JP5648695B2 - 弾性波装置及びその製造方法 - Google Patents
弾性波装置及びその製造方法 Download PDFInfo
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- JP5648695B2 JP5648695B2 JP2012549722A JP2012549722A JP5648695B2 JP 5648695 B2 JP5648695 B2 JP 5648695B2 JP 2012549722 A JP2012549722 A JP 2012549722A JP 2012549722 A JP2012549722 A JP 2012549722A JP 5648695 B2 JP5648695 B2 JP 5648695B2
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02228—Guided bulk acoustic wave devices or Lamb wave devices having interdigital transducers situated in parallel planes on either side of a piezoelectric layer
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
- H10N30/8542—Alkali metal based oxides, e.g. lithium, sodium or potassium niobates
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
本発明の弾性波装置の製造方法は特に限定されないが、好ましくは以下の第2〜第4の実施形態の製造方法を好適に用いることができる。
2…支持基板
3…音響反射層
3a,3c,3e,3g…高音響インピーダンス層
3b,3d,3f,3h…低音響インピーダンス層
4…圧電体層
5…IDT電極
6,7…反射器
Claims (9)
- 支持基板と、
前記支持基板上に形成されている音響反射層と、
前記音響反射層上に形成されている圧電体層と、
前記圧電体層の上面または下面に形成されたIDT電極とを備え、
前記圧電体層の厚みが、前記IDT電極の電極指の周期よりも小さく、A 1 モード、S 0 モード又はSH 0 モードの板波を利用している弾性波装置であって、
前記音響反射層が、低音響インピーダンス層と、該低音響インピーダンス層よりも音響インピーダンスが高い高音響インピーダンス層とを有し、
前記低音響インピーダンス層がSiO2からなり、前記高音響インピーダンス層が、W、LiTaO3、Al2O3、AlN、LiNbO3、SiN及びZnOからなる群から選択された少なくとも一種の材料からなる、弾性波装置。 - 支持基板と、
前記支持基板上に形成されている音響反射層と、
前記音響反射層上に形成されている圧電体層と、
前記圧電体層の上面または下面に形成されたIDT電極とを備え、
前記圧電体層の厚みが、前記IDT電極の電極指の周期よりも小さく、A 1 モード又はS 0 モードの板波を利用している弾性波装置であって、
前記音響反射層が、低音響インピーダンス層と、該低音響インピーダンス層よりも音響インピーダンスが高い高音響インピーダンス層とを有し、
前記低音響インピーダンス層がSiO 2 からなり、前記高音響インピーダンス層が、W、LiTaO 3 、Al 2 O 3 、AlN、LiNbO 3 、SiN及びZnOからなる群から選択された少なくとも一種の材料からなる、請求項1に記載の弾性波装置。 - 前記高インピーダンス層が、LiTaO3、Al2O3、AlN、LiNbO3、SiN及びZnOからなる群から選択された少なくとも一種の材料からなる、請求項1又は2に記載の弾性波装置。
- 前記圧電体層が、LiTaO3、LiNbO3、ZnO、AlN及び水晶からなる群から選択された少なくとも一種の材料からなる、請求項1〜3のいずれか1項に記載の弾性波装置。
- 支持基板上に音響反射層を形成する工程と、
前記音響反射層上に圧電体層を積層する工程と、前記圧電体層上にIDT電極を形成する工程とを備える、請求項1〜5のいずれか一項に記載の弾性波装置の製造方法。 - 前記音響反射層上に前記圧電体層を形成する工程が、前記音響反射層上に、圧電体層を接合し、次に、該圧電体層を薄くして前記圧電体層を形成することにより行う、請求項6に記載の弾性波装置の製造方法。
- 前記圧電体層を前記音響反射層上に積層する工程が、前記音響反射層上に前記圧電体層を成膜することにより行われる、請求項6に記載の弾性波装置の製造方法。
- 前記圧電体層よりも厚い圧電体上に、前記音響反射層を形成する工程と、前記音響反射層の前記圧電体が積層されている側と反対側の面に前記支持基板を接合する工程と、
前記圧電体を薄くし、前記圧電体層を形成する工程と、前記圧電体層上にIDT電極を形成する工程とを備える、請求項1〜5のいずれか一項に記載の弾性波装置の製造方法。
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| JP2010287505 | 2010-12-24 | ||
| JP2010287505 | 2010-12-24 | ||
| JP2012549722A JP5648695B2 (ja) | 2010-12-24 | 2011-12-12 | 弾性波装置及びその製造方法 |
| PCT/JP2011/078696 WO2012086441A1 (ja) | 2010-12-24 | 2011-12-12 | 弾性波装置及びその製造方法 |
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| JPWO2012086441A1 JPWO2012086441A1 (ja) | 2014-05-22 |
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Cited By (2)
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| US12334900B2 (en) | 2020-02-28 | 2025-06-17 | Tohoku University | Acoustic wave device |
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| JP2006197554A (ja) * | 2004-12-17 | 2006-07-27 | Seiko Epson Corp | 弾性表面波デバイス及びその製造方法、icカード、携帯用電子機器 |
| FR2882205B1 (fr) * | 2005-02-16 | 2007-06-22 | Centre Nat Rech Scient | Dispositif a ondes acoustiques haute frequence |
| JP4613960B2 (ja) | 2005-10-19 | 2011-01-19 | 株式会社村田製作所 | ラム波デバイス |
| JP5137828B2 (ja) * | 2006-06-16 | 2013-02-06 | 株式会社村田製作所 | 弾性表面波装置 |
| CN101523720B (zh) * | 2006-10-12 | 2012-07-04 | 株式会社村田制作所 | 弹性边界波装置 |
| DE112008001500B8 (de) * | 2007-06-06 | 2016-06-16 | Murata Manufacturing Co., Ltd. | Oberflächenschallwellenvorrichtung |
| CN101689841A (zh) * | 2007-12-25 | 2010-03-31 | 株式会社村田制作所 | 复合压电基板的制造方法 |
| JP4553047B2 (ja) * | 2008-03-12 | 2010-09-29 | セイコーエプソン株式会社 | ラム波型共振子及び発振器 |
| KR20110133037A (ko) * | 2009-02-27 | 2011-12-09 | 세이코 엡슨 가부시키가이샤 | 탄성 표면파 공진자, 탄성 표면파 발진기, 및 전자 기기 |
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2011
- 2011-12-12 JP JP2012549722A patent/JP5648695B2/ja active Active
- 2011-12-12 WO PCT/JP2011/078696 patent/WO2012086441A1/ja not_active Ceased
- 2011-12-12 CN CN201180062385.9A patent/CN103283147B/zh active Active
- 2011-12-12 EP EP11850373.9A patent/EP2658122B1/en active Active
-
2013
- 2013-06-18 US US13/920,344 patent/US9780759B2/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180041738A (ko) * | 2015-10-23 | 2018-04-24 | 가부시키가이샤 무라타 세이사쿠쇼 | 탄성파 장치 |
| CN108028636A (zh) * | 2015-10-23 | 2018-05-11 | 株式会社村田制作所 | 弹性波装置 |
| KR102111928B1 (ko) * | 2015-10-23 | 2020-05-18 | 가부시키가이샤 무라타 세이사쿠쇼 | 탄성파 장치 |
| US12334900B2 (en) | 2020-02-28 | 2025-06-17 | Tohoku University | Acoustic wave device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103283147B (zh) | 2016-09-21 |
| EP2658122A1 (en) | 2013-10-30 |
| WO2012086441A1 (ja) | 2012-06-28 |
| EP2658122B1 (en) | 2019-02-13 |
| JPWO2012086441A1 (ja) | 2014-05-22 |
| US9780759B2 (en) | 2017-10-03 |
| EP2658122A4 (en) | 2014-07-30 |
| US20140152146A1 (en) | 2014-06-05 |
| CN103283147A (zh) | 2013-09-04 |
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