JPH09107197A - How to determine the parts arrangement - Google Patents
How to determine the parts arrangementInfo
- Publication number
- JPH09107197A JPH09107197A JP7262666A JP26266695A JPH09107197A JP H09107197 A JPH09107197 A JP H09107197A JP 7262666 A JP7262666 A JP 7262666A JP 26266695 A JP26266695 A JP 26266695A JP H09107197 A JPH09107197 A JP H09107197A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- component
- priority
- positions
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
(57)【要約】
【課題】 多品種少量生産の実装機の生産効率を向上さ
せることができる部品配列の決定方法を提供する。
【解決手段】 全品種の基板で使用される全ての部品を
リストアップし、これら部品について、各品種の基板間
で使用される部品の共通性を求めて、部品の共通度レベ
ルから共通部品と非共通部品とに分類し、上記共通部品
を部品供給部の優先配列位置に割当て、これら共通部品
に全品種の基板の装着作業を通じて同一位置となるよう
に配列位置を固定的に与え、他方、上記非共通部品を部
品供給部の非優先配列位置に割当て、これら非共通部品
に各品種の基板毎に対応する位置となるように配列位置
を個別的に与えて、部品配列位置を決定することを特徴
とする。
(57) [Abstract] [PROBLEMS] To provide a method for determining a component arrangement capable of improving the production efficiency of a mounting machine for high-mix low-volume production. SOLUTION: All parts used in boards of all product types are listed, and for these parts, commonality of parts used between boards of each product type is sought, and the commonality level of the parts is changed to a common part. The common parts are classified into non-common parts, and the common parts are assigned to the priority arrangement positions of the component supply unit, and the arrangement positions are fixedly given to these common parts so as to be the same positions through the mounting work of the boards of all kinds, on the other hand, Allocating the non-common parts to the non-priority array positions of the part supply unit, and individually giving the array positions to these non-common parts so as to be the positions corresponding to each board of each type, and determining the part array position. Is characterized by.
Description
【0001】[0001]
【発明の属する技術分野】本発明は、多品種少量生産の
実装機における供給部品の配列位置を決定する方法に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for determining the arrangement position of supply parts in a mounting machine for high-mix low-volume production.
【0002】[0002]
【従来の技術】近年、プリント基板へ部品を装着する生
産ラインでは、多品種少量のプリント基板の生産が増え
つつある。そこで生産ラインにおいては、部品の装着時
間の短縮と、プリント基板の品種切替時間の短縮との両
面からトータルで生産効率を向上させることが求めら
れ、各実装機ごとに種々の提案がなされている。2. Description of the Related Art In recent years, in a production line for mounting components on a printed circuit board, the production of a large number of various types of printed circuit boards is increasing. Therefore, in the production line, it is required to improve the total production efficiency in terms of both the mounting time of the parts and the switching time of the type of the printed circuit board, and various proposals have been made for each mounting machine. .
【0003】このような多品種少量のプリント基板へ部
品を装着する実装機として、図3に示す構成のものが知
られている。以下図3〜図7を参照しながら、その実装
機の動作を説明する。As a mounting machine for mounting parts on such a large number of various kinds of printed circuit boards, a mounting machine having a structure shown in FIG. 3 is known. The operation of the mounting machine will be described below with reference to FIGS.
【0004】図3に示す実装機1は、部品Zの配列位置
(Z1,Z2,Z3,・・・)をライン状に有する部品
供給部5と、部品を吸装着する固定動作をおこなう装着
ヘッド4と、プリント基板3をXY方向に移動自在に位
置決めするテーブル2とを備えている。A mounting machine 1 shown in FIG. 3 has a component supply section 5 having line-shaped arrangement positions (Z1, Z2, Z3, ...) Of components Z, and a mounting head for performing a fixing operation for sucking and mounting the components. 4 and a table 2 for positioning the printed circuit board 3 movably in the XY directions.
【0005】この部品供給部5の各部品Zは、図の矢印
で示す方向へのみ自由度を有している。この部品配列位
置は、Z1位置が優先順位が最も高い配列位置となって
いる。すなわち、部品の優先配列位置はZ1側からZ
2,Z3・・・へと順次決められている。そして、Z1
位置から順に各部品が割当てられて、必要な配列位置ま
でが使用されている。Each component Z of the component supply unit 5 has a degree of freedom only in the direction shown by the arrow in the figure. In this component arrangement position, the Z1 position is the arrangement position having the highest priority. That is, the priority arrangement position of the parts is from the Z1 side to Z
2, Z3 ... are decided in sequence. And Z1
Each part is assigned in order from the position, and up to the necessary arrangement position is used.
【0006】そこで、固定位置間でおこなわれる装着ヘ
ッド4の部品Zの吸装着動作は、まず部品供給部5が移
動して、装着ヘッド4位置上にある部品供給部5の部品
Zが装着ヘッド4で吸着される。次に装着ヘッド4は、
移動自在に構成されたテーブル2上にセットされたプリ
ント基板3の面上に吸着した部品Zを装着している。Therefore, in the sucking and mounting operation of the component Z of the mounting head 4 performed between the fixed positions, first, the component supply unit 5 moves and the component Z of the component supply unit 5 located on the position of the mounting head 4 moves the mounting head. Adsorbed at 4. Next, the mounting head 4
The component Z adsorbed on the surface of the printed circuit board 3 set on the movable table 2 is mounted.
【0007】なお、ここで各品種の生産順序は、生産さ
れる基板の枚数に応じて、生産量の多い順に品種1から
順次品種4へと割当られていて、品種1から順に品種
2、品種3、品種4へと生産がおこなわれている。Here, the production order of each product type is assigned from product type 1 to product type 4 in descending order of production amount according to the number of substrates to be produced. Production is being carried out for 3 and 4 types.
【0008】以上のように構成された実装機の供給部品
は、図4に示すフローに従って部品配列が決められる。
N種のプリント基板に対し、まずその内の1つが選ばれ
る(ステップ1)。この品種(N=1)のプリント基板
に使用される使用部品のリストが作成される(ステップ
2)。The component arrangement of the mounting components of the mounting machine configured as described above is determined according to the flow shown in FIG.
First, one of the N kinds of printed circuit boards is selected (step 1). A list of used parts used for this type (N = 1) of printed circuit boards is created (step 2).
【0009】リストの部品を実装ラインの各実装機へ振
分ける(ステップ3)。この振分け作業は、例えば部品
形状の小さいものから大きいもの順で分けられたり、装
着速度の速いものから遅いもの順で分けられたりしてい
る。ステップ4では、各実装機へ振分けられた部品の配
列を決定する。The parts in the list are distributed to the respective mounting machines on the mounting line (step 3). This sorting work is divided into, for example, a component having a small shape and a component having a large shape, and a component having a high mounting speed and a component having a slow mounting speed. In step 4, the arrangement of the components distributed to each mounting machine is determined.
【0010】この配列は、その実装機の実装時間が最小
となるように各部品が部品供給部に割当てられる。以後
次の品種(N=2)のプリント基板について同様のこと
が繰り返され、最終的には全ての品種のプリント基板に
ついて、部品の振分け及び配列が決定される(ステップ
5)。In this arrangement, each component is assigned to the component supply unit so that the mounting time of the mounting machine is minimized. After that, the same process is repeated for the next type (N = 2) of printed circuit boards, and finally, the allocation and arrangement of the components are determined for all types of printed circuit boards (step 5).
【0011】以上のようにプリント基板の品種ごとに個
別に部品配列が決められ、例えば図5に示す実装機名M
V−1とMV−2の各部品供給配列Z1,Z2,Z3・
・・には、4種のプリント基板(品種1〜4)に対する
部品(図のab,aa,・・・等で示す名称)が割付け
られる。As described above, the component arrangement is individually determined for each type of printed circuit board, and for example, the mounting machine name M shown in FIG.
V-1 and MV-2 parts supply arrays Z1, Z2, Z3.
.. are assigned parts (names indicated by ab, aa, ... In the figure) for four types of printed circuit boards (types 1 to 4).
【0012】以上が図4で示すフローで部品の配列を決
定する方法であるが、上記の他に配列を決定するものに
図6に示すフローのものも知られている。The above is the method of determining the arrangement of the parts by the flow shown in FIG. 4, but in addition to the above, the method shown in FIG. 6 is also known as a method of determining the arrangement.
【0013】図6に示すフローにおいて、まずステップ
1では全てのプリント基板(全品種)で使用する全ての
部品のリストが作成される。そしてリストの部品を実装
ラインの各実装機へ振分ける(ステップ2)。この振分
け作業は、例えば全ての部品が形状の小さなものから大
きいもの順で分けられたり、装着速度の速いものから遅
いもの順で分けられたりして、それら順位で各実装機に
実装時間のバランスがとれるように均等に振り分けられ
る。ステップ3では、この振分けられた部品の配列を各
実装機の部品供給部に割当てている。In the flow shown in FIG. 6, first, in step 1, a list of all parts used in all printed boards (all types) is created. Then, the parts on the list are distributed to the respective mounting machines on the mounting line (step 2). This sorting work is performed by, for example, sorting all parts in order from smallest to largest, or from those with the fastest mounting speed to those with the slowest mounting speed. Are evenly distributed so that In step 3, the array of distributed components is assigned to the component supply unit of each mounting machine.
【0014】なお、この配列は全ての品種のプリント基
板に共通となり、図7に示す実装機名MV−1とMV−
2の各部品供給配列Z1,Z2,・・・には、4品種分
のプリント基板(品種1〜4)の部品名の全てが割付け
られる。This arrangement is common to all types of printed circuit boards, and mounting machine names MV-1 and MV- shown in FIG.
All the component names of the four types of printed circuit boards (types 1 to 4) are assigned to each of the component supply arrays Z1, Z2 ,.
【0015】[0015]
【発明が解決しようとする課題】上記従来の部品配列の
決定方法において、図4の方法では、プリント基板の品
種を切替える際に部品供給部の配列を交換する必要があ
り、品種切替時間を要するため多品種少量生産では生産
効率がダウンするという問題がある。In the above-mentioned conventional method for determining a component arrangement, in the method shown in FIG. 4, it is necessary to exchange the arrangement of the component supply unit when changing the type of the printed circuit board, which requires a type change time. Therefore, there is a problem that production efficiency is reduced in high-mix low-volume production.
【0016】一方、図6の方法では、品種を切替えても
部品供給部の配列を換える必要はないが、特定の品種で
は使用しない部品もセットされており、必ずしも好適な
配列でなく部品実装の動作は、部品供給部の移動ロスが
生じて、プリント基板の実装部品が増す分だけ生産効率
がダウンするという問題がある。さらに、部品の種類が
全実装機の部品供給部の最大数を越える場合は、部品供
給部に載りきらないという問題があった。On the other hand, in the method of FIG. 6, it is not necessary to change the arrangement of the component supply unit even if the product type is switched, but the components not used in a specific product type are set, and the arrangement is not necessarily suitable and the mounting of the component is not always done. In the operation, there is a problem that the production efficiency is reduced by the increase in the number of mounted components on the printed circuit board due to the movement loss of the component supply unit. Furthermore, when the number of types of components exceeds the maximum number of component supply units of all mounting machines, there is a problem that the components cannot be fully loaded in the component supply units.
【0017】そこで、多品種少量生産の実装機において
は、上記従来例の問題点を解決し、生産効率を向上させ
る部品の配列位置を決定する方法が望まれていた。Therefore, in a mounting machine for high-mix low-volume production, there has been a demand for a method of solving the problems of the above-mentioned conventional example and determining the arrangement position of the components for improving the production efficiency.
【0018】本発明は上記問題点を解決し、品種の異な
るプリント基板に部品を実装する実装ラインの生産効率
をトータルで向上させる多品種少量生産の部品配列の決
定方法を提供することを目的とする。It is an object of the present invention to solve the above problems and to provide a method for determining a component arrangement for high-mix low-volume production that improves the total production efficiency of a mounting line for mounting components on printed circuit boards of different types. To do.
【0019】[0019]
【課題を解決するための手段】本発明は上記従来例の問
題点を解決するため、優先順位が定められた部品配列位
置にセットされた部品を、優先順位順に基板上の所定位
置に装着すると共に、複数の品種の基板が所定枚数づつ
順次供給される実装機における部品配列の決定方法にお
いて、全品種の基板で使用される全ての部品をリストア
ップし、これら部品について、各品種の基板間で使用さ
れる部品の共通性を求めて、部品の共通度レベルから共
通部品と非共通部品とに分類し、上記共通部品を部品供
給部の優先配列位置に割り当て、これら共通部品に全品
種の基板の装着作業を通じて同一位置となるように配列
位置を固定的に与え、他方、上記非共通部品を部品供給
部の非優先配列位置に割り当て、これら非共通部品に各
品種を基板毎に対応する位置となるように配列位置を個
別的に与えて、部品配列位置を決定することを特徴とす
る。In order to solve the problems of the above-mentioned conventional example, the present invention mounts the components set in the component arrangement position in which the priority order is determined, to the predetermined positions on the board in the priority order. At the same time, in the method of determining the component arrangement in a mounting machine in which a plurality of boards of a plurality of types are sequentially supplied, a list of all the components used in the boards of all types is provided. In order to find the commonality of the parts used in, the common level of the parts is classified into common parts and non-common parts, and the above common parts are assigned to the priority arrangement position of the part supply unit, and all common product types are assigned to these common parts. Arrangement positions are fixedly provided so as to be the same position through the board mounting work, while the above-mentioned non-common parts are assigned to non-priority arrangement positions of the component supply section, and each product type is paired to these non-common parts. The sequence position so that the position of giving individually, and determines a component arrangement position.
【0020】本発明において、共通部品中の配列位置の
優先順位を、共通度レベルを考慮し、共通度レベルの高
いものを優先させて決定すると好適である。In the present invention, it is preferable that the priority order of the arrangement positions in the common parts is determined by considering the commonality level and giving priority to the one having the higher commonality level.
【0021】また本発明において、非共通部品中の配列
位置の優先順位を、各品種の基板の連続生産関係を考慮
し、連続生産関係にある部品を優先させて決定すると好
適である。Further, in the present invention, it is preferable that the priority order of the arrangement positions in the non-common parts is determined by giving priority to the parts in the continuous production relationship in consideration of the continuous production relationship of the boards of each type.
【0022】本発明は上記構成によって、次のような作
用を営むことができる。すなわち、部品の共通度レベル
から共通部品と非共通部品とに分類分けし、共通部品の
配列位置について、部品供給部の優先配列位置から順次
連続してまとまるようにその配列位置を決定し、しかも
全品種の基板の装着作業を通じて同一位置となるように
配列位置を固定的に与え、他方非共通部品の配列位置に
ついて、部品供給部の非優先配列位置を与え、かつこれ
ら非共通部品に各品種の基板毎に対応する位置となるよ
うに配列位置を個別的に与えているので、たとえ多品種
少量生産の実装機にあっても、共通性のある共通部品は
優先配列位置へまとめられて、その配列位置を占有する
ことができ、部品を切替る必要がなくなり、全体として
も切替ロスを防止することができる結果、実装機の生産
効率をトータル的には向上させることができる。The present invention having the above-described structure can perform the following operations. That is, the commonality level of the parts is classified into common parts and non-common parts, and the arrangement positions of the common parts are determined so as to be sequentially contiguous from the priority arrangement position of the component supply unit. Arrangement positions are fixedly provided so as to be the same position through the mounting work of all types of boards, while non-priority arrangement positions of the component supply unit are given to the arrangement positions of the non-common parts, and these non-common parts are given different types. Since the array positions are individually given so as to be the positions corresponding to each board of, even in the mounting machine of the high-mix low-volume production, common parts having commonality are grouped into the priority array position, The array position can be occupied, it is not necessary to switch the parts, and the switching loss can be prevented as a whole. As a result, it is possible to improve the production efficiency of the mounting machine as a whole. That.
【0023】[0023]
【発明の実施の形態】以下本発明の実施の形態を示す実
施例について、図面を参照しながら詳細に説明する。図
1〜図3は本発明の実施例を示すものである。Embodiments of the present invention will be described below in detail with reference to the drawings. 1 to 3 show an embodiment of the present invention.
【0024】図3に示す実装機1は、部品Zの配列位置
(Z1,Z2,Z3,・・・)をライン状に有する部品
供給部5と、一定の吸着位置Sで部品Zを吸収し、一定
の装着位置Mで部品Zを装着する固定動作をおこなう装
着ヘッド4と、プリント基板3をXY方向に移動自在に
位置決めする可動テーブル2とを備えている。The mounting machine 1 shown in FIG. 3 absorbs the components Z at a constant suction position S, and a component supply section 5 having lined arrangement positions (Z1, Z2, Z3, ...) Of the components Z. A mounting head 4 that performs a fixing operation for mounting the component Z at a fixed mounting position M, and a movable table 2 that positions the printed circuit board 3 movably in the XY directions are provided.
【0025】この部品供給部5の各部品Zは、図の矢印
で示す方向へのみ自由度を有している。この部品配列位
置は、Z1位置が優先順位が最も高い配列位置となって
いる。すなわち、部品の優先配列位置はZ1側からZ
2,Z3・・・へと順次決められている。そして、Z1
位置から順に各部品が割当てられて、必要な配列位置ま
でが使用されている。Each component Z of the component supply unit 5 has a degree of freedom only in the direction shown by the arrow in the figure. In this component arrangement position, the Z1 position is the arrangement position having the highest priority. That is, the priority arrangement position of the parts is from the Z1 side to Z
2, Z3 ... are decided in sequence. And Z1
Each part is assigned in order from the position, and up to the necessary arrangement position is used.
【0026】そこで、固定位置間でおこなわれる装着ヘ
ッド4の部品Zの吸装着動作は、まず部品供給部5が移
動して、吸着位置S上にある配列位置の部品Zが装着ヘ
ッド4で吸着される。Therefore, in the suction and mounting operation of the component Z of the mounting head 4 performed between the fixed positions, first, the component supply unit 5 moves and the component Z at the array position on the suction position S is sucked by the mounting head 4. To be done.
【0027】次に、装着ヘッド4は吸着した部品Zを装
着位置M上に移動させ、移動自在に構成されたテーブル
2上にセットされたプリント基板3のXY方向に位置決
めされた装着ポイントに装着している。Next, the mounting head 4 moves the sucked component Z onto the mounting position M, and mounts it on the mounting point positioned in the XY directions of the printed circuit board 3 set on the freely movable table 2. doing.
【0028】以上のように構成された実装機1が配され
た実装ラインは同特性のMV−1、MV−2の2台の実
装機を備えて、各実装機は固定位置間でおこなわれる装
着ヘッド4の部品の吸装着動作で、4種類のプリント基
板3(品種1〜品種4)に部品Zを装着している。ここ
で各品種は、生産される基板の枚数に応じて、生産量の
多い順に品種1から順次品種4へと割当られている。そ
して品種1から順に品種2、品種3、品種4へと連続し
て生産がおこなわれる。The mounting line on which the mounting machine 1 configured as described above is arranged includes two mounting machines MV-1 and MV-2 having the same characteristics, and each mounting machine is operated between fixed positions. The component Z is mounted on the four types of printed circuit boards 3 (models 1 to 4) by the suction and mounting operation of the components of the mounting head 4. Here, each product type is sequentially assigned to the product type 1 to the product type 4 in descending order of the production amount according to the number of boards to be produced. Then, production is successively performed from the product type 1 to the product type 2, the product type 3, and the product type 4.
【0029】この実装機1の部品配列の決定方法を図1
のフローに従って説明する。図1に示す1〜7の番号は
各工程番号を示すもので、1で示す第1工程において
は、全てのプリント基板(全品種)で使用する全ての部
品リストが作成される。このリストにはプリント基板品
種名や部品の名称、部品数、装着速度などのデータが含
まれている。FIG. 1 shows the method of determining the component arrangement of the mounting machine 1.
The description will be made according to the flow of FIG. The numbers 1 to 7 shown in FIG. 1 indicate the respective process numbers, and in the first process indicated by 1, a list of all parts used for all printed circuit boards (all types) is created. This list includes data such as printed circuit board product names, component names, the number of components, and mounting speed.
【0030】第2工程は部品リストから各プリント基板
間の部品の共通性が調べられる。ここで共通性とは4つ
の品種(品種1〜品種4)の各プリント基板間で共通し
て使用される頻度の多い部品であるか否かで決定されて
いる。In the second step, the commonality of parts between the printed boards is checked from the parts list. Here, the commonality is determined by whether or not the parts are frequently used in common among the printed boards of four kinds (kinds 1 to 4).
【0031】第3工程においては、上記共通性から部品
の分類分けがおこなわれる。この分類分けは、予め設定
された共通度レベルに達した部品を共通部品とし、他の
部品を非共通部品とする2種に分類している。なお、本
実施例においては共通度レベルが3品種以上で共通に使
用されている部品を共通部品とし、他を非共通部品とし
ている。In the third step, the parts are classified based on the commonality. This classification is performed by classifying into two types, a component that has reached a preset commonality level is a common component and another component is a non-common component. In the present embodiment, parts commonly used in three or more commonality levels are common parts, and other parts are non-common parts.
【0032】第4工程は部品を2台の実装機MV−1,
MV−2(本実施例では両者は同特性のもの)に振り分
ける工程で、装着速度の速いもの(装着時間0.14s
ec)のグループと、遅いもの(装着時間0.25se
c)に大別し、装着速度の速いものを優先的にMV−1
に振り分け、かつ装着時間と部品の個数から2つの実装
機の実装時間が均一となるように分けている。この結果
図2に示すようにMV−1には装着時間0.14sec
の部品のみが、MV−2には装着時間0.14secと
0.25secの2グループの部品が振り分けられてい
る。なお、一般的には、実装機の特性が考慮されて特殊
部品が振り分けられた後、例えば部品形状の小さいもの
から大きいもの順や、装着速度の速いものから遅いもの
順などで分けられて、更に各実装機の実装時間をプリン
ト基板の品種ごとに算出して、いずれの品種のプリント
基板であっても各実装機で実装時間のバランスがとれる
ように振分けられている。The fourth step is to mount two component mounters MV-1,
In the process of allocating to MV-2 (both of which have the same characteristics in this embodiment), the one having a high mounting speed (mounting time 0.14 s)
ec) group and slower (wearing time 0.25se
c), and the one with a fast wearing speed is given priority to MV-1
The mounting time of the two mounting machines is made uniform based on the mounting time and the number of parts. As a result, as shown in FIG. 2, the mounting time was 0.14 sec for the MV-1.
In the MV-2, two groups of parts having a mounting time of 0.14 sec and a mounting time of 0.25 sec are distributed. In addition, in general, after the special parts are sorted in consideration of the characteristics of the mounting machine, for example, the parts are sorted in order from the smallest to the largest shape, or from the fastest to the slowest mounting speed. Further, the mounting time of each mounting machine is calculated for each type of printed circuit board, and the mounting time is distributed to each mounting machine so that the mounting time can be balanced regardless of the type of printed circuit board.
【0033】第5工程は各実装機ごとに振り分けられた
部品を部品の装着速度及び共通性からグルーピングして
いる。図2に示すように、MV−1では共通部品A1 を
優先順位が上位となるグループに、非共通部品B1,C1
を優先順位が下位となるグループに分け、MV−2で
は、装着速度が0.14secの部品でかつ共通部品A
2 を第1優先グループ、同非共通部品C2 を第2優先グ
ループ、装着速度が0.25secの部品でかつ共通部
品A3 を第3優先順位、同非共通部品B2 , C3を第4
優先順位として、グループ分けされている。In the fifth step, the parts distributed to each mounting machine are grouped according to the mounting speed and commonality of the parts. As shown in FIG. 2, in MV-1, the common component A 1 is assigned to the group having the higher priority and the non-common components B 1 and C 1 are assigned.
Are divided into lower priority groups, and in the MV-2, the parts having a mounting speed of 0.14 sec and the common part A
2 is the first priority group, the non-common parts C 2 is the second priority group, the mounting speed is 0.25 sec, the common part A 3 is the third priority, and the non-common parts B 2 and C 3 are the second priority groups. Four
Grouped as a priority.
【0034】第6工程は上記共通度レベルから分類され
た共通部品の配列を決定する工程で、第6a工程では第
5工程で大別された各グループ内で共通部品に係る部品
配列を、装着対象である基板品種の優先順位(品種1〜
品種4)に基づいて決定している。The sixth step is a step of deciding the arrangement of the common parts classified according to the above-mentioned commonality level. In the sixth step, the parts arrangement relating to the common parts in each group roughly classified in the fifth step is mounted. Priority of the target board type (type 1
Determined based on product type 4).
【0035】続いて第6b工程では上記第6a工程でグ
ループ内の配列が決定された各グループを装着部品数に
応じて、順次優先配列位置に配置している。Then, in step 6b, the groups whose arrangements have been determined in step 6a are sequentially arranged at the priority arrangement positions according to the number of mounted parts.
【0036】図2のA1、A2、A3で示す各グループ
内の配列順序は、第6工程で決定された共通部品の配列
を示している。そして、これら共通部品A1,A2,A
3のグループに属する部品は、図2に示すように、部品
供給部番号が固定的に与えられ、全品種の基板(品種1
〜品種4)に対する装着動作を通じて、部品交換が行わ
れることはない。The arrangement order in each group indicated by A1, A2, and A3 in FIG. 2 indicates the arrangement of the common parts determined in the sixth step. And these common parts A1, A2, A
As shown in FIG. 2, the components belonging to the group No. 3 are fixedly assigned the component supply unit numbers, and all types of substrates (type 1
-Parts are not replaced through the mounting operation for the product 4).
【0037】次に第7工程は共通性が低く非共通部品に
分類された部品の配列を決定する工程である。この非共
通性部品B1 ,C1 ,C2 ,B2 ,C3 のグループに属
する部品は、図2に示すように、部品供給部番号が固定
的には与えられないで、装着対象となる基板(品種1〜
品種4)に対応して与えられ、図2に※で示す時点で部
品の交換が行われる。第7a工程では、品種の異なる基
板間で連続して使用する部品B1,B2 のグループに属す
る部品を優先して、配列位置を割付けている。Next, the seventh step is a step of determining the arrangement of the parts classified into the non-common parts having low commonality. As shown in FIG. 2, the parts belonging to the group of the non-common parts B 1 , C 1 , C 2 , B 2 , and C 3 are not fixedly assigned to the parts supply unit number, and are to be mounted. Naru board (type 1
It is given according to product type 4), and parts are replaced at the time indicated by * in Fig. 2. In the 7a step, the array positions are assigned by giving priority to the parts belonging to the group of the parts B 1 and B 2 which are continuously used between the boards of different types.
【0038】図2の品種1〜品種4は生産枚数の多い品
種を優先して品種1から順に品種4へ割当られていて、
品種1から品種2、品種2から品種3、品種3から品種
4へと順番に生産がおこなわれることから、例えばMV
−1の図2のB1で示す範囲に連続関係にある非共通部
品の割付けが優先的におこなわれている。生産順序が連
続する品種1と品種2の基板で使用される部品caを、
第6工程を経て共通部品が占有した配列位置を除いて、
次の最も優先順位の高い実装機MV−1の部品供給位置
Z5に割付けている。続いて生産順序が連続する品種2
と品種3の基板で使用される部品ddを次の優先順位の
配列位置Z6に割付け、また、部品bfについては、Z
5における空き部分に割付け、さらに部品eaについて
はZ7に割付けている。The products 1 to 4 shown in FIG. 2 are assigned to products 4 in order from product 1 with priority given to products having a large number of products.
Since production is carried out in order from product type 1 to product type 2, product type 2 to product type 3, and product type 3 to product type 4, for example, MV
-1 is assigned preferentially to non-common parts having a continuous relationship in the range indicated by B1 in FIG. The parts ca used in the boards of type 1 and type 2 whose production sequence is continuous are
Except for the array position occupied by common parts through the sixth step,
It is assigned to the component supply position Z5 of the next highest mounting machine MV-1. Product type 2 with continuous production sequence
And the component dd used on the board of the product type 3 is assigned to the arrangement position Z6 of the next priority, and for the component bf, Z
No. 5 is allocated to the vacant portion, and further, part ea is allocated to Z7.
【0039】次の第7b工程では、非共通部品で、かつ
生産順序に連続性のない部品C1,C2,C3 のグループに
属する部品の配列を、共通部品及び連続部品の占有配列
位置を除いて空白となっている配列位置へ、品種1〜品
種4に装着される順に割付けている。図2のB1及びC
1の範囲に示す部品cb,ad及びaeはその割付けを
示すものである。すなわち、部品cb、adは品種1で
使用される部品であるため、実装個数の多い順に、品種
1の配列Z1位置から共通部品の占有配列位置を除い
て、下方の空白となっている最も優先配列となる位置Z
6、Z7へ順次割り当てられる。部品aeについても同
様に品種3で使用される部品であるため、品種3の最も
優先配列となる位置Z8へ割り当てられている。In the next 7b step, the arrangement of the non-common parts and the parts belonging to the group of the parts C 1, C 2 and C 3 which are not continuous in the production sequence is set to the occupied array positions of the common parts and the continuous parts. All are laid out in the order of being mounted in the product types 1 to 4 to blank array positions except for. B1 and C of FIG.
The parts cb, ad and ae shown in the range of 1 indicate the allocation. That is, since the components cb and ad are the components used in the product type 1, in the descending order of the number of mounted products, the blanks below the highest priority are excluded from the array Z1 position of the product type 1 except the occupied array position of the common component. Array position Z
6 and Z7 are sequentially assigned. Since the component ae is also a component used in the product type 3, it is assigned to the position Z8 which is the highest priority array of the product type 3.
【0040】一方、実装機MV−2においても同様に、
まず装着速度が0.14secのグループの部品bc、
bdが各々使用される品種1、品種2の空白の優先とな
る配列位置Z3に割り当てられ、続いて装着速度が0.
25secのグループも同様に部品cf、ce、daが
各々使用される品種の同一グループ内の空白となってい
る配列位置Z7、Z6、Z7の順に割り当てられてい
る。On the other hand, also in the mounting machine MV-2,
First, the parts bc of the group whose mounting speed is 0.14 sec,
bd is allocated to the blank arrangement position Z3 of the product type 1 and the product type 2 which are used, respectively, and then the mounting speed is 0.
Similarly, the 25 sec group is also assigned in the order of blank arrangement positions Z7, Z6, and Z7 in the same group of the types in which the components cf, ce, and da are used.
【0041】以上の工程1〜7を経て得られた図2に示
す部品の配列位置は、従来例の図7のものと比較して、
大幅に部品切替え回数を減少させることができ(図2に
※で示すように6回)、部品切替えロスを少なくするこ
とができる。The arrangement positions of the parts shown in FIG. 2 obtained through the above steps 1 to 7 are compared with those of the conventional example shown in FIG.
The number of parts switching can be significantly reduced (6 times as indicated by * in Fig. 2), and the parts switching loss can be reduced.
【0042】[0042]
【発明の効果】本発明によれば、品種の異なるプリント
基板に部品を実装する実装機の品種切替ロスを減少さ
せ、生産効率を向上させることができる。According to the present invention, it is possible to reduce the product type switching loss of a mounting machine that mounts components on different types of printed circuit boards and improve the production efficiency.
【図面の簡単な説明】[Brief description of the drawings]
【図1】本発明の実施例を示すフローチャート。FIG. 1 is a flowchart showing an embodiment of the present invention.
【図2】その部品配列を示すデータ図。FIG. 2 is a data diagram showing the component arrangement.
【図3】実装機を示す構成図。FIG. 3 is a configuration diagram showing a mounting machine.
【図4】第1の従来例を示すフローチャート。FIG. 4 is a flowchart showing a first conventional example.
【図5】その部品配列を示すデータ図。FIG. 5 is a data diagram showing the component arrangement.
【図6】第2の従来例を示すフローチャート。FIG. 6 is a flowchart showing a second conventional example.
【図7】その部品配列を示すデータ図。FIG. 7 is a data diagram showing the component arrangement.
1 実装機 2 可動テーブル 3 プリント基板 4 装着ヘッド 5 部品供給部 Z 部品 1 Mounting Machine 2 Movable Table 3 Printed Circuit Board 4 Mounting Head 5 Component Supply Section Z Component
───────────────────────────────────────────────────── フロントページの続き (72)発明者 益田 聖 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 佐藤 健一 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Satoshi Masuda 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Kenichi Sato, 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.
Claims (3)
ットされた部品を、優先順位順に基板上の所定位置に装
着すると共に、複数の品種の基板が所定枚数づつ順次供
給される実装機における部品配列の決定方法において、 全品種の基板で使用される全ての部品をリストアップ
し、 これら部品について、各品種の基板間で使用される部品
の共通性を求めて、部品の共通度レベルから共通部品と
非共通部品とに分類し、 上記共通部品を部品供給部の優先配列位置に割当て、こ
れら共通部品に全品種の基板の装着作業を通じて同一位
置となるように配列位置を固定的に与え、 他方、上記非共通部品を部品供給部の非優先配列位置に
割当て、これら非共通部品に各品種の基板毎に対応する
位置となるように配列位置を個別的に与えて、 部品配列位置を決定することを特徴とする部品配列の決
定方法。1. A mounting machine in which components set in component arrangement positions having a predetermined priority order are mounted at predetermined positions on a board in order of priority and a plurality of boards of a plurality of types are sequentially supplied by a predetermined number. In the method of determining the component arrangement, list all the components used in all types of boards, find the commonality of the components used in each type of board, and calculate the commonality level of the components. Classify into common parts and non-common parts, assign the above-mentioned common parts to the priority arrangement position of the component supply unit, and give these common parts a fixed arrangement position so that they will be in the same position through the mounting work of the boards of all types. On the other hand, the non-common parts are assigned to the non-priority array positions of the component supply unit, and the array positions are individually given to these non-common parts so as to be the positions corresponding to each board of each type, and the component array position is determined. Method of determining the part sequence and determining the.
通度レベルを考慮し、共通度レベルの高いものを優先さ
せて決定することを特徴とする請求項1記載の部品配列
の決定方法。2. The method for determining a component arrangement according to claim 1, wherein the arrangement positions in the common components are determined in priority by considering the commonality level and giving priority to those having a high commonality level. .
各品種の基板の連続生産関係を考慮し、連続生産関係に
ある部品を優先させて決定することを特徴とする請求項
1又は2記載の部品配列の決定方法。3. The order of priority of array positions in non-common parts,
3. The method for determining a component arrangement according to claim 1, wherein the components in the continuous production relationship are prioritized and determined in consideration of the continuous production relationship of the boards of each type.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26266695A JP3621764B2 (en) | 1995-10-11 | 1995-10-11 | How to determine the part arrangement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26266695A JP3621764B2 (en) | 1995-10-11 | 1995-10-11 | How to determine the part arrangement |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004298616A Division JP2005057300A (en) | 2004-10-13 | 2004-10-13 | How to determine component arrangement |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09107197A true JPH09107197A (en) | 1997-04-22 |
| JP3621764B2 JP3621764B2 (en) | 2005-02-16 |
Family
ID=17378929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26266695A Expired - Fee Related JP3621764B2 (en) | 1995-10-11 | 1995-10-11 | How to determine the part arrangement |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3621764B2 (en) |
Cited By (10)
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|---|---|---|---|---|
| JP2003229696A (en) * | 2002-02-06 | 2003-08-15 | Juki Corp | Component mounting method and system |
| JP2007035892A (en) * | 2005-07-26 | 2007-02-08 | Matsushita Electric Ind Co Ltd | Data management method |
| JP2009111106A (en) * | 2007-10-30 | 2009-05-21 | Juki Corp | Feeder layout optimization method for component mounters |
| JP2009272551A (en) * | 2008-05-09 | 2009-11-19 | Panasonic Corp | Method of deciding mounting condition |
| JP2012094663A (en) * | 2010-10-27 | 2012-05-17 | Hitachi High-Tech Instruments Co Ltd | Component mounting system, component mounting setting unit, component mounting setting program and component mounting method |
| JP2012520577A (en) * | 2009-03-16 | 2012-09-06 | シーメンス アクチエンゲゼルシヤフト | How to determine equipment for a fixed table of an automatic mounting machine |
| WO2013124959A1 (en) | 2012-02-20 | 2013-08-29 | 富士機械製造株式会社 | Production plan determining method and determining device |
| WO2014068712A1 (en) * | 2012-10-31 | 2014-05-08 | 富士機械製造株式会社 | Set-up change method, and set-up change device |
| WO2019168230A1 (en) * | 2018-02-27 | 2019-09-06 | 한화정밀기계 주식회사 | Feeder placement method and feeder placement device for single mounter composed of plurality of feeder bases for manufacturing multiple pcbs |
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1995
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| JP2003229696A (en) * | 2002-02-06 | 2003-08-15 | Juki Corp | Component mounting method and system |
| JP2007035892A (en) * | 2005-07-26 | 2007-02-08 | Matsushita Electric Ind Co Ltd | Data management method |
| JP2009111106A (en) * | 2007-10-30 | 2009-05-21 | Juki Corp | Feeder layout optimization method for component mounters |
| JP2009272551A (en) * | 2008-05-09 | 2009-11-19 | Panasonic Corp | Method of deciding mounting condition |
| JP2016149545A (en) * | 2009-03-16 | 2016-08-18 | シーメンス アクチエンゲゼルシヤフトSiemens Aktiengesellschaft | Method for determining setups for constant tables of automatic placement machines, computer software program for implementing method, computer readable medium containing instructions for implementing method, and placement lines having constant tables |
| JP2012520577A (en) * | 2009-03-16 | 2012-09-06 | シーメンス アクチエンゲゼルシヤフト | How to determine equipment for a fixed table of an automatic mounting machine |
| US8793008B2 (en) | 2009-03-16 | 2014-07-29 | Siemens Aktiengesellschaft | Method for determining fittings for constant tables of automatic placement machines |
| JP2012094663A (en) * | 2010-10-27 | 2012-05-17 | Hitachi High-Tech Instruments Co Ltd | Component mounting system, component mounting setting unit, component mounting setting program and component mounting method |
| WO2013124959A1 (en) | 2012-02-20 | 2013-08-29 | 富士機械製造株式会社 | Production plan determining method and determining device |
| WO2014068712A1 (en) * | 2012-10-31 | 2014-05-08 | 富士機械製造株式会社 | Set-up change method, and set-up change device |
| JPWO2014068712A1 (en) * | 2012-10-31 | 2016-09-08 | 富士機械製造株式会社 | Setup change method and setup change device |
| WO2019168230A1 (en) * | 2018-02-27 | 2019-09-06 | 한화정밀기계 주식회사 | Feeder placement method and feeder placement device for single mounter composed of plurality of feeder bases for manufacturing multiple pcbs |
| US11663760B2 (en) | 2020-04-24 | 2023-05-30 | Fujitsu Limited | Non-transitory computer-readable recording medium having stored therein displaying program, method for displaying, and information processing apparatus |
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