JPH081064A - Rotation processing device - Google Patents
Rotation processing deviceInfo
- Publication number
- JPH081064A JPH081064A JP6137224A JP13722494A JPH081064A JP H081064 A JPH081064 A JP H081064A JP 6137224 A JP6137224 A JP 6137224A JP 13722494 A JP13722494 A JP 13722494A JP H081064 A JPH081064 A JP H081064A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- processing liquid
- rotation
- processing
- liquid receiving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Coating Apparatus (AREA)
- Weting (AREA)
Abstract
(57)【要約】
【目的】 基板から排出された処理液を確実に回収し
て、処理液の基板への再付着を防止することができる回
転処理装置を提供する。
【構成】 吸着チャック１４に吸着支持された基板２お
よび整流板１６を取り囲むように、アンダープレート６
の上面に基板２とほぼ相似形の角型の処理液受け部材１
８が固定されて、基板２と近接した状態で一体的に回転
可能となっている。処理液を供給した後、基板２を回転
させると、回転により発生した遠心力Ｆによって当該基
板２から外周方向に余剰の処理液Ｌが排出されるが、そ
の処理液Ｌが直ちに近接配置された処理液受け部材１８
の水平ひさし部２２および傾斜案内部２４で受けられ、
水平案内部２６とアンダープレート６との間の経路Ｒに
沿って壁部２８側に導かれる。そして、処理液受け部材
１８の隅部に設けられた排液口３２を介して水平外方に
排出される。
(57) [Abstract] [PROBLEMS] To provide a rotation processing apparatus capable of surely collecting a processing liquid discharged from a substrate and preventing the processing liquid from reattaching to the substrate. The under plate 6 surrounds the substrate 2 and the current plate 16 that are suction-supported by the suction chuck 14.
A rectangular processing liquid receiving member 1 having a shape similar to that of the substrate 2 on the upper surface of
8 is fixed and can rotate integrally with the substrate 2 in the vicinity thereof. When the substrate 2 is rotated after supplying the processing liquid, the centrifugal force F generated by the rotation causes the excess processing liquid L to be discharged from the substrate 2 in the outer peripheral direction, but the processing liquid L is immediately arranged in proximity. Processing liquid receiving member 18
Received by the horizontal eaves portion 22 and the inclined guide portion 24 of
It is guided to the wall portion 28 side along the route R between the horizontal guide portion 26 and the under plate 6. Then, the liquid is discharged horizontally outward through the liquid outlet 32 provided at the corner of the processing liquid receiving member 18.
Description
【０００１】[0001]
【産業上の利用分野】この発明は、液晶用ガラス角型基
板、半導体ウエハ、カラーフィルタ用基板などの基板
（以下単に「基板」という）を回転させて当該基板の表
面に供給されたフォトレジストや洗浄水などの処理液を
表面全体に拡散流動させて、フォトレジストを基板表面
に塗布してその薄膜を形成したりあるいは洗浄液によっ
て基板表面の洗浄を行ったりする回転処理装置に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention rotates a substrate such as a glass rectangular substrate for liquid crystal, a semiconductor wafer, a substrate for color filter (hereinafter simply referred to as "substrate"), and supplies a photoresist to the surface of the substrate. The present invention relates to a rotation processing apparatus for diffusing and flowing a processing liquid such as cleaning water or the like over the surface to apply a photoresist to the surface of a substrate to form a thin film thereof or to clean the surface of the substrate with the cleaning liquid.
【０００２】[0002]
【従来の技術】従来より、この種の回転処理装置として
は、例えば特開平４−６１９５５号公報に記載された装
置がある。この装置では基板を水平に支持しつつ回転さ
せる回転台が設けられており、基板の上面中央部に塗布
液（処理液）を滴下した後、基板を搭載した状態のまま
で回転台を回転させることによって塗布液を拡散流動さ
せて、均一な薄膜を基板の上面に形成させている。2. Description of the Related Art Conventionally, as a rotation processing apparatus of this kind, there is an apparatus described in, for example, Japanese Patent Laid-Open No. 4-61955. This device is equipped with a turntable that rotates the substrate while supporting it horizontally. After the coating liquid (treatment liquid) is dropped onto the center of the upper surface of the substrate, the turntable is rotated with the substrate still mounted. As a result, the coating liquid is diffused and flowed to form a uniform thin film on the upper surface of the substrate.
【０００３】上記のように構成された回転処理装置で
は、例えば図４に示すように、基板２を回転させること
によって、基板２上へ供給した塗布液（処理液）を遠心
力でその表面全体に拡散流動させるために、余剰の塗布
液Ｌは基板２から外周方向に排出される。ここで、この
ようにして排出された塗布液Ｌを放置しておくと、塗布
液Ｌにより装置が汚染されたり、固化した塗布液Ｌがパ
ーティクルとなって基板２に付着する等の問題が生じる
ため、当該装置では回転台から一定距離だけ離れて側壁
を設け、排出された塗布液を回収するようにしている。In the rotation processing apparatus configured as described above, for example, as shown in FIG. 4, by rotating the substrate 2, the coating liquid (processing liquid) supplied onto the substrate 2 is centrifugally applied to the entire surface thereof. The excess coating liquid L is discharged from the substrate 2 in the outer peripheral direction in order to diffuse and flow to the substrate 2. Here, if the coating liquid L discharged in this way is left to stand, there arises a problem that the apparatus is contaminated by the coating liquid L or the solidified coating liquid L becomes particles and adheres to the substrate 2. Therefore, in the apparatus, a side wall is provided at a certain distance from the turntable to collect the discharged coating liquid.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上記の
ように構成された装置では、同図（ｂ）に示すように、
基板２から排出された塗布液（処理液）Ｌの一部が側壁
に達する前に回転する基板２の表面に再付着し、基板２
が汚染されると問題があった。特に角型基板２では隅部
から排出された塗布液Ｌが重大な問題となる。However, in the apparatus constructed as described above, as shown in FIG.
A part of the coating liquid (treatment liquid) L discharged from the substrate 2 reattaches to the surface of the rotating substrate 2 before reaching the side wall.
There was a problem when was polluted. Particularly in the case of the rectangular substrate 2, the coating liquid L discharged from the corner becomes a serious problem.
【０００５】なお、上記のような問題は、塗布液を基板
表面に回転塗布する装置にのみ生じるのではなく、現像
液や洗浄液などの処理液を基板に供給し、基板回転によ
り拡散流動させて所定の処理を行う回転処理装置全般に
おいて生じる問題である。The above problem does not occur only in an apparatus that spin-coats a coating liquid on the surface of a substrate, but a processing liquid such as a developing liquid or a cleaning liquid is supplied to the substrate to diffuse and flow by rotating the substrate. This is a problem that occurs in all rotation processing apparatuses that perform predetermined processing.
【０００６】そこで、この発明は、上記課題を解決する
ためになされたもので、基板から排出された処理液を確
実に回収して、処理液の基板への再付着を防止すること
ができる回転処理装置を提供することを目的とする。Therefore, the present invention has been made in order to solve the above-mentioned problems, and it is possible to reliably collect the processing liquid discharged from the substrate and prevent the processing liquid from reattaching to the substrate. An object is to provide a processing device.
【０００７】[0007]
【課題を解決するための手段】請求項１の発明は、基板
を回転させて、当該基板に供給された処理液をその表面
全体に拡散流動させて、前記基板に所定の処理を施す回
転処理装置であって、上記目的を達成するため、基板の
外形と同等以上の大きさを有し、基板を水平支持した状
態で回転させる回転支持手段と、前記回転支持手段上に
支持された基板の外周部に近接して配置され、前記回転
支持手段と一体に回転するとともに、前記基板から外周
方向に飛散した処理液を受ける処理液受け手段と、を備
えている。According to a first aspect of the present invention, a substrate is rotated, and a treatment liquid supplied to the substrate is diffused and flowed over the entire surface of the substrate to perform a predetermined treatment on the substrate. In order to achieve the above object, the apparatus has a rotation supporting means having a size equal to or larger than the outer shape of the substrate and rotating the substrate in a state of horizontally supporting the substrate, and a substrate supported on the rotation supporting means. And a treatment liquid receiving unit that is disposed close to the outer peripheral portion, rotates integrally with the rotation supporting unit, and receives the treatment liquid scattered in the outer peripheral direction from the substrate.
【０００８】請求項２の発明は、前記基板および前記処
理液受け手段をともに角型形状とし、しかも前記処理液
受け手段の各隅部に処理液を外部に排出するための排液
部を設けている。According to a second aspect of the present invention, both the substrate and the processing liquid receiving means have a rectangular shape, and a drainage portion for discharging the processing liquid to the outside is provided at each corner of the processing liquid receiving means. ing.
【０００９】請求項３の発明は、前記基板を取り囲むよ
うに、前記処理液受け手段を前記基板の全周に沿って設
けている。According to a third aspect of the present invention, the processing liquid receiving means is provided along the entire circumference of the substrate so as to surround the substrate.
【００１０】請求項４の発明は、回転支持手段上に支持
された基板の上面と所定の間隔を隔てて平行に配設され
るとともに、基板の外形と同等以上の大きさを有し、か
つ、回転支持手段と一体に回転される上部回転板を、さ
らに備えている。According to a fourth aspect of the present invention, it is arranged in parallel with the upper surface of the substrate supported on the rotation supporting means at a predetermined distance, and has a size equal to or larger than the outer shape of the substrate. Further provided is an upper rotary plate which is rotated integrally with the rotary support means.
【００１１】[0011]
【作用】請求項１の発明では、処理液受け手段が回転支
持手段上に支持された基板の外周部に近接して配置され
ているため、前記回転支持手段によって基板を回転させ
た際に当該基板から外周方向に飛散した処理液が確実に
回収される。したがって、基板への処理液の再付着が防
止される。According to the invention of claim 1, since the processing liquid receiving means is arranged close to the outer peripheral portion of the substrate supported on the rotation supporting means, when the substrate is rotated by the rotation supporting means. The processing liquid scattered in the outer peripheral direction from the substrate is reliably collected. Therefore, redeposition of the processing liquid on the substrate is prevented.
【００１２】請求項２の発明では、角型基板から排出さ
れた処理液が、同じく角型形状に構成された処理液受け
手段により回収された後、当該処理液受け手段の各隅部
に設けられた排液部から外部に排出される。According to the second aspect of the present invention, after the processing liquid discharged from the rectangular substrate is collected by the processing liquid receiving means having the same rectangular shape, it is provided at each corner of the processing liquid receiving means. The liquid is discharged to the outside from the drained part.
【００１３】請求項３の発明では、処理液受け手段は、
基板を取り囲むように、当該基板の全周に沿って設けら
れ、回転する基板から排出された処理液を確実に回収す
る。In the invention of claim 3, the processing liquid receiving means is
It is provided along the entire circumference of the substrate so as to surround the substrate, and reliably collects the processing liquid discharged from the rotating substrate.
【００１４】請求項４の発明では、上部回転板が回転支
持手段上に支持された基板の上面と所定の間隔を隔てて
平行に配設されて、密閉あるいは半密閉空間を形成す
る。According to the invention of claim 4, the upper rotary plate is arranged in parallel with the upper surface of the substrate supported on the rotary support means at a predetermined interval to form a closed or semi-closed space.
【００１５】[0015]
【実施例】図１は、この発明にかかる回転処理装置の一
実施例を示す断面図である。また、図２は、この装置の
部分拡大図である。この回転処理装置では、例えば角形
の基板２を搭載でき、しかも回転軸４回りに回転自在な
アンダープレート６が設けられている。すなわち、回転
軸４に沿って回転シャフト８が垂設されており、その上
端に連結ボス１０を介して基板２の外形と同等以上の大
きさを有するアンダープレート６が水平に取り付けられ
る一方、その下端に図示を省略するモータが連結されて
いる。また、この回転シャフト８の先端部には、吸着チ
ャック１４が固着されており、基板２を吸着支持可能と
なっている。このように、この実施例は、これらの構成
により、基板２を水平支持した状態で回転させる回転支
持手段が構成されている。1 is a sectional view showing an embodiment of a rotation processing apparatus according to the present invention. FIG. 2 is a partially enlarged view of this device. In this rotation processing device, for example, a rectangular substrate 2 can be mounted, and an under plate 6 that is rotatable around a rotation axis 4 is provided. That is, a rotating shaft 8 is vertically provided along the rotating shaft 4, and an under plate 6 having a size equal to or larger than the outer shape of the substrate 2 is horizontally attached to the upper end of the rotating shaft 8 via a connecting boss 10. A motor (not shown) is connected to the lower end. A suction chuck 14 is fixed to the tip of the rotary shaft 8 to support the substrate 2 by suction. As described above, in this embodiment, the rotation supporting means for rotating the substrate 2 in a horizontally supported state is constituted by these configurations.
【００１６】このアンダープレート６の上方側には、ト
ッププレート７がアンダープレート６に支持された基板
２と所定間隔を隔てた上方位置に平行配置されている。
このトッププレート７は、図１の一点鎖線に示すよう
に、図示しない昇降装置により上下方向に移動自在であ
り、下降時には後述するリング状のスペーサ３４と嵌合
して、アンダープレート６，スペーサ３４と一体化した
状態で回転軸４回りに回転するようになっている。On the upper side of the under plate 6, a top plate 7 is arranged in parallel at a predetermined position above the substrate 2 supported by the under plate 6 at a predetermined distance.
The top plate 7 can be moved in the vertical direction by a lifting device (not shown) as shown by the alternate long and short dash line in FIG. It is adapted to rotate around the rotary shaft 4 in an integrated state with.
【００１７】また、アンダープレート６の上面には、回
転軸４を同心としたリング状の整流板１６が固定されて
おり、基板２やアンダープレート６と一体的に回転され
るようになっている。この整流板１６を設けることで、
図２に示すように、基板２の外周下面には、わずかな隙
間しか存在しなくなり、基板２を回転させた場合でも、
基板２の外周部付近で渦状の気流が発生するのを抑制す
ることができ、レジスト液や洗浄液などの処理液が基板
２の裏面側に回り込むなどの不都合を防止することがで
きる。A ring-shaped straightening plate 16 having the rotating shaft 4 as a concentric center is fixed to the upper surface of the under plate 6 so as to rotate integrally with the substrate 2 and the under plate 6. . By providing this straightening plate 16,
As shown in FIG. 2, only a small gap exists on the lower surface of the outer periphery of the substrate 2, and even when the substrate 2 is rotated,
It is possible to suppress the generation of a spiral airflow near the outer peripheral portion of the substrate 2, and it is possible to prevent the inconvenience that a processing liquid such as a resist liquid or a cleaning liquid flows around to the back surface side of the substrate 2.
【００１８】さらに、アンダープレート６の上面に吸着
支持された基板２および整流板１６を取り囲むように、
基板２とほぼ相似形の角型の処理液受け部材１８が固定
されて、基板２と近接した状態で一体的に回転可能とな
っている。Further, so as to surround the substrate 2 and the current plate 16 which are suction-supported on the upper surface of the under plate 6,
A rectangular processing liquid receiving member 18 having a shape substantially similar to that of the substrate 2 is fixed and can be integrally rotated in a state of being close to the substrate 2.
【００１９】図３は、処理液受け部材１８を示す斜視図
である。処理液受け部材１８には、同図に示すように、
上面側に基板２と同等以上の大きさの開口２０が形成さ
れており、この開口２０を介して基板２を搬入および搬
出することができるように構成されている。また、処理
液受け部材１８は、水平ひさし部２２と、傾斜案内部２
４と、水平案内部２６と、壁部２８とを有し、次のよう
に構成されている。すなわち、水平ひさし部２２は基板
２と平行に延設され、また当該水平ひさし部２２の外周
縁から裾広がり状に傾斜案内部２４が延設されている。
そして、この傾斜案内部２４の下端縁より水平外方に水
平案内部２６が延設されている。さらに、水平案内部２
６の外周縁から下方に壁部２８が立設され、アンダープ
レート６に固定される。このため、処理液を供給した
後、基板２を回転させると、図２に示すように、回転に
より発生した遠心力Ｆによって当該基板２から外周方向
に余剰の処理液Ｌが排出されるが、その処理液Ｌが直ち
に近接配置された処理液受け部材１８の水平ひさし部２
２および傾斜案内部２４で受けられ、水平案内部２６と
アンダープレート６との間を矢印で示す経路Ｒに沿って
壁部２８側に導かれる。そして、処理液受け部材１８の
隅部に設けられた排液口３２を介して水平外方に排出さ
れる。FIG. 3 is a perspective view showing the processing liquid receiving member 18. As shown in FIG.
An opening 20 having a size equal to or larger than that of the substrate 2 is formed on the upper surface side, and the substrate 2 can be loaded and unloaded through the opening 20. Further, the processing liquid receiving member 18 includes a horizontal eaves portion 22 and an inclined guide portion 2.
4, the horizontal guide portion 26, and the wall portion 28, and are configured as follows. That is, the horizontal eaves portion 22 is extended in parallel with the substrate 2, and the inclined guide portion 24 is extended from the outer peripheral edge of the horizontal eaves portion 22 in a skirt-spreading manner.
A horizontal guide portion 26 extends horizontally outward from the lower edge of the inclined guide portion 24. Furthermore, the horizontal guide 2
A wall portion 28 is erected downward from the outer peripheral edge of 6 and is fixed to the under plate 6. For this reason, when the substrate 2 is rotated after supplying the processing liquid, the excess processing liquid L is discharged from the substrate 2 in the outer peripheral direction by the centrifugal force F generated by the rotation, as shown in FIG. The processing solution L is immediately adjacent to the horizontal eaves 2 of the processing solution receiving member 18.
2 and the inclined guide portion 24, and is guided to the wall portion 28 side between the horizontal guide portion 26 and the under plate 6 along a path R indicated by an arrow. Then, the liquid is discharged horizontally outward through the liquid outlet 32 provided at the corner of the processing liquid receiving member 18.
【００２０】この処理液受け部材１８を取り囲むよう
に、アンダープレート６の上面の外周部にスペーサ３４
が固設されている。また、このスペーサ３４の上面側
で、トッププレート７はピンＰの嵌め合いによってスペ
ーサ３４に対して着脱自在となっており、トッププレー
ト７が下降してスペーサ３４に装着されると、これらア
ンダープレート６，トッププレート７及びスペーサ３４
とで基板２への処理液による所定の処理を行う閉空間Ｓ
が形成される。A spacer 34 is provided on the outer peripheral portion of the upper surface of the under plate 6 so as to surround the processing liquid receiving member 18.
Is fixed. Further, on the upper surface side of the spacer 34, the top plate 7 is attachable to and detachable from the spacer 34 by fitting the pins P. When the top plate 7 descends and is attached to the spacer 34, these under plates 6, top plate 7 and spacer 34
And the closed space S for performing a predetermined treatment with the treatment liquid on the substrate 2.
Is formed.
【００２１】このスペーサ３４の下面の所定位置には溝
３６が穿設されており（図２参照）、処理液受け部材１
８の排液口３２から排出された処理液が溝３６を介して
外部に流出される。スペーサ３４の溝３６の外周端部と
対向する位置には、断面形状が台形のトラップ部３８が
設けられている。このトラップ部３８は溝３６を介して
閉空間Ｓと連通される。また、トラップ部３８の下側に
は、アンダープレート６の半径方向内側に向かって低く
なる傾斜面４０が形成され、傾斜面４０の下端には、排
出穴４２が設けられている。したがって、基板２および
アンダープレート６が高速回転し、遠心力Ｆが付加され
ている間、基板２からの余剰の処理液Ｌが処理液受け部
材１８で受けられ、さらに溝３６を介してトラップ部３
８に流入するとともに、そのトラップ部３８で貯留され
る。そして、基板２およびアンダープレート６の回転数
が落ちて、遠心力Ｆが一定未満になる、あるいはゼロに
なったとき、トラップ部３８に貯留されていた処理液
が、排出穴４２から下方に流出する。A groove 36 is formed at a predetermined position on the lower surface of the spacer 34 (see FIG. 2), and the processing liquid receiving member 1 is formed.
The processing liquid discharged from the liquid discharge port 32 of No. 8 flows out to the outside through the groove 36. A trap portion 38 having a trapezoidal sectional shape is provided at a position facing the outer peripheral end of the groove 36 of the spacer 34. The trap portion 38 communicates with the closed space S via the groove 36. Further, an inclined surface 40 is formed on the lower side of the trap portion 38 so as to decrease inward in the radial direction of the under plate 6, and a discharge hole 42 is provided at the lower end of the inclined surface 40. Therefore, while the substrate 2 and the under plate 6 rotate at high speed and the centrifugal force F is applied, the excess treatment liquid L from the substrate 2 is received by the treatment liquid receiving member 18, and further the trap portion is passed through the groove 36. Three
8 and is stored in the trap portion 38. Then, when the rotational speeds of the substrate 2 and the under plate 6 drop and the centrifugal force F becomes less than a certain value or becomes zero, the processing liquid stored in the trap portion 38 flows downward from the discharge hole 42. To do.
【００２２】なお、図示を省略しているが、アンダープ
レート６のまわりには、環状のカップが配置されてお
り、上記のようにして排出された処理液を回収し、所定
の排液回収部に排出するようになっている。Although not shown in the drawing, an annular cup is arranged around the under plate 6 to collect the processing liquid discharged as described above, and a predetermined drain collecting part. It is designed to be discharged to.
【００２３】以上のように、この実施例によれば、処理
液受け部材１８を吸着チャック１４上の支持された基板
２の外周部に近接して配置しているため、基板２を回転
させた際に当該基板２から外周方向に飛散する処理液Ｌ
を確実に回収することができ、基板２への処理液Ｌの再
付着を効果的に防止することができる。また、処理液受
け部材１８により余剰の処理液Ｌを回収するようにして
いるので、処理液Ｌによるトッププレート７やスペーサ
３４の汚染を防止することができ、トッププレート７や
スペーサ３４のメンテナンスを簡素にすることができ
る。As described above, according to this embodiment, since the processing liquid receiving member 18 is arranged close to the outer peripheral portion of the substrate 2 supported on the adsorption chuck 14, the substrate 2 is rotated. At this time, the processing liquid L scattered from the substrate 2 in the outer peripheral direction
It is possible to reliably collect the liquid, and it is possible to effectively prevent the processing liquid L from reattaching to the substrate 2. Further, since the excess processing liquid L is collected by the processing liquid receiving member 18, it is possible to prevent the top plate 7 and the spacer 34 from being contaminated by the processing liquid L, and to maintain the top plate 7 and the spacer 34. Can be simplified.
【００２４】なお、上記実施例では、ほぼ密閉された空
間Ｓを形成する半密閉タイプの回転処理装置について説
明したが、完全に密閉された閉空間を形成する半密閉タ
イプやトッププレート７を設けないオープンタイプの装
置にも本発明を適用することができる。In the above embodiment, the semi-hermetic type rotation processing device for forming the substantially sealed space S has been described, but the semi-hermetic type or the top plate 7 for forming the completely sealed closed space is provided. The present invention can be applied to an open type device which does not exist.
【００２５】また、上記実施例では、処理液受け部材１
８を基板２の全周に沿って設けているが、必ずしも全周
に設ける必要はなく、上記不都合（基板２からの余剰の
処理液が基板２に再付着するという問題）が生じる位
置、例えば角型基板２では各隅部に対応して処理液受け
部材１８を設けるようにしてもよい。Further, in the above embodiment, the processing liquid receiving member 1
Although 8 is provided along the entire circumference of the substrate 2, it is not always necessary to provide it on the entire circumference, and the above-described inconvenience (problem that the excessive processing liquid from the substrate 2 redeposits on the substrate 2) occurs, for example The rectangular substrate 2 may be provided with the processing liquid receiving member 18 corresponding to each corner.
【００２６】また、上記実施例では、排液口３２を処理
液受け部材１８の四隅部に設けたが、排液口３２の配設
位置および個数はこの実施例に限定されるものではな
く、任意である。Further, in the above-described embodiment, the drainage ports 32 are provided at the four corners of the processing liquid receiving member 18, but the disposition position and the number of the drainage ports 32 are not limited to this embodiment. It is optional.
【００２７】また、上記では、処理液を供給した後に基
板を回転させているが、処理液を基板に供給しながら基
板を回転させる装置にも本発明を適用することができる
ことはいうまでもない。Further, in the above, the substrate is rotated after the processing liquid is supplied, but it goes without saying that the present invention can be applied to an apparatus for rotating the substrate while supplying the processing liquid to the substrate. .
【００２８】さらに、上記実施例では、角型基板２の場
合について説明したが、半導体ウエハのような略円形基
板に対して処理液を供給し、当該円形基板を回転させる
ことで所定の処理を行う回転処理装置にも、本発明を適
用することができる。Further, in the above-mentioned embodiment, the case of the rectangular substrate 2 has been described, but the processing liquid is supplied to a substantially circular substrate such as a semiconductor wafer and the circular substrate is rotated to perform a predetermined process. The present invention can be applied to a rotation processing device that performs the processing.
【００２９】[0029]
【発明の効果】請求項１の発明によれば、処理液受け手
段を回転支持手段上に支持された基板の外周部に近接し
て配置しているため、前記回転支持手段によって基板を
回転させた際に当該基板から外周方向に排出された処理
液を確実に回収することができ、その結果、処理液の基
板への再付着を防止することができる。According to the first aspect of the invention, since the processing liquid receiving means is arranged close to the outer peripheral portion of the substrate supported on the rotation supporting means, the substrate is rotated by the rotation supporting means. At this time, the processing liquid discharged from the substrate in the outer peripheral direction can be surely collected, and as a result, re-adhesion of the processing liquid to the substrate can be prevented.
【００３０】請求項２の発明によれば、基板および前記
処理液受け手段をともに角型形状に形成し、しかも前記
処理液受け手段の各隅部に処理液を外部に排出するため
の排液部を設けているので、当該処理液受け手段により
回収した処理液を前記排液部を介して外部に排出するこ
とができる。According to the second aspect of the present invention, both the substrate and the processing liquid receiving means are formed in a rectangular shape, and the processing liquid is discharged to the outside at each corner of the processing liquid receiving means. Since the portion is provided, the processing liquid collected by the processing liquid receiving means can be discharged to the outside through the liquid discharging portion.
【００３１】請求項３の発明によれば、処理液受け手段
を、基板を取り囲むように、当該基板の全周に沿って設
けているので、回転する基板から排出された処理液をよ
り確実に回収することができる。According to the third aspect of the present invention, the processing liquid receiving means is provided along the entire circumference of the substrate so as to surround the substrate, so that the processing liquid discharged from the rotating substrate can be more reliably discharged. Can be collected.
【００３２】請求項４の発明によれば、上部回転板を回
転支持手段上に支持された基板の上面と所定の間隔を隔
てて平行に配設しているが、回転する基板から排出した
処理液を処理液受け手段によって受けるようにしている
ので、前記上部回転板が処理液により汚染させるのを効
果的に防止することができる。According to the fourth aspect of the present invention, the upper rotary plate is arranged in parallel with the upper surface of the substrate supported on the rotation supporting means at a predetermined interval, but the process discharged from the rotating substrate. Since the treatment liquid is received by the treatment liquid receiving means, it is possible to effectively prevent the upper rotary plate from being contaminated with the treatment liquid.
【図１】この発明にかかる回転処理装置の一実施例を示
す断面図である。FIG. 1 is a sectional view showing an embodiment of a rotation processing device according to the present invention.
【図２】図１の装置の部分拡大図である。2 is a partially enlarged view of the device of FIG.
【図３】処理液受け部材を示す斜視図である。FIG. 3 is a perspective view showing a processing liquid receiving member.
【図４】従来の回転処理装置における余剰の処理液の飛
散の様子を示す模式平面図である。FIG. 4 is a schematic plan view showing how the excess processing liquid is scattered in the conventional rotation processing apparatus.
２ 基板 ６ アンダープレート ７ トッププレート １４ 吸着チャック １８ 処理液受け部材 ３２ 排液口 Ｌ 余剰の処理液 2 Substrate 6 Under plate 7 Top plate 14 Adsorption chuck 18 Processing liquid receiving member 32 Discharge port L Excess processing liquid
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 21/304 ３５１ 21/308 Ｇ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Office reference number FI technical display location H01L 21/304 351 21/308 G
Claims (4)
た処理液をその表面全体に拡散流動させて、前記基板に
所定の処理を施す回転処理装置において、 基板の外形と同等以上の大きさを有し、基板を水平支持
した状態で回転させる回転支持手段と、 前記回転支持手段上に支持された基板の外周部に近接し
て配置され、前記回転支持手段と一体に回転するととも
に、前記基板から外周方向に飛散した処理液を受ける処
理液受け手段と、を備えたことを特徴とする回転処理装
置。1. A rotation processing apparatus for rotating a substrate to cause a processing liquid supplied to the substrate to diffuse and flow over the entire surface of the substrate to perform a predetermined process on the substrate, the size being equal to or larger than the outer shape of the substrate. And a rotation supporting means for rotating the substrate in a state of horizontally supporting the substrate, and the rotation supporting means are disposed in proximity to the outer peripheral portion of the substrate supported on the rotation supporting means, and rotate integrally with the rotation supporting means, And a processing liquid receiving means for receiving the processing liquid scattered from the substrate in the outer peripheral direction.
もに角型形状であり、しかも前記処理液受け手段の各隅
部に処理液を外部に排出するための排液部が設けられた
請求項１記載の回転処理装置。2. The substrate and the processing liquid receiving means are both rectangular in shape, and a drainage portion for discharging the processing liquid to the outside is provided at each corner of the processing liquid receiving means. The rotation processing device according to 1.
囲むように、前記基板の全周に沿って設けられた請求項
１または２記載の回転処理装置。3. The rotation processing apparatus according to claim 1, wherein the processing liquid receiving means is provided along the entire circumference of the substrate so as to surround the substrate.
と所定の間隔を隔てて平行に配設されるとともに、基板
の外形と同等以上の大きさを有し、かつ、回転支持手段
と一体に回転される上部回転板を、さらに備えた請求項
１ないし３のうちのいずれかに記載の回転処理装置。4. The rotation support means is disposed in parallel with the upper surface of the substrate supported on the rotation support means at a predetermined interval and has a size equal to or larger than the outer shape of the substrate. The rotation processing device according to claim 1, further comprising an upper rotating plate that is integrally rotated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP06137224A JP3102831B2 (en) | 1994-06-20 | 1994-06-20 | Rotary processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP06137224A JP3102831B2 (en) | 1994-06-20 | 1994-06-20 | Rotary processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH081064A true JPH081064A (en) | 1996-01-09 |
| JP3102831B2 JP3102831B2 (en) | 2000-10-23 |
Family
ID=15193686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP06137224A Expired - Fee Related JP3102831B2 (en) | 1994-06-20 | 1994-06-20 | Rotary processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3102831B2 (en) |
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