JP4167715B1 - ツインチップ搭載型ダイオード - Google Patents
ツインチップ搭載型ダイオード Download PDFInfo
- Publication number
- JP4167715B1 JP4167715B1 JP2007210589A JP2007210589A JP4167715B1 JP 4167715 B1 JP4167715 B1 JP 4167715B1 JP 2007210589 A JP2007210589 A JP 2007210589A JP 2007210589 A JP2007210589 A JP 2007210589A JP 4167715 B1 JP4167715 B1 JP 4167715B1
- Authority
- JP
- Japan
- Prior art keywords
- diode
- lead
- terminal board
- chip
- joined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H10W70/481—
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
- H02S40/30—Electrical components
- H02S40/34—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
- H02S40/345—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes with cooling means associated with the electrical connection means, e.g. cooling means associated with or applied to the junction box
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- H10W72/60—
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- H10W90/811—
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/40247—Connecting the strap to a bond pad of the item
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- H10W72/076—
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- H10W72/07631—
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- H10W72/07636—
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- H10W72/5366—
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- H10W72/631—
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- H10W74/00—
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- H10W90/00—
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- H10W90/756—
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- H10W90/763—
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- H10W90/766—
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Photovoltaic Devices (AREA)
Abstract
【解決手段】 共通の端子板に接合されるためのリード足をチップごとに有するツインチップ搭載型ダイオードにおいて、各チップから出て各リード足の接合される部分までの間で互いに電気的に接続される構成を有することを特徴とするダイオード。電気的に接続される構成は各リード足の一体成型によって達成されることが好ましい。
【選択図】 図2
Description
Claims (5)
- 一つのフレームに二つのチップが搭載され、これらのチップごとにリード足を有するツインチップ搭載型ダイオードであって、各リード足が同極の共通の端子板に接合されるものにおいて、一方のリード足の端子板への接合部分に欠陥が生じても端子板からの電流が他方のリード足を経て両方のチップに伝達されるように各チップから出て各リード足の接合される部分までの間でリード足が互いに電気的に接続される構成を有することを特徴とするダイオード。
- 電気的に接続される構成が、各リード足の一体成型によって達成されることを特徴とする請求項1に記載のダイオード。
- 請求項1又は2に記載のダイオード、及び端子板を含む端子板回路であって、ダイオードの各リード足が同極の共通の端子板に接合され、一方のリード足の端子板への接合部分に欠陥が生じても端子板からの電流が他方のリード足を経て両方のチップに伝達されることを特徴とする端子板回路。
- 端子板がダイオードから発生した熱を十分に放散できるように拡大されていることを特徴とする請求項3に記載の端子板回路。
- 請求項3又は4に記載の端子板回路を含むことを特徴とする太陽電池パネル用端子箱。
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007210589A JP4167715B1 (ja) | 2007-08-13 | 2007-08-13 | ツインチップ搭載型ダイオード |
| US12/513,490 US8237065B2 (en) | 2007-08-13 | 2008-01-25 | Twin-chip-mounting type diode |
| CN2008800009460A CN101548380B (zh) | 2007-08-13 | 2008-01-25 | 双芯片搭载型二极管 |
| PCT/JP2008/000094 WO2009022441A1 (ja) | 2007-08-13 | 2008-01-25 | ツインチップ搭載型ダイオード |
| EP08710298.4A EP2077579A4 (en) | 2007-08-13 | 2008-01-25 | CHIP MOUNTED DOUBLE DIODE |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007210589A JP4167715B1 (ja) | 2007-08-13 | 2007-08-13 | ツインチップ搭載型ダイオード |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP4167715B1 true JP4167715B1 (ja) | 2008-10-22 |
| JP2009044107A JP2009044107A (ja) | 2009-02-26 |
Family
ID=39985850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007210589A Expired - Fee Related JP4167715B1 (ja) | 2007-08-13 | 2007-08-13 | ツインチップ搭載型ダイオード |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8237065B2 (ja) |
| EP (1) | EP2077579A4 (ja) |
| JP (1) | JP4167715B1 (ja) |
| CN (1) | CN101548380B (ja) |
| WO (1) | WO2009022441A1 (ja) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013143519A (ja) | 2012-01-12 | 2013-07-22 | Fuji Electric Co Ltd | 接続子および樹脂封止型半導体装置 |
| DE112015006979B4 (de) * | 2015-09-28 | 2021-02-25 | Mitsubishi Electric Corporation | Halbleitervorrichtung |
| CN205336219U (zh) * | 2015-12-08 | 2016-06-22 | 泰科电子(上海)有限公司 | 光伏接线盒和二极管 |
| CN105790704A (zh) * | 2016-06-03 | 2016-07-20 | 浙江人和光伏科技有限公司 | 太阳能电池用接线盒 |
| CN105871328A (zh) * | 2016-06-03 | 2016-08-17 | 浙江人和光伏科技有限公司 | 一种太阳能电池用接线盒 |
| US11107761B2 (en) * | 2018-02-06 | 2021-08-31 | Denso Corporation | Semiconductor device |
| JP2019186403A (ja) | 2018-04-11 | 2019-10-24 | トヨタ自動車株式会社 | 半導体装置 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH021862Y2 (ja) * | 1985-12-06 | 1990-01-17 | ||
| JPH0176059U (ja) * | 1987-11-10 | 1989-05-23 | ||
| JP3120575B2 (ja) * | 1992-06-29 | 2000-12-25 | 富士電機株式会社 | 半導体装置 |
| KR20000026245A (ko) * | 1998-10-19 | 2000-05-15 | 윤종용 | 도선테 |
| JP2001135847A (ja) * | 1999-11-05 | 2001-05-18 | Kanegafuchi Chem Ind Co Ltd | 半導体装置及びこれを備えた端子ボックス |
| JP3871587B2 (ja) * | 2002-03-18 | 2007-01-24 | 日本インター株式会社 | 樹脂封止型半導体装置 |
| JP3744458B2 (ja) * | 2002-04-10 | 2006-02-08 | 住友電装株式会社 | 太陽電池モジュール用端子ボックス装置 |
| JP2004207618A (ja) * | 2002-12-26 | 2004-07-22 | Shindengen Electric Mfg Co Ltd | 半導体装置 |
| JP4056066B2 (ja) | 2004-03-04 | 2008-03-05 | オーナンバ株式会社 | 太陽電池パネル用端子ボックス |
| JP4515817B2 (ja) * | 2004-05-18 | 2010-08-04 | 株式会社三社電機製作所 | 太陽電池モジュール接続具 |
| JP4004534B2 (ja) | 2004-05-19 | 2007-11-07 | エンゼル工業株式会社 | 太陽電池用リード端子付ダイオード |
| EP1758176A4 (en) * | 2004-05-25 | 2007-08-01 | Kitani Electric Co Ltd | CONNECTION BOX FOR A SOLAR CELL MODULE |
| JP2006165227A (ja) | 2004-11-15 | 2006-06-22 | Oonanba Kk | 太陽電池パネル用端子ボックス |
| DE112005002898B4 (de) * | 2004-11-25 | 2012-11-22 | Sansha Electric Manufacturing Co., Ltd. | Solarzellenmodul-Verbinder |
-
2007
- 2007-08-13 JP JP2007210589A patent/JP4167715B1/ja not_active Expired - Fee Related
-
2008
- 2008-01-25 WO PCT/JP2008/000094 patent/WO2009022441A1/ja not_active Ceased
- 2008-01-25 EP EP08710298.4A patent/EP2077579A4/en not_active Withdrawn
- 2008-01-25 CN CN2008800009460A patent/CN101548380B/zh not_active Expired - Fee Related
- 2008-01-25 US US12/513,490 patent/US8237065B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP2077579A4 (en) | 2014-10-08 |
| EP2077579A1 (en) | 2009-07-08 |
| CN101548380B (zh) | 2012-12-12 |
| US8237065B2 (en) | 2012-08-07 |
| JP2009044107A (ja) | 2009-02-26 |
| WO2009022441A1 (ja) | 2009-02-19 |
| US20100084183A1 (en) | 2010-04-08 |
| CN101548380A (zh) | 2009-09-30 |
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