JP5218525B2 - 熱輸送流体が流通する装置 - Google Patents
熱輸送流体が流通する装置 Download PDFInfo
- Publication number
- JP5218525B2 JP5218525B2 JP2010251091A JP2010251091A JP5218525B2 JP 5218525 B2 JP5218525 B2 JP 5218525B2 JP 2010251091 A JP2010251091 A JP 2010251091A JP 2010251091 A JP2010251091 A JP 2010251091A JP 5218525 B2 JP5218525 B2 JP 5218525B2
- Authority
- JP
- Japan
- Prior art keywords
- heat transport
- transport fluid
- heat
- hydrophobic
- cooler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000012530 fluid Substances 0.000 title claims description 132
- 230000002209 hydrophobic effect Effects 0.000 claims description 98
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 39
- 239000010419 fine particle Substances 0.000 claims description 20
- 239000002904 solvent Substances 0.000 claims description 17
- 239000012528 membrane Substances 0.000 claims description 11
- 239000000126 substance Substances 0.000 claims description 9
- 230000032258 transport Effects 0.000 description 148
- 239000010408 film Substances 0.000 description 60
- 238000001179 sorption measurement Methods 0.000 description 40
- 239000000758 substrate Substances 0.000 description 30
- 239000000463 material Substances 0.000 description 24
- 230000015572 biosynthetic process Effects 0.000 description 18
- 238000001816 cooling Methods 0.000 description 16
- 239000011859 microparticle Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 11
- 239000002105 nanoparticle Substances 0.000 description 11
- 239000002244 precipitate Substances 0.000 description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 9
- 239000002245 particle Substances 0.000 description 9
- 229910001593 boehmite Inorganic materials 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 8
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 150000001343 alkyl silanes Chemical class 0.000 description 6
- 238000007710 freezing Methods 0.000 description 6
- 230000008014 freezing Effects 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical class [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 239000002041 carbon nanotube Substances 0.000 description 5
- 229910021393 carbon nanotube Inorganic materials 0.000 description 5
- 238000002474 experimental method Methods 0.000 description 5
- 238000001556 precipitation Methods 0.000 description 5
- 239000010949 copper Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 230000005484 gravity Effects 0.000 description 4
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 230000000994 depressogenic effect Effects 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 3
- 230000002940 repellent Effects 0.000 description 3
- 239000005871 repellent Substances 0.000 description 3
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N ferric oxide Chemical compound O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 125000003709 fluoroalkyl group Chemical group 0.000 description 2
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical group FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 2
- -1 for example Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Chemical compound [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 description 2
- QTRSWYWKHYAKEO-UHFFFAOYSA-N 1,1,2,2,3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,10-henicosafluorodecyl-tris(1,1,2,2,2-pentafluoroethoxy)silane Chemical compound FC(F)(F)C(F)(F)O[Si](OC(F)(F)C(F)(F)F)(OC(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F QTRSWYWKHYAKEO-UHFFFAOYSA-N 0.000 description 1
- SJBBXFLOLUTGCW-UHFFFAOYSA-N 1,3-bis(trifluoromethyl)benzene Chemical class FC(F)(F)C1=CC=CC(C(F)(F)F)=C1 SJBBXFLOLUTGCW-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 101001058366 Danio rerio Glucose-induced degradation protein 8-B homolog Proteins 0.000 description 1
- 102100025576 Glucose-induced degradation protein 8 homolog Human genes 0.000 description 1
- 101001115417 Homo sapiens M-phase phosphoprotein 8 Proteins 0.000 description 1
- 102100023268 M-phase phosphoprotein 8 Human genes 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- DPXJVFZANSGRMM-UHFFFAOYSA-N acetic acid;2,3,4,5,6-pentahydroxyhexanal;sodium Chemical compound [Na].CC(O)=O.OCC(O)C(O)C(O)C(O)C=O DPXJVFZANSGRMM-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000001913 cellulose Chemical class 0.000 description 1
- 229920002678 cellulose Chemical class 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000881 depressing effect Effects 0.000 description 1
- 238000000635 electron micrograph Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000013529 heat transfer fluid Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 229960004592 isopropanol Drugs 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 235000011056 potassium acetate Nutrition 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium(II) oxide Chemical compound [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/10—Liquid materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
- F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2245/00—Coatings; Surface treatments
- F28F2245/02—Coatings; Surface treatments hydrophilic
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2245/00—Coatings; Surface treatments
- F28F2245/04—Coatings; Surface treatments hydrophobic
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F23/00—Features relating to the use of intermediate heat-exchange materials, e.g. selection of compositions
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Combustion & Propulsion (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
以下、本発明を適用する第1実施形態について図1〜図8を参照して説明する。図1は第1実施形態の疎水性膜が形成された疎水性基材10を示す模式図である。図2(a)及び(b)は、疎水性基材10において、凝縮水が発生した際の撥水作用を説明するための模式図である。
(第1工程:ベーマイト処理)
疎水性基材10の元になるアルミニウムからなる基材を沸騰水で5分間煮沸して、表面にベーマイトの針状構造を形成する。このベーマイト処理により、基材の表面に、微小な凹凸面が形成される。
(第2工程:製膜処理)
FAS17(perfluorodecyltriethoxylsilane)25mMの水飽和1,3−ビス(トリフルオロメチル)ベンゼン(F6xy)溶液に、第1工程にて表面をベーマイト化した基材を室温(20℃)で2日浸積する。
(第3工程:製膜処理の後処理)
第3工程では、第2工程にて製膜処理を行った基材をアセトンにて洗浄した後、80℃にて1時間乾燥させる。これにより、基材の表面に、フルオロアルキル基を有するC8F17C2H4Si(O−)3の単分子膜(フッ化アルキル単分子膜)からなる撥水膜が形成された撥水性基材を作製した。なお、第3工程は省略することもできる。
hl=Q/(ΔT・A) …(2)
h=(1/n)・Σhln …(3)
ただし、n=1〜4、Aは発熱体2Aと冷却器間の伝熱面積、Qはヒーター2aから与えられる熱量である。
以上、本発明の好ましい実施形態について説明したが、本発明は上述した実施形態に何ら制限されることなく、本発明の主旨を逸脱しない範囲において種々変形して実施することが可能である。
3…冷却器(熱交換器、インバーター冷却器)
7…入口部
7A…管路
7B…曲がり部
7C,7D…チャンバー
12…突部(凹凸面)
13…小突起(針状構造)
32…フィン
33…流体通路(内部通路)
Claims (9)
- 水または有機物からなる溶媒と前記溶媒中に分散される微小粒子とを含む熱輸送流体が流通することで熱輸送が行われる熱輸送回路に設けられる装置であって、
前記熱輸送流体が接触する表面に疎水性膜を備え、
前記疎水性膜は、多数の突起で構成される凹凸面に膜剤によって形成される毛状部を有することを特徴とする熱輸送流体が流通する装置。 - 前記疎水性膜は、前記熱輸送回路に設けられ前記熱輸送流体が流通するインバーター冷却器の内部通路の壁面に形成されていることを特徴とする請求項1に記載の熱輸送流体が流通する装置。
- 前記疎水性膜は、前記熱輸送回路に設けられ前記熱輸送流体が流通するインバーター冷却器の入口部の表面に形成されていることを特徴とする請求項1または請求項2に記載の熱輸送流体が流通する装置。
- 前記疎水性膜は、前記熱輸送回路に設けられ前記熱輸送流体が流通するインバーター冷却器の内部通路における角部の壁面に形成されていることを特徴とする請求項1から請求項3に記載の熱輸送流体が流通する装置。
- 前記熱輸送回路に設けられ前記熱輸送流体が流通する装置を形成する容器の鉛直方向下部に設けられたチャンバーを備え、前記疎水性膜は、前記チャンバーの内表面に形成されることを特徴とする請求項1から請求項4のいずれか一項に記載の熱輸送流体が流通する装置。
- 前記疎水性膜は、前記熱輸送回路に含まれる管路の内表面に形成されていることを特徴とする請求項1から請求項5のいずれか一項に記載の熱輸送流体が流通する装置。
- 前記疎水性膜は、前記管路における曲がり部の内表面に形成されていることを特徴とする請求項6に記載の熱輸送流体が流通する装置。
- 前記疎水性膜は、前記熱輸送回路に設けられる熱交換器のフィン表面に形成されていることを特徴とする請求項1から請求項7のいずれか一項に記載の熱輸送流体が流通する装置。
- 前記疎水性膜は、針状構造が形成される凹凸面をフッ化アルキルシランで覆う滑水膜により形成されることを特徴とする請求項1から請求項8のいずれか一項に記載の熱輸送流体が流通する装置。
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010251091A JP5218525B2 (ja) | 2010-11-09 | 2010-11-09 | 熱輸送流体が流通する装置 |
| US13/291,445 US9022099B2 (en) | 2010-11-09 | 2011-11-08 | Heat transport fluid passage device with hydrophobic membrane |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010251091A JP5218525B2 (ja) | 2010-11-09 | 2010-11-09 | 熱輸送流体が流通する装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012104604A JP2012104604A (ja) | 2012-05-31 |
| JP5218525B2 true JP5218525B2 (ja) | 2013-06-26 |
Family
ID=46018508
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010251091A Expired - Fee Related JP5218525B2 (ja) | 2010-11-09 | 2010-11-09 | 熱輸送流体が流通する装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US9022099B2 (ja) |
| JP (1) | JP5218525B2 (ja) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10533779B2 (en) * | 2011-06-30 | 2020-01-14 | International Business Machines Corporation | Adsorption heat exchanger devices |
| JP2015222149A (ja) * | 2014-05-23 | 2015-12-10 | 株式会社デンソー | 熱輸送システム |
| US20160108301A1 (en) * | 2014-10-16 | 2016-04-21 | Hudson Gencheng Shou | High-efficiency coolant for electronic systems |
| JP6669890B2 (ja) * | 2016-03-30 | 2020-03-18 | アモセンス・カンパニー・リミテッドAmosense Co., Ltd. | 車両ヒーター用ptcユニット、これを具備するptcヒーターおよび車両用空調装置 |
| EP3568645A4 (en) * | 2017-01-12 | 2020-10-14 | Nelumbo Inc. | TEMPERATURE AND RELATIVE HUMIDITY REGULATOR |
| JP2019045105A (ja) * | 2017-09-05 | 2019-03-22 | トヨタ自動車株式会社 | 熱輸送システム |
| US11536520B2 (en) * | 2018-02-02 | 2022-12-27 | INDIAN INSTITUTE OF TECHNOLOGY MADRAS (IIT Madras) | Modified surface for condensation |
| JP7024570B2 (ja) * | 2018-04-13 | 2022-02-24 | 株式会社豊田中央研究所 | 熱輸送システム |
| JP7024571B2 (ja) * | 2018-04-13 | 2022-02-24 | 株式会社豊田中央研究所 | 熱輸送システム |
| CN112752474B (zh) * | 2020-10-30 | 2022-05-10 | 天津七所精密机电技术有限公司 | 机箱箱体的润湿改性加工方法及高防护性加固电子设备 |
| JP7426336B2 (ja) | 2020-12-14 | 2024-02-01 | 本田技研工業株式会社 | 冷却器 |
| US20250162861A1 (en) * | 2022-01-25 | 2025-05-22 | Nanyang Technological University | Surface Structuring of Additively Manufactured Articles |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3438388A (en) * | 1965-10-19 | 1969-04-15 | Duriron Co | Fully lined valve |
| FR2215990B1 (ja) * | 1973-02-02 | 1976-09-10 | Commissariat Energie Atomique | |
| US4776391A (en) * | 1979-10-04 | 1988-10-11 | Heat Exchanger Industries, Inc. | Heat exchanger method and apparatus |
| EP1373430A4 (en) * | 2001-01-30 | 2007-04-25 | Mat & Electrochem Res Corp | NANO CARBON MATERIALS FOR IMPROVING HEAT TRANSFER IN FLUIDES |
| FR2829948B1 (fr) * | 2001-09-21 | 2004-07-09 | Commissariat Energie Atomique | Procede de deplacement d'un fluide d'interet dans un capillaire et microsysteme fluidique |
| US6858157B2 (en) * | 2003-04-17 | 2005-02-22 | Vnaderbilt University | Compositions with nano-particle size diamond powder and methods of using same for transferring heat between a heat source and a heat sink |
| US7770809B2 (en) * | 2003-05-16 | 2010-08-10 | Kambiz Vafai | Methods and devices comprising flexible seals, flexible microchannels, or both for modulating or controlling flow and heat |
| JP3906921B2 (ja) * | 2003-06-13 | 2007-04-18 | セイコーエプソン株式会社 | バンプ構造体およびその製造方法 |
| JP2006005039A (ja) * | 2004-06-16 | 2006-01-05 | Matsushita Electric Ind Co Ltd | 冷却システム |
| JP2006017436A (ja) | 2004-07-05 | 2006-01-19 | Honda Motor Co Ltd | 蓄熱システム |
| JP2006016573A (ja) | 2004-07-05 | 2006-01-19 | Honda Motor Co Ltd | マイクロカプセル及び熱輸送流体 |
| WO2006034876A1 (de) * | 2004-09-30 | 2006-04-06 | Behr Gmbh & Co. Kg | Wärmeübertrager und verfahren zur kühlung von ladeluft |
| US7204298B2 (en) * | 2004-11-24 | 2007-04-17 | Lucent Technologies Inc. | Techniques for microchannel cooling |
| JP4528223B2 (ja) | 2005-07-25 | 2010-08-18 | 本田技研工業株式会社 | 熱輸送流体 |
| DE102005043730A1 (de) * | 2005-09-14 | 2007-03-22 | Behr Gmbh & Co. Kg | Wärmetauscher, insbesondere Abgaswärmetauscher |
| JP2007180438A (ja) * | 2005-12-28 | 2007-07-12 | Fujitsu Ltd | 冷却媒体、冷却装置及び電子機器 |
| US9103607B2 (en) * | 2006-03-03 | 2015-08-11 | Micro Delta T Ab | Porous layer |
| JP4679475B2 (ja) * | 2006-08-31 | 2011-04-27 | 富士通株式会社 | 冷却装置、電子機器および冷却媒体 |
| JP4679474B2 (ja) * | 2006-08-31 | 2011-04-27 | 富士通株式会社 | 冷却装置、電子機器および冷却媒体 |
| JP2008063411A (ja) * | 2006-09-06 | 2008-03-21 | Denso Corp | 熱輸送流体、熱輸送構造、及び熱輸送方法 |
| JP2008112874A (ja) * | 2006-10-31 | 2008-05-15 | Fujitsu Ltd | 冷却装置および電子機器 |
| JP4528324B2 (ja) | 2007-01-11 | 2010-08-18 | 本田技研工業株式会社 | 熱輸送流体およびその製造方法 |
| ES2395161T3 (es) * | 2007-01-18 | 2013-02-08 | Mitsubishi Electric Corporation | Composición de revistimiento, método de revestimiento, intercabiador de calor y acondicionador de aire |
| JP5125242B2 (ja) * | 2007-06-14 | 2013-01-23 | 株式会社トッパンNecサーキットソリューションズ | 半導体素子の実装構造、印刷配線板及びその製造方法 |
| US8308926B2 (en) * | 2007-08-20 | 2012-11-13 | Purdue Research Foundation | Microfluidic pumping based on dielectrophoresis |
| JP2010077667A (ja) * | 2008-09-25 | 2010-04-08 | Maruichi Corp | 排水配管 |
| US20100096113A1 (en) * | 2008-10-20 | 2010-04-22 | General Electric Company | Hybrid surfaces that promote dropwise condensation for two-phase heat exchange |
| DE102008056621B4 (de) * | 2008-11-10 | 2012-01-05 | Siemens Aktiengesellschaft | Verfahren zur Herstellung eines Dampfkondensators, sowie Dampfkondensator für eine Dampfturbinenanlage und Vorrichtung zum Beschichten eines Kondensatorrohres |
| US9187684B2 (en) * | 2009-03-20 | 2015-11-17 | University Of South Carolina | Nanofluids for thermal management systems |
-
2010
- 2010-11-09 JP JP2010251091A patent/JP5218525B2/ja not_active Expired - Fee Related
-
2011
- 2011-11-08 US US13/291,445 patent/US9022099B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US9022099B2 (en) | 2015-05-05 |
| US20120111549A1 (en) | 2012-05-10 |
| JP2012104604A (ja) | 2012-05-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5218525B2 (ja) | 熱輸送流体が流通する装置 | |
| Sureshkumar et al. | Heat transfer characteristics of nanofluids in heat pipes: A review | |
| Kim | Enhancement of critical heat flux in nucleate boiling of nanofluids: a state-of-art review | |
| Anoop et al. | Experimental study of forced convective heat transfer of nanofluids in a microchannel | |
| Li et al. | Subcooled flow boiling on hydrophilic and super-hydrophilic surfaces in microchannel under different orientations | |
| US20080054217A1 (en) | Heat transport fluid, heat transport structure, and heat transport method | |
| Yang et al. | Flow boiling heat transfer in the evaporator of a loop thermosyphon operating with CuO based aqueous nanofluid | |
| US20100243213A1 (en) | Heat pipe type heat transfer device | |
| Sudhan et al. | Research progress on performance enhancement of heat pipes: a review | |
| Dey et al. | Nanofluid in the multiphase flow field and heat transfer: A review | |
| Jadar et al. | Performance evaluation of Al-MWCNT based automobile radiator | |
| JP2006016573A (ja) | マイクロカプセル及び熱輸送流体 | |
| Rahul et al. | Enhanced pool boiling heat transfer characteristics on microstructured copper surfaces coated with hybrid nanofluid: N. Rahul et al. | |
| Hadi et al. | An evaluation of heat transfer and pressure drop performance of superhydrophobic surfaced integral mini-channel heat sinks with nanofluids | |
| Jadar et al. | f-MWCNT nanomaterial integrated automobile radiator | |
| JP5499464B2 (ja) | 熱輸送流体、熱輸送装置および熱輸送方法 | |
| Benedict et al. | Nanocellulose as heat transfer liquid in heat exchanger | |
| Sivakumar et al. | Thermal performance of U‐shaped serpentine microchannel heat sink using various metal oxide nanofluids | |
| Chougule et al. | Experimental investigation of heat transfer augmentation in automobile radiator with CNT/water nanofluid | |
| Hadi et al. | Experimental investigation of thermal performance of the graphene-coated Al heat sink | |
| JP5125792B2 (ja) | 熱輸送装置 | |
| Ozbalci et al. | Examining the impact of Ag-decorated CuO-H2O nanofluid on pressure and thermal efficiency in a channel with metal foam heat sinks: An experimental study | |
| JP2008088240A (ja) | 熱輸送媒体 | |
| JP2007238862A (ja) | 熱輸送媒体 | |
| JP2009276022A (ja) | ヒートパイプ |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20120308 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20121108 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20121113 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130108 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130205 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130218 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20160315 Year of fee payment: 3 |
|
| R151 | Written notification of patent or utility model registration |
Ref document number: 5218525 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20160315 Year of fee payment: 3 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |