JP6462761B2 - Product manufacturing apparatus and manufacturing method - Google Patents

Description

  The present invention relates to a product manufacturing apparatus and a manufacturing method for manufacturing a product by cutting a workpiece.

  A substrate composed of a printed circuit board, a lead frame, or the like is virtually divided into a plurality of lattice-shaped areas, and chip-shaped elements (for example, semiconductor chips) are attached to the respective areas. A substrate on which a semiconductor chip is mounted is called a mounted substrate. The semiconductor chip mounted on the mounted substrate is sealed with a sealing resin to manufacture a sealed substrate. By cutting the sealed substrate using a cutting mechanism that uses a rotating grindstone (also called a rotary blade), the sealed substrate is separated into individual regions. Each of the separated articles corresponds to a product. The sealed substrate may correspond to one product.

  The drive mechanism of the cutting mechanism has a rotating shaft, and a rotating grindstone is attached to the rotating shaft. The drive mechanism rotates the rotating grindstone at high speed. The sealed substrate is cut by pressing a rotating grindstone rotating at high speed against the sealed substrate. The rotating grindstone is gradually worn by repeated cutting. When the rotating grindstone is worn out, the diameter of the rotating grindstone becomes small, so it is necessary to increase the cutting depth according to the amount of wear. Therefore, it is required to always detect the amount of wear of the rotating grindstone and adjust the cutting depth to a predetermined cutting depth. The “cut depth” refers to the depth at which the rotating grindstone enters in the thickness direction of the workpiece. The “predetermined cutting depth” refers to a depth such that the lowermost end of the outer edge of the rotating grindstone slightly protrudes from the lower surface of the workpiece.

  Chips may occur at the outer edge, which is the cutting edge of the rotating grindstone, due to an increase in cutting load on the rotating grindstone. The chipping may cause the cutting quality to deteriorate by causing roughening of the cut surface. In addition, there is a risk that defective products may be generated by continuing to use the rotating grindstone. A chip that may deteriorate the quality of cutting and a chip that may cause a defective product to occur is referred to as a chip defect. It is required to grasp whether or not a chipping defect has occurred. Therefore, it is required to detect both the wear amount of the rotating grindstone and the chipping defect of the rotating grindstone.

  The following cutting device is disclosed as a cutting device capable of detecting wear and breakage (notches and chips) of a cutting blade (same meaning as a rotating grindstone). This cutting apparatus includes a detecting means. The detection means is a first detection means for detecting the outer peripheral edge of the cutting blade, and a second detection for detecting the outer peripheral edge of the worn cutting blade disposed inside the first detection means in the radial direction of the cutting blade. And switching means for detecting the outer peripheral edge of the cutting blade by switching from the first detection means to the second detection means (paragraphs [0006] to [0007], [0049] of FIG. 2-4).

JP, 2006-007673, A

  According to the cutting device disclosed in Patent Document 1, the following problem occurs. As shown in FIGS. 2 to 4 of Patent Document 1, this cutting apparatus requires two detection means and switching means for switching between the two detection means. Therefore, according to the conventional cutting apparatus, it is difficult to simplify the mechanical configuration and electrical configuration of the apparatus. According to the conventional cutting method, it is difficult to simplify the cutting method because it requires a step of switching between the two detection means.

  An object of the present invention is to simplify a product manufacturing apparatus and a manufacturing method by detecting both a chipping defect of a rotating grindstone and an amount of wear of the rotating grindstone using a single detection mechanism.

  In order to solve the above-described problems, a product manufacturing apparatus according to the present invention is a product manufacturing apparatus that manufactures a product by cutting a workpiece using a disk-shaped rotating grindstone, and is a rotating device. Image information by processing a detection mechanism having a light emitting unit that emits irradiation light toward the outer peripheral portion of the grindstone, and a light receiving unit that receives incident light including light resulting from the irradiation light, and image processing of the image converted from the incident light An image processing unit that obtains the image, and a determination unit that determines a state of the outer peripheral portion of the rotating grindstone based on the image information and issues a determination signal indicating that the outer peripheral portion of the rotating grindstone is in a specific state, The light emitting part is placed on one side of the outer peripheral part of the rotating grindstone, the light receiving part is placed on the side of the outer peripheral part of the rotating grindstone, and the judging part is a chip indicating a chipping defect in the rotating grindstone as a judgment signal Judgment signal and rotating wheel Capable of emitting a wear amount determination signal indicating 耗量, having aspects of.

  In order to solve the above-described problems, a manufacturing method of a product according to the present invention is a manufacturing method of a product that manufactures a product by cutting a workpiece using a disk-shaped rotary grindstone, and emits light. A step of preparing a detection mechanism having a light receiving portion and a light receiving portion, a step of receiving incident light including light caused by irradiation light emitted from the light emitting portion toward the outer peripheral portion of the rotating grindstone, and the incident light is converted by the conversion portion A process of acquiring image information by performing image processing on the converted image, and determining the state of the outer peripheral portion of the rotating grindstone based on the image information, and indicating that the outer peripheral portion of the rotating grindstone is in a specific state Determining whether or not to issue a determination signal, and in the step of preparing the detection mechanism, a light emitting part is placed on one side of the outer peripheral part of the rotating grindstone, and a light receiving part on the side of the outer peripheral part of the rotating grindstone Put the judgment signal In the step of determining whether to have a failure determination signal indicating the occurrence of chipping failure in the grinding wheel, it is possible to emit the wear amount determination signal indicating the amount of wear of the grinding wheel, a mode called.

  According to the present invention, it is possible to detect both the defective chipping of the rotating grindstone and the wear amount of the rotating grindstone by using one detection mechanism. As a result, the product manufacturing apparatus and method can be simplified.

It is a top view which shows the manufacturing apparatus of a product. FIG. 2A is a schematic diagram illustrating a state in which a defective chip of a rotating grindstone is detected in a process in which a sealed substrate is cut by the rotating grindstone included in the cutting mechanism. FIG. 2A is a front view of the cutting mechanism, and FIG. FIG. 2C is a side view of the cutting mechanism viewed from the side of the rotating whetstone, and FIG. 2C is a view of the outer periphery of the rotating whetstone viewed from the light receiving unit side. 3A is a cross-sectional view showing a first type of detection mechanism included in the cutting mechanism shown in FIG. 2, and FIG. 3B is a cross-sectional view of an optical fiber bundle included in the detection mechanism. FIGS. 4A and 4B are schematic diagrams respectively showing two aspects of the processing range in the detection range when detecting chipping failure and wear of the rotating grindstone. 5A is a cross-sectional view showing a second type of detection mechanism included in the cutting mechanism shown in FIG. 2, and FIG. 5B is a schematic view showing the outer peripheral portion of the rotating grindstone projected in the field of view. It is. FIG. 6A is a schematic view showing an aspect in which two detection mechanisms are used for two rotating grindstones included in the cutting mechanism shown in FIG. 2, and FIG. 6B is reflected in the field of view. It is the figure which looked at the outer peripheral part of the rotated grindstone from the light-receiving part side.

[Embodiment 1]
A first embodiment of a product manufacturing apparatus according to the present invention will be described with reference to FIGS. As a product manufacturing apparatus, a cutting apparatus for cutting a sealed substrate corresponding to a workpiece will be described. In this application document, the term “cutting” includes cutting all of the workpiece in the thickness direction (full cutting) and cutting a portion of the workpiece in the thickness direction (half cut). : Half cutting). The processing object is cut by fully cutting the processing object. A groove is formed in the workpiece by half-cutting the workpiece.
Any figure in the application documents is schematically omitted or exaggerated as appropriate for the sake of clarity. About the same component, the same code | symbol is attached | subjected and description is abbreviate | omitted suitably.

(Configuration of manufacturing equipment)
A product manufacturing apparatus according to Embodiment 1 will be described with reference to FIG. As shown in FIG. 1, the product manufacturing apparatus 1 is a manufacturing apparatus that manufactures a plurality of separated products P by dividing the sealed substrate 2 into individual pieces. Examples of the product P obtained by separating the sealed substrate 2 include electronic devices such as an IC (Integrated Circuit), an LSI (Large-Scale Integrated circuit), and a light emitting diode (LED).

  The product manufacturing apparatus 1 includes a supply module A, a cutting module B, and a dispensing module C as components. The supply module A supplies the sealed substrate to the cutting module B. The cutting module B cuts the sealed substrate. Each component (each module A-C) is mutually removable with respect to another component.

  A substrate supply mechanism 3 is provided in the supply module A. FIG. 1 shows an example in which four magazines MZ containing sealed substrates 2 are arranged in the substrate supply mechanism 3. The sealed substrate 2 is unloaded from the substrate supply mechanism 3 and transferred to the cutting module B by a transfer mechanism (not shown). A control unit CTL is provided in the supply module A. The control unit CTL performs control related to operation and physical quantity detection in the entire manufacturing apparatus 1. The control unit CTL includes an image processing unit IMP and a determination unit JDG. The image processing unit IMP processes an image obtained by an image sensor (described later). The determination unit JDG makes various determinations based on the result of image processing.

  One cutting table 4 is provided in the cutting module B. An object to be processed is placed on the table 4 as a processing table and processed. A sealed substrate 2 is placed on the table 4. The sealed substrate 2 is temporarily fixed to the upper surface of the table 4 by being sucked using a suction path (not shown). The table 4 can be moved in the Y direction by the moving member 5, and can be rotated in the θ direction by the rotating member 6. The drive source M1 such as a servo motor and the ball screw S1 constitute a first moving mechanism that moves the moving member 5 in the Y direction.

  In the cutting module B, a cutting mechanism 8 having one spindle accommodating portion 7 is provided. The spindle accommodating portion 7 can move in the X direction. The drive source M2 such as a servo motor and the ball screw S2 constitute a second moving mechanism that moves the cutting mechanism 8 in the X direction. The table 4 and the spindle accommodating portion 7 can be relatively moved by the first moving mechanism and the second moving mechanism.

  A spindle motor SM is provided inside the spindle accommodating portion 7. The spindle motor SM has a rotating shaft 9. The axis of rotation 9 is often called the “spindle”. A disk-shaped rotating grindstone 10 is mounted on the rotating shaft 9. The spindle motor SM rotates the rotating grindstone 10. The sealed substrate 2 is cut by relatively moving the table 4 and the spindle accommodating portion 7 including the rotating grindstone 10. The rotating grindstone 10 cuts the sealed substrate 2 by rotating in a plane including the Y direction and the Z direction. The rotary grindstone 10 can be attached to and detached from the rotary shaft 9 and can be replaced with another rotary grindstone.

  A work table 11 is provided in the dispensing module C. The cut substrate 12 is placed on the work table 11. The cut substrate 12 is an assembly including a plurality of products P cut into pieces by cutting the sealed substrate 2. An inspection camera 13 and a non-defective tray 14 are provided in the dispensing module C. Another tray for storing defective products may be provided in the dispensing module C. A cleaning mechanism for cleaning the cut substrate 12 and a drying mechanism for drying the cleaned substrate 12 may be provided in the dispensing module C.

  The work table 11 and the inspection camera 13 move relative to each other in the X direction and the Y direction, so that the inspection camera 13 photographs a plurality of products P. Based on the obtained image data, the image processing unit IMP performs image processing such as binarization. Based on the data obtained as a result of the image processing, the determination unit JDG determines the quality of the product P. The inspected products P are sorted into good products and defective products, and the good products are stored in the tray 14.

(Configuration of cutting mechanism)
With reference to FIG. 2, the cutting mechanism used in the manufacturing apparatus of the product which concerns on Embodiment 1 is demonstrated. The cutting mechanism 8 included in the manufacturing apparatus 1 includes a fixed plate 15. As the fixing plate 15 moves in the X direction along the X-axis guide rail (not shown), the cutting mechanism 8 moves in the X direction. A mounting plate 16 is provided on the fixed plate 15. A Z-axis guide rail 17 is provided on the fixed plate 15. A drive mechanism 18 for the Z axis is provided on the mounting plate 16. For example, a servo motor or a stepping motor is used as the drive mechanism 18. A ball screw 19 is connected to the rotating shaft of the drive mechanism 18. The elevating member 20 is attached to a ball nut (not shown) attached to the ball screw 19. The spindle accommodating portion 7 is fixed to the elevating member 20. When the drive mechanism 18 rotates the ball screw 19, the spindle housing portion 7 fixed to the elevating member 20 moves up and down along the Z-axis guide rail 17.

  FIG. 2 shows a state where the lower end of the rotating grindstone 10 is lowered to a predetermined cutting position and the sealed substrate 2 is being cut by the rotating grindstone 10. The predetermined cutting position refers to the position of the lower end of the rotating grindstone 10 in a state where the rotating grindstone 10 is lowered until the lower end of the outer edge of the rotating grindstone 10 is positioned at a predetermined cutting depth.

  As shown in FIG. 2A, one detection mechanism 21 is provided in the cutting mechanism 8. The detection mechanism 21 detects the state of the outer peripheral portion of the rotating grindstone 10 that is a detection target. Specifically, the detection mechanism 21 detects both the wear amount and chipping failure of the rotating grindstone 10. The detection mechanism 21 is provided on the side of the spindle housing 7 where the rotating grindstone 10 is attached (the right side in FIG. 2A). The detection mechanism 21 is moved up and down by the drive mechanism 22. The drive mechanism 22 includes a drive source M3 such as a servo motor and a ball screw S3. The drive mechanism 22 is used to raise the detection mechanism 21 when the rotary grindstone 10 is exchanged and retract it upward, and to lower the detection mechanism 21 after exchanging the rotary grindstone 10. An air cylinder or the like may be used as the drive mechanism 22. As the drive mechanism 22, a cam mechanism or the like interlocking with the raising / lowering of the spindle housing portion 7 may be used.

  As shown in FIGS. 2A and 2B, the detection mechanism 21 is provided so as to extend along the radial direction (the −Z direction in FIG. 2) from the outer periphery of the rotating grindstone 10 toward the center. The spindle accommodating portion 7 and the detection mechanism 21 are lifted and lowered together in a common motion system. Therefore, when the cutting depth of the rotating grindstone 10 is increased in accordance with the wear amount of the rotating grindstone 10, both the spindle housing portion 7 and the detection mechanism 21 are lowered.

(Detection mechanism configuration, etc.)
The detection mechanism 21 is a transmissive photoelectric sensor, and includes a light emitting unit 23 and a light receiving unit 24 that face each other. The light emitting unit 23 and the light receiving unit 24 preferably have the same optical axis (common optical axis) OP. The optical axis OP is preferably orthogonal to the surface of the rotating grindstone 10. Irradiation light 25 is emitted from the light emitting unit 23 toward the light receiving unit 24. In FIG. 2A, the light emitting portion 23 is disposed on the tip side (right side in FIG. 2A) of the rotating shaft 9 in the rotary grindstone 10, and on the spindle accommodating portion 7 side (left side in FIG. 2A). The light receiving unit 24 is disposed at the center. Instead of this, the light emitting unit 23 and the light receiving unit 24 may be interchanged. This is the same in other embodiments using a transmissive photoelectric sensor as the detection mechanism 21.

  The shapes of the light emitting area LA of the light emitting section 23 and the light receiving area RA of the light receiving section 24 will be described with reference to FIG. The shapes of the light emitting area LA of the light emitting section 23 and the light receiving area RA of the light receiving section 24 are preferably circles having the same effective diameter D with the same optical axis OP as the center. This circle corresponds to the detection range S of the light emitting area LA and the light receiving area RA each having an effective diameter D. In FIG. 2C, the field of view CV of the image sensor included in the light receiving unit 24 is indicated by a thin rectangular broken line. In addition, the light emitting area LA, the light receiving area RA, and the detection range S are indicated by one circular thin broken line.

  The incident light 26 (corresponding to a hatched portion in FIG. 2C) includes light that is not blocked by the rotating grindstone 10 among the irradiation light 25 irradiated from the light emitting unit 23. The light receiving unit 24 can receive incident light 26. The incident light 26 includes disturbance light (for example, illumination light) that is not caused by the irradiation light 25. Since the amount of disturbance light is sufficiently smaller than the amount of irradiation light 25, detection relating to the rotating grindstone 10 is not affected by the disturbance light.

  The light emitting unit 23 includes a light emitting element such as a light emitting diode or a laser diode (LD). The light receiving unit 24 includes an image pickup device (described later) such as a charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS) image sensor. Referring to FIG. 2C, the incident light 26 received by the light receiving unit 24 in the detection range S is guided into the field of view CV of the image sensor included in the light receiving unit 24.

  The light emitting unit 23 and the light receiving unit 24 are provided on the side of the outer peripheral portion of the rotating grindstone 10 that is a detection target. It is preferable that the light emitting unit 23 and the light receiving unit 24 are arranged so that the light emitting unit 23 and the light receiving unit 24 sandwich the upper part of the outer edge of the rotating grindstone 10. More preferably, the light emitting unit 23 and the light receiving unit 24 are arranged such that the light emitting unit 23 and the light receiving unit 24 sandwich the uppermost end of the outer edge of the rotating grindstone 10. When viewed along the optical axis OP, the light-emitting area LA of the light-emitting portion 23 and the light-receiving area RA of the light-receiving portion 24 are preferably nearly circular, and more preferably circular.

  As described above, by arranging the light emitting unit 23 and the light receiving unit 24, the following two effects can be obtained. First, droplets resulting from processing water such as cutting water or cooling water supplied near the portion where the sealed substrate 2 corresponding to the processing object is cut adhere to the light emitting unit 23 and the light receiving unit 24. It is suppressed to do. Second, the movement of the droplets caused by the processed water in the optical path where the incident light 26 travels to the light receiving unit 24 is suppressed. As a result, the irradiation light 25 and the incident light 26 are less likely to be disturbed by the droplet. Therefore, when detecting both the chipping failure of the rotating grindstone and the wear of the rotating grindstone, adverse effects (for example, a decrease in sensitivity to be detected) due to noise caused by droplets are suppressed.

  In this application document, the expressions “same optical axis”, “same diameter”, “same area”, “same range”, etc. indicate the position of the optical axis, the size of the diameter, the size of the area, the size of the range, etc. Including the case where there is a difference. For example, even if there is a deviation between the optical axis of the light emitting unit 23 and the optical axis of the light receiving unit 24, the accuracy of measuring the amount of incident light 26 received by the light receiving unit 24 is not practically affected. If the optical axis is shifted to a certain extent, the state is included in the “same optical axis”.

  In FIG. 2, the substrate 27 made of a printed circuit board, a lead frame or the like included in the sealed substrate 2 is on the upper side, and the sealing resin 28 included in the sealed substrate 2 is on the lower side. 2 is temporarily fixed to the table 4. As shown in FIGS. 2A and 2B, virtual grid-like cutting lines 29 are formed on the sealed substrate 2. Each of the plurality of regions 30 surrounded by the cutting line 29 corresponds to one product P (see FIG. 1).

  As shown in FIG. 2A, the table 4 is formed with a groove 31 in which the lower end of the outer edge of the rotating grindstone 10 is accommodated. The sealed substrate 2 is temporarily fixed to the upper surface of the table 4 by sucking the sealed substrate 2 through the suction path 32 provided in the groove 31. Instead of forming the groove 31 and the suction path 32 in the table 4, the upper surface of the table 4 and the sealing resin 28 of the sealed substrate 2 may be temporarily fixed using an adhesive tape. In this case, the lower end of the outer edge of the rotating grindstone 10 partially cuts the upper part of the thickness of the adhesive tape.

  Referring to FIG. 2C, the incident light 26 received by the light receiving unit 24 in the detection range S is guided to the field of view CV of the image sensor included in the light receiving unit 24. The relationship between the state where the rotating grindstone 10 is new and the detection range S, and the relationship between the state where the rotating grindstone 10 is worn to the limit where it can be used and the detection range S will be described. FIG. 2C shows two states of the rotating grindstone 10. The first state is a state where the rotating grindstone 10 is new. The new rotating grindstone 10 has an outer edge 33n. In this state, the wear amount of the rotating grindstone 10 is 0 (zero). The second state is a state where the rotating grindstone 10 is worn to the limit where it can be used. In this state, the rotating whetstone 10 worn to the limit has an outer edge 33w.

As shown in FIG. 2C, the detection range S corresponding to the circle having the effective diameter D includes the following three elements related to the rotating grindstone 10.
(1) First Element The first element is the outer edge 33n of the new rotating grindstone 10. In other words, it is the outer edge 33n of the rotating grindstone 10 whose wear amount is zero.

(2) 2nd element The 2nd element is the outer edge 33w of the rotating grindstone 10 in the state worn out to the limit which the rotating grindstone 10 can be used.

(3) 3rd element The 3rd element is a specific chip | tip among the chip | tips generate | occur | produced in the state from which the rotating grindstone 10 was worn to the limit which can be used from a new state. Specifically, the third element is a specific chip (hereinafter referred to as “minimum chip Cmin”) corresponding to the case where the chipped portion is the minimum in the non-allowable range. In other words, the size of the minimum chip Cmin is the minimum size that is judged to correspond to a defect of the rotating grindstone 10 when a chip gradually increasing from a small chip is assumed. The chip defect corresponding to the defect of the rotating grindstone 10 corresponds to a chip that requires the cutting process to be stopped after the rotation of the rotating grindstone 10 is stopped. In FIG. 2C, the minimum chipping Cmin is indicated by a V-shaped thick broken line. The rotating grindstone 10 in which the chipping defect corresponding to the chipping of the minimum chipping Cmin or more has occurred is usually replaced with a new rotating whetstone.

  The effective diameter D (the diameter of the detection range S; see FIG. 2C) between the light emitting area LA of the light emitting section 23 and the light receiving area RA of the light receiving section 24 is preferably 3 mm or more. In addition, the effective diameter D is preferably 6 mm or less.

  When the effective diameter D is less than 3 mm, at least one of the following two elements may not be included in the effective diameter D. First, it is one of the outer edge 33n (first element) of the new rotating grindstone 10 or the outer edge 33w (second element) of the rotating grindstone 10 in a state where the rotating grindstone 10 is worn to the limit where it can be used. When one of the outer edge 33n of the rotating grindstone 10 or the outer edge 33w of the rotating grindstone 10 is not included in the effective diameter D, the wear amount of the rotating grindstone 10 cannot be detected. Second, among the minimum chipping Cmin (third element), it is the minimum chipping Cmin in a state in which the rotating grindstone 10 is worn to the limit where it can be used. When the minimum chip Cmin in a state where the rotating grindstone 10 is worn to the limit that can be used is not included in the effective diameter D, the minimum chip Cmin in a state where the rotating grindstone 10 is worn to the limit cannot be detected.

  When the effective diameter D exceeds 6 mm, the dimensional difference between the outer edge 33n which is the first element and the outer edge 33w which is the second element regarding the amount of wear among the three elements described above, compared to the effective diameter D. Becomes relatively small. Therefore, the sensitivity for detecting the wear amount may be reduced. For the reasons described so far, the effective diameter D is preferably 3 mm or more and 6 mm or less.

With reference to FIG. 3, the detection mechanism 21 which the manufacturing apparatus of the product which concerns on this invention has is demonstrated. In the present embodiment, a technique for performing image processing on an image obtained by using an image sensor included in the detection mechanism 21 is applied. In the detection mechanism 21, the light emitting unit 23 includes a light emitting element 34, an optical fiber bundle 35, a light diffusion plate 36, a collimator lens 37, a reflecting mirror 38, and a transmission window 39. The light receiving unit 24 includes a light receiving window 40, a reflecting mirror 41, a condensing lens 42, an optical fiber bundle 43, and an imaging element 44 that is a light receiving element. The control unit CTL and the light emitting element 34 and the imaging element 44 and the control unit CTL are connected by signal lines, respectively. As the condenser lens 42, for example, a unit conjugate ratio lens can be used .

  As shown in FIG. 3B, the optical fiber bundles 35 and 43 are configured by bundling a plurality (N) of plastic optical fibers 45 having a diameter d of about 0.2 mm to 0.3 mm. . The plurality of plastic optical fibers 45 are covered with a coating 46. The diameter d of the plastic optical fiber 45 is preferably small and is preferably 0.2 mm or less. The diameter d of the plastic optical fiber 45 is more preferably about 0.07 to 0.08 mm.

  It is preferable to provide a light passage plate LT1 having a slit SL1 between the light emitting unit 23 and the rotating grindstone 10. A light passage plate LT2 having a slit SL2 is preferably provided between the rotating grindstone 10 and the light receiving unit 24. The light passage plate LT <b> 1 is provided between the light emitting unit 23 and the rotating grindstone 10 and in the vicinity of the transmission window 39. The light passage plate LT2 is provided between the rotary grindstone 10 and the light receiving unit 24 and near the light receiving window 40. The light passage plate LT1 may be attached to the main body of the light emitting unit 23 on the side of the transmission window 39. The light passage plate LT2 may be attached to the main body of the light receiving unit 24 on the light receiving window 40 side. Either one of the light passage plate LT1 and the slit SL2 may be provided. In summary, the light passing plates LT1 and LT2 are provided between the light emitting unit light emitting unit 23 and the rotating grindstone 10 or at least one between the rotating grindstone 10 and the light receiving unit 24. The width of the light passage plate LT1 and the width of the light passage plate LT2 are both smaller than the width of the light receiving region.

  The slit SL1 and the slit SL2 are elongated gaps extending in the Z direction. The width of these gaps (dimension in the Y direction) is determined to an optimum value. For example, the width of these gaps is preferably 0.5 mm to 1.2 mm. When the width of the gap is larger than 1.2 mm, the sensitivity for detecting a chipping defect of the rotating grindstone 10 may be lowered. When the width of the gap is smaller than 0.5 mm, the amount of received light is reduced, and therefore, when the chipping defect of the rotating grindstone 10 is detected, it is likely to be adversely affected by noise caused by droplets, chips, and the like. The content described so far with respect to the slit is similarly applied to other embodiments.

  In the light emitting unit 23, the light emitted from the light emitting element 34 is converted into diffused light by the light diffusion plate 36 after passing through the optical fiber bundle 35. The diffused light is converted into parallel light by the collimator lens 37. The parallel light travels in the −Z direction toward the reflecting mirror 38 and is reflected by −90 ° by the reflecting mirror 38 to become irradiation light 25 traveling in the −X direction. The irradiation light 25 sequentially passes through the transmission window 39 of the light emitting unit 23 and the slit SL1. A part of the irradiation light 25 is blocked by the rotating grindstone 10. The remaining portion of the irradiation light 25 that is not blocked by the rotating grindstone 10 sequentially passes through the slit SL2 and the light receiving window 40 of the light receiving unit 24 as incident light 26. In the light receiving unit 24, the incident light 26 is reflected by −90 ° by the reflecting mirror 41 and proceeds in the + Z direction. The reflected incident light 26 is collected by the condenser lens 42. The condensed light reaches the image sensor 44 via the optical fiber bundle 43.

(Operation of detection mechanism)
The operation of the product manufacturing apparatus 1 according to the first embodiment will be described below with reference to FIGS. 2 and 3. For example, an image sensor 44 made of a CMOS image sensor is provided in the light receiving unit 24. The optical fiber bundle 43 that guides the collected light to the image sensor 44 includes N plastic optical fibers 45. The light received by the N plastic optical fibers 45 corresponds to the light source.

  The imaging element 44 receives light from N light sources through N plastic optical fibers 45. Light from one light source is photoelectrically converted by a plurality of pixels included in the image sensor 44. The image sensor 44 photoelectrically converts light from N light sources and sends image signals corresponding to the respective pixels to the control unit CTL. The image processing unit IMP included in the control unit CTL AD-converts each image signal to, for example, 256 gradations. The image processing unit IMP generates image information by dividing (binarizing) the AD-converted image signal into “1” and “0” based on the threshold value. The image processing unit IMP generates a binary image based on the image information. “1” corresponds to “black” and indicates a place where the rotating grindstone 10 exists. “0” corresponds to “white” and indicates a place where the rotating grindstone 10 does not exist. The image information is used for detecting a chip defect of the rotating grindstone 10 and detecting the wear amount. The image information is displayed as an image on a display panel 47 such as a touch panel connected to the control unit CTL by a signal line. Image processing other than binarization may be used.

  First, detection of the amount of wear of the rotating grindstone 10 will be described. The control unit CTL sends a signal to the image sensor 44, and the image sensor 44 images the outer peripheral portion of the rotating grindstone 10 according to the signal. The image processing unit IMP performs image processing on the entire range of the captured image. The outer periphery of the rotating grindstone 10 includes the outer edge of the rotating grindstone 10. The boundary between “black” and “white” in the image subjected to image processing is recognized as the outer edge of the rotating grindstone 10.

  The control unit CTL previously captures the outer edge 33n of the new rotating grindstone 10 and the outer edge 33w in a state where the rotating grindstone 10 is worn to the limit where it can be used, and performs image processing on these images. The control unit CTL records the position (initial position) of the outer edge 33n of the new rotating grindstone 10 and the position (limit position) of the outer edge 33w in a state where the rotating grindstone 10 is worn to the limit that can be used on the recording medium. To do. The control unit CTL calculates the wear amount based on the difference between the initial position and the limit position, and records the wear amount on the recording medium as the limit wear amount.

  After the new rotating grindstone 10 starts to be used, the control unit CTL sends a signal to the image sensor 44, and the image sensor 44 images the outer edge of the rotating grindstone 10 according to the signal. The image processing unit IMP performs image processing on the entire range of the captured image. The determination unit JDG included in the control unit CTL compares the recognized position of the outer edge of the rotating grindstone 10 with the initial position read from the recording medium, and calculates the amount of wear at that time based on the position difference, for example. To do. The determination unit JDG compares the continuously calculated wear amount with the limit wear amount read from the recording medium. When the calculated wear amount is smaller than the limit wear amount, the determination unit JDG determines that the wear amount of the rotating grindstone 10 has not yet reached the limit. In this case, the control unit CTL does not limit the operation of the manufacturing apparatus 1.

  When the calculated wear amount becomes equal to the limit wear amount or exceeds the limit wear amount, the determination unit JDG determines that the wear amount of the rotating grindstone 10 has reached the limit. In this case, the control unit CTL controls the operation of the manufacturing apparatus 1 as follows, for example. The control in this case is referred to as “control when an abnormality occurs”.

  The control unit CTL stops the operation of cutting the sealed substrate 2 using the rotating grindstone 10 (hereinafter referred to as “cutting operation”). For example, the control unit CTL stops the cutting operation when the sealed substrate 2 has been cut along one cutting line 29. The control unit CTL operates to relatively move the rotary grindstone 10 and the table 4 (hereinafter referred to as “moving operation”, and corresponds to the + Y direction movement of the sealed substrate 2 shown in FIG. 2B). .) Is stopped. The control unit CTL raises the rotating grindstone 10 and stops the rotation of the rotating grindstone 10. Both a certain cutting operation and a moving operation from the end of the cutting operation to the start of the next cutting operation are included in the step of cutting the workpiece.

  In addition, the control unit CTL displays on the display panel 47 that “the rotating grindstone 10 has been worn to the limit where it can be used”. The control unit CTL performs an operation of blinking the indicator lamp, an operation of emitting sound such as a buzzer, and the like. These indications and actions inform the operator that an abnormality has occurred that “the rotating grindstone 10 has been worn to the limit where it can be used”. An operator who knows that "the rotating grindstone 10 has been worn to the limit that can be used" replaces the rotating grindstone 10 that has been worn to the limit with a new rotating grindstone 10 (the rotating grindstone 10 that has not been worn to the limit may be used).

  Secondly, detection of chipping defects in the rotating grindstone 10 will be described. The control unit CTL previously records the size (area) of the minimum chipping Cmin on the recording medium. When there is a “white” region extending downward from the outer edge of the “black” region, the control unit CTL recognizes the “white” region as missing (see FIG. 2C). The determination unit JDG compares the recognized chip size with the size of the minimum chip Cmin read from the recording medium. If the recognized chip size is smaller than the minimum chip size Cmin, the determination unit JDG determines that no chipping defect has occurred in the rotating grindstone 10. In this case, the control unit CTL does not limit the operation of the manufacturing apparatus 1.

  When the size of the chip becomes equal to the size of the minimum chip Cmin or exceeds the size of the minimum chip Cmin, the determination unit JDG determines that a chipping defect has occurred in the rotating grindstone 10. When a chipping defect occurs, the control unit CTL controls the manufacturing apparatus 1 when an abnormality occurs. In this case, it is preferable to immediately stop the cutting operation when the occurrence of chipping defects is detected.

  It is preferable to detect a chipping defect during a period when the rotating grindstone 10 cuts the sealed substrate 2 and an amount of wear during a period when the rotating grindstone 10 does not cut the sealed substrate 2. Examples of the period during which the rotating grindstone 10 does not cut the sealed substrate 2 include a period of moving operation from the end of a certain cutting operation to the start of the next cutting operation. By separating the period for detecting the chipping defect and the period for detecting the wear amount, the control unit CTL immediately detects the chipping defect that occurs during the period in which the rotating grindstone 10 cuts the sealed substrate 2, and the manufacturing apparatus. 1 can be controlled when an abnormality occurs. Therefore, when chipping defects occur in the rotating grindstone 10, it is possible to suppress deterioration in cutting quality such as roughening of the cut surface caused by continuing to use the rotating grindstone 10. In addition, the occurrence of defective products can be suppressed. These are the same in other embodiments.

(Function and effect)
According to the first embodiment, both the chipping failure of the rotating grindstone and the wear amount of the rotating grindstone are detected by the single detection mechanism 21. This can simplify the product manufacturing apparatus and the manufacturing method. Therefore, the apparatus cost and the product manufacturing cost can be suppressed. This is the same in other embodiments.

  According to Embodiment 1, each component (each module A-C) can be mutually attached or detached with respect to another component. By attaching another cutting module B between the supply module A and the cutting module B, the number of cutting modules B can be increased afterwards. By attaching another cutting module B between the cutting module B and the dispensing module C, the number of cutting modules B may be increased afterwards. By removing one of the plurality of cutting modules B, the number of cutting modules B can be reduced afterwards. Therefore, it is possible to respond to an increase or decrease in demand without increasing or decreasing the number of manufacturing apparatuses themselves. This is the same in other embodiments.

  As the cutting module B, a cutting module having a cutting mechanism different from the rotating grindstone may be attached to the cutting module using the rotating grindstone. Examples of the cutting mechanism different from the rotating grindstone include laser light, wire saw, water jet, blasting and the like. Thereby, a product (for example, a memory card) having a planar shape combining a line segment and a curved line (or a broken line) can be manufactured. By using laser light, blasting, or the like, a product in which a groove having a planar shape combining a line segment and a curved line (or a broken line) can be manufactured. These are the same in other embodiments.

[Embodiment 2]
(Image processing mode)
FIG. 2C shows a mode in which an image of the entire detection range S is processed. Not only this aspect but the aspect which image-processes a part of image of the detection range S is also employable. As shown in FIGS. 4A and 4B, an image of the entire range of the circular detection range S is included in a part of the visual field CV. The processing range 48 is a part of the detection range S and is a range to be subjected to image processing in the second embodiment. This is the same in the embodiments described later.

  4A and 4B show the outer edge of the image included in the processing range 48 among the images included in the field of view CV viewed from the light receiving unit 24 side shown in FIG. 2A by a solid line. The outer edge of an image not included in the processing range 48 (an image that has not been captured by the optical fiber bundle 43 shown in FIG. 3A) is indicated by a broken line. FIGS. 4A and 4B show both the state where the rotating grindstone 10 is normal within the processing range 48 and the case where the minimum chipping Cmin occurs in the rotating grindstone 10 by solid lines.

  FIG. 4A shows Embodiment 2 in which one type of image corresponding to an image of a part of the detection range S is image-targeted for the rotating grindstone 10 at a certain point in time. The processing range 48 corresponds to a range narrowed by the slit SL1 (or slit SL2) shown in FIG. The processing range 48 includes the outer edge 33n of the new rotating grindstone 10, the outer edge 33w of the rotating grindstone 10 worn to the limit, and the minimum chip Cmin in the rotating grindstone 10 worn to the limit. The width of the slit SL1 may completely include the minimum chipping Cmin, or may include the majority of the minimum chipping Cmin (for example, about 90% of the area of the minimum chipping Cmin). These two modes exist as “modes including the minimum chipping Cmin”.

(Function and effect)
According to the second embodiment, the area of the image to be subjected to image processing corresponds to the area of the slit SL1 (= the area of the processing range 48). The area of the processing range 48 corresponds to a partial area of the detection range S. Since all images other than the processing range 48 in the field of view CV are “black”, it is not necessary to perform image processing on images other than the processing range 48. Therefore, the amount of image information to be subjected to image processing is small as compared with an aspect in which an image of the entire detection range S is processed. As a result, it is possible to perform image processing at a higher speed than in the case where the image of the entire range of the detection range S is processed. Therefore, according to the second embodiment, since the number of images that can be processed within a unit time increases, the determination regarding the wear amount and the determination regarding the defect defect can be performed with high accuracy and at high speed.

[Embodiment 3]
(Image processing mode)
In FIG. 4A, two types of images corresponding to different partial images included in the detection range S are selected for the rotating wheel 10 at a certain point in time after the rotating wheel 10 starts to be used. Then, Embodiment 3 which determines the presence or absence of a chip defect and the amount of wear based on those images is shown. In the processing range 48 narrowed by the slit SL1 included in the light transmission plate LT1 (see FIG. 3A), image information in two different types of processing ranges is selected. The following two types of images are acquired based on the selected image information.

  When a new rotating grindstone 10 is targeted, the first of the two types of images is a new chip detection area that can include the new chip minimum chip Cmin in the processing range 48 narrowed by the slit SL1. It is an image of RC. The second of the two types of images is an image of the outer edge detection area RE when new, including the new outer edge 33n in the processing range 48.

  When the rotating grindstone 10 that has been worn to the limit is targeted, the first of the two types of images is the chipping detection area at the time of limit wear that can include the minimum chipping Cmin when the processing range 48 is worn to the limit. It is an image of RC. The second of the two types of images is an image of the outer edge detection region RE at the time of limit wear including the outer edge 33w at the time of limit wear in the processing range 48.

  The wear amount of the rotating grindstone 10 is detected by calculating based on the position of the outer edge detection area RE when the outer edge detection area RE is set. Specifically, the wear amount of the rotating grindstone 10 is calculated from the distance from the outer edge of the new rotating whetstone 10 to the outer edge of the worn rotating whetstone 10. The outer edge detection region RE is set so that the outer edge 33n to the outer edge 33w of the rotating wheel 10 are positioned at the center of the outer edge detection region RE in the Z direction from the new rotation wheel 10 to the limit wear. The amount of movement of the outer edge detection area RE in the Z direction when the outer edge detection area RE is set is grasped as the corresponding number of pixels. Therefore, the actual amount of wear of the rotating grindstone 10 is calculated based on the number of pixels corresponding to the amount of movement of the outer edge detection area RE corresponding to the outer edge of the new rotating whetstone 10 from the outer edge of the worn rotating whetstone 10.

  In the image in the vicinity of the outer edge of the rotating grindstone 10, the image blur described below occurs. The image blur occurs due to disturbance including irregularities on the outer edge of the rotating grindstone 10 and mist droplets in the vicinity of the outer edge of the rotating grindstone 10. The mist-like droplets are generated from processing water or the like that is involved in the rotation of the rotating grindstone 10. The image blur becomes a factor (a kind of noise for the image signal) that reduces the accuracy of detecting the position of the outer edge of the rotating grindstone 10. In the image that has been subjected to image processing, the irregularities on the outer edge of the rotating grindstone 10 and the mist-like droplets present near the outer edge of the rotating grindstone 10 appear as blurring of the outer edge in the image. In order to maintain the accuracy of detecting the position of the outer edge of the rotating grindstone 10, it is preferable to correct image blurring. In order to correct the shake, for example, an average of the positions of the outer edges of the rotating grindstone 10 may be calculated using a plurality of images. This is the same in other embodiments.

(Function and effect)
According to the third embodiment, the areas of two types of images selected based on image information generated by image processing correspond to a part of the area of the slit SL2. Therefore, according to the third embodiment in which an image of a part of the area of the slit SL2 is determined as compared with the second embodiment in which an image of the entire range of the slit SL2 is processed, image processing can be performed at a higher speed. Compared to the second embodiment, according to the third embodiment, the number of images that can be processed within a unit time is increased, so that the determination regarding the wear amount and the determination regarding the chipping defect can be performed with higher accuracy and at higher speed.

[Embodiment 4]
(Image processing mode)
In FIG. 4B, two types of images corresponding to different partial images in the detection range S are selected for image processing on the rotating wheel 10 at a certain point in time after the rotating wheel 10 starts to be used. Embodiment 4 is shown. In the fourth embodiment, an image having a narrower width than the image of the third embodiment is acquired by using the slit SL3 included in the light transmission plate LT3 instead of the slit SL1. The width of the slit SL3 is smaller than the width of the slit SL1 and smaller than the width of the minimum chip Cmin.

  The outer edge detection region RE is set so that the outer edges 33n to 33w of the rotary wheel 10 are located at the center of the outer edge detection region RE in the Z direction from the time when the rotating wheel 10 is new to the time of limit wear. The chipping detection area RC is set so that the chipping detection area RC is included within the minimum chipping Cmin from the time when the rotating grindstone 10 is new to the time of limit wear. In other words, the chip detection area RC is set so that the chip detection area RC is positioned inside the minimum chip Cmin. The chip detection region RC is included in the minimum chip Cmin in a state of being separated from the outer edges 33n to 33w of the rotary grindstone 10 in the −Z direction from when the rotary grindstone 10 is new to when it is critically worn. The chipping detection area RC corresponds to an area in which it is determined in advance that it is determined that the minimum chipping Cmin has occurred if the image in this area is “white”.

(Function and effect)
According to the fourth embodiment, first, the area of the chip detection region RC selected based on the image information generated by image processing is smaller than the area of the chip detection region RC selected in the third embodiment. . Second, the area of the outer edge detection region RE selected based on the above-described image information is smaller than the area of the outer edge detection region RE selected in the third embodiment. Thus, image processing can be performed at a higher speed than in the third embodiment. Therefore, compared to the third embodiment, according to the fourth embodiment, the number of images that can be processed within a unit time is increased, so that the determination regarding the wear amount and the determination regarding the chip defect can be performed with higher accuracy and at higher speed. it can.

  In addition, according to the fourth embodiment, the chipping detection region RC is included in the minimum chipping Cmin in a state of being separated from the outer edges 33n to 33w of the rotating grindstone 10 in the −Z direction. Therefore, the influence of the image blur due to the disturbance near the outer edge of the rotating grindstone 10 is suppressed.

[Embodiment 5]
(Configuration of detection mechanism)
With reference to FIG. 5, the detection mechanism used in Embodiment 5 will be described. The difference from Embodiments 1 and 2 is that a reflection type is used instead of a transmission type as a detection mechanism that is a photoelectric sensor. Since other configurations and operations are basically the same as those of the first embodiment, the same components are denoted by the same reference numerals and description thereof is omitted. The fifth embodiment corresponds to a combination of the second embodiment and a reflective photoelectric sensor.

  As shown in FIG. 5A, the detection mechanism 49 includes a light emitting unit 23 and a light receiving unit 24. In the cutting mechanism 8 (see FIG. 2), the rotating grindstone 10 is arranged so that both side surfaces of the rotating grindstone 10 are along the Z direction. The light emitting unit 23 is arranged so that the optical axis OP1 of the light emitting unit 23 is along the Z direction. The light receiving unit 24 is arranged such that the optical axis OP2 of the light receiving unit 24 is along the X direction. Therefore, the optical axis OP1 and the optical axis OP2 are orthogonal. The light emitting unit 23 and the light receiving unit 24 are disposed inside the case 50. A light passage plate LT1 is disposed between the rotating grindstone 10 and the light receiving unit 24. The light passage plate LT1 is provided with an elongated slit SL1 extending along the Z direction.

  The light emitting unit 23 includes a light emitting element 34, an optical fiber bundle 35, a light diffusing plate 36, a collimator lens 37, and a half mirror 51. The light emitting element 34 irradiates light in the −Z direction in the figure. The light receiving unit 24 includes a condenser lens 42, an optical fiber bundle 43, and an image sensor 44. A beam splitter can be used instead of the half mirror 51.

  The detection mechanism 49 uses coaxial illumination. By using coaxial illumination, incident light including reflected light reflected on the surface of the rotating grindstone 10 can be made incident, and diffused light at the outer edge of the rotating grindstone 10 can be deflected. The image sensor 44 can stably receive the reflected light from the surface of the rotating grindstone 10. Therefore, the contrast ratio between the surface of the rotating grindstone 10 and the background with respect to the light incident on the image sensor 44 becomes clear.

(Operation of detection mechanism)
With reference to FIG. 5, the operation | movement which detects the chipping defect and wear amount of the rotating grindstone 10 using the detection mechanism 49 is demonstrated. As shown in FIG. 5A, first, the control unit CTL sends a signal instructing light emission to the light emitting unit 23. The light emitted from the light emitting element 34 according to the received signal is guided to the collimator lens 37 through the optical fiber bundle 35 and the light diffusion plate 36 in order, and is converted into parallel light by the collimator lens 37. The parallel light travels toward the half mirror 51 and is reflected by −90 ° by the half mirror 51. Irradiation light 52 that is reflected parallel light travels in the −X direction. The irradiation light 52 sequentially passes through the opening 53 of the detection mechanism 49 and the slit SL1 and reaches the surface of the rotating grindstone 10. The range of the slit SL1 corresponds to the processing range 48 described in the second embodiment (see FIGS. 4 and 5B).

  In the outer peripheral portion of the rotating grindstone 10, a part of the irradiation light 52 passes through the rotating grindstone 10 as transmitted light 54. A portion of the irradiated light 52 other than the transmitted light 54 (in other words, a remaining portion of the irradiated light 52 that has not passed through the rotating grindstone 10) is reflected on the surface of the rotating grindstone 10 to become reflected light 55. The reflected light 55 passes through the slit SL1 and the opening 53 in order and enters the light receiving unit 24. The reflected light 55 incident on the light receiving unit 24 passes through the half mirror 51 and is collected by the condenser lens 42. The condensed light reaches the image sensor 44 via the optical fiber bundle 43. Since the method for detecting the chipping defect and the wear amount of the rotating grindstone 10 based on the image signal obtained by the image sensor 44 is the same as that in the first embodiment, the description thereof is omitted.

  The image processed by the image processing unit IMP is displayed on the display unit 47 (see FIG. 5B). In the upper part of FIG. 5B, a state in which the minimum chip Cmin is generated in the new rotating grindstone 10 is displayed by a solid line within the processing range 48 and a broken line outside the processing range 48 included in the visual field CV. A state in which the minimum chip Cmin is generated in the rotating grindstone 10 worn to the limit is displayed by a broken line below FIG.

(Function and effect)
According to the fifth embodiment, the reflection type detection mechanism 49 is used as a detection mechanism for detecting the chipping defect and the wear amount of the rotating grindstone 10. The detection mechanism 49 detects a chip defect and a wear amount of the rotating grindstone 10 by an illumination method using coaxial illumination. By using coaxial illumination, the diffused light at the outer edge of the rotating grindstone 10 can be diverted. Thereby, the difference in brightness between the rotating grindstone 10 and the background in the light incident on the image sensor 44 becomes clear. Therefore, since the outer edge of the rotating grindstone 10 is detected with high accuracy, the presence / absence of chipping defects and the amount of wear in the rotating grindstone 10 can be detected and determined.

  According to the fifth embodiment, it is possible to detect the presence or absence of chipping defects and the amount of wear in the rotating grindstone 10 using the reflective detection mechanism 49. Therefore, by adjusting the position at which the rotating grindstone 10 is lowered according to the amount of wear of the rotating grindstone 10, it is possible to cut the workpiece with the cutting depth of the rotating grindstone 10 constant. In addition, it is possible to detect a chipping defect in the rotating grindstone 10 and stop the cutting operation. As a result, as in the first embodiment, it is possible to suppress the deterioration of the cutting quality due to chipping defects and to suppress the generation of defective products.

  According to the fifth embodiment, since the reflection type detection mechanism 49 is used, the detection mechanism can be simplified and downsized as compared with the transmission type detection mechanism. Thereby, the manufacturing apparatus and manufacturing method of a product can be simplified. Therefore, the apparatus cost and the product manufacturing cost can be suppressed.

  According to the fifth embodiment, since the reflection type detection mechanism 49 is used, it is not necessary to arrange the detection mechanism so as to sandwich the rotating grindstone 10 from both sides unlike the transmission type detection mechanism. A reflective detection mechanism 49 is arranged opposite to one of the surfaces of the rotating grindstone 10. For example, the detection mechanism 49 shown in FIG. 5A is disposed only on the side of the spindle housing portion 7 in the rotary grindstone 10 shown in FIG. 2A (the left side of the rotary grindstone 10 in FIG. 2A). To do. Thereby, when exchanging the rotating grindstone 10, it is not necessary to retract the detection mechanism 49 toward the upper side of the rotating grindstone 10, so that the rotating grindstone 10 can be easily replaced. Therefore, the work time for exchanging the rotating grindstone 10 can be shortened and workability can be improved.

  In the fifth embodiment, instead of the reflection type detection mechanism 49 shown in FIG. 5, a modification using a reflection type detection mechanism having a coaxial light emitting part and light receiving part may be adopted. According to this modification, a reflection type detection mechanism is used in which a part of the ends of a plurality of optical fibers is used as a light emitting part and the remaining part is used as a light receiving part. In this case, as an example, two rows on the outer peripheral side of the plurality of plastic optical fibers 45 shown in FIG. 3B are used as light emitting units, and the remaining inner portion is used as a light receiving unit. As another example, the right half of the plurality of plastic optical fibers 45 shown in FIG. 3B is used as a light emitting unit, and the remaining left half is used as a light receiving unit. According to this modification, compared with the case where the reflection type detection mechanism 49 shown in FIG. 5 is used, the detection mechanism is further simplified and further reduced in size by performing light emission and light reception coaxially. Can do.

  In particular, when a reflection type detection mechanism is used, sufficient reflected light 55 may not be obtained depending on the state of the surface of the rotating grindstone 10. Examples of the case where sufficient reflected light 55 cannot be obtained include a case where the light reflectance of the abrasive grains contained in the rotating grindstone 10 is low. In this case, since the difference between the light amount of the portion where the rotating grindstone 10 exists and the light amount of the portion where the rotating grindstone 10 does not exist is small, it may be difficult to detect the outer edge of the rotating grindstone 10. As a countermeasure, the AD-converted image signal corresponding to the image extending along the −Z direction inside the processing range 48 shown in FIG. 4 is differentiated along the −Z direction. In the differentiated value, the position where the image signal rises and the position where it is saturated are obtained as inflection points. It is estimated that the intermediate point between the two obtained positions corresponds to the outer edge of the rotating grindstone 10. Regardless of whether the detection mechanism is a transmission type or a reflection type, the method of differentiating the image signal is effective when the surface color of the rotating grindstone 10 changes, or when the surface of the rotating grindstone 10 becomes dirty.

  According to the fifth embodiment, the second embodiment and the reflective photoelectric sensor are combined. Not only this but Embodiment 3 and a reflection type photoelectric sensor may be combined, and Embodiment 4 and a reflection type photoelectric sensor may be combined.

[Embodiment 6]
With reference to FIG. 6, an apparatus for manufacturing a product having a twin spindle configuration having two rotation mechanisms will be described. In particular, a detection mechanism of the product manufacturing apparatus will be described. This detection mechanism can detect the chipping defect and the wear amount of the rotating grindstones attached to the two rotating mechanisms, in other words, the total of two rotating grindstones in the same process. Since the configuration other than the cutting mechanism and the detection mechanism is basically the same as that of the first embodiment, the same components are denoted by the same reference numerals and description thereof is omitted.

(Configuration of cutting mechanism and detection mechanism)
With reference to FIG. 6, the structure of the cutting mechanism and detection mechanism used in Embodiment 6 is demonstrated. As shown in FIG. 6A, in the manufacturing apparatus 56, the cutting module B (see also FIG. 1) is provided with, for example, two tables 4a and 4b. The manufacturing apparatus 56 has a twin cut table configuration. The sealed substrate 2 is placed on each of the two tables 4a and 4b as an object to be processed. The sealed substrate 2 is sucked onto the upper surfaces of the tables 4a and 4b by a suction mechanism (not shown).

  The cutting module B is provided with two rotating mechanisms 8a and 8b that cut the respective sealed substrates 2. Spindle motors SMa and SMb are provided in the rotation mechanisms 8a and 8b, respectively. The manufacturing apparatus 56 has a twin spindle configuration. The two spindle motors SMa and SMb have rotating shafts 9a and 9b, respectively. Rotating grindstones 10a and 10b are mounted on the rotating shafts 9a and 9b, respectively.

  A detection mechanism 21a is provided so as to sandwich the outer edge portion of the rotating grindstone 10a. A detection mechanism 21b is provided so as to sandwich the outer edge portion of the rotating grindstone 10b. The detection mechanisms 21a and 21b are transmissive detection mechanisms and have the same configuration as the detection mechanism 21 disclosed in the first embodiment.

  The detection mechanism 21a includes a light emitting unit 23a and a light receiving unit 24a that face each other. The light emitting part 23a and the light receiving part 24a are respectively arranged so as to sandwich the outer edge part of the rotating grindstone 10a. The light emitting portion 23a is arranged on the side of the spindle motor SMa in the rotating grindstone 10a (the left side of the rotating grindstone 10a in FIG. 6A). The light receiving portion 24a is disposed on the tip side of the rotating shaft 9a in the rotating grindstone 10a (on the right side of the rotating grindstone 10a in FIG. 6A).

  The detection mechanism 21b includes a light emitting unit 23b and a light receiving unit 24b that face each other. The light emitting part 23b and the light receiving part 24b are respectively arranged so as to sandwich the outer edge part of the rotating grindstone 10b. The light emitting portion 23b is disposed on the side of the spindle motor SMb in the rotating grindstone 10b (on the right side of the rotating grindstone 10b in FIG. 6A). The light receiving portion 24b is disposed on the distal end side of the rotating shaft 9b in the rotating grindstone 10b (on the left side of the rotating grindstone 10b in FIG. 6A).

  Each of the light emitting unit 23a and the light emitting unit 23b has the same configuration as the light emitting unit 23 described in the first embodiment. Each of the light receiving unit 24a and the light receiving unit 24b has the same configuration as the light receiving unit 24 described in the first embodiment (see FIG. 3A).

  The light emitting unit 23a included in the detection mechanism 21a is connected to a light emitting element 34a provided outside the light emitting unit 23a via an optical fiber bundle 35a. The light receiving unit 24a of the detection mechanism 21a is connected to one common imaging unit 57 provided outside the light receiving unit 24a via an optical fiber bundle 43a. The imaging unit 57 is provided with a condensing lens 42a that condenses the light received from the light receiving unit 24a. The imaging unit 57 is provided with one common imaging element 44. As the image pickup element 44, a CCD, a CMOS image sensor, or the like is used. As will be described later, the imaging element 44 can simultaneously image the outer peripheral portion of the rotating grindstone 10a and the outer peripheral portion of the rotating grindstone 10b.

  The light emitting unit 23b included in the detection mechanism 21b is connected to a light emitting element 34b provided outside the light emitting unit 23b via an optical fiber bundle 35b. The light receiving unit 24b of the detection mechanism 21b is connected to one common image pickup unit 44 provided outside the light receiving unit 24b via an optical fiber bundle 43b. For example, the imaging unit 57 is provided with a condensing lens 42b that condenses the light received from the light receiving unit 24b. Instead of the two condensing lenses 42a and 42b, one common condensing lens (collection shown in FIG. 3A) that targets both incident light received from the optical fiber bundles 43a and 43b, respectively. (Corresponding to the optical lens 42) may be used.

  The imaging unit 57 is connected to both the light receiving unit 24a of the detection mechanism 21a and the light receiving unit 24b of the detection mechanism 21b. The imaging unit 57 receives both light received by the light receiving unit 24a and the light receiving unit 24b, and converts the intensity of each light into an electric signal. By providing the imaging unit 57 outside the light receiving unit 24a of the detection mechanism 21a and outside the light receiving unit 24b of the detection mechanism 21b, the imaging unit 57 can be used as a common imaging unit for the light receiving units 24a and 24b. With this configuration, the imaging unit 57 can simultaneously capture the light received by the detection mechanism 21a and the detection mechanism 21b.

  In FIG. 6A, two whetstone detectors 58 are indicated by dashed rectangles. The detection unit 58 for two grindstones has at least the light emitting elements 34a and 34b, a part of the optical fiber bundles 35a and 35b, a part of the optical fiber bundles 43a and 43b, and one common imaging unit 57. . According to the configuration shown in FIG. 6A, the detection unit 58 for two grindstones including the imaging device 44 is not included in the cutting module B but is included in the supply module A. The detection mechanisms 21a and 21b shown in FIG. 6A do not include the light emitting elements 34a and 34b and the imaging unit 57. According to this configuration, the light emitting elements 34a and 34b and the imaging unit 57 are not included in the vicinity of the rotating grindstone 10a and in the vicinity of the rotating grindstone 10b. Usually, the environment such as the temperature and humidity inside the supply module A is maintained in a constant environment that is better than the environment near the rotating grindstone 10a and the environment near the rotating grindstone 10b. Therefore, the light emitting elements 34a and 34b and the imaging unit 57 are suppressed from being affected by the presence of droplets, chips, temperature changes, and the like.

  By using the detection unit 58 for two grindstones, the light received by the detection mechanism 21a and the detection mechanism 21b can be simultaneously imaged. If necessary, a light shielding plate LS may be disposed in the middle of the image sensor 44 in order to prevent interference between the light received from the light receiving unit 24a and the light received from the light receiving unit 24b. 6A and 6B show an example in which the light shielding plate LS is arranged.

  The light emitting elements 34a and 34b and the imaging element 44 are connected to a control unit CTL provided in the supply module A (see also FIG. 1) via signal lines. The control unit CTL includes an image processing unit IMP and a determination unit JDG. Based on the data sent from the imaging unit 57 to the control unit CTL, the control unit CTL detects and determines the presence or absence of chipping defects and the wear amount of the two rotating grindstones 10a and 10b.

  FIG. 6B is a view of the outer peripheral portions of the rotating grindstones 10a and 10b projected in the visual field CV as viewed from the light receiving portions 24a and 24b. As shown in FIG. 6B, the display unit 47 displays the states of the two rotating grindstones 10a and 10b captured by the image sensor 44 on the same screen. Since the method for detecting the chipping defect and the wear amount of the rotating grindstones 10a and 10b is the same as that in the first embodiment, the description thereof is omitted.

(Function and effect)
According to the sixth embodiment, the imaging unit 57 is connected to both the light receiving unit 24a of the detection mechanism 21a and the light receiving unit 24b of the detection mechanism 21b. One imaging element 44 included in the imaging unit 57 simultaneously receives both light received by the light receiving unit 24a and the light receiving unit 24b, and converts the intensity of each light into an electrical signal. The imaging device 44 images both states of the rotating grindstones 10a and 10b at the same time. Based on the data sent from one imaging unit 57 to the control unit CTL, the control unit CTL detects and determines the presence or absence of chipping defects and the wear amount of the two rotating grindstones 10a and 10b. Thereby, the manufacturing apparatus and manufacturing method of a product can be simplified. Therefore, the apparatus cost and the product manufacturing cost can be suppressed.

  According to the sixth embodiment, the control unit CTL determines the presence / absence of chipping defects and the amount of wear of the two rotating grindstones 10a and 10b. Thereby, in the manufacturing apparatus having a twin spindle configuration, it is possible to detect chipping defects and wear amounts of the two rotating grindstones 10a and 10b while executing a process of cutting a workpiece. Therefore, the productivity of the manufacturing apparatus 56 can be improved. In addition, the quality of cutting can be improved.

  In the sixth embodiment, transmissive detection mechanisms 21a and 21b are used to detect chipping defects and wear amounts of the two rotating grindstones 10a and 10b, respectively. However, the present invention is not limited to this, and a reflection type detection mechanism can also be used in order to detect chipping failure and wear amount of the two rotating grindstones.

  In the sixth embodiment, the manufacturing apparatus having the twin spindle configuration and the twin cut table configuration has been described. The detection mechanism of the present invention can be applied not only to this but also to a manufacturing apparatus having a twin spindle configuration and a single cut table configuration.

  In the sixth embodiment, the light emitting elements 34 a and 34 b and the imaging unit 57 including the imaging element 44 are provided outside the cutting module B. In this case, a configuration in which the detection unit 58 for two grindstones is arranged in the control unit CTL provided in the supply module A included in the manufacturing apparatus 56 may be employed. FIG. 6A shows this configuration. Not limited to these configurations, as in the first embodiment, a configuration in which two light emitting elements 34a and 34b are provided inside each of the two light emitting sections, and two image sensors 44 are provided in two. You may employ | adopt the structure provided one each inside a light-receiving part.

  The operator may manually operate the drive mechanism 22 shown in FIG. For example, a micrometer head is attached to the mounting plate 16 shown in FIG. 2, and the micrometer head is used as a drive mechanism. The operator can raise and lower the detection mechanism 21 by operating the micrometer head. The operator can know the position of the optical axis OP in the Z direction from the scale of the micrometer head. Such a drive mechanism is used when a plurality of types of rotating grindstones 10 having a plurality of outer diameter values are attached to the same cutting mechanism 8 and used for replacement, and when the difference in outer diameter values is large. Is particularly useful.

  When using such a drive mechanism, before using the new rotating grindstone 10, the first to third elements described above are included in the detection range S, and the operator manually The drive mechanism 22 is operated. The detection mechanism 21 is fixed at a position where the first element to the third element are included in the detection range S. As a result, it is possible to detect the wear amount of the rotating grindstone 10 between the new state and the state in which the rotating grindstone 10 is worn to the limit, and the minimum chipping Cmin generated between them while the detection mechanism 21 is fixed. .

  An image processing unit IMP having a function of performing image processing and a determination unit JDG having a function of detecting chipping failure and wear amount of the rotating grindstone 10 may be provided separately from the control unit CTL. The detection mechanism 21, the image processing unit IMP, and the determination unit JDG can be attached to the product manufacturing apparatus 1 afterwards. In this case, software for image processing, detection and determination of chipping defects and wear amount may be added to the control unit CTL after the fact.

  In each embodiment, the case where the sealed board | substrate 11 which is a plate-shaped member containing a chip-shaped element as a processing target object is cut and separated into pieces is shown. However, the present invention is not limited to this, and the present invention is applied to a case where the next processing object is separated into pieces as processing objects other than the sealed substrate 11.

  The first object to be processed is a semiconductor wafer such as silicon (Si). A semiconductor wafer is a plate-like member in which functional elements such as IC and MEMS (Micro Electro Mechanical Systems) are built. The second workpiece is a ceramic substrate or the like in which functional elements such as resistors, capacitors, sensors, and surface acoustic wave devices are built. Ceramic substrates and the like are separated into individual pieces to manufacture products such as chip resistors, chip capacitors, chip-type sensors, and surface acoustic wave devices. In these two cases, a semiconductor wafer, a ceramic substrate, or the like corresponds to a plate-like member in which functional elements corresponding to a plurality of regions are formed. The third workpiece is a resin molded product that is a plate-like member. By separating the resin molded product into individual pieces, optical products such as lenses, optical modules and light guide plates, and general molded products are manufactured. In this case, optical products and molded products correspond to functional elements. The contents described so far can be applied to various cases including the above four cases.

  When the processing object is broken by applying an external force to the processing object after forming a groove in the processing object, the divided (divided into pieces) corresponds to the product. You may manufacture the product which has a groove | channel by forming the groove | channel which has an appropriate width | variety and depth in a workpiece, respectively. Among these products, products having fine grooves are used as MEMS parts and the like.

  The present invention is not limited to the above-described embodiments, and can be arbitrarily combined, modified, or selected and adopted as necessary within the scope not departing from the gist of the present invention. It is.

1, 56 Manufacturing equipment 2 Encapsulated substrate (object to be processed)
DESCRIPTION OF SYMBOLS 3 Substrate supply mechanism 4, 4a, 4b Table 5 Moving member 6 Rotating member 7 Spindle accommodating part 8, 8a, 8b Cutting mechanism 9, 9a, 9b Rotating shaft 10, 10a, 10b Rotating grindstone 11 Worktable 12 Cut substrate 13 Camera 14 Tray 15 Fixing plate 16 Mounting plate 17 Guide rail 18 Drive mechanism 19 Ball screw 20 Lifting member 21, 21a, 21b, 49 Detection mechanism 22 Drive mechanism 23, 23a, 23b Light emitting part 24, 24a, 24b Light receiving part 25, 52 Irradiation Light 26 Incident light 27 Substrate 28 Sealing resin 29 Cutting line 30 Region 31 Groove 32 Suction path 33n, 33w Outer edge 34, 34a, 34b Light emitting element 35, 35a, 35b, 43, 43a, 43b Optical fiber bundle 36 Light diffusion plate 37 Collimator lens 38, 41 Reflector 39 Transmission window 40 Reception window 42 Collection Lens 44 Image sensor 45 Plastic optical fiber 46 Coating 47 Display panel 48 Processing range 50 Case 51 Half mirror 53 Aperture 54 Transmitted light 55 Reflected light 57 Imaging unit 58 Two detection units for grindstone A Supply module B Cutting module C Discharge module Cmin Minimum chip CTL control unit CV Field of view D Effective diameter d Diameter IMP Image processing unit JDG Judgment unit LA Light emitting area LS Light shielding plate LT1, LT2, LT3 Light transmission plate M1, M2, M3 Drive source MZ magazine OP, OP1, OP2 Optical axis P Product RA Light receiving area RC Chip detection area RE Outer edge detection area S Detection range S1, S2, S3 Ball screw SL1, SL2, SL3 Slit SM, SMa, SMb Spindle motor

Claims (2)

A product manufacturing apparatus that manufactures a product by cutting a workpiece using a disk-shaped rotary grindstone,
A detection mechanism having a light emitting unit that emits irradiation light toward the outer peripheral portion of the rotating grindstone and a light receiving unit that receives incident light including light resulting from the irradiation light;
An image processing unit that acquires image information by performing image processing on the image obtained by converting the incident light; and
A determination unit that determines a state of the outer peripheral portion of the rotating grindstone based on the image information and issues a determination signal indicating that the outer peripheral portion of the rotating grindstone is in a specific state;
The light emitting part is placed on one side of the outer peripheral part of the rotating grindstone,
The light receiving part is placed on the side of the outer peripheral part of the rotating grindstone,
The determination unit can issue, as the determination signal, a chipping determination signal indicating the occurrence of chipping defects in the rotating grindstone, and a wear amount determination signal indicating the amount of wear of the rotating grindstone,
The rotary grindstone includes a first grindstone and a second grindstone,
A first detection mechanism having a first light receiving portion targeting the first rotating grindstone, and a second detection mechanism having a second light receiving portion targeting the second rotating grindstone,
Conversion that converts the first incident light received by the first light receiving region of the first light receiving unit and the second incident light received by the second light receiving region of the second light receiving unit into an image. Part
The conversion unit acquires a first image based on the first incident light using a part of the visual field of the conversion unit,
The conversion unit acquires a second image based on the second incident light using at least a part of the remaining field of view of the conversion unit,
The image processing unit obtains first image information by performing image processing on the first image;
The image processing unit acquires second image information by performing image processing on the second image,
The determination unit determines whether or not to issue a first determination signal based on the first image information;
The determination unit determines whether or not to issue a second determination signal based on the second image information. A product manufacturing method for manufacturing a product by cutting an object to be processed using a disk-shaped rotary grindstone,
Preparing a detection mechanism having a light emitting part and a light receiving part;
Receiving incident light including light resulting from irradiation light emitted from the light emitting portion toward the outer peripheral portion of the rotating grindstone;
Obtaining image information by performing image processing on an image obtained by converting the incident light by a conversion unit;
Determining a state of the outer peripheral portion of the rotating grindstone based on the image information, and determining whether or not to issue a determination signal indicating that the outer peripheral portion of the rotating grindstone is in a specific state. ,
In the step of preparing the detection mechanism, the light emitting part is placed on one side of the outer peripheral part of the rotating grindstone, the light receiving part is placed on the side of the outer peripheral part of the rotating grindstone,
In the step of determining whether or not to issue the determination signal, it is possible to issue a breakage determination signal indicating the occurrence of chipping failure in the rotating grindstone and a wear amount determination signal indicating the wear amount of the rotating grindstone,
Preparing a first rotating grindstone and a second rotating grindstone as the rotating grindstone;
In the step of preparing the detection mechanism, a first detection mechanism having a first light receiving area for the first rotating grindstone and a second light receiving area for the second rotating grindstone are provided. Preparing a second detection mechanism;
Obtaining a first image based on first incident light received by the first light receiving region using a part of a field of view of the conversion unit;
Using the remaining part of the field of view of the converter to obtain a second image based on the second incident light received by the second light receiving region;
Obtaining first image information by subjecting the first image to image processing;
Obtaining second image information by subjecting the second image to image processing;
Determining whether to issue a first determination signal for the first rotating grindstone based on the first image information;
And a step of determining whether or not to issue a second determination signal for the second rotating grindstone based on the second image information.

Images