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JP5530571B1 - 絶縁性粒子付き導電性粒子、導電材料及び接続構造体 - Google Patents

絶縁性粒子付き導電性粒子、導電材料及び接続構造体 Download PDF

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Publication number
JP5530571B1
JP5530571B1 JP2013555500A JP2013555500A JP5530571B1 JP 5530571 B1 JP5530571 B1 JP 5530571B1 JP 2013555500 A JP2013555500 A JP 2013555500A JP 2013555500 A JP2013555500 A JP 2013555500A JP 5530571 B1 JP5530571 B1 JP 5530571B1
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Prior art keywords
particles
conductive
insulating
insulating particles
conductive particles
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Japanese (ja)
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JPWO2014084173A1 (ja
Inventor
茂雄 真原
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2013555500A 2012-11-28 2013-11-25 絶縁性粒子付き導電性粒子、導電材料及び接続構造体 Active JP5530571B1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013555500A JP5530571B1 (ja) 2012-11-28 2013-11-25 絶縁性粒子付き導電性粒子、導電材料及び接続構造体

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012259824 2012-11-28
JP2012259824 2012-11-28
PCT/JP2013/081661 WO2014084173A1 (fr) 2012-11-28 2013-11-25 Particule conductrice avec particules isolantes, matériau conducteur et structure de connexion
JP2013555500A JP5530571B1 (ja) 2012-11-28 2013-11-25 絶縁性粒子付き導電性粒子、導電材料及び接続構造体

Publications (2)

Publication Number Publication Date
JP5530571B1 true JP5530571B1 (ja) 2014-06-25
JPWO2014084173A1 JPWO2014084173A1 (ja) 2017-01-05

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Family Applications (1)

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JP2013555500A Active JP5530571B1 (ja) 2012-11-28 2013-11-25 絶縁性粒子付き導電性粒子、導電材料及び接続構造体

Country Status (5)

Country Link
JP (1) JP5530571B1 (fr)
KR (1) KR102095291B1 (fr)
CN (1) CN104584141B (fr)
TW (1) TWI598889B (fr)
WO (1) WO2014084173A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017051842A1 (fr) * 2015-09-24 2017-03-30 積水化学工業株式会社 Particules conductrices, matériau conducteur, et structure de connexion
KR102431084B1 (ko) 2014-12-04 2022-08-11 세키스이가가쿠 고교가부시키가이샤 도전 페이스트, 접속 구조체 및 접속 구조체의 제조 방법

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102529562B1 (ko) * 2015-05-20 2023-05-09 세키스이가가쿠 고교가부시키가이샤 도전성 점착재 및 도전성 기재 부착 도전성 점착재
KR20180029945A (ko) * 2015-07-14 2018-03-21 세키스이가가쿠 고교가부시키가이샤 도전 재료 및 접속 구조체
CN111971757B (zh) * 2018-04-04 2023-03-14 积水化学工业株式会社 导电性粒子、其制造方法、导电材料及连接结构体

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06349339A (ja) * 1993-06-03 1994-12-22 Sony Chem Corp 異方性導電膜
JP2005197089A (ja) * 2004-01-07 2005-07-21 Hitachi Chem Co Ltd 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
JP2007016088A (ja) * 2005-07-06 2007-01-25 Asahi Kasei Electronics Co Ltd 異方導電性接着シート及び微細接続構造体
JP2009231292A (ja) * 2009-05-08 2009-10-08 Hitachi Chem Co Ltd 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
JP2009238753A (ja) * 2009-05-08 2009-10-15 Hitachi Chem Co Ltd フィルム状回路接続材料、回路部材の接続構造及びその製造方法
JP2011105861A (ja) * 2009-11-18 2011-06-02 Hitachi Chem Co Ltd 回路接続材料及び接続構造体
JP2011198773A (ja) * 2011-06-28 2011-10-06 Sony Chemical & Information Device Corp 異方性導電フィルム、接続方法、及び接合体
WO2012137335A1 (fr) * 2011-04-07 2012-10-11 日立化成工業株式会社 Matériau de connexion de circuit et son utilisation, et structure de connexion et son procédé de production

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100437838C (zh) * 2003-07-07 2008-11-26 积水化学工业株式会社 包覆导电性粒子、各向异性导电材料以及导电连接结构体
US20100025089A1 (en) * 2004-01-07 2010-02-04 Jun Taketatsu Circuit connection material, film-shaped circuit connection material using the same, circuit member connection structure, and manufacturing method thereof
KR101538820B1 (ko) * 2008-03-21 2015-07-22 세키스이가가쿠 고교가부시키가이샤 경화성 조성물, 이방성 도전 재료 및 접속 구조체
JP4993230B2 (ja) * 2009-09-08 2012-08-08 積水化学工業株式会社 絶縁粒子付き導電性粒子、絶縁粒子付き導電性粒子の製造方法、異方性導電材料及び接続構造体

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06349339A (ja) * 1993-06-03 1994-12-22 Sony Chem Corp 異方性導電膜
JP2005197089A (ja) * 2004-01-07 2005-07-21 Hitachi Chem Co Ltd 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
JP2007016088A (ja) * 2005-07-06 2007-01-25 Asahi Kasei Electronics Co Ltd 異方導電性接着シート及び微細接続構造体
JP2009231292A (ja) * 2009-05-08 2009-10-08 Hitachi Chem Co Ltd 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
JP2009238753A (ja) * 2009-05-08 2009-10-15 Hitachi Chem Co Ltd フィルム状回路接続材料、回路部材の接続構造及びその製造方法
JP2011105861A (ja) * 2009-11-18 2011-06-02 Hitachi Chem Co Ltd 回路接続材料及び接続構造体
WO2012137335A1 (fr) * 2011-04-07 2012-10-11 日立化成工業株式会社 Matériau de connexion de circuit et son utilisation, et structure de connexion et son procédé de production
JP2011198773A (ja) * 2011-06-28 2011-10-06 Sony Chemical & Information Device Corp 異方性導電フィルム、接続方法、及び接合体

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102431084B1 (ko) 2014-12-04 2022-08-11 세키스이가가쿠 고교가부시키가이샤 도전 페이스트, 접속 구조체 및 접속 구조체의 제조 방법
WO2017051842A1 (fr) * 2015-09-24 2017-03-30 積水化学工業株式会社 Particules conductrices, matériau conducteur, et structure de connexion
JPWO2017051842A1 (ja) * 2015-09-24 2018-07-12 積水化学工業株式会社 導電性粒子、導電材料、および接続構造体

Also Published As

Publication number Publication date
TWI598889B (zh) 2017-09-11
KR20150090018A (ko) 2015-08-05
CN104584141B (zh) 2017-04-12
TW201423766A (zh) 2014-06-16
KR102095291B1 (ko) 2020-03-31
WO2014084173A1 (fr) 2014-06-05
CN104584141A (zh) 2015-04-29
JPWO2014084173A1 (ja) 2017-01-05

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