JPH07235800A - Part carrying device and part carrying method - Google Patents

Abstract

PURPOSE:To enable easy and rapid carrying of a proper part by inspecting an attraction position of a part by a part holding means and a configuration of a constituent element projecting to a side of a part by using a single imaging means. CONSTITUTION:Plane transmission light and side transmission light of a part W attracted to a part holding means 1 are introduced to a single imaging means 4, and plane transmission image and side transmission image of the part W are picked up and image processing is performed for part inspection. When it is judged as defective as a result of inspection, the part is not carried to an operational position 300 but discharged. Meanwhile, when it is judged as normal, error of an attraction position obtained by the image processing is corrected and the part is carried to the operational position 300 at a proper position.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrying device and a carrying method for electronic parts having terminals protruding from the side surface, for example.
More specifically, the present invention relates to a component transfer device and a component transfer method for inspecting the posture and shape of a transported component before or during transportation and arranging only normal components in a proper posture at a destination.

[0002]

2. Description of the Related Art For example, in an electronic component automatic mounting apparatus for automatically mounting electronic components on a printed circuit board, a mounting head sucks electronic components from a component supply means such as a tape feeder or a multi-stage tray feeder, and a mounting table is mounted. It is conveyed to the printed circuit board arranged above and mounted at a predetermined mounting position.

In such an electronic component automatic mounting apparatus, when there is an error in the component suction position of the mounting head, the error directly becomes the displacement of the mounting position on the printed circuit board. Therefore, it is necessary to detect the error of the suction posture with respect to the mounting head in advance and correct the operation of the mounting head based on the detection result. For this reason,
Some of them have an inspection station between the component supply position and the printed circuit board supply position that inspects the component suction posture of the mounting head.The inspection station images the component suction state and uses an image processing device. Error in the component suction posture with respect to the reference of the mounting head.

The inspection of the component suction posture using such an image processing apparatus will be described in more detail. The mounting head is arranged at a certain upper position facing the image pickup camera, and the electronic component sucked by the mounting head is viewed from above. At the same time as irradiating light, the light transmitted around the electronic component is captured by an imaging camera, converted into an electrical signal, and input to an image processing device. The planar transmission image of the electronic component thus captured is compared with the reference posture by the image processing device to obtain the error of the suction posture.

In order to manufacture a high-quality electronic circuit with a good yield, the component suction posture of the mounting head is corrected as described above, and the sucked electronic component is defective.
In particular, it is necessary to confirm that the terminals are not bent or twisted. For example, looking at an electronic component called a QFP (Quad Flat Pakage), a large number of terminals are projected from the side surface of the component body, and the tips of the terminals must be positioned at the contacts formed on the printed board.

However, the terminals protruding from these side surfaces may be bent or twisted due to shock or vibration received during transportation. If there is even one terminal that is bent or twisted in this way, the defective terminal does not come into contact with the board contact even if the mounting head is mounted on a printed circuit board by correcting the component suction posture, and as a result, The entire electronic circuit becomes a defective product, which causes a decrease in yield.

When such bending or twisting of the terminal occurs in the lateral direction, it can be inspected also by the plane transmission image of the electronic component taken in when inspecting the component suction posture. However, if the terminal is bent or twisted in the vertical (up and down) direction, an imaging camera is placed further to the side of the electronic component to capture an image viewed from the side of the terminal, or a laser measuring instrument is used. Using (up or down)
Had to scan the terminal from.

[0008]

As described above, for example, prior to mounting an electronic component, which is picked up by a mounting head, on a printed circuit board, the picking posture of the component and the bending or twisting of the terminal protruding from the side surface of the component body are considered. In order to inspect for the presence or absence of a component, a means or method for obtaining a plane transmission image of a component and a side transmission image, and sequentially performing image processing to determine pass / fail has been known. Since the imaging camera is required, the equipment cost becomes high. Further, adjustment work such as optical axis alignment and focus adjustment is required for each image pickup camera, and the work is complicated.

Japanese Unexamined Patent Publication (Kokai) No. 5-235132 solves such a problem and simultaneously captures a plane reflection image 91 and an end face reflection image 92 of an IC lead by a single image pickup device.
A bending inspection device for a C lead is disclosed (see FIG. 7). In this inspection apparatus, light reflected by the plane of the IC lead is made incident on the image pickup apparatus, a reflecting mirror is arranged on the extension line of the IC lead, and the light reflected from the end surface of the IC lead is imaged through this reflecting mirror. It is configured to enter the device.

However, the IC lead bending inspection apparatus disclosed in the above publication has a fatal drawback that it requires a long time for image processing. That is, in order to recognize the image captured by the imaging device and inspect the quality of the lead based on the image, the image processing device sets an image processing area called a window 93 and recognizes the image. When this window 93 is set so as to include a plurality of leads, it is necessary to recognize the image in the gap between the leads, and the processing time becomes long.
Therefore, usually, the image is recognized by opening the window 93 for each lead.

However, as shown in FIG. 7, when a plane reflection image 91 and an end face reflection image 92 are taken in for each lead arranged on each side of the IC package and the quality of the lead is inspected from these images, Those images 91, 92
It is necessary to apply a window 93 to each lead appearing in the window for image recognition, and the recent I
C has a drawback that it takes too much time to inspect all the leads.

When the means or method for inspecting the bending or twisting of the terminal protruding from the side surface of the component body by the laser measuring device is adopted, the image processing device and the laser measuring device must be equipped. Since all of these are large and expensive devices, the equipment cost is high in this case as well, and a wide installation space is required.

The present invention has been made in view of the problems of the prior art as described above.
The purpose of the present invention is to easily and quickly inspect the shapes of constituent elements that project from the side surface of a part with a single imaging means so that only normal parts can be efficiently conveyed in a proper posture. And Furthermore, in the device of the present invention,
The purpose is to reduce the equipment cost required for these inspections and to save space.

[0014]

In order to achieve the above-mentioned object, a parts conveying apparatus of the present invention is characterized by having the following constitution. A component holding means for arranging the component sucked by the component supply unit at a predetermined image pickup position and transporting it to a predetermined work position or discharge position. Light source for obtaining plane transmitted light and side face transmitted light of the component arranged at the image pickup position Single image pickup means for injecting the plane transmitted light of the component arranged at the position Reflecting means for guiding the side transmitted light of the component arranged at the image pickup position to the image pickup means Plane transmitted light of the component captured by the image pickup means by the plane of the component The transmission shape is image-recognized, and the error of the suction posture with respect to the reference posture of the component is obtained, and the plane transmission light and the side transmission light of the component captured by the image pickup means project the plane of the component existing on the side surface of the component. Image processing means for recognizing the transparent shape of the side surface and the side surface, and determining the quality of the constituent element. The holding means is controlled so that the article is conveyed to the working position, or the part whose shape of the component projecting on the side surface of the part is determined to be defective by the image processing means is conveyed to the discharge position. Control means

Here, it is assumed that the light source forms the first side surface transmitted light and the second side surface transmitted light which is orthogonal to the side surface transmitted light with respect to the adsorption component, and the reflecting means converts the first side surface transmitted light. The configuration may include a first reflecting unit that guides the second side transmitted light to the image capturing unit and a second reflecting unit that guides the second side surface transmitted light to the image capturing unit.

The component carrying method of the present invention is characterized by including the following steps. A component suction process for sucking and picking up a component from the component supply unit by the component holding unit Arranging process for placing the sucked component at a predetermined image pickup position Plane transmitted light of the component placed at the image pickup position is incident on a single image pickup unit An image pickup step of reflecting the side surface transmitted light of the component and entering the image pickup means. The plane transmitted light of the component captured by the image pickup step is used to image-recognize the plane transmitted shape of the component, and the suction posture of the component with respect to the reference posture. In addition to obtaining the error, the plane-transmitted light and the side-transmitted light of the component captured by the image pickup means are used to image-recognize the plane and side transmission shapes of the component projecting on the side surface of the component, and whether the component is good or bad. Image processing step to make a judgment Correct the posture error of the part obtained in the image processing step and convey the part to a predetermined work position, or project to the side part Conveying process that conveys the parts whose existing component shapes are defective in the image processing process to the specified discharge position

Further, in the above-described component carrying method, when the error of the suction posture with respect to the reference posture of the component obtained in the image processing step exceeds the preset allowable error, the error of the suction posture is first corrected. After placing the component at the image pickup position, the plane transmitted light of the component is again incident on the single image pickup means, and the side transmitted light of the component is reflected and made incident on the image pickup means. It is preferable to image-recognize the transmission shapes of the planes and the side surfaces of the constituent elements that project from the side surface portion of the component by the plane transmitted light and the side surface transmitted light, and determine the quality of the constituent elements.

[0018]

According to the present invention having such a configuration, the inspection necessary for realizing the proper conveyance of the component is performed by the image processing, and the plane transmitted light and the side transmitted light of the component adsorbed by the component holding means are detected. Is guided to a single image pickup means, and a plane transmission image and a side transmission image of the suction component are image-recognized from these transmitted lights. Then, the error of the suction posture of the component is obtained from the plane transmission image, and the error is corrected. Furthermore, the planar transmission image and the side transmission image are image-recognized by paying attention to the component portion projecting on the side surface of the component, and the quality of the component is determined.

At this time, the side-face transmission image appears as a single image in which the constituent elements lined up on one side surface of the part are overlapped, so that it is only necessary to open the image for window recognition and to reduce the number of processings. The quality of the element can be determined. That is, when a bent or twisted component is present on the side surface, the defective component is projected from the overlapping images, and thus it can be immediately determined to be defective. As a result of the determination, when the component is determined to be defective, the component is ejected without being conveyed to the work position.
As a result, it is possible to prevent the defective part from being transferred to the work position. On the other hand, when the constituent elements are normal, the component is conveyed to the work position in the proper posture with the error corrected as described above.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. This embodiment shows an example in which the component transfer device of the present invention is applied to an electronic component automatic mounting device, such as a QFP or the like in which terminals (components) Wb project from the sides of a rectangular component body Wa in all directions. The following description will be given with the electronic component W (see FIGS. 2 and 3) as a conveyance target.

FIG. 1 is a block diagram showing the outline of a parts conveying apparatus according to this embodiment. As shown in the figure, in the component carrying device of this embodiment, the mounting head (component holding means) 1 is
The electronic component W is picked up by the component supply unit 100, and the imaging position 20
After carrying out a predetermined inspection at 0, a normal electronic component is carried to a predetermined position (working position) 300 on the printed board P for mounting work, while a defective part is carried to a discharge position 400, The parts are discarded on the discharge tray 2 provided at the same position.

The component supply unit 100 is provided with a component supply device 3 including a tape feeder and a multi-stage tray feeder. For example, the electronic parts W such as QFP to be conveyed in this embodiment are supplied by a multi-stage tray feeder. A mounting head 1 as a component holding means includes a head body 10 that is movable in X-Y directions (left and right in FIG. 1 and a direction perpendicular to the plane of the drawing), and a spindle 11 that is vertically movable and rotatable about an axis. The suction nozzle 12 is attached to the tip of the spindle 11. Suction nozzle 12
Touches the central portion of the upper surface of the electronic component W and adsorbs the portion.

At the tip of the spindle 11 (that is, at a position slightly above the base end of the suction nozzle 12), the electronic component (hereinafter also referred to as a suction component) W sucked by the suction nozzle 12 is transmitted through the plane. First light source 1 for obtaining light
3 is provided. The first light source (the same applies to the second and third light sources described later) 13 is, for example, an issuing diode (LE).
D) or a white fluorescent tube can be used. In this embodiment, a plurality of light emitting diodes are used as the first light source 13. A diffusion plate 14 is provided between the first light source 13 and the tip of the suction nozzle 12. The diffuser plate 14 scatters the light emitted from the first light source 13, forms a surface light source having uniform brightness over the entire surface, and irradiates the upper surface of the suction component W and its periphery.

Below the image pickup position 200, an image pickup device (image pickup means) 4 for picking up an image of the suction component W is provided. The imaging device 4 includes an imaging camera 40 and a reflection plate 41 that guides the image of the suction component W to the light receiving section 40a of the imaging camera 40.
And a lens barrel 42. Of course, the image of the suction component W can be made incident on the image pickup camera 40 without going through the reflection plate 41, but in the present embodiment, in order to reduce the device size in the vertical direction, the reflection plate 41 is used. It guides the image of W laterally. A CCD camera, for example, can be used as the imaging camera 40.

Above the image taking-in port 4a formed in the image pickup device 4, a rectangular light guide tube 5 is arranged with its axis oriented in the vertical direction. As shown in FIGS. 2 and 3, second and third light sources 51 and 52 and first and second reflecting mirrors (first and second reflecting means) 53 and 54 are provided on the inner wall of the light guide tube 5, respectively. Each is positioned and provided on the same horizontal plane. The suction component W is
It is arranged on the horizontal plane inside the light guide tube 5 and is inspected for the suction posture and the quality of the terminals. That is, inside the light guide tube 5, the substantially central portion of the horizontal plane where the second and third light sources 51 and 52 and the first and second reflecting mirrors 53 and 54 are positioned is the imaging position 200.

The second light source 51 irradiates light from the side of the suction component W arranged at the image pickup position 200 to obtain light (first side transmitted light) that passes through the periphery of one side surface of the component. It is for. The third light source 52 is for obtaining light (second side surface transmitted light) that is transmitted around the other side surface of the suction component W orthogonal to the side surface. Each of the second and third light sources 51 and 52 uses a plurality of light emitting diodes, and the second light sources 51 are arranged side by side in the horizontal direction on one surface of the inner wall of the light guide tube 5. The third light source 52 is arranged side by side in the horizontal direction on another surface adjacent to the surface on which the second light source 51 is provided. Diffusion plates 55 and 56 are installed beside the light sources 51 and 52, respectively.
The light emitted from is scattered to form a surface light source with uniform brightness over the entire surface and illuminate it in the horizontal direction.

The first reflecting mirror 53 is arranged horizontally on the surface facing the above-mentioned second light source 51.
On the other hand, the second reflecting mirror 54 is provided on the surface facing the third light source 52,
They are arranged horizontally. Each of these reflecting mirrors 53,
Reference numeral 54 is arranged at an angle of about 45 ° with respect to the horizontal plane, and is adjusted so as to guide the light incident from the horizontal direction to the image capturing port 4a of the image pickup device 4.

The output of the image pickup camera 40 is connected to an image processing device (image processing means) 6. The image processing device 6 receives the image pickup signal from the image pickup camera 40, performs a predetermined calculation, recognizes the image of the suction component W, and determines the suction posture of the suction component W with respect to the reference posture based on the recognized image. While determining the error, the quality of the terminal shape protruding on the side surface of the same part W is determined.

Further, the output of the image processing device 6 is connected to a control device (control means) 7. The control device 7 controls the operation of the mounting head 1. That is, the control device 7
Operates the mounting head 1 based on an operation program that is input in advance, and corrects the error in the suction attitude input from the image processing device 6 to correct the suction component W.
The mounting head 1 is controlled so that the mounting head 1 is mounted on the predetermined position 300 of the printed circuit board P. On the other hand, when the determination result indicating that the terminal shape of the suction component W is defective is input from the image processing device 6, the mounting head 1 is moved to the discharge position 400,
The defective part is stored in the discharge tray 2.

Next, an embodiment of a component carrying method using the above-mentioned apparatus will be described. First, the mounting head 1 is moved to a position above the component supply device 3 arranged in the component supply unit 100, and the spindle 11 is lowered to move the component supply device 3
The central portion of the upper surface of the upper electronic component W is sucked by the suction nozzle 12 (component suction step). At this time, there are variations in the supply position and the supply posture of the component by the component supply device (multi-stage tray feeder) 3, and therefore, the suction nozzle 12 may not be able to accurately suck the central portion of the upper surface of the electronic component W in a proper posture. However, those errors will be corrected in a later step.

After sucking the electronic component W by the suction nozzle 12, the spindle 11 is raised and the mounting head 1 is moved in the horizontal direction to convey the suction component W above the image pickup position 200. Then, the spindle 11 is lowered and the electronic component W is arranged at the imaging position 200 (arrangement step). When the electronic component W is placed at the image pickup position 200, the first to third light sources 13, 51 and 52 emit light. Then,
The light from each light source is scattered by the diffusion plates 14, 55, and 56 to become a surface light source with uniform brightness, and is applied to the adsorption component W.
Then, the light emitted from the first light source 13 irradiates the upper surface of the suction component W, passes through the periphery thereof, and enters the image capturing port 4a of the image pickup device 4 as plane transmitted light.

The light emitted from the second and third light sources 51 and 52 respectively illuminates the side surfaces of the component body Wa and the terminal Wb of the suction component W, and also penetrates the peripheries of the component body Wa and the terminals Wb, respectively. It is incident on the first and second reflecting mirrors 53 and 54 as the side surface transmitted light. Each reflecting mirror 53, 54
Reflects the incident side transmitted light at a substantially right angle and guides it to the image capturing port 4 a of the image pickup device 4. The plane-transmitted light and the first and second side-face transmitted lights thus entering the image capturing port 4a enter the light receiving section 40a of the image pickup camera 40 via the reflection plate 41 in the lens barrel 42 (imaging step). ). In this way, when the plane transmitted light and the first and second side transmitted light are made incident on the single imaging camera 40, the plane transmitted image and the side transmitted image of the suction component W can be captured on a single screen. You can

The image pickup camera 40 converts each of the transmitted transmitted light into an image signal and outputs the image signal to the image processing device 6. The image processing device 6 performs image processing on the image signal input from the imaging camera 40, and recognizes the planar transmission image of the suction component W, the side transmission images, and a single screen (image processing step). FIG. 4 shows an example of the image of the suction component recognized by the image processing apparatus. In this way, the flat transmission image 61 and the first and second side transmission images 62, 63 of the suction component W are formed on the single screen 60, and then the suction nozzle is formed based on these images 61, 62, 63. The attitude of the electronic component W attracted to the terminal 12 is compared with the reference attitude to calculate the error of the attitude, and the terminal W
The presence or absence of bending or twisting of b is determined.

The attitude error can be obtained as follows using the plane transmission image 61. That is, in the image processing device 6, the suction nozzle 12 accurately sucks the central portion of the upper surface of the electronic component W, and a proper posture when the electronic component W is mounted on the printed circuit board P is stored in advance as a reference posture. When the suction position of the suction nozzle 12 is deviated, an error between the reference posture and the XY direction appears in the planar transmission image 61. Further, when the electronic component W is sucked by the suction nozzle 12 in a state of being slightly rotated on the horizontal plane, an angle error in the θ direction appears between the electronic device W and the reference posture in the plane transmission image 61. Therefore, the error relating to the posture of the suction component W is calculated based on the plane transmission image 61 and output to the control device 7.

If the angle error in the θ direction from the reference posture is too large, the main body Wa portion of the electronic component W and the terminal Wb portion will overlap each other in the side surface transmission images 62 and 63, and the terminal Wb of the terminal Wb. The outline becomes unclear. Therefore,
The limit angular error in which the contour of the terminal Wb appears is previously input to the image processing device 6 or the control device 7 as an allowable error, and when the detected angular error of the suction component W exceeds this allowable error, The controller 11 controls the spindle 11 to correct the angle error of the suction component W in the θ direction. Then, after correcting the angle error in the θ direction,
The plane transmitted light of the suction component W and the first and second side transmitted light are made incident on the imaging camera 40 again, and the plane of the suction component W is displayed on the single screen 60 by the image processing device 6 based on these transmitted light. It is preferable to form the transmission image 61 and the first and second side transmission images 62 and 63.

When the terminal Wb of the suction component W is bent or twisted in the lateral direction, the bent or twisted image is shown in the plane transmission image 61 as shown in an enlarged view in FIG. 5 (a).
Therefore, the window 6 is attached to the terminal portion of the plane transmission image 61.
Image recognition is performed by multiplying by 4, and the presence or absence of bending or twisting is inspected. Further, when the terminal Wb of the suction component W is bent or twisted in the vertical direction, for example, as shown by an imaginary line in FIG. Abnormalities appear in the side surface transmission images 62 and 63. Therefore, a window 64 is applied to the terminal portions in the first and second side surface transmission images 62 and 63 to perform image recognition,
The presence or absence of such an abnormality is detected.

As described above, the quality of the suction component W can be determined by inspecting the presence / absence of abnormality by paying attention to the terminal portions of the plane transmission image 61 and the side transmission images 62, 63. The pass / fail judgment result is output to the control device 7. When the control device 7 inputs a determination result indicating that the component is a defective component from the image processing device 6, the control device 7 removes the mounting head 1 from the ejection position 400.
And the suction component W is discarded in the discharge tray 2. On the other hand, when the determination result indicating that the component is normal is input, the rotation of the spindle 11 corrects the angle error in the θ direction of the suction component W, and the previously input transport position is set in the XY direction. Only the error is corrected, and the mounting head 1 is controlled so that the suction component W is transported to the predetermined position 300 of the printed circuit board P (transport process).

FIG. 6 is a bottom sectional view showing another embodiment of the present invention, and corresponds to FIG. 3 described above. The component transfer device shown in the figure is a light source for obtaining side transmitted light.
Only the second light source 51 (or the third light source 52) described in the previous embodiment is used, and the first reflecting mirror 53 (second reflecting mirror 5) is used as a reflecting means for guiding the side transmitted light to the image pickup means.
4 may be used).

When the component carrying method of the present invention is carried out by using this apparatus, in the above-described image pickup step, first, the plane transmitted light of the suction component W and the side transmitted light of one side surface are taken into the image pickup apparatus 4. The attitude error of the suction component W is calculated based on the images obtained by these transmitted lights, and the presence or absence of bending or twisting of the terminal shown in the side surface transmission image is determined. Then, the spindle 11 is rotated by about 90 ° so that the other side surface adjacent to the second light source 51
The side-face transmitted light relating to the side face is captured by the image pickup device 4, and it is determined whether or not the terminal is bent or twisted in the side-face transmitted image.

Even with such a configuration, when picking up an image of the suction component W, the mounting head (component holding means) 1 holds the suction component W in parallel with the image pickup device (image pickup means) 4 and sucks it within the holding plane. The structure does not have to be complicated, since only the parts need to be rotated. This is the same as the conventional one.
When the respective surfaces (the flat surface and the two side surfaces) of (1) are arranged in parallel with the image pickup device 4 and the images are picked up, the turning operation of the suction component W is further required, and the mounting head (component holding means) 1 is complicated and It becomes large.

The present invention is not limited to the above embodiment. That is, the field of application of the present invention is not limited to the electronic component mounting device, but can be used for various component transporting devices that require inspection of suction components during transportation. Even when used in an electronic component mounting apparatus, the transport target is not limited to the QFP, but an electronic component having terminals protruding only on two symmetrical side surfaces such as an SOP (Small Outline Package) can be the transport target. In this case, a required side image can be obtained with one side transmitted light, so that it is only necessary to provide a pair of light sources and a reflecting means on the side of the imaging position.

[0042]

As described above, according to the present invention, when a predetermined inspection is performed on a component sucked by the component holding means, the plane transmitted light and the side transmitted light of the component are guided to a single image pickup means. Therefore, it is possible to easily and quickly determine the quality of the component that is present in the side surface portion of the component from the plane transmission image and the side surface transmission image of the component. At the same time, it is possible to correct the error of the suction posture with respect to the reference posture obtained from the plane transmission image of the component, and efficiently convey only the normal component in the proper posture. Moreover, according to the component carrier of the present invention, the equipment cost is low and the space can be saved.

[Brief description of drawings]

FIG. 1 is a configuration diagram showing an outline of a component transfer device according to an embodiment of the present invention.

FIG. 2 is an enlarged vertical cross-sectional view showing a peripheral portion of an image pickup position of the apparatus.

3 is a cross-sectional view taken along the line AA of FIG.

FIG. 4 is a plan view showing an example of an image recognized by an image processing means of the apparatus.

5 is an enlarged view of a terminal portion of the image shown in FIG.

FIG. 6 is a bottom cross-sectional view showing another embodiment of the present invention.

FIG. 7 is a plan view showing a conventional technique in which a plane image and an end face image of an IC lead are captured in one screen.

[Explanation of symbols]

 1: Mounting head 2: Ejection tray 3: Component supply device 4: Imaging device 5: Light guide cylinder 6: Image processing device 7: Control device 10: Head body 11: Spindle 12: Suction nozzle 13: First light source 14: Diffusion Plate 40: Imaging camera 41: Reflector 42: Lens barrel 51: Second light source 52: Third light source 53: First reflector 54: Second reflector 55: Diffuser 56: Diffuser 100: Component supply unit 200: Imaging position 300: Work position 400: Discharge position

Claims (4)

[Claims] 1. A component holding means for arranging a component adsorbed by a component supply unit at a predetermined image pickup position and transporting the component to a predetermined work position or a discharge position, and plane transmitted light and a side surface of the component arranged at the image pickup position. A light source for obtaining transmitted light; a single image pickup means for making plane transmitted light of the component arranged at the image pickup position incident; and a reflecting means for guiding side face transmitted light of the component arranged at the image pickup position to the image pickup means. The plane-transmitted light of the component captured by the image-capturing unit is used to image-recognize the plane-transparent shape of the component, the error of the suction posture with respect to the reference posture of the component is obtained, and the plane-transmitted plane of the component captured by the image-capturing unit By the light and the transmitted light from the side surface, the transparent shape of the plane and the side surface of the component projecting on the side surface portion of the component is image-recognized, and the quality of the component is judged. The image processing means and the component orientation error determined by the image processing means are corrected to convey the component to the work position, or the component existing on the side surface of the component is defective by the image processing means. And a control unit configured to control the holding unit so that the component determined to be transported to the discharge position. 2. The component carrying device according to claim 1, wherein the light source forms first side surface transmitted light and second side surface transmitted light orthogonal to the side surface transmitted light as the side surface transmitted light of the component. The reflecting means comprises a first reflecting means for guiding the first side surface transmitted light to the image capturing means and a second reflecting means for guiding the second side surface transmitted light to the image capturing means. Characteristic parts transfer device. 3. A component adsorbing step of adsorbing and picking up a component from a component supply section by a component holding means, an arranging step of arranging the adsorbed component at a predetermined image pickup position, and a plane transmitted light of the component placed at the image pickup position. Is incident on a single image pickup means and the side surface transmitted light of the component is reflected by the image pickup step of reflecting the side transmitted light to the image pickup means. The shape is image-recognized, the error of the suction posture with respect to the reference posture of the component is obtained, and the plane transmitted light and the side transmitted light of the component captured by the image pickup means are used to project the component existing on the side surface of the component. The image processing step of recognizing the transparent shapes of the plane and the side surface to judge the quality of the constituent element, and correcting the posture error of the component obtained in the image processing step A component for transporting the product to a predetermined work position, or a component for which the shape of the component existing on the side surface is determined to be defective in the image processing process, is transported to a predetermined discharge position. Transport method. 4. The component transfer method according to claim 3, wherein when the error of the suction posture with respect to the reference posture of the component obtained in the image processing step exceeds a preset allowable error, the error of the suction posture is first calculated. After correcting the component and arranging the component at the image capturing position, the plane transmitted light of the component is incident on the single image capturing means again, and the side transmitted light of the component is reflected and incident on the image capturing means. By the plane transmitted light and the side transmitted light of these parts, the parts are characterized by image-recognizing the transmission shapes of the planes and the side surfaces of the constituent elements that project and exist on the side surface portions of the parts, and judge the quality of the constituent elements. Transport method.