JP3569923B2 - Manufacturing method of laminated hybrid integrated circuit component - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing a laminated hybrid integrated circuit component having a ceramic laminate as a functional component as a substrate.
[0002]
[Prior art]
Generally, as a laminated hybrid integrated circuit component, there is a component configured such that a functional component in which a capacitor or an inductor or both are incorporated in a ceramic laminate is used as a substrate, electrodes and resistors are formed, and electronic components such as an IC are mounted. .
[0003]
In order to manufacture the hybrid integrated circuit component, since the substrate is also one functional component, after forming the component as a functional component for each component, a predetermined processing for forming the hybrid integrated circuit component is performed on each substrate individually. It is done to be applied.
[0004]
However, this involves complicated operations, complicates the transport method, and leads to a long lead time, which is not only inferior in productivity, but also because the size of each substrate is extremely small, so that fine electrode patterns and edge It is also difficult to form electrodes and the like with high precision by accurately aligning them with built-in components.
[0005]
[Problems to be solved by the invention]
The present invention is not only capable of increasing the number of products to be produced, but also simplifying the transfer method and improving the processing capacity, thereby improving the productivity. In addition, the parts which constitute the hybrid integrated circuit parts in the ceramic laminate are highly accurate. It is an object of the present invention to provide a method of manufacturing a laminated integrated circuit component which can be formed efficiently by being aligned with the above.
[0006]
[Means for Solving the Problems]
In a method for manufacturing a laminated hybrid integrated circuit component according to the present invention, a ceramic laminated body, which is a single functional component corresponding to a plurality of hybrid integrated circuit components, is provided as a substrate, and the hybrid integrated circuit component is mounted on a board of the substrate. After forming the same pattern on the surface, the ceramic laminate is divided and formed into hybrid integrated circuit component units, and a plurality of hybrid integrated circuit components are simultaneously manufactured.
Steps of providing a plurality of through holes along the contour of each board surface corresponding to one hybrid integrated circuit component of the board, and printing a plane electrode on the board surface of the ceramic board, starting from the required locations of the through holes Forming a flat electrode and a resistor in the same pattern on each plate surface corresponding to one hybrid integrated circuit component of a substrate through a forming process and a process of printing and forming the resistor between necessary plane electrodes. And
Next, a step of forming a glass coat on the entire surface of the substrate, forming the glass coat as a planar electrode and a protective film for resistance by trimming, a step of forming a base film for plating on the entire surface of the substrate, A step of forming a coating on the entire surface of the substrate, a step of forming an exposed portion of a predetermined pattern on the resist film with a photoresist, and exposing a base film for plating by removing the exposed portion; Forming the exposed electrode of the underlying film by plating, removing the underlying film for plating exposed by peeling off the remaining resist film, and etching the electrode to trim the end electrode. Formed in the hole of the through-hole, and connect each part including the plane electrode, the resistor, and the end electrode to the circuit board. It is adapted to form one pattern.
[0007]
[Action]
In the method for manufacturing a laminated hybrid integrated circuit component according to the present invention, a planar electrode constituting a hybrid integrated circuit component, comprising a ceramic laminate as one functional component corresponding to a plurality of hybrid integrated circuit components as a substrate, After forming a resistor in the same pattern on each plate surface of a substrate corresponding to one hybrid integrated circuit component, forming a protective film, forming a base film, forming a resist film, forming an exposed portion, and removing the exposed portion. To form electrodes by plating, further stripping of the remaining resist film and removal of the underlying film, forming hybrid integrated circuit components on the surface of the ceramic laminate, and finally forming the substrate on the hybrid integrated circuit. By dividing and forming each component, it is possible to increase the number of hybrid integrated circuit components to be produced, to simplify the substrate transfer method and to increase the processing capacity, and to increase the processing capacity of each hybrid integrated circuit component. The let me align the parts and high precision built in the ceramic laminate can be formed well efficiency.
[0008]
BEST MODE FOR CARRYING OUT THE INVENTION
Referring to the accompanying drawings, FIGS. 1 to 10 show a form of a substrate which has been subjected to a predetermined processing by applying a method for manufacturing a laminated hybrid integrated circuit component according to the present invention, in the order of each step. Until the final step before mounting the IC, the substrate is kept as a single substrate corresponding to a plurality of stacked hybrid integrated circuit components (four in the drawing, for convenience).
[0009]
FIG. 1 shows a ceramic laminate 1 formed as a single piece as a plurality of hybrid integrated circuit components serving as a substrate of a multilayer hybrid integrated circuit component. The ceramic laminate 1 is formed by laminating a magnetic material and / or a dielectric material by a printing method or a sheet method, and is formed as a functional component including a capacitor or an inductor or both.
[0010]
The ceramic laminate 1 is peeled off from the carrier sheet or film used in the lamination forming step as a single piece of a plurality of hybrid integrated circuit components, and is handled in a substrate form having a relatively large area. To the manufacturing process of the hybrid integrated circuit part. For this reason, the substrate of the hybrid integrated circuit component can be easily handled in each of the processing steps and the transport process in the order of the steps, and the positioning required for each processing can be easily performed.
[0011]
First, as shown in FIG. 2, a through-hole used to form an end electrode is formed on one ceramic laminate 1 (hereinafter, simply referred to as “substrate 1”) corresponding to a plurality of hybrid integrated circuit components. Holes 2, 2, ... are provided. The through holes 2, 2,... Can be formed in a step before or after firing of the ceramic laminated body because a hole making means such as punching, etching, or beam irradiation is applied. The through holes 2, 2,... Are respectively provided along the contours of the substrates 10, 11,... (Hereinafter simply referred to as “the substrates 10, 11,...”) Corresponding to one hybrid integrated circuit component.
[0012]
With the necessary portions of the through holes 2, 2,... As base points, planar electrodes 3, 3,... Are formed on the plate surfaces of the substrates 10, 11,. Are formed in the same pattern on each plate surface of each of the substrates 10, 11,... By applying screen printing or the like.
[0013]
Next, since the plane electrodes 3, 3,... Are arranged between required areas, the resistors 4, 4,... Are formed on the plate surfaces of the substrates 10, 11,. The resistors 4, 4,... Are also formed by the same pattern on the plate surfaces of the substrates 10, 11,.
[0014]
After the formation of the planar electrodes 3, 3,... And the resistors 4, 4,..., A glass coat 5 is printed on the entire surface of the substrate 1 as shown in FIG. The glass coat 5 is trimmed by beam irradiation or the like to form a protective coating (not shown) covering the planar electrodes 3, 3... And the resistors 4, 4,. Form.
[0015]
After the formation of the protective film, a base film 6 for plating, which will be described later, is formed from a conductive material, as shown in FIG. The base film 6 for plating is formed over the entire surface of the substrate 1 by applying sputtering or the like.
[0016]
After the formation of the base film 6, a resist agent is applied to the entire surface of the substrate 1 to form a resist film. A photoresist is applied to this resist film, and an exposed portion is formed on each plate surface of each substrate according to the pattern of the planar electrodes 3, 3,. FIG. 7 shows a resist film 7 (see black portions) provided with exposed portions (see white portions).
[0017]
After the exposed portion is removed from the resist film 7 by an alkali or solvent treatment, a plating process for forming an end electrode and a connection circuit electrode is performed on the surface of the substrate 1 where the base film 6 is exposed. FIG. 8 shows the substrate 1 on which the plating film 8 of the electrode (see the black drawing) is formed.
[0018]
Thereafter, the remaining resist film 7 is peeled off. FIG. 9 shows the substrate 1 from which the resist coating has been stripped. In the substrate 1, an extra plating base film 6 (see black portions) other than the portions where the end electrodes and the wiring electrodes are formed by the plating film 8 (see white portions) is exposed by peeling of the resist film. .
[0019]
The substrate 1 is subjected to an etching process for removing the base film 6 for plating and trimming the plating film 8. FIG. 10 shows the substrate 1 after the etching process. On the surface of the substrate 1, flat electrodes 3, 3..., Resistors 4, 4,..., And end electrodes 8a, 8a. . Are formed in the same pattern on the plate surfaces of the substrates 10, 11,... By connecting the respective parts including the circuits with the wiring electrodes 8b, 8b.
[0020]
In the manufacturing process up to this point, the ceramic laminated body kept in a single shape corresponding to a plurality of hybrid integrated circuit parts is processed, so that it can be easily positioned as a large-plate ceramic laminated body and each part can be positioned. Can be formed accurately, and the transfer processing between the respective steps can be efficiently performed by simple means.
[0021]
After the steps up to this point, the ceramic laminate maintained in a single-piece form is divided into hybrid integrated circuit component units, so that a plurality of chip-like components are formed. A plurality of such chip-shaped parts can be manufactured simultaneously by passing through a series of manufacturing steps of a hybrid integrated circuit part for one cycle. For this reason, according to the above-mentioned manufacturing process, a large number can be efficiently manufactured in a short time, and productivity can be remarkably improved.
[0022]
In this hybrid integrated circuit component, when an electronic component such as an IC is mounted, the mounting process may be performed before the ceramic laminate is divided, or the mounting process may be performed after being divided for each hybrid integrated circuit component. FIG. 11 shows the final form of the laminated hybrid integrated circuit component on which the IC 9 is mounted. After checking the characteristics as usual, the laminated hybrid integrated circuit component is shipped as a product by taping and packaging as a series of electronic components.
[0023]
【The invention's effect】
As described above, according to the method of manufacturing a laminated hybrid integrated circuit component according to the present invention, it is possible to increase the production number of the hybrid integrated circuit component, simplify the substrate transfer system, increase the processing capacity, and improve the hybrid integration. Each part constituting a circuit component can be efficiently formed by accurately aligning each part with a component incorporated in the ceramic laminate.
[Brief description of the drawings]
FIG. 1 shows a ceramic laminate which is a functional component used in the method according to the present invention.
FIG. 2 shows a state in which through holes are provided in the ceramic laminate of FIG.
FIG. 3 shows a state where a planar electrode is provided on the ceramic laminate of FIG. 2;
FIG. 4 shows a state in which a resistor is provided on the ceramic laminate of FIG. 3;
5 shows a state in which a protective coating is provided on the ceramic laminate of FIG.
FIG. 6 shows a state in which a base film for plating is provided on the ceramic laminate of FIG. 5;
7 shows a state in which a base film for plating and a resist film are provided on the ceramic laminate of FIG. 1;
8 shows a state in which a plating process has been performed on the ceramic laminate of FIG. 7;
9 shows a state in which a resist film has been removed from the ceramic laminate of FIG. 8;
FIG. 10 shows a state in which an etching process has been performed on a base film of the ceramic laminate of FIG. 9;
FIG. 11 shows a product form of a laminated hybrid integrated circuit component on which an IC is mounted.
[Explanation of symbols]
1 Ceramic laminates 10 and 11 for taking multiple components Substrates 2 and 2 corresponding to one component Through holes 3 and 3 Planar electrodes 4 and 4 Resistance 5 Glass coat 6 Undercoat film 7 for plating Resist coating 8 electrodes

Claims (1)

A ceramic laminate, which is a single functional component corresponding to a plurality of hybrid integrated circuit components, is provided as a substrate, and after forming the hybrid integrated circuit components in the same pattern on the plate surface of the substrate, the ceramic laminate is formed. In the method of manufacturing a laminated hybrid integrated circuit component, which is formed by dividing the hybrid integrated circuit component unit and simultaneously manufacturing a plurality of hybrid integrated circuit components,
Steps of providing a plurality of through holes along the contour of each board surface corresponding to one hybrid integrated circuit component of the board, and printing a plane electrode on the board surface of the ceramic board, starting from the required locations of the through holes Forming a flat electrode and a resistor in the same pattern on each plate surface corresponding to one hybrid integrated circuit component of a substrate through a forming process and a process of printing and forming the resistor between necessary plane electrodes. And
Next, a step of forming a glass coat on the entire surface of the substrate, forming the glass coat as a planar electrode and a protective film for resistance by trimming, a step of forming a base film for plating on the entire surface of the substrate, A step of forming a coating on the entire surface of the substrate, a step of forming an exposed portion of a predetermined pattern on the resist film with a photoresist, and exposing a base film for plating by removing the exposed portion; Forming the exposed electrode of the underlying film by plating, removing the underlying film for plating exposed by peeling off the remaining resist film, and etching the electrode to trim the end electrode. Formed in the hole of the through-hole, and connect each part including the plane electrode, the resistor, and the end electrode to the circuit board. Method of manufacturing a multilayer hybrid integrated circuit component, characterized in that in order to form one pattern.

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