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JP4548663B2 - Battery pack - Google Patents

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Publication number
JP4548663B2
JP4548663B2 JP2005153132A JP2005153132A JP4548663B2 JP 4548663 B2 JP4548663 B2 JP 4548663B2 JP 2005153132 A JP2005153132 A JP 2005153132A JP 2005153132 A JP2005153132 A JP 2005153132A JP 4548663 B2 JP4548663 B2 JP 4548663B2
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Prior art keywords
circuit board
upper cover
unit cell
board
fitting portion
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Expired - Fee Related
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JP2005153132A
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JP2006331818A (en
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宏 山本
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Maxell Ltd
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Hitachi Maxell Energy Ltd
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Priority to JP2005153132A priority Critical patent/JP4548663B2/en
Priority to KR1020077027276A priority patent/KR101233261B1/en
Priority to CN2006800140091A priority patent/CN101167198B/en
Priority to US11/884,355 priority patent/US20100143793A1/en
Priority to PCT/JP2006/309154 priority patent/WO2006126379A1/en
Publication of JP2006331818A publication Critical patent/JP2006331818A/en
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

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Description

本発明は、素電池の上側に回路基板を配するとともに回路基板の上側に上側カバーを配して、樹脂モールドで素電池の上面に一体化する電池パックに関する。   The present invention relates to a battery pack in which a circuit board is arranged on the upper side of a unit cell and an upper cover is arranged on the upper side of the circuit board and integrated with the upper surface of the unit cell by a resin mold.

特許文献１・２では、回路基板の上面に外部接続端子を配し、その外部接続端子を電池パックの上面に露出させた状態で、回路基板などを樹脂モールドで素電池に一体化している。   In Patent Documents 1 and 2, an external connection terminal is arranged on the upper surface of a circuit board, and the circuit board and the like are integrated with a unit cell by a resin mold in a state where the external connection terminal is exposed on the upper surface of the battery pack.

特開２００４−２２１０２６号公報（図１・５）JP 2004-221026 A (FIGS. 1 and 5) 特開２００３−１７０２２号公報（図３−４）Japanese Patent Laying-Open No. 2003-17022 (FIG. 3-4)

前記電池パックを携帯電話や充電器などの外部機器の装着部に装着した際には、前記装着部の位置決め部材などが電池パックの上面に当接する。これに対して、特許文献２に示すごとく回路基板の上側を樹脂モールドで覆う手法では、前記位置決め部材などの当接に対する電池パックの上面の強度が不足することになる。   When the battery pack is mounted on a mounting portion of an external device such as a mobile phone or a charger, the positioning member of the mounting portion contacts the upper surface of the battery pack. On the other hand, as shown in Patent Document 2, the technique of covering the upper side of the circuit board with a resin mold results in insufficient strength of the upper surface of the battery pack against the contact of the positioning member or the like.

特許文献１に示すごとく強度の大きな合成樹脂製のカバーに回路基板の外部接続端子に対面する窓口を設け、このカバーで回路基板の全体を覆うとともに前記窓口を介して外部接続端子を露出させておき、この状態で、樹脂モールドでカバーと回路基板とを素電池に一体化することが考えられる。ところが、特許文献１では、回路基板の全体をカバーで覆っているために、組み立て作業に手間が掛かって電池パックの生産性が悪くなる。   As shown in Patent Document 1, a cover made of a synthetic resin having high strength is provided with a window facing the external connection terminal of the circuit board. The cover covers the entire circuit board and exposes the external connection terminal through the window. In this state, it is conceivable to integrate the cover and the circuit board into the unit cell with a resin mold. However, in Patent Document 1, since the entire circuit board is covered with a cover, the assembly work takes time and the productivity of the battery pack deteriorates.

一方、組み立て作業の簡略化のために回路基板の上側のみにカバーを配し、そのカバーや回路基板などを樹脂モールドで素電池に一体化することが考えられる。この場合、溶融樹脂が、上側カバーと回路基板との隙間を通って外部接続端子を覆うことを防止する必要がある。   On the other hand, in order to simplify the assembling work, it is conceivable that a cover is provided only on the upper side of the circuit board, and the cover, the circuit board, etc. are integrated with the unit cell by resin molding. In this case, it is necessary to prevent the molten resin from covering the external connection terminal through the gap between the upper cover and the circuit board.

そこで本発明の目的は、溶融樹脂が上側カバーと回路基板との隙間を通って外部接続端子を覆うことを防止できる電池パックを提供することにある。   Accordingly, an object of the present invention is to provide a battery pack that can prevent molten resin from covering an external connection terminal through a gap between an upper cover and a circuit board.

本発明が対象とする電池パック１は、図２および図３に示すごとく、内部に電極体を電解液とを収容した外装缶７の上面を封口板９で塞いでなる素電池２と、素電池２の上側に配される回路基板１２と、回路基板１２の上側に配される上側カバー３と、上側カバー３と素電池２の上面（封口板が位置する側の面）との間に成形されて回路基板１２および上側カバー３を素電池２の上面に一体化する樹脂モールド５とを含んでいる。回路基板１２の上面には、外部接続端子１９・２０・２１が配されており、上側カバー３は、外部接続端子１９・２０・２１に対面する窓口２６・２７・２９を貫通状に設けてある。上側カバー３の下面には、図１に示すごとく回路基板１２が嵌め込まれる基板嵌合部３６が凹み形成されている。 As shown in FIGS. 2 and 3, the battery pack 1 targeted by the present invention includes a unit cell 2 in which an upper surface of an outer can 7 in which an electrode body is accommodated with an electrolyte solution is closed with a sealing plate 9, and a unit cell 2 . Between the circuit board 12 disposed on the upper side of the battery 2, the upper cover 3 disposed on the upper side of the circuit board 12, and the upper surface of the upper cover 3 and the unit cell 2 ( the surface on the side where the sealing plate is located). And a resin mold 5 which is molded and integrates the circuit board 12 and the upper cover 3 onto the upper surface of the unit cell 2. External connection terminals 19, 20, and 21 are arranged on the upper surface of the circuit board 12, and the upper cover 3 has windows 26, 27, and 29 facing the external connection terminals 19, 20, and 21 in a penetrating manner. is there. A board fitting portion 36 into which the circuit board 12 is fitted is formed on the lower surface of the upper cover 3 as shown in FIG.

ここでは、回路基板１２の全体が基板嵌合部３６に嵌め込まれる場合と、回路基板１２の上下方向の一部のみが基板嵌合部３６に嵌め込まれる場合とが含まれる。基板嵌合部３６の内面と回路基板１２との間の隙間は、小さいほうが好ましい。   Here, a case where the entire circuit board 12 is fitted into the board fitting part 36 and a case where only a part of the circuit board 12 in the vertical direction is fitted into the board fitting part 36 are included. The gap between the inner surface of the board fitting portion 36 and the circuit board 12 is preferably small.

詳しくは、上側カバー３の下面に係止部５０を設けてあり、回路基板１２が基板嵌合部３６に嵌め込まれた状態で、係止部５０によって上側カバー３を回路基板１２に固定する。   Specifically, the locking part 50 is provided on the lower surface of the upper cover 3, and the upper cover 3 is fixed to the circuit board 12 by the locking part 50 in a state where the circuit board 12 is fitted into the board fitting part 36.

また、基板嵌合部３６内の上面（基板嵌合部３６の内面であって、当該基板嵌合部３６に嵌め込まれる回路基板１２の板面と対向する面）に、両面テープ３７が嵌め込まれるテープ嵌合部３９を凹み形成して、このテープ嵌合部３９に嵌め込んだ両面テープ３７によって上側カバー３を回路基板１２の上面に固定する構成とする。ここでは、両面テープ３７の全体がテープ嵌合部３９に嵌め込まれる場合と、両面テープ３７の上下方向の一部のみがテープ嵌合部３９に嵌め込まれる場合とが含まれる。 A double-sided tape 37 is fitted on the upper surface in the board fitting portion 36 (the inner surface of the board fitting portion 36 that faces the plate surface of the circuit board 12 fitted in the board fitting portion 36). A tape fitting part 39 is formed in a recessed manner, and the upper cover 3 is fixed to the upper surface of the circuit board 12 by a double-sided tape 37 fitted into the tape fitting part 39 . Here, a case where the entire double-sided tape 37 is fitted into the tape fitting portion 39 and a case where only a part of the double-sided tape 37 in the vertical direction is fitted into the tape fitting portion 39 are included.

樹脂モールド５の成形の際に、基板嵌合部３６の下端から基板嵌合部３６の内側面と回路基板１２の側面との隙間に入り込んだ溶融樹脂は、その隙間を上側に流れたのちに、基板嵌合部３６の上端で向きを変えて回路基板１２の上面と基板嵌合部３６内の上面との隙間を流れようとする。 When the resin mold 5 is molded, the molten resin that has entered the gap between the inner side surface of the board fitting portion 36 and the side surface of the circuit board 12 from the lower end of the board fitting portion 36 flows upward through the gap. , it tends to flow to the gap between the upper surface of the upper surface and the substrate fitting portions 36 of the circuit board 12 in different directions at the upper end of the substrate fitting portions 36.

つまり、回路基板１２が基板嵌合部３６内に嵌まり込む分だけ、基板嵌合部３６の下端から回路基板１２の外部接続端子１９・２０・２１までの溶融樹脂の流路が長くなるうえに、基板嵌合部３６の上端で溶融樹脂の流れの向きが変わる分だけ流路抵抗が大きくなって、溶融樹脂が外部接続端子１９・２０・２１に届き難くなる。したがって、樹脂モールド５の成形の際に、溶融樹脂が外部接続端子１９・２０・２１上に被さることが防止されて、外部接続端子１９・２０・２１が、窓口２６・２７・２９を介して外部機器の接触端子に確実に接触接続できる。   That is, the flow path of the molten resin from the lower end of the board fitting portion 36 to the external connection terminals 19, 20, and 21 of the circuit board 12 is increased by the amount that the circuit board 12 is fitted into the board fitting portion 36. In addition, the flow path resistance is increased by the amount of change in the flow direction of the molten resin at the upper end of the board fitting portion 36, and the molten resin is difficult to reach the external connection terminals 19, 20, and 21. Therefore, when the resin mold 5 is molded, the molten resin is prevented from covering the external connection terminals 19, 20, and 21, and the external connection terminals 19, 20, and 21 are connected via the windows 26, 27, and 29. It can be securely connected to the contact terminals of external devices.

係止部５０で上側カバー３を回路基板１２に固定し、あるいは両面テープ３７で上側カバー３を回路基板１２に固定すると、樹脂モールド５の成形前に回路基板１２から上側カバー３が離れることを確実に防止できる。したがって、回路基板１２の上面と基板嵌合部３６内の上面との隙間が大きくなることを確実に防止できて、溶融樹脂が外部接続端子１９・２０・２１上に被さることをより防止できる。 When the upper cover 3 is fixed to the circuit board 12 with the locking portion 50 or the upper cover 3 is fixed to the circuit board 12 with the double-sided tape 37, the upper cover 3 is separated from the circuit board 12 before the resin mold 5 is formed. It can be surely prevented. Therefore, can be securely prevented that the gap is large between the upper surface of the upper surface and the substrate fitting portions 36 of the circuit board 12, the molten resin can be further prevented from overlaying on the external connection terminals 19, 20, 21.

両面テープ３７を上側カバー３のテープ嵌合部４６に嵌まり込むようにすると、両面テープ３７の存在によって回路基板１２の上面と基板嵌合部３６内の上面との隙間が大きくなることを低減でき、この点からも溶融樹脂が外部接続端子１９・２０・２１上に被さることをより防止できる。 When the double-sided tape 37 is fitted into the tape fitting portion 46 of the upper cover 3, the presence of the double-sided tape 37 reduces the increase in the gap between the upper surface of the circuit board 12 and the upper surface in the board fitting portion 36 . In this respect, the molten resin can be further prevented from covering the external connection terminals 19, 20, and 21.

（実施例１） 図１ないし図６は、本発明が対象とする電池パックの実施例１を示しており、図２および図３に示すごとく、電池パック１は、扁平角箱状の素電池２と、素電池２の上側に配される電装品と、電装品の上側に配されるプラスチック製の上側カバー３と、素電池２の上面に電装品と上側カバー３とを一体化する樹脂モールド５と、素電池２の下面に固定されるプラスチック製の下側カバー６とを含む。素電池２の左右幅寸法は３3.８mm、上下高さ寸法は４６mm、前後厚み寸法は4.５mmとした。 Example 1 FIGS. 1 to 6 show Example 1 of a battery pack targeted by the present invention. As shown in FIGS. 2 and 3, the battery pack 1 is a flat rectangular box-shaped unit cell. 2, an electrical component disposed on the upper side of the unit cell 2, a plastic upper cover 3 disposed on the upper side of the electrical unit, and a resin that integrates the electrical unit and the upper cover 3 on the upper surface of the unit cell 2. A mold 5 and a plastic lower cover 6 fixed to the lower surface of the unit cell 2 are included. The left-right width dimension of the unit cell 2 was 33.8 mm, the vertical height dimension was 46 mm, and the front-rear thickness dimension was 4.5 mm.

樹脂モールド５は、ポリアミド系樹脂またはポリエステル系樹脂で成形しており、電装品を外部から絶縁するとともに保護する。素電池２は、図２に示すごとく、上下高さ寸法および左右幅寸法に比べて前後厚み寸法が小さくなっている。素電池２は、外装缶７の内部に電極体と電解液とを封入してあり、充放電が可能な二次電池、具体的にはリチウムイオン電池からなる。素電池２は、外装缶７の上面を塞ぐ封口板９の中央に負極端子１０を有している。   The resin mold 5 is formed of a polyamide-based resin or a polyester-based resin, and insulates and protects electrical components from the outside. As shown in FIG. 2, the unit cell 2 has a smaller front-rear thickness dimension than a vertical height dimension and a left-right width dimension. The unit cell 2 has an electrode body and an electrolytic solution sealed inside an outer can 7 and is composed of a rechargeable secondary battery, specifically a lithium ion battery. The unit cell 2 has a negative electrode terminal 10 in the center of a sealing plate 9 that closes the upper surface of the outer can 7.

外装缶７は、アルミニウムまたはその合金からなる板材を深絞り加工して形成される。封口板９は、アルミニウム合金などの板材をプレス加工して形成される。電極体は、ＬｉＣｏＯ2 を正極活物質とする正極シートと、黒鉛を負極活物質とする負極シートとを樹脂製のセパレータを挟んで渦巻状に巻回してなり、全体が扁平状に押し潰し形成されている。 The outer can 7 is formed by deep drawing a plate material made of aluminum or an alloy thereof. The sealing plate 9 is formed by pressing a plate material such as an aluminum alloy. The electrode body is formed by spirally winding a positive electrode sheet using LiCoO 2 as a positive electrode active material and a negative electrode sheet using graphite as a negative electrode active material with a resin separator in between, and crushing the whole into a flat shape Has been.

電装品は、素電池２の上側に配されるＰＴＣ１１と、ＰＴＣ１１の上側に配される左右横長の回路基板１２とを含む。ＰＴＣ１１は、素電池２の充放電電流が設定値を越えたときに、その電流を強制的に減少させる。ＰＴＣ１１は、帯状の端子側リード線１３を介して負極端子１０に接続されるとともに、帯状の基板側リード線１５を介して回路基板１２に接続される。回路基板１２は、Ｌ字状に折り曲げた一対のリード板１６・１７を介して素電池２の封口板９に接続される。基板側リード線１５は、Ｕ字状に湾曲した状態で回路基板１２の左端部に接合される。   The electrical component includes a PTC 11 disposed on the upper side of the unit cell 2 and a horizontally long circuit board 12 disposed on the upper side of the PTC 11. When the charge / discharge current of the unit cell 2 exceeds the set value, the PTC 11 forcibly decreases the current. The PTC 11 is connected to the negative electrode terminal 10 via a strip-shaped terminal-side lead wire 13 and is connected to the circuit board 12 via a strip-shaped substrate-side lead wire 15. The circuit board 12 is connected to the sealing plate 9 of the unit cell 2 through a pair of lead plates 16 and 17 bent in an L shape. The board-side lead wire 15 is bonded to the left end portion of the circuit board 12 in a U-shaped curved state.

回路基板１２は、素電池２の充放電電流を制限する保護回路などを備えており、回路基板１２の上面の右側寄りには、外部接続端子１９・２０・２１が左右に並べて配されている。外部接続端子１９・２０・２１は、携帯電話や充電器などの外部機器の接触端子に接触接続して、素電池２への充放電電流の入出力などを行なう。回路基板１２の上面の左側寄りには、電池パック１の性能検査のための一対の検査用端子２２・２３が左右に並べて配されている。   The circuit board 12 includes a protection circuit for limiting the charging / discharging current of the unit cell 2, and external connection terminals 19, 20, and 21 are arranged side by side on the right side of the upper surface of the circuit board 12. . The external connection terminals 19, 20, and 21 are connected to contact terminals of an external device such as a mobile phone or a charger to input / output charge / discharge current to / from the unit cell 2. A pair of inspection terminals 22 and 23 for performance inspection of the battery pack 1 are arranged side by side on the left side of the upper surface of the circuit board 12.

リード線１３・１５およびリード板１６・１７は、アルミニウムやニッケルなどの導電性金属の薄シートを切断して形成される。素電池２の上側に前記電装品および上側カバー３を仮組みして、この中間組立品に樹脂モールド５が成形される。   The lead wires 13 and 15 and the lead plates 16 and 17 are formed by cutting a thin sheet of conductive metal such as aluminum or nickel. The electrical component and the upper cover 3 are temporarily assembled on the upper side of the unit cell 2, and the resin mold 5 is formed on the intermediate assembly.

上側カバー３の左右両端には、前記外部機器の位置決め用凸部に係合する切り欠き２５・２５をそれぞれ形成してある。上側カバー３は、外部接続端子１９・２０・２１に対面する３個の窓口２６・２７・２９と、前記検査用端子２２・２３に対面する２個の窓口３０・３１とを貫通状に設けてあり、窓口３０・３１の上面を塞ぐように水没判定シール３２が貼り付けられる。   Notches 25 and 25 are formed on the left and right ends of the upper cover 3 to engage with the positioning convex portions of the external device. The upper cover 3 is provided with three windows 26, 27, 29 facing the external connection terminals 19, 20, 21 and two windows 30, 31 facing the inspection terminals 22, 23 in a penetrating manner. A submergence determination seal 32 is attached so as to close the upper surfaces of the windows 30 and 31.

上側カバー３の左右両端部には、図１および図２に示すごとく所定寸法の位置決め突起３３・３３がそれぞれ下方に向けて突設してあり、図３および図４に示すごとく各位置決め突起３３の下端が素電池２の封口板９の上面にそれぞれ当接することで、上側カバー３と素電池２の上面との間隔が規制される。位置決め突起３３の上下寸法は２mmである。   As shown in FIGS. 1 and 2, positioning projections 33 and 33 having predetermined dimensions project downward from the left and right end portions of the upper cover 3, respectively. As shown in FIGS. Are in contact with the upper surface of the sealing plate 9 of the unit cell 2, so that the distance between the upper cover 3 and the upper surface of the unit cell 2 is regulated. The vertical dimension of the positioning projection 33 is 2 mm.

各位置決め突起３３は、図１に示すごとく前後幅（図１では上下）に比べて左右幅が小さい板状になっており、各位置決め突起３３の上下中間の前後縁には、四角の凹み状に形成した前後一対の凹部３５・３５がそれぞれ設けられる。この凹部３５・３５に樹脂モールド５が入り込んで、樹脂モールド５に対する上側カバー３の抜け止めが図られる。   As shown in FIG. 1, each positioning projection 33 has a plate shape with a smaller left-right width than the front-rear width (upper and lower in FIG. 1). A pair of front and rear recesses 35, 35 formed in the above are provided. The resin mold 5 enters the recesses 35 and 35 to prevent the upper cover 3 from coming off from the resin mold 5.

上側カバー３の下面には、図１および図４に示すごとく、回路基板１２が嵌め込まれる左右横長の基板嵌合部３６が凹み形成されている。基板嵌合部３６の左右中間には、両面テープ３７が嵌め込まれるテープ嵌合部３９が凹み形成されている。両面テープ３７によって上側カバー３が回路基板１２に貼り付けられる。素電池２の封口板９の上面には、図３および図５に示すごとく、左右中央付近から左端にかけて絶縁シール４０が配されており、この絶縁シール４０によってＰＴＣ１１や端子側リード線１３や基板側リード線１５が素電池２の封口板９に接触することを防いでいる。   As shown in FIGS. 1 and 4, left and right horizontally long board fitting portions 36 into which the circuit board 12 is fitted are formed on the lower surface of the upper cover 3. A tape fitting portion 39 into which a double-sided tape 37 is fitted is formed in the middle of the left and right sides of the board fitting portion 36. The upper cover 3 is attached to the circuit board 12 by the double-sided tape 37. As shown in FIGS. 3 and 5, an insulating seal 40 is arranged on the upper surface of the sealing plate 9 of the unit cell 2 from the vicinity of the center of the left and right to the left end. The side lead wire 15 is prevented from contacting the sealing plate 9 of the unit cell 2.

下側カバー６の下面には、図３に示すごとく、外部機器の嵌合部が嵌まり込む嵌合凹部４１が形成されている。下側カバー６の上面の左右両端には、図２に示すごとく、リング状の溝４２で囲まれた接着部４３がそれぞれ設けられており、下側カバー６の上面の左右中央部には、両面テープ４５が嵌め込まれるテープ嵌合部４６が凹み形成されている。接着部４３には、接着剤が塗布され、その接着剤と両面テープ４５とで下側カバー６が素電池２の下面に貼り付けられる。   As shown in FIG. 3, a fitting recess 41 into which a fitting portion of an external device is fitted is formed on the lower surface of the lower cover 6. As shown in FIG. 2, adhesive portions 43 surrounded by ring-shaped grooves 42 are respectively provided at the left and right ends of the upper surface of the lower cover 6. A tape fitting portion 46 into which the double-sided tape 45 is fitted is formed as a recess. An adhesive is applied to the adhesive portion 43, and the lower cover 6 is attached to the lower surface of the unit cell 2 with the adhesive and the double-sided tape 45.

素電池２の前後左右の周面は、図６に示すごとく、絶縁性を有するラベル４７が貼り付けられて覆われる。ラベル４７の外面には、所定のロゴタイプなどの印刷が施される。   The front, rear, left and right peripheral surfaces of the unit cell 2 are covered with an insulating label 47 as shown in FIG. A predetermined logo type or the like is printed on the outer surface of the label 47.

次に、前記中間組立品の組み立て要領を説明する。ＰＴＣ１１の一端に端子側リード線１３の一端を接合し、そのリード線１３の他端を負極端子１０に接合する。また、ＰＴＣ１１の他端に基板側リード線１５の一端を接合し、そのリード線１５の他端を回路基板１２の左端部に接合する。   Next, the assembly procedure of the intermediate assembly will be described. One end of the terminal-side lead wire 13 is joined to one end of the PTC 11, and the other end of the lead wire 13 is joined to the negative electrode terminal 10. Further, one end of the board-side lead wire 15 is joined to the other end of the PTC 11, and the other end of the lead wire 15 is joined to the left end portion of the circuit board 12.

回路基板１２の右端部にリード板１６を接合し、素電池２の封口板９の上面の右側寄りにリード板１７を接合する。基板側リード線１５をＵ字状に湾曲させて素電池２の上側に回路基板１２を配し、リード板１６とリード板１７とを接合する。上側カバー３に両面テープ３７を貼り付け、上側カバー３の基板嵌合部３６に回路基板１２を嵌め込んで、回路基板１２に上側カバー３を固定し、中間組立品を形成する。 A lead plate 16 is joined to the right end portion of the circuit board 12, and a lead plate 17 is joined to the right side of the upper surface of the sealing plate 9 of the unit cell 2. The circuit board 12 is arranged on the upper side of the unit cell 2 by bending the substrate-side lead wire 15 in a U shape, and the lead plate 16 and the lead plate 17 are joined. A double-sided tape 37 is affixed to the upper cover 3, the circuit board 12 is fitted into the board fitting portion 36 of the upper cover 3, and the upper cover 3 is fixed to the circuit board 12 to form an intermediate assembly.

この中間組立品を樹脂モールド５の成形用金型内に装着することで、金型の内面で上側カバー３が押されて、各位置決め突起３３の下端が素電池２の封口板９の上面にそれぞれ当接し、上側カバー３と素電池２の上面との間隔が規制される。この状態で、上側カバー３と素電池２の上面との間に樹脂モールド５が成形される。   By mounting this intermediate assembly in the molding die of the resin mold 5, the upper cover 3 is pushed by the inner surface of the die, and the lower end of each positioning projection 33 is placed on the upper surface of the sealing plate 9 of the unit cell 2. Each contact | abuts, and the space | interval of the upper cover 3 and the upper surface of the unit cell 2 is controlled. In this state, the resin mold 5 is formed between the upper cover 3 and the upper surface of the unit cell 2.

この後、下側カバー６の各接着部４３に接着剤が塗布され、その接着剤と両面テープ４５とで下側カバー６が素電池２の下面に貼り付けられる。素電池２の前後左右の周面には、ラベル４７が貼り付けられ、また上側カバー３の上面には、水没判定シール３２が貼り付けられる。   Thereafter, an adhesive is applied to each adhesive portion 43 of the lower cover 6, and the lower cover 6 is attached to the lower surface of the unit cell 2 with the adhesive and the double-sided tape 45. A label 47 is affixed to the front, rear, left and right peripheral surfaces of the unit cell 2, and a submergence determination seal 32 is affixed to the upper surface of the upper cover 3.

（実施例２） 実施例２では、上側カバー３を回路基板１２に貼り付けるための両面テープ３７およびテープ嵌合部３９に代えて、図７に示すごとく、上側カバー３の前後の縁であってその左右の端寄りに、それぞれ係止部５０を下方に向けて突設してある。 (Example 2) In Example 2, instead of the double-sided tape 37 and the tape fitting part 39 for attaching the upper cover 3 to the circuit board 12, as shown in FIG. Locking portions 50 project downward from the left and right ends of the lever.

各係止部５０は、図８に示すごとく、基板嵌合部３６の上側に被さるようにフック状に形成されており、係止部５０によって上側カバー３を回路基板１２に嵌合固定する。つまり、上側カバー３の下面側を回路基板１２に押し付けることで、各係止部５０を押しのけるようにして回路基板１２が基板嵌合部３６内に嵌まり込む。すると、各係止部５０が、図８の状態に復元して回路基板１２の下面に引っ掛かり、これによって上側カバー３を回路基板１２に固定する。   As shown in FIG. 8, each locking part 50 is formed in a hook shape so as to cover the upper side of the board fitting part 36, and the upper cover 3 is fitted and fixed to the circuit board 12 by the locking part 50. In other words, by pressing the lower surface side of the upper cover 3 against the circuit board 12, the circuit board 12 is fitted into the board fitting portion 36 so as to push the respective locking portions 50. Then, each locking portion 50 is restored to the state of FIG. 8 and is hooked on the lower surface of the circuit board 12, thereby fixing the upper cover 3 to the circuit board 12.

なお、各係止部５０における基板嵌合部３６側の面はテーパ状に傾斜している。その他の点は、実施例１と同じであるので説明を省略する。   In addition, the board | substrate fitting part 36 side surface in each latching | locking part 50 inclines in the taper shape. Since the other points are the same as those of the first embodiment, description thereof is omitted.

前記各実施例において、基板嵌合部３６の内面と回路基板１２との間の隙間は、小さいほうが好ましく、0.１mm以下であることが好ましい。   In each of the above embodiments, the gap between the inner surface of the board fitting portion 36 and the circuit board 12 is preferably small, and is preferably 0.1 mm or less.

実施例１の電池パックの上側カバーの斜視図The perspective view of the upper cover of the battery pack of Example 1 実施例１の電池パックの中間組立品の分解斜視図1 is an exploded perspective view of an intermediate assembly of a battery pack of Example 1. FIG. 実施例１の電池パックの縦断正面図Vertical front view of the battery pack of Example 1 実施例１の電池パックの要部を示す縦断正面図A longitudinal front view showing a main part of the battery pack of Example 1 図３のＡ−Ａ線断面図AA line sectional view of FIG. 実施例１の電池パックの正面図Front view of the battery pack of Example 1 実施例２の電池パックの上側カバーの斜視図The perspective view of the upper cover of the battery pack of Example 2 実施例２の上側カバーの縦断側面図Vertical side view of the upper cover of Example 2

符号の説明Explanation of symbols

１ 電池パック
２ 素電池
３ 上側カバー
５ 樹脂モールド
１２ 回路基板
１９・２０・２１ 外部接続端子
２６・２７・２９ 窓口
３６ 基板嵌合部
４５ 両面テープ
４６ テープ嵌合部
５０ 係止部 DESCRIPTION OF SYMBOLS 1 Battery pack 2 Unit cell 3 Upper cover 5 Resin mold 12 Circuit board 19/20/21 External connection terminal 26/27/29 Window 36 Board fitting part 45 Double-sided tape 46 Tape fitting part 50 Locking part

Claims (2)

内部に電極体と電解液とを収容した外装缶の上面を封口板で塞いでなる素電池と、素電池の上側に配される回路基板と、その回路基板の上側に配される上側カバーと、前記上側カバーと前記素電池の上面（封口板が位置する側の面）との間に成形されて前記回路基板および前記上側カバーを前記素電池の上面に一体化する樹脂モールドとを含み、
前記回路基板の上面に外部接続端子が配されており、
前記上側カバーは、前記外部接続端子に対面する窓口を貫通状に設けてあり、
前記上側カバーの下面に、前記回路基板が嵌め込まれる基板嵌合部が凹み形成されており、
前記基板嵌合部内の上面（前記基板嵌合部の内面であって、当該基板嵌合部に嵌め込まれる前記回路基板の板面と対向する面）に、両面テープが嵌め込まれるテープ嵌合部が凹み形成されており、
前記両面テープによって前記上側カバーを前記回路基板の上面に固定することを特徴とする電池パック。 A unit cell in which an upper surface of an outer can containing an electrode body and an electrolyte solution is sealed with a sealing plate, a circuit board disposed on the upper side of the unit cell, and an upper cover disposed on the upper side of the circuit board; A resin mold that is molded between the upper cover and the upper surface of the unit cell ( the surface on which the sealing plate is located) and integrates the circuit board and the upper cover with the upper surface of the unit cell,
External connection terminals are arranged on the upper surface of the circuit board,
The upper cover is provided with a window facing the external connection terminal in a penetrating manner,
A board fitting portion into which the circuit board is fitted is formed in a recess on the lower surface of the upper cover ,
A tape fitting portion in which a double-sided tape is fitted on an upper surface in the board fitting portion (the inner surface of the board fitting portion and facing the plate surface of the circuit board fitted in the substrate fitting portion) A dent is formed,
Battery pack characterized that you fix the upper cover on the upper surface of the circuit board by the double-sided tape. 内部に電極体を電解液とを収容した外装缶の上面を封口板で塞いでなる素電池と、素電池の上側に配される回路基板と、その回路基板の上側に配される上側カバーと、前記上側カバーと前記素電池の上面（封口板が位置する側の面）との間に成形されて前記回路基板および前記上側カバーを前記素電池の上面に一体化する樹脂モールドとを含み、
前記回路基板の上面に外部接続端子が配されており、
前記上側カバーは、前記外部接続端子に対面する窓口を貫通状に設けてあり、
前記上側カバーの下面に、前記回路基板が嵌め込まれる基板嵌合部が凹み形成されており、
前記上側カバーの下面に係止部を設けてあり、
前記回路基板が前記基板嵌合部に嵌め込まれた状態で、前記係止部によって前記上側カバーを前記回路基板に固定することを特徴とする電池パック。 A unit cell in which an upper surface of an outer can containing an electrode body containing an electrolytic solution is closed with a sealing plate, a circuit board disposed on the upper side of the unit cell, and an upper cover disposed on the upper side of the circuit board; A resin mold that is molded between the upper cover and the upper surface of the unit cell (the surface on which the sealing plate is located) and integrates the circuit board and the upper cover with the upper surface of the unit cell,
External connection terminals are arranged on the upper surface of the circuit board,
The upper cover is provided with a window facing the external connection terminal in a penetrating manner,
A board fitting portion into which the circuit board is fitted is formed in a recess on the lower surface of the upper cover,
A locking portion is provided on the lower surface of the upper cover,
Wherein the circuit while the substrate is fitted to the substrate fitting portions, a battery pack, characterized by fixing the upper cover to the circuit board by the locking portion.
JP2005153132A 2005-05-25 2005-05-25 Battery pack Expired - Fee Related JP4548663B2 (en)

Priority Applications (5)

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JP2005153132A JP4548663B2 (en) 2005-05-25 2005-05-25 Battery pack
KR1020077027276A KR101233261B1 (en) 2005-05-25 2006-05-02 Battery pack
CN2006800140091A CN101167198B (en) 2005-05-25 2006-05-02 Battery pack
US11/884,355 US20100143793A1 (en) 2005-05-25 2006-05-02 Battery Pack
PCT/JP2006/309154 WO2006126379A1 (en) 2005-05-25 2006-05-02 Battery pack

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