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JPH0716870B2 - Polishing equipment - Google Patents

Polishing equipment

Info

Publication number
JPH0716870B2
JPH0716870B2 JP62179837A JP17983787A JPH0716870B2 JP H0716870 B2 JPH0716870 B2 JP H0716870B2 JP 62179837 A JP62179837 A JP 62179837A JP 17983787 A JP17983787 A JP 17983787A JP H0716870 B2 JPH0716870 B2 JP H0716870B2
Authority
JP
Japan
Prior art keywords
workpiece
drive mechanism
polished
polishing apparatus
elastic body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP62179837A
Other languages
Japanese (ja)
Other versions
JPS6427852A (en
Inventor
勇藏 森
秀治 堀川
信顯 小西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koyo Seiko Co Ltd
Original Assignee
Koyo Seiko Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koyo Seiko Co Ltd filed Critical Koyo Seiko Co Ltd
Priority to JP62179837A priority Critical patent/JPH0716870B2/en
Publication of JPS6427852A publication Critical patent/JPS6427852A/en
Publication of JPH0716870B2 publication Critical patent/JPH0716870B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Description

【発明の詳細な説明】 <産業上の利用分野> 本発明は、微細粉末砥粒を一様に分散した懸濁液中に浸
漬させた被加工物の被研磨面に、回転弾性体を近接させ
て、この両者の間で前記懸濁液を流動させることにより
前記被加工物の被研磨面を加工する構成の研磨装置に関
する。
DETAILED DESCRIPTION OF THE INVENTION <Industrial field of application> The present invention provides a rotating elastic body in the vicinity of a surface to be polished of a work piece immersed in a suspension in which fine powder abrasive grains are uniformly dispersed. The polishing apparatus is configured to process the surface to be polished of the workpiece by causing the suspension to flow between the two.

<従来の技術> 近年、完全な表面を得る目的として、EEM(Elastic Emi
ssion Machining)と称する極微小量弾性破壊現象を利
用した加工技術を実現する研磨装置が提案されている。
<Prior Art> In recent years, EEM (Elastic Emi
ssion Machining) has been proposed as a polishing device that realizes a processing technique that utilizes the extremely small amount of elastic fracture phenomenon.

この研磨装置を第3図および第4図に示し、これらの図
を参照して説明する。
This polishing apparatus is shown in FIGS. 3 and 4 and will be described with reference to these figures.

図において、符号1は鉛直方向に上下動自在なNC主軸ヘ
ッドで、このNC主軸ヘッド1にはモータ2が十字ばね3
で斜めに懸垂されている。
In the figure, reference numeral 1 is an NC spindle head that is vertically movable in a vertical direction. A motor 2 is attached to the NC spindle head 1 and a cross spring 3 is provided.
It is suspended diagonally.

このモータ2の出力軸4の軸端にはポリウレタン球など
の回転弾性体5が取り付けられている。
A rotary elastic body 5 such as a polyurethane ball is attached to the shaft end of the output shaft 4 of the motor 2.

符号6は微細粉末砥粒を一様に分散した懸濁液7が収容
された容器で、容器6の底部には被加工物8が固定され
ているとともに、前記の回転弾性体5が浸漬されてい
る。
Reference numeral 6 is a container in which a suspension 7 in which fine powder abrasive grains are uniformly dispersed is housed. A workpiece 8 is fixed to the bottom of the container 6 and the rotary elastic body 5 is dipped therein. ing.

この容器6はX方向用エアスライド9により駆動される
Xテーブル10に固定されており、このXテーブル10はY
方向エアスライド11により駆動されるYテーブル12に固
定されている。
The container 6 is fixed to an X table 10 driven by an air slide 9 for the X direction.
It is fixed to a Y table 12 driven by a directional air slide 11.

Xテーブル10とYテーブル12とにより被加工物8が容器
6とともに水平方向に送られるようになっている。
The X table 10 and the Y table 12 allow the workpiece 8 to be fed in the horizontal direction together with the container 6.

符号13は被加工物8の被研磨面8aと回転弾性体5との近
接の程度を調節する荷重支持棒である。
Reference numeral 13 is a load supporting rod for adjusting the degree of proximity between the surface 8a to be polished of the workpiece 8 and the rotary elastic body 5.

次に動作を説明する。Next, the operation will be described.

モータ2により回転弾性体5を回転させながら、被加工
物8をXテーブル10,Yテーブル12でX−Y方向に任意に
送り、回転弾性体5に被加工物8を近接させる。
While rotating the rotary elastic body 5 by the motor 2, the workpiece 8 is arbitrarily sent in the XY directions by the X table 10 and the Y table 12 to bring the workpiece 8 close to the rotary elastic body 5.

この回転弾性体5の回転により、第4図に示すように、
回転弾性体5と被加工物8の被研磨面8aとの間の微小間
隔を懸濁液7が流体軸受的に流れることとなり、この懸
濁液7中の微細粉末砥粒が被研磨面8aに衝突・滑走して
被研磨面8aが研磨されるのである。
Due to the rotation of the rotary elastic body 5, as shown in FIG.
The suspension 7 flows like a hydrodynamic bearing in a minute gap between the rotary elastic body 5 and the surface 8a to be polished of the workpiece 8, and the fine powder abrasive grains in the suspension 7 are mixed with the surface 8a to be polished. The surface 8a to be polished is polished by colliding with and sliding on.

つまり、本研磨装置によれば、極微小量弾性破壊現象を
利用して原子の単位で加工することができ、格子欠陥を
増殖させずに被加工物8の被研磨面8aを高精度に研磨す
ることができる。研磨量は、例えば回転弾性体5に対す
る被加工物8の通過速度によって制御することができ
る。
That is, according to the present polishing apparatus, it is possible to perform processing in atomic units by utilizing the extremely small amount of elastic fracture phenomenon, and to polish the polished surface 8a of the workpiece 8 with high precision without multiplying lattice defects. can do. The polishing amount can be controlled, for example, by the passing speed of the workpiece 8 with respect to the rotary elastic body 5.

具体的に、この種の研磨装置では、前記通過速度つまり
Xテーブル10やYテーブル12の送り速度を遅くするにつ
れて研磨量が増加する傾向になっている。
Specifically, in this type of polishing apparatus, the polishing amount tends to increase as the passing speed, that is, the feed speed of the X table 10 and the Y table 12 is decreased.

このような構成の研磨装置において、例えば第5図
(a)に示すように、破線で示す曲面8bを持つ非球面レ
ンズを形成する場合には、回転弾性体5に対する被加工
物8の送りパターンを第5図(b)に示すようにする。
In the polishing apparatus having such a configuration, for example, as shown in FIG. 5 (a), when forming an aspherical lens having a curved surface 8b shown by a broken line, the feed pattern of the workpiece 8 to the rotary elastic body 5 is formed. As shown in FIG. 5 (b).

つまり、回転弾性体5に対して被加工物8を横切らせる
ようにXテーブル10でX方向に直線的に送るとともに、
X方向に1回送る毎にYテーブル12でY方向にΔyずつ
送るようにする。
That is, while linearly moving in the X direction with the X table 10 so as to traverse the workpiece 8 with respect to the rotary elastic body 5,
Each time it is sent once in the X direction, the Y table 12 sends it by Δy in the Y direction.

そして、前加工形状と所望加工形状との差にしたがいX
方向での研磨量を部分的に増減するために、X方向送り
範囲の開始点から終了点まで被加工物8の加工時間を変
化させるようにXテーブル10の送り速度または停止時間
を制御する。
Then, according to the difference between the pre-processed shape and the desired processed shape, X
In order to partially increase or decrease the polishing amount in the direction, the feed speed or the stop time of the X table 10 is controlled so as to change the processing time of the workpiece 8 from the start point to the end point of the X-direction feed range.

<発明が解決しようとする問題点> しかしながら、このような構成を有する従来例の場合に
は、次のような問題点がある。
<Problems to be Solved by the Invention> However, the conventional example having such a configuration has the following problems.

上述するように、Xテーブル10とYテーブル12とで被研
磨面8aの研磨を進行させるように構成している従来の研
磨装置では、例えば非球面レンズを形成するときに、前
加工面が完全な球面であってもX方向での研磨量が増減
するため、加工時間を変化させねばならず、さらに所定
の精度の曲面を得るためにX方向の送りピッチを極く小
さくしなければならず高い位置決め精度も要求されるの
で、Xテーブル10の送り制御が非常に複雑になり、高い
機械精度が要求される。本発明はこのような事情に鑑み
て創案されたもので、特にレンズなどを形成するに際し
て、簡単な制御でもって所定の精度の加工が行える研磨
装置を提供することを目的としている。
As described above, in the conventional polishing apparatus configured to advance the polishing of the surface 8a to be polished by the X table 10 and the Y table 12, for example, when the aspherical lens is formed, the preprocessed surface is completely Even if it is a spherical surface, the amount of polishing in the X direction increases or decreases, so the processing time must be changed, and the feed pitch in the X direction must be extremely small in order to obtain a curved surface with a predetermined accuracy. Since high positioning accuracy is also required, the feed control of the X table 10 becomes very complicated and high mechanical accuracy is required. The present invention was devised in view of such circumstances, and an object of the present invention is to provide a polishing apparatus capable of performing processing with a predetermined accuracy by simple control particularly when forming a lens or the like.

<問題点を解決するための手段> 本発明はこのような目的を達成するために、次のような
構成をとる。
<Means for Solving Problems> The present invention has the following configuration in order to achieve such an object.

即ち、本発明にかかる研磨装置は、 微細粉末砥粒を一様に分散した懸濁液中に浸漬させた被
加工物の被研磨面に、回転弾性体を近接させて、この両
者の間で前記懸濁液を流動させることにより前記被加工
物の被研磨面を加工する構成であって、 前記被加工物を回転させる回転駆動機構と、 この回転駆動機構の回転中心軸に対して直交する方向に
この回転駆動機構と前記回転弾性体との相対位置を変位
させる送り機構とを備えている。
That is, the polishing apparatus according to the present invention is arranged such that the rotary elastic body is brought close to the surface to be polished of the work piece immersed in the suspension in which the fine powder abrasive grains are uniformly dispersed, and between the both. A structure for processing a surface to be polished of the workpiece by causing the suspension to flow, and a rotary drive mechanism for rotating the workpiece, and a drive shaft orthogonal to a rotation center axis of the rotary drive mechanism. And a feed mechanism for displacing the relative position between the rotary drive mechanism and the rotary elastic body in the direction.

<作用> 本発明の構成による作用は次のとおりである。<Operation> The operation of the configuration of the present invention is as follows.

例えば完全に球面の被研磨面を持つ被加工物から所定の
曲面の非球面レンズを形成する場合、被研磨面の最外周
縁から中心点に向かって例えば同心円状または螺旋状と
なるように、回転駆動機構で被加工物を円周方向に送る
とともに、送り機構で被加工物を径方向に所定ピッチず
つ送るが、一定半径距離の円周上では研磨量が一定とな
るため、同一円周上では加工時間が一定でよい。即ち、
被加工物を径方向に所定ピッチずつ送る毎に回転駆動機
構による被加工物の送り速度をまたは停止時間を変化さ
せるように制御すればよい。
For example, when forming an aspherical lens having a predetermined curved surface from a work piece having a completely spherical surface to be polished, for example, in a concentric or spiral shape from the outermost peripheral edge of the surface to be polished toward the center point, The rotation drive mechanism sends the work piece in the circumferential direction, and the feed mechanism sends the work piece in the radial direction by a predetermined pitch, but the polishing amount is constant on the circumference of a constant radius distance, so the same circumference In the above, the processing time may be constant. That is,
The feed speed of the workpiece by the rotary drive mechanism or the stop time may be controlled to change each time the workpiece is fed in the radial direction by a predetermined pitch.

実際面においては、前加工面の形状精度が絶対的なもの
でないため、同一円周上でも制御が必要であるが、前加
工精度の誤差修正のみでよいため加工量の変化は微小で
あり加工時間の制御も従来方式に比べ容易になる。
On the actual surface, the shape accuracy of the pre-machined surface is not absolute, so control is required even on the same circumference, but since the error in the pre-machined accuracy only needs to be corrected, the change in the machining amount is small. Time control is also easier than in the conventional method.

本加工は加工精度向上のため、被加工面各位置を座標化
し、その位置での加工量を加工情報として予め入力させ
ておく必要があるが、加工量の変動が小さいと、同じ加
工精度を得るにしても入力を行う座標数を小さくするこ
とができ、記憶装置の縮小化が図れるばかりか、機械的
なワークの追随も容易に対応が可能となる。
In order to improve the machining accuracy in this machining, it is necessary to coordinate each position on the surface to be machined and input the machining amount at that position in advance as machining information. Even if it is obtained, the number of coordinates to be input can be reduced, so that not only the storage device can be downsized, but also mechanical work can be easily followed.

<実施例> 以下、本発明の一実施例を図面に基づいて詳細に説明す
る。
<Example> Hereinafter, one example of the present invention will be described in detail with reference to the drawings.

第1図および第2図に本発明の一実施例を示しており、
第1図は研磨装置の概略を示す一部縦断の側面図、第2
図(a)および(b)は被加工物の送りパターンを示す
説明図である。
1 and 2 show an embodiment of the present invention,
FIG. 1 is a partially longitudinal side view showing the outline of a polishing apparatus, and FIG.
(A) And (b) is explanatory drawing which shows the feed pattern of a to-be-processed object.

これらの図において、第3図ないし第5図に付した符号
と同一の符号は同一部品もしくは対応する部分を指す。
In these figures, the same reference numerals as those shown in FIGS. 3 to 5 indicate the same parts or corresponding parts.

本実施例では従来例のものと異なる構成のみについて説
明する。
In this embodiment, only the structure different from that of the conventional example will be described.

容器6の一側面には、回転駆動機構としてのモータ14が
取り付けられている。このモータ14の回転中心軸15は水
平方向に平行に配向されている。
A motor 14 as a rotation drive mechanism is attached to one side surface of the container 6. The rotation center axis 15 of the motor 14 is oriented parallel to the horizontal direction.

モータ14の一端には支持台16が回転自在に設けられてお
り、この支持台16に被加工物8を固定させるのである。
A support base 16 is rotatably provided at one end of the motor 14, and the workpiece 8 is fixed to the support base 16.

また、容器6は送り機構としてのXテーブル17上に設置
されており、このXテーブル17はエアスライド18により
X方向例えば第1図の紙面に対して垂直な方向に往復送
りさせるものである。
Further, the container 6 is installed on an X table 17 serving as a feeding mechanism, and the X table 17 is reciprocally fed by an air slide 18 in the X direction, for example, a direction perpendicular to the paper surface of FIG.

次に動作を説明する。Next, the operation will be described.

まず、モータ14へ被加工物8を取り付けるときには、モ
ータ14の回転中心軸15に被加工物8の中心点を位置させ
る。
First, when attaching the workpiece 8 to the motor 14, the center point of the workpiece 8 is positioned on the rotation center shaft 15 of the motor 14.

そして、例えば、モータ14により被加工物8を円周方向
に予め入力された制御速度で送ると、被研磨面8aには円
状に回転弾性体5を走査させることができる。
Then, for example, when the workpiece 8 is sent in the circumferential direction by the motor 14 at a control speed input in advance, the surface 8a to be polished can be circularly scanned with the rotary elastic body 5.

一方、モータ14で被加工物8を円周方向に送り、一定の
回転角度または時間毎にXテーブル17を駆動させると螺
旋状に回転弾性体5を走査させることができる。
On the other hand, when the workpiece 8 is sent in the circumferential direction by the motor 14 and the X table 17 is driven at a constant rotation angle or time, the rotary elastic body 5 can be spirally scanned.

このように、本実施例の研磨装置は、モータ14で被加工
物8を円周方向に送るとともに、Xテーブル17で被加工
物8を被加工物8の回転軸と直角の方向に送るように構
成されており、モータ14の円周方向の送り速度を制御さ
せることで種々な加工を行えるようにしている。
Thus, in the polishing apparatus of this embodiment, the motor 14 sends the work 8 in the circumferential direction, and the X table 17 sends the work 8 in the direction perpendicular to the rotation axis of the work 8. In this configuration, various processing can be performed by controlling the feed rate of the motor 14 in the circumferential direction.

そこで、本研磨装置で非球面レンズを形成する場合の手
順を説明する。
Therefore, a procedure for forming an aspherical lens with the present polishing apparatus will be described.

加工に際して、被加工物8の被研磨面8aの加工面前の面
形状を正確に測定して、この測定値から所望面形状にす
るために必要な研磨量を割り出し、このデータに基づい
て、モータ14による被加工物8の円周方向の送り速度を
制御させるのであるが、ここでは、球面の被研磨面8aを
持つ円形板状の被加工物8から所定の曲面の非球面レン
ズを形成するものとする。
During processing, the surface shape of the surface to be polished 8a of the workpiece 8 before the processed surface is accurately measured, and the amount of polishing required to obtain the desired surface shape is calculated from this measurement value. The feed rate of the workpiece 8 in the circumferential direction by the 14 is controlled. Here, the aspherical lens having a predetermined curved surface is formed from the circular plate-shaped workpiece 8 having the spherical surface 8a to be polished. I shall.

モータ14へ被加工物8を取り付けるときには、モータ14
の回転中心軸15に被加工物8の中心点を位置させる。
When attaching the workpiece 8 to the motor 14, the motor 14
The center point of the workpiece 8 is located on the rotation center axis 15 of.

こうして、被加工物8の送りパターンを第2図(a)に
示すようにする。
In this way, the feed pattern of the workpiece 8 is set as shown in FIG.

具体的に説明する。This will be specifically described.

Xテーブル17および鉛直Z方向に動く主軸ヘッド1で
回転弾性体5に対して被加工物8の最外周縁の任意の1
点Aを位置させる。
With the X-table 17 and the spindle head 1 that moves in the vertical Z-direction, any one of the outermost peripheral edges of the workpiece 8 with respect to the rotating elastic body 5
Position point A.

この位置からモータ14で被加工物8を円周方向に取
代により定められる速度で送って1周させる。
From this position, the work piece 8 is sent by the motor 14 in the circumferential direction at a speed determined by the machining allowance to make one turn.

Xテーブル17および主軸ヘッド1で被加工物8を径方
向の中心側にΔxだけ送る。
The X table 17 and the spindle head 1 feed the workpiece 8 by Δx to the center side in the radial direction.

この位置から前記と同様に取代により定められる
速度で被加工物8を1周させる。
From this position, the workpiece 8 is rotated once at a speed determined by the machining allowance in the same manner as described above.

以下順次、Xテーブル17および主軸ヘッド1で被加
工物8を径方向の中心側にΔxずつ送るとともに、モー
タ14による被加工物8の送り速度を変化させる。
Subsequently, the X table 17 and the spindle head 1 sequentially feed the workpiece 8 to the center side in the radial direction by Δx, and the feed speed of the workpiece 8 by the motor 14 is changed.

このように、本実施例の研磨装置によれば、非球面レン
ズを形成する場合、非球面メンズの得るべき曲面の各等
高線に沿って研磨を進行させるようにモータ14で被加工
物8を円周方向に送ることができるから、円周方向での
研磨量を増加または減少させる度合が小さく、モータ14
による被加工物8の送り速度の制御と位置決め制御が容
易になる。
As described above, according to the polishing apparatus of the present embodiment, when the aspherical lens is formed, the workpiece 14 is circularly moved by the motor 14 so that the polishing is advanced along each contour line of the curved surface to be obtained by the aspherical mens. Since it can be fed in the circumferential direction, the degree to which the polishing amount in the circumferential direction is increased or decreased is small, and the motor 14
The feed rate control and the positioning control of the work piece 8 by means of are facilitated.

なお、本実施例の研磨装置でレンズを形成する際の被加
工物8の送りパターンを第2図(a)に示すように同心
円状にするとしているが、この他に第2図(b)に示す
ように螺旋状にすることも可能である。
The feed pattern of the workpiece 8 when forming the lens with the polishing apparatus of the present embodiment is assumed to be concentric as shown in FIG. 2 (a), but in addition to this, FIG. 2 (b). It is also possible to make a spiral as shown in FIG.

この場合、モータ14で被加工物8を円周方向に所定角Δ
cずつ送り、1回ずつ送る毎に被加工物8を径方向中心
側にΔxずつ送るようにモータ14,Xテーブル17および主
軸ヘッド1をそれぞれ制御すればよい。
In this case, the motor 14 moves the workpiece 8 in the circumferential direction by a predetermined angle Δ.
The motor 14, the X table 17, and the spindle head 1 may be controlled so that the workpiece 8 is fed to the center side in the radial direction by Δx each time it is fed by c, and is fed once.

また、上記実施例においては、送り機構としてXテーブ
ル17を採用しているが、本発明はこれに限定されず、例
えば水平方向に回転中心軸15を配向したモータ14または
主軸ヘッド1を鉛直方向に送るような送り機構を採用す
ることも可能である。
Further, although the X table 17 is adopted as the feeding mechanism in the above-mentioned embodiment, the present invention is not limited to this, and for example, the motor 14 or the spindle head 1 in which the rotation center shaft 15 is oriented in the horizontal direction is set in the vertical direction. It is also possible to employ a feeding mechanism that feeds to.

さらに、上記実施例では、モータ14の回転中心軸15を水
平方向に配向させているが、本発明はこれに限定され
ず、例えばモータ14の回転中心軸15を鉛直方向に配向し
て、被加工物8の被研磨面8aを水平な状態にすることも
可能である。
Further, in the above embodiment, the rotation center shaft 15 of the motor 14 is oriented in the horizontal direction, but the present invention is not limited to this.For example, the rotation center shaft 15 of the motor 14 is oriented in the vertical direction, and It is also possible to make the surface 8a to be polished of the workpiece 8 horizontal.

<発明の効果> 本発明では、レンズの得るべき曲面の各等高線に沿って
円周方向に研磨を進行させることができるから、1つの
等高線について進行方向で研磨量を一定にすることがで
きる。
<Effects of the Invention> In the present invention, polishing can be made to proceed in the circumferential direction along each contour line of the curved surface to be obtained by the lens, so that the amount of polishing can be made constant for one contour line in the proceeding direction.

勿論、等高線はそれぞれでは、各等高線1周の間に前加
工精度を修正するために研磨量をそれぞれ増加また減少
させるように制御しなければならないが、従来のように
頻繁に行う必要がない。
Of course, each contour line must be controlled so as to increase or decrease the polishing amount in order to correct the pre-processing accuracy during one round of each contour line, but it is not necessary to perform it frequently as in the conventional case.

したがって、本発明の研磨装置によれば、被加工物を送
るための制御を従来よりも大幅に簡単にでき、所定の精
度のレンズを容易に加工することができる。
Therefore, according to the polishing apparatus of the present invention, the control for feeding the workpiece can be made much simpler than in the conventional case, and the lens with a predetermined accuracy can be easily processed.

【図面の簡単な説明】[Brief description of drawings]

第1図および第2図は本発明の一実施例にかかり、第1
図は研磨装置の概略を示す部分断面の側面図、第2図
(a)および(b)はそれぞれ被加工物の送りパターン
を示す説明図である。 また、第3図ないし第5図は従来例にかかり、第3図は
研磨装置の概略を示す部分断面の側面図、第4図は加工
時の回転体と被加工物とを示す拡大図、第5図(a)は
被加工物の側面図、第5図(b)は被加工物の送りパタ
ーンを示す説明図である。 5……回転弾性体 6……容器 7……懸濁液 8……被加工物 8a……被研磨面 14……モータ(回転駆動機構) 15……回転中心軸 16……Xテーブル(送り機構)。
1 and 2 relate to an embodiment of the present invention.
The figure is a side view of a partial cross section showing the outline of the polishing apparatus, and FIGS. 3 to 5 relate to a conventional example, FIG. 3 is a side view of a partial cross section showing an outline of a polishing apparatus, and FIG. 4 is an enlarged view showing a rotating body and a workpiece during processing, FIG. 5 (a) is a side view of the workpiece, and FIG. 5 (b) is an explanatory view showing the feed pattern of the workpiece. 5 …… Rotary elastic body 6 …… Container 7 …… Suspension 8 …… Workpiece 8a …… Surface to be polished 14 …… Motor (rotary drive mechanism) 15 …… Rotation center axis 16 …… X table (feed mechanism).

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭62−88565(JP,A) 特開 昭62−199353(JP,A) 特開 昭63−232949(JP,A) ─────────────────────────────────────────────────── --- Continuation of the front page (56) References JP 62-88565 (JP, A) JP 62-199353 (JP, A) JP 63-232949 (JP, A)

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】微細粉末砥粒を一様に分散した懸濁液中に
浸漬させた被加工物の被研磨面に、回転弾性体を近接さ
せて、この両者の間で前記懸濁液を流動させることによ
り前記被加工物の被研磨面を加工する構成の研磨装置に
おいて、 前記被加工物を回転させる回転駆動機構と、 この回転駆動機構の回転中心軸に対して直交する方向に
この回転駆動機構と前記回転弾性体との相対位置を変位
させる送り機構 とを備えていることを特徴とする研磨装置。
1. A rotary elastic body is brought close to the surface to be polished of a work piece immersed in a suspension in which fine powder abrasive grains are uniformly dispersed, and the suspension is placed between the two. A polishing apparatus configured to process a surface to be polished of a workpiece by flowing the rotary drive mechanism for rotating the workpiece, and the rotation drive mechanism in a direction orthogonal to a rotation center axis of the rotary drive mechanism. A polishing apparatus comprising: a drive mechanism and a feed mechanism for displacing the relative position of the rotary elastic body.
【請求項2】前記回転駆動機構の回転中心軸が水平方向
に平行に配向されていて、この回転駆動機構がその回転
中心軸周りに前記被加工物を回転させるものであること
を特徴とする特許請求の範囲第(1)項記載の研磨装
置。
2. A rotation center axis of the rotation drive mechanism is oriented parallel to a horizontal direction, and the rotation drive mechanism rotates the workpiece around the rotation center axis. The polishing apparatus according to claim (1).
JP62179837A 1987-07-17 1987-07-17 Polishing equipment Expired - Fee Related JPH0716870B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62179837A JPH0716870B2 (en) 1987-07-17 1987-07-17 Polishing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62179837A JPH0716870B2 (en) 1987-07-17 1987-07-17 Polishing equipment

Publications (2)

Publication Number Publication Date
JPS6427852A JPS6427852A (en) 1989-01-30
JPH0716870B2 true JPH0716870B2 (en) 1995-03-01

Family

ID=16072764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62179837A Expired - Fee Related JPH0716870B2 (en) 1987-07-17 1987-07-17 Polishing equipment

Country Status (1)

Country Link
JP (1) JPH0716870B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007018117A1 (en) 2005-08-05 2007-02-15 Yuzo Mori Electron beam assisted eem method
JP6446590B1 (en) * 2018-08-09 2018-12-26 国立大学法人 東京大学 Local polishing method, local polishing apparatus, and corrected polishing apparatus using the local polishing apparatus

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4639669B2 (en) * 2004-07-09 2011-02-23 森 勇蔵 Ultra-precision mirror surface processing method and apparatus by EEM method
US8734661B2 (en) 2007-10-15 2014-05-27 Ebara Corporation Flattening method and flattening apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007018117A1 (en) 2005-08-05 2007-02-15 Yuzo Mori Electron beam assisted eem method
JP6446590B1 (en) * 2018-08-09 2018-12-26 国立大学法人 東京大学 Local polishing method, local polishing apparatus, and corrected polishing apparatus using the local polishing apparatus

Also Published As

Publication number Publication date
JPS6427852A (en) 1989-01-30

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