on the printed circuit board 3 of all electronic components of this group are aggregated, and the average values on the X-axis and the Y-axis are the central coordinates. Calculate as
【００１７】この後、算出した中心座標のＹ座標から電
子部品供給部１，２までの距離を求め、距離の短い方を
そのグループの電子部品供給部１または電子部品供給部
２として決定する。次に、決定した電子部品供給部１，
２における前記中心座標のＸ座標から一番近い配列区画
をその電子部品の配置区画として決定する。After that, the distance from the calculated Y coordinate of the central coordinates to the electronic component supply units 1 and 2 is obtained, and the shorter one is determined as the electronic component supply unit 1 or the electronic component supply unit 2 of the group. Next, the determined electronic component supply unit 1,
The array section closest to the X coordinate of the center coordinate in 2 is determined as the arrangement section of the electronic component.
【００１８】以上の手順を全てのグループに対して順位
の高いものから行い、電子部品供給部１，２における全
ての電子部品の配列を決定する。次に、全ての電子部品
のうち、装着速度の一番速い実装位置ａの電子部品を選
択する。そして、現在の装着ヘッド４の位置から、電子
部品供給部１，２における電子部品の配列区画から電子
部品の各実装位置までの移動距離を求めた後、その実装
直後の装着ヘッド４の位置から、残りの各電子部品の電
子部品供給部１，２における配列区画までの距離と、こ
の配列区画から各電子部品の実装点までの距離の和をそ
れぞれ求め、これらの求められた総和距離のうち、一番
短い距離となった実装位置ｂの電子部品を次に実装する
電子部品と決定して、プリント基板３へ実装する。以上
の動作を繰り返し、装着ヘッド４の移動距離が最小にな
るように電子部品実装順序を決定する。これにより、プ
リント基板３への電子部品実装時間を最小限まで短縮す
ることができ、作業能率が向上する。The above procedure is performed for all groups in descending order of rank to determine the arrangement of all electronic components in the electronic component supply units 1 and 2. Next, of all the electronic components, the electronic component at the mounting position a having the highest mounting speed is selected. Then, after obtaining the moving distance from the current position of the mounting head 4 to each mounting position of the electronic components from the arrangement section of the electronic components in the electronic component supplying units 1 and 2, from the position of the mounting head 4 immediately after the mounting. , Of the remaining electronic components to the array section in the electronic component supply units 1 and 2 and the sum of the distances from this array section to the mounting points of the electronic components, respectively, and out of the calculated total distances. The electronic component at the mounting position b that has the shortest distance is determined as the electronic component to be mounted next, and is mounted on the printed circuit board 3. By repeating the above operation, the electronic component mounting order is determined so that the movement distance of the mounting head 4 is minimized. As a result, the time required to mount the electronic component on the printed circuit board 3 can be shortened to the minimum and the work efficiency is improved.
【００１９】なお、図１においては、実装位置ａと実装
位置ｂとが同一種類の電子部品である場合を示し、電子
部品供給部１における中心座標のＸ座標から一番近い配
列区画１ａをその電子部品の配列区画１ａとして決定し
ている場合を示す。FIG. 1 shows the case where the mounting position a and the mounting position b are the same type of electronic component, and the array section 1a closest to the X coordinate of the central coordinate in the electronic component supply unit 1 is shown. The case where it is determined as the arrangement section 1a of the electronic component is shown.
【００２０】次に、本発明の第二の実施例について図２
を参照しながら説明する。図２において、７は装着ヘッ
ド格納部、８，９，１０は装着ヘッドである。プリント
基板３には装着ヘッド８で実装する２種類の電子部品
ｆ，ｇ、装着ヘッド９で実装する１種類の電子部品ｈ、
装着ヘッド１０で実装する１種類の電子部品ｉがそれぞ
れ実装される。また、実装スピードは、大きいものから
装着ヘッド８、装着ヘッド９、装着ヘッド１０の順であ
り、装着ヘッド８が最も速い。Next, a second embodiment of the present invention will be described with reference to FIG.
Will be described with reference to. In FIG. 2, reference numeral 7 is a mounting head storage portion, and 8, 9, 10 are mounting heads. On the printed circuit board 3, two types of electronic components f and g to be mounted by the mounting head 8, one type of electronic component h to be mounted by the mounting head 9,
One type of electronic component i to be mounted by the mounting head 10 is mounted respectively. Further, the mounting speed is in the order of the mounting head 8, the mounting head 9, and the mounting head 10 from the largest, and the mounting head 8 is the fastest.
【００２１】はじめに、プリント基板３上に実装される
各電子部品ｆ〜ｉを各装着ヘッド８〜１０ごとにグルー
プ分けを行う。これによって、電子部品ｆ，ｇは装着ヘ
ッド８のグループ、電子部品ｈは装着ヘッド９のグルー
プ、電子部品ｉは装着ヘッド１０のグループにグループ
分けされる。First, the electronic components f to i mounted on the printed circuit board 3 are divided into groups for each mounting head 8 to 10. As a result, the electronic components f and g are grouped into the mounting head 8 group, the electronic component h into the mounting head 9 group, and the electronic component i into the mounting head 10 group.
【００２２】次に、グループ毎の順位を装着ヘッド８〜
１０の実装スピードの速い順に決定する。したがって、
装着ヘッド８のグループの電子部品ｆ，ｇ、装着ヘッド
９のグループの電子部品ｈ、装着ヘッド１０のグループ
の電子部品ｉの順に電子部品ｆ〜ｉのグループ別の実装
順序が決定される。Next, the order of the mounting heads 8 to
It is determined in the order of 10 mounting speeds. Therefore,
The electronic components f and g of the group of the mounting head 8, the electronic component h of the group of the mounting head 9, and the electronic component i of the group of the mounting head 10 are determined in the order of mounting the electronic components f to i for each group.
【００２３】グループ毎の実装順序を決定した後、各グ
ループ内での電子部品ｆ〜ｉの実装順序を上記第一の実
施例の実装順序決定方法にしたがって決定して、実装動
作を行わせる。After the mounting order of each group is determined, the mounting order of the electronic components f to i in each group is determined according to the mounting order determining method of the first embodiment, and the mounting operation is performed.
【００２４】これにより、同一グループの電子部品ｆ〜
ｉを連続して装着して装着ヘッド８〜１０の交換回数を
最小にすることができるため、装着ヘッド８〜１０の交
換時間を短縮できて、ひいてはプリント基板３への電子
部品実装時間を短縮することができる。As a result, the electronic components f ...
Since the number of times of replacement of the mounting heads 8 to 10 can be minimized by continuously mounting i, the replacement time of the mounting heads 8 to 10 can be shortened, which in turn shortens the electronic component mounting time on the printed circuit board 3. can do.
【００２５】[0025]
【発明の効果】以上のように、本発明によれば、基板に
実装される電子部品の実装位置の座標分布をデータとし
て取り込み、各電子部品の種類ごとに基板上での座標デ
ータの平均値を中心座標として算出し、電子部品供給部
における電子部品を供給する配列区画位置を、前記中心
座標に接近する位置に設定することにより、各電子部品
の実装点から電子部品供給部に配列された各電子部品ま
での装着ヘッドの移動距離の総和を小さくすることがで
きて、基板への電子部品実装時間を短縮することができ
る。As described above, according to the present invention, the coordinate distribution of the mounting position of the electronic component mounted on the board is fetched as data, and the average value of the coordinate data on the board for each type of electronic component is acquired. Is calculated as the central coordinate, and the arrangement section position for supplying the electronic component in the electronic component supply unit is set to a position approaching the central coordinate, so that the electronic component is arranged in the electronic component supply unit from the mounting point. The total moving distance of the mounting head to each electronic component can be reduced, and the electronic component mounting time on the board can be shortened.
【００２６】また、さらに、基板における同一種類の電
子部品の数量をデータとして取り込み、電子部品供給部
における電子部品の配列区画位置を、数量の多い電子部
品から優先して中心座標に接近する位置に設定すること
により、基板への電子部品実装時間をより一層短縮する
ことができる。Further, the quantity of electronic components of the same type on the board is taken in as data, and the array partition position of the electronic components in the electronic component supply unit is set to a position closer to the central coordinates in preference to the electronic components having the larger quantity. By setting, it is possible to further reduce the mounting time of electronic components on the board.
【００２７】また、基板における電子部品の実装位置か
ら電子部品供給部に配列された電子部品までの装着ヘッ
ドの各移動距離の総和が最小となるように、基板におけ
る電子部品の実装順序を設定することにより、基板への
電子部品実装時間を短縮することができる。Further, the mounting order of the electronic components on the board is set so that the total sum of the movement distances of the mounting heads from the mounting position of the electronic components on the board to the electronic components arranged in the electronic component supply section is minimized. As a result, the time required to mount the electronic component on the board can be shortened.
【００２８】また、各電子部品を装着ヘッド毎にグルー
プ分けを行うことによって、装着ヘッドの交換回数が最
小になり、装着ヘッドの交換によって生じる時間が短縮
され、電子部品実装時間を短縮することができる。Further, by grouping each electronic component for each mounting head, the number of times the mounting head is replaced can be minimized, the time required for replacing the mounting head can be shortened, and the electronic component mounting time can be shortened. it can.
【図１】本発明の第一の実施例における電子部品実装方
法を概略的に示す平面図FIG. 1 is a plan view schematically showing an electronic component mounting method according to a first embodiment of the present invention.
【図２】本発明の第二の実施例における電子部品実装方
法FIG. 2 is an electronic component mounting method according to a second embodiment of the present invention.
【図３】電子部品実装機の全体斜視図FIG. 3 is an overall perspective view of an electronic component mounter
【図４】従来の電子部品実装方法を概略的に示す平面図FIG. 4 is a plan view schematically showing a conventional electronic component mounting method.
１，２ 電子部品供給部 １ａ 配列区画 ３ プリント基板 ４，８，９，１０ 装着ヘッド ６ 電子部品の実装順序の軌跡 1, electronic component supply unit 1a array section 3 printed circuit board 4, 8, 9, 10 mounting head 6 locus of mounting sequence of electronic components
Claims (4)
および電子部品が実装される基板が実装時に所定の設定
位置に固定されており、電子部品を装着する装着ヘッド
が電子部品供給部から基板の実装位置にわたって移動さ
れる電子部品実装機において電子部品を実装する方法で
あって、基板に実装される電子部品の実装位置の座標分
布をデータとして取り込み、各電子部品の種類ごとに基
板上での座標データの平均値を中心座標として算出し、
電子部品供給部における電子部品を供給する配列区画位
置を、前記中心座標に接近する位置に設定する電子部品
実装方法。1. An electronic component supply unit in which a plurality of compartments are arranged and a substrate on which electronic components are mounted are fixed at a predetermined set position during mounting, and a mounting head for mounting electronic components is provided from the electronic component supply unit. A method of mounting an electronic component on an electronic component mounter that moves across the mounting position of the board, in which the coordinate distribution of the mounting position of the electronic component mounted on the board is fetched as data, and the type of each electronic component is printed on the board. Calculate the average value of the coordinate data in
An electronic component mounting method for setting an array section position for supplying an electronic component in an electronic component supply unit to a position approaching the central coordinates.
をデータとして取り込み、電子部品供給部における電子
部品の配列区画位置を、数量の多い電子部品から優先し
て中心座標に接近する位置に設定する請求項１記載の電
子部品実装方法。2. The number of electronic components of the same type on a board is fetched as data, and the arrangement partition position of the electronic components in the electronic component supply unit is set to a position closer to the central coordinates, with priority given to the electronic components with the larger number. The electronic component mounting method according to claim 1.
および電子部品が実装される基板が実装時に所定の設定
位置に固定されており、電子部品を装着する装着ヘッド
が電子部品供給部から基板の実装位置にわたって移動さ
れる電子部品実装機において電子部品を実装する方法で
あって、基板における電子部品の実装位置から電子部品
供給部に配列された電子部品までの装着ヘッドの各移動
距離の総和が最小となるように、基板における電子部品
の実装順序を設定する電子部品実装方法。3. An electronic component supply unit in which a plurality of compartments are arranged and a board on which the electronic components are mounted are fixed at a predetermined set position during mounting, and a mounting head for mounting electronic components is provided from the electronic component supply unit. A method of mounting an electronic component in an electronic component mounter that is moved over a mounting position of a board, wherein each moving distance of a mounting head from the mounting position of the electronic component on the board to the electronic component arranged in the electronic component supply unit An electronic component mounting method for setting the mounting order of electronic components on a board so that the total sum is minimized.
よび電子部品供給部が実装時に所定の設定位置に固定さ
れており、電子部品を装着する複数種類の装着ヘッドが
電子部品供給部から基板の実装位置にわたって移動され
る電子部品実装機において電子部品を実装する方法であ
って、電子部品をその電子部品に対応する装着ヘッドの
種類別にグループ分けを行い、同一グループの電子部品
を連続して装着して装着ヘッドの交換回数を最小にする
電子部品実装方法。4. A substrate on which a plurality of types of electronic components are mounted and an electronic component supply unit are fixed at predetermined setting positions during mounting, and a plurality of types of mounting heads for mounting electronic components are mounted on the substrate from the electronic component supply unit. A method of mounting electronic components on an electronic component mounter that is moved over the mounting position of the electronic components, the electronic components are grouped according to the type of mounting head corresponding to the electronic components, and the electronic components of the same group are consecutively arranged. An electronic component mounting method that mounts and minimizes the number of times the mounting head needs to be replaced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6311052A JPH08167796A (en) | 1994-12-15 | 1994-12-15 | Electronic component mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6311052A JPH08167796A (en) | 1994-12-15 | 1994-12-15 | Electronic component mounting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08167796A true JPH08167796A (en) | 1996-06-25 |
Family
ID=18012534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6311052A Pending JPH08167796A (en) | 1994-12-15 | 1994-12-15 | Electronic component mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08167796A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010135463A (en) * | 2008-12-03 | 2010-06-17 | Yamaha Motor Co Ltd | Apparatus and method for mounting component |
| CN102495918A (en) * | 2011-11-15 | 2012-06-13 | 中兴通讯股份有限公司 | Coordinate distribution method for single boards before drawing of single-board optical fiber connection graph and system |
| US8612041B2 (en) | 2010-11-12 | 2013-12-17 | Samsung Techwin Co., Ltd. | Method for optimizing component mounting sequence with variable pitch heads and component mounting device using the same |
| WO2016020998A1 (en) * | 2014-08-06 | 2016-02-11 | 富士機械製造株式会社 | Substrate work device |
-
1994
- 1994-12-15 JP JP6311052A patent/JPH08167796A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010135463A (en) * | 2008-12-03 | 2010-06-17 | Yamaha Motor Co Ltd | Apparatus and method for mounting component |
| US8612041B2 (en) | 2010-11-12 | 2013-12-17 | Samsung Techwin Co., Ltd. | Method for optimizing component mounting sequence with variable pitch heads and component mounting device using the same |
| CN102495918A (en) * | 2011-11-15 | 2012-06-13 | 中兴通讯股份有限公司 | Coordinate distribution method for single boards before drawing of single-board optical fiber connection graph and system |
| WO2016020998A1 (en) * | 2014-08-06 | 2016-02-11 | 富士機械製造株式会社 | Substrate work device |
| JPWO2016020998A1 (en) * | 2014-08-06 | 2017-05-18 | 富士機械製造株式会社 | Board work equipment |
| US10091920B2 (en) | 2014-08-06 | 2018-10-02 | Fuji Corporation | Surface mount device for control of holding and moving printed circuit board in the priority order |
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