JPH0491887A - Positioning jig for lead pin for pin grid array package and production thereof - Google Patents

Abstract

PURPOSE:To reduce the cost of processing by laminating plural of thin sheets having plural holes corresponding to plural supporting holes, thereby forming the jig. CONSTITUTION:The plural supporting holes 2 for supporting the plural lead pins in order to individually position the pins at the time of implanting the plural lead pins to a pin grid array package are provided on the jig 1. The jig 1 is constituted by laminating plural sheets of the thin sheets 3 having the plural holes corresponding to the plural supporting holes 2. The plural thin sheets are joined to each other by diffusion joining. The plural holes are formed by etching on the thin sheets. The jig for positioning the lead pins for the pin grid array package is formed in this way without executing boring by drilling.

Description

DETAILED DESCRIPTION OF THE INVENTION [Purpose of the Invention (Industrial Field of Application)] The present invention provides a method for brazing lead pins to a pin grid array package suitable for increasing the number of pins in ICs, LSI chips, etc. The present invention relates to a positioning jig having a plurality of support holes for supporting a plurality of lead pins for positioning, and a method for manufacturing the same.

<Prior Art> In recent years, as ICs, LSI chips, etc. have become more densely packed, the number of lead pins provided in their packages has been increased. Such multi-pin packages include pin grid array packages in which a plurality of lead pins are regularly arranged in a grid pattern.

By the way, when implanting the above lead pins into a pin grid array package, a jig in which a plurality of support holes are regularly provided in a grid pattern is used to position the lead pins at predetermined mounting positions according to the design. By inserting the pins into each support hole, each pin was positioned and brazed to the package. In the jig described above, a plurality of support holes are regularly drilled in a grid pattern at a predetermined pitch, but conventionally, holes are drilled in a metal plate one hole at a time using a drill. For example, 10 per jig
Since a large number of holes from 00 to 1500 are drilled, the machining time is long, and the drill needs to be replaced periodically to prevent hole diameter uniformity due to drill wear, which increases the machining cost. There was a problem that it would change.

<Problems to be Solved by the Invention> In view of the problems of the prior art, the main object of the present invention is to provide a jig for positioning lead pins for a pin grid array package and a method for manufacturing the same, which can reduce processing costs. It is about providing.

[Structure of the Invention] Means for Solving the Problems According to the present invention, when a plurality of lead pins are implanted in a pin grid array package, it is necessary to individually position the plurality of lead pins. (A jig having a plurality of support holes for supporting a pin grid, the jig being formed by laminating a plurality of thin plates having a plurality of holes corresponding to the plurality of support holes. This is achieved by providing a positioning jig for lead pins for array packages.In particular, it is preferable that the plurality of thin plates are bonded to each other by diffusion bonding, and further, that the plurality of holes are formed in the thin plates by etching. Alternatively, a process of drilling a plurality of holes in a thin plate, a process of laminating a plurality of said thin plates, and joining each of said plurality of laminated thin plates to each other by diffusion bonding to integrate them. forming a jig having a plurality of support holes formed by the respective holes for supporting the plurality of lead pins for individual positioning when the plurality of lead pins are implanted in the pin grid array package; This is achieved by providing a method for manufacturing a lead pin positioning jig for a pin grid array package, characterized by having the following.

In this way, when drilling holes in a thin plate, many holes can be made at once by etching, for example, and a plurality of drilled thin plates can be stacked to form a predetermined shape. In order to form a thick jig, for example, diffusion bonding can be used for suitable integration, and the machining time can be shortened compared to drilling each hole one by one.

<Embodiments> Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a plan view showing a jig 1 for a pin grid array package according to the present invention, and FIG. 2 is a side sectional view of a main part thereof. As shown in FIGS. 1 and 2, the jig 1 has a plurality of 1,000-
Approximately 1,500 support holes 2 are regularly arranged in a grid pattern, for example, within the range shown by the two-dot chain line in the figure.

The jig 1 is made of SUS with a thickness t (for example, 0.5 to 1 mm).
For example, it is made up of about 15 laminated thin plates 3.
The thin plates 3 are bonded to each other, for example, by diffusion bonding. As shown in FIG. 2, the support hole 2 has a predetermined depth d (for example, 1.5
mm), a small diameter portion 2a of the same diameter (for example, diameter Oy 36 mm) is formed, but from the lower end of the small diameter portion 2a to the jig 1. For example, until you reach the other end face on the lower side of the figure,
．． A medium diameter portion 2b having a diameter of 5 mm and a large diameter portion 2C having a diameter of 1.6 mm, for example, are arranged alternately. In addition, at the four corners of the jig 1, positioning pins 4 are press-fitted into positioning holes 8 with Uj holes (9) in the thickness direction.

As shown in FIG. By positioning with the positioning pins 4, each lead pin (-) can be suitably positioned using the jig 1. Note that the positioning of the jig 1 is not limited to the positioning fin 4, and for example, the four corners may be pressed against the positioning frame H.

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The cage 5 is placed opposite the jig 1-, and each cage 5 is placed in front of the jig 1-, and each cage 5 is placed in front of the jig 1-, and each cage 5 is placed in front of the jig 1-.
/Page, number 5 (= 21 in the j hole (not shown), lead bottle 6 (1,000 mounds) (= 1 (surare, taro 4. + 7 melted, each Lead pin 6
Braze it in place on the Bingley F1 Neu baggage 5 and install it.

Next, the first step in manufacturing the jig 1 will be described above with reference to FIG. First, in step STI, the thin plate 3 is etched to form holes corresponding to the small diameter portion 2a, medium diameter portion 2H, and large diameter portion 2C for forming the support hole 2.

Since hole drilling is performed by drilling in this way, it is possible to drill many holes at once, and it is possible to drill holes as easily as when using a drill. 4. I don't have anything to do with it. In the next step ST2, a predetermined number of thin plates 3 are laminated, and as shown in 2, the medium diameter part 2b or the large diameter part 2C is suitably combined 1J with respect to the small diameter part 2a. By laminating the thin plates 3 in combination, it is possible to easily form a jig 1 that can drill holes of various diameters. With this, it is possible to easily form a jig 1 having a support hole 2 of the same diameter or a support hole 2 having a different diameter in the middle.

Then, as shown in FIG. 5, in step ST3, the positioning pin 4 is press-fitted into the positioning hole 8 in a penetrating state, and in step ST4, a joining jig 9 is attached to both end faces of the laminated thin plates 3 at 11F. The thin plates 3 are pressed together and fixed 4- by a fixing jig (not shown) so that each thin plate 3 is sandwiched between the two joining jigs 9. In step ST5, the thin plates 3 fixed together by the bonding jigs 9 as described above are
Bonding is performed by known diffusion bonding in which a predetermined pressure is applied at a predetermined temperature in a vacuum or active gas. In this way, a jig for easily integrating a plurality of thin plates 3 and for mounting a large number of support plates 2 is completed.

As mentioned above, since the support holes 2 are formed in each thin plate 3, the holes can be easily formed by etching if the thickness of the plate is not large relative to the hole diameter. When the thin plates 3 are bonded to each other using a binder such as a brazing material, the binder flows into the support holes 2 to close the holes, but in this embodiment, diffusion bonding is used. Therefore, the thin plates 3 can be joined to each other without blocking the support holes 2.

With the jig 1 configured in this way, drilling with a drill can significantly shorten the machining time compared to the case of machining 1, thereby reducing the machining cost and reducing the occurrence of cracks caused by the drill. do not have. Furthermore, since there is no need to periodically replace the drill due to wear or breakage, running costs are also reduced. Incidentally, the support hole 2 may be opened by press working. In this case as well, since the holes can be drilled one by one in the thin plates 3 at a time, it is possible to save labor compared to drilling 1' with a drill.

[Effect of the invention 1 As described above, according to the present invention, drilling a hole with a drill can be done by adding 1-
It is possible to form a pin positioning jig for pin grid array vaso gauges without drilling 1.

By shortening the machining time, it is possible to reduce the cost of the T-1 stroke. In addition, the effects are extremely user-friendly, such as eliminating the hassle of replacing drills to prevent uniformity of holes and defects in quality due to wear of the drill.

[Brief explanation of drawings]

FIG. 18 is a plan view showing a treatment U based on the present invention. FIG. 2 is a side sectional view taken along the line (■--n) in FIG. 1. FIG. 3 is a sectional view of a main part showing an example of how the jig is used. FIG. 4 is a flow diagram showing the manufacturing process of a jig based on the present invention. FIG. 5 is a schematic diagram showing one embodiment of the jig manufacturing process. 1... Jig 2... Support hole 2a... Small diameter part 2b... Medium diameter part 2c... Large diameter part
3...Thin plate 4...Positioning pin

Claims (4)

[Claims] (1) A jig having a plurality of support holes for supporting the plurality of lead pins in order to individually position them when implanting the plurality of lead pins in a pin grid array package, the jig including the plurality of lead pins. 1. A lead pin positioning jig for a pin grid array package, comprising a plurality of laminated thin plates each having a plurality of holes corresponding to the support holes of the pin grid array package. (2) The lead pin positioning jig for a pin grid array package according to claim 1, wherein the plurality of thin plates are bonded to each other by diffusion bonding. (3) The lead pin positioning jig for a pin grid array package according to claim 1 or 2, wherein the plurality of holes are formed in the thin plate by etching. (4) By drilling a plurality of holes in a thin plate, stacking a plurality of the thin plates, and bonding and integrating the plurality of laminated thin plates by diffusion bonding,
forming a jig having a plurality of support holes formed by the respective holes in order to support the plurality of lead pins for individual positioning when the plurality of lead pins are implanted in the pin grid array package; A method for manufacturing a lead pin positioning jig for a pin grid array package, characterized in that: