JP6738381B2 - Emcフィルタ - Google Patents
Emcフィルタ Download PDFInfo
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- JP6738381B2 JP6738381B2 JP2018157354A JP2018157354A JP6738381B2 JP 6738381 B2 JP6738381 B2 JP 6738381B2 JP 2018157354 A JP2018157354 A JP 2018157354A JP 2018157354 A JP2018157354 A JP 2018157354A JP 6738381 B2 JP6738381 B2 JP 6738381B2
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H11/00—Networks using active elements
- H03H11/02—Multiple-port networks
- H03H11/32—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/44—Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F17/06—Fixed inductances of the signal type with magnetic core with core substantially closed in itself, e.g. toroid
- H01F17/062—Toroidal core with turns of coil around it
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/40—Structural association with built-in electric component, e.g. fuse
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/14—Arrangements for reducing ripples from DC input or output
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H1/0007—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network of radio frequency interference filters
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/0138—Electrical filters or coupling circuits
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/42—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns
- H03H7/425—Balance-balance networks
- H03H7/427—Common-mode filters
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F17/06—Fixed inductances of the signal type with magnetic core with core substantially closed in itself, e.g. toroid
- H01F2017/065—Core mounted around conductor to absorb noise, e.g. EMI filter
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/06—Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
- H01F2027/065—Mounting on printed circuit boards
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0021—Constructional details
- H03H2001/0035—Wound magnetic core
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0233—Filters, inductors or a magnetic substance
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1006—Non-printed filter
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Filters And Equalizers (AREA)
- Power Conversion In General (AREA)
- Inverter Devices (AREA)
Description
例えば、300V乃至800Vの間の電圧で作動する高電圧インバータでは、ノイズの構成素子(component)として主に共通モードノイズが発生する。
また、インバータ側に向いた第3のキャパシタC3がチョークL2の下流のラインHV−と接地電位との間に、それからインバータ側に向いた第4のキャパシタC4がチョークL1の下流のラインHV+と接地電位との間に配置される。各々のキャパシタC1乃至C4を実際に具現する時には、複数の部分キャパシタ、即ち複数のキャパシタの構成素子を組み合わせて具現できる。
2 インバータ(Inverter)
3 インプット(HV+/HV−)
4 第1チョークL1、コイルL1
5 第2チョークL2、コイルL2
6 第1キャパシタC1、第1キャパシタンスC1
7 第2キャパシタC2、第2キャパシタンスC2
8 第3キャパシタC3、第3キャパシタンスC3
9 第4キャパシタC4、第4キャパシタンスC4
10 EMCフィルタモジュール
11 コア、チョークコア
12 インバータのメーンボード
13 銅層、導体経路、導体トラック
14 第1キャリアボード
15 第2キャリアボード
16、 16a、16b コイル
17、 17a、17b、17c、17d 接触手段
18 ハンダ付け連結部
19 連結手段
Claims (7)
- 一つ以上のチョーク(4、5)、一つ以上のコア(11)、及び複数のキャパシタ(6、7、8、9)を含むノイズ(妨害信号)を抑制するためのEMCフィルタ(1)において、
EMCフィルタモジュール(10)で、コイル(16)を有するチョーク(4、5)の一つ以上のコア(11)が第1キャリアボード(14)上に配置され、キャパシタ(6、7、8、9)の中の一つ以上のキャパシタが第1キャリアボード(14)上に配置され、第1キャリアボード(14)は2つ以上の接触手段(17)を含み、EMCフィルタモジュール(10)の第1キャリアボード(14)がインバータ(2)のメーンボード(12)に接触手段(17)を用いて電気的に連結するように配置され、
第2キャリアボード(15)はEMCフィルタモジュール(10)内に配置され、コア(11)は第1キャリアボード(14)と第2キャリアボード(15)との間に配置され、
メーンボード(12)とEMCフィルタモジュール(10)とを機械的に連結するためにメーンボード(12)に切り欠きが備えられ、
接触手段(17)は、前記切り欠き内に第1キャリアボード(14)及び第2キャリアボード(15)から突出する鼻状部又は突起部が配置され、
メーンボード(12)とEMCフィルタモジュール(10)とを電気的に連結するために、少なくとも導体トラックを形成する第1キャリアボード(14)の銅層(13)と導体トラックを形成するメーンボード(12)の銅層(13)との間には、電気的連結を形成するハンダ付け連結部(18)が配置されることを特徴とするEMCフィルタ(1)。 - 第2キャリアボード(15)は、第1キャリアボード(14)に対して平行するように配置されることを特徴とする請求項1に記載のEMCフィルタ(1)。
- 第1キャリアボード(14)と第2キャリアボード(15)との間には、連結手段(19)が配置され、チョーク(4、5)のコア(11)は、第1キャリアボード(14)と第2キャリアボード(15)との間に、且つ連結手段(19)上に配置されることを特徴とする請求項1に記載のEMCフィルタ(1)。
- 第1キャリアボード(14)の表面上及び/又は第2キャリアボード(15)の表面上に少なくとも部分的に導体トラックを形成する銅層(13)が配置されることを特徴とする請求項1に記載のEMCフィルタ(1)。
- 第1キャリアボード(14)及び/又は第2キャリアボード(15)の銅層(13)を形成する導体トラック上にキャパシタ(6、7、8、9)が配置されることを特徴とする請求項1に記載のEMCフィルタ(1)。
- 第1キャリアボード(14)と第2キャリアボード(15)との間には、一つの共通モードチョークの一つのコア(11)が配置されるか、又は二つの差動モードチョークの二つのコア(11)が配置されることを特徴とする請求項1に記載のEMCフィルタ(1)。
- 第1キャリアボード(14)は、メーンボード(12)に対して直角に整列されるように配置されることを特徴とする請求項1乃至6の何れか1項に記載のEMCフィルタ(1)。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102017120924.7 | 2017-09-11 | ||
| DE102017120924.7A DE102017120924B4 (de) | 2017-09-11 | 2017-09-11 | EMV-Filter zur Unterdrückung von Störsignalen |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2019050719A JP2019050719A (ja) | 2019-03-28 |
| JP6738381B2 true JP6738381B2 (ja) | 2020-08-12 |
Family
ID=65441256
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018157354A Active JP6738381B2 (ja) | 2017-09-11 | 2018-08-24 | Emcフィルタ |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10644588B2 (ja) |
| JP (1) | JP6738381B2 (ja) |
| KR (1) | KR102036203B1 (ja) |
| CN (1) | CN109494974B (ja) |
| DE (1) | DE102017120924B4 (ja) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102018208313A1 (de) * | 2018-05-25 | 2019-11-28 | Robert Bosch Gmbh | Elektrisches Filterelement und elektrischer Stromrichter |
| US11949393B2 (en) | 2019-03-28 | 2024-04-02 | Em Coretech Co., Ltd. | Divided active electromagnetic interference filter module and manufacturing method thereof |
| KR102326924B1 (ko) * | 2019-09-19 | 2021-11-17 | 이엠코어텍 주식회사 | 분리형 능동 emi 필터 모듈 및 그 제조방법 |
| WO2020197334A1 (ko) * | 2019-03-28 | 2020-10-01 | 이엠코어텍 주식회사 | 분리형 능동 emi 필터 모듈 |
| DE102019123197A1 (de) | 2019-06-25 | 2020-12-31 | Tdk Electronics Ag | Elektrische Komponente |
| DE102020104106A1 (de) * | 2020-02-17 | 2021-08-19 | Hanon Systems | EMV-Filter-Steckanordnung |
| CN111900872B (zh) * | 2020-07-23 | 2022-01-04 | 重庆大及电子科技有限公司 | 一种电磁防护滤波装置 |
| DE102020121952A1 (de) | 2020-08-12 | 2022-02-17 | innolectric AG | Resonanz Transformator mit zusätzlich gekoppelter Induktivität für OBC |
| US20230327112A1 (en) * | 2020-10-21 | 2023-10-12 | Asahi Kasei Kabushiki Kaisha | Nonaqueous Alkali Metal Power Storage Element and Positive Electrode Coating Liquid |
| KR102827816B1 (ko) * | 2020-11-30 | 2025-07-01 | 삼성전자주식회사 | 라인 필터 및 이를 포함하는 디스플레이 장치 |
| DE102020133161A1 (de) | 2020-12-11 | 2022-06-15 | Tdk Electronics Ag | Drosselmodul und Verfahren zur Herstellung eines Drosselmoduls |
| DE102021110986A1 (de) * | 2021-04-29 | 2022-11-03 | Schaeffler Technologies AG & Co. KG | EMV-Filtervorrichtung mit integriertem Stromsensor und integrierter Kapazität; sowie Leistungselektronikmodul |
| CN114190041B (zh) * | 2021-11-08 | 2023-10-20 | 陕西千山航空电子有限责任公司 | 一种电源模块电磁干扰滤波结构 |
| DE102022132448A1 (de) * | 2022-12-07 | 2024-06-13 | Schaeffler Technologies AG & Co. KG | EMV-Filtervorrichtung in bauraumsparender Bauweise; Steuerungselektronik sowie elektrische Maschine |
| DE102022132613A1 (de) | 2022-12-08 | 2024-06-13 | Audi Aktiengesellschaft | Kraftfahrzeug mit einem Gleichspannungsbordnetz |
| US12512732B2 (en) | 2022-12-16 | 2025-12-30 | Bae Systems Controls Inc. | Current management and termination |
| DE102024204742A1 (de) * | 2024-05-23 | 2025-11-27 | Robert Bosch Gesellschaft mit beschränkter Haftung | Leiterplattensystem |
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| EP0626767B1 (en) * | 1993-05-26 | 1999-04-21 | Nippon Telegraph And Telephone Corporation | EMC filter for a balanced multi-wired telecommunication line |
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| US10491180B2 (en) * | 2015-05-14 | 2019-11-26 | Mitsubishi Electric Corporation | Board-type noise filter and electronic device |
| KR101821878B1 (ko) * | 2016-02-24 | 2018-01-24 | 엘에스산전 주식회사 | 인버터 |
| EP3229564B1 (de) * | 2016-04-04 | 2018-02-28 | Sick Ag | Leiterplattenanordnung und sensor |
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| Publication number | Publication date |
|---|---|
| US10644588B2 (en) | 2020-05-05 |
| US20190081554A1 (en) | 2019-03-14 |
| DE102017120924A1 (de) | 2019-03-14 |
| DE102017120924B4 (de) | 2025-07-03 |
| JP2019050719A (ja) | 2019-03-28 |
| KR102036203B1 (ko) | 2019-10-24 |
| CN109494974B (zh) | 2020-12-15 |
| KR20190029420A (ko) | 2019-03-20 |
| CN109494974A (zh) | 2019-03-19 |
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