JP2690689B2 - Diamond cutter - Google Patents
Diamond cutterInfo
- Publication number
- JP2690689B2 JP2690689B2 JP6135905A JP13590594A JP2690689B2 JP 2690689 B2 JP2690689 B2 JP 2690689B2 JP 6135905 A JP6135905 A JP 6135905A JP 13590594 A JP13590594 A JP 13590594A JP 2690689 B2 JP2690689 B2 JP 2690689B2
- Authority
- JP
- Japan
- Prior art keywords
- underlayer
- segment
- view
- segment tip
- diamond cutter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910003460 diamond Inorganic materials 0.000 title claims description 15
- 239000010432 diamond Substances 0.000 title claims description 15
- 239000006061 abrasive grain Substances 0.000 claims description 10
- 239000010953 base metal Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 6
- 239000011800 void material Substances 0.000 claims 1
- 238000003466 welding Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 7
- 238000005259 measurement Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004566 building material Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009661 fatigue test Methods 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- FQMNUIZEFUVPNU-UHFFFAOYSA-N cobalt iron Chemical compound [Fe].[Co].[Co] FQMNUIZEFUVPNU-UHFFFAOYSA-N 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、石材・建材等の切断に
用いられるダイヤモンドカッターに関し、とくに、その
セグメントチップの形状に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a diamond cutter used for cutting stone materials, building materials and the like, and more particularly to the shape of its segment tip.
【０００２】[0002]
【従来の技術】石材・建材等の切断には、図７、図８に
示す形状のダイヤモンドカッターが用いられる。これら
の図において、（ａ）は正面図（左半分）、（ｂ）は断
面図である。2. Description of the Related Art A diamond cutter having a shape shown in FIGS. 7 and 8 is used for cutting stone materials and building materials. In these figures, (a) is a front view (left half), and (b) is a sectional view.
【０００３】これらのカッターのセグメントチップ２
は、ダイヤモンド砥粒を含有する砥粒層２ａと台金（円
板状基板）１との接着に適した材質から成る、下地層２
ｂから形成される。図中３は、切断時にセグメントチッ
プ２に掛かる応力による台金１の歪みを解放するための
溝である。Segment tip 2 of these cutters
Is an underlayer 2 made of a material suitable for adhering an abrasive grain layer 2a containing diamond abrasive grains and a base metal (disc-shaped substrate) 1.
b. Reference numeral 3 in the drawing denotes a groove for releasing the strain of the base metal 1 due to the stress applied to the segment tip 2 at the time of cutting.
【０００４】また、このセグメントチップ２は特開平３
−２２１２８１号公報に見られるように、円板状基板１
の周縁部にレーザー溶接電子ビーム溶接等の手段によ
り、固着される。Further, this segment chip 2 is disclosed in
Disc-shaped substrate 1
It is fixed to the peripheral portion of the substrate by means such as laser welding and electron beam welding.
【０００５】セグメントチップ２の形状は、図７に見ら
れる弓形のもの、図８に見られる扇形のものとがある
が、扇形のものが多く用いられる。The shape of the segment tip 2 includes an arc shape shown in FIG. 7 and a fan shape shown in FIG. 8, but a fan shape is often used.
【０００６】理由としては扇形の方がセグメントチップ
最外周部の間隔が狭く切断時の被削材との衝撃が小さく
加工部の表面品位が向上するためである。The reason is that the sector shape has a narrower interval between the outermost peripheral portions of the segment chips, has a smaller impact with the work material at the time of cutting, and improves the surface quality of the processed portion.
【０００７】[0007]
【発明が解決しようとする課題】しかしながら、上記の
従来技術においては、以下の問題点がある。However, the above-mentioned prior art has the following problems.
【０００８】 レーザ溶接法でセグメントチップ２を
台金１に固着する際、図９のａに見られるように、レー
ザービームの入口側で下地層２ｂに溶接引けが生じ、切
欠け状になってしまう（レーザービームの出口側の下地
層はｂに示すように切欠けの発生は少ない）。このため
この切欠き部ａには、切断時の衝撃で起こる応力が集中
しやすく疲労破壊の原因となっている。このことは、ダ
イヤモンドカッターの安全に関わる大きな問題であっ
た。When the segment tip 2 is fixed to the base metal 1 by the laser welding method, as shown in FIG. 9A, a weld shrinkage occurs in the underlayer 2b at the laser beam entrance side, resulting in a notch shape. (The base layer on the exit side of the laser beam has few notches as shown in b). For this reason, the stress generated by the impact at the time of cutting tends to concentrate in the notch portion a, which causes fatigue fracture. This has been a major issue regarding the safety of diamond cutters.
【０００９】 セグメントチップの間隔が狭いため
に、切粉が外部に排出されにくく図１０の矢印に見られ
るように切粉は、セグメントチップの前端に沿って内側
に流れ、それから下地層２ｂの下部に沿って流れる。Since the interval between the segment chips is small, the chips are difficult to be discharged to the outside, and the chips flow inward along the front end of the segment chip as shown by the arrow in FIG. Flowing along.
【００１０】このため図１１，図１２（ａ）に見られる
ように下地層２ｂの前部及び側面部が摩耗し、セグメン
トチップ２が台金１から剥離することがあった。因み
に、図１２（ｂ）は新品時の断面図である。As a result, as shown in FIGS. 11 and 12 (a), the front portion and the side surface portion of the underlayer 2b may be worn, and the segment tip 2 may be separated from the base metal 1. Incidentally, FIG. 12B is a sectional view of a new product.
【００１１】そこで、本発明が解決すべき課題は、レー
ザー溶接時に下地層に発生する切欠きを防止し、また、
切粉がセグメントチップの下部に流れにくくすることの
できるダイヤモンドカッターを提供することにある。Therefore, the problem to be solved by the present invention is to prevent notches generated in the underlayer during laser welding, and
An object of the present invention is to provide a diamond cutter capable of preventing chips from flowing under the segment chips.
【００１２】[0012]
【課題を解決するための手段】前記課題を解決するた
め、本発明は、溝を円周上に設けた円板状基板からなる
台金の周囲に、ダイヤモンド砥粒を含有する砥粒層と下
地層からなるセグメントチップを固着したダイヤモンド
カッターにおいて、前記溝の入口の幅よりもセグメント
チップの砥粒層の空隙の幅を広くし、かつ前記セグメン
トチップの下部端面に、１０〜３０°のすくい角をもつ
傾斜を設けたことを特徴とするものである。In order to solve the above-mentioned problems, the present invention provides an abrasive grain layer containing diamond abrasive grains around a base metal comprising a disk-shaped substrate provided with grooves on the circumference. In a diamond cutter to which a segment tip consisting of an underlayer is fixed, the width of the gap of the abrasive grain layer of the segment tip is made wider than the width of the entrance of the groove, and a rake of 10 to 30 ° is formed on the lower end face of the segment tip. It is characterized in that a slope having a corner is provided.
【００１３】[0013]
【作用】本発明では、図１に示すように、セグメントチ
ップ２の端面の下部端面にすくい角αをもつ傾斜部２ｃ
を形成した。（図１参照）In the present invention, as shown in FIG. 1, the inclined portion 2c having the rake angle α on the lower end face of the end face of the segment tip 2 is used.
Was formed. (See Fig. 1)
【００１４】上記手段によって次の作用がある。 １．レーザ溶接時の切欠き部分をすくい角αをもつ傾斜
部２ｃが補っており、下地層２ｂに切欠きができない。
このため疲労強度が高くなる。（図２参照） ２．下地層２ｂのすくい角αによって形成された前端部
の傾斜面２ｃで切粉は外周部にはね上げられる。このた
め、下地層２ｂの下部を切粉が流れにくくなり、摩耗が
少なくなる。（図３参照）The above means have the following effects. 1. The notch portion at the time of laser welding is supplemented by the inclined portion 2c having the rake angle α, and the notch cannot be formed in the base layer 2b.
Therefore, the fatigue strength increases. (See FIG. 2) 2. The chips are splashed to the outer peripheral portion by the inclined surface 2c at the front end formed by the rake angle α of the underlayer 2b. For this reason, the chips are less likely to flow in the lower portion of the base layer 2b, and wear is reduced. (See Fig. 3)
【００１５】[0015]
【実施例】以下、本発明を実施例を参照しながら具体的
に説明する。図４は本発明の実施例を示すものである。
図４（ａ）は正面図（左半分）、（ｂ）は断面図、
（ｃ）はセグメントチップ２の拡大図である。台金１の
材質はＳＣＭ４３０材、砥粒層２ａの材質はコバルト・
鉄系材料、下地層２ｂの材質は同じくコバルト・鉄系材
料とした。傾斜部２ｃのすくい角は２０度とした。台金
１の厚みは１．５ｍｍ、セグメントチップの外周長さは
３５ｍｍ、厚みは２．３ｍｍとした。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically described below with reference to embodiments. FIG. 4 shows an embodiment of the present invention.
4A is a front view (left half), FIG. 4B is a cross-sectional view,
(C) is an enlarged view of the segment chip 2. The base metal 1 is made of SCM430 and the abrasive layer 2a is made of cobalt.
The iron-based material and the material of the underlayer 2b were also cobalt-iron-based materials. The rake angle of the inclined portion 2c was 20 degrees. The base metal 1 had a thickness of 1.5 mm, the outer circumference of the segment tip was 35 mm, and the thickness was 2.3 mm.
【００１６】この実施例を用いて従来技術との比較を行
った結果を以下に示す。 （試験）実施例（図４）と従来技術（図８）を用いて表
１に示すレーザー溶接条件でテストカッターを試作し、
表２に示す疲れ試験及び表３に示す切断性能比較試験を
行った。The results of comparison with the prior art using this embodiment are shown below. (Test) Using the example (FIG. 4) and the prior art (FIG. 8), a test cutter was prototyped under the laser welding conditions shown in Table 1,
The fatigue test shown in Table 2 and the cutting performance comparison test shown in Table 3 were performed.
【００１７】[0017]
【表１】 レーザー溶接条件 [Table 1] Laser welding conditions
【００１８】[0018]
【表２】 疲れ試験条件 [Table 2] Fatigue test conditions
【００１９】[0019]
【表３】 [Table 3]
【００２０】（結果） （１）切欠き部の深さＡ 実施例（図４） ０．１ｍｍ 従来技術（図８） １．４ｍｍ(Results) (1) Depth A of Notch Part Example (FIG. 4) 0.1 mm Prior Art (FIG. 8) 1.4 mm
【００２１】（２）疲れ寿命 実施例（図４） ４×１０7 回で破壊せず。 従来技術（図８） ２×１０4 回で破壊した。(2) Fatigue life Example (FIG. 4) No damage occurred after 4 × 10 7 times. Conventional technology (Fig. 8) Damaged 2 x 10 4 times.
【００２２】図６はすくい角αを０〜３０度に変化させ
たときの下地層の摩耗量の測定結果を示すものである。
図中Ａは図５（ａ）に示す下地層２ｂの長手方向の切欠
き部の深さ、Ｂは図５（ｂ）に示す下地層２ｂの幅方向
の切欠きの深さを示すものである。この測定結果から分
かるように、すくい角２０度を超えると摩耗量はほぼ一
定化する。FIG. 6 shows the measurement results of the amount of wear of the underlayer when the rake angle α was changed from 0 to 30 degrees.
In the figure, A is the depth of the notch in the longitudinal direction of the underlayer 2b shown in FIG. 5A, and B is the depth of the notch in the width direction of the underlayer 2b shown in FIG. 5B. is there. As can be seen from the measurement results, the wear amount becomes almost constant when the rake angle exceeds 20 degrees.
【００２３】なお、本実施例では、下地層２ｂの端面に
すくい角αの傾斜部２ｃを形成した例を示しているが、
下地層２ｂだけでなく、砥粒層２ａを含んで傾斜部２ｃ
を形成してもよい。Although the present embodiment shows an example in which the inclined portion 2c having the rake angle α is formed on the end face of the underlayer 2b,
Inclined portion 2c including not only base layer 2b but also abrasive grain layer 2a
May be formed.
【００２４】[0024]
【発明の効果】上述したように、本発明によれば以下の
効果を奏する。As described above, the present invention has the following effects.
【００２５】レーザ溶接時に下地層に発生する切欠き
を防止することができ、疲労限度が向上する。Notches that occur in the underlayer during laser welding can be prevented, and the fatigue limit is improved.
【００２６】切粉を外部に排出する効率が高いため、
セグメントチップの下部に切粉が流れにくくなり、下地
層の摩耗を防止できる。Since the efficiency of discharging the cutting chips to the outside is high,
The chips are less likely to flow to the lower part of the segment tip, and the wear of the underlayer can be prevented.
【図１】 本発明に係るすくい角を形成したセグメント
チップの側面図である。FIG. 1 is a side view of a segment tip having a rake angle according to the present invention.
【図２】 本発明に係るすくい角を有するダイヤモンド
カッターのレーザー溶接状況を示す側面図である。FIG. 2 is a side view showing a laser welding state of a diamond cutter having a rake angle according to the present invention.
【図３】 本発明に係るすくい角を有するダイヤモンド
カッターの切断時の切粉の流れ状況を示す説明図であ
る。FIG. 3 is an explanatory diagram showing a flow state of chips during cutting of a diamond cutter having a rake angle according to the present invention.
【図４】 本発明の実施例を示すもので、（ａ）は正面
図（左半分）、（ｂ）は断面図、（ｃ）はセグメントチ
ップの拡大図である。FIG. 4 shows an embodiment of the present invention, (a) is a front view (left half), (b) is a sectional view, and (c) is an enlarged view of a segment chip.
【図５】 下地層の摩耗状況を示すもので、（ａ）は側
面図、（ｂ）は断面図である。FIG. 5 is a side view and (b) is a cross-sectional view showing the wear state of the underlayer.
【図６】 すくい角αを変化させたときの下地層の摩耗
量の測定結果を示すグラフである。FIG. 6 is a graph showing the measurement results of the wear amount of the underlayer when the rake angle α is changed.
【図７】 従来のダイヤモンドカッターの例を示すもの
であり、（ａ）は正面図（左半分）、（ｂ）は断面図で
ある。FIG. 7 shows an example of a conventional diamond cutter, (a) is a front view (left half), and (b) is a sectional view.
【図８】 従来のダイヤモンドカッターの他の例を示す
ものであり、（ａ）は正面図（左半分）、（ｂ）は断面
図である。FIG. 8 shows another example of a conventional diamond cutter, in which (a) is a front view (left half) and (b) is a sectional view.
【図９】 従来のダイヤモンドカッターにおけるレーザ
ー溶接時の切欠き発生状態を示す説明図である。FIG. 9 is an explanatory view showing a notch generation state during laser welding in a conventional diamond cutter.
【図１０】 従来における切断時の切粉の流れ状況を示
す説明図である。FIG. 10 is an explanatory diagram showing a flow state of chips during cutting in the related art.
【図１１】 セグメントチップの摩耗状態を示す拡大図
である。FIG. 11 is an enlarged view showing a worn state of the segment tip.
【図１２】 図１１のＡ−Ａ′断面図であり、（ａ）は
摩耗後の状態、（ｂ）は新品時の状態を示す。FIG. 12 is a cross-sectional view taken along the line AA ′ in FIG. 11, where (a) shows a state after wear and (b) shows a state when the product is new.
１ 台金（円板状基板）、２ セグメントチップ、２ａ
砥粒層、２ｂ 下地層、２ｃ 傾斜部、３ 溝1 base metal (disc-shaped substrate), 2 segment chips, 2a
Abrasive grain layer, 2b Underlayer, 2c Inclined portion, 3 groove
Claims (1)
台金の周囲に、ダイヤモンド砥粒を含有する砥粒層と下
地層からなるセグメントチップを固着したダイヤモンド
カッターにおいて、前記溝の入口の幅よりもセグメント
チップの砥粒層の空隙の幅を広くし、かつ前記セグメン
トチップの下部端面に、１０〜３０°のすくい角をもつ
傾斜を設けたことを特徴とするダイヤモンドカッター。1. A diamond cutter in which a segment tip composed of an abrasive grain layer containing diamond abrasive grains and an underlayer is fixed around a base metal made of a disk-shaped substrate provided with grooves on the circumference thereof. The width of the void of the abrasive grain layer of the segment tip is wider than the width of the inlet of the segment tip, and the lower end surface of the segment tip is provided with an inclination having a rake angle of 10 to 30 ° .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6135905A JP2690689B2 (en) | 1994-06-17 | 1994-06-17 | Diamond cutter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6135905A JP2690689B2 (en) | 1994-06-17 | 1994-06-17 | Diamond cutter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH081524A JPH081524A (en) | 1996-01-09 |
| JP2690689B2 true JP2690689B2 (en) | 1997-12-10 |
Family
ID=15162575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6135905A Expired - Lifetime JP2690689B2 (en) | 1994-06-17 | 1994-06-17 | Diamond cutter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2690689B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001170869A (en) * | 1999-12-14 | 2001-06-26 | Imamura Seiko:Kk | Mount and cutter for grinding wheel |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61153993A (en) * | 1984-12-26 | 1986-07-12 | 大同特殊鋼株式会社 | Electrode punching hole sealing device for arc furnace |
| JPS6360558U (en) * | 1986-10-07 | 1988-04-22 | ||
| JPS6456963U (en) * | 1987-10-06 | 1989-04-10 | ||
| JPH0714592B2 (en) * | 1990-03-22 | 1995-02-22 | ノリタケダイヤ株式会社 | Diamond cutting whetstone |
| JPH0644601Y2 (en) * | 1990-05-31 | 1994-11-16 | ノリタケダイヤ株式会社 | Dry cutting blade for trolley type engine cutter |
| JPH03221281A (en) * | 1990-08-27 | 1991-09-30 | Osaka Diamond Ind Co Ltd | Welding method for cutter segment |
| JPH0650135Y2 (en) * | 1991-01-29 | 1994-12-21 | 三京ダイヤモンド工業株式会社 | Diamond blade |
| JP2602877Y2 (en) * | 1991-10-28 | 2000-01-31 | 旭ダイヤモンド工業株式会社 | Diamond blade |
| JPH05345280A (en) * | 1992-06-12 | 1993-12-27 | Noritake Dia Kk | Tip structure of diamond cutting grinding wheel |
-
1994
- 1994-06-17 JP JP6135905A patent/JP2690689B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH081524A (en) | 1996-01-09 |
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