JP4443694B2 - Support base for semiconductor device having wiring pattern and liquid crystal display device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a support base for a semiconductor device having a wiring pattern and a liquid crystal display device, and more particularly to a semiconductor device in which a wiring pattern comprising a plurality of wirings connecting two device components is formed on a substrate such as a film. It is suitable for use as a support substrate.
[0002]
[Prior art]
With the miniaturization of devices, elements necessary for circuit configuration are often integrated and mounted on the same substrate. In this case, in order to electrically connect the two elements, a so-called tape carrier in which a plurality of wirings formed on a polyimide film that can be reduced in size and thickness is used. A package in which a bare chip IC is mounted on the tape carrier is referred to as a tape carrier package (TCP).
[0003]
Generally, a tape carrier package on which a driver IC for driving a TFT (thin film transistor) of a liquid crystal display unit is mounted is used for a liquid crystal display device. FIG. 2 is a plan view showing the overall configuration of the tape carrier package 1. One end of the tape carrier package 1 is connected to a printed circuit board on which a wiring circuit is formed, and the other end is connected to a liquid crystal display substrate.
[0004]
As shown in FIG. 2, a driver IC 3 is mounted at a substantially central portion on a polyimide film 2 (hereinafter abbreviated as “film”), between the output side of the driver IC 3 and the liquid crystal display substrate connecting portion 4, and the input of the driver IC 3 A wiring pattern composed of a plurality of wirings is formed between the side and the printed circuit board connecting portion 5.
[0005]
With this wiring pattern, a plurality of output terminal electrodes on the driver IC 3 and a plurality of terminal electrodes on the transistor matrix of the liquid crystal display substrate are connected, and a plurality of input terminal electrodes on the driver IC 3 and a plurality of printed circuit boards are connected. To the terminal electrode. In FIG. 2, only the wiring pattern 6 between the output side of the driver IC 3 and the liquid crystal display substrate connecting portion 4 is shown.
[0006]
In particular, the terminal on the driver IC 3 connection side is referred to as an inner lead, and the terminal on the liquid crystal display substrate connection side is referred to as an outer lead, but the inner lead is smaller than the entire length l ₁ where the outer lead is disposed as shown in the figure. Since the entire length l ₂ to be arranged is shorter, the pitch P _i between the inner leads and the pitch P _o between the outer leads are usually different due to the relationship P _i <P _o . Therefore, the wiring pattern 6 on the film 2 is bent for pitch conversion.
[0007]
FIG. 4 is a plan view showing the configuration of the central portion (A portion) of the region where the wiring pattern 6 shown in FIG. 2 is formed. In general, the size and the horizontal pitch of the terminal electrodes of the driver IC 3 are different from the size and the horizontal pitch of the terminal electrodes of the liquid crystal display substrate connecting portion 4, so that the width and alignment of the wiring patterns on each side are different. The pitches P _i and P _o are also different. For this reason, in the connection region where the mutual wirings 41 and 42 extending directly from the terminal electrode meet each other, the non-parallel portion (bending portion) 43 allows the mutual wiring 41 and 42 to be converted from one pitch to the other pitch. 42 is connected.
[0008]
The wiring pattern in the bent portion 43 is more suitable for reducing the size of the tape carrier package 1 if the wiring pattern is symmetrical with respect to the center line 10 in the length direction of the driver IC 3 as a reference axis. However, in this case, since the length of the diagonal wiring in the bent portion 43 becomes shorter in order from the outside of the tape carrier toward the inner reference axis, the wiring in the central portion 44 closest to the reference axis is the bent portion. It is the shortest of all 43 wirings. The central portion 44 is also a portion where the direction of bending is different from the adjacent line and is discontinuous.
[0009]
[Problems to be solved by the invention]
By the way, in order to guarantee the quality of the liquid crystal display device, the liquid crystal display device including the tape carrier is subjected to a temperature cycle test. In addition, after the printed board or the liquid crystal display board is attached to the tape carrier, the connector is attached to or detached from the printed board at the time of incorporation into the final device. In such a case, a tensile stress is applied to the tape carrier thermally or mechanically.
[0010]
In this way, when thermal or mechanical tensile stress is applied to the tape carrier from the outside, the slanted wiring length is the shortest and the bending direction of the bending portion 43 where the bending direction is discontinuous with respect to the adjacent line is as follows. Stress is intensively applied to the central portion 44, which is one factor that causes the wiring to break. The process up to the disconnection is considered to occur in the following order.
[0011]
1) First, external stress is applied to the tape carrier.
2) Concentrated stress is applied to a part of the wiring pattern.
3) The wiring pattern in the portion where concentrated stress is applied tends to be deformed.
4) Cracks occur in the resist that cannot withstand deformation (which is applied to the wiring pattern surface of the tape carrier for the purpose of insulating the wiring pattern and protecting the wiring).
5) Further concentrated stress is applied to the cracked portion, resulting in disconnection.
[0012]
The present invention has been made to solve such a problem, and it is intended to improve resistance to external stress of wiring formed on a film of a tape carrier and to suppress occurrence of disconnection. Objective.
[0013]
[Means for Solving the Problems]
A support base of a semiconductor device having a wiring pattern according to the present invention is a wiring pattern in which a wiring pattern comprising a plurality of wirings connecting between a first connection terminal group and a second connection terminal group is formed on a substrate. And at least one wiring in the vicinity of the wiring having the shortest wiring length at the bent portion of the plurality of wirings is the pitch of the first connection terminal group and the second connection terminal. The wiring width of the wiring corresponding to the larger one of the pitches of the group remains the same, and is arranged on the substrate between the first connection terminal group and the second connection terminal group. In addition, the other wirings except the at least one wiring have different wiring widths from the first connection terminal group to the bent portion and wiring widths from the bent portion to the second connection terminal group. It is configured.
In another aspect of the support base of the semiconductor device having the wiring pattern of the present invention, a wiring pattern comprising a plurality of wirings connecting between the first connection terminal group and the second connection terminal group is formed on the substrate. In addition, in the support base of the semiconductor device having a wiring pattern, at least one wiring in the vicinity of the wiring having the shortest wiring length in the bent portion of the plurality of wirings is the first connection terminal group and the second wiring. The other wiring except for the at least one wiring is configured with a wiring width from the first connecting terminal group to the bent portion and the bent. The wiring width from the first connection terminal group to the second connection terminal group is different, and at least one other wiring adjacent to the at least one wiring is a dummy wiring.
According to another aspect of the support substrate of the semiconductor device having the wiring pattern of the present invention, the first connection terminal group and the second connection terminal group are different from each other due to the difference in pitch between the first connection terminal group and the second connection terminal group. A wiring pattern in which a plurality of wires connected to the second connection terminal group are bent at an intermediate bent portion is formed on the substrate, and the inclination of the wiring at the bent portion is not continuous with a certain boundary line as a boundary. In the support substrate of the semiconductor device having a wiring pattern, at least one wiring in the vicinity of the boundary line has a larger pitch among the pitch of the first connection terminal group and the pitch of the second connection terminal group. The wiring width of the wiring corresponding to the direction is arranged on the substrate between the first connecting terminal group and the second connecting terminal group, and the at least one wiring is Other arrangements except It is configured differently and wiring width of the wiring width and the bending portion from the first connecting terminal groups to the bending portion to the second connection terminal group.
The liquid crystal display device of the present invention comprises a support base of a semiconductor device having an upper Symbol wiring pattern, and a liquid crystal panel having a liquid crystal display substrate connected thereto via the first or second connecting terminal groups.
[0014]
According to the present invention configured as described above, at least one wiring in the vicinity of the wiring having the shortest wiring length in the bent portion is arranged with a large line width or without bending, so that it is externally provided. The portion where the stress is easily applied in a concentrated manner has strong rigidity, and the stress resistance when a mechanical stress or a tensile stress due to heat is generated in the wiring direction is improved .
[0015]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a plan view showing an example of a wiring pattern according to the present embodiment. This wiring pattern shows the configuration of the central portion (A portion) of the region where the wiring pattern 6 shown in FIG. 2 is formed. In the present embodiment, a first connection terminal group is configured by a plurality of input terminals of the driver IC 3, and a second connection terminal group is configured by a plurality of output terminals of the liquid crystal display substrate connection unit 4.
[0016]
As described above, the size and the horizontal pitch of the terminal electrodes of the driver IC 3 in FIG. 2 are different from the size and the horizontal pitch of the terminal electrodes of the liquid crystal display substrate connecting portion 4, so that the wiring on each side The pattern width and the array pitches P _i and P _o are also different. Therefore, in the connection region where the mutual wirings 13 and 14 extending directly from the terminal electrode meet, the mutual wirings 13 and 14 are formed by the diagonal wirings of the bent portion 15 in order to convert from one pitch to the other pitch. Is connected.
[0017]
In the present embodiment, the wiring pattern in the bent portion 15 is a symmetrical wiring pattern with the vicinity of the center line 10 with respect to the length direction of the driver IC 3 as a reference axis. Further, the innermost two left and right wirings 11 and 11 in which the diagonal wiring length is the shortest at the bent portion 15 are not provided with the bent wiring portion with the thick line width d of the outer lead, and from the outer lead to the inner lead. It is arranged linearly up to the vicinity of the lead.
[0018]
As described above, when the innermost wirings 11 and 11 are linearly arranged to the vicinity of the inner lead while maintaining the line width d of the outer lead, the plurality of wirings 13 are not arranged at equal intervals in the vicinity of the inner lead. Therefore, when the terminal electrodes are arranged at equal intervals on the driver IC 3, the pitch of the terminal electrodes of the driver IC 3 is changed from the pitch of the wiring 13 so that the pitch of the non-uniform intervals of the wiring 13 is equal. It is necessary to provide a bent portion (not shown) for converting into the bent portion 15 separately from the bent portion 15.
[0019]
In the present embodiment, this other bent portion is provided in the protective potting resin region of the driver IC 3. That is, as shown in the tape carrier package 1 of FIG. 2, in order to fix the driver IC 3 on the film 2, the protective potting resin 7 for giving strength to the film 2 borders the periphery of the driver IC 3. Is provided. Further, as shown in FIG. 3, the protective potting resin 8 is also attached to the back side of the portion where the driver IC 3 is mounted in the tape carrier package 1.
[0020]
Therefore, by providing a bent portion in the region of the protective potting resins 7 and 8 for converting the pitches of the innermost wires 11 and 11 and the surrounding wires, the tape carrier is thermally or mechanically pulled from the outside. Even if stress is applied, the wiring at the bent portion is protected by the protective potting resins 7 and 8, so that disconnection can be prevented.
[0021]
As described above in detail, in the present embodiment, the innermost two left and right wirings 11, 11 arranged with the reference axis serving as the left / right symmetrical boundary in the bent portion 15 are connected to the thick line width d of the outer lead. As it is arranged straight up to the vicinity of the inner lead without bending, it is compared with other wiring on the wiring pattern 6 when the tensile stress in the wiring direction is generated from the outside with respect to the tape carrier. Resistance can be improved.
[0022]
In addition, for the adjacent wirings 12 and 12 in contact with the innermost wirings 11 and 11, diagonal wiring is provided in the region of the bent portion 15, and the diagonal wiring length is shown in FIG. It is longer than the diagonal wiring length in the non-continuous portion 44. Further, the oblique wiring at the bent portion 15 of the wirings 12 and 12 is also affected by the strong stress resistance of the wirings 11 and 11 adjacent thereto, and the resistance to stress applied from the outside is improved.
[0023]
As a result, when mechanical stress or thermal stress is applied to the tape carrier from the outside, it is possible to sufficiently resist concentrated stress applied to the wiring near the center, and reliability against disconnection can be improved. Improvements can be made.
[0024]
Further, in the present embodiment, the bent portions for converting the pitch of the innermost wires 11 and 11 and the surrounding wires in accordance with the pitch of the terminal electrodes of the driver IC 3 are provided in the region of the protective potting resins 7 and 8. Since the protective potting resins 7 and 8 are provided, the bent portions can have sufficient resistance against externally applied stress.
[0025]
The results of verifying the wiring resistance to tensile stress by the finite element method for the wiring pattern shown in FIG. The structure of the verification model is based on the polyimide film 2 and the copper foil wiring pattern 6 is in close contact therewith. In addition, as a constraint condition for the verification model, tensile stress is applied at the upper part (printed circuit board connecting part 5 side) in FIG. 1, and only the degree of freedom for vertical movement is provided at the lower part (liquid crystal display board connecting part 4 side). It is a restraint.
[0026]
In such a verification model, when the wiring widths of the innermost two wirings 11 and 11 across the reference axis are thickened consistently on the outer lead side and the inner lead side as shown in FIG. The concentrated stress moves to the bent portions of the wirings 12 and 12 adjacent to the wirings 11 and 11. If the value of the concentrated stress applied to the wiring in the central portion 44 is 100 in a normal wiring pattern as shown in FIG. 4 in which the width of the two central wirings is not increased, the concentration stress applied to the bent portions of the wirings 12 and 12 in FIG. The value was 52.46, which was reduced to about half. Thereby, it was confirmed that about twice the conventional resistance against the stress applied to the tape carrier from the outside can be obtained.
[0027]
In the above-described embodiment, the innermost two wirings 11 and 11 closest to the reference axis are provided in a straight line without providing a bent wiring part with a thick line width, but are necessarily two. There is no need, and at least one wiring having such a structure is sufficient. Further, four or more wirings including the wirings 12 and 12 adjacent to the innermost wirings 11 and 11 may be configured in the same manner as the wirings 11 and 11 described above.
[0028]
Moreover, in the said embodiment, as shown in FIG. 2, although illustrated about the wiring pattern 6 between the output side of driver IC3, and the liquid crystal display substrate connection part 4, the input side of driver IC3 and a printed circuit board connection part are illustrated. Similarly, the present invention can be applied to a wiring pattern between 5. In this case, a plurality of input terminals of the driver IC 3 constitute a first connection terminal group, and a plurality of output terminals of the printed circuit board connection unit 5 constitute a second connection terminal group.
[0029]
In the above embodiment, the bent portion for converting the pitch of the wiring 13 on the inner lead side to the pitch of the terminal electrode of the driver IC 3 is provided in the region of the protective potting resins 7 and 8. When the terminal electrodes are not arranged at equal intervals and the pitch of the wiring 13 can be used as it is, it is not always necessary to provide the bent portion.
[0030]
Moreover, in the said embodiment, although the example which applied this invention with respect to the tape carrier of a liquid crystal display device is shown, this invention is not limited to this. For example, the present invention can be applied to a tape carrier of a microprocessor unit used in a notebook personal computer or the like. Further, the present invention can also be applied to other FPC (Flexible Printed Circuits) in which a wiring pattern made of a conductive material is formed on a thin film-like surface having both insulating properties and flexibility.
[0031]
The two wirings 12 and 12 adjacent to the innermost wirings 11 and 11 may be dummy wirings that are not used as signal lines at all. In this way, the wirings 12 and 12 having the shortest diagonal wiring length in the bent portion 15 shown in FIG. 1 are used as dummy wirings, so that even if the wirings 12 and 12 are disconnected due to the application of external stress. The semiconductor device can be operated as usual, and a guarantee in the event of an emergency can be obtained.
[0032]
The wirings 12 and 12 may be provided with no wiring, and this portion may be blank. However, when the tape carrier and the glass substrate of the liquid crystal display unit are bonded using conductive particles, In order to improve the adhesiveness, it is preferable that dummy wirings are provided and the widths of the respective wirings are arranged at equal intervals.
[0033]
The various aspects of the present invention are summarized as follows.
(1) In a support base of a semiconductor device having a wiring pattern in which a wiring pattern composed of a plurality of wirings connecting between a first connection terminal group and a second connection terminal group is formed on a substrate,
At least one wiring in the vicinity of the wiring having the shortest wiring length at the bent portion of the plurality of wirings, the larger of the pitch of the first connection terminal group and the pitch of the second connection terminal group A support base for a semiconductor device having a wiring pattern, wherein the wiring width of the wiring corresponding to 1 is maintained on a substrate between the first connection terminal group and the second connection terminal group.
[0034]
(2) In a support base of a semiconductor device having a wiring pattern in which a wiring pattern composed of a plurality of wirings connecting between the first connection terminal group and the second connection terminal group is formed on a substrate,
Without providing a bent portion between the first connection terminal group and the second connection terminal group, at least one wire in the vicinity of the wiring having the shortest wiring length in the bent portion of the plurality of wirings. A support base of a semiconductor device having a wiring pattern characterized by being arranged.
[0035]
(3) The wiring according to (1) or (2), wherein the bent portion of the at least one wiring is provided in a potting resin region for protecting the first connection terminal group. A support base of a semiconductor device having a pattern.
(4) The semiconductor having a wiring pattern according to any one of (1) to (3), wherein at least one other wiring adjacent to the at least one wiring is a dummy wiring. Support substrate for the device.
(5) The support base of the semiconductor device is a tape carrier in which a wiring pattern composed of a plurality of wirings connecting the first connection terminal group and the second connection terminal group is formed on a film. A support base for a semiconductor device having the wiring pattern according to any one of (1) to (4) above.
[0036]
(6) Due to the difference between the pitch of the first connection terminal group and the pitch of the second connection terminal group, a plurality of wirings connecting the first connection terminal group and the second connection terminal group are halfway. In a support base of a semiconductor device having a wiring pattern formed on a substrate, the wiring pattern being bent at the bent portion, and having a wiring pattern in which the inclination of the wiring at the bent portion becomes discontinuous with respect to a certain boundary line,
At least one wiring in the vicinity of the boundary line is kept in the wiring width of the wiring corresponding to the larger one of the pitch of the first connection terminal group and the pitch of the second connection terminal group. A support base for a semiconductor device having a wiring pattern, wherein the support base is disposed on a substrate between one connection terminal group and the second connection terminal group.
[0037]
(7) A support base according to (1) or (2) above, and a liquid crystal panel having a liquid crystal display substrate connected thereto via the first or second connection terminal group. A liquid crystal display device.
[0038]
【The invention's effect】
According to the present invention, at least one wire of wire around the wiring length becomes shortest at the bent portion of the plurality of wires, of the pitch of first pitch and the second connecting terminal groups of the connecting terminal groups Since wiring is arranged with the wiring width corresponding to the one having the larger pitch (or arranged without providing a bent portion between the first connection terminal group and the second connection terminal group) , the stress from the outside It is possible to impart strong rigidity to the portion where the slabs are intensively applied, and it is possible to improve the stress resistance when mechanical stress or tensile stress due to heat is applied. Thereby, generation | occurrence | production of the disconnection resulting from the stress from the outside can be suppressed.
[Brief description of the drawings]
FIG. 1 is a plan view illustrating an example of a wiring pattern according to an embodiment.
FIG. 2 is a plan view showing the overall configuration of the tape carrier package.
FIG. 3 is a back view showing the overall configuration of the tape carrier package.
FIG. 4 is a plan view showing an example of a conventional wiring pattern.
[Explanation of symbols]
1 Tape carrier package 2 Polyimide film 3 Driver IC
4 Liquid crystal display board connection part 5 Printed circuit board connection part 6 Wiring pattern 7, 8 Protective potting resin 11 Innermost wiring 12 Wiring adjacent to innermost wiring 13 Driver IC side (inner lead side) wiring 14 Liquid crystal display board side (Outer lead side) Wiring 15 Bend

Claims (5)

In a support base of a semiconductor device having a wiring pattern, wherein a wiring pattern comprising a plurality of wirings connecting between the first connection terminal group and the second connection terminal group is formed on a substrate.
At least one wiring in the vicinity of the wiring having the shortest wiring length at the bent portion of the plurality of wirings has a larger pitch between the pitch of the first connection terminal group and the pitch of the second connection terminal group. The wiring width of the wiring corresponding to the direction is arranged on the substrate between the first connection terminal group and the second connection terminal group,
The wiring other than the at least one wiring is configured such that the wiring width from the first connection terminal group to the bent portion is different from the wiring width from the bent portion to the second connection terminal group. A support base for a semiconductor device having a wiring pattern. In a support base of a semiconductor device having a wiring pattern, wherein a wiring pattern comprising a plurality of wirings connecting between the first connection terminal group and the second connection terminal group is formed on a substrate.
At least one wiring near the wiring having the shortest wiring length in the bent portion of the plurality of wirings is provided without a bent portion between the first connection terminal group and the second connection terminal group. Configured, and
The wiring other than the at least one wiring is configured such that the wiring width from the first connection terminal group to the bent portion is different from the wiring width from the bent portion to the second connection terminal group. and,
A support base for a semiconductor device having a wiring pattern, wherein at least one of the other wirings adjacent to the at least one wiring is a dummy wiring . 2. The support base for a semiconductor device having a wiring pattern according to claim 1 , wherein at least one other wiring adjacent to the at least one wiring is a dummy wiring. A plurality of wires connecting between the first connection terminal group and the second connection terminal group due to the difference between the pitch of the first connection terminal group and the pitch of the second connection terminal group are bent portions in the middle. In the support base of the semiconductor device having a wiring pattern, the wiring pattern bent at the above is formed on the substrate, and the inclination of the wiring at the bent portion is discontinuous at a certain boundary line,
At least one wiring in the vicinity of the boundary line has the wiring width of the wiring corresponding to the larger one of the pitch of the first connection terminal group and the pitch of the second connection terminal group. And arranged on a substrate between one connection terminal group and the second connection terminal group,
The wiring other than the at least one wiring is configured such that the wiring width from the first connection terminal group to the bent portion is different from the wiring width from the bent portion to the second connection terminal group. A support base for a semiconductor device having a wiring pattern.   5. A support base of a semiconductor device having the wiring pattern according to claim 1, and a liquid crystal panel having a liquid crystal display substrate connected to the support base via the first or second connection terminal group. A liquid crystal display device comprising:

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