JP5001055B2 - 極端紫外光源装置 - Google Patents
極端紫外光源装置 Download PDFInfo
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- JP5001055B2 JP5001055B2 JP2007111704A JP2007111704A JP5001055B2 JP 5001055 B2 JP5001055 B2 JP 5001055B2 JP 2007111704 A JP2007111704 A JP 2007111704A JP 2007111704 A JP2007111704 A JP 2007111704A JP 5001055 B2 JP5001055 B2 JP 5001055B2
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- Prior art keywords
- extreme ultraviolet
- ultraviolet light
- collector mirror
- light source
- plasma
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05G—X-RAY TECHNIQUE
- H05G2/00—Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma
- H05G2/001—Production of X-ray radiation generated from plasma
- H05G2/009—Auxiliary arrangements not involved in the plasma generation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
- G03F7/70033—Production of exposure light, i.e. light sources by plasma extreme ultraviolet [EUV] sources
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70941—Stray fields and charges, e.g. stray light, scattered light, flare, transmission loss
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05G—X-RAY TECHNIQUE
- H05G2/00—Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma
- H05G2/001—Production of X-ray radiation generated from plasma
- H05G2/002—Supply of the plasma generating material
- H05G2/0023—Constructional details of the ejection system
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05G—X-RAY TECHNIQUE
- H05G2/00—Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma
- H05G2/001—Production of X-ray radiation generated from plasma
- H05G2/002—Supply of the plasma generating material
- H05G2/0027—Arrangements for controlling the supply; Arrangements for measurements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05G—X-RAY TECHNIQUE
- H05G2/00—Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma
- H05G2/001—Production of X-ray radiation generated from plasma
- H05G2/008—Production of X-ray radiation generated from plasma involving an energy-carrying beam in the process of plasma generation
- H05G2/0082—Production of X-ray radiation generated from plasma involving an energy-carrying beam in the process of plasma generation the energy-carrying beam being a laser beam
- H05G2/0086—Optical arrangements for conveying the laser beam to the plasma generation location
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05G—X-RAY TECHNIQUE
- H05G2/00—Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma
- H05G2/001—Production of X-ray radiation generated from plasma
- H05G2/009—Auxiliary arrangements not involved in the plasma generation
- H05G2/0094—Reduction, prevention or protection from contamination; Cleaning
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Epidemiology (AREA)
- Plasma & Fusion (AREA)
- Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Public Health (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- X-Ray Techniques (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
図1は、本発明の第1の実施形態に係るEUV光源装置を示す側面図である。本実施形態に係るEUV光源装置は、レーザビームをターゲット物質に照射して励起させることによりEUV光を生成するレーザ励起プラズマ(LPP)方式を採用している。
図5は、遮蔽プレートにより構造物を覆う本発明の第2の実施形態に係るEUV光源装置の内部構造を示す概略図である。真空チャンバ内でプラズマに対して露出するコレクタミラーホルダ16や構造物100を覆うために、EUV光の透過率が高い材料で形成される遮蔽プレート22が設けられている。本実施形態においては、遮蔽プレート22の材料として、EUV光の透過率が高いシリコン(Si)が用いられるが、ジルコニウム(Zr)、モリブデン(Mo)、リチウム(Li)、又は、アルミニウム(Al)を用いても良く、それらの合金を用いても良い。
Claims (9)
- ドライバレーザによって生成されるレーザビームをターゲットに照射することにより、プラズマから極端紫外光を発生する極端紫外光源装置であって、
極端紫外光の生成が行われるチャンバと、
前記チャンバ内の所定の位置にターゲットを供給するターゲット供給部と、
前記チャンバ内に設置され、反射面に多層膜を有し、プラズマから放射される極端紫外光を集光して出射するコレクタミラーと、
前記チャンバ内において前記コレクタミラーを支持するコレクタミラーホルダと、
前記チャンバ内において、前記コレクタミラーホルダ、前記ターゲット供給部、及び、前記チャンバの内壁の内の1つの構造物との間に熱伝導材料を挟んで設置され、プラズマから発生するイオンに対して前記構造物を遮蔽し、前記構造物を形成する第1の材料よりも極端紫外光の透過率が高い第2の材料で形成された遮蔽材と、
を具備する極端紫外光源装置。 - 前記構造物と前記遮蔽材との間に、前記遮蔽材を冷却するための冷却装置が配置されている、請求項1記載の極端紫外光源装置。
- 前記ドライバレーザによって生成される励起用レーザビームを集光するレンズと、前記レンズを支持するレンズホルダとが、前記チャンバ内に設置されており、前記遮蔽材が、プラズマから発生するイオンに対して前記レンズホルダを遮蔽する遮蔽材を含む、請求項1又は2記載の極端紫外光源装置。
- ドライバレーザによって生成されるレーザビームをターゲットに照射することにより、プラズマから極端紫外光を発生する極端紫外光源装置であって、
極端紫外光の生成が行われるチャンバと、
前記チャンバ内の所定の位置にターゲットを供給するターゲット供給部と、
前記チャンバ内に設置され、反射面に多層膜を有し、プラズマから放射される極端紫外光を集光して出射するコレクタミラーと、
前記チャンバ内において前記コレクタミラーを支持するコレクタミラーホルダと、
を具備し、前記コレクタミラーホルダ、及び、前記チャンバの内壁の内の少なくとも1つの構造物の少なくとも一部が、前記構造物を形成する第1の材料よりも極端紫外光の透過率が高い第2の材料によってコーティングされている、極端紫外光源装置。 - 前記ドライバレーザによって生成される励起用レーザビームを集光するレンズと、前記レンズを支持するレンズホルダとが、前記チャンバ内に設置されており、前記レンズホルダの少なくとも一部が、前記第2の材料によってコーティングされている、請求項4記載の極端紫外光源装置。
- 前記第1の材料が、ステンレス鋼を含む、請求項1〜5のいずれか1項記載の極端紫外光源装置。
- 前記第2の材料が、シリコン(Si)、ジルコニウム(Zr)、モリブデン(Mo)、リチウム(Li)、アルミニウム(Al)、又は、それらの合金を含む、請求項1〜6のいずれか1項記載の極端紫外光源装置。
- ドライバレーザによって生成されるレーザビームをターゲットに照射することにより、プラズマから極端紫外光を発生する極端紫外光源装置であって、
極端紫外光の生成が行われるチャンバと、
前記チャンバ内の所定の位置にターゲットを供給するターゲット供給部と、
前記チャンバ内に設置され、反射面に多層膜を有し、プラズマから放射される極端紫外光を集光して出射するコレクタミラーと、
前記チャンバ内において前記コレクタミラーを支持するコレクタミラーホルダと、
を具備し、前記コレクタミラーホルダ、及び、前記チャンバの内壁の内の少なくとも1つの構造物の少なくとも一部が、シリコン(Si)、ジルコニウム(Zr)、モリブデン(Mo)、リチウム(Li)、アルミニウム(Al)、又は、それらの合金を含む材料で形成されている、極端紫外光源装置。 - 前記ドライバレーザによって生成される励起用レーザビームを集光するレンズと、前記レンズを支持するレンズホルダとが、前記チャンバ内に設置されており、前記レンズホルダの少なくとも一部が、シリコン(Si)、ジルコニウム(Zr)、モリブデン(Mo)、リチウム(Li)、アルミニウム(Al)、又は、それらの合金を含む材料で形成されている、請求項8記載の極端紫外光源装置。
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007111704A JP5001055B2 (ja) | 2007-04-20 | 2007-04-20 | 極端紫外光源装置 |
| US12/453,058 US8450706B2 (en) | 2007-04-20 | 2009-04-28 | Extreme ultraviolet light source apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007111704A JP5001055B2 (ja) | 2007-04-20 | 2007-04-20 | 極端紫外光源装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008270533A JP2008270533A (ja) | 2008-11-06 |
| JP5001055B2 true JP5001055B2 (ja) | 2012-08-15 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007111704A Expired - Fee Related JP5001055B2 (ja) | 2007-04-20 | 2007-04-20 | 極端紫外光源装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US8450706B2 (ja) |
| JP (1) | JP5001055B2 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10880981B2 (en) * | 2017-09-29 | 2020-12-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Collector pellicle |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7671349B2 (en) * | 2003-04-08 | 2010-03-02 | Cymer, Inc. | Laser produced plasma EUV light source |
| JP5086664B2 (ja) * | 2007-03-02 | 2012-11-28 | ギガフォトン株式会社 | 極端紫外光源装置 |
| JP5426317B2 (ja) | 2008-10-23 | 2014-02-26 | ギガフォトン株式会社 | 極端紫外光光源装置 |
| KR101622272B1 (ko) * | 2008-12-16 | 2016-05-18 | 코닌클리케 필립스 엔.브이. | 향상된 효율로 euv 방사선 또는 소프트 x선을 생성하기 위한 방법 및 장치 |
| JP5580032B2 (ja) * | 2008-12-26 | 2014-08-27 | ギガフォトン株式会社 | 極端紫外光光源装置 |
| JP5455661B2 (ja) * | 2009-01-29 | 2014-03-26 | ギガフォトン株式会社 | 極端紫外光源装置 |
| JP2011049513A (ja) * | 2009-07-30 | 2011-03-10 | Ushio Inc | 光源装置 |
| JP2011192965A (ja) * | 2010-02-22 | 2011-09-29 | Komatsu Ltd | チャンバ装置、および極端紫外光生成装置 |
| WO2011116897A1 (en) * | 2010-03-25 | 2011-09-29 | Eth Zurich | A beam line for a source of extreme ultraviolet (euv) radiation |
| JP5726587B2 (ja) * | 2010-10-06 | 2015-06-03 | ギガフォトン株式会社 | チャンバ装置 |
| JP5802465B2 (ja) * | 2010-10-29 | 2015-10-28 | ギガフォトン株式会社 | ドロップレット生成及び検出装置、並びにドロップレット制御装置 |
| JP5921879B2 (ja) * | 2011-03-23 | 2016-05-24 | ギガフォトン株式会社 | ターゲット供給装置及び極端紫外光生成装置 |
| US8748853B2 (en) * | 2011-03-24 | 2014-06-10 | Gigaphoton Inc. | Chamber apparatus |
| US9310689B2 (en) | 2011-09-02 | 2016-04-12 | Asml Netherlands B.V. | Radiation source and lithographic apparatus |
| NL2009359A (en) * | 2011-09-23 | 2013-03-26 | Asml Netherlands Bv | Radiation source. |
| TWI596384B (zh) * | 2012-01-18 | 2017-08-21 | Asml荷蘭公司 | 光源收集器元件、微影裝置及元件製造方法 |
| JP5982137B2 (ja) * | 2012-03-05 | 2016-08-31 | ギガフォトン株式会社 | ターゲット供給装置 |
| US9268031B2 (en) * | 2012-04-09 | 2016-02-23 | Kla-Tencor Corporation | Advanced debris mitigation of EUV light source |
| WO2014024865A1 (ja) * | 2012-08-08 | 2014-02-13 | ギガフォトン株式会社 | ターゲット供給装置及び極端紫外光生成装置 |
| US9392678B2 (en) | 2012-10-16 | 2016-07-12 | Asml Netherlands B.V. | Target material supply apparatus for an extreme ultraviolet light source |
| JP6283684B2 (ja) * | 2013-11-07 | 2018-02-21 | ギガフォトン株式会社 | 極端紫外光生成装置及び極端紫外光生成装置の制御方法 |
| JP6448661B2 (ja) * | 2014-11-20 | 2019-01-09 | ギガフォトン株式会社 | 極端紫外光生成装置 |
| US9538628B1 (en) * | 2015-06-11 | 2017-01-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for EUV power improvement with fuel droplet trajectory stabilization |
| WO2017017834A1 (ja) * | 2015-07-30 | 2017-02-02 | ギガフォトン株式会社 | 極端紫外光生成装置 |
| DE102016213830B3 (de) * | 2016-07-27 | 2017-12-07 | Carl Zeiss Smt Gmbh | Quell-Hohlkörper sowie EUV-Plasma-Lichtquelle mit einem derartigen Quell-Hohlkörper |
| WO2018042565A1 (ja) * | 2016-08-31 | 2018-03-08 | ギガフォトン株式会社 | ドロップレット回収装置 |
| US10310380B2 (en) * | 2016-12-07 | 2019-06-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | High-brightness light source |
| DE102017213181A1 (de) * | 2017-07-31 | 2019-01-31 | Carl Zeiss Smt Gmbh | Optische Anordnung für EUV-Strahlung mit einer Abschirmung zum Schutz vor der Ätzwirkung eines Plasmas |
| US10477663B2 (en) | 2017-11-16 | 2019-11-12 | Taiwan Semiconductor Manufacturing Co., Ltd. | Light source for lithography exposure process |
| US11550233B2 (en) * | 2018-08-14 | 2023-01-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Lithography system and operation method thereof |
| US10871719B2 (en) * | 2018-08-17 | 2020-12-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | EUV metal droplet catchers |
| NL2023879A (en) * | 2018-09-26 | 2020-05-01 | Asml Netherlands Bv | Apparatus for and method of controlling introduction of euv target material into an euv chamber |
| KR102897585B1 (ko) * | 2020-09-29 | 2025-12-10 | 삼성전자주식회사 | 극자외선 광원 시스템 |
| JP2023142410A (ja) * | 2022-03-25 | 2023-10-05 | ギガフォトン株式会社 | 極端紫外光生成装置、及び電子デバイスの製造方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09320794A (ja) * | 1996-05-27 | 1997-12-12 | Nikon Corp | X線発生装置 |
| WO1999063790A1 (en) * | 1998-05-29 | 1999-12-09 | Nikon Corporation | Laser-excited plasma light source, exposure apparatus and its manufacturing method, and device manufacturing method |
| US6972421B2 (en) * | 2000-06-09 | 2005-12-06 | Cymer, Inc. | Extreme ultraviolet light source |
| US6479830B1 (en) * | 2000-11-01 | 2002-11-12 | Trw Inc. | Low-sputter-yield coating for hardware near laser-produced plasma |
| JP2003142296A (ja) * | 2001-11-05 | 2003-05-16 | Canon Inc | X線発生装置 |
| JP2004128105A (ja) * | 2002-10-01 | 2004-04-22 | Nikon Corp | X線発生装置及び露光装置 |
| JP4340851B2 (ja) * | 2003-04-09 | 2009-10-07 | 株式会社ニコン | 光源ユニット、照明光学装置、露光装置および露光方法 |
| US7164144B2 (en) * | 2004-03-10 | 2007-01-16 | Cymer Inc. | EUV light source |
| JP2005268358A (ja) | 2004-03-17 | 2005-09-29 | Nikon Corp | ミラーの洗浄装置及び照明光学装置 |
| US7365349B2 (en) * | 2005-06-27 | 2008-04-29 | Cymer, Inc. | EUV light source collector lifetime improvements |
-
2007
- 2007-04-20 JP JP2007111704A patent/JP5001055B2/ja not_active Expired - Fee Related
-
2009
- 2009-04-28 US US12/453,058 patent/US8450706B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10880981B2 (en) * | 2017-09-29 | 2020-12-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Collector pellicle |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008270533A (ja) | 2008-11-06 |
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| US8450706B2 (en) | 2013-05-28 |
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