JP5680979B2 - 固体撮像装置 - Google Patents
固体撮像装置 Download PDFInfo
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- JP5680979B2 JP5680979B2 JP2011010114A JP2011010114A JP5680979B2 JP 5680979 B2 JP5680979 B2 JP 5680979B2 JP 2011010114 A JP2011010114 A JP 2011010114A JP 2011010114 A JP2011010114 A JP 2011010114A JP 5680979 B2 JP5680979 B2 JP 5680979B2
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/191—Photoconductor image sensors
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/50—Control of the SSIS exposure
- H04N25/57—Control of the dynamic range
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
- H04N25/713—Transfer or readout registers; Split readout registers or multiple readout registers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
- H04N25/72—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors using frame transfer [FT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/15—Charge-coupled device [CCD] image sensors
- H10F39/152—One-dimensional array CCD image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
- H10F39/8033—Photosensitive area
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
- H10F39/8037—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Description
Claims (2)
- 光入射に応じて電荷を発生し且つ平面形状が二つの長辺と二つの短辺とによって形作られる略矩形状を成す光感応領域と、前記光感応領域に対して前記光感応領域の平面形状を成す長辺に平行な所定の方向に沿って高くされた電位勾配を形成する電位勾配形成領域と、をそれぞれ有すると共に、前記所定の方向に交差する方向に沿うように併置された複数の光電変換部と、
前記光電変換部にそれぞれ対応し且つ前記光感応領域の平面形状を成す他方の短辺側に配置され、対応する光電変換部の光感応領域で発生した電荷を蓄積する複数の電荷蓄積部と、
前記複数の電荷蓄積部からそれぞれ転送された電荷を取得し、前記所定の方向に交差する前記方向に転送して出力する電荷出力部と、を備え、
前記電荷蓄積部は、前記所定の方向に沿って配置されると共に前記所定の方向に向かってポテンシャルを高くするように所定の電位がそれぞれ与えられる少なくとも二つのゲート電極を有し、前記複数の電荷蓄積部において前記ポテンシャルの高低差が生じている状態で、前記複数の電荷蓄積部に電荷を蓄積し、前記複数の電荷蓄積部において前記ポテンシャルの高低差が生じている状態で、前記複数の電荷蓄積部から電荷を転送することを特徴とする固体撮像装置。 - 前記電荷蓄積部にそれぞれ対応し且つ各前記電荷蓄積部と前記電荷出力部との間に配置され、対応する前記電荷蓄積部に蓄積されている電荷を取得し、取得した電荷を前記電荷出力部へ転送する複数の転送部を更に備えていることを特徴とする請求項1に記載の固体撮像装置。
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011010114A JP5680979B2 (ja) | 2011-01-20 | 2011-01-20 | 固体撮像装置 |
| KR1020137018477A KR102018923B1 (ko) | 2011-01-20 | 2011-10-31 | 고체 촬상 장치 |
| US13/977,987 US9419051B2 (en) | 2011-01-20 | 2011-10-31 | Solid-state imaging device |
| KR1020187008803A KR20180036793A (ko) | 2011-01-20 | 2011-10-31 | 고체 촬상 장치 |
| CN201180065655.1A CN103329271B (zh) | 2011-01-20 | 2011-10-31 | 固体摄像装置 |
| PCT/JP2011/075098 WO2012098747A1 (ja) | 2011-01-20 | 2011-10-31 | 固体撮像装置 |
| EP11856354.3A EP2667410B1 (en) | 2011-01-20 | 2011-10-31 | Solid-state imaging device |
| TW100140987A TWI553845B (zh) | 2011-01-20 | 2011-11-09 | Solid-state imaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011010114A JP5680979B2 (ja) | 2011-01-20 | 2011-01-20 | 固体撮像装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012151364A JP2012151364A (ja) | 2012-08-09 |
| JP5680979B2 true JP5680979B2 (ja) | 2015-03-04 |
Family
ID=46515388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011010114A Active JP5680979B2 (ja) | 2011-01-20 | 2011-01-20 | 固体撮像装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9419051B2 (ja) |
| EP (1) | EP2667410B1 (ja) |
| JP (1) | JP5680979B2 (ja) |
| KR (2) | KR20180036793A (ja) |
| CN (1) | CN103329271B (ja) |
| TW (1) | TWI553845B (ja) |
| WO (1) | WO2012098747A1 (ja) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5452511B2 (ja) * | 2011-01-14 | 2014-03-26 | 浜松ホトニクス株式会社 | 固体撮像装置 |
| JP5680979B2 (ja) | 2011-01-20 | 2015-03-04 | 浜松ホトニクス株式会社 | 固体撮像装置 |
| JP6211898B2 (ja) | 2013-11-05 | 2017-10-11 | 浜松ホトニクス株式会社 | リニアイメージセンサ |
| JP6348272B2 (ja) | 2013-11-05 | 2018-06-27 | 浜松ホトニクス株式会社 | 電荷結合素子及びその製造方法、並びに固体撮像装置 |
| JP6739891B2 (ja) * | 2014-09-01 | 2020-08-12 | 浜松ホトニクス株式会社 | 固体撮像装置 |
| JP6306989B2 (ja) * | 2014-09-09 | 2018-04-04 | 浜松ホトニクス株式会社 | 裏面入射型固体撮像装置 |
| WO2019037104A1 (zh) * | 2017-08-25 | 2019-02-28 | 深圳市汇顶科技股份有限公司 | 一种可形成电位能梯度的感光元件 |
| FR3071103B1 (fr) * | 2017-09-11 | 2019-10-04 | Continental Automotive France | Pixel photosensible et capteur d'image associe |
| US12159892B2 (en) * | 2018-08-23 | 2024-12-03 | Tohoku University | Optical sensor and signal readout method thereof, optical area sensor and signal readout method thereof |
| JP6818075B2 (ja) * | 2019-04-08 | 2021-01-20 | 浜松ホトニクス株式会社 | 固体撮像装置 |
| KR102789680B1 (ko) | 2019-06-25 | 2025-04-01 | 에스케이하이닉스 주식회사 | 이미지 센서 |
| KR102709669B1 (ko) | 2019-07-01 | 2024-09-26 | 에스케이하이닉스 주식회사 | 픽셀 및 이를 포함하는 이미지 센서 |
| KR102668562B1 (ko) | 2019-07-24 | 2024-05-24 | 에스케이하이닉스 주식회사 | 메모리 시스템 및 그것의 동작 방법 |
| WO2021131397A1 (ja) * | 2019-12-26 | 2021-07-01 | 浜松ホトニクス株式会社 | 光検出装置、及び光センサの駆動方法 |
| JP7602346B2 (ja) * | 2020-10-14 | 2024-12-18 | 浜松ホトニクス株式会社 | 光センサ |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
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| GB1551935A (en) * | 1976-08-19 | 1979-09-05 | Philips Nv | Imaging devices |
| JPH0669089B2 (ja) * | 1983-10-15 | 1994-08-31 | 松下電子工業株式会社 | 電荷転送装置 |
| JP2738589B2 (ja) * | 1990-09-05 | 1998-04-08 | 三菱電機株式会社 | 固体撮像素子 |
| JPH04134862A (ja) | 1990-09-27 | 1992-05-08 | Hamamatsu Photonics Kk | 光電変換装置 |
| JPH05283666A (ja) | 1992-03-30 | 1993-10-29 | Sony Corp | 固体撮像素子 |
| JPH06140442A (ja) | 1992-10-29 | 1994-05-20 | Matsushita Electric Ind Co Ltd | 電荷転送装置 |
| JPH06236987A (ja) * | 1993-02-12 | 1994-08-23 | Matsushita Electron Corp | 固体撮像装置 |
| JPH07130989A (ja) | 1993-10-29 | 1995-05-19 | Matsushita Electric Ind Co Ltd | 電荷転送装置 |
| JP2871640B2 (ja) | 1996-12-18 | 1999-03-17 | 日本電気株式会社 | 固体撮像素子の駆動方法 |
| US5965910A (en) | 1997-04-29 | 1999-10-12 | Ohmeda Inc. | Large cell charge coupled device for spectroscopy |
| JP2001060681A (ja) | 1999-06-14 | 2001-03-06 | Nec Corp | 固体撮像装置およびその駆動方法 |
| US7005637B2 (en) | 2003-01-31 | 2006-02-28 | Intevac, Inc. | Backside thinning of image array devices |
| JP2005109313A (ja) | 2003-10-01 | 2005-04-21 | Matsushita Electric Ind Co Ltd | 抵抗値調整回路およびその調整方法 |
| JP4471677B2 (ja) | 2004-02-09 | 2010-06-02 | Necエレクトロニクス株式会社 | 固体撮像装置及び電荷転送部 |
| JP2005268564A (ja) | 2004-03-19 | 2005-09-29 | Ricoh Co Ltd | 固体撮像素子及び固体撮像素子の製造方法 |
| JP4725049B2 (ja) | 2004-07-29 | 2011-07-13 | ソニー株式会社 | 固体撮像装置およびその製造方法 |
| JP2007259417A (ja) | 2006-02-24 | 2007-10-04 | Sony Corp | 固体撮像素子および固体撮像素子の駆動方法および撮像装置 |
| US8334918B2 (en) | 2006-11-28 | 2012-12-18 | Hamamatsu Photonics K.K. | Solid-state imaging element |
| JP5350659B2 (ja) * | 2008-03-25 | 2013-11-27 | 浜松ホトニクス株式会社 | 固体撮像装置 |
| JP5134427B2 (ja) * | 2008-04-30 | 2013-01-30 | 浜松ホトニクス株式会社 | 固体撮像装置 |
| JP5535835B2 (ja) | 2010-02-09 | 2014-07-02 | ルネサスエレクトロニクス株式会社 | 固体撮像装置及びその駆動方法 |
| US8426902B2 (en) | 2010-07-30 | 2013-04-23 | Unisantis Electronics Singapore Pte Ltd. | Solid-state imaging device |
| JP5485919B2 (ja) * | 2011-01-14 | 2014-05-07 | 浜松ホトニクス株式会社 | 固体撮像装置 |
| JP5680979B2 (ja) | 2011-01-20 | 2015-03-04 | 浜松ホトニクス株式会社 | 固体撮像装置 |
-
2011
- 2011-01-20 JP JP2011010114A patent/JP5680979B2/ja active Active
- 2011-10-31 KR KR1020187008803A patent/KR20180036793A/ko not_active Ceased
- 2011-10-31 WO PCT/JP2011/075098 patent/WO2012098747A1/ja not_active Ceased
- 2011-10-31 CN CN201180065655.1A patent/CN103329271B/zh active Active
- 2011-10-31 KR KR1020137018477A patent/KR102018923B1/ko active Active
- 2011-10-31 US US13/977,987 patent/US9419051B2/en active Active
- 2011-10-31 EP EP11856354.3A patent/EP2667410B1/en active Active
- 2011-11-09 TW TW100140987A patent/TWI553845B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI553845B (zh) | 2016-10-11 |
| CN103329271A (zh) | 2013-09-25 |
| WO2012098747A1 (ja) | 2012-07-26 |
| KR20180036793A (ko) | 2018-04-09 |
| KR102018923B1 (ko) | 2019-09-05 |
| KR20140015292A (ko) | 2014-02-06 |
| TW201232771A (en) | 2012-08-01 |
| EP2667410A4 (en) | 2017-09-06 |
| US9419051B2 (en) | 2016-08-16 |
| EP2667410A1 (en) | 2013-11-27 |
| EP2667410B1 (en) | 2021-09-01 |
| JP2012151364A (ja) | 2012-08-09 |
| CN103329271B (zh) | 2016-09-21 |
| US20130270609A1 (en) | 2013-10-17 |
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