JPH0697608A - Connection part structure of flexible circuit board and its forming method - Google Patents
Connection part structure of flexible circuit board and its forming methodInfo
- Publication number
- JPH0697608A JPH0697608A JP4270998A JP27099892A JPH0697608A JP H0697608 A JPH0697608 A JP H0697608A JP 4270998 A JP4270998 A JP 4270998A JP 27099892 A JP27099892 A JP 27099892A JP H0697608 A JPH0697608 A JP H0697608A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- flexible circuit
- auxiliary plate
- connecting portion
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 22
- 238000010030 laminating Methods 0.000 claims abstract description 3
- 239000000463 material Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 abstract description 4
- 239000011889 copper foil Substances 0.000 abstract description 4
- 229920005989 resin Polymers 0.000 abstract description 3
- 239000011347 resin Substances 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、可撓性回路基板相互の
接続又は可撓性回路基板と硬質回路基板とを接続する場
合、可撓性回路基板の裏面に突起部を有する補助板を配
設することにより可撓性回路基板の接続部に接点状の隆
起部を形成した可撓性回路基板の接続部構造及びその形
成法に関する。BACKGROUND OF THE INVENTION The present invention relates to an auxiliary plate having a protrusion on the back surface of a flexible circuit board when connecting the flexible circuit boards to each other or connecting the flexible circuit board and the hard circuit board. The present invention relates to a connecting portion structure of a flexible circuit board in which a contact-shaped raised portion is formed in the connecting portion of the flexible circuit board by arranging the flexible circuit board and a method for forming the same.
【0002】[0002]
【従来技術とその問題点】可撓性回路基板の相互を接続
するか又は可撓性回路基板と硬質回路基板とを互いに接
続する手法としては、例えば、図10の如きディンプル
接続方式の他、図12のようなバンプ接続方式がある。2. Description of the Related Art As a method for connecting flexible circuit boards to each other or connecting a flexible circuit board and a rigid circuit board to each other, for example, in addition to the dimple connection method shown in FIG. There is a bump connection method as shown in FIG.
【0003】ディンプル接続方式の構造は、同図のよう
に可撓性絶縁べ−ス材15に接着層14を介して被着し
た配線パタ−ン12を備えた可撓性回路基板を用意し、
この可撓性回路基板の接続部には金型で機械的にド−ム
状に変形させたディンプル部13を形成し、そのディン
プル部13の裏面を合成樹脂板の如き適当な弾性部材1
6に形成した突起部17で該ディンプル部13を支持し
た状態で相手方の回路基板18に於ける接続とそのディ
ンプル部13を接触接続させるものである。In the dimple connection type structure, a flexible circuit board having a wiring pattern 12 adhered to a flexible insulating base material 15 via an adhesive layer 14 is prepared as shown in FIG. ,
A dimple portion 13 mechanically deformed into a dome shape is formed in a connecting portion of the flexible circuit board by a die, and the back surface of the dimple portion 13 is formed of a suitable elastic member 1 such as a synthetic resin plate.
The dimple portion 13 is connected to the connection on the mating circuit board 18 while the dimple portion 13 is supported by the protruding portion 17 formed in 6.
【0004】このようなディンプル接続方式は、可撓性
絶縁べ−ス材15と接着層14及び配線パタ−ン12か
らなる薄い可撓性回路基板の変形のみでド−ム状のディ
ンプル部13を形成する構造である為、その製造工程上
又は機器に対する組込み時或いは組込み後に於いて外力
に対して極めて脆弱であってド−ム状のディンプル部1
3は容易に変形を受ける。In such a dimple connection system, the dimple portion 13 in the form of a dome is formed only by deforming a thin flexible circuit board including a flexible insulating base material 15, an adhesive layer 14 and a wiring pattern 12. Since it is a structure that forms a dimple portion 1 that is extremely vulnerable to an external force during its manufacturing process or during or after being incorporated into a device, it is a dome-shaped dimple portion 1
3 is easily deformed.
【0005】従って、このディンプル接続方式は接続歩
留の向上を図ることは困難であり、また、上記の如く可
撓性回路基板単独では機器に対する組込みは不可能であ
るから、突起部17を有する弾力性のある弾性部材16
によってディンプル部13の変形保護と接触信頼性を持
たせる必要がある。Therefore, in this dimple connection method, it is difficult to improve the connection yield, and as described above, since the flexible circuit board cannot be incorporated into a device by itself, it has the protrusions 17. Elastic member 16 having elasticity
Therefore, it is necessary to provide deformation protection of the dimple portion 13 and contact reliability.
【0006】そして、このディンプル接続方式ではいず
れにしても可撓性回路基板の下方部位に弾性部材16が
必要であってこれはコスト的に不利であり、また、図1
1のように可撓性回路基板19のディンプル部13と弾
性部材16の突起部17との位置合わせを正確に行わな
いと、その突起部17の変形又はディンプル部13の変
形を伴う等、両者の位置合わせ精度が必要であるという
不都合もある。In any case, this dimple connection method requires the elastic member 16 at the lower portion of the flexible circuit board, which is disadvantageous in terms of cost.
If the alignment of the dimple portion 13 of the flexible circuit board 19 and the protrusion 17 of the elastic member 16 is not accurately performed as in the case of 1, the protrusion 17 may be deformed or the dimple 13 may be deformed. There is also an inconvenience that the positioning accuracy of is required.
【0007】更に、このディンプル接続方式は、金型で
ディンプル部13を強制的に急激に変形させるものであ
るから、その際には可撓性絶縁べ−ス材15と銅箔から
なる配線パタ−ン12との剥離を発生させる虞もあり、
また、金型の強度によりディンプル部13の最小ピッチ
と径などが決定されるので、ディンプル部13が密集す
るような高密度接続形態には対応不可能である。Further, in this dimple connection method, since the dimple portion 13 is forcibly and suddenly deformed by a mold, at that time, the wiring pattern made of the flexible insulating base material 15 and the copper foil is used. -There is also a possibility that peeling from the
Further, since the minimum pitch and diameter of the dimples 13 are determined by the strength of the mold, it is impossible to cope with a high-density connection mode in which the dimples 13 are densely packed.
【0008】一方、バンプ接続方式に於いては、図12
の如く可撓性回路基板の配線パタ−ン12を形成した
後、印刷によりバンプ20を形成するので、工数の増加
に加えて接触接続の信頼性上致命的な高さのバラツキを
制御することは非常に困難である為、接続歩留の低下を
来している。On the other hand, in the bump connection method, as shown in FIG.
As described above, since the bumps 20 are formed by printing after forming the wiring pattern 12 of the flexible circuit board, it is possible to control the variation of the height which is fatal to the reliability of the contact connection in addition to the increase in the number of steps. Is very difficult, resulting in a decrease in connection yield.
【0009】また、このバンプ接続方式でもディンプル
接続方式と同様に可撓性回路基板の下方部位に弾力性の
ある部材21を必要とし、コスト面でも不利である。Further, this bump connection method also requires an elastic member 21 in the lower portion of the flexible circuit board as in the dimple connection method, which is also disadvantageous in terms of cost.
【0010】[0010]
【課題を解決するための手段】本発明は、上記の諸問題
を解消する為、突起部を有する補助板を可撓性回路基板
の接続部位裏面に接合処理することにより、可撓性回路
基板の接続部に接点状の隆起部を形成し、これによって
可撓性回路基板の製作工数及び組立工数の削減を図り、
また、接点状隆起部がつぶれる虞のない高密度且つ高信
頼性に富む回路基板相互接続の為の可撓性回路基板の接
続部構造及びその形成法を提供するものである。SUMMARY OF THE INVENTION In order to solve the above problems, the present invention provides a flexible circuit board by bonding an auxiliary plate having a protrusion to the back surface of a connection portion of the flexible circuit board. A contact-shaped ridge is formed at the connection part of, thereby reducing the manufacturing man-hours and assembling man-hours of the flexible circuit board,
The present invention also provides a flexible circuit board connecting portion structure and a method of forming the same for high-density and highly reliable circuit board interconnection in which the contact-like ridges are not crushed.
【0011】その為に本発明では、所要部位に任意形状
の突起部を形成した補助板を設け、この補助板の突起部
形成面に可撓性回路基板の接続部箇所を接合することに
よって、その接続部に上記補助板の突起部に対応した接
点状の隆起部を形成するように構成したものである。Therefore, according to the present invention, an auxiliary plate having a protrusion of an arbitrary shape is provided at a required portion, and the connecting portion of the flexible circuit board is joined to the protrusion-forming surface of the auxiliary plate. A contact-shaped ridge corresponding to the protrusion of the auxiliary plate is formed at the connecting portion.
【0012】また、補助板の突起部周辺に適宜な透孔を
形成して突起部に弾性を付与させる構造を採用する場合
には、相手方回路基板との接触接続状態で可撓性回路基
板の接点状隆起部は結果的に相手方回路基板の経時変化
をも含む凹凸を好適に吸収できることとなる。Further, in the case of adopting a structure in which an appropriate through hole is formed around the protrusion of the auxiliary plate to give elasticity to the protrusion, the flexible circuit board in the contact connection state with the counterpart circuit board is used. As a result, the contact-shaped ridge can appropriately absorb the unevenness of the other circuit board including the change over time.
【0013】[0013]
【実施例】以下、図示の実施例を参照しながら本発明を
更に詳述する。図1及び図2に於いて、1は可撓性回路
基板の絶縁性べ−ス材であって、その一方面には所要数
の配線パタ−ン2Aが銅箔のエッチング処理で形成さ
れ、それら配線パタ−ン2Aは例えば接続部2で終端さ
せることもできる。3は接続部2に後述の手法により形
成された上向きに突出する接点状の隆起部を示し、5は
適宜な樹脂部材からなる補助板であって、この補助板5
は接点状の隆起部3を形成させる為の突起部6を所定箇
所に一体的に備え、該補助板5は接着剤4を用いて可撓
性回路基板に於ける接続部2が配設された所定箇所の裏
面に圧接接合されて本発明の一実施例による可撓性回路
基板の接続部を構成する。The present invention will be described in more detail below with reference to the illustrated embodiments. In FIGS. 1 and 2, reference numeral 1 is an insulating base material for a flexible circuit board, and a required number of wiring patterns 2A are formed on one surface of the insulating base material by etching a copper foil. The wiring patterns 2A can be terminated at the connecting portion 2, for example. Reference numeral 3 denotes a contact-shaped protruding portion which is formed on the connecting portion 2 and which is formed by a method described later and protrudes upward. Reference numeral 5 denotes an auxiliary plate made of an appropriate resin member.
Is integrally provided with a protrusion 6 for forming a contact-shaped raised portion 3 at a predetermined position, and the auxiliary plate 5 is provided with a connecting portion 2 in a flexible circuit board by using an adhesive 4. Also, the flexible circuit board connection portion according to one embodiment of the present invention is formed by pressure-bonding to the back surface of the predetermined portion.
【0014】このような可撓性回路基板の接続部構造を
製作するには、図3の如く例えば半球状の突起部6を所
定箇所に形成した補助板5を適当な樹脂板部材で予め製
作しておき、一方、可撓性回路基板に関してもその可撓
性絶縁べ−ス材1上に銅箔等の導電性部材で補助板5の
突起部6の位置に対応させた部位に配線パタ−ン2Aの
接続部2を形成しておく。そして、補助板5を可撓性回
路基板の裏面側に配置して接着剤4を介して相互を接合
処理すると、補助板5の突起部6により接続部2には接
点状に突起した隆起部3を形成することができる。In order to manufacture such a connecting portion structure of a flexible circuit board, as shown in FIG. 3, an auxiliary plate 5 having, for example, hemispherical projections 6 formed at predetermined positions is manufactured in advance with an appropriate resin plate member. On the other hand, with respect to the flexible circuit board, a wiring pattern is formed on the flexible insulating base material 1 at a position corresponding to the position of the protruding portion 6 of the auxiliary plate 5 with a conductive member such as copper foil. -Connecting part 2 of 2A is formed in advance. Then, when the auxiliary plate 5 is arranged on the back surface side of the flexible circuit board and is joined to each other through the adhesive 4, the protrusion 6 of the auxiliary plate 5 causes the connection part 2 to project in a contact-like shape on the connection part 2. 3 can be formed.
【0015】ここで、接点状に突起する隆起部3の形状
は、補助板5に形成する突起部6の形状により、例えば
図4の如く台形状の隆起部3Aにも成形できる等、隆起
部3の形状は補助板5の突起部6の形状に従って任意の
形状に構成できる。Here, the shape of the protruding portion 3 protruding like a contact point can be formed into a trapezoidal protruding portion 3A as shown in FIG. 4, depending on the shape of the protruding portion 6 formed on the auxiliary plate 5, for example. The shape of 3 can be configured arbitrarily according to the shape of the protrusion 6 of the auxiliary plate 5.
【0016】図5は接続部2に対して弾力性を付与させ
る為の構造を示し、その為には同図の如く補助板5の突
起部6の周辺部位に例えばU字状の透孔7を形成した状
態で可撓性回路基板と相互に接合処理すると、透孔7の
作用により補助板5の突起部6の周辺部位は適度な弾力
性を有するので、これに応じて接続部2に形成される接
点状の隆起部3も弾力性を持つように構成でき、従っ
て、相手方回路基板に於ける製造時の凹凸又は経時変化
による凹凸等を好適に吸収して確実な回路基板相互の接
触接続状態を確保できる。FIG. 5 shows a structure for imparting elasticity to the connection portion 2. For that purpose, for example, a U-shaped through hole 7 is formed in the peripheral portion of the projection 6 of the auxiliary plate 5 as shown in FIG. When the flexible circuit board is joined to the flexible circuit board in the state where the ridges are formed, since the peripheral portion of the protrusion 6 of the auxiliary plate 5 has an appropriate elasticity due to the action of the through hole 7, the connection portion 2 is accordingly The contact-shaped ridges 3 formed can also be configured to have elasticity, and therefore, the unevenness of the mating circuit board during manufacturing or the unevenness due to aging can be suitably absorbed to ensure reliable contact between the circuit boards. The connection status can be secured.
【0017】接点状の隆起部3に斯かる弾力性を付与さ
せる手法としては、図6に示すように可撓性回路基板の
接続部2の周辺にも補助板5の透孔7に対応させたU字
状の透孔1Aを設けることも好適である。As a method of imparting such elasticity to the contact-shaped raised portion 3, as shown in FIG. 6, the periphery of the connecting portion 2 of the flexible circuit board is made to correspond to the through hole 7 of the auxiliary plate 5. It is also preferable to provide a U-shaped through hole 1A.
【0018】上記の如く接続部2に対して弾力性を付与
させる為の構造はその他種々の形態を提供することがで
きる。図7、図8及び図9はその具体例を示し、先ず図
7の(1)及び(2)は可撓性回路基板の接続部に対応
した箇所に於ける補助板5の底部に適宜な陥部8を形成
し、且つ接点状の隆起部3の間の部位に適宜な形状の透
孔9を形成した構造を示し、また、図8の(1)及び
(2)の構造はその透孔が可撓性回路基板にも共通に穿
設された透孔10を有するように構成したものである。As described above, the structure for imparting elasticity to the connecting portion 2 can be provided in various forms. 7, 8 and 9 show specific examples thereof. First, (1) and (2) of FIG. 7 are suitable for the bottom portion of the auxiliary plate 5 at a portion corresponding to the connecting portion of the flexible circuit board. 8 shows a structure in which a recess 8 is formed and a through hole 9 having an appropriate shape is formed in a portion between the contact-shaped raised portions 3. Further, the structures (1) and (2) in FIG. The holes are formed in the flexible circuit board in common with the through holes 10.
【0019】また、図9は補助板5の突起部6の下方部
位に陥部11を形成して結果的には接点状の隆起部3に
対して適度な弾力性を与えるように構成した例を示す。Further, FIG. 9 shows an example in which a recess 11 is formed below the protrusion 6 of the auxiliary plate 5 so that the contact-like ridge 3 is appropriately elastic. Indicates.
【0020】[0020]
【発明の効果】本発明による可撓性回路基板の端子部構
造及びその形成法では、所定の部位に突起部を設けた補
助板を可撓性回路基板の端子部裏面に積層接合してその
端子部に上記補助板の突起部に応じた接点状の隆起部を
形成するものであるから、この端子部に於ける接点状の
隆起部の機械的強度は高く、つぶれ又は変形等の虞なく
相手方の回路基板と確実な接触接続構造を得ることがで
きる。According to the structure of the terminal portion of the flexible circuit board and the method of forming the same according to the present invention, an auxiliary plate having a protrusion at a predetermined portion is laminated and bonded to the rear surface of the terminal portion of the flexible circuit board. Since the contact-shaped ridges corresponding to the protrusions of the auxiliary plate are formed in the terminal portion, the mechanical strength of the contact-shaped ridges in this terminal portion is high, and there is no fear of collapse or deformation. It is possible to obtain a reliable contact connection structure with the circuit board of the other party.
【0021】また、補助板の突起部周辺や可撓性回路基
板の端子部周辺に透孔を具備するような形態の可撓性回
路基板の端子部構造では、相手方の回路基板の凹凸や経
時的変化による凹凸を好適に吸収するので、回路基板相
互の接触接続状態を良好に維持できる。In addition, in the terminal portion structure of the flexible circuit board in which the through holes are provided around the protrusions of the auxiliary plate and around the terminal portions of the flexible circuit board, unevenness of the counterpart circuit board and aging Since the unevenness due to the dynamic change is appropriately absorbed, the contact connection state between the circuit boards can be favorably maintained.
【0022】可撓性回路基板の端子部に於ける接点状の
隆起部は、補助板の突起部の形状を任意に形成すること
により最適な形状に構成することが容易である。The contact-shaped raised portion in the terminal portion of the flexible circuit board can be easily formed into an optimum shape by arbitrarily forming the shape of the protrusion of the auxiliary plate.
【0023】補助板は可撓性回路基板の所要の接続部裏
面に密着した構造であるので、組立時の位置合わせ処理
も簡便であり、高密度且つ高信頼性に富む接点状隆起部
を備えた端子部構造を提供できる。Since the auxiliary plate is in close contact with the back surface of the required connection portion of the flexible circuit board, the alignment process during assembly is simple, and the high density and highly reliable contact-like protrusions are provided. It is possible to provide an improved terminal structure.
【図1】 本発明の一実施例により構成された可撓性回
路基板の端子部構造の概念的な要部斜視構成図。FIG. 1 is a conceptual perspective view of a terminal portion structure of a flexible circuit board constructed according to an embodiment of the present invention.
【図2】 そのA−A線断面構成図。FIG. 2 is a sectional view taken along the line AA.
【図3】 本発明に従って可撓性回路基板と補助板とを
積層接合する態様を説明する為の図。FIG. 3 is a diagram for explaining a mode of laminating and joining a flexible circuit board and an auxiliary plate according to the present invention.
【図4】 端子部に於ける接点状隆起部の他の形状を示
す説明図。FIG. 4 is an explanatory view showing another shape of the contact-like raised portion in the terminal portion.
【図5】 端子部の接点状隆起部に対して弾力性を付与
させる構造を説明する為の斜視構成図。FIG. 5 is a perspective configuration diagram for explaining a structure for imparting elasticity to the contact-like raised portion of the terminal portion.
【図6】 可撓性回路基板の端子部周辺に透孔を形成し
た構造の可撓性回路基板の他の実施例による端子部の斜
視構成図。FIG. 6 is a perspective configuration diagram of a terminal portion according to another embodiment of the flexible circuit board having a structure in which a through hole is formed around the terminal portion of the flexible circuit board.
【図7】 (1)及び(2)は可撓性回路基板の端子部
に弾力性を持たせる為の構造を説明する斜視構成図及び
そのB−B線断面構成図。7A and 7B are a perspective configuration diagram and a BB line cross-sectional configuration diagram illustrating a structure for giving elasticity to a terminal portion of a flexible circuit board.
【図8】 (1)及び(2)は可撓性回路基板の端子部
に弾力性を持たせる為の他の構造を説明する斜視構成図
及びそのC−C線断面構成図。8A and 8B are a perspective configuration diagram and a CC line cross-sectional configuration diagram illustrating another structure for giving elasticity to the terminal portion of the flexible circuit board.
【図9】 補助板単独で可撓性回路基板の端子部に弾力
性を付与させる構造の断面説明図。FIG. 9 is an explanatory cross-sectional view of a structure in which the auxiliary plate alone imparts elasticity to the terminal portion of the flexible circuit board.
【図10】従来のディンプル接続方式を説明する為の
図。FIG. 10 is a diagram for explaining a conventional dimple connection method.
【図11】その問題点を説明する為の図。FIG. 11 is a diagram for explaining the problem.
【図12】従来のバンプ接続方式を説明する為の図。FIG. 12 is a diagram for explaining a conventional bump connection method.
1 可撓性絶縁べ−ス材 2 端子部 2A 配線パタ−ン 3 接点状の隆起部 4 接着剤 5 補助板 6 突起部 7 U字状透孔 8 陥部 9 弾力性付与の透孔 10 弾力性付与の透孔 11 陥部 1 Flexible Insulation Base Material 2 Terminal Part 2A Wiring Pattern 3 Contact-Shaped Protrusion 4 Adhesive 5 Auxiliary Plate 6 Projection 7 U-Shaped Through Hole 8 Cave 9 Elasticity-Providing Through Hole 10 Elasticity Through hole for imparting sex 11 Cave
Claims (10)
合した補助板を具備し、この補助板は上記接続部の位置
に対応した所定の箇所に突起部を備え、この突起部の形
状に従って上記接続部には上向きに突起する接点状の隆
起部を有することを特徴とする可撓性回路基板の接続部
構造。1. A flexible circuit board is provided with an auxiliary plate laminated and joined to the back surface of the connection part, the auxiliary plate having projections at predetermined positions corresponding to the positions of the connection parts. A connection part structure of a flexible circuit board, wherein the connection part has a contact-shaped protrusion protruding upward according to the shape.
請求項1の可撓性回路基板の接続部構造。2. The connecting portion structure of a flexible circuit board according to claim 1, wherein a through hole is provided around a protrusion of the auxiliary plate.
を有するように構成した請求項1又は2の可撓性回路基
板の接続部構造。3. The flexible circuit board connecting portion structure according to claim 1, wherein the flexible circuit board has a through hole around a terminal portion thereof.
部を有する請求項1〜3の可撓性回路基板の接続部構
造。4. The connecting portion structure for a flexible circuit board according to claim 1, wherein a recess is formed on a bottom surface of the auxiliary plate located on the protrusion.
合した補助板を具備し、この補助板は上記接続部の位置
に対応した所定の箇所に突起部を備え、この突起部の形
状に従って上記接続部には上向きに突起する接点状の隆
起部を有し、隣接する上記端子部の接点状隆起部の間に
位置する部位の上記補助板の箇所には透孔を設けるよう
に構成した可撓性回路基板の接続部構造。5. An auxiliary plate laminated and joined to the back surface of the connecting portion of the flexible circuit board, the auxiliary plate having a protrusion at a predetermined position corresponding to the position of the connecting portion, According to the shape, the connecting portion has a contact-shaped ridge protruding upward, and a through hole is provided at a portion of the auxiliary plate located between the contact-shaped ridges of the adjacent terminal portions. Structure of the connecting portion of the configured flexible circuit board.
回路基板の部位にも透孔を備える請求5の可撓性回路基
板の接続部構造。6. The flexible circuit board connecting portion structure according to claim 5, wherein a through hole is also provided in a portion of the flexible circuit board located in the through hole of the auxiliary plate.
助板と、可撓性絶縁べ−ス材の一方面に所要の配線パタ
−ンと共に接続部を形成した可撓性回路基板とを用意
し、上記接続部の裏面に上記突起部を位置させた状態で
上記補助板を該接続部の裏面に積層接合することにより
その接続部に接点状の隆起部を形成することを特徴とす
る可撓性回路基板の接続部の形成法。7. An auxiliary plate having a required number of protrusions formed at predetermined locations, and a flexible circuit board having a connection portion formed on one surface of a flexible insulating base material together with a required wiring pattern. And forming a contact-like raised portion on the connection portion by laminating and joining the auxiliary plate to the back surface of the connection portion in a state where the protrusion is located on the back surface of the connection portion. Method for forming connection part of flexible circuit board.
など上記接点状の隆起部を形成するに必要な所定の形状
に形成される請求項7の可撓性回路基板の接続部の形成
法。8. The connecting portion of the flexible circuit board according to claim 7, wherein the protrusion of the auxiliary plate is formed in a predetermined shape required to form the contact-shaped raised portion such as a hemisphere or a trapezoid. Forming method.
か又は該突起部の底面に陥部を形成した補助板を使用す
る請求項7〜8の可撓性回路基板の接続部の形成法。9. A flexible circuit board connecting portion according to claim 7, wherein an auxiliary plate having a through hole formed around said protrusion or an auxiliary plate having a recess formed on the bottom surface of said protrusion is used. Forming method.
孔を形成したものを使用する請求項7〜9の可撓性回路
基板の接続部の形成法。10. The method for forming a connecting portion of a flexible circuit board according to claim 7, wherein a through hole is formed around the connecting portion of the flexible circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4270998A JPH0697608A (en) | 1992-09-14 | 1992-09-14 | Connection part structure of flexible circuit board and its forming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4270998A JPH0697608A (en) | 1992-09-14 | 1992-09-14 | Connection part structure of flexible circuit board and its forming method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0697608A true JPH0697608A (en) | 1994-04-08 |
Family
ID=17493985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4270998A Pending JPH0697608A (en) | 1992-09-14 | 1992-09-14 | Connection part structure of flexible circuit board and its forming method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0697608A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1480291A2 (en) | 2003-05-19 | 2004-11-24 | Siegfried Muck | Electronic assembly |
| US6891314B2 (en) | 2001-08-22 | 2005-05-10 | Fuji Xerox Co., Ltd | Lattice array-structured piezoelectric actuator and method for producing the same |
| US7482541B2 (en) | 2004-03-17 | 2009-01-27 | Seiko Epson Corporation | Panel for electro-optical apparatus, method of manufacture thereof, electro-optical apparatus and electronic apparatus |
| JP2017050354A (en) * | 2015-08-31 | 2017-03-09 | 日亜化学工業株式会社 | Semiconductor module |
| CN112974580A (en) * | 2021-05-11 | 2021-06-18 | 四川英创力电子科技股份有限公司 | Bent circuit board and processing equipment and method thereof |
-
1992
- 1992-09-14 JP JP4270998A patent/JPH0697608A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6891314B2 (en) | 2001-08-22 | 2005-05-10 | Fuji Xerox Co., Ltd | Lattice array-structured piezoelectric actuator and method for producing the same |
| EP1480291A2 (en) | 2003-05-19 | 2004-11-24 | Siegfried Muck | Electronic assembly |
| DE10322840A1 (en) * | 2003-05-19 | 2004-12-16 | Siegfried Muck | Electronic assembly |
| EP1480291A3 (en) * | 2003-05-19 | 2007-09-19 | Siegfried Muck | Electronic assembly |
| US7482541B2 (en) | 2004-03-17 | 2009-01-27 | Seiko Epson Corporation | Panel for electro-optical apparatus, method of manufacture thereof, electro-optical apparatus and electronic apparatus |
| JP2017050354A (en) * | 2015-08-31 | 2017-03-09 | 日亜化学工業株式会社 | Semiconductor module |
| CN112974580A (en) * | 2021-05-11 | 2021-06-18 | 四川英创力电子科技股份有限公司 | Bent circuit board and processing equipment and method thereof |
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