JP2768111B2 - TAB-Method of Manufacturing Integrated Circuit and TAB Tape for the Method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to TAB (Tape Au).
The present invention relates to a method of manufacturing an integrated circuit (hereinafter referred to as an LSI) having a large number of input / output terminals by a tomated bonding method and a TAB tape used for the method.

[0002]

2. Description of the Related Art Conventionally, this type of TAB-LSI has been disclosed in FIG.
As shown in (1), a connection lead 4 is aligned with a connection terminal on an LSI 5 using a TAB tape 1 having an arbitrary required width, and is connected by thermocompression bonding or the like.

[0003]

The conventional TAB described above.
-The LSI has the same width as the original TAB tape even after being assembled into a TAB-LSI and subjected to an electrical test. Therefore, the width of the TAB tape that matches the degree of integration of the LSI is required. It was also necessary to separately prepare a carrier for holding. Further, the assembling apparatus for mounting the TAB-LSI has a drawback in that an apparatus corresponding to the tape width and the tape carrier must be prepared.

An object of the present invention is to firstly cut a TAB-LSI wide TAB tape to a commonly used tape width after completion of the electrical inspection of the TAB-LSI.
A TA which can share a carrier for holding a B tape and an assembling apparatus for mounting a TAB-LSI with an apparatus for a normal tape width.
A second object of the present invention is to provide a method for manufacturing a B-LSI and, secondly, to provide a TAB tape which is provided with a slit in a portion of the above-described TAB integrated circuit where the TAB tape is to be cut, thereby facilitating the cutting.

[0005]

[MEANS FOR SOLVING THE PROBLEMS] The first TAB- of the present invention.
A method of manufacturing an integrated circuit is as follows. In an integrated circuit that performs terminal connection by a TAB method, a TAB tape wider than a normal one is manufactured by assembling a TAB tape having a test terminal of the TAB integrated circuit, and the TAB tape of the TAB-integrated circuit is assembled. After the inspection of the integrated circuit is completed, the portion having the inspection terminal is cut,
Means for reducing the width of the TAB tape to a normal tape width is included.

[0006] The second TAB tape of the present invention is a TAB tape.
In an integrated circuit that connects terminals by the B method, TAB
A TAB tape having a wider width than that of a conventional TAB tape having integrated circuit test terminals is manufactured and assembled. A portion having a slit in advance is provided at a portion where the TAB tape is cut at a portion having the test terminals of the integrated circuit.

[0007]

(1) When assembling an LSI having a large number of terminals,
If the tape does not fit in a normal TAB width, for example, a 35 mm wide tape, a 48 mm or 70 mm wide TA
Use B tape. After assembling into a TAB-LSI and performing an electrical test, the TAB-LSI is fixed and cut into an outer shape having a normal tape width. At the same time, the sprocket holes that match the width are also punched. As a result, the TAB tape holding carrier and the mounting and assembling apparatus can be shared with those for ordinary TAB tape. (2) As described above, when cutting a wide tape of, for example, 70 mm into a normal tape of 35 mm, slits are provided in advance at portions to be cut. Thereby, the cutting load can be reduced.

[0008]

1A and 1B are plan views of a TAB-LSI according to a first embodiment of the present invention. In FIG. 1A, a wide TAB tape 1 having an electric inspection selection pad 3 which is a terminal for inspection of a TAB integrated circuit.
Are the LSI 5 and the ILB (I
nner Lead Bonding). This wide TAB tape is an LSI having a large number of terminals and a large number of selection pads for electrical inspection. Therefore, the total area of the pads is increased.
Used when a TAB tape with a width of mm cannot be used. Further, the width of the wide tape is selected so that the number of sorting pads for electrical inspection can be arranged, and a tape wider than 35 mm includes a 48 mm tape and a 70 mm tape.

The TAB-LSI of this wide tape is formed by using the TAB-L
The direction and position of SI are fixed, and a normal narrow TA
Cutting is performed so as to have the outer shape of the B-LSI. Then, the sprocket holes 6 are punched simultaneously with the cutting or earlier than the cutting. Since this sprocket hole is used for cutting the TAB-LSI when mounting later, high accuracy is required. A carrier for holding a narrow TAB tape has a structure in which a pin or the like is passed through the sprocket hole and held.

FIGS. 2A and 2B are plan views of a TAB-LSI according to a second embodiment of the present invention. This TAB
The tape is later converted from a wide TAB tape, for example, a 70 mm TAB tape, to a narrow TAB tape, for example, 35 m
When cutting into mTAB tape, the slit 8 is formed in advance so as to reduce the load at the time of cutting and facilitate cutting. Further, a sprocket hole 6 used as a narrow TAB-LSI when cutting into a narrow TAB tape is also formed in advance. Thus, the slit 8 and the sprocket hole 6
The TAB tape on which is formed is connected to the LSI via connection leads. Note that the TA in FIG.
The sorting pad 3 for electrical inspection of the B tape is formed at a portion outside the slit 8 and the sprocket hole 6 to be cut and removed, but there is no problem because it is cut after the electrical inspection.

[0011]

(1) As described above, the present invention provides a method for connecting a wide TAB tape to an LSI and cutting the wide TAB tape into a narrow TAB tape after an electrical test. When a TAB-LSI is mounted, there is no need for a dedicated manufacturing facility for a wide tape or a dedicated tape carrier for holding the TAB-LSI, so that the facility can be shared and the size of the facility can be reduced. (2) Further, the TAB tape in which slits and sprocket holes are previously formed can reduce the cutting load when cutting from a wide TAB tape to a narrow TAB tape. Cutting can be performed without causing deformation or deviation of the accuracy of the connection leads, and there is an effect that the yield can be improved and the accuracy can be improved.

[Brief description of the drawings]

FIG. 1 is a plan view of a TAB-LSI according to one embodiment of the present invention.

FIG. 2 is a plan view of a TAB-LSI according to another embodiment of the present invention.

FIG. 3 is a plan view of a conventional TAB-LSI.

[Explanation of Signs] 1 Wide TAB tape 2 Sprocket hole 3 Separation pad for electrical inspection 4 Connection lead 5 LSI 6 Sprocket hole 7 Narrow width TAB tape 8 Slit

Claims (2)

(57) [Claims] 1. A TAB for connecting terminals by a TAB method
-In a method of manufacturing an integrated circuit, a TAB tape having a TAB integrated circuit inspection terminal wider than a normal TAB tape is manufactured and assembled;
After the inspection of the integrated circuit is completed, the portion having the inspection terminal is cut to make the width of the TAB tape a normal tape width ,
And a method of manufacturing a TAB-integrated circuit, wherein a sprocket hole adapted to the tape width is provided . 2. TAB for connecting terminals by TAB method
-In a TAB tape used in a method of manufacturing an integrated circuit,
A TAB tape wider than the usual one is manufactured because it has a test terminal for the TAB integrated circuit. A slit is provided in advance at a place where the TAB tape at the portion having the test terminal for the TAB-integrated circuit to be cut is cut. Was done
A TAB tape characterized by having sprocket holes on a tape of normal width .