JP2981301B2 - Polyimide resin composition for sliding material - Google Patents
Polyimide resin composition for sliding materialInfo
- Publication number
- JP2981301B2 JP2981301B2 JP3125789A JP12578991A JP2981301B2 JP 2981301 B2 JP2981301 B2 JP 2981301B2 JP 3125789 A JP3125789 A JP 3125789A JP 12578991 A JP12578991 A JP 12578991A JP 2981301 B2 JP2981301 B2 JP 2981301B2
- Authority
- JP
- Japan
- Prior art keywords
- formula
- group
- resin composition
- polyimide resin
- unit represented
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920001721 polyimide Polymers 0.000 title claims description 47
- 239000009719 polyimide resin Substances 0.000 title claims description 39
- 239000000203 mixture Substances 0.000 title claims description 25
- 239000000463 material Substances 0.000 title claims description 20
- 229920005989 resin Polymers 0.000 claims description 21
- 239000011347 resin Substances 0.000 claims description 21
- 239000011342 resin composition Substances 0.000 claims description 20
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 19
- 239000004974 Thermotropic liquid crystal Substances 0.000 claims description 18
- 125000001931 aliphatic group Chemical group 0.000 claims description 12
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 9
- 125000004432 carbon atom Chemical group C* 0.000 claims description 9
- 239000004917 carbon fiber Substances 0.000 claims description 9
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 6
- 229920006026 co-polymeric resin Polymers 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- 125000003118 aryl group Chemical group 0.000 claims description 4
- 229920001038 ethylene copolymer Polymers 0.000 claims description 4
- 238000001746 injection moulding Methods 0.000 claims description 3
- 125000002950 monocyclic group Chemical group 0.000 claims description 3
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052794 bromium Inorganic materials 0.000 claims description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 2
- 239000000460 chlorine Substances 0.000 claims description 2
- 229910052801 chlorine Inorganic materials 0.000 claims description 2
- HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical group FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 claims description 2
- 150000002430 hydrocarbons Chemical group 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 2
- 125000000654 isopropylidene group Chemical group C(C)(C)=* 0.000 claims description 2
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 claims description 2
- 229910052717 sulfur Inorganic materials 0.000 claims description 2
- 239000011593 sulfur Substances 0.000 claims description 2
- 125000004149 thio group Chemical group *S* 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 125000004122 cyclic group Chemical group 0.000 claims 1
- 125000002573 ethenylidene group Chemical group [*]=C=C([H])[H] 0.000 claims 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- -1 methylene chloride Chemical class 0.000 description 17
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 14
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 10
- 239000004642 Polyimide Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 7
- 239000002994 raw material Substances 0.000 description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- 238000002425 crystallisation Methods 0.000 description 6
- 230000008025 crystallization Effects 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 239000000835 fiber Substances 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 5
- 229920005575 poly(amic acid) Polymers 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 150000004985 diamines Chemical class 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 3
- 150000008064 anhydrides Chemical class 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 2
- UCQABCHSIIXVOY-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)phenyl]phenoxy]aniline Chemical group NC1=CC=CC(OC=2C=CC(=CC=2)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 UCQABCHSIIXVOY-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- GRSMWKLPSNHDHA-UHFFFAOYSA-N Naphthalic anhydride Chemical compound C1=CC(C(=O)OC2=O)=C3C2=CC=CC3=C1 GRSMWKLPSNHDHA-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 238000005461 lubrication Methods 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 2
- YKNMIGJJXKBHJE-UHFFFAOYSA-N (3-aminophenyl)-(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=CC(N)=C1 YKNMIGJJXKBHJE-UHFFFAOYSA-N 0.000 description 1
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 1
- OLQWMCSSZKNOLQ-UHFFFAOYSA-N 3-(2,5-dioxooxolan-3-yl)oxolane-2,5-dione Chemical group O=C1OC(=O)CC1C1C(=O)OC(=O)C1 OLQWMCSSZKNOLQ-UHFFFAOYSA-N 0.000 description 1
- LXJLFVRAWOOQDR-UHFFFAOYSA-N 3-(3-aminophenoxy)aniline Chemical compound NC1=CC=CC(OC=2C=C(N)C=CC=2)=C1 LXJLFVRAWOOQDR-UHFFFAOYSA-N 0.000 description 1
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 1
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 description 1
- ZMPZWXKBGSQATE-UHFFFAOYSA-N 3-(4-aminophenyl)sulfonylaniline Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=CC(N)=C1 ZMPZWXKBGSQATE-UHFFFAOYSA-N 0.000 description 1
- ZDBWYUOUYNQZBM-UHFFFAOYSA-N 3-(aminomethyl)aniline Chemical compound NCC1=CC=CC(N)=C1 ZDBWYUOUYNQZBM-UHFFFAOYSA-N 0.000 description 1
- TYKLCAKICHXQNE-UHFFFAOYSA-N 3-[(2,3-dicarboxyphenyl)methyl]phthalic acid Chemical compound OC(=O)C1=CC=CC(CC=2C(=C(C(O)=O)C=CC=2)C(O)=O)=C1C(O)=O TYKLCAKICHXQNE-UHFFFAOYSA-N 0.000 description 1
- UCFMKTNJZCYBBJ-UHFFFAOYSA-N 3-[1-(2,3-dicarboxyphenyl)ethyl]phthalic acid Chemical compound C=1C=CC(C(O)=O)=C(C(O)=O)C=1C(C)C1=CC=CC(C(O)=O)=C1C(O)=O UCFMKTNJZCYBBJ-UHFFFAOYSA-N 0.000 description 1
- DKKYOQYISDAQER-UHFFFAOYSA-N 3-[3-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 DKKYOQYISDAQER-UHFFFAOYSA-N 0.000 description 1
- LBPVOEHZEWAJKQ-UHFFFAOYSA-N 3-[4-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 LBPVOEHZEWAJKQ-UHFFFAOYSA-N 0.000 description 1
- UQHPRIRSWZEGEK-UHFFFAOYSA-N 3-[4-[1-[4-(3-aminophenoxy)phenyl]ethyl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=C(N)C=CC=2)C=CC=1C(C)C(C=C1)=CC=C1OC1=CC=CC(N)=C1 UQHPRIRSWZEGEK-UHFFFAOYSA-N 0.000 description 1
- BUCRPLWBLGEXGT-UHFFFAOYSA-N 3-[4-[2-[4-(3-aminophenoxy)-3,5-dimethylphenyl]propan-2-yl]-2,6-dimethylphenoxy]aniline Chemical compound CC1=CC(C(C)(C)C=2C=C(C)C(OC=3C=C(N)C=CC=3)=C(C)C=2)=CC(C)=C1OC1=CC=CC(N)=C1 BUCRPLWBLGEXGT-UHFFFAOYSA-N 0.000 description 1
- LYIHEARDOUIKEU-UHFFFAOYSA-N 3-[4-[2-[4-(3-aminophenoxy)-3,5-dimethylphenyl]propan-2-yl]phenoxy]aniline Chemical compound CC1=CC(C(C)(C)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=CC(C)=C1OC1=CC=CC(N)=C1 LYIHEARDOUIKEU-UHFFFAOYSA-N 0.000 description 1
- QIGZRZPVWRFRJB-UHFFFAOYSA-N 3-[4-[2-[4-(3-aminophenoxy)-3-methylphenyl]propan-2-yl]-2-methylphenoxy]aniline Chemical compound CC1=CC(C(C)(C)C=2C=C(C)C(OC=3C=C(N)C=CC=3)=CC=2)=CC=C1OC1=CC=CC(N)=C1 QIGZRZPVWRFRJB-UHFFFAOYSA-N 0.000 description 1
- QZDGREOAXMLPHS-UHFFFAOYSA-N 3-[4-[2-[4-(3-aminophenoxy)-3-methylphenyl]propan-2-yl]phenoxy]aniline Chemical compound CC1=CC(C(C)(C)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=CC=C1OC1=CC=CC(N)=C1 QZDGREOAXMLPHS-UHFFFAOYSA-N 0.000 description 1
- KOUQMRHSPOKPBD-UHFFFAOYSA-N 3-[4-[2-[4-(3-aminophenoxy)phenyl]butan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=C(N)C=CC=2)C=CC=1C(C)(CC)C(C=C1)=CC=C1OC1=CC=CC(N)=C1 KOUQMRHSPOKPBD-UHFFFAOYSA-N 0.000 description 1
- BDROEGDWWLIVJF-UHFFFAOYSA-N 3-[4-[2-[4-(3-aminophenoxy)phenyl]ethyl]phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(CCC=3C=CC(OC=4C=C(N)C=CC=4)=CC=3)=CC=2)=C1 BDROEGDWWLIVJF-UHFFFAOYSA-N 0.000 description 1
- NYRFBMFAUFUULG-UHFFFAOYSA-N 3-[4-[2-[4-(3-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=C(N)C=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=CC(N)=C1 NYRFBMFAUFUULG-UHFFFAOYSA-N 0.000 description 1
- RXLJULCBJYADBX-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)-3,5-dibromophenyl]-2,6-dibromophenoxy]aniline Chemical group NC1=CC=CC(OC=2C(=CC(=CC=2Br)C=2C=C(Br)C(OC=3C=C(N)C=CC=3)=C(Br)C=2)Br)=C1 RXLJULCBJYADBX-UHFFFAOYSA-N 0.000 description 1
- ULUBCMOLQJRYAV-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)-3,5-dibromophenyl]phenoxy]aniline Chemical group NC1=CC=CC(OC=2C=CC(=CC=2)C=2C=C(Br)C(OC=3C=C(N)C=CC=3)=C(Br)C=2)=C1 ULUBCMOLQJRYAV-UHFFFAOYSA-N 0.000 description 1
- DBLBINKTLXOPAQ-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)-3,5-dichlorophenyl]-2,6-dichlorophenoxy]aniline Chemical group NC1=CC=CC(OC=2C(=CC(=CC=2Cl)C=2C=C(Cl)C(OC=3C=C(N)C=CC=3)=C(Cl)C=2)Cl)=C1 DBLBINKTLXOPAQ-UHFFFAOYSA-N 0.000 description 1
- BEQFFQGYJLCHIX-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)-3,5-dichlorophenyl]phenoxy]aniline Chemical group NC1=CC=CC(OC=2C=CC(=CC=2)C=2C=C(Cl)C(OC=3C=C(N)C=CC=3)=C(Cl)C=2)=C1 BEQFFQGYJLCHIX-UHFFFAOYSA-N 0.000 description 1
- QAVRLHHNFOJNGT-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)-3,5-dimethoxyphenyl]sulfanyl-2,6-dimethoxyphenoxy]aniline Chemical compound C=1C(OC)=C(OC=2C=C(N)C=CC=2)C(OC)=CC=1SC(C=C1OC)=CC(OC)=C1OC1=CC=CC(N)=C1 QAVRLHHNFOJNGT-UHFFFAOYSA-N 0.000 description 1
- SWUWOGPXPUWCSR-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)-3,5-dimethoxyphenyl]sulfanylphenoxy]aniline Chemical compound C=1C(OC)=C(OC=2C=C(N)C=CC=2)C(OC)=CC=1SC(C=C1)=CC=C1OC1=CC=CC(N)=C1 SWUWOGPXPUWCSR-UHFFFAOYSA-N 0.000 description 1
- SXQNSTHTOVNMAJ-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)-3,5-dimethylphenyl]-2,6-dimethylphenoxy]aniline Chemical group CC1=CC(C=2C=C(C)C(OC=3C=C(N)C=CC=3)=C(C)C=2)=CC(C)=C1OC1=CC=CC(N)=C1 SXQNSTHTOVNMAJ-UHFFFAOYSA-N 0.000 description 1
- KZGXKAPDSOGTQO-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)-3,5-dimethylphenyl]phenoxy]aniline Chemical group CC1=CC(C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=CC(C)=C1OC1=CC=CC(N)=C1 KZGXKAPDSOGTQO-UHFFFAOYSA-N 0.000 description 1
- IWBGRHNGPPHLKI-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)-3-bromophenyl]-2-bromophenoxy]aniline Chemical group NC1=CC=CC(OC=2C(=CC(=CC=2)C=2C=C(Br)C(OC=3C=C(N)C=CC=3)=CC=2)Br)=C1 IWBGRHNGPPHLKI-UHFFFAOYSA-N 0.000 description 1
- OACQNZGRYGFYHK-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)-3-chlorophenyl]-2-chlorophenoxy]aniline Chemical group NC1=CC=CC(OC=2C(=CC(=CC=2)C=2C=C(Cl)C(OC=3C=C(N)C=CC=3)=CC=2)Cl)=C1 OACQNZGRYGFYHK-UHFFFAOYSA-N 0.000 description 1
- PHMAAVKNACFYBK-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)-3-methoxyphenyl]sulfanyl-2-methoxyphenoxy]aniline Chemical compound C=1C=C(OC=2C=C(N)C=CC=2)C(OC)=CC=1SC(C=C1OC)=CC=C1OC1=CC=CC(N)=C1 PHMAAVKNACFYBK-UHFFFAOYSA-N 0.000 description 1
- YXUXVPRGSFKQIZ-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)-3-methylphenyl]-2-methylphenoxy]aniline Chemical group CC1=CC(C=2C=C(C)C(OC=3C=C(N)C=CC=3)=CC=2)=CC=C1OC1=CC=CC(N)=C1 YXUXVPRGSFKQIZ-UHFFFAOYSA-N 0.000 description 1
- QRDGZBOBLAGEAG-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)-3-methylphenyl]phenoxy]aniline Chemical group CC1=CC(C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=CC=C1OC1=CC=CC(N)=C1 QRDGZBOBLAGEAG-UHFFFAOYSA-N 0.000 description 1
- NQZOFDAHZVLQJO-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)phenoxy]phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(OC=3C=CC(OC=4C=C(N)C=CC=4)=CC=3)=CC=2)=C1 NQZOFDAHZVLQJO-UHFFFAOYSA-N 0.000 description 1
- JERFEOKUSPGKGV-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)phenyl]sulfanylphenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(SC=3C=CC(OC=4C=C(N)C=CC=4)=CC=3)=CC=2)=C1 JERFEOKUSPGKGV-UHFFFAOYSA-N 0.000 description 1
- WCXGOVYROJJXHA-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)S(=O)(=O)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 WCXGOVYROJJXHA-UHFFFAOYSA-N 0.000 description 1
- CVDXGVFLGSMYES-UHFFFAOYSA-N 3-[4-[4-[4-(3-aminophenoxy)phenoxy]phenoxy]phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(OC=3C=CC(OC=4C=CC(OC=5C=C(N)C=CC=5)=CC=4)=CC=3)=CC=2)=C1 CVDXGVFLGSMYES-UHFFFAOYSA-N 0.000 description 1
- ICNFHJVPAJKPHW-UHFFFAOYSA-N 4,4'-Thiodianiline Chemical compound C1=CC(N)=CC=C1SC1=CC=C(N)C=C1 ICNFHJVPAJKPHW-UHFFFAOYSA-N 0.000 description 1
- AVCOFPOLGHKJQB-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)sulfonylphthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1S(=O)(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 AVCOFPOLGHKJQB-UHFFFAOYSA-N 0.000 description 1
- BFWYZZPDZZGSLJ-UHFFFAOYSA-N 4-(aminomethyl)aniline Chemical compound NCC1=CC=C(N)C=C1 BFWYZZPDZZGSLJ-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- IWXCYYWDGDDPAC-UHFFFAOYSA-N 4-[(3,4-dicarboxyphenyl)methyl]phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1CC1=CC=C(C(O)=O)C(C(O)=O)=C1 IWXCYYWDGDDPAC-UHFFFAOYSA-N 0.000 description 1
- GEYAGBVEAJGCFB-UHFFFAOYSA-N 4-[2-(3,4-dicarboxyphenyl)propan-2-yl]phthalic acid Chemical compound C=1C=C(C(O)=O)C(C(O)=O)=CC=1C(C)(C)C1=CC=C(C(O)=O)C(C(O)=O)=C1 GEYAGBVEAJGCFB-UHFFFAOYSA-N 0.000 description 1
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 description 1
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 description 1
- KMKWGXGSGPYISJ-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 KMKWGXGSGPYISJ-UHFFFAOYSA-N 0.000 description 1
- LDFYRFKAYFZVNH-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenoxy]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 LDFYRFKAYFZVNH-UHFFFAOYSA-N 0.000 description 1
- HYDATEKARGDBKU-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]phenoxy]aniline Chemical group C1=CC(N)=CC=C1OC1=CC=C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 HYDATEKARGDBKU-UHFFFAOYSA-N 0.000 description 1
- UTDAGHZGKXPRQI-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 UTDAGHZGKXPRQI-UHFFFAOYSA-N 0.000 description 1
- AYWCMMZKGNGLIX-UHFFFAOYSA-N 4-[4-[4-[4-(4-aminophenoxy)phenoxy]phenoxy]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC(C=C1)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 AYWCMMZKGNGLIX-UHFFFAOYSA-N 0.000 description 1
- CNABHHDNHRETRU-UHFFFAOYSA-N 4-[4-[4-[4-[4-(4-aminophenoxy)phenoxy]phenyl]sulfonylphenoxy]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C=CC(OC=4C=CC(N)=CC=4)=CC=3)=CC=2)C=C1 CNABHHDNHRETRU-UHFFFAOYSA-N 0.000 description 1
- WXNZTHHGJRFXKQ-UHFFFAOYSA-N 4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1 WXNZTHHGJRFXKQ-UHFFFAOYSA-N 0.000 description 1
- VETOZLDSVKEYKO-UHFFFAOYSA-N 4-phenyl-2-benzofuran-1,3-dione Chemical compound O=C1OC(=O)C2=C1C=CC=C2C1=CC=CC=C1 VETOZLDSVKEYKO-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- YTRAFABYXOZRDF-UHFFFAOYSA-N 5-phenyl-2-benzofuran-1,3-dione Chemical compound C=1C=C2C(=O)OC(=O)C2=CC=1C1=CC=CC=C1 YTRAFABYXOZRDF-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- PYVHTIWHNXTVPF-UHFFFAOYSA-N F.F.F.F.C=C Chemical compound F.F.F.F.C=C PYVHTIWHNXTVPF-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000004988 Nematic liquid crystal Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- WYYLAHMAYZBJOI-UHFFFAOYSA-N [3-[4-(3-aminophenoxy)benzoyl]phenyl]-[4-(3-aminophenoxy)phenyl]methanone Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)C(=O)C=2C=C(C=CC=2)C(=O)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 WYYLAHMAYZBJOI-UHFFFAOYSA-N 0.000 description 1
- JAGJCSPSIXPCAK-UHFFFAOYSA-N [4-[4-(3-aminophenoxy)benzoyl]phenyl]-[4-(3-aminophenoxy)phenyl]methanone Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)C(=O)C=2C=CC(=CC=2)C(=O)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 JAGJCSPSIXPCAK-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- KSQMWIGJIDTOFT-UHFFFAOYSA-N anthracene-1,9-dicarboxylic anhydride Chemical compound C1=CC(C(=O)OC2=O)=C3C2=C(C=CC=C2)C2=CC3=C1 KSQMWIGJIDTOFT-UHFFFAOYSA-N 0.000 description 1
- MRSWDOKCESOYBI-UHFFFAOYSA-N anthracene-2,3,6,7-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=C2C=C(C=C(C(C(=O)O)=C3)C(O)=O)C3=CC2=C1 MRSWDOKCESOYBI-UHFFFAOYSA-N 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- IDVDAZFXGGNIDQ-UHFFFAOYSA-N benzo[e][2]benzofuran-1,3-dione Chemical compound C1=CC2=CC=CC=C2C2=C1C(=O)OC2=O IDVDAZFXGGNIDQ-UHFFFAOYSA-N 0.000 description 1
- TUQQUUXMCKXGDI-UHFFFAOYSA-N bis(3-aminophenyl)methanone Chemical compound NC1=CC=CC(C(=O)C=2C=C(N)C=CC=2)=C1 TUQQUUXMCKXGDI-UHFFFAOYSA-N 0.000 description 1
- ZLSMCQSGRWNEGX-UHFFFAOYSA-N bis(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C=C1 ZLSMCQSGRWNEGX-UHFFFAOYSA-N 0.000 description 1
- BBRLKRNNIMVXOD-UHFFFAOYSA-N bis[4-(3-aminophenoxy)phenyl]methanone Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)C(=O)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 BBRLKRNNIMVXOD-UHFFFAOYSA-N 0.000 description 1
- NNFPXDULJJJKBG-UHFFFAOYSA-N bis[4-[4-(4-aminophenoxy)phenoxy]phenyl]methanone Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(C(=O)C=2C=CC(OC=3C=CC(OC=4C=CC(N)=CC=4)=CC=3)=CC=2)C=C1 NNFPXDULJJJKBG-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003484 crystal nucleating agent Substances 0.000 description 1
- STZIXLPVKZUAMV-UHFFFAOYSA-N cyclopentane-1,1,2,2-tetracarboxylic acid Chemical compound OC(=O)C1(C(O)=O)CCCC1(C(O)=O)C(O)=O STZIXLPVKZUAMV-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 238000007580 dry-mixing Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- GBASTSRAHRGUAB-UHFFFAOYSA-N ethylenetetracarboxylic dianhydride Chemical group O=C1OC(=O)C2=C1C(=O)OC2=O GBASTSRAHRGUAB-UHFFFAOYSA-N 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 1
- OBKARQMATMRWQZ-UHFFFAOYSA-N naphthalene-1,2,5,6-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 OBKARQMATMRWQZ-UHFFFAOYSA-N 0.000 description 1
- YTVNOVQHSGMMOV-UHFFFAOYSA-N naphthalenetetracarboxylic dianhydride Chemical compound C1=CC(C(=O)OC2=O)=C3C2=CC=C2C(=O)OC(=O)C1=C32 YTVNOVQHSGMMOV-UHFFFAOYSA-N 0.000 description 1
- BXSZBTFVSMMJQG-UHFFFAOYSA-N naphtho[2,3-e][2]benzofuran-1,3-dione Chemical compound C1=CC2=CC3=CC=CC=C3C=C2C2=C1C(=O)OC2=O BXSZBTFVSMMJQG-UHFFFAOYSA-N 0.000 description 1
- AJXNLGUENUIIRW-UHFFFAOYSA-N naphtho[2,3-f][2]benzofuran-1,3-dione Chemical compound C1=CC=C2C=C(C=C3C(=O)OC(=O)C3=C3)C3=CC2=C1 AJXNLGUENUIIRW-UHFFFAOYSA-N 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229940090668 parachlorophenol Drugs 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- UMSVUULWTOXCQY-UHFFFAOYSA-N phenanthrene-1,2,7,8-tetracarboxylic acid Chemical compound OC(=O)C1=CC=C2C3=CC=C(C(=O)O)C(C(O)=O)=C3C=CC2=C1C(O)=O UMSVUULWTOXCQY-UHFFFAOYSA-N 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- CLYVDMAATCIVBF-UHFFFAOYSA-N pigment red 224 Chemical compound C=12C3=CC=C(C(OC4=O)=O)C2=C4C=CC=1C1=CC=C2C(=O)OC(=O)C4=CC=C3C1=C42 CLYVDMAATCIVBF-UHFFFAOYSA-N 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 229920001059 synthetic polymer Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920006259 thermoplastic polyimide Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- LLYYNOVSVPBRGV-MVNKZKPCSA-N valnemulin Chemical compound CC(C)[C@@H](N)C(=O)NCC(C)(C)SCC(=O)O[C@@H]1C[C@@](C)(C=C)[C@@H](O)[C@H](C)[C@@]23CC[C@@H](C)[C@]1(C)[C@@H]2C(=O)CC3 LLYYNOVSVPBRGV-MVNKZKPCSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Description
【0001】[0001]
【産業上の利用分野】 本発明は摺動材用ポリイミド系
樹脂組成物に関するものである。The present invention relates to a polyimide resin composition for a sliding material.
【0002】[0002]
【従来の技術】 従来から、ポリイミドは耐熱性が極め
て優れている上に、力学的強度、寸法安定性が優れ、難
燃性、電気絶縁性等をあわせ持つために、電気・電子機
器、宇宙航空用機器、輸送機器などの分野で使用されて
おり、今後も耐熱性が要求される分野への用途拡大が期
待され、既に、優れた特性を示すポリイミドが開発され
ている。2. Description of the Related Art Conventionally, polyimide has extremely excellent heat resistance, mechanical strength, dimensional stability, flame retardancy, electrical insulation, etc., so that electric / electronic equipment, space It is used in fields such as aviation equipment and transportation equipment, and is expected to be used in fields requiring heat resistance in the future. Polyimides exhibiting excellent properties have already been developed.
【0003】しかし、従来開発されたポリイミドには優
れた特性を示すものが多いが、優れた有するけれども加
工性にとぼしいとか、また加工性向上を目的として開発
された樹脂は耐熱性、耐溶剤性に劣るなど性能に一長一
短があった。[0003] However, many of the polyimides developed so far have excellent properties. However, although they have excellent properties, they have poor workability, and resins developed for the purpose of improving the workability have high heat resistance and solvent resistance. There were advantages and disadvantages in performance such as inferior.
【0004】例えば、J.Polym.Sci.Mac
romol,Rev.,11,161(1976)また
はJ.Elast.Plast.,7,285(197
5)に記載されている式(6)〔化9〕[0004] For example, in J. Polym. Sci. Mac
romol, Rev. , 11, 161 (1976) or J.A. Elast. Plast. , 7, 285 (197
Formula (6) described in 5)
【0005】[0005]
【化9】 で表わされる基本骨格からなるポリイミド(デユポン社
製:商品名Kapton,Vespel)は明瞭なガラ
ス転移温度を有せず、耐熱性に優れたポリイミドである
が、成形材料として用いる場合に加工が困難で、焼結成
形などの手法を用いて加工しなければならない。また、
電気・電子部品の材料として用いる際には寸法安定性、
絶縁性、はんだ耐熱性に悪影響をおよぼす吸水率が高い
という欠点を有している。Embedded image Is a polyimide having a basic skeleton represented by the following formula (manufactured by DuPont; trade name: Kapton, Vespel), which does not have a clear glass transition temperature and is excellent in heat resistance, but is difficult to process when used as a molding material. It must be processed using techniques such as sinter molding. Also,
When used as a material for electrical and electronic parts, dimensional stability,
It has a drawback of high water absorption which has an adverse effect on insulation and solder heat resistance.
【0006】また、式(7)〔化10〕In addition, formula (7) [formula 10]
【0007】[0007]
【化10】 で表わされる様な基本骨格を有するポリエーテルイミド
(ゼネラルエレクトリック社製:商品名ULTEM)は
加工性の優れた樹脂であるが、ガラス転移温度が217
℃と低く、またメチレンクロリドなどのハロゲン化炭化
水素に可溶で、耐熱性、耐溶剤性の面からは満足のゆく
樹脂ではない。Embedded image Is a resin having excellent workability, but has a glass transition temperature of 217.
° C, and is soluble in halogenated hydrocarbons such as methylene chloride, and is not a satisfactory resin in terms of heat resistance and solvent resistance.
【0008】これらの欠点を解決すべく、本出願人は特
開昭62−236858および特開昭62−25365
5等に、本発明の構成要素のひとつである式(1)〔化
11〕In order to solve these drawbacks, the present applicant has disclosed Japanese Patent Application Laid-Open Nos. 62-236858 and 62-25365.
5 and the like, one of the constituent elements of the present invention represented by the formula (1)
【0009】[0009]
【化11】 で表わされる繰り返し単位を有するポリイミド樹脂を開
発した。Embedded image A polyimide resin having a repeating unit represented by
【0010】本ポリイミド樹脂は、熱的性質、電気的性
質などに優れた性能を有しているため広範囲の分野で利
用されているが、溶融粘度が高くて成形加工性にいまだ
難点があり、結晶化に伴う熱処理過程での寸法変化が大
きく、寸法安定性に欠けるなどの欠点を有している。The polyimide resin is used in a wide range of fields because of its excellent properties such as thermal properties and electrical properties. However, the polyimide resin has a high melt viscosity and is still difficult to process. It has drawbacks such as a large dimensional change during the heat treatment process accompanying crystallization and a lack of dimensional stability.
【0011】さらに、本発明者らは、上記ポリイミド樹
脂の欠点を改良するには、上記ポリイミド樹脂にサーモ
トロピック液晶ポリマーを配合することが有効であるこ
とを見出し、特許出願した(特開平4−17537
3)。この樹脂組成物は、耐熱性、強靭性、加工性など
に優れているため、従来、金属またはセラミックスの領
域と考えられていた分野への用途開発が進められてい
る。しかし、これらの樹脂組成物も、潤滑性および摺動
特性の点では未だ十分に満足のいくものではない。Further, the present inventors have found that it is effective to blend the above-mentioned polyimide resin with a thermotropic liquid crystal polymer in order to improve the disadvantages of the above-mentioned polyimide resin, and have filed a patent application ( Japanese Patent Application Laid-Open No. Hei 4- 17537
3 ). Since this resin composition is excellent in heat resistance, toughness, workability, and the like, application development to a field conventionally considered to be a metal or ceramics area has been promoted. However, these resin compositions are still not sufficiently satisfactory in terms of lubricity and sliding properties.
【0012】[0012]
【発明が解決しようとする課題】本発明の目的は、ポリ
イミド樹脂とサーモトロピック液晶ポリマーからなる樹
脂組成物において、優れた耐熱性、加工性に加え、優れ
た摺動特性、機械物性を付与することにある。SUMMARY OF THE INVENTION It is an object of the present invention to provide a resin composition comprising a polyimide resin and a thermotropic liquid crystal polymer with excellent heat resistance and workability, as well as excellent sliding properties and mechanical properties. It is in.
【0013】[0013]
【課題を解決するための手段】本発明者らは前記の目的
を達成するために鋭意検討した結果、ポリイミド樹脂と
サーモトロピック液晶ポリマーを含有してなる樹脂組成
物に、フッ素樹脂および炭素繊維を配合することによ
り、優れた摺動特性、機械特性を有し、高強度の摺動材
を得ることが可能であることを見出し、本発明を完成し
た。Means for Solving the Problems The present inventors have made intensive studies to achieve the above object, and as a result, a fluororesin and a carbon fiber were added to a resin composition containing a polyimide resin and a thermotropic liquid crystal polymer. It has been found that by blending, it is possible to obtain a high-strength sliding material having excellent sliding properties and mechanical properties, and completed the present invention.
【0014】すなわち、本発明は、 (1) 式(1)〔化12〕で表わされる繰り返し単
位を有するポリイミド樹脂50〜99重量%と、サーモ
トロピック液晶ポリマーの1種または2種以上の混合物
50〜1重量%とを含む樹脂組成物と、この樹脂組成物
100重量部に対して、1〜60重量部のフッ素樹脂、
および5〜160重量部の炭素繊維を含有してなり、3
70〜410℃の温度範囲で射出成型することを特徴と
する摺動材用ポリイミド系樹脂組成物That is, the present invention provides: (1) 50 to 99% by weight of a polyimide resin having a repeating unit represented by the formula (1) [Formula 12] and one or more mixtures of two or more thermotropic liquid crystal polymers. And 1 to 60 parts by weight of a fluororesin, based on 100 parts by weight of the resin composition.
And 5-160 Ri name contains carbon fiber parts by weight, 3
A polyimide resin composition for a sliding material, which is injection-molded in a temperature range of 70 to 410C .
【0015】[0015]
【化12】 (式中、Xは直結、イオウ、炭素数1〜10の二価の炭
化水素基、六フッ素化されたイソプロピリデン基、カル
ボニル基、チオ基、スルホニル基、重素から成る群より
選ばれた基を表わし、Y1、Y2、Y3およびY4はそ
れぞれ水素、塩素または臭素から成る群より選ばれた基
を表わし、またR1は炭素数4〜9の脂肪族基、炭素数
4〜10の単環式脂肪族基、単環式芳香族基、縮合多環
式芳香族基、芳香族基が直接又は架橋員より相互に連結
された非縮合多環式芳香族基から成る群より選ばれた4
価の基を表わす。)Embedded image (Wherein, X is selected from the group consisting of direct bond, sulfur, divalent hydrocarbon group having 1 to 10 carbon atoms, hexafluorinated isopropylidene group, carbonyl group, thio group, sulfonyl group, and heavy element . Y 1 , Y 2 , Y 3 and Y 4 each represent a group selected from the group consisting of hydrogen, chlorine and bromine, and R 1 represents an aliphatic group having 4 to 9 carbon atoms and 4 carbon atoms. A group consisting of 10 to 10 monocyclic aliphatic groups, monocyclic aromatic groups, condensed polycyclic aromatic groups, and non-condensed polycyclic aromatic groups in which the aromatic groups are interconnected directly or by a bridge member 4 selected from
Represents a valence group. )
【0016】[0016]
【化13】 Embedded image
【0017】[0017]
【化14】 Embedded image
【0018】[0018]
【化15】 Embedded image
【0019】[0019]
【化16】 (3) フッ素樹脂が、次の(a)〜(f)からなる群
より選ばれた少なくとも1種である(1)項記載の摺動
材用ポリイミド系樹脂組成物、 (a)分子内に、式、−(CF2CF2)−で表わされる
繰り返し構造単位を有する四フッ化エチレン樹脂 (b)分子内に、 式、−(CF2CF2)− および 式、−〔CF(CF3) CF2〕− で表わされる繰り返し構造単位を有する四フッ化エチレ
ン樹脂−六フッ化プロピレン共重合樹脂 (c)分子内に、 式、−(CF2CF2)− および 式、−〔CF(OCmF2m++1)CF2〕(式中、mは正
の整数) で表される繰り返し構造単位を有する四フッ化エチレン
−パーフロロアルキルビニルエーテル共重合樹脂 (d)分子内に、 式、−(CF2CF2)− および 式、−(CH2CH2)− で表される繰り返し構造単位を有する四フッ化エチレン
−エチレン共重合樹脂 (e)分子内に、 式、−(CH2CH2)− および 式、−(CFClCF2) − で表される繰り返し構造単位を有する三フッ化塩化エチ
レン−エチレン共重合樹脂 (f)分子内に、式、−(CF2CH2)−で表わされる
繰り返し構造単位を有するフッ化ビニリデン樹脂 (4) 式(1)で表わされる繰り返し構造単位を有す
るポリイミド樹脂の式中のR1 が、次の(a)〜(e)
からなる群より選ばれた少なくとも1種である(1)項
記載の摺動材用ポリイミド系樹脂組成物、 (a) 炭素数4〜9の脂肪族基 (b) 炭素数4〜10の環式脂肪族基 (c) 次式〔化17〕で表される単環式芳香族基Embedded image (3) The polyimide resin composition for a sliding material according to (1), wherein the fluororesin is at least one selected from the group consisting of the following (a) to (f): , A tetrafluoroethylene resin having a repeating structural unit represented by-(CF 2 CF 2 )-; (b) In a molecule, a compound represented by the formula,-(CF 2 CF 2 )-and the formula,-[CF (CF 3 ) CF 2] - tetrafluoroethylene resin having recurring structural units represented by - the hexafluoropropylene copolymer resin (c) in the molecule, wherein, - (CF 2 CF 2) - and wherein - [CF ( OC m F 2m ++ 1 ) CF 2 ] (wherein m is a positive integer). (D) In the molecule, a tetrafluoroethylene-perfluoroalkylvinyl ether copolymer resin having a repeating structural unit represented by the formula: , - (CF 2 CF 2) - and formula, - (CH 2 CH 2) - Ethylene copolymer resin (e) in the molecule, wherein - - represented by repeated tetrafluoroethylene having a structural unit (CH 2 CH 2) - and formula, - (CFClCF 2) - in the repeating structural unit represented by (F) Vinylidene fluoride resin having a repeating structural unit represented by the formula,-(CF 2 CH 2 )-in the molecule (4) represented by the formula (1) R 1 in the formula of the polyimide resin having a repeating structural unit represented by the following (a) to (e)
(1) The polyimide resin composition for a sliding material according to (1), which is at least one member selected from the group consisting of: (a) an aliphatic group having 4 to 9 carbon atoms; and (b) a ring having 4 to 10 carbon atoms. Formula aliphatic group (c) Monocyclic aromatic group represented by the following formula [Formula 17]
【0020】[0020]
【化17】 (d) 次式〔化18〕で表される縮合多環式芳香族基Embedded image (D) a condensed polycyclic aromatic group represented by the following formula [Formula 18]
【0021】[0021]
【化18】 (e)次式〔化19〕で表わされる芳香族基が直接又は
架橋員より相互に連結された非縮合多環式芳香族基Embedded image (E) a non-condensed polycyclic aromatic group in which an aromatic group represented by the following formula [Chemical Formula 19] is connected directly or by a crosslinking member:
【0022】[0022]
【化19】 である。Embedded image It is.
【0023】本発明の摺動材用ポリイミド系樹脂組成物
における式(1)で表わされる繰り返し単位を基本骨格
として有するポリイミド樹脂の原料として用いるジアミ
ン成分は、式(8)〔化20〕The diamine component used as a raw material of the polyimide resin having a repeating unit represented by the formula (1) as a basic skeleton in the polyimide resin composition for a sliding material of the present invention is represented by the formula (8):
【0024】[0024]
【化20】 (式中、Xは前記に同じ)に示すエーテルジアミンと式
(9)〔化21〕Embedded image (Wherein X is as defined above) and an ether diamine represented by the formula (9)
【0025】[0025]
【化21】 (式中、R1 は前記に同じ)に示す1種以上のテトラカ
ルボン酸二無水物とを有機溶媒の存在下または不存在下
において反応させ、得られたポリアミド酸を化学的にま
たは熱的にイミド化して製造することができる。反応温
度は通常250℃以下であり、反応圧力は特に限定され
ず、常圧で充分実施できる。また反応時間は使用するテ
トラカルボン酸二無水物、溶剤の種類、反応温度により
異なり、通常中間生成物であるポリアミド酸の生成が完
了するのに充分な時間反応させる。反応時間は24時
間、場合によっては1時間以内で充分である。Embedded image (Wherein R 1 is the same as above) with one or more tetracarboxylic dianhydrides in the presence or absence of an organic solvent, and the resulting polyamic acid is chemically or thermally reacted. Can be produced by imidization. The reaction temperature is usually 250 ° C. or lower, the reaction pressure is not particularly limited, and the reaction can be carried out at normal pressure. The reaction time varies depending on the type of tetracarboxylic dianhydride used, the type of solvent and the reaction temperature, and the reaction is usually carried out for a time sufficient to complete the production of the intermediate product, polyamic acid. A reaction time of 24 hours, in some cases within 1 hour, is sufficient.
【0026】このような反応により式(1)の繰り返し
単位に対応するポリアミド酸が得られ、ついでこのポリ
アミド酸を100〜400℃に加熱脱水するか、または
通常用いられるイミド化剤を用いて化学イミド化するこ
とにより式(1)の繰り返し構造単位を有するポリイミ
ドが得られる。また、ポリアミド酸の生成と熱イミド化
反応を同時に行ってポリイミドを得ることもできる。By such a reaction, a polyamic acid corresponding to the repeating unit of the formula (1) is obtained, and the polyamic acid is then dehydrated by heating to 100 to 400 ° C. or chemically dehydrated using a commonly used imidizing agent. By imidization, a polyimide having a repeating structural unit of the formula (1) is obtained. In addition, polyimide can be obtained by simultaneously performing the polyamic acid generation and the thermal imidization reaction.
【0027】この方法て使用される式(8)のエーテル
ジアミンとしては、式(8)中のXが脂肪属基であるも
のとして、〔4−(3−アミノフェノキシ)フェニル〕
メタン、1,1−ビス〔4−(3−アミノフェノキシ)
フェニル〕エタン、1,2−ビス〔4−(3−アミノフ
ェノキシ)フェニル〕エタン、2,2−ビス〔4−(3
−アミノフェノキシ)フェニル〕プロパン、2−〔4−
(3−アミノフェノキシ)フェニル〕−2−〔4−(3
−アミノフェノキシ)−3−メチルフェニル〕プロパ
ン、2,2−ビス〔4−(3−アミノフェノキシ)−3
−メチルフェニル〕プロパン、2−〔4−(3−アミノ
フェノキシ)フェニル〕−2−〔4−(3−アミノフェ
ノキシ)−3,5−ジメチルフェニル〕プロパン、2,
2−ビス〔4−(3−アミノフェノキシ)−3,5−ジ
メチルフェニル〕プロパン、2,2−ビス〔4−(3−
アミノフェノキシ)フェニル〕ブタン、2,2−ビス
〔4−(3−アミノフェノキシ)フェニル〕−1,1,
1,3,3,3−ヘキサフルオロプロパン、式中のXが
直接結合のものとして、4,4’−ビス(3−アミノフ
ェノキシ)ビフェニル、4,4’−ビス(3−アミノフ
ェノキシ)−3−メチルビフェニル、4,4’−ビス
(3−アミノフェノキシ)−3,3’−ジメチルビフェ
ニル、4,4’−ビス(3−アミノフェノキシ)−3,
5−ジメチルビフェニル、4,4’−ビス(3−アミノ
フェノキシ)−3,3’,5,5’−テトラメチルビフ
ェニル、4,4’−ビス(3−アミノフェノキシ)−
3,3’−ジクロロビフェニル、4,4’−ビス(3−
アミノフェノキシ)−3,5−ジクロロビフェニル、
4,4’−ビス(3−アミノフェノキシ)−3,3’,
5,5’−テトラクロロビフェニル、4,4’−ビス
(3−アミノフェノキシ)−3,3’−ジブロモビフェ
ニル、4,4’−ビス(3−アミノフェノキシ)−3,
5−ジブロモビフェニル、4,4’−ビス(3−アミノ
フェノキシ)−3,3’,5,5’−テトラブロモビフ
ェニル、式中のXが−CO−基のものとして、ビス〔4
−(3−アミノフェノキシ)フェニル〕ケトン、ビス
〔4−{4−(4−アミノフェノキシ)フェノキシ}フ
ェニル〕ケトン、式中のXが−S−基のものとして、ビ
ス〔4−(3−アミノフェノキシ)フェニル〕スルフィ
ド、ビス〔4−(3−アミノフェノキシ)−3−メトキ
シフェニル〕スルフィド、〔4−(3−アミノフェノキ
シ)フェニル〕〔4−(3−アミノフェノキシ)3,5
−ジメトキシフェニル〕スルフィド、ビス〔4−(3−
アミノフェノキシ)−3,5−ジメトキシフェニル〕ス
ルフィド、式中のXが−SO2 −基のものとして、ビス
〔4−(3−アミノフェノキシ)フェニル〕スルホン、
ビス〔4−{4−(4−アミノフェノキシ)フェノキ
シ}フェニル〕スルホン、式中のXが−O−基のものと
して、ビス〔4−(3−アミノフェノキシ)フェニル〕
エーテル、ビス〔4−(4−アミノフェノキシ)フェニ
ル〕エーテル、式中のXがその他のものとして、1,4
−ビス〔4−(3−アミノフェノキシ)フェノキシ〕ベ
ンゼン、1,4−ビス〔4−(4−アミノフェノキシ)
フェノキシ〕ベンゼン、1,4−ビス〔4−(3−アミ
ノフェノキシ)ベンゾイル〕ベンゼン、1,3−ビス
〔4−(3−アミノフェノキシ)ベンゾイル〕ベンゼ
ン、ビス〔4−{4−(4−アミノフェノキシ)フェノ
キシ}フェニル〕スルホンなどが挙げられ、これらは単
独あるいは2種以上混合して用いられる。The ether diamine of the formula (8) used in this method includes a compound represented by the formula (8) wherein X is an aliphatic group, and is represented by [4- (3-aminophenoxy) phenyl].
Methane, 1,1-bis [4- (3-aminophenoxy)
Phenyl] ethane, 1,2-bis [4- (3-aminophenoxy) phenyl] ethane, 2,2-bis [4- (3
-Aminophenoxy) phenyl] propane, 2- [4-
(3-aminophenoxy) phenyl] -2- [4- (3
-Aminophenoxy) -3-methylphenyl] propane, 2,2-bis [4- (3-aminophenoxy) -3
-Methylphenyl] propane, 2- [4- (3-aminophenoxy) phenyl] -2- [4- (3-aminophenoxy) -3,5-dimethylphenyl] propane, 2,
2-bis [4- (3-aminophenoxy) -3,5-dimethylphenyl] propane, 2,2-bis [4- (3-
Aminophenoxy) phenyl] butane, 2,2-bis [4- (3-aminophenoxy) phenyl] -1,1,1
1,3,3,3-hexafluoropropane, in which X is a direct bond, 4,4'-bis (3-aminophenoxy) biphenyl, 4,4'-bis (3-aminophenoxy)- 3-methylbiphenyl, 4,4'-bis (3-aminophenoxy) -3,3'-dimethylbiphenyl, 4,4'-bis (3-aminophenoxy) -3,
5-dimethylbiphenyl, 4,4'-bis (3-aminophenoxy) -3,3 ', 5,5'-tetramethylbiphenyl, 4,4'-bis (3-aminophenoxy)-
3,3'-dichlorobiphenyl, 4,4'-bis (3-
Aminophenoxy) -3,5-dichlorobiphenyl,
4,4′-bis (3-aminophenoxy) -3,3 ′,
5,5'-tetrachlorobiphenyl, 4,4'-bis (3-aminophenoxy) -3,3'-dibromobiphenyl, 4,4'-bis (3-aminophenoxy) -3,
5-dibromobiphenyl, 4,4′-bis (3-aminophenoxy) -3,3 ′, 5,5′-tetrabromobiphenyl, wherein X is a —CO— group, and bis [4
-(3-aminophenoxy) phenyl] ketone, bis [4- {4- (4-aminophenoxy) phenoxy} phenyl] ketone, in which X is a -S- group, and bis [4- (3- Aminophenoxy) phenyl] sulfide, bis [4- (3-aminophenoxy) -3-methoxyphenyl] sulfide, [4- (3-aminophenoxy) phenyl] [4- (3-aminophenoxy) 3.5
-Dimethoxyphenyl] sulfide, bis [4- (3-
Aminophenoxy) -3,5-dimethoxyphenyl] sulfide, wherein X is a —SO 2 — group, and bis [4- (3-aminophenoxy) phenyl] sulfone;
Bis [4- {4- (4-aminophenoxy) phenoxy} phenyl] sulfone wherein X is a -O- group, and bis [4- (3-aminophenoxy) phenyl]
Ether, bis [4- (4-aminophenoxy) phenyl] ether, wherein X is other than 1,4
-Bis [4- (3-aminophenoxy) phenoxy] benzene, 1,4-bis [4- (4-aminophenoxy)
Phenoxy] benzene, 1,4-bis [4- (3-aminophenoxy) benzoyl] benzene, 1,3-bis [4- (3-aminophenoxy) benzoyl] benzene, bis [4- {4- (4- Aminophenoxy) phenoxy {phenyl] sulfone, etc., and these may be used alone or as a mixture of two or more.
【0028】また、上記熱可塑性ポリイミド樹脂の溶融
流動性を損なわない範囲で他のジアミンを混合して用い
ることもできる。混合して用いることのできるジアミン
としてはm−アミノベンジルアミン、p−アミノベンジ
ルアミン、3,3’−ジアミノジフェニルエーテル、
3,4’−ジアミノジフェニルエーテル、4,4’−ジ
アミノジフェニルエーテル、3,3’−ジアミノジフェ
ニルスルフィド、3,4’−ジアミノジフェニルスルフ
ィド、4,4’−ジアミノジフェニルスルフィド、3,
3’−ジアミノジフェニルスルホン、3,4’−ジアミ
ノジフェニルスルホン、4,4’−ジアミノジフェニル
スルホン、3,3’−ジアミノベンゾフェノン、3,
4’−ジアミノベンゾフェノン、4,4’−ジアミノベ
ンゾフェノン、1,3−ビス(3−アミノフェノキシ)
ベンゼン、1,3−ビス(4−アミノフェノキシ)ベン
ゼン、1,4−ビス(3−アミノフェノキシ)ベンゼ
ン、1,4−ビス(4−アミノフェノキシ)ベンゼン、
2,2−ビス〔4−(4−アミノフェノキシ)フェニ
ル〕プロパン、4,4’−ビス(4−アミノフェノキ
シ)ビフェニル、4,4’−ビス(4−アミノフェノキ
シ)フェニル〕ケトン、ビス〔4−アミノフェノキシ)
フェニル〕スルフィド、ビス〔4−(4−アミノフェノ
キシ)フェニル〕スルホン等が挙げられ、これらのジア
ミンは通常30重量%以下、好ましくは5重量%以下混
合して用いられる。Further, other diamines can be mixed and used as long as the melt fluidity of the thermoplastic polyimide resin is not impaired. Examples of the diamine that can be used as a mixture include m-aminobenzylamine, p-aminobenzylamine, 3,3′-diaminodiphenyl ether,
3,4′-diaminodiphenyl ether, 4,4′-diaminodiphenyl ether, 3,3′-diaminodiphenyl sulfide, 3,4′-diaminodiphenyl sulfide, 4,4′-diaminodiphenyl sulfide, 3,
3′-diaminodiphenylsulfone, 3,4′-diaminodiphenylsulfone, 4,4′-diaminodiphenylsulfone, 3,3′-diaminobenzophenone, 3,
4'-diaminobenzophenone, 4,4'-diaminobenzophenone, 1,3-bis (3-aminophenoxy)
Benzene, 1,3-bis (4-aminophenoxy) benzene, 1,4-bis (3-aminophenoxy) benzene, 1,4-bis (4-aminophenoxy) benzene,
2,2-bis [4- (4-aminophenoxy) phenyl] propane, 4,4′-bis (4-aminophenoxy) biphenyl, 4,4′-bis (4-aminophenoxy) phenyl] ketone, bis [ 4-aminophenoxy)
Phenyl] sulfide, bis [4- (4-aminophenoxy) phenyl] sulfone and the like, and these diamines are usually used in a mixture of 30% by weight or less, preferably 5% by weight or less.
【0029】また、式(1)で表されるポリイミドを製
造するのに用いられる一方の原料であるテトラカルボン
酸二無水物の具体例としては、式(9)において、式中
のR1 が脂肪族基であるエチレンテトラカルボン酸二無
水物、ブタンテトラカルボン酸二無水物、式中のR1 が
環式脂肪族基であるものとしてはシクロペンタンテトラ
カルボン酸二無水物、式中のR1 が単環式脂肪族基であ
るものとしてはピロメリット酸二無水物、1,2,3,
4−ベンゼンテトラカルボン酸二無水物、式中のR1 が
次式〔化22〕で表され、As a specific example of tetracarboxylic dianhydride which is one of the raw materials used for producing the polyimide represented by the formula (1), in the formula (9), R 1 in the formula is Aliphatic groups such as ethylenetetracarboxylic dianhydride and butanetetracarboxylic dianhydride; those in which R 1 in the formula is a cycloaliphatic group include cyclopentanetetracarboxylic dianhydride; Examples of the group in which 1 is a monocyclic aliphatic group include pyromellitic dianhydride, 1,2,3
4-benzenetetracarboxylic dianhydride, in which R 1 is represented by the following formula:
【0030】[0030]
【化22】 同式中のX1 が−CO−基である3,3’,4,4’−
ベンゾフェノンテトラカルボン酸二無水物、2,2’,
3,3’−ベンゾフェノンテトラカルボン酸二無水物、
同式中のX1 が直接結合である3,3’,4,4’−ビ
フェニルテトラカルボン酸二無水物、2,2’,3,
3’−ビフェニルテトラカルボン酸二無水物、同式中の
X1 が脂肪族基である2,2−ビス(3,4−ジカルボ
キシフェニル)プロパン二無水物、2,2−ビス(2,
3−ジカルボキシフェニル)プロパン二無水物、1,1
−ビス(2,3−ジカルボキシフェニル)エタン二無水
物、ビス(2,3−ジカルボキシフェニル)メタン二無
水物、ビス(3,4−ジカルボキシフェニル)メタン二
無水物、同式中のX1 が−O−基であるビス(3,4−
ジカルボキシフェニル)エーテル二無水物、同式中のX
1 が−SO2 −基であるビス(3,4−ジカルボキシフ
ェニル)スルホン二無水物、また、式(9)中のR1 が
縮合多環式芳香族基である2,3,6,7−ナフタレン
テトラカルボン酸二無水物、1,4,5,8−ナフタレ
ンテトラカルボン酸二無水物、1,2,5,6−ナフタ
レンテトラカルボン酸二無水物、3,4,9,10−ペ
リレンテトラカルボン酸二無水物、2,3,6,7−ア
ントラセンテトラカルボン酸二無水物、1,2,7,8
−フェナントレンテトラカルボン酸二無水物、同式中の
R1 がその他のものとして、ビス(3,4ジカルボキ
シ)(p−フェニレンジオキシ)二無水物などであり、
これらテトラカルボン酸二無水物は単独または2種以上
混合して用いられる。また、本発明に用いられる式
(1)で表されるポリイミド樹脂は、無水フタル酸、
2,3−ベンゾフェノンジカルボン酸無水物、 3,4−ベン
ゾフェノンジカルボン酸無水物、 2,3−ジカルボキシフ
ェニルフェニルエーテル無水物、 3,4−ジカルボキシフ
ェニルフェニルエーテル無水物、 2,3−ビフェニルジカ
ルボン酸無水物、3,4−ビフェニルジカルボン酸無水
物、 2,3−ジカルボキシフェニルフェニルスルホン無水
物、 3,4−ジカルボキシフェニルフェニルスルホン無水
物、 2,3−ジカルボキシフェニルフェニルスルフィド無
水物、 3,4−ジカルボキシフェニルフェニルスルフィド
無水物、 1,2−ナフタレンジカルボン酸無水物、 2,3−
ナフタレンジカルボン酸無水物、 1,8−ナフタレンジカ
ルボン酸無水物、 1,2−アントラセンジカルボン酸無水
物、 2,3−アントラセンジカルボン酸無水物、1,9 −ア
ントラセンジカルボン酸無水物等のジカルボン酸無水物
で封止されたものも使用可能である。Embedded image 3,3 ′, 4,4′- wherein X 1 in the formula is a —CO— group
Benzophenonetetracarboxylic dianhydride, 2,2 ',
3,3′-benzophenonetetracarboxylic dianhydride,
3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride wherein X 1 in the formula is a direct bond, 2,2 ′, 3
3′-biphenyltetracarboxylic dianhydride, 2,2-bis (3,4-dicarboxyphenyl) propane dianhydride wherein X 1 is an aliphatic group, 2,2-bis (2
3-dicarboxyphenyl) propane dianhydride, 1,1
-Bis (2,3-dicarboxyphenyl) ethane dianhydride, bis (2,3-dicarboxyphenyl) methane dianhydride, bis (3,4-dicarboxyphenyl) methane dianhydride; Bis (3,4-) wherein X 1 is an -O- group
Dicarboxyphenyl) ether dianhydride, X in the formula
Bis (3,4-dicarboxyphenyl) sulfone dianhydride in which 1 is a —SO 2 — group, and 2,3,6 in which R 1 in the formula (9) is a condensed polycyclic aromatic group 7-naphthalenetetracarboxylic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, 1,2,5,6-naphthalenetetracarboxylic dianhydride, 3,4,9,10- Perylenetetracarboxylic dianhydride, 2,3,6,7-anthracenetetracarboxylic dianhydride, 1,2,7,8
-Phenanthrenetetracarboxylic dianhydride, wherein R 1 in the formula is other than bis (3,4 dicarboxy) (p-phenylenedioxy) dianhydride;
These tetracarboxylic dianhydrides are used alone or in combination of two or more. In addition, the polyimide resin represented by the formula (1) used in the present invention includes phthalic anhydride,
2,3-benzophenone dicarboxylic anhydride, 3,4-benzophenone dicarboxylic anhydride, 2,3-dicarboxyphenyl phenyl ether anhydride, 3,4-dicarboxyphenyl phenyl ether anhydride, 2,3-biphenyl dicarboxylic Acid anhydride, 3,4-biphenyldicarboxylic anhydride, 2,3-dicarboxyphenylphenylsulfone anhydride, 3,4-dicarboxyphenylphenylsulfone anhydride, 2,3-dicarboxyphenylphenylsulfide anhydride, 3,4-dicarboxyphenylphenyl sulfide anhydride, 1,2-naphthalenedicarboxylic anhydride, 2,3-
Dicarboxylic anhydrides such as naphthalenedicarboxylic anhydride, 1,8-naphthalenedicarboxylic anhydride, 1,2-anthracenedicarboxylic anhydride, 2,3-anthracenedicarboxylic anhydride, and 1,9-anthracenedicarboxylic anhydride Those sealed with an object can also be used.
【0031】式(1)で表わされる繰り返し単位を有す
るポリイミド樹脂の対数粘度は通常0.35〜0.65
dl/g、好ましくは0.40〜0.60dl/gの範
囲のものである。この対数粘度が上記の範囲を越えて
0.35以下であると機械物性、耐久性が不十分とな
り、また0.65以上であると成形性悪化し射出成形困
難となる。この対数粘度はパラクロロフェノール/フェ
ノール(90/10重量比)の混合溶媒中、濃度0.5
g/100mlの溶媒で加熱溶解した後、35℃に冷却
して測定される。The logarithmic viscosity of the polyimide resin having a repeating unit represented by the formula (1) is usually 0.35 to 0.65.
dl / g, preferably in the range of 0.40 to 0.60 dl / g. If the logarithmic viscosity exceeds the above range and is 0.35 or less, mechanical properties and durability become insufficient. If it is 0.65 or more, moldability deteriorates and injection molding becomes difficult. This logarithmic viscosity is 0.5 in a mixed solvent of parachlorophenol / phenol (90/10 weight ratio).
After heating and dissolving with a solvent of g / 100 ml, the solution is cooled to 35 ° C. and measured.
【0032】また、本発明で用いられるサーモトロピッ
ク液晶ポリマーは、前記の式(2)、式(3)、式
(4)および式(5)から選ばれた少なくとも1種の基
本構造からなる熱可塑性樹脂である。Further, the thermotropic liquid crystal polymer used in the present invention has a thermal structure having at least one basic structure selected from the above formulas (2), (3), (4) and (5). It is a plastic resin.
【0033】これらサーモトロピック液晶ポリマーで市
販されている代表的なものには、日本石油化学(株)
「ザイダー」(商標)、住友化学工業(株)「エコノー
ル」(商標)、ポリプラスチック(株)「ベクトラ」
(商標)として市販されている本発明の摺動材用ポリイ
ミド系樹脂組成物において、ポリイミドとサーモトロピ
ック液晶ポリマーとを含む樹脂組成物の両者の配合割合
は、ポリイミド樹脂50〜99重量%とサーモトロピッ
ク液晶ポリマー50〜1重量%である。サーモトロピッ
ク液晶ポリマーの配合割合が、50重量%を越えると得
られる樹脂組成物のウエルド強度が低下し、また、異方
性が目立つようになる。また、1重量%未満では得られ
る樹脂組成物の成形加工性が十分ではなく、結晶化に伴
う熱処理過程での成形品の寸法安定性も改良されない。Representative examples of these thermotropic liquid crystal polymers which are commercially available include Nippon Petrochemical Co., Ltd.
"Zyder" (trademark), Sumitomo Chemical Co., Ltd. "Econol" (trademark), Polyplastics Co., Ltd. "Vectra"
In the polyimide resin composition for a sliding material of the present invention, which is commercially available as (Trademark), the mixing ratio of both the polyimide and the resin composition containing the thermotropic liquid crystal polymer is 50 to 99% by weight of the polyimide resin and the thermoplastic resin. The tropic liquid crystal polymer is 50 to 1% by weight. When the compounding ratio of the thermotropic liquid crystal polymer exceeds 50% by weight, the weld strength of the obtained resin composition decreases and the anisotropy becomes conspicuous. If the amount is less than 1% by weight, the molding processability of the obtained resin composition is not sufficient, and the dimensional stability of the molded product in the heat treatment process accompanying crystallization is not improved.
【0034】また、ネマチック液晶相を形成しうるこれ
らのサーモトロピック液晶ポリマーをブレンドすること
により、結晶化速度が著しく向上し、昇温過程における
結晶化発熱温度の低温側へのシフト及び降温過程におけ
る結晶化発熱温度の高温側へのシフトが可能である。Further, by blending these thermotropic liquid crystal polymers capable of forming a nematic liquid crystal phase, the crystallization speed is remarkably improved, the crystallization exothermic temperature shifts to a lower temperature side in the temperature increasing process, and the crystallization temperature in the temperature decreasing process. The crystallization exothermic temperature can be shifted to a higher temperature side.
【0035】本発明の摺動材用ポリイミド系樹脂組成物
は、上記の樹脂組成物に必須の成分としてフッ素樹脂お
よび炭素繊維を含有してなるものである。The polyimide resin composition for a sliding material of the present invention contains a fluororesin and carbon fiber as essential components of the above resin composition.
【0036】上記のフッ素樹脂とは、分子中にフッ素原
子(F)を含有する合成高分子のことであり、一般に他
の合成樹脂と比較して耐熱性、耐薬品性、電気特性に優
れ、また特有の低摩擦特性、非粘着性をそなえている。The above-mentioned fluororesin is a synthetic polymer containing a fluorine atom (F) in the molecule, and is generally superior in heat resistance, chemical resistance and electric properties as compared with other synthetic resins. In addition, it has unique low friction characteristics and non-adhesiveness.
【0037】その具体例としては、 (a)分子内に、式、−(CF2CF2)−で表わされる
繰り返し構造単位を有する四フッ化エチレン樹脂、 (b)分子内に、 式、−(CF2CF2)− および 式、−〔CF(CF3) CF2〕− で表わされる繰り返し構造単位を有する四フッ化エチレ
ン樹脂−六フッ化プロピレン共重合樹脂、 (c)分子内に、 式、−(CF2CF2)− および 式、−〔CF(OCmF2m++1)CF2〕(式中、mは正
の整数) で表される繰り返し構造単位を有する四フッ化エチレン
−パーフロロアルキルビニルエーテル共重合樹脂、 (d)分子内に、 式、−(CF2CF2)− および 式、−(CH2CH2)− で表される繰り返し構造単位を有する四フッ化エチレン
−エチレン共重合樹脂、 (e)分子内に、 式、−(CH2CH2)− および 式、−(CFClCF2) − で表される繰り返し構造単位を有する三フッ化塩化エチ
レン−エチレン共重合樹脂、 (f)分子内に、式、−(CF2CH2)−で表わされる
繰り返し構造単位を有するフッ化ビニリデン樹脂、等が
あげられる。Specific examples thereof include: (a) a tetrafluoroethylene resin having a repeating structural unit represented by the formula — (CF 2 CF 2 ) — in the molecule; and (b) a formula: — (CF 2 CF 2 ) — and a tetrafluoroethylene resin-propylene hexafluoride propylene copolymer resin having a repeating structural unit represented by the formula: — [CF (CF 3 ) CF 2 ] —. Tetrafluoride having a repeating structural unit represented by the formula,-(CF 2 CF 2 )-and the formula,-[CF (OC m F 2m ++ 1 ) CF 2 ] (where m is a positive integer) (D) tetrafluoride having a repeating structural unit represented by the formula,-(CF 2 CF 2 )-and the formula-(CH 2 CH 2 )-in the molecule. Ethylene-ethylene copolymer resin, (e) in the molecule, , - (CH 2 CH 2) - and formula, - (CFClCF 2) - trifluorochloroethylene having a repeating structural unit represented by - ethylene copolymer resin, in (f) molecular formula, - (CF 2 CH 2) - vinylidene fluoride resin having a repeating structural unit represented by, and the like.
【0038】上記の中でも 式(a)の四フッ化エチレ
ン樹脂(以下、PTFEという)はこれらの性質が抜群
であり、本発明では最も好ましく用いられる。本発明の
摺動材用ポリイミド系樹脂組成物に使用するフッ素樹脂
は、通常粉末状であり、約1〜25ミクロン、好ましく
は約5〜10ミクロンの粒度を有している。Among the above, the ethylene tetrafluoride resin of the formula (a) (hereinafter referred to as PTFE) is excellent in these properties, and is most preferably used in the present invention. The fluororesin used in the polyimide resin composition for a sliding material of the present invention is usually in the form of a powder, and has a particle size of about 1 to 25 microns, preferably about 5 to 10 microns.
【0039】本発明におけるフッ素樹脂の添加量は、ポ
リイミド樹脂とサーモトロピック液晶ポリマーからなる
前記樹脂組成物100重量部に対して、フッ素樹脂1〜
60重量部の範囲である。The amount of the fluororesin used in the present invention is 1 to 100 parts by weight of the resin composition comprising a polyimide resin and a thermotropic liquid crystal polymer.
It is in the range of 60 parts by weight.
【0040】ポリイミド樹脂とサーモトロピック液晶ポ
リマーからなる前記樹脂組成物100重量部に対して、
フッ素樹脂の添加量が1重量部未満では、耐摩擦性改良
効果が小さく、また添加量が60重量部を越えると、得
られる樹脂組成物の機械的特性が悪くなる。With respect to 100 parts by weight of the resin composition comprising a polyimide resin and a thermotropic liquid crystal polymer,
When the addition amount of the fluororesin is less than 1 part by weight, the effect of improving the friction resistance is small, and when the addition amount exceeds 60 parts by weight, the mechanical properties of the obtained resin composition deteriorate.
【0041】本発明における炭素繊維の添加量は、ポリ
イミド樹脂とサーモトロピック液晶ポリマーからなる前
記樹脂組成物100重量部に対して、炭素繊維5〜16
0重量部の範囲である。The amount of carbon fiber added in the present invention is 5 to 16 carbon fibers per 100 parts by weight of the resin composition comprising a polyimide resin and a thermotropic liquid crystal polymer.
The range is 0 parts by weight.
【0042】ポリイミド樹脂とサーモトロピック液晶ポ
リマーからなる前記樹脂組成物100重量部に対して、
炭素繊維の添加量が5重量部未満では、機械特性改良効
果が小さく、また添加量が160重量部を越えると、得
られる樹脂組成物の成形加工性が十分ではない。With respect to 100 parts by weight of the resin composition comprising a polyimide resin and a thermotropic liquid crystal polymer,
If the amount of carbon fiber added is less than 5 parts by weight, the effect of improving mechanical properties is small, and if the amount exceeds 160 parts by weight, the moldability of the obtained resin composition is not sufficient.
【0043】尚、本発明の摺動材用ポリイミド系樹脂組
成物には、必要に応じガラス繊維、光学繊維、セラミッ
ク繊維、チタン酸カリウム繊維、金属繊維、ボロン繊
維、炭化ケイ素繊維、アスベスト、ロックウール等の繊
維状強化材、炭酸カルシウム、マイカ、ガラスビーズ、
グラファイト、二硫化モリブデン、クレー、シリカ、ア
ルミナ、タルク、ケイソウ土、水和アルミナ、シラスバ
ルーン等の充填剤、滑剤、離型剤、安定剤、着色剤、結
晶核剤の他、他の熱可塑性樹脂(例えば、ポリフェニレ
ンサルファイド、ポリエーテルイミド、ポリエーテルサ
ルホン、ポリエーテルケトン等)、熱硬化性樹脂(例え
ば、エポキシ樹脂、シリコーン樹脂、ポリアミドイミド
樹脂等)を併用してもよい。The polyimide resin composition for a sliding material according to the present invention may contain, if necessary, glass fiber, optical fiber, ceramic fiber, potassium titanate fiber, metal fiber, boron fiber, silicon carbide fiber, asbestos, and rock. Fibrous reinforcement such as wool, calcium carbonate, mica, glass beads,
Fillers such as graphite, molybdenum disulfide, clay, silica, alumina, talc, diatomaceous earth, hydrated alumina, shirasu balloon, lubricants, mold release agents, stabilizers, coloring agents, crystal nucleating agents, and other thermoplastics Resins (for example, polyphenylene sulfide, polyether imide, polyether sulfone, polyether ketone, etc.) and thermosetting resins (for example, epoxy resin, silicone resin, polyamide imide resin, etc.) may be used in combination.
【0044】本発明の摺動材用ポリイミド系樹脂組成物
を調製するための諸原材料を混合する手段は、特に限定
されるものではなく、原料を個別に溶融混合機に供給し
ても、また予めヘンシェルミキサー、ボールミキサー、
リボンブレンダー等の汎用の混合機を用いて2種以上の
ものを同時に混合してもよい。通常、混合温度は、25
0〜420℃、好ましくは300〜400℃である。The means for mixing the various raw materials for preparing the polyimide resin composition for a sliding material of the present invention is not particularly limited, and the raw materials may be individually supplied to a melt mixer. Henschel mixer, ball mixer,
Two or more types may be mixed simultaneously using a general-purpose mixer such as a ribbon blender. Typically, the mixing temperature is 25
The temperature is 0 to 420 ° C, preferably 300 to 400 ° C.
【0045】本発明の摺動材用ポリイミド系樹脂組成物
を成形方法も、圧縮成形、焼結成形等を適用し得ること
は勿論であるが、均一溶融ブレンド体を形成し生産性の
高い射出成形もしくは押出成形を行うことができる。The polyimide resin composition for a sliding material of the present invention can be formed by compression molding, sintering, or the like as a molding method. Molding or extrusion can be performed.
【0046】上記の本発明の樹脂組成物は、摺動性、耐
熱性、耐薬品性、機械的強度に優れているため、歯車、
カム、プッシング、プーリー、スリーブ、軸受け等の機
械部品や、コネクター、ボビン、ICソケット等の電気
・電子部品、また、インペラ、マニホールド、バルブガ
イド、バルムステム、ピストンスカート、オイルパン、
フロントカバー、ロッカーカバー等の自動車部品に使用
できる。以下、本発明を実施例および比較例により詳細
に説明する。The resin composition of the present invention has excellent sliding properties, heat resistance, chemical resistance, and mechanical strength.
Mechanical parts such as cams, pushing, pulleys, sleeves, bearings, etc., electrical and electronic parts such as connectors, bobbins, IC sockets, impellers, manifolds, valve guides, valve stems, piston skirts, oil pans,
It can be used for automotive parts such as front covers and rocker covers. Hereinafter, the present invention will be described in detail with reference to Examples and Comparative Examples.
【0047】なお、実施例および比較例で用いたサーモ
トロピック液晶ポリマー、フッ素樹脂および炭素繊維は
次の通りである。 (1)サーモトロピック液晶ポリマー: 日本石油化学社製 Xydar SRT−500 住友化学工業社製 エコノール E−6000 ポリプラスチック社製 ベクトラ A−950 (2)フッ素樹脂: ダンキン社製 PTFE L−5 (3)炭素繊維: 東邦レーヨン社製 炭素繊維 HTAThe thermotropic liquid crystal polymer, fluororesin and carbon fiber used in the examples and comparative examples are as follows. (1) Thermotropic liquid crystal polymer: Xydar SRT-500 manufactured by Nippon Petrochemical Co., Ltd. Econor E-6000 manufactured by Sumitomo Chemical Co., Ltd. Vectra A-950 manufactured by Polyplastics (2) Fluororesin: PTFE L-5 manufactured by Dunkin (3) Carbon fiber: Carbon fiber HTA manufactured by Toho Rayon Co., Ltd.
【0048】[0048]
実施例1〜14 4,4’−ビス(3−アミノフェノキシ)ビフェニルと
ピロメリット酸二無水物を原料として得られた対数粘度
0.46dl/gのポリイミドと各種原材料を第1表に
示すような割合で乾式混合した後、二軸押出機を用いて
370〜400℃で押出して造粒し、得られたペレット
を射出成形機(シリンダー温度370〜410℃、射出
圧力900kg/cm2 、金型温度180℃)に供給
し、後述する各試験法に定められた試験片を成形し、摩
擦係数、摩耗係数、引張強度、曲げ強度を測定した。結
果を第1表,第2表に示す。なお、各試験方法は次の通
りである。Examples 1 to 14 Table 1 shows polyimides having a logarithmic viscosity of 0.46 dl / g and various raw materials obtained from 4,4'-bis (3-aminophenoxy) biphenyl and pyromellitic dianhydride as raw materials. After dry mixing at an appropriate ratio, the mixture is extruded at 370 to 400 ° C. using a twin-screw extruder and granulated, and the obtained pellets are injected into an injection molding machine (cylinder temperature 370 to 410 ° C., injection pressure 900 kg / cm 2 , gold (Temperature: 180 ° C.), and a test piece specified by each test method described later was formed, and the friction coefficient, the wear coefficient, the tensile strength, and the bending strength were measured. The results are shown in Tables 1 and 2. In addition, each test method is as follows.
【0049】1)摩擦係数:スラスト型摩擦摩耗試験機
を用い、摺動荷重10kg/cm2 、滑り速度毎分7
m、相手材ステンレススチール45C、無潤滑、運転時
間40分時の摩擦係数を求める。 2)摩耗係数:円筒式摩耗試験機を用い、摺動荷重5k
g/cm2 、滑り速度毎分100m、相手材SUS30
4、無潤滑、運転時間60時間時の摩耗係数を求める。 3)引張強度:ASTM−D−638による。 4)曲げ強度:ASTM−D790による。1) Coefficient of friction: Using a thrust-type friction and wear tester, a sliding load of 10 kg / cm 2 and a sliding speed of 7 per minute
m, the mating stainless steel 45C, no lubrication, and the friction coefficient at an operation time of 40 minutes are determined. 2) Abrasion coefficient: 5k sliding load using a cylindrical abrasion tester
g / cm 2 , sliding speed 100 m / min, mating material SUS30
4. Determine the wear coefficient at 60 hours with no lubrication. 3) Tensile strength: according to ASTM-D-638. 4) Flexural strength: according to ASTM-D790.
【0050】比較例1〜5 諸原材料の配合割合を第2表に示したようにした以外は
全て実施例1と全く同様の操作を行って試験片を作製
し、それぞれの性質を測定し、得られた結果を第3表に
併記した。Comparative Examples 1 to 5 Except that the mixing ratios of the various raw materials were as shown in Table 2, the same operations as in Example 1 were carried out to produce test pieces, and the properties of the test pieces were measured. The results obtained are shown in Table 3.
【0051】(第1表,第2表)と第3表を比較する
と、実施例1〜14はいずれも優れた摺動特性および機
械物性を有している。一方、比較例1〜5は、これらの
いずれかの特性が著しく劣っているか、成形加工性が悪
く成形困難等の欠点を有していることは明白である。Comparing (Tables 1 and 2) with Table 3, Examples 1 to 14 all have excellent sliding characteristics and mechanical properties. On the other hand, it is obvious that Comparative Examples 1 to 5 have disadvantages such as any of these properties being extremely inferior or poor moldability and difficulty in molding.
【0052】[0052]
【表1】 [Table 1]
【0053】[0053]
【表2】 [Table 2]
【0054】[0054]
【表3】 [Table 3]
【0055】[0055]
【発明の効果】以上のことから明らかなようにこの発明
の摺動材用ポリイミド系樹脂組成物からなる成形品は、
基材樹脂であるポリイミド樹脂およびサーモトロピック
液晶ポリマーからなる樹脂組成物本来の特性を損なうこ
となく、摺動特性および機械特性に非常に優れたもので
ある。As is apparent from the above description, the molded article made of the polyimide resin composition for a sliding material of the present invention is:
The sliding properties and mechanical properties are extremely excellent without impairing the inherent properties of a resin composition comprising a base resin, a polyimide resin and a thermotropic liquid crystal polymer.
【0056】よって、本発明の樹脂組成物は、摺動特
性、機械特性,耐熱性,耐薬品性に非常に優れているた
め、歯車,カム,プッシング,プーリー,プーリー,ス
リーブ,軸受け等の機械部品や、コネクター,ボビン,
ICソケット等の電気・電子部品、またインペラ,マニ
ホールド,バルブガイド,バルブシステム,ピストンス
カート,オイルパン,フロントカバー,ロッカーカバー
等の自動車部品、その他各種機器類の摺動部品に広く利
用することができるので、この発明の意義は極めて大き
いといえる。Therefore, since the resin composition of the present invention is very excellent in sliding properties, mechanical properties, heat resistance, and chemical resistance, it can be used in machines such as gears, cams, pushing, pulleys, pulleys, sleeves, bearings and the like. Parts, connectors, bobbins,
It can be widely used for electric and electronic parts such as IC sockets, automobile parts such as impellers, manifolds, valve guides, valve systems, piston skirts, oil pans, front covers, rocker covers, and other various equipment. Therefore, it can be said that the present invention is extremely significant.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 堤 敏彦 神奈川県横浜市栄区笠間町1190番地 三 井東圧化学株式会社内 (72)発明者 高橋 敏明 神奈川県横浜市栄区笠間町1190番地 三 井東圧化学株式会社内 (72)発明者 大地 広泰 神奈川県横浜市栄区笠間町1190番地 三 井東圧化学株式会社内 (56)参考文献 特開 昭62−185748(JP,A) 特開 昭63−8455(JP,A) 特開 昭62−253655(JP,A) 特開 昭63−72755(JP,A) ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Toshihiko Tsutsumi 1190 Kasama-cho, Sakae-ku, Yokohama-shi, Kanagawa Prefecture Inside (72) Inventor Toshiaki Takahashi 1190 Kasama-cho, Sakae-ku, Yokohama-shi, Kanagawa Mitsui Toatsu Chemical Co., Ltd. (72) Inventor Hiroyasu Daichi 1190 Kasama-cho, Sakae-ku, Yokohama-shi, Kanagawa Prefecture Mitsui Toatsu Chemicals Co., Ltd. (56) References JP-A-62-185748 (JP, A) JP-A-63-8455 ( JP, A) JP-A-62-253655 (JP, A) JP-A-63-72755 (JP, A)
Claims (4)
単位を有するポリイミド樹脂50〜99重量%と、サー
モトロピック液晶ポリマーの1種または2種以上の混合
物50〜1重量%とを含む樹脂組成物と、この樹脂組成
物100重量部に対して、1〜60重量部のフッ素樹
脂、および5〜160重量部の炭素繊維を含有してな
り、370〜410℃の温度範囲で射出成形することを
特徴とする摺動材用ポリイミド系樹脂組成物。 【化1】 (式中、Xは直結、イオウ、炭素数1〜10の二価の炭
化水素基、六フッ素化されたイソプロピリデン基、カル
ボニル基、チオ基、スルホニル基、酸素から成る群より
選ばれた基を表わし、Y1、Y2、Y3 およびY4 はそれ
ぞれ水素、塩素または臭素から成る群より選ばれた基を
表わし、またR1 は炭素数4〜9の脂肪族基、炭素数4
〜10の単環式脂肪族基、単環式芳香族基、縮合多環式
芳香族基、芳香族基が直接又は架橋員より相互に連結さ
れた非縮合多環式芳香族基から成る群より選ばれた4価
の基を表わす。)1. A composition comprising 50 to 99% by weight of a polyimide resin having a repeating unit represented by the formula (1) [Formula 1] and 50 to 1% by weight of a mixture of one or more thermotropic liquid crystal polymers. The resin composition contains 100 parts by weight of the resin composition, 1 to 60 parts by weight of a fluororesin, and 5 to 160 parts by weight of carbon fibers.
Ri, sliding material for a polyimide resin composition characterized that you injection molding at a temperature in the range of three hundred seventy to four hundred ten ° C.. Embedded image (Wherein X is a group selected from the group consisting of a direct bond, sulfur, a divalent hydrocarbon group having 1 to 10 carbon atoms, a hexafluorinated isopropylidene group, a carbonyl group, a thio group, a sulfonyl group, and oxygen. Wherein Y 1 , Y 2 , Y 3 and Y 4 each represent a group selected from the group consisting of hydrogen, chlorine and bromine, and R 1 represents an aliphatic group having 4 to 9 carbon atoms;
A group consisting of 10 to 10 monocyclic aliphatic groups, monocyclic aromatic groups, condensed polycyclic aromatic groups, and non-condensed polycyclic aromatic groups in which the aromatic groups are interconnected directly or by a bridge member Represents a tetravalent group selected from )
(2)〔化2〕、式(3)〔化3〕、式(4)〔化4〕
および式(5)〔化5〕の繰り返し単位を有する基本構
造からなる群より選ばれた少なくとも1種のものである
ことを特徴とする請求項1記載の摺動材用ポリイミド系
樹脂組成物。 【化2】 【化3】 【化4】 【化5】 2. The thermotropic liquid crystal polymer has the formula (2) [formula 2], the formula (3) [formula 3], the formula (4) [formula 4]
2. The polyimide resin composition for a sliding material according to claim 1, wherein the polyimide resin composition is at least one member selected from the group consisting of a basic structure having a repeating unit represented by the following formula (5). Embedded image Embedded image Embedded image Embedded image
る群より選ばれた少なくとも1種である請求項1記載の
摺動材用ポリイミド系樹脂組成物。 (a)分子内に、式、−(CF2CF2)−で表わされる
繰り返し構造単位を有する四フッ化エチレン樹脂 (b)分子内に、 式、−(CF2CF2)− および 式、−〔CF(CF3) CF2〕− で表わされる繰り返し構造単位を有する四フッ化エチレ
ン樹脂−六フッ化プロピレン共重合樹脂 (c)分子内に、 式、−(CF2CF2)− および 式、−〔CF(OCmF2m++1)CF2〕(式中、mは正
の整数) で表される繰り返し構造単位を有する四フッ化エチレン
−パーフロロアルキルビニルエーテル共重合樹脂 (d)分子内に、 式、−(CF2CF2)− および 式、−(CH2CH2)− で表される繰り返し構造単位を有する四フッ化エチレン
−エチレン共重合樹脂 (e)分子内に、 式、−(CH2CH2)− および 式、−(CFClCF2) − で表される繰り返し構造単位を有する三フッ化塩化エチ
レン−エチレン共重合樹脂 (f)分子内に、式、−(CF2CH2)−で表わされる
繰り返し構造単位を有するフッ化ビニリデン樹脂3. The polyimide resin composition for a sliding material according to claim 1, wherein the fluororesin is at least one selected from the group consisting of the following (a) to (f). (A) In a molecule, a tetrafluoroethylene resin having a repeating structural unit represented by the formula,-(CF 2 CF 2 )-; (b) In a molecule, a formula,-(CF 2 CF 2 )-and a formula: - [CF (CF 3) CF 2] - tetrafluoroethylene resin having recurring structural units represented by - the hexafluoropropylene copolymer resin (c) in the molecule, wherein, - (CF 2 CF 2) - and wherein - [CF (OC m F 2m ++ 1 ) CF 2 ] (wherein, m is a positive integer) tetrafluoroethylene having a repeating structural unit represented by - perfluoroalkyl vinyl ether copolymer resin (d ) In the molecule, a tetrafluoroethylene-ethylene copolymer resin having a repeating structural unit represented by the formula,-(CF 2 CF 2 )-and the formula-(CH 2 CH 2 )- formula, - (CH 2 CH 2) - and formula, - (C FClCF 2) - trifluorochloroethylene having a repeating structural unit represented by - ethylene copolymer resin (f) in the molecule, wherein, - (CF 2 CH 2) - fluoride having a repeating structural unit represented by Vinylidene resin
有するポリイミド樹脂の式中のR1 が、次の(a)〜
(e)からなる群より選ばれた少なくとも1種である請
求項1記載の摺動材用ポリイミド系樹脂組成物。 (a) 炭素数4〜9の脂肪族基 (b) 炭素数4〜10の環式脂肪族基 (c) 次式〔化6〕で表される単環式芳香族基 【化6】 (d) 次式〔化7〕で表される縮合多環式芳香族基 【化7】 (e)次式〔化8〕で表わされる芳香族基が直接又は架
橋員より相互に連結された非縮合多環式芳香族基 【化8】 4. The polyimide resin having a repeating structural unit represented by the formula (1), wherein R 1 in the formula is the following (a) to
The polyimide resin composition for a sliding material according to claim 1, which is at least one member selected from the group consisting of (e). (A) an aliphatic group having 4 to 9 carbon atoms (b) a cyclic aliphatic group having 4 to 10 carbon atoms (c) a monocyclic aromatic group represented by the following formula (6) (D) a condensed polycyclic aromatic group represented by the following formula: (E) a non-condensed polycyclic aromatic group in which an aromatic group represented by the following formula [Chemical formula 8] is connected directly or by a bridging member:
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3125789A JP2981301B2 (en) | 1991-05-29 | 1991-05-29 | Polyimide resin composition for sliding material |
| US07/883,267 US5312866A (en) | 1989-11-30 | 1992-05-14 | Polyimide based resin composition |
| US08/204,433 US5516837A (en) | 1989-11-30 | 1994-03-02 | Polyimide based resin composition |
| US08/474,112 US5571875A (en) | 1989-11-30 | 1995-06-07 | Polyimide based resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3125789A JP2981301B2 (en) | 1991-05-29 | 1991-05-29 | Polyimide resin composition for sliding material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04351664A JPH04351664A (en) | 1992-12-07 |
| JP2981301B2 true JP2981301B2 (en) | 1999-11-22 |
Family
ID=14918908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3125789A Expired - Fee Related JP2981301B2 (en) | 1989-11-30 | 1991-05-29 | Polyimide resin composition for sliding material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2981301B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4011939A4 (en) * | 2019-08-08 | 2022-12-14 | Mitsubishi Gas Chemical Company, Inc. | FIRE RESISTANT POLYIMIDE MOLDING MATERIAL AND MOLDED BODY |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3891607B2 (en) * | 1995-07-11 | 2007-03-14 | Ntn株式会社 | Heat-resistant / lubricating resin composition |
| JPH09286915A (en) * | 1995-12-28 | 1997-11-04 | Ntn Corp | Vane motor blade |
-
1991
- 1991-05-29 JP JP3125789A patent/JP2981301B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4011939A4 (en) * | 2019-08-08 | 2022-12-14 | Mitsubishi Gas Chemical Company, Inc. | FIRE RESISTANT POLYIMIDE MOLDING MATERIAL AND MOLDED BODY |
| US12466935B2 (en) | 2019-08-08 | 2025-11-11 | Mitsubishi Gas Chemical Company, Inc. | Flame-retardant polyimide shaping material and shaped body |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04351664A (en) | 1992-12-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4816516A (en) | Polyimide resin-fluoropolymer compositions | |
| US5312866A (en) | Polyimide based resin composition | |
| JPH02227460A (en) | Miscible composition of imido-containing polymer and poly (arylsulfone) | |
| KR940005648B1 (en) | Polyimide resin composition | |
| JP2981301B2 (en) | Polyimide resin composition for sliding material | |
| JP2919636B2 (en) | Polyimide resin composition for sliding material | |
| JP3083197B2 (en) | Oil-containing polyimide resin composition for sliding materials | |
| JP2923077B2 (en) | Carbon fiber reinforced polyimide resin composition | |
| JP3034143B2 (en) | Polyimide resin composition | |
| JP2602363B2 (en) | Resin composition | |
| JP2714544B2 (en) | Polyimide resin composition | |
| JP3224161B2 (en) | Polyimide resin composition | |
| JPH0218419A (en) | Production of polyimide excellent in thermal stability | |
| JPH03195771A (en) | Polyimide resin composition | |
| JP2644363B2 (en) | Polyimide resin composition | |
| KR940005649B1 (en) | Polyimide resin composition | |
| JPH05271537A (en) | Polyimide resin composition | |
| KR940005650B1 (en) | Polyimide Resin Composition | |
| JP3197372B2 (en) | Polyimide resin composition | |
| JP2930564B2 (en) | Polyimide resin composition | |
| JPH04323225A (en) | Production of polyimide resin composition through kneading | |
| JPH04351663A (en) | Polyimide resin composition | |
| JPH037765A (en) | Aromatic polyimide resin composition | |
| JPH0681804B2 (en) | Aromatic polysulfone resin composition | |
| JPS63312354A (en) | Polyphenylene sulfide resin composition |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |