JP5468381B2 - Sheet peeling apparatus and peeling method - Google Patents

Description

  The present invention relates to a sheet peeling apparatus and a peeling method, and more specifically, a peeling tape is affixed to an adhesive sheet affixed to an adherend such as a semiconductor wafer, and the adhesive sheet is peeled off via the peeling tape. The present invention relates to a sheet peeling apparatus and a peeling method that can be used.

  In the process of processing a semiconductor wafer (hereinafter sometimes simply referred to as “wafer”), the wafer is subjected to various processes such as backside grinding after a protective adhesive sheet is applied to its circuit surface, before dicing. The adhesive sheet is peeled off. An example of such an adhesive sheet peeling apparatus is disclosed in Patent Document 1. In this Patent Document 1, after affixing a peeling tape to an adhesive sheet with an affixing roller, the adhesive sheet is folded back and peeled while pressing the adhesive sheet region just before peeling at the tip of the edge member toward the wafer side. By forming an edge and relatively moving the edge member and the wafer, the adhesive sheet is peeled from the wafer.

JP 2002-124494 A

However, in the sheet peeling apparatus described in Patent Document 1, when the edge width of the edge member is narrower than the width of the wafer, a wafer portion that cannot be pressed downward by the edge member is formed, and this wafer portion is bonded. Since the edge member is lifted and damaged, the edge member must have a width equal to or larger than the diameter of the circular adhesive sheet (the diameter of the circular wafer). Therefore, in order to provide versatility that enables the adhesive sheet to be peeled for each wafer having a different diameter, there is a restriction that an edge member having a width that can correspond to the largest wafer diameter is required.
As shown in FIG. 4A, when the adhesive sheet S is peeled from the wafer W integrated with the ring frame RF via the mounting tape T, the wafer W is usually larger than the thickness of the ring frame RF. Since it is thinly ground, the upper surface position of the adhesive sheet S is lower than the upper surface position of the ring frame RF. Accordingly, when peeling is performed from the point A to the point B in FIG. 4A using the edge member P1 having the width D1 equal to or larger than the diameter D of the wafer W, the peeling start region near the point A or the point B In the adjacent peeling end region, the tip of the edge member P1 rides on the ring frame RF, and a gap G is generated between the tip of the edge member P1 and the adhesive sheet S as shown in FIG. It will be. For this reason, the adhesive sheet S cannot be folded and peeled while pressing the adhesive sheet S region just before being peeled off at the tip of the edge member P1 toward the wafer W, and the wafer W is lifted together with the adhesive sheet S and damaged. Resulting in. Here, when the same peeling as described above is performed using the edge member P2 having the width D2 that can enter the inside of the ring frame RF, the edge of the edge member P2 is pressed as the peeling of the adhesive sheet S proceeds. An undesired wafer W portion and an adhesive sheet S portion (region D3) appear, and the wafer W portion in the region D3 is lifted together with the adhesive sheet S and is damaged.

[Object of invention]
An object of the present invention is to provide a sheet peeling apparatus capable of peeling the adhesive sheet by reliably performing pressing corresponding to the width change even if the width of the adhesive sheet region immediately before peeling from the adherend changes. It is to provide a peeling method.

  In order to achieve the above object, the present invention provides a feeding means for feeding out the peeling tape in a sheet peeling apparatus for peeling an adhesive sheet attached to an adherend from the adherend via a peeling tape; Pressing means for pressing and adhering the peeling tape fed from the feeding means to the adhesive sheet, and tension for peeling the adhesive sheet from the adherend by applying tension to the peeling tape stuck to the adhesive sheet An application means, and a tip capable of forming a release edge by pressing the adhesive sheet region immediately before being peeled off from the adherend by the tension applying means toward the adherend side and folding back the adhesive sheet; It is configured to include a peeling posture forming means provided so that the width of the tip forming the edge can be changed.

  Furthermore, the present invention relates to a sheet peeling method for peeling an adhesive sheet affixed to an adherend from the adherend via a peeling tape, and a step of feeding the peeling tape, A step of pressing and adhering the tape to the adhesive sheet, a step of peeling the adhesive sheet from the adherend by applying tension to the peeling tape affixed to the adhesive sheet, and peeling from the adherend A step of forming a peeling edge by pressing the immediately preceding adhesive sheet region toward the adherend side with the tip of the peeling posture forming means and folding back the adhesive sheet; and changing the tip width of the peeling posture forming means to change the adhesion And a step of peeling the adhesive sheet from the body.

According to the present invention, since the tip width of the peeling posture forming means can be changed, the restriction that an edge member having a width corresponding to the size of the largest adherend must be adopted is eliminated. it is Ru can.
In particular , when a wafer integrated with a ring frame is targeted and applied to a configuration in which the adhesive sheet is peeled off from the wafer, even if the upper surface of the adhesive sheet is lower than the upper surface of the ring frame, the ring There is no inconvenience that the tip of the plate member rides on the upper surface of the frame. That is, the tip end of the plate member is gradually enlarged from the peeling start area until passing through the center of the adhesive sheet, and gradually reduced from the position past the center to the peeling end area. While pressing the adhesive sheet area just before peeling to the wafer side, the adhesive sheet can be folded back to form a peeling edge, and the adhesive sheet can be peeled from the wafer, reliably preventing damage and cracking of the wafer can do.

The schematic front view of the sheet peeling apparatus which concerns on embodiment. The principal part schematic perspective view of a sheet peeling apparatus. (A), (B) is a schematic perspective view which shows a modification. (A) is a top view which shows a malfunction example, (B) is A arrow sectional drawing of (A).

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  1 and 2, a sheet peeling apparatus 10 includes a table 12 that sucks and holds a wafer W as an adherend, a feeding means 13 that feeds a strip-like peeling tape PT to the upper surface side of the wafer W, and a wafer W. A pressing means 14 for pressing and adhering the peeling tape PT to the affixed adhesive sheet S, and tension application for separating the adhesive sheet S from the wafer W by applying tension to the affixing tape PT affixed to the adhesive sheet S A means 15, a peeling posture forming means 16 for guiding the peeling tape PT fed from the feeding means 13 and guiding the peeling tape PT toward the tension applying means 15, and a drive for moving the peeling posture forming means 16 And means 17. The feeding means 13, the tension applying means 15, the peeling posture forming means 16 and the driving means 17 are disposed so as to be positioned above the table 12 supported and conveyed by the frame F.

  The table 12 has an adhesive sheet S attached to one surface (upper surface in FIG. 1), and a wafer W integrated with the ring frame RF from the other surface (lower surface in FIG. 1) via a mounting tape T. 1 is provided so as to be capable of being sucked and held from the mounting tape T side, and is provided so as to be movable in the left-right direction in FIG. Here, the upper surface position of the adhesive sheet S is lower than the upper surface position of the ring frame RF when supported by the table 12.

  The feeding means 13 supports the peeling tape PT wound in a roll shape, and supports a support roller 20 that can be rotated by a motor M1, a drive roller 21 that is rotated by a motor M2, and a drive roller 21. And a pinch roller 22 for sandwiching the peeling tape PT. Note that the surface of the pinch roller 22 is coated with a fluororesin or the like so that the peeling tape PT does not adhere to the surface of the pinch roller 22 and is subjected to non-adhesion treatment.

  The pressing means 14 is constituted by a linear motion motor 23, and a frame F is supported on a slider 23 </ b> A of the linear motion motor 23. With such a configuration, the slider 23A is driven in the vertical direction in FIG. 1 so that the peeling tape PT is stuck to the adhesive sheet S stuck on the wafer W by pressing the peeling posture forming means 16. In consideration of the thickness of the wafer W, the adhesive sheet S, the mounting tape T, etc., the distance between the upper surface of the table 12 in FIG. 1 and the peeling posture forming means 16 is adjusted, or the peeling posture forming means 16 is It is possible to adjust the pressing force for pressing the adhesive sheet S or the like.

  The tension applying means 15 includes a driving roller 34 that rotates via a motor M3, a pinch roller 35 that sandwiches a peeling tape PT between the driving roller 34, and a motor M4 that rotates the peeling tape PT and the peeling tape PT. And a take-up roller 37 for winding the adhesive sheet S. Note that the surface of the drive roller 34 is subjected to non-adhesion processing. The tension applying means 15 is capable of peeling the adhesive sheet S from the wafer W by applying tension to the peeling tape PT by synchronously driving the table 12 with the single-axis robot 18 that moves leftward in FIG. Yes.

  The peeling posture forming means 16 is constituted by a plate member 24 composed of a first plate member 25 and a second plate member 26 capable of pressing the peeling tape PT toward the adhesive sheet S, and the peeling posture forming means 16 is fed from the feeding means 13. The tape PT is wound around so as to be folded back from the lower surface side of the plate member 24 to the upper surface side. As a result, the front end 24A (left end in FIG. 1) of the plate member 24 presses the adhesive sheet S area immediately before being peeled from the wafer W by the tension applying means 15 to the wafer W side, thereby folding the adhesive sheet S back. The peeling edge PE from which the adhesive sheet S is peeled from the wafer W can be formed. The first plate member 25 includes an upper surface 25A, an inclined surface 25B connected to the left side of the upper surface 25A in FIG. 1, a back inclined surface 25C that forms a part of the tip 24A with the inclined surface 25B, and a back inclined surface. And a lower surface 25D connected to the surface 25C. Further, the second plate member 26 includes an upper surface 26A set to be equal to the width of the first plate member 25 in the direction orthogonal to the paper surface in FIG. 1, and an inclined surface 26B continuously provided on the left side in FIG. The inclined surface 26B includes a lower surface 26C that forms a part of the tip 24A.

  The driving means 17 is composed of first and second linear motors 17A and 17B supported at one end by a frame F, and a first plate member 25 is attached to the slider 30 of the first linear motor 17A. A second plate member 26 is attached to the slider 31 of the linear motor 17B. Accordingly, the back inclined surface 25C and the lower surface 25D of the first plate member 25 can be relatively moved in the direction perpendicular to the paper surface in FIG. 1 so that the upper surface 26A slides above the inclined surface 26B and the upper surface 26A of the second plate member 26. The width of the tip 24A of the plate member 24 can be changed. A part of the tip 24A formed by the first plate member 25 and a part of the tip 24A formed by the second plate member 26 can be positioned on the same straight line in a plane parallel to the surface of the adhesive sheet S. ing.

  Next, the peeling method of the adhesive sheet S by the sheet peeling apparatus 10 will be described.

  As indicated by a two-dot chain line in FIG. 1, the wafer W integrated with the ring frame RF via the mounting tape T is placed at a predetermined position on the table 12 by a conveying means (not shown). When it is confirmed that the wafer 12 is attracted and held by the table 12, the table 12 is relatively moved in the direction of arrow A in FIG. When the sensor (not shown) detects that the wafer W has reached a predetermined position below the plate member 24, the driving of the single-axis robot 18 is stopped. Thereafter, the frame F is lowered by the operation of the linear motion motor 23, and the peeling tape PT is pressed and stuck to the left end of the adhesive sheet S with the tip 24A of the plate member 24 as shown by a two-dot chain line in FIG. . At this time, the first and second plate members 25 and 26 are actuated by the driving means 17 so that the tip 24A does not ride on the upper surface of the ring frame RF, as indicated by a two-dot chain line in FIG. The tip width of the tip 24A of the member 24 is adjusted.

  Thereafter, the motors M1, M2, and M4 are operated in synchronism with the rotation of the drive roller 34 by the motor M3, and the peeling tape PT is fed out from the support roller 20 toward the take-up roller 37, and the single-axis robot 18 Are also driven synchronously to move the table 12 relatively in the direction of arrow A in FIG. As a result, the adhesive sheet S region immediately before being peeled from the wafer W is pressed against the wafer W by the tip 24A of the plate member 24, and the adhesive sheet S is folded back to form the peeling edge PE. It can be peeled from the wafer W. Here, the width of the peeling edge PE of the adhesive sheet S is narrow in the peeling start region, but the width increases as the peeling progresses, and becomes narrower toward the peeling end region with the center position of the wafer W being maximized. . Therefore, the first and second plate members 25 and 26 are moved relative to each other in the direction of the arrow AR in FIG. And is controlled in a predetermined manner so that the width of the tip 24A does not become narrower than the width of the peeling edge PE and does not ride on the upper surface of the ring frame RF. .

  Therefore, according to such an embodiment, the first and second plate members 25 and 26 are not buffered on the ring frame RF and are not buffered in the entire region from the separation start region to the separation end region. The adhesive sheet S can be folded back and peeled from the wafer W while the adhesive sheet S area immediately before being peeled from the wafer W is always pressed toward the wafer W, and the wafer W is lifted together with the adhesive sheet S. Can be reliably prevented, and damage and cracking of the wafer W can be prevented.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.
Therefore, the description limited to the shape disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded one part or all part is included in this invention.

  For example, the plate member 24 is composed of two members including the first and second plate members 25 and 26, but may be three or more members. Furthermore, the first and second plate members 25 and 26 do not have to have the same width. For example, design changes such as providing the second plate member 26 with a small width are not hindered.

  In the above-described embodiment, the configuration in which the adhesive sheet S is peeled from the wafer W integrated with the ring frame RF is shown and described. However, the adhesive sheet S from the wafer W as a single unit not integrated with the ring frame RF is illustrated. Of course, it is also possible to peel off. In this case, even if the sizes of the wafer W and the adhesive sheet S are various, it is sufficient to adjust the width of the front end 24A of the plate member 24 in accordance with the width of the peeling edge PE. The restriction that an edge member having a width that can correspond to the diameter of the wafer W must be employed can be eliminated.

  Furthermore, the adherend in the present invention is not limited to a semiconductor wafer, and other adherends such as a glass plate, a steel plate, or a resin plate can also be targeted. It may be a wafer or a compound wafer.

  Further, a single-axis robot similar to the single-axis robot 18 is provided on the frame F side, the table 12 is stopped, and the frame F is moved in synchronization with the operation of the drive roller 34 being rotated by the motor M3. S may be peeled off, or a single-axis robot may be provided on both the frame F and the table 12, and the adhesive sheet S may be peeled off in synchronization with the rotation of the driving roller 34.

Furthermore, the peeling tape PT may be a heat-sensitive adhesive tape or a pressure-sensitive adhesive tape. Further, as the peeling tape PT, a single-wafer type peeling tape PT having a predetermined length as disclosed in JP-A-11-16862 can be used in addition to the belt-like one as in the above embodiment. In this case, the pressing means includes a heater up / down cylinder (509), a heater block (501), a heater (503), and a heater tool (505), and the tension applying means is a peeling head portion (400). Composed. The numbers in parentheses are the numbers given in JP-A-11-16862.
Furthermore, in the above embodiment, the case where the adhesive sheet S having the same shape as the wafer W is peeled is illustrated. However, as shown in FIG. 3A, the adherend W1 has a larger area than the adherend W1. Adhesive sheet S1 having a large adhesive area, or adhesive sheet S2 having a smaller planar area than adherend W2, as shown in FIG. 3 (B). S2 can also be peeled off, and is not limited to the size or shape of the adherend or adhesive sheet. For example, in the case of FIG. 3 (A), it is sufficient that the width of the tip 24A of the plate member 24 is wider than at least the maximum width D4 of the adherend W1, which is the maximum width of the peeling edge PE. In the case of B), it is sufficient that the width of the tip 24A of the plate member 24 is wider than at least the maximum width D5 of the adhesive sheet S2, which is the maximum width of the peeling edge PE.
Further, the pressing force for pressing the peeling tape against the adhesive sheet by the plate member 24 controls the linear motion motor 23 constituting the pressing means 14 in a predetermined manner, taking into consideration the hardness of the adherend and the properties of the peeling tape. Can be set as appropriate. In particular, when the adherend is brittle, the plate member 24 is pressed against the adhesive sheet S by the operation of the linear motor 23 after the peeling tape PT is pressed against the left end of the adhesive sheet S with the tip 24A of the plate member 24. It is good to control so that adhesive sheet S may be peeled from a to-be-adhered body like the said embodiment, adjusting to the grade whether a pressure is applied.
Further, like the above-mentioned Patent Document 1, the pressing means is composed of a sticking roller, and after the peeling tape is stuck across the radial direction of the adhesive sheet, the adhesive sheet is pressed against the adherend side as in the above embodiment. However, the adhesive sheet may be folded back and peeled off from the adherend.

DESCRIPTION OF SYMBOLS 10 Sheet peeling apparatus 13 Feeding means 14 Pressing means 15 Tension providing means 16 Peeling attitude forming means 17 Driving means 24 Plate member 24A Tip PT Stripping tape S Adhesive sheet W Semiconductor wafer (Substrate)
PE peeling edge

Claims (2)

In the sheet peeling apparatus for peeling the adhesive sheet affixed to the adherend from the adherend via the peeling tape,
A feeding means for feeding out the peeling tape;
A pressing means for pressing and attaching the peeling tape fed from the feeding means to the adhesive sheet;
Tension applying means for peeling the adhesive sheet from the adherend by applying tension to the peeling tape affixed to the adhesive sheet;
An adhesive sheet region immediately before being peeled off from the adherend by the tension applying means is pressed toward the adherend side and folded back to form the peel edge, thereby forming the peel edge A sheet peeling apparatus comprising: a peeling posture forming means provided so that the width of the tip can be changed. In the sheet peeling method of peeling the adhesive sheet affixed to the adherend from the adherend via the peeling tape,
A step of feeding out the peeling tape;
A process of pressing and sticking the drawn-off peeling tape to the adhesive sheet;
Peeling the adhesive sheet from the adherend by applying tension to the peeling tape attached to the adhesive sheet; and
A step of forming a peeling edge by pressing the adhesive sheet region just before being peeled off from the adherend to the adherend side at the tip of the peeling posture forming means and folding the adhesive sheet;
And a step of peeling the adhesive sheet from the adherend by changing the width of the tip of the peeling posture forming means.

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