JP2008282989A - Sheet peeling apparatus and peeling method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sheet peeling device and peeling method for preventing the smooth peeling of an adhesive sheet and the damage of a wafer. <P>SOLUTION: An adhesive sheet S is adhered to the surface of a semiconductor wafer W. The semiconductor wafer W is supported on supporting means 11. A peeling tape T is applied onto the periphery portion of the adhesive sheet S. One end side of the peeling tape T is held on a peeling head 15. Peeling auxiliary means 15 is positioned on the adhesive sheet S. A folding edge B of the adhesive sheet S is formed via the peeling auxiliary means 15. When the adhesive sheet S is peeled, the sheet is peeled by allowing an endless member 45 hung around a guide plate 42 and first and second axes 43 and 44 to rotationally move on the adhesive sheet S. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a sheet peeling apparatus and a peeling method, and in particular, when peeling an adhesive sheet or the like affixed to an adherend such as a semiconductor wafer, it provides a peeling force while preventing damage to the adherend. The present invention relates to a sheet peeling apparatus and a peeling method.

  Conventionally, an adhesive sheet for protecting the circuit surface is attached to a semiconductor wafer (hereinafter simply referred to as “wafer”). This adhesive sheet is peeled off via a sheet peeling device after, for example, back grinding of the wafer.

  The above-described peeling of the adhesive sheet can be performed using, for example, a sheet peeling apparatus disclosed in Patent Document 1. The apparatus attaches a peeling tape to an adhesive sheet affixed to a wafer, and when pulling the peeling tape, presses an edge member formed at an acute angle on the adhesive sheet while pulling the peeling tape. The edge member and the wafer are relatively moved.

JP 2002-124494 A

However, in the sheet peeling method using the peeling apparatus disclosed in Patent Document 1, the edge member is pressed against the adhesive sheet in order to prevent the wafer from lifting or to keep the peeling angle constant. As a result, the adhesive sheet is tightly sandwiched between the wafer and the edge member, and the peeling resistance increases. As a result, the peeling tape or adhesive sheet is cut off during the peeling of the adhesive sheet, resulting in poor peeling. There is a disadvantage that occurs.
In addition, when an adhesive sheet is applied to a wafer having a bump or other protrusion that constitutes a conductive electrode on the circuit surface of the wafer and the adhesive sheet is peeled off, the edge height position of the edge member is set to the upper end of the bump. It must be set to match. In this case, the wafer cannot be lifted at a position where there is no bump in the peeling process of the adhesive sheet, and this causes a disadvantage that the wafer is damaged.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and the object thereof is to prevent the wafer from being lifted without increasing the peeling resistance of the adhesive sheet using the peeling assisting means. It is an object of the present invention to provide a sheet peeling apparatus and a peeling method capable of preventing smooth peeling and wafer damage.

In order to achieve the above object, the present invention comprises a supporting means for supporting an adherend to which an adhesive sheet is affixed, a tape affixing means for affixing a peeling tape to the adhesive sheet, and holding the peeling tape. In a sheet peeling apparatus comprising a pulling means for pulling the peeling tape, and a peeling auxiliary means that is positioned between the support means and the pulling means to form a bending edge of the adhesive sheet.
The peeling assisting unit includes a guide member located on the adhesive sheet, and an endless member that is provided on the outer peripheral side of the guide member and rotates following the peeling operation of the adhesive sheet. Adopted.

  In the present invention, the endless member can be constituted by an elastic member.

  Further, the guide member is disposed in a direction substantially parallel to the guide plate longer than the maximum width orthogonal to the peeling direction of the adhesive sheet, and has a maximum width orthogonal to the peeling direction of the adhesive sheet. It can be configured by a long shaft, and the endless member can be wound around the guide plate and the shaft.

  Further, the guide member is disposed in a direction substantially parallel to the guide roller longer than the maximum width orthogonal to the peeling direction of the adhesive sheet, and from the maximum width orthogonal to the peeling direction of the adhesive sheet. A configuration in which the endless member is wound around the guide roller and the shaft may be adopted.

  The peeling assisting unit may further include a peeling angle adjusting unit.

  The endless member may be arranged in a plurality of rows at predetermined intervals along a direction orthogonal to the peeling direction of the adhesive sheet.

  Furthermore, it is possible to further include a lift prevention means for preventing the adherend from lifting due to the peeling of the adhesive sheet.

  Further, the floating prevention means may be constituted by a gas spraying device that blows gas onto the surface of the adherend.

Furthermore, the present invention provides a sheet peeling method in which a peeling tape is affixed to an adhesive sheet affixed to an adherend, and the adhesive sheet is peeled from the adherend by pulling the peeling tape in a predetermined peeling direction. ,
An endless member is brought into contact with the adhesive sheet,
A method is employed in which a bent edge of the adhesive sheet is formed through the endless member, and the endless member is rotated so as to follow the peeling operation of the adhesive sheet to peel the adhesive sheet.

  In the sheet peeling method, a method of adjusting a peeling angle of the adhesive sheet by changing a turning locus of the endless member may be adopted.

According to the present invention, the guide member located on the adhesive sheet and the endless member provided on the outer peripheral side of the guide member constitute the peeling assisting means, and the endless member follows the peeling operation of the adhesive sheet and rotates. Since the adhesive sheet is configured so that the adhesive sheet is tightly sandwiched between the peeling auxiliary means and the adherend, the wafer is prevented from being lifted without increasing the peeling resistance of the adhesive sheet, and bonded. Smooth peeling of the sheet can be performed. Thereby, it is possible to prevent the adhesive sheet from being peeled off, and to prevent the wafer from being damaged even if the adherend is brittle like a wafer. Further, when the endless member is made of an elastic member, the endless member is displaced so as to follow the surface shape of the adherend to which the adhesive sheet is attached. Even in the case of a wafer where there is no bump, the adhesive sheet can be peeled while reliably preventing the wafer from being lifted.
In addition, by adopting a configuration in which the endless member is wound around the guide member constituted by the guide plate and the shaft, it becomes possible to suppress meandering of the endless member, to set the tension, to cope with elongation with time, and the like. By using the shaft as a rotating shaft, the endless member can be smoothly rotated, and an increase in peeling resistance can be prevented.
Further, in the configuration in which the endless member is wound around the guide roller and the shaft, the endless member can be smoothly rotated, and an increase in peeling resistance can be prevented.
Further, according to the configuration in which the peeling angle adjusting means is provided in the peeling assisting means, when the surface of the adherend to which the adhesive sheet is stuck is uneven, for example, the adhesive sheet is attached to the wafer having the bumps described above. When the affixed object is an object to be peeled off, the adhesive sheet can be peeled off by setting an angle at which the adhesive of the adhesive sheet does not remain around each bump, for example, a peeling angle of 90 degrees.
Furthermore, according to the configuration in which the endless member is arranged at a predetermined interval along the direction orthogonal to the peeling direction of the adhesive sheet, the contact area between the guide member and the endless member is reduced, and the endless member is turned Resistance can be reduced and an increase in peeling resistance can be prevented.
Further, in the configuration provided with the lifting prevention means for maintaining the position of the adherend from which the adhesive sheet has been peeled off, the adherend is lifted by being pulled by the adhesive sheet in the region where the pressing by the endless member is released. It is possible to prevent the wafer from being damaged.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 shows a schematic front view of a sheet peeling apparatus according to this embodiment, and FIG. 2 shows a schematic perspective view during a peeling operation using the sheet peeling apparatus. In these drawings, a sheet peeling apparatus 10 supports a wafer W as an adherend having an adhesive sheet S affixed to the upper surface (circuit surface), and the support means 11 is movable. As a pulling means for attaching the peeling tape T (see FIG. 2) to the outer peripheral portion of the adhesive sheet S and pulling the peeling tape T in the direction of peeling the adhesive sheet S from the wafer W. Between the peeling head 13, a tape supply unit 14 constituting a tape applying means for feeding the peeling tape T every predetermined length and bonding a part thereof to the adhesive sheet S, and between the support means 11 and the peeling head 13. And a peeling assisting means 15 for forming the bending edge B of the adhesive sheet S.

  The support means 11 is not particularly limited, but is arranged between the lower table 17 and the upper table 18 that are square in plan view, and between the lower table 17 and the upper table 18, and the upper table. A drive device 19 that allows the 18 to rotate and move up and down and a slider 20 provided on the lower surface side of the lower table 17 are included. Here, the upper table 18 has an upper surface formed as a suction surface (not shown) so that the wafer W can be sucked and held. This suction holding force is controlled to a weak suction force that can maintain the planar shape of a wafer that has been ground to a thickness of several tens of μm and that is not deformed by suction. The

  The moving means 12 includes a pair of guide rails 22, a feed screw shaft 23 extending in parallel with the guide rails 22 between the guide rails 22, and the feed screw shaft 23 positioned on one end side of the feed screw shaft 23. It comprises a drive motor 25 that rotates the shaft 23 and a rotary bearing 26 that supports the other end of the feed screw shaft 23. The support means 11 is movably supported on the guide rail 22 via the slider 20, and the feed screw shaft 23 penetrates the nut member 28 provided on the lower surface side of the lower table 17, and the nut member 28. The support means 11 can move along the guide rail 22 by rotating the feed screw shaft 23.

  The peeling head 13 is provided with a pair of upper and lower chuck claws 30 provided in the lower part thereof so as to be separated and approachable in the vertical direction. A peeling tape T is sandwiched between the chuck claws 30 and the peeling head 13 is separated. The tape T can be held. The peeling head 13 is supported by the tape supply unit 14 via a support member (not shown). In addition, the peeling head 13 can employ | adopt the structure similar to the peeling head described in the prior application (Unexamined-Japanese-Patent No. 2003-22986) by this applicant.

  The tape supply unit 14 is the same as the unit disclosed in the prior application gazette. To briefly describe this, the tape supply unit 14 attaches the peeling tape T to the peeling head 13. It includes a tape feeding portion that feeds out, a heater that thermally welds the peeling tape T to the adhesive sheet S, and a cutter that cuts the peeling tape T at predetermined lengths. Since the tape supply unit 14 is not the gist of the present application, description of the detailed structure of each part is omitted here.

  The peeling assisting means 15 is located on the side of the upper table 18, and is supported by the support block 40 provided to be movable in the left-right direction in FIG. And an endless member 45 made of a rubber belt or the like that rotates following the peeling operation of the release sheet S. The guide member 41 includes a guide plate 42 and first and second shafts provided alongside the guide plate 42, and in this embodiment, rotating shafts 43 and 44. The guide plate 42 is provided with an acute triangular cross section, and a bent edge B of the adhesive sheet S is formed by the left corner in FIG. 1 and the endless member 45 (see FIG. 2). As shown in FIG. 2, the guide plate 42 and the first and second rotating shafts 43 and 44 are set to be longer than the width orthogonal to the peeling direction of the adhesive sheet S, and are mutually in the axial direction. Are arranged substantially in parallel. Further, the first rotating shaft 43 is supported so as to be movable along the slot hole 40B formed in the support block 40, and it is possible to suppress meandering of the endless member 45, to set a tension, and to cope with elongation over time. ing. On the other hand, the second rotary shaft 44 is supported so that its axial position can be displaced along a slot hole 40 </ b> A formed in the support block 40. Here, the second rotating shaft 44 and the slot hole 40A constitute a peeling angle adjusting means for adjusting the peeling angle of the adhesive sheet S by changing the turning locus of the endless member 45.

  The endless member 45 is hung on the outer peripheral side of the guide plate 42 and the first and second rotating shafts 43, 44, and between the lower surface of the guide plate 42 and the first rotating shaft 43. The region is parallel to the surface of the adhesive sheet S, and the parallel region rotates while being in surface contact with the adhesive sheet S.

  Next, the sheet peeling method in this embodiment will be described with reference to FIG.

  First, the wafer W is placed on the table 16 via a transfer arm (not shown) and held by suction. Then, the peeling tape is fed out from the tape supply unit 14 by a predetermined length, and its end is supplied between the chuck claws 30 of the peeling head 13 and extends between the chuck claws 30 and the tape supply unit 14. A part of the tape T is welded to the outer peripheral portion of the adhesive sheet S, and the peeling tape T is cut between the welded portion and the tape supply unit 14 (see a two-dot chain line in FIG. 3). The supply, welding, and cutting for each predetermined length of the peeling tape T are substantially the same as the operations described in the above-mentioned prior application publication. At this time, the peeling tape T may be a pressure-sensitive adhesive tape instead of the heat-sensitive adhesive tape. When a pressure-sensitive adhesive tape is used, a mechanism for welding or cutting to a predetermined length can be omitted.

  Next, the peeling assisting means 15 moves to the position shown in FIG. 3 via a moving device (not shown), and moves so that the endless member 45 on the leading end side of the guide plate 42 is located on the outer peripheral edge side on the adhesive sheet S. A bent edge B is formed when the head 13 moves from the position indicated by the two-dot chain line to the position indicated by the solid line to peel off the adhesive sheet S. Before and after this operation, the upper table 18 rises via the driving device 19 so that the adhesive sheet S contacts the lower surface of the endless member 45 with a predetermined pressing force. Then, the support means 11 starts to move in the direction of the arrow a in FIG. 3 via the moving means 12, while the peeling head 13 relatively moves in the direction of the arrow b at the same speed as the moving means 12.

  In this way, the relative movement between the support means 11 and the peeling head 13 causes the peeling of the adhesive sheet S while the front end side of the guide plate 42 is the bent edge B at the time of peeling. In this peeling operation, the endless member 45 rotates rightward in FIG. 3 due to the frictional force with the adhesive tape S, and the adhesive sheet S is strongly sandwiched between the wafer W and the peeling assisting means 15 as in the conventional case. As a result, the peeling tape T and the adhesive sheet S are not cut, and the peeling operation that makes the adhesive tape S smooth prevents the peeling failure. The upper table 18 can be swung in a plane as needed via the driving device 19. Thereby, the adhesive sheet S is gradually peeled from the wafer W so as to be zigzag. And when the support means 11 passes the lower position of the peeling assistance means 15, peeling of the adhesive sheet S will be completed.

  After the adhesive sheet S is completely peeled from the wafer W in this way, the wafer W is transferred via a transfer arm (not shown). On the other hand, the peeled adhesive sheet S is discarded together with the peeling tape T in a waste box or the like (not shown). Then, when the support means 11, the peeling head 13, and the peeling auxiliary means 15 are returned to the initial positions, the wafer W, which becomes a new peeling object, is transferred onto the table 16, and thereafter the adhesive sheet S is peeled in the same manner. The Rukoto.

  When unevenness such as bumps exists on the upper surface side of the wafer W, the second rotating shaft 44 is moved along the slot hole 40A as shown in FIG. The separation angle θ1 is adjusted to 90 degrees by changing, or the second rotation shaft 44 is positioned near the middle of the slot hole 40A and the separation angle θ2 is set to an angle exceeding 90 degrees to perform the separation. It may be. Further, a gas spraying device 50 that constitutes a floating prevention unit is disposed on the upper surface side of the wafer W from which the peeling of the adhesive sheet S has been completed. It may be prevented from being damaged by being pulled.

  Therefore, according to such an embodiment, even if the peeling assisting means 15 acts so as to press the adhesive tape S against the wafer W, the endless member 45 performs a revolving operation, thereby suppressing the peeling resistance. The sheet S can be peeled stably, and damage to the wafer W can be effectively prevented when a brittle material such as the wafer W is targeted.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

  For example, in the above-described embodiment, the case where the endless member 45 is configured by a single member having a belt shape is illustrated and described. However, as shown in FIG. The endless members 45 may be arranged in a plurality of rows at positions spaced apart from each other along the length direction of the two rotation shafts 43 and 44. Thereby, the rotational resistance of the endless member 45 can be relatively reduced, and the peeling resistance of the adhesive sheet S can be further reduced.

  In the above-described embodiment, the guide plate 42 and the first and second rotating shafts 43 and 44 are cantilevered. However, the support block 40 may be configured as a pair and supported on both sides.

  Furthermore, instead of the guide plate 42, a guide roller having the same shape as that of the first or second rotating shaft 43, 44 is adopted, and this guide roller and the first and second rotating shafts 43, A configuration in which the endless member 45 is wound around the outer peripheral side of 44 can also be adopted. At this time, it is sufficient that the guide roller is supported by the support block 40 so that the axial position of the guide roller corresponds to the position of the tip of the guide plate 42.

  Further, the adherend is not limited to the semiconductor wafer W, but includes other adherends.

The schematic front view of the sheet peeling apparatus which concerns on this embodiment. The schematic perspective view at the time of operation | movement of the said sheet peeling apparatus. The schematic front view at the time of operation | movement of the said sheet peeling apparatus. The schematic front view similar to FIG. 3 which shows the state which changed the peeling angle. The schematic perspective view of the sheet sticking apparatus which shows a modification.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Sheet peeling apparatus 11 Support means 12 Moving means 13 Peeling head (tensile means)
14 Tape supply unit (tape application means)
15 Peeling auxiliary means 40A Slot hole (peeling angle adjusting means)
41 Guide member 42 Guide plate 43 First rotating shaft (peeling angle adjusting means)
44 Second rotating shaft 45 Endless member 50 Gas blowing device (lifting prevention means)
B Bending edge T Stripping tape S Adhesive sheet W Semiconductor wafer (Substrate)

Claims (10)

A supporting means for supporting the adherend to which the adhesive sheet is affixed, a tape affixing means for affixing a peeling tape to the adhesive sheet, a tension means for holding the peeling tape and pulling the peeling tape, In the sheet peeling apparatus provided with a peeling auxiliary means that is positioned between the supporting means and the tension means to form a bent edge of the adhesive sheet,
The peeling auxiliary means includes a guide member positioned on the adhesive sheet, and an endless member that is provided on the outer peripheral side of the guide member and rotates following the peeling operation of the adhesive sheet. A sheet peeling apparatus.   The sheet peeling apparatus according to claim 1, wherein the endless member is formed of an elastic member.   The guide member is arranged in a direction substantially parallel to the guide plate that is longer than the maximum width orthogonal to the peeling direction of the adhesive sheet, and an axis that is longer than the maximum width orthogonal to the peeling direction of the adhesive sheet. The sheet peeling apparatus according to claim 1, wherein the endless member is wound around the guide plate and the shaft.   The guide member has a guide roller longer than a maximum width orthogonal to the peeling direction of the adhesive sheet, and an axis longer than the maximum width orthogonal to the peeling direction of the adhesive sheet and disposed in a direction substantially parallel to the guide roller. The sheet peeling apparatus according to claim 1, wherein the endless member is wound around the guide roller and the shaft.   The sheet peeling apparatus according to claim 1, wherein the peeling assisting unit further includes a peeling angle adjusting unit.   6. The sheet peeling apparatus according to claim 1, wherein the endless members are arranged in a plurality of rows at predetermined intervals along a direction orthogonal to the peeling direction of the adhesive sheet.   The sheet peeling apparatus according to any one of claims 1 to 6, further comprising a lifting prevention means for preventing the adherend from lifting due to peeling of the adhesive sheet.   The sheet peeling apparatus according to claim 7, wherein the lifting prevention means is configured by a gas spraying device that sprays gas onto the surface of the adherend. In the sheet peeling method for peeling the adhesive sheet from the adherend by applying the peeling tape to the adhesive sheet attached to the adherend and pulling the peeling tape in a predetermined peeling direction.
An endless member is brought into contact with the adhesive sheet,
A sheet peeling method comprising: forming a bent edge of an adhesive sheet via the endless member; and rotating the endless member so as to follow the peeling operation of the adhesive sheet to peel the adhesive sheet.   The sheet peeling method according to claim 10, wherein a peeling angle of the adhesive sheet is adjusted by changing a turning locus of the endless member.

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