JPH06104101B2 - Imaging device - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an image pickup apparatus in which the temperature of a solid-state image pickup element is prevented from rising.

[Problems to be Solved by Conventional Techniques and Inventions] In recent years, by inserting an elongated insertion portion into a body cavity, the inside of the body cavity is observed and, if necessary, treatment treatment is performed using a treatment tool. Alternatively, an endoscope apparatus which can insert the above-mentioned insertion portion into a tube hole and observe the inside of the tube hole is widely used.

In this endoscope device, an optical endoscope in which, for example, a fiber bundle is used as a transmission optical system, and an electronic endoscope in which a solid-state image pickup device such as a charge coupled device (CCD) is used as an image pickup device There is. This electronic endoscope has advantages that it has a higher resolution than that of an optical type, that images can be easily stored and reproduced, and that enlargement and comparison of different images are easy.

The solid-state image sensor is fixed at an image forming position by an objective lens as disclosed in, for example, Japanese Patent Laid-Open No. 63-2721807, and an optical image of a visual observation site formed by the objective lens is Photoelectrically converted by the solid-state image sensor,
It is configured to be amplified by an amplifier circuit provided on the circuit board. Then, this amplified signal is input to the video signal processing circuit in the video processor through the signal cable connected to the circuit board, and after being converted into a video signal by the processing circuit, the video signal is displayed on the television monitor. By being output, the image of the observed portion can be observed through this television monitor.

However, the amplifier circuit generates heat during operation. In addition, a regulator is generally arranged on the circuit board, and this regulator also generates heat during operation. When the heat of the heat generating portion such as the amplifier circuit or the regulator is transferred to the solid-state image sensor, the temperature of the solid-state image sensor rises above the standard operating temperature, thermal noise occurs, and the image displayed on the TV monitor is displayed. Along with the deterioration, the durability of the solid-state imaging device also deteriorates.

For example, while the standard operating temperature of the solid-state image sensor is about 55 ° C., the operating limit operating temperature of the amplification IC, which is an example of the amplifier circuit, is 70 ° C. or higher, and the solid-state image sensor is lower in thermal capability. In an experiment assuming that the solid-state image sensor is placed close to the solid-state image sensor, the temperature of the solid-state image sensor rises to about 58 ° C.

To deal with this, it is difficult to transfer the heat of the heat generating part to the solid-state image sensor by disposing the heat generating part in a part sufficiently separated from the solid-state image sensor, that is, at the hand side or in the middle of the insertion part. However, if the heat generating portion such as the amplifier circuit and the solid-state imaging device are separated from each other, the distance for signal transmission becomes long and the possibility that disturbance noise may enter increases. However, the device may become large.

[Object of the Invention] The present invention has been made in view of these circumstances, and prevents deterioration of an image and durability of a solid-state imaging device by preventing the temperature of the solid-state imaging device from rising due to heat of a heat generating portion. It is an object of the present invention to provide an imaging device capable of preventing a decrease in size and preventing an increase in size of the device.

[Means and Actions for Solving the Problems] An imaging device according to the present invention includes a solid-state imaging device, an amplifier circuit connected to the solid-state imaging device, which generates a large amount of heat, and a signal transmission cable connected to the amplifier circuit. In an imaging device, a passive electronic component such as a capacitor is installed in a space between the solid-state image sensor and the amplification circuit, and heat transfer between the amplification circuit and the signal transmission cable is improved. It is characterized in that it has been improved in heat conductivity between and.

With this configuration, it is possible to prevent heat of the amplifier circuit, which generates a large amount of heat, from being transferred to the signal transmission cable side and thus transferred to the solid-state imaging device, and also to prevent the temperature of the solid-state imaging device from rising.

Embodiments of the Invention Embodiments of the present invention will be described below with reference to the drawings.

1 to 7 relate to a first embodiment of the present invention. FIG. 1 is a side view of an image pickup apparatus, FIG. 2 is a side view of a tip portion, FIG. 3 is a front view of a tip portion, and FIG. FIG. 5 is a schematic configuration diagram of the endoscope system, FIG. 5 is an explanatory diagram of an image, FIG. 6 is an explanatory diagram of a light distribution state, and FIG. 7 is a circuit diagram of an electronic circuit.

First, referring to FIG. 4, an outline of the system will be described. Reference numeral 1 is an endoscope, 2 is a light source device, 3 is a video processor incorporating a video signal processing circuit and a drive circuit, and this video processor 3 has , Monitor 4, VTR deck 5, video printer 6, video disk 7, and other peripheral devices are connected.

The endoscope 1 has an elongated and flexible insertion portion 8 that can be inserted into a body cavity, and a large-diameter operation portion 9 that is continuously provided on the proximal end side of the insertion portion 8. ing. In addition, the bending portion 1 composed of a plurality of node rings 11a is provided on the distal end side of the insertion portion 8.
The distal end portion 12 is provided via 1 and the distal end portion 12 can be directed to the observed region by bending the bending portion with a bending operation knob (not shown) provided in the operation portion 9. You can do it.

Further, from one side of the operation section 9, a connector device is attached to the tip.
While the universal cord 13 having 13a is extended, the light source device 2 is provided with a connector receiver 2a to which the connector device 13a is connected. By connecting the connector device 13a and the connector receiver 2a, the illumination light generated by the light source lamp 2b of the light source device 2 and condensed by the condenser lens 2c is arranged in the universal cord 13. Endoscope 1 via a light guide (not shown)
It can be guided in any direction.

The light guide is connected to another pair of light guides 14 arranged in the insertion portion 8 and extends to the tip portion 12. As shown in FIG. 3, a pair of illumination through holes 15a, 15b are formed in the vertically deflected portion of the tip portion 12, and the illumination light from the light source device 2 is emitted through the illumination through holes 15a, 15b. Irradiation to the visual observation site is performed via the orientation lens 16 fixed to 15b.

Also, sandwiched between the pair of illumination through holes 15a, 15b, and
A forceps through hole 17 is formed in a portion of the tip portion 12 that is deflected to the outer peripheral side. The forceps through hole 17 communicates with a forceps insertion opening 17b formed in the operation portion 9 through a forceps channel (not shown) provided in the insertion portion 8 and is inserted into the insertion opening 17b. The forceps is adapted to be projected from the tip portion 12 through the forceps through hole 17.

Further, an observation through hole 18 in which a cover lens 18b is interposed via a first lens frame 18a is formed in the tip portion 12,
The observation site is observed through the observation through hole 18, and the tip portion 12 is provided with a nozzle 21 for air supply / water supply directed to the cover lens 18b. , The operation switch provided in the operation section 9
By operating 9a, air and water are supplied to the cover lens 18b via the nozzle 21, and it is possible to remove fogging and the like on the surface of the cover lens 18b.

The observation through-hole 18 is formed at a portion facing the forceps through-hole 17 with the central axis of the distal end portion 12 sandwiched therebetween, and the distal end portion 12 has a smaller diameter in order to reduce the diameter of the distal end portion 12. The illumination through hole 15a formed in the lower portion has a smaller diameter than the diameter of another illumination through hole 15b formed above the tip portion 12. Therefore, when the illumination light is uniformly emitted from these illumination through holes 15a, 15b, the amount of light emitted through the large diameter observation through hole 15b is emitted through the small diameter illumination through hole 15a. The light amount is larger than the light amount, and as shown in FIG. 5, a shadow 19a of the forceps 19 is generated in the image observed through the observation through hole 18 when the treatment process is performed by the forceps 19, which obstructs the observation and the treatment. Can cause

In this embodiment, this problem is dealt with by giving a peak to the light distribution of the illumination light emitted through the illumination through holes 15a and 15b. That is, as shown by the chain double-dashed line in FIG. 6, the illumination light emitted from the illumination through hole 15b provided in the upper portion of the tip portion 12 has a light distribution peak in the vertical center line A- of the tip portion 12. It is set so that B and a line 22 connecting the center lines of the objective lens 18 and the forceps through hole 17 intersect, that is, a portion indicated by A'in FIG. As shown by the broken line in FIG. 6, the orientation peak of the illumination light emitted from the relatively small-diameter illumination through hole 15A provided on the line 22 is a portion deflected to the forceps through hole 17 side on the line 22, That is, it is set so as to come to a portion indicated by B'in FIG.
As a result, the illumination light from the illumination through hole 15A is irradiated below the forceps 19 shown in FIG. 5 and the shadow 19a is prevented from being formed at this portion.

On the other hand, as shown in FIGS. 1 and 2, the first lens frame 18a is fixed to the observation through hole 18 by the fixing screw 24, and the observation through hole 18 and the first lens frame 18a are also provided. An O-ring 23 is interposed between and, and the liquid-tight state in the observation through hole 18 is held by the O-ring 23.

A second lens frame 25 is fixed to the opposite side of the first lens frame 18a from the cover lens 18b via an insulating portion 26. In the second lens frame 25, an objective lens system 27 including a plurality of lens groups having an optical axis matching the optical axis of the observation through hole 18 and the optical axis of the cover lens 18b is arranged. At the same time, an element frame 28 is capped and fixed to the outer periphery of the second lens frame 25 opposite to the first lens frame 18a. The element frame 28 is extended rearward of the second lens frame 25, and a solid-state image sensor 29 is fixed to the extended portion with an adhesive 30 orthogonal to the optical axis of the objective lens system 27. Has been done.

This solid-state image pickup device 29 includes a cover glass 29a arranged on the objective lens system 27 side, a sealing resin 29b provided on the opposite side of the cover glass 29a from the objective lens system 27, and an encapsulating resin 29b. The element chip 29f is fixed via the bonding wire 29c and is electrically connected to the plurality of external leads 29e via the internal wiring of the element substrate 29d. Also,
A flare stop 31 is provided on the objective lens system 27 side of the cover glass 29a, and the flare stop 31 regulates the luminous intensity of an image incident through the objective lens system 27. .

The tip end of the shield frame 32, which is formed in a tubular shape and whose outer periphery is covered with an insulating cover 32a, is fixed to the outer periphery of the element frame 28 on the proximal end side. A base end side of the shield frame 32 is extended rearward, and a circuit board 33 made of ceramic is held in the extended portion substantially in parallel with the optical axis. The external lead 29e is connected.

A capacitor 34, which is a passive electronic component, is disposed on the circuit board 33 on the solid-state imaging device 29 side, and the circuit board is soldered to the circuit board 33.
It is fixed to the circuit board 33 in a state of being connected to the circuit pattern in 33 and is surrounded by an insulating agent 34a.

Further, a signal amplification IC 35, which is an example of a heat generating portion, is die-bonded to a portion of the capacitor 34 opposite to the solid-state imaging device 29, and then wire-bonded to the circuit pattern of the circuit board 33, and the signal The amplification IC 35 is covered with the sealing resin 35a. And these capacitors 3
4. The signal amplification IC 35 and the like constitute the electronic circuit 41.

A through substrate 36 is fixed in the shield frame 32 substantially parallel to the circuit substrate 33, and the through substrate 36 is electrically connected to the internal wiring of the element substrate 29d through the external lead 29e. In addition, between the through board 36 and the circuit board 33, a potting agent 37 for heat dissipation is filled,
Metal cable fixing portions 38 are fixed by soldering to the base end sides of the through substrate 36 and the circuit substrate 33.

In addition, a plurality of cables from the base end side of the shield frame 32
A signal transmission cable 40 composed of 39 is extended, and the outer conductor 39b of these cables 39 is connected to the cable fixing member 3 described above.
The surface of the circuit board 33 opposite to the through board 36, that is, the upper surface of the through board 33 and the surface of the circuit board 33 on the opposite side of the through board 36, that is, the lower surface of the circuit board 33, are in contact with each other. It is fixed with solder.

Among the plurality of internal conductors 39a, the internal conductor 39a fixed to the circuit board 33 is fixed by soldering to a portion facing the signal amplification IC 35 with the circuit board 33 interposed therebetween. Therefore, the heat generated in the signal amplification IC 35 is generated by the circuit board 33.
Is transmitted to the internal conductor 39a via the internal conductor 39a, is transmitted to the base end side of the insertion portion 8 via the internal conductor 39a, and
The heat transferred to the solid-state image sensor 29 side is prevented by being transferred to the signal transmission cable 40 via the cable fixing member 38 and transferred to the base end side of the insertion portion 8. Therefore, the temperature rise of the solid-state imaging device 29 is avoided.

An insulating member 43 is closely attached to the upper surface of the through board 36 and the lower surface of the circuit board 33, and the outer circumference of the insulating member 42 is surrounded by an insulating tube 44.

On the other hand, the insulating cover 32a that covers the shield frame 32 is extended toward the base end side of the shield frame 32 and has a reduced diameter,
It is fixed to the signal transmission cable 40. A conductive adhesive 52 is filled between the shield frame 32 and the outer conductor 39b of the cable 39, and between the cable 39 and a portion of the insulating cover 32a extending from the shield frame 32 to the base end side. The cable 39 is fixed by being filled with the reinforcing adhesive 53.

Further, the signal transmission cable 40 is configured such that the integrated shield member 40a of the plurality of cables 39 is covered and fixed by the press-winding member 40b, and the outer circumference of the press-winding member 40b is further covered with the cable jacket 40c. ing. The front end side of the integrated shield member 40a is folded back to the outer peripheral portion of the cable outer cover 40c and fixed by a spool adhesive 40d. The base end side of the insulating cover 32a is fixed on the spool adhesive 40d.

The base end side of the signal transmission cable 40 is extended to the connector device 13a of the universal cord 13 via the insertion portion 8. As shown in FIG. 4, from the video processor side of the connector device 13a, another universal cord 45 that houses the extended portion of the signal transmission cable 40 is extended, and the tip of the universal cord 45 is extended. Another connector device 45a is also provided in the section. Further, the video processor 3 is provided with a connector device 3a to which the connector device 45a is connected.
The universal cord 45 which is the interior of this connector device 45
It is adapted to be connected to the video processor 3 via a. Then, the signal image of the observed region photoelectrically converted by the solid-state imaging device 29 is processed by the signal processing circuit in the video processor 3 and output to the monitor 4, whereby an image of the observed region is displayed. Screen of this monitor 4
It is possible to observe at 4a.

By the way, the electronic circuit 41 is constructed, for example, as shown in FIG.

That is, the internal conductors of, for example, the three cables 39c of the signal transmission cable 40 set for drive pulses are connected to the drive pulse input terminals of the solid-state imaging device 29 via the through substrate 36. Further, the power input terminal of the solid-state image pickup device 29 is a cable 39d which is set to be charged with, for example, 12 v of electric power for power supply among the cables 39.
And the grounding terminal is connected to the shield frame 32 via the cable 39e set for grounding, while being connected to the video processor 3 via the signal transmission cable 40. Has become.
In addition, this cable 39e for grounding has multiple cables 39
The outer conductor of is also connected.

Further, the output terminal of the solid-state image pickup device 29 is connected to the base of the transistor 46 via the cable 39f set for output. The collector of the transistor 46 is connected to the power supply cable 39d, while the emitter is connected to the ground cable 39e via a resistor 47 and to the base of another transistor 48. . The collector of the transistor 47 is connected to the power supply cable 39d, and the emitter of the transistor 47 is connected to the video processor 3 via the resistor 49.

On the other hand, the capacitor 34 is arranged between the driving cable 39d and the grounding cable 39e, and the grounding cable 39a is connected to the dummy cable 3 via the resistor 50.
Connected to 9g.

When observing a site to be observed with the endoscope 1 having such a configuration, the universal cord 13 is inserted through the connector 13a.
Is connected to the light source device 2, and another connector device 45a is connected.
Another universal cord 45 is connected to the video processor 3 via. Next, the light source device 2 and the video processor 3 are turned on, and the insertion portion 8 of the endoscope 1 is inserted into a body cavity or a tube hole, and an angle operation knob (not shown) provided in the operation portion 9 is provided. By bending the bending portion 11, the tip portion 12 is directed to the observed region.

Then, the illumination light generated by the light source lamp 26 of the light source device 2 and condensed by the condenser lens 2c is guided to the tip portion 12 by the light guide 14, and a pair of illumination lights provided at the tip portion 12 are provided. The observation site is irradiated with light through a light distribution lens 16 provided in the through holes 15a and 15b.

The image of this observed region is captured by the solid-state image sensor with the objective lens system 27.
An image is formed on the element chip 29f of 29, and at the same time the power of the video processor 3 is turned on, the operation of the image pickup device is started to photoelectrically convert the image formed on the element chip 29f.
It is amplified by the signal amplification IC35. The amplified signal is input to the video processor 3 via the signal transmission cable 40, processed by the signal processing circuit provided in the video processor 3 and output to the monitor 4, An image of the observed region is displayed on the screen 4a of the monitor 4.

By the way, when the signal amplification IC 35 is operated, heat is generated in the signal amplification IC. This heat is transferred to the circuit board 33 to which the signal amplification IC is fixed. Since the circuit board 33 is made of ceramic, it has low heat conductivity, and the internal conductor 39a of the cable 29 is fixed by soldering to the portion of the circuit board 33 facing the signal amplification IC 35. Therefore, most of the heat transferred to the circuit board 33 is transferred to the internal conductor 39a.

Then, the heat is prevented from being transferred to the front end side or the base end side of the circuit board 33 via the circuit board 33 by being transferred to the base end side of the cable 39 via the internal conductor 39a. It

The signal amplification IC 35 is fixed to a portion facing the solid-state imaging device 29 with the capacitor 34 in between, that is, a portion separated from the solid-state imaging device 29 as much as possible,
Since the cable fixing member 38 made of metal is fixed to the base end side of the circuit board 33 by soldering, signal amplification
The heat that is about to be transferred from the IC 35 through the circuit board 35 is transferred to the cable fixing member 38, and is transferred to the base end side through the cable fixing member 38 and the cable 39, and at the same time, the conductive adhesive is used. It is transmitted to the shield frame 32 via the agent 52 and is radiated by the shield frame 32. Therefore, it is extremely difficult for heat to be transferred to the solid-state imaging device 29 side having a relatively long distance, and the temperature rise of the solid-state imaging device 29 is avoided.

Further, the heat transferred from the signal amplification IC 35 to the sealing resin covering the signal amplification IC 35 is transferred to the heat releasing potting agent 37 filled between the circuit board 33 and the through board 36. The heat is radiated through the potting agent 37.

Thus, the heat generated by the signal amplification IC 35 is transferred to the base end side via the cable 39 or radiated via the potting agent 37, whereby the solid-state imaging device 39
It is possible to prevent the temperature of the solid-state image pickup element 39 from rising and prevent image deterioration due to thermal noise, and also to significantly extend the durability of the solid-state image pickup element 29. It will be possible. According to the experiment, the temperature of the solid-state imaging device 39 could be suppressed to 53 ° C.

When it is necessary to perform a medical treatment using the forceps 19 during the observation performed in this way, the forceps 19 are inserted into the insertion opening 17b formed in the operation portion 9 and the distal end portion is inserted through a forceps channel (not shown). It is made to project toward the distal end side, that is, in the direction of the observed region through the forceps through hole 17 formed in 12. Then, the tip of the forceps 19 is displayed on the screen 4a of the monitor 4, and the treatment process can be performed via the screen 4a.

In this case, the illumination light that illuminates the site to be observed is the above-mentioned tip portion 12
The pair of illuminating through holes 15a and 15b are formed so that the illumination light emitted from these illuminating through holes 15a and 15b has a predetermined peak in the light distribution. The shadow 19a of 19 does not appear on the screen, and observation and treatment are not hindered.

In the present embodiment, the example in which the signal amplification IC 35 is used as one row of the heat generating section has been described, but even if this heat generating section is another one such as a regulator for stabilizing the voltage, the temperature rise of the solid-state image pickup device 29 is increased. Of course, it is possible to prevent

Further, although the present embodiment has been described on the assumption that the solid-state image pickup device 29 is for a frame sequential black-and-white image, the solid-state image pickup device 29 is a simultaneous type and is configured to obtain a color image. It is also possible.

By the way, the electronic circuit 41 may be configured as a modification shown in FIG.

In this modified example, a cable 39h set so that a charge of, for example, 9v is applied separately from the voltage 12v for driving the solid-state image pickup device 29.
The signal amplification IC 35 is configured to be driven by the cable 39h, while the solid-state imaging device 29 is configured to have a plurality of outputs.
A plurality of transistors 46 and 48 similar to those described in the figure are provided.

With this configuration, the drive voltage of the signal amplification IC 35 can be lowered in comparison with the above example, and the signal amplification IC 35 can be reduced.
Since the heat generation by the 35 can be suppressed, it is possible to further prevent the temperature rise of the solid-state imaging device 29.

FIG. 9 is a side view of the image pickup apparatus according to the second embodiment of the present invention. The same members as those described in the first embodiment and members having the same operation as those described in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

In this embodiment, the circuit board 33 is formed of a heat insulating member, and on the heat insulating circuit board 33, a conductive member 54 having a good heat transfer property made of metal, a continuous conductor pattern or gold plating is formed. Is provided, the signal amplification IC 35 is fixed to the conductive member 54, and the base end side of the conductive member 54 is brought into contact with the cable fixing member 38.

With this configuration, even if the signal amplification IC 35 generates heat, this heat is transmitted to the cable fixing member 38 via the conductive member 54,
It is transmitted to the cable 3 via the cable fixing member 38. Further, since the circuit board 33 is formed of a heat insulating member, it is difficult for heat to be transferred to this circuit board 33, and even if heat is transferred, the conductive member 54
The heat is transmitted to the inner conductor 39a of the cable 39 fixed to the opposing portion with the circuit board 33 sandwiched therebetween and is transmitted to the base end side via the inner conductor 39a, whereby heat is transferred to the solid-state imaging device 29.
It is prevented from being transmitted to the side.

FIG. 10 is a side view of the image pickup apparatus according to the third embodiment of the present invention.

In this embodiment, the thickness of the circuit board 33 on the solid-state imaging device 29 side is made thicker, while the thickness on the side in contact with the cable fixing member 38 is made thinner. Since the heat conductivity is poor on the side formed thick and the conductivity is improved on the side formed thin, the heat generated in the signal amplification circuit 35 and transferred to the circuit board 33 is formed thin on this circuit board 35. It is transmitted to the cable fixing member 38 via the cut portion and is transmitted to the cable 39. Therefore, the heat transferred to the thickly formed side of the circuit board 33 is extremely small, and the temperature rise of the solid-state imaging device 29 can be prevented.

FIG. 11 is a side view of the image pickup device according to the fourth embodiment of the present invention.

In this embodiment, the base end side of the circuit board 33 and the metal cable fixing member 38 are contacted and fixed, and
A cable 39 fixed to 33 is extended from the signal amplification IC 35, and an internal conductor 39a of this cable 39 is fixed to the capacitor 34 side.

With such a configuration, the heat transferred to the circuit board 33 is easily transferred to the side of the cable fixing member 38 having good thermal conductivity. On the other hand, the heat transferred to the capacitor 34 side through the circuit board 33 is the internal conductor 39a fixed near the capacitor 34.
Is prevented from being transmitted to the solid-state image sensor 29 side.

12 and 13 relate to the fifth embodiment of the present invention, FIG. 12 is a side view of the image pickup device, and FIG. 13 is a bottom view of FIG.

In this embodiment, the area of the land 33a of the circuit board 33 to which the external lead 29f of the solid-state imaging device 29 is contacted is formed to be much larger than the area of the land 33b of the circuit board 33 to which the internal conductor 39a of the cable 39 is contacted. It has been done.

The amount of heat transferred to the internal conductor 39a via the land 33b having a large area is larger than the amount of heat transferred to the external lead 29f via the land 33a having a small area, and the signal amplification IC 3
The heat generated in 5 and transferred to the circuit board 33
Since the heat is transferred to the inner conductor 39a side of the cable 39 via 3b, the heat is prevented from being transferred to the solid-state image sensor 29 side via the external lead 29e.

FIG. 14 is a side view of the image pickup device according to the sixth embodiment of the present invention.

In this embodiment, the external leads 29f of the solid-state image pickup device 29 and the circuit board 33 are fixed with a conductive adhesive, while the circuit board 33 and the internal conductor 39a of the cable 39 are fixed with solder.

When comparing the thermal conductivity of this solder with the thermal conductivity of the above conductive adhesive, the conductivity of the solder is better.
The heat generated in 35 and transferred to the circuit board 33 is transferred to the internal conductor 39a side of the cable 39 through this solder,
Transmission to the solid-state image sensor 29 side is prevented.

FIG. 15 is a side view of the image pickup apparatus according to the seventh embodiment of the present invention.

In this embodiment, the circuit board 33 is formed to have a relatively long length, and the element chip 29f of the solid-state image pickup device 29 is directly mounted on the tip end side of the circuit board 33, and the prism 56
Is configured so that the optical image is incident on the element chip 29f. Further, the signal amplification IC 35 is provided on the lower surface of the circuit board 35 on the side opposite to the side where the element chip 29f is mounted.
The capacitor 34 is fixed on the lower surface of the circuit board 35, and the electric element 57 such as a resistor is fixed on the lower surface of the circuit board 35 facing the element chip 29f.

Further, the inner conductor 39a of the cable 39 is fixed by soldering on the upper surface of the circuit board 35 at a position approximately midway between the signal amplification IC 35 and the capacitor 34, and the cable 3
The outer conductor 39b of 9 is fixed to the portion corresponding to the signal amplification IC 35 by soldering. Further, the base end side of the cable 39 extending from the circuit board 35 is fixed to the shield frame 32 with a reinforcing adhesive 53.

With this configuration, the heat generated in the signal amplification IC 35 and transferred to the circuit board 33 is transferred to the outer conductor 39b of the cable 39, thereby preventing transfer to the element chip 29f side via the circuit board 33. To be done. Further, even if heat is transferred to the element chip 29f side from the circuit board 33, this heat is transferred to the internal conductor 39a of the cable 39 fixed in the intermediate portion between the signal amplification IC 35 and the capacitor 34. Therefore, the temperature of the element chip 29f is prevented from rising.

Further, the circuit board 33 is formed to be relatively long, and the signal amplification IC 35 and the element chip 29f are formed on the circuit board 33.
It is fixed to the end portion on the tip end side and the end portion on the base end side and is separated from each other as much as possible, so that heat generated by the signal amplification circuit 33 is prevented from being transferred to the element chip 29f side.

[Effects of the Invention] As described above, in the image pickup apparatus according to the present invention, the temperature of the solid-state image pickup element is prevented from rising due to the heat of the heat generating portion, so that the image photoelectrically converted by this solid-state image pickup element is prevented. Of the solid-state image sensor, the durability of the solid-state image sensor is improved, and the size of the apparatus is prevented from increasing.

[Brief description of drawings]

1 to 7 relate to a first embodiment of the present invention. FIG. 1 is a side view of an image pickup apparatus, FIG. 2 is a side view of a tip portion, FIG. 3 is a front view of a tip portion, and FIG. FIG. 5 is a schematic configuration diagram of an endoscope system, FIG. 5 is an image explanatory diagram, FIG. 6 is a light distribution state explanatory diagram, FIG. 7 is an electronic circuit diagram, and FIG. 8 is a first embodiment. FIG. 9 is a side view of an image pickup apparatus according to a second embodiment of the present invention, FIG. 10 is a side view of an image pickup apparatus according to a third embodiment of the present invention, and FIG. FIG. 12 is a side view of an image pickup apparatus according to a fourth embodiment of the present invention, FIGS. 12 and 13 are related to a fifth embodiment of the present invention, and FIG. 12 is a side view of the image pickup apparatus,
FIG. 13 is a bottom view of FIG. 12, FIG. 14 is a side view of an image pickup apparatus according to a sixth embodiment of the present invention, and FIG. 15 is a side view of an image pickup apparatus according to a seventh embodiment of the present invention. . 29 …… Solid-state image sensor 33 …… Circuit board 35 …… Heating part 40 …… Signal transmission cable 41 …… Electronic circuit

Claims (1)

[Claims] 1. A solid-state image sensor, an amplifier circuit connected to the solid-state image sensor, which generates a large amount of heat, and a signal transmission cable connected to the amplifier circuit. A passive electronic component such as a capacitor is installed in the space between them, and heat transfer between the amplifier circuit and the signal transmission cable is improved more than that between the amplifier circuit and the solid-state image sensor. A characteristic imaging device.