JPH0681775B2 - Method for producing polyhydroxy compound - Google Patents
Method for producing polyhydroxy compoundInfo
- Publication number
- JPH0681775B2 JPH0681775B2 JP62112056A JP11205687A JPH0681775B2 JP H0681775 B2 JPH0681775 B2 JP H0681775B2 JP 62112056 A JP62112056 A JP 62112056A JP 11205687 A JP11205687 A JP 11205687A JP H0681775 B2 JPH0681775 B2 JP H0681775B2
- Authority
- JP
- Japan
- Prior art keywords
- polyhydroxy compound
- phenols
- compound
- present
- mol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 150000001875 compounds Chemical class 0.000 title claims description 39
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 53
- 150000002989 phenols Chemical class 0.000 claims description 30
- 229920003987 resole Polymers 0.000 claims description 17
- 230000018044 dehydration Effects 0.000 claims description 8
- 238000006297 dehydration reaction Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 5
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 230000002378 acidificating effect Effects 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims description 2
- 238000009833 condensation Methods 0.000 claims description 2
- 230000005494 condensation Effects 0.000 claims description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 32
- 238000006243 chemical reaction Methods 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 13
- 239000000047 product Substances 0.000 description 13
- 229920005989 resin Polymers 0.000 description 13
- 239000011347 resin Substances 0.000 description 13
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 12
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- 229920003986 novolac Polymers 0.000 description 12
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 10
- 238000009826 distribution Methods 0.000 description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 9
- 229920000647 polyepoxide Polymers 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 6
- 238000006482 condensation reaction Methods 0.000 description 5
- 238000004821 distillation Methods 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- -1 usually Chemical class 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000003377 acid catalyst Substances 0.000 description 4
- 230000001588 bifunctional effect Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 235000006408 oxalic acid Nutrition 0.000 description 4
- 238000001256 steam distillation Methods 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 238000005755 formation reaction Methods 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 230000009257 reactivity Effects 0.000 description 3
- IXQGCWUGDFDQMF-UHFFFAOYSA-N 2-Ethylphenol Chemical compound CCC1=CC=CC=C1O IXQGCWUGDFDQMF-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- 229930040373 Paraformaldehyde Natural products 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- OVBPIULPVIDEAO-LBPRGKRZSA-N folic acid Chemical compound C=1N=C2NC(N)=NC(=O)C2=NC=1CNC1=CC=C(C(=O)N[C@@H](CCC(O)=O)C(O)=O)C=C1 OVBPIULPVIDEAO-LBPRGKRZSA-N 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229920002866 paraformaldehyde Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- UYVWNPAMKCDKRB-UHFFFAOYSA-N 1,2,4,5-tetraoxane Chemical compound C1OOCOO1 UYVWNPAMKCDKRB-UHFFFAOYSA-N 0.000 description 1
- BGJSXRVXTHVRSN-UHFFFAOYSA-N 1,3,5-trioxane Chemical compound C1OCOCO1 BGJSXRVXTHVRSN-UHFFFAOYSA-N 0.000 description 1
- VADKRMSMGWJZCF-UHFFFAOYSA-N 2-bromophenol Chemical compound OC1=CC=CC=C1Br VADKRMSMGWJZCF-UHFFFAOYSA-N 0.000 description 1
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- 229940126062 Compound A Drugs 0.000 description 1
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 1
- OVBPIULPVIDEAO-UHFFFAOYSA-N N-Pteroyl-L-glutaminsaeure Natural products C=1N=C2NC(N)=NC(=O)C2=NC=1CNC1=CC=C(C(=O)NC(CCC(O)=O)C(O)=O)C=C1 OVBPIULPVIDEAO-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- JNGZXGGOCLZBFB-IVCQMTBJSA-N compound E Chemical compound N([C@@H](C)C(=O)N[C@@H]1C(N(C)C2=CC=CC=C2C(C=2C=CC=CC=2)=N1)=O)C(=O)CC1=CC(F)=CC(F)=C1 JNGZXGGOCLZBFB-IVCQMTBJSA-N 0.000 description 1
- 239000007859 condensation product Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- PVAONLSZTBKFKM-UHFFFAOYSA-N diphenylmethanediol Chemical class C=1C=CC=CC=1C(O)(O)C1=CC=CC=C1 PVAONLSZTBKFKM-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229960000304 folic acid Drugs 0.000 description 1
- 235000019152 folic acid Nutrition 0.000 description 1
- 239000011724 folic acid Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 150000002440 hydroxy compounds Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- GJYCVCVHRSWLNY-UHFFFAOYSA-N ortho-butylphenol Natural products CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- LVTJOONKWUXEFR-FZRMHRINSA-N protoneodioscin Natural products O(C[C@@H](CC[C@]1(O)[C@H](C)[C@@H]2[C@]3(C)[C@H]([C@H]4[C@@H]([C@]5(C)C(=CC4)C[C@@H](O[C@@H]4[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@@H](O)[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@H](CO)O4)CC5)CC3)C[C@@H]2O1)C)[C@H]1[C@H](O)[C@H](O)[C@H](O)[C@@H](CO)O1 LVTJOONKWUXEFR-FZRMHRINSA-N 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000005292 vacuum distillation Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
Landscapes
- Phenolic Resins Or Amino Resins (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、新規なポリヒドロキシ化合物の製造法、詳し
くは分子量分布幅が狭く、しかも溶融粘度の低い新規に
して且つ有用なポリヒドロキシ化合物の製造法に関す
る。TECHNICAL FIELD The present invention relates to a novel method for producing a polyhydroxy compound, more specifically, a novel and useful method for producing a polyhydroxy compound having a narrow molecular weight distribution range and a low melt viscosity. Regarding
従来の技術 従来より、エポキシ樹脂の硬化剤としては、アミン類、
酸無水物、フエノールノボラツク樹脂等が用いられてき
たが、近年、積層板、封止材、粉体塗料等の用途におい
ても、製品の高性能化、低価格化の要請から、フエノー
ルノボラツク樹脂が見直され、該樹脂は殊に電気・電子
材料関係に好適に利用されている。しかして、該フエノ
ールノボラツク樹脂は、一般にフエノール類とホルムア
ルデヒドとを酸触媒の存在下で縮合反応させて得られ、
主としてメチレン結合により結合されたフエノール核2
〜20個から構成される分子量分布幅の広い直鎖状分子で
あると考えられている。上記原料フエノール類として
は、通常1個のフエノール性水酸基を有する石炭酸、オ
ルソクレゾール等が用いられ、その結果得られる樹脂は
未反応のフエノールモノマーと2核体からなる低布分子
量成分を含んでいる。これ等のことより、該樹脂はこれ
を硬化剤として用いた場合、架橋密度の高い硬化物を提
供し難く、従って得られる硬化物は耐熱性、耐薬品性、
機械特性等の点で満足しえないという欠点がある。また
一方、該樹脂は5核体以上の比較的高分子量の成分を多
量に含有するため、前記用途における成形加工時の流れ
性が十分でなく、その結果として作業性が劣るという欠
点もある。Conventional technology Conventionally, as curing agents for epoxy resins, amines,
Acid anhydrides, phenol novolac resins, etc. have been used, but in recent years, even in applications such as laminates, encapsulants, and powder coatings, due to the demand for higher performance and lower prices of products, phenol novolac resins have been used. The resin has been reviewed, and the resin is particularly preferably used for electrical / electronic materials. Thus, the phenol novolak resin is generally obtained by subjecting phenols and formaldehyde to a condensation reaction in the presence of an acid catalyst,
Phenol nuclei mainly linked by methylene bonds 2
It is considered to be a linear molecule with a wide molecular weight distribution consisting of ~ 20 molecules. As the above-mentioned raw material phenols, usually, carboxylic acid having one phenolic hydroxyl group, orthocresol, etc. are used, and the resulting resin contains unreacted phenol monomer and a low cloth molecular weight component consisting of a binuclear body. . From these things, when this resin is used as a curing agent, it is difficult to provide a cured product having a high cross-linking density, and thus the obtained cured product has heat resistance, chemical resistance,
It has a drawback that it is not satisfactory in terms of mechanical properties. On the other hand, since the resin contains a large amount of components having a relatively high molecular weight of 5 or more nuclei, the flowability at the time of molding and processing in the above applications is not sufficient, and as a result, workability is poor.
また、2種以上のフエノール類とホルムアルデヒドを同
時に仕込んで縮合反応させた共縮合ノボラツク樹脂も知
られているが、これも上記一般的なフエノールノボラツ
ク樹脂に見られると同様に分子量分布幅が広く、蒸留等
の操作によりモノマーの含有率を1重量%以下に調整し
た場合でも低分子量成分である2核体と高分子量成分で
ある5核体以上の分子を多く含有する。即ち、多分酸
度:Mw/Mn(Mwは重量平均分子量値、Mnは数平均分子量値
を示す)が比較的高い値を示すため、前記と同様に作業
性が劣るという不利がある。A co-condensed novolak resin obtained by simultaneously charging two or more phenols and formaldehyde and subjecting them to a condensation reaction is also known. This also has a wide molecular weight distribution range as seen in the above-mentioned general phenol novolak resin. Even when the content of the monomer is adjusted to 1% by weight or less by an operation such as distillation, it contains a large number of molecules of a dinuclear body which is a low molecular weight component and a pentanuclear body which is a high molecular weight component. That is, since the acidity: Mw / Mn (Mw indicates a weight average molecular weight value and Mn indicates a number average molecular weight value) is relatively high, the workability is inferior as in the above case.
発明が解決しようとする問題点 本発明は、前記従来技術に鑑み、殊にエポキシ樹脂の硬
化剤として優れた特性を有する新しい多官能性フエノー
ル樹脂、より詳しくは3核体及び4核体を主成分とする
分子量分布幅が狭い多官能性フエノール樹脂を製造する
方法を提供することを目的とする。DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention In view of the above-mentioned prior art, the present invention mainly relates to a new polyfunctional phenol resin having excellent properties as a curing agent for an epoxy resin, more particularly a trinuclear body and a tetranuclear body. An object of the present invention is to provide a method for producing a polyfunctional phenol resin having a narrow molecular weight distribution as a component.
問題点を解決するための手段 上記目的は、一般式 (式中、R1は炭素数1〜10のアルキル基を示す。)で表
わされるオルソ置換フエノール類1モルと、ホルムアル
デヒドもしくはホルムアルデヒド発生源物質1.5〜2.5モ
ルとをアルカリ性条件下に反応させて得たレゾール
(A)に対して、2官能以上のフエノール類(B)を、
(A)の製造時のオルソ置換フエノール類の使用量に対
して1.1〜20倍モルの使用割合で酸性条件下に縮合さ
せ、更に脱水及び脱モノマーして、3核体と4核体との
合計含有率が45重量%以上であり、且つ多分散度が1.20
以下であるポリヒドロキシ化合物を得ることを特徴とす
るポリヒドロキシ化合物の製造法により達成される。Means to solve the problem (In the formula, R 1 represents an alkyl group having 1 to 10 carbon atoms), obtained by reacting 1 mol of an ortho-substituted phenol with 1.5 to 2.5 mol of formaldehyde or a formaldehyde source material under alkaline conditions. Resol (A), difunctional or higher functional phenols (B),
Condensation under acidic conditions at a ratio of 1.1 to 20 times the molar amount of the ortho-substituted phenols used in the production of (A), further dehydration and demonomerization to give a trinuclear body and a tetranuclear body. Total content is 45% by weight or more and polydispersity is 1.20
This is achieved by a method for producing a polyhydroxy compound, characterized in that the following polyhydroxy compound is obtained.
ここに、上記特定のレゾール(A)は、 一般式 (式中、R1は前記と同じ。)で表わされるオルソ置換フ
エノール類のジメチロール誘導体及び/又は一般式 (式中、R1は前記と同じ。)で表わされるジヒドロキシ
ジフエニルメタンのジメチロール誘導体(一般式(2)
のジメチロール誘導体の縮合物)を主成分としてなるも
のである。Here, the specific resol (A) has the general formula (In the formula, R 1 is the same as above) and a dimethylol derivative of an ortho-substituted phenol and / or a general formula (In the formula, R 1 is the same as above.) A dimethylol derivative of dihydroxydiphenylmethane represented by the general formula (2)
(Condensation product of the dimethylol derivative of 1) as a main component.
本発明者は、鋭意研究の結果、上記の通り、特定のレゾ
ール(A)を出発原料として用い、これを酸触媒の存在
下に2官能以上のフエノール類(B)をレゾール中のメ
チロール基に対し過剰量で反応させるときには、引続き
通常の蒸留操作等により脱水及び脱モノマー行うことに
より目的とする化合物が得られることを見出し、ここに
本発明を完成した。As a result of earnest research, the present inventor, as described above, uses a specific resol (A) as a starting material, and uses this in the presence of an acid catalyst to convert a bifunctional or higher functional phenol (B) into a methylol group in the resol. On the other hand, when the reaction was carried out in an excess amount, it was found that the desired compound can be obtained by subsequent dehydration and demomerization by ordinary distillation operation, and the present invention was completed here.
本発明により得られるポリヒドロキシ化合物は、3核体
及び4核体を主成分とする分子量分布幅の狭い樹脂であ
り、しかも従来の同一軟化点のノボラツク樹脂と比較し
て溶融粘度が低いという特長がある。そのためエポキシ
樹脂の硬化剤として非常に優れた特長を発揮でき、例え
ば、成形材料として使用した場合には、流れ性が良好な
材料を提供でき、該材料を硬化させて得られる硬化物は
機械特性、耐薬品性に優れることはもとより、殊に耐熱
性の点で優秀である。The polyhydroxy compound obtained by the present invention is a resin having a narrow molecular weight distribution containing trinuclear and tetranuclear as main components, and has a low melt viscosity as compared with a conventional novolak resin having the same softening point. There is. Therefore, it can exhibit extremely excellent characteristics as a curing agent for epoxy resin. For example, when used as a molding material, it can provide a material with good flowability, and a cured product obtained by curing the material has mechanical properties. In addition to being excellent in chemical resistance, it is particularly excellent in heat resistance.
本発明においては、オルソ置換フエノール類を出発原料
たる特定レゾール(A)の使用成分として用いるが、該
オルソ置換フエノール類としては、オルソクレゾール、
オルソエチルフエノール、オルソプロピルフエノール、
オルソブチルフエノール、オルソノニルフエノール等を
例示できるが、原料価格、後述するノボラツク化時の反
応性等の点を考慮すればオルソクレゾールが好ましい。
該オルソ置換フエノール類から誘導される特定レゾー
ル、即ち一般式(2)及び/又は一般式(3)で表わさ
れる主成分たるジメチロール誘導体は、例えばE.S.Gran
ger,Industrial and Engineering Chemistry,24,442,
(1932)あるいはF.Hanus,Journalfr Praktiche Chem
ie,155,317(1940)等の文献記載の方法を採用すること
により容易に得られる。より具体的には、前記オルソ置
換フエノール類1モルに対してホルムアルデヒドもしく
はホルムアルデヒド発生源物質1.5〜2.5モルを、水酸化
ナトリウム、水酸化カリウム等のアルカリ触媒の存在下
に10〜60℃程度で、1週間〜数時間程度、メチロール化
反応させることにより前記特定のレゾール(A)を収得
しうる。アルカリ触媒の使用量は、通常該フエノール類
に対し0.8〜1.2倍モル量、好ましくは0.9〜1.1倍モル量
とされる。前記のホルムアルデヒド発生源物質とは、パ
ラホルムアルデヒド、トリオキサン、テトラオキサン等
のレゾール化条件下でホルムアルデヒドを発生する各種
のものをいう。上記において、ホルムアルデヒド、該発
生源物質の使用量が、1.5モルに満たない場合は、オル
ソ置換フエノール類のモノメチロール体の生成量がふ
え、その結果、一般式(2)及び(3)のジメチロール
誘導体の収率が低下することとなる。該モノメチロール
体は引続くノボラツク化工程を経由しても本発明の3核
体、4核体とはならず、2核体を生成することとなるた
め好ましくない。一方、2.5モルを越える場合は、未反
応のホルムアルデヒドが多量に存在することとなり、水
洗処理が必要となったり、コスト高となるため好ましく
ない。該方法で得られる反応物は、通常未精製のオイル
状物のままで使用するが、精製して使用することもでき
る。In the present invention, ortho-substituted phenols are used as the starting component of the specific resol (A), and the ortho-substituted phenols include ortho-cresol,
Orthoethylphenol, orthopropylphenol,
Orthobutylphenol, orthononylphenol and the like can be exemplified, but orthocresol is preferable in consideration of the raw material price, the reactivity at the time of novolak formation described later and the like.
The specific resole derived from the ortho-substituted phenol, that is, the dimethylol derivative as the main component represented by the general formula (2) and / or the general formula (3) is, for example, ESGran.
ger, Industrial and Engineering Chemistry, 24 , 442,
(1932) or F. Hanus, Journalfr Praktiche Chem
It can be easily obtained by adopting the method described in the literature such as ie, 155 , 317 (1940). More specifically, formaldehyde or formaldehyde generating substance 1.5 to 2.5 mol per 1 mol of the ortho-substituted phenols in the presence of an alkali catalyst such as sodium hydroxide or potassium hydroxide at about 10 to 60 ° C. The specific resol (A) can be obtained by performing a methylolation reaction for about 1 week to several hours. The amount of the alkali catalyst used is usually 0.8 to 1.2 times, preferably 0.9 to 1.1 times the molar amount of the phenols. The above-mentioned formaldehyde generating source substance refers to various substances such as paraformaldehyde, trioxane and tetraoxane which generate formaldehyde under resolization conditions. In the above, when the use amount of formaldehyde and the source substance is less than 1.5 mol, the production amount of the monomethylol body of the ortho-substituted phenols is increased, and as a result, the dimethylol of the general formulas (2) and (3) is obtained. The yield of the derivative will decrease. The monomethylol body does not become the trinuclear body or tetranuclear body of the present invention even if it undergoes the subsequent novolakization step, and it is not preferable because it produces a binuclear body. On the other hand, if the amount exceeds 2.5 mols, unreacted formaldehyde will be present in a large amount, which requires washing with water and increases the cost, which is not preferable. The reaction product obtained by this method is usually used as it is as an unpurified oily product, but it can also be used after purification.
本発明におけるもう一方の原料である2官能以上のフエ
ノール類(B)としては、石炭酸の他、例えばクレゾー
ル、キシレノール等のアルキル置換フエノール類、クロ
ロフエノール、ブロモフエノール等のハロゲン化フエノ
ール類等が挙げられる。これらのうちで反応性を考慮す
れば石炭酸及びクレゾールが好ましい。ここで、官能数
は、フエノール類分子中に存するホルムアルデヒドと反
応しうる活性位置の数を意味する。Examples of the bifunctional or higher functional phenols (B) as the other raw material in the present invention include, in addition to carboxylic acids, alkyl-substituted phenols such as cresol and xylenol, halogenated phenols such as chlorophenol and bromophenol, and the like. To be Of these, folic acid and cresol are preferable in consideration of reactivity. Here, the functional number means the number of active positions capable of reacting with formaldehyde present in a molecule of phenols.
本発明方法では、まず上記の特定レゾール(A)と2官
能以上のフエノール類(B)とを、酸触媒の存在下に加
熱反応させる。ここで使用する酸触媒としては、特に制
限はされず通常のノボラツク反応に用いられる各種のも
のをいずれも使用できる。そのうちで特にシユウ酸は好
適である。該レゾールに対する該フエノール類の使用量
は、該レゾールの製造原料である前記オルソ置換フエノ
ール類の使用量を基準として決定され、オルソ置換フエ
ノール類に対して1.1〜20倍モル量、好ましくは3〜10
倍モル量とするのがよい。即ち、本発明では、上記のよ
うに該レゾールに対して過剰の該フエノール類を用いる
ことによって、レゾールに存在するメチロール基相互の
縮合反応を抑え、5核体以上の高分子量成分の生成を最
小限に抑制させるものである。2官能以上のフエノール
類の使用量が1.1倍モルを下回る場合には、得られる目
的物に占める5核体以上の高分子量成分の含有量が多く
なり、目的物の溶融粘度が高くなる傾向がるため好まし
くない。20倍モルを越えるのは、前記範囲を越えて更に
過剰に使用しても多分散度を低下させる意義は小さいこ
と及び得られるポリヒドロキシ化合物のコストが高くな
るため好ましくない。In the method of the present invention, the specific resol (A) and the bifunctional or higher functional phenols (B) are first heated and reacted in the presence of an acid catalyst. The acid catalyst used here is not particularly limited and any of various kinds used in ordinary novolak reaction can be used. Of these, oxalic acid is particularly preferable. The amount of the phenols used with respect to the resole is determined on the basis of the amount of the ortho-substituted phenols used as a raw material for producing the resole, and is 1.1 to 20 times the molar amount of the ortho-substituted phenols, preferably 3 to Ten
It is preferable to use a double molar amount. That is, in the present invention, by using an excess of the phenols with respect to the resole as described above, the condensation reaction between the methylol groups present in the resole is suppressed, and the formation of a high molecular weight component of pentanuclear or higher is minimized. It is what is suppressed to the limit. When the amount of the bifunctional or higher functional phenols used is less than 1.1 times the molar amount, the content of the high molecular weight component having 5 or more nuclides in the obtained target product increases, and the melt viscosity of the target product tends to increase. Therefore, it is not preferable. If the amount exceeds 20 times the molar amount, it is not preferable because the polydispersity is not significantly reduced even if the amount exceeds the above range and the polydispersity is further increased.
上記反応条件は、前記レゾールと該フエノール類との反
応性を考慮して適宜決定されるが、通常約50〜100℃、
好ましくは約60〜80℃の温度条件が反応でき、約3〜6
時間上記温度で加熱するのがよい。また、反応生成物中
に存在するイオン性不純物を除去するため、反応生成物
を数回程度、適宜水洗操作を行ってもよい。The reaction conditions are appropriately determined in consideration of the reactivity between the resole and the phenols, but usually about 50 to 100 ° C,
Preferably, a temperature condition of about 60 to 80 ° C. can react and a temperature of about 3 to 6
It is preferable to heat at the above temperature for a time. Further, in order to remove ionic impurities existing in the reaction product, the reaction product may be appropriately washed with water several times.
本発明では、次いで脱水及び脱モノマーを行う。脱モノ
マーは、主として、未反応の前記フエノール類(B)を
除去するものである。脱水及び脱モノマーは、具体的に
は、通常の蒸留操作に従って行なわれる。この蒸留方法
は、特に制限はされず、公知の各種方法、例えば減圧蒸
留、薄膜蒸留、水蒸気蒸留等のいずれによってもよい。In the present invention, dehydration and demonomer are then performed. Demonomer mainly removes the unreacted phenols (B). Dehydration and demomerization are specifically carried out according to ordinary distillation operations. This distillation method is not particularly limited and may be any of various known methods such as vacuum distillation, thin film distillation and steam distillation.
かくして、本発明によれば、3核体及び4核体の合計含
有率が45重量%以上であり、且つ多分散度が1.20以下の
分子量分布幅の狭い所望のポリヒドロキシ化合物を得る
ことができる。該含有率が45重量%以下であれば、通常
多分散度も1.20以下となり、これを用いることにより、
本発明の目的とする成形加工時の流動特性等が発揮され
る。Thus, according to the present invention, a desired polyhydroxy compound having a total content of trinuclear and tetranuclear bodies of 45% by weight or more and a polydispersity of 1.20 or less and a narrow molecular weight distribution can be obtained. . When the content is 45% by weight or less, the polydispersity is usually 1.20 or less, and by using this,
The flow characteristics and the like at the time of molding, which is the object of the present invention, are exhibited.
本発明方法により得られるポリヒドロキシ化合物は、下
記一般式 (式中、R1は前記と同じ。R2及びR3は、水素原子、アル
キル基又はハロゲン原子を各々示す。)及び/又は一般
式 (式中、R1、R2及びR3は前記と同じ。)で表わされるフ
エノール核で換算して3核体又は4核体を主体とするフ
エノールノボラツク樹脂であると推定される。一般式
(4)及び(5)において、R2及びR3はフエノール類
(B)に由来するものである。The polyhydroxy compound obtained by the method of the present invention has the following general formula: (In the formula, R 1 is the same as the above. R 2 and R 3 each represent a hydrogen atom, an alkyl group or a halogen atom.) And / or the general formula (In the formula, R 1 , R 2 and R 3 are the same as above.) It is presumed to be a phenol novolak resin mainly composed of a trinuclear body or a tetranuclear body when converted into a phenol nucleus. In the general formulas (4) and (5), R 2 and R 3 are derived from the phenols (B).
本発明方法により得られる上記ポリヒドロキシ化合物
は、エポキシ樹脂の硬化剤として非常に有用である。該
硬化剤としての利用に当り、本発明ポリヒドロキシ化合
物は、各種エポキシ樹脂及び必要に応じて硬化促進剤、
その他の添加剤等と配合され、エポキシ樹脂組成物とさ
れ、例えば電子部品の封止材料、積層板、粉体塗料等の
用途に好適に使用することができる。更に該ポリヒドロ
キシ化合物は、ポリウレタン用のポリオール成分として
あるいはエポキシ樹脂原料としても用いることができ
る。The polyhydroxy compound obtained by the method of the present invention is very useful as a curing agent for epoxy resins. When used as the curing agent, the polyhydroxy compound of the present invention contains various epoxy resins and, if necessary, a curing accelerator,
It is mixed with other additives and the like to give an epoxy resin composition, which can be suitably used for applications such as a sealing material for electronic parts, a laminated board, and a powder coating material. Further, the polyhydroxy compound can be used as a polyol component for polyurethane or as an epoxy resin raw material.
発明の効果 本発明方法により得られる上記ポリヒドロキシ化合物
は、(1)同一軟化点を有する従来のノボラツク樹脂と
比較した場合、分子量分布幅が狭いことに起因して溶融
粘度が低い。そのため(2)エポキシ樹脂の硬化剤とし
て使用した場合には、配合物の粘度も低下し、成形時の
作業性が顕著に向上する。また、(3)同一軟化点を有
する従来のノボラツク樹脂と比較して、エポキシ樹脂と
硬化させて得られる硬化物のガラス転移点が高くなるた
め、該硬化物の耐熱性が改良される等の効果を奏するも
のである。EFFECTS OF THE INVENTION The polyhydroxy compound obtained by the method of the present invention has a low melt viscosity due to its narrow molecular weight distribution width (1) when compared with a conventional novolak resin having the same softening point. Therefore, (2) when it is used as a curing agent for an epoxy resin, the viscosity of the compound is reduced, and the workability during molding is significantly improved. Further, (3) the glass transition point of a cured product obtained by curing with an epoxy resin is higher than that of a conventional novolak resin having the same softening point, so that the heat resistance of the cured product is improved. It is effective.
実施例 以下、本発明の実施例及び比較例を挙げ、本発明を更に
詳しく説明するが、本発明は、これら各例に限定される
ものではない。尚、各例中、部及び%な特記しない限り
全て重量基準である。EXAMPLES Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples of the present invention, but the present invention is not limited to these examples. In each example, all parts and percentages are by weight unless otherwise specified.
実施例 1 攪拌機、温度計及び冷却器を備えた500ml容フラスコ内
を窒素ガスで置換した後、オルソクレゾール54g(0.5モ
ル)及び37%ホルマリン81g(1モル)を入れ、窒素気
流下に撹拌しながら30℃に保温し、10%水酸化ナトリウ
ム水溶液200g(NaOHとして0.5モル)を滴下した。同温
度で1時間保温した後、更に50℃で1時間加温し、メチ
ロール化反応を行った。次いで、30℃に冷却し、20%硫
酸123g(H2SO4として0.25モル)により中和し、オイル
状レゾール89gを得た。該レゾール89gに対し、オルソク
レゾール162g(1.5モル)とシユウ酸1gを加え、75℃で
4時間縮合反応を行い、更に減圧下に脱水し、水蒸気蒸
留により脱モノマーを行い、未反応のオルソクレゾール
含量が0.5%以下になるように調整し、本発明のポリヒ
ドロキシ化合物115gを得た。これを化合物Aという。Example 1 After replacing the inside of a 500 ml flask equipped with a stirrer, a thermometer and a cooler with nitrogen gas, 54 g (0.5 mol) of orthocresol and 81 g (1 mol) of 37% formalin were added and stirred under a nitrogen stream. While keeping the temperature at 30 ° C., 200 g of 10% aqueous sodium hydroxide solution (0.5 mol as NaOH) was added dropwise. After keeping the temperature at the same temperature for 1 hour, it was further heated at 50 ° C. for 1 hour to carry out a methylolation reaction. Then, the mixture was cooled to 30 ° C. and neutralized with 123 g of 20% sulfuric acid (0.25 mol as H 2 SO 4 ) to obtain 89 g of oily resol. To 89 g of the resol, 162 g (1.5 mol) of orthocresol and 1 g of oxalic acid were added, a condensation reaction was carried out at 75 ° C. for 4 hours, dehydration was further performed under reduced pressure, and demonomerization was carried out by steam distillation to obtain unreacted orthocresol. The content was adjusted to 0.5% or less to obtain 115 g of the polyhydroxy compound of the present invention. This is called compound A.
実施例 2 実施例1において、ノボラツク化反応に使用するオルソ
クレゾールの使用量を270gに増加させた他は同様にして
反応を行い、フエノールモノマー含量が0.5%以下のポ
リヒドロキシ化合物120gを得た。これを化合物Bとい
う。Example 2 The reaction was performed in the same manner as in Example 1 except that the amount of orthocresol used in the novolakization reaction was increased to 270 g to obtain 120 g of a polyhydroxy compound having a phenol monomer content of 0.5% or less. This is called compound B.
実施例 3 実施例1と同様の反応装置を窒素ガスで置換した後、オ
ルソクレゾール54g及び37%ホルマリン81gを入れ、窒素
気流下に撹拌しながら30℃に保温し、10%水酸化ナトリ
ウム水溶液200gを滴下した。次いで65℃に加温し、同温
度で4時間メチロール化反応を行った。この後、30℃に
冷却し、20%硫酸123gにより中和し、オイル状レゾール
86gを得た。該レゾール86gに対し、オルソクレゾール16
2gとシユウ酸1gを加え、75℃で4時間縮合反応を行い、
更に減圧下に脱水し、水蒸気蒸留により脱モノマーを行
い、未反応のオルソクレゾール含量が0.5%以下になる
ように調整し、本発明のポリヒドロキシ化合物112gを得
た。これを化合物Cという。Example 3 The same reactor as in Example 1 was replaced with nitrogen gas, 54 g of orthocresol and 81 g of 37% formalin were added, and the mixture was kept at 30 ° C. with stirring under a nitrogen stream and 200 g of 10% aqueous sodium hydroxide solution. Was dripped. Then, the mixture was heated to 65 ° C., and methylolation reaction was carried out at the same temperature for 4 hours. After that, cool to 30 ° C and neutralize with 123 g of 20% sulfuric acid.
86 g was obtained. Orthocresol 16 to the resol 86 g
Add 2g and 1g of oxalic acid and carry out condensation reaction at 75 ℃ for 4 hours.
Furthermore, dehydration was performed under reduced pressure, and demomer was performed by steam distillation to adjust the unreacted orthocresol content to 0.5% or less, to obtain 112 g of the polyhydroxy compound of the present invention. This is called compound C.
実施例 4 実施例3において、ノボラツク化反応に使用するオルソ
クレゾールの使用量を270gに増加させた他は同様にして
反応を行い、未反応のオルソクレゾール含量が0.5%以
下のポリヒドロキシ化合物114gを得た。これを化合物D
という。Example 4 In Example 3, the same reaction was performed except that the amount of orthocresol used in the novolak formation reaction was increased to 270 g, and 114 g of unreacted polyhydroxy compound having an orthocresol content of 0.5% or less was obtained. Obtained. This is compound D
Say.
比較例 1 攪拌機、温度計及び冷却器を備えた1容フラスコ内を
窒素ガスで置換した後、オルソクレゾール378g(3.5モ
ル)、37%ホルマリン213g(2.63モル)及びシユウ酸3.
8gを入れ、窒素気流下に還流温度で3時間反応を行い、
その後減圧下に脱水し、水蒸気蒸留により脱フエノール
を行い、未反応のオルソクレゾール含量が0.5%以下に
なるように調整し、ポリヒドロキシ化合物367gを得た。
これを化合物Eという。Comparative Example 1 After replacing the inside of a 1-volume flask equipped with a stirrer, a thermometer and a condenser with nitrogen gas, 378 g (3.5 mol) of orthocresol, 213 g (2.63 mol) of 37% formalin and oxalic acid 3.
8g was added, and the reaction was carried out at reflux temperature for 3 hours under nitrogen flow.
Then, dehydration was performed under reduced pressure, and dephenol was performed by steam distillation to adjust the unreacted orthocresol content to 0.5% or less to obtain 367 g of a polyhydroxy compound.
This is called compound E.
比較例 2 比較例1において、37%ホルマリンの使用量を187gに減
少させた他は同様にして反応を行い、未反応のオルソク
レゾール含量が0.5%以下のポリヒドロキシ化合物355g
を得た。これを化合物Fという。Comparative Example 2 The reaction was performed in the same manner as in Comparative Example 1, except that the amount of 37% formalin used was reduced to 187 g, and 355 g of a polyhydroxy compound having an unreacted orthocresol content of 0.5% or less.
Got This is called compound F.
比較例 3 比較例1において、37%ホルマリン213gに代えて37%ホ
ルマリン121g及び92%パラホルムアルデヒド48.5gを用
いた他は同様にして反応を行い、未反応のオルソクレゾ
ール含量が0.5%以下のポリヒドロキシ化合物390gを得
た。これを化合物Gという。Comparative Example 3 The reaction was performed in the same manner as in Comparative Example 1 except that 121 g of 37% formalin and 48.5 g of 92% paraformaldehyde were used in place of 213 g of 37% formalin, and the reaction was carried out in the same manner. 390 g of hydroxy compound was obtained. This is called compound G.
比較例 4 比較例1において、37%ホルマリンの使用量を263gに増
加させた他は同様にして反応を行い、未反応のオルソク
レゾール含量が0.5%以下のポリヒドロキシ化合物383g
を得た。これを化合物Hという。Comparative Example 4 The reaction was performed in the same manner as in Comparative Example 1 except that the amount of 37% formalin used was increased to 263 g, and 383 g of a polyhydroxy compound having an unreacted orthocresol content of 0.5% or less.
Got This is called compound H.
上記実施例1〜4及び比較例1〜4で得られた各種ポリ
ヒドロキシ化合物の性状を求めた結果を第1表及び第1
〜4図に示す。Table 1 and Table 1 show the results of the properties of the various polyhydroxy compounds obtained in Examples 1 to 4 and Comparative Examples 1 to 4 above.
~ Fig. 4 shows.
第1表において、溶融粘度はB型粘度計(東京計器
(株)製)に少量サンプルアダプタを組合わせ、サンプ
ル量10g、HM形ローターNo.2、150℃の条件で測定した。
軟化点は環球法により求めたものである。各成分含量及
びMw/Mnは、カラム(東洋曹達(株)製、「TSKゲルG−
2000HxL」及び「G−1000HxL」を直列に構成)を、高速
液体クロマトグラフ測定装置(同社製、「HLC−802
0」)を用いて測定されたものであり、データ処理は同
社製「CP−8000」により行った。また、ガラス転移点の
測定は、TMA(Thermo Mechanical Analysis)法により
理学電機工業(株)製の測定装置を用いて行った。尚、
液状エポキシ樹脂(油化シエルエポキシ(株)製、「エ
ピコート828」)100部、実施例又は比較例で得た各種ポ
リヒドロキシ化合物63部及び2−メチルイミダゾール1
部を均一に混合し、これを175℃、2時間で硬化させた
ものを試料片として硬化物のTgを測定した。In Table 1, the melt viscosity was measured under the conditions of a B-type viscometer (manufactured by Tokyo Keiki Co., Ltd.) and a small amount of sample adapter, a sample amount of 10 g, an HM type rotor No. 2 and 150 ° C.
The softening point is obtained by the ring and ball method. The content of each component and Mw / Mn are columns (Toyo Soda Co., Ltd., "TSK gel G-
2000HxL "and" G-1000HxL "are connected in series, and a high-performance liquid chromatograph measuring device (manufactured by the same company," HLC-802 "
0 ”), and data processing was performed by“ CP-8000 ”manufactured by the same company. Further, the glass transition point was measured by a measuring device manufactured by Rigaku Denki Kogyo Co., Ltd. by the TMA (Thermo Mechanical Analysis) method. still,
100 parts of liquid epoxy resin ("Epicote 828" manufactured by Yuka Shell Epoxy Co., Ltd.), 63 parts of various polyhydroxy compounds obtained in Examples or Comparative Examples, and 2-methylimidazole 1
The parts were uniformly mixed and cured at 175 ° C. for 2 hours, and the cured product was used as a sample piece to measure the Tg of the cured product.
第1表より明らかなように、本発明方法で得られたポリ
ヒドロキシ化合物は、ほぼ同一の軟化点の比較例のもの
と比べて、いずれも溶融粘度が低く、そのため各種用途
での作業性が向上することは明らかである。また、硬化
物のTgも高いため、該硬化物の耐熱性、機械特性等も向
上することになる。 As is clear from Table 1, the polyhydroxy compounds obtained by the method of the present invention have lower melt viscosities than those of the comparative examples having almost the same softening point, and therefore, the workability in various applications is high. It is clear that it will improve. Further, since the cured product has a high Tg, the cured product has improved heat resistance, mechanical properties and the like.
第1〜4図は、化合物B、化合物D、化合物F、化合物
Hの各々について高速液体クロマトグラフ測定装置(東
洋曹達(株)製、「HLC−8020」)を用いて測定した分
子量分布を示すグラフであり、図中、横軸は溶出時間
を、縦軸はピーク強度を示す。第1図、第2図におい
て、いずれも4核体はピークNo.2に、3核体はピークN
o.3に対応する。第3図、第4図において、いずれも4
核体はピークNo.3に、3核体はピークNo.4に対応する。1 to 4 show the molecular weight distributions of each of Compound B, Compound D, Compound F, and Compound H measured by using a high performance liquid chromatograph measuring apparatus ("HLC-8020" manufactured by Toyo Soda Co., Ltd.). In the graph, the horizontal axis represents elution time and the vertical axis represents peak intensity. In Figures 1 and 2, the tetranuclear body has peak No. 2 and the trinuclear body has peak N.
Corresponds to o.3. 3 and 4, both are 4
Nucleus corresponds to peak No. 3 and trinuclear corresponds to peak No. 4.
各図の対比より明らかな通り、本発明方法により得られ
るポリヒドロキシ化合物(第1図及び第2図)は、比較
例で得た化合物(第3図及び第4図)に比し、分子量分
布が狭く、しかも3核体及び4核体を主成分としている
ことが判る。As is clear from the comparison between the figures, the polyhydroxy compound obtained by the method of the present invention (FIGS. 1 and 2) has a molecular weight distribution higher than that of the compound obtained in the comparative example (FIGS. 3 and 4). Is narrow, and it is understood that the main components are trinuclear bodies and tetranuclear bodies.
第1〜4図は、本発明実施例2及び4で得たポリヒドロ
キシ化合物並びに比較例2及び4で得たポリヒドロキシ
化合物の各々の分子量分布を求めたグラフである。1 to 4 are graphs in which the molecular weight distributions of the polyhydroxy compounds obtained in Examples 2 and 4 of the present invention and the polyhydroxy compounds obtained in Comparative Examples 2 and 4 were determined.
Claims (1)
わされるオルソ置換フエノール類1モルと、ホルムアル
デヒドもしくはホルムアルデヒド発生源物質1.5〜2.5モ
ルとをアルカリ性条件下に反応させて得たレゾール
(A)に対して、2官能以上のフエノール類(B)を、
(A)の製造時のオルソ置換フエノール類の使用量に対
して1.1〜20倍モルの使用割合で酸性条件下に縮合さ
せ、更に脱水及び脱モノマーして、3核体と4核体との
合計含有率が45重量%以上であり、且つ多分散度が1.20
以下であるポリヒドロキシ化合物を得ることを特徴とす
るポリヒドロキシ化合物の製造法。1. A general formula (In the formula, R 1 represents an alkyl group having 1 to 10 carbon atoms), obtained by reacting 1 mol of an ortho-substituted phenol with 1.5 to 2.5 mol of formaldehyde or a formaldehyde source material under alkaline conditions. Resol (A), difunctional or higher functional phenols (B),
Condensation under acidic conditions at a ratio of 1.1 to 20 times the molar amount of the ortho-substituted phenols used in the production of (A), further dehydration and demonomerization to give a trinuclear body and a tetranuclear body. Total content is 45% by weight or more and polydispersity is 1.20
A method for producing a polyhydroxy compound, which comprises obtaining the following polyhydroxy compound.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62112056A JPH0681775B2 (en) | 1987-05-07 | 1987-05-07 | Method for producing polyhydroxy compound |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62112056A JPH0681775B2 (en) | 1987-05-07 | 1987-05-07 | Method for producing polyhydroxy compound |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63275620A JPS63275620A (en) | 1988-11-14 |
| JPH0681775B2 true JPH0681775B2 (en) | 1994-10-19 |
Family
ID=14576930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62112056A Expired - Lifetime JPH0681775B2 (en) | 1987-05-07 | 1987-05-07 | Method for producing polyhydroxy compound |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0681775B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04318017A (en) * | 1991-04-15 | 1992-11-09 | Yuka Shell Epoxy Kk | Novolak type epoxy resin |
| ES2306796T3 (en) | 2001-11-16 | 2008-11-16 | Asahi Organic Chemicals Industry Co., Ltd. | PROCEDURE FOR THE PRODUCTION OF FELONIC NOVOLACAS. |
| JP5254590B2 (en) * | 2007-10-17 | 2013-08-07 | 昭和電工株式会社 | Low molecular weight novolak resin, method for producing the same, and thermosetting resin composition using the same |
| JP2010143998A (en) * | 2008-12-17 | 2010-07-01 | Showa Highpolymer Co Ltd | Curing agent for epoxy resin and epoxy resin composition containing the same |
| JP6125967B2 (en) | 2013-09-30 | 2017-05-10 | 明和化成株式会社 | Epoxy resin composition, sealing material, cured product thereof, and phenol resin |
| JP6724264B2 (en) * | 2018-03-27 | 2020-07-15 | 明和化成株式会社 | Phenolic resin and method for producing the same, epoxy resin composition and cured product thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0662731B2 (en) * | 1986-03-14 | 1994-08-17 | 旭チバ株式会社 | Production method of novolac resin |
-
1987
- 1987-05-07 JP JP62112056A patent/JPH0681775B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63275620A (en) | 1988-11-14 |
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