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JP3140061U - 基板接合装置 - Google Patents

基板接合装置 Download PDF

Info

Publication number
JP3140061U
JP3140061U JP2007009685U JP2007009685U JP3140061U JP 3140061 U JP3140061 U JP 3140061U JP 2007009685 U JP2007009685 U JP 2007009685U JP 2007009685 U JP2007009685 U JP 2007009685U JP 3140061 U JP3140061 U JP 3140061U
Authority
JP
Japan
Prior art keywords
substrate
bonding
flexible
guide portion
concave space
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2007009685U
Other languages
English (en)
Japanese (ja)
Inventor
李裕文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TPK Touch Solutions Inc
Original Assignee
TPK Touch Solutions Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TPK Touch Solutions Inc filed Critical TPK Touch Solutions Inc
Application granted granted Critical
Publication of JP3140061U publication Critical patent/JP3140061U/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B5/00—Presses characterised by the use of pressing means other than those mentioned in the preceding groups
    • B30B5/02—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of a flexible element, e.g. diaphragm, urged by fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum

Landscapes

  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Liquid Crystal (AREA)
  • Combinations Of Printed Boards (AREA)
JP2007009685U 2007-09-12 2007-12-18 基板接合装置 Expired - Lifetime JP3140061U (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW96134107A TWI381495B (zh) 2007-09-12 2007-09-12 Substrate bonding device

Publications (1)

Publication Number Publication Date
JP3140061U true JP3140061U (ja) 2008-03-13

Family

ID=39597932

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007009685U Expired - Lifetime JP3140061U (ja) 2007-09-12 2007-12-18 基板接合装置

Country Status (3)

Country Link
JP (1) JP3140061U (zh)
DE (1) DE202008000705U1 (zh)
TW (1) TWI381495B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113805296A (zh) * 2020-05-29 2021-12-17 上海微电子装备（集团）股份有限公司 一种光学组件及其制作方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102476487B (zh) * 2010-11-25 2014-07-02 联茂电子股份有限公司 基板压合装置、压合方法及其基板组
US20130312907A1 (en) * 2012-05-23 2013-11-28 Lg Display Co., Ltd. Substrate-bonding apparatus for display device and method for manufacturing bonded substrate
CN106793488B (zh) 2015-11-20 2019-04-30 财团法人工业技术研究院 软性电子装置与软性电子装置制作工艺方法
CN106739424B (zh) 2015-11-20 2020-02-14 财团法人工业技术研究院 取下贴合装置及应用此装置的取下方法与贴合方法
TWI643696B (zh) * 2015-11-20 2018-12-11 財團法人工業技術研究院 取下貼合裝置及應用此裝置之取下方法與貼合方法
CN106853711B (zh) * 2015-12-09 2019-01-22 宸鸿光电科技股份有限公司 贴合设备及贴合方法
CN211467477U (zh) * 2019-11-30 2020-09-11 向波 一种气囊抽真空手机屏幕贴膜机
CN113299582B (zh) * 2021-04-29 2023-08-25 江苏集萃有机光电技术研究所有限公司 一种封装方法及盖板贴合治具

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5393365A (en) 1993-11-19 1995-02-28 E. I. Du Pont De Nemours And Company Embossed glass/plastic laminate and process for preparing the same
US5858163A (en) 1996-03-22 1999-01-12 Gerber Optical, Inc. Apparatus for making ophthalmic lenses by vacuum lamination
US20040261930A1 (en) * 2003-03-04 2004-12-30 Shibaura Mechatronics Corporation Method of bonding substrates and apparatus for bonding substrates
TWI278793B (en) * 2005-01-27 2007-04-11 Shibaura Mechatronics Corp Substrate bonding apparatus and a bonding method and a bonding method for judging of a substrates bonding

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113805296A (zh) * 2020-05-29 2021-12-17 上海微电子装备（集团）股份有限公司 一种光学组件及其制作方法
CN113805296B (zh) * 2020-05-29 2023-02-21 上海微电子装备（集团）股份有限公司 一种光学组件及其制作方法

Also Published As

Publication number Publication date
TW200913180A (en) 2009-03-16
TWI381495B (zh) 2013-01-01
DE202008000705U1 (de) 2008-07-10

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