JP2002127021A - Rotary disc cutter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To find the optimum dimensional range of chips of a rotary disc cutter with the plurality of chips formed on the outer periphery of a disc substrate, achieving high machining performance by giving slight vibration to the chips during machining, while maintaining the strength of the chips. SOLUTION: A continuous, circular abrasive material layer 12a is provided on the outer periphery of the substrate 11 and the plurality of chips 12b having the same abrasive material layer are further formed on the outer periphery thereof. A length L of the chip 12b in the peripheral direction of the substrate is 1.5-4 mm and a ratio L/H of the length L to a height H in the radial direction of the substrate is 0.8-2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rotary disk cutter used for cutting, grooving and grinding stones, concrete, building materials and the like.

[0002]

2. Description of the Related Art Stone, concrete, glass, tile,
As a rotary disk cutter for cutting, grooving, and grinding a tile or the like, a rim-type cutter 40 as shown in FIG. 5A and a segment-type cutter 50 as shown in FIG.
Is used. The rim-type cutter 40 is formed by continuously attaching an abrasive layer 42 made of superabrasive grains such as diamond and CBN on the outer peripheral end surface of a disk-shaped substrate 41. Segment chips 5 made of an abrasive material layer on the outer peripheral end face of the substrate 51 of FIG.
2 are arranged at regular intervals, and slits 53 are formed in the outer peripheral portion of the substrate between the segment chips 52.

In these rotary disk cutters, abrasive grains protrude from an abrasive material layer, and the abrasive grains apply an impact to the work material to break the work material and perform processing such as cutting. For this reason, the material of the abrasive grains is set such that the hardness of the abrasive grains is much higher than the hardness of the workpiece. However, in the case of a workpiece having a very high hardness, even if abrasive grains having a high hardness are used, the difference in hardness between the workpiece and the workpiece becomes small, so that the abrasive grains hardly bite into the workpiece,
High workability cannot be obtained. Further, the processing resistance continues to increase with the increase in the processing amount, and the sharpness decreases.

To solve such a problem, Japanese Patent Laid-Open No. 7-520 discloses
No. 51, a plurality of small projections containing diamond and other abrasives are formed on a grinding portion provided on the outer periphery of a disk-shaped substrate,
In addition, there is described a rotating disk cutter in which the distance and the area between the small projections are set such that the grinding resistance with respect to the increase in the amount of grinding changes a predetermined value substantially constant. According to this rotary disk cutter, it is said that a substantially constant sharpness can be maintained for a long period of time without dressing.

[0005] In addition to the problem of reduced sharpness, there is a problem of abrasive grains falling off during processing. The abrasive grains are held by a binder or electrodeposition, but are likely to fall off due to shock or vibration during processing.

To solve such a problem, Japanese Patent Laid-Open Publication No. 3-792
No. 19 discloses that the edge of a perfect blade around the circular saw is
A circular saw is described in which a flat cutting edge is formed by removing about 70% from the flat cutting edge, and hard abrasive grain attachment portions reaching the saw blade groove from the flat cutting edge are formed on both side surfaces of the saw material. Also, JP-A-9-47970
The publication discloses a rotary disk cutter in which an integral annular molded product is formed following an inner peripheral portion of each of the segment-shaped blade portions and an inner peripheral portion of another adjacent blade portion. According to these circular saws or rotating disk cutters, it is possible to prevent the abrasive material layer from peeling off.

[0007]

However, in the cutters described in the above publications, there is no clear standard for the dimensions of the cutting edge. That is, JP-A-7-520
In the rotating disk cutter described in Japanese Patent Publication No. 51, the distance and the area between the small projections formed in the grinding portion are set so that the grinding resistance with respect to the increase in the amount of grinding changes a predetermined value substantially constant. Conditions are shown, and only an example is described as to the dimensions of the small projections, but the dimension range is not specified. In the circular saw described in Japanese Patent Application Laid-Open No. 3-79219, a completely blade-shaped cutting edge is set at a height of 30 mm.
A condition of 切除 70% resection is shown, and only one example is described for the dimensions of the cutting blade, but the dimension range is not specified. Similarly, in the rotating disk cutter described in JP-A-9-47970, the dimensional range of the blade portion is not specified.

[0008] The dimensions of the cutting edge portion composed of the abrasive material layer are factors that greatly affect the sharpness, life, and machining accuracy of the cutter. In actual production of the cutter, the cutting edge portion is set to an optimal dimensional range. There must be. However, there is no description in the above publication regarding the relationship between the dimensions of the cutting blade portion and the sharpness, life, and machining accuracy of the cutter.

[0009] Therefore, it is impossible to estimate the optimum dimensional range of the cutting blade portion from these publications. In addition, when the length of the cutting edge in the circumferential direction of the substrate is 0.5 mm as in the example of the rotating disk cutter described in Japanese Patent Application Laid-Open No. 7-52051, the strength of the cutting edge is Therefore, there is a problem that the vibration during processing becomes too large, the processing resistance increases, and the sharpness decreases. In addition, the abrasive layer may be damaged.

An object of the present invention is to provide a rotating disk cutter having a plurality of chips formed of an abrasive material layer on the outer periphery of a substrate. The purpose of the present invention is to find an optimum dimensional range of a chip capable of obtaining high processing performance.

[0011]

SUMMARY OF THE INVENTION The present invention relates to a rotating disk cutter having a plurality of chips made of an abrasive layer formed on the outer periphery of a disk-shaped substrate. And a plurality of chips made of the same abrasive material layer are formed on the outer periphery thereof, the length L of the chips in the circumferential direction of the substrate is set to 1.5 to 4 mm, and the length L and the height in the radial direction of the substrate are provided. The ratio L / H of H is set to 0.8 to 2.

A rotary disk cutter according to the present invention is characterized in that a rim-type cutter and a segment-type cutter are provided in that an annular abrasive layer is provided on the outer periphery of a substrate and a plurality of chips formed of the same abrasive layer are formed on the outer periphery. It is an eclectic type of cutter. Since the bonding portion between the substrate and the abrasive layer extends over the entire circumference or almost the entire circumference of the substrate, the bonding force between the substrate and the abrasive layer is large, and the abrasive layer does not peel during processing. The tip is
By setting the length in the circumferential direction of the substrate and the ratio of this length to the height in the radial direction of the substrate in a specific range, the chip itself can vibrate minutely during processing. The tip vibrates due to resistance during processing, and the vibration makes it easy for abrasive grains to bite into the workpiece. Even after digging, the vibration of the abrasive grains can cause intra-crystalline fracture of the workpiece. Thereby, the workpiece can be efficiently processed.

The mechanism of the vibration of the chip starts when the chip is pushed back backward in the cutter rotation direction by the impact when the chip collides with the workpiece. The amplitude of the vibration is smaller than the elastic deformation amount of the abrasive layer, and depends on the strength of the abrasive layer and the magnitude of the processing resistance. The amplitude of the vibration depends on the natural frequency of the abrasive layer. Vibration is mainly that the tip slightly moves back and forth from the rear to the front in the cutter rotation direction, and from the front to the rear, and vibration in the lateral direction (left and right directions) is applied to the rotation direction of the cutter.

Here, if the length L of the chip in the circumferential direction of the substrate is smaller than 1.5 mm, the strength of the chip becomes low, the amplitude of vibration becomes too large, and it becomes a resistance at the time of processing.
Is larger than 4 mm, the strength of the tip becomes too high, the amplitude of the vibration becomes small, and it becomes impossible to obtain a sufficient penetration into the workpiece. If the ratio L / H of the length L of the chip in the circumferential direction of the substrate to the height H in the radial direction of the substrate is smaller than 0.8, the strength of the abrasive material layer decreases. Becomes difficult to vibrate during processing.

Further, by forming the area of the boundary surface between the annular abrasive layer and the chip, that is, the bottom area of the chip smaller than the upper area of the chip, the center of gravity of the chip is shifted toward the outer peripheral side. The amplitude of the vibration of the chip in the direction transverse to the direction can be increased, and the processing efficiency can be further improved. To obtain lateral vibration, the chip bottom area B is made sufficiently smaller than the upper area T. However,
If the bottom area is too small, the strength of the chip becomes weak, so the ratio B / T is set to 0.7 or more. In order to reduce the bottom area of the chip, one or both of the front surface and the rear surface in the rotational direction of the chip are formed as inclined surfaces, so that the effect of the chip strength reduction can be minimized. The shape of the chip can be easily formed into a predetermined shape by a forming process using a laser beam or an electron beam.

Here, the length L of the chip in the circumferential direction of the substrate and the chip ratio determined by the gap between the chips (total length of the chip in the circumferential direction of the substrate / peripheral length of the board) greatly affect the sharpness of the cutter. Generally, sharpness is better when the length L of the chip in the circumferential direction of the substrate is shorter and the chip ratio is higher, and the sharpness is lower as the length L of the chip in the circumferential direction of the substrate is longer and the chip ratio is lower. The length L of the chip in the circumferential direction of the substrate is set to 1.
In the case of the cutter of the present invention having a length of 5 to 4 mm, the tip ratio is 4
If it is less than 0%, the impact applied to one chip is too large, the sharpness is reduced, and the abrasive layer may be damaged. On the other hand, when the chip ratio exceeds 95%, the impact applied to each chip is too small, so that the chip is less likely to vibrate at the time of processing, and the heat generated at the time of processing deteriorates the sharpness.
Therefore, it is desirable that the chip rate be 40 to 95%.

In the rotary disk cutter of the present invention, the substrate used in a normal rotary disk cutter, such as iron, aluminum alloy, stainless steel, or cemented carbide, can be used. Also, the abrasive layer is made of diamond, CBN, GC, etc. as abrasive grains, and Co, Ni,
Metal bond such as Cu can be used, especially for processing of semi-fired tile, porous tile, porous brick, tile containing glass, etc. From the viewpoint of the magnitude of the impact at the time, a substrate made of iron or aluminum alloy, diamond, C
Abrasive layers made of abrasive grains such as BN having excellent workability and metal bonds having excellent abrasive grain holding power and thermal conductivity are suitable.

[0018]

FIG. 1 is a front view showing a rotary disk cutter according to an embodiment of the present invention. FIG. 2 (a) is a partially enlarged view of an abrasive layer, and FIG. 2 (b) is a sectional view thereof. .

The cutter 10 is a cutter in which an abrasive material layer 12 in which diamond abrasive grains are bonded and held by a metal bond is formed on the outer periphery of a disk-shaped iron (SK5) substrate 11. Substrate 1
The dimensions of 1 are an outer diameter of 92 mm and a thickness of 1.5 mm.

The abrasive layer 12 comprises an annular abrasive layer 12a formed continuously on the outer periphery of the substrate 11, and a number of chips 12b formed on the outer periphery. The number of chips 12b is 72
The length L in the circumferential direction of the substrate is 3.5 mm, the height H in the radial direction of the substrate is 4 mm, and the width W is 2 mm.

As shown in FIG. 3, the chip 12b forms an abrasive layer 13 once on the outer periphery of the substrate 11 and then cuts and removes a portion 13a corresponding to the groove 12c in FIG. Then, the chip 12b of FIG. 2A is formed.
Irregularities during processing remain on the cut surface by the laser beam. When the length L of the chip 12b in the circumferential direction of the substrate is short (when the ratio L / H is small), the relative influence on the chip strength is reduced. Therefore, the specification is determined so that the ratio L / H becomes 0.8 or more. In addition, since the unevenness itself microscopically forms an inclined surface, the chip 12b
There is one surface that plays a role similar to the role of the inclination of the front or rear surface in the substrate rotation direction described later with respect to the vibration of the substrate.

As described above, since the cutter 10 of the present embodiment has the annular abrasive layer 12a formed continuously on the outer periphery of the substrate 11, the joining force between the substrate 11 and the abrasive layer 12a is large, and The abrasive layer does not peel off. Further, since a large number of chips 12b each having a size capable of vibrating are formed on the outer periphery of the abrasive material layer 12a, the chips 12b vibrate due to resistance during processing, and the vibration causes abrasive grains to bite into the workpiece. This makes it easy for the workpiece to be broken by vibrating the abrasive grains even after biting, so that the workpiece can be efficiently processed.

FIG. 4 is a partially enlarged view showing another embodiment of the chip shape. The chip 12a shown in FIG. 2 has an inverted trapezoidal shape in plan view, and both the front surface and the rear surface in the cutter rotation direction (see the arrow A in FIG. 1) are surfaces parallel to the substrate radial direction. In the tip 22b shown in a), the rear face 22d in the cutter rotation direction is inclined in a direction in which the tip bottom area decreases. The chip 32b shown in FIG.
Has a front surface 32e in the cutter rotation direction that is inclined in a direction in which the chip bottom area decreases.

The rear surface 22d of the chip 22b and the chip 3
The inclination of the front surface 32e of the chip 2b depends on the chip bottom area B and the top area T.
Is formed so that the ratio B / T with respect to this is approximately 0.9. By reducing the chip bottom area with such an inclination, the amplitude of the vibration of the chip in the direction transverse to the cutter rotation direction increases, and the processing efficiency can be further improved.

Although the cutter in the above embodiment is an example in which an annular abrasive layer is formed continuously on the outer periphery of the substrate, the cutter must be formed within a range in which a sufficient bonding force between the substrate and the abrasive layer can be secured. The annular abrasive layer can be formed intermittently. For example, a unit abrasive layer may be formed by connecting the bottom surfaces of 24 to 120 chips, and a plurality of the abrasive layers may be arranged on the outer periphery of the substrate.

Test Example 1 The cutter used for the test is shown in FIG.
The height H of the chip in the radial direction of the substrate is 2 mm, and the ratio L / H to the length L in the circumferential direction of the substrate is 0.
8, 1.5, 2.0 three cutters (invention products 1 to 3),
Three cutters having L / H of 0.5, 2.5, and 3.0 (comparative products 1 to 3), the rim-type cutter shown in FIG. 5A (conventional product 1), and FIG. ) Is a segment type cutter (conventional product 2). Each of the cutters was mounted on a portable electric tool, and a hard porcelain tile having a thickness of 15 mm and a side of 200 mm was dry-cut. Table 1 shows the average cutting speed when 20 tiles were cut.

[0027]

[Table 1]

As can be seen from Table 1, the cutters (inventive products 1 to 3 and comparative products 1 to 3) in which a chip was further formed on the outer periphery of the annular abrasive layer had a cutting speed of 0.40 cm / min or more. The cutting efficiency was 1.1 to 1.5 times that of the conventional products 1 and 2, and the superiority of the cutter of this type was confirmed without peeling of the abrasive layer. Further, the ratio L / H is set to 0.8 to
The cutting efficiency of the cutters of Invention products 1 to 3 having 2.0 is further improved as compared with the cutters of Comparative products 1 to 3. The rim-type cutter (conventional product 1) failed to be cut because a spark was generated during cutting and the test was stopped. The segment type cutter (conventional product 2) could be cut, but the vibration was large and the tiles were sometimes broken.

Test Example 2 In the basic shape shown in FIG. 1, the ratio L / H of the length L of the chip in the circumferential direction of the substrate to the height H in the radial direction of the substrate is 1.5 in the circumferential direction of the substrate. Length L is 0.5m
m, 1 mm, two cutters (comparative products 4, 5), length L of 1.5 mm, 2 mm, 3 mm, 4 mm cutters of 4 mm (invention products 4 to 7), length L of 5 mm, A cutting test was performed on the two cutters (comparative products 6 and 7) having a size of 6 mm under the same conditions as in Test Example 1. Table 2 shows the test results.

[0030]

[Table 2]

As can be seen from Table 2, the ratio L / H is 1.5
The cutters of invention products 4 to 7 having a length L of 1.5 to 4 mm under the cutting conditions have a cutting speed of 0.50 cm / min or more, but the comparative products 4 having a length L of less than 1.5 mm and more than 4 mm The cutters No. to No. 7 had a cutting speed lower than 0.50 cm / min, and the influence of the chip size on the cutting efficiency in the cutter of the present invention was confirmed.

[0032]

According to the present invention, the following effects can be obtained.

(1) A continuous or semi-continuous annular abrasive material layer is provided on the outer periphery of the substrate, and a plurality of chips of the same size formed of the same abrasive material layer are formed on the outer periphery of the cutter. Vibration occurs due to the resistance during processing, and this vibration makes it easy for the abrasive grains to bite into the workpiece, and even after biting, the grains of the workpiece can be broken by the vibration of the abrasive grains, making the workpiece more efficient Can be processed well.

(2) By forming the bottom area of the chip smaller than the upper area, the amplitude of the vibration of the chip in the transverse direction to the cutter rotation direction can be increased, and the processing efficiency can be further improved.

[Brief description of the drawings]

FIG. 1 is a front view showing a rotating disk cutter according to an embodiment of the present invention.

FIG. 2 is a partially enlarged view of an abrasive layer of the rotary disk cutter of FIG. 1;

FIG. 3 is an explanatory diagram of a chip forming method.

FIG. 4 is a partially enlarged view showing another embodiment of a chip shape.

FIG. 5 is a diagram showing a conventional example of a rotating disk cutter.

[Explanation of symbols]

 REFERENCE SIGNS LIST 10 cutter 11 substrate 12 abrasive layer 12a annular abrasive layer 12b, 22b, 32b chip 12c groove 13 abrasive layer 13a groove equivalent portion 22d tip rotational direction rear surface 32e chip rotational direction front surface

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Masanori Matsukawa 210, Takeshi, Tanushimaru-cho, Ukiha-gun, Fukuoka Prefecture F-term in Noritake Diamond Co., Ltd. (reference) 3C063 AA02 AB03 BA04 BA12 BB02 BG01 BG07 EE16 EE31 FF23

Claims (3)

[Claims] 1. A rotating disk cutter having a plurality of chips made of an abrasive material layer formed on the outer periphery of a disk-shaped substrate, wherein a continuous or semi-continuous annular abrasive layer is provided on the outer periphery of the substrate, and furthermore, the same outer circumference is provided. A plurality of chips made of an abrasive material layer are formed, and the length L of the chips in the circumferential direction of the substrate is set to 1.5 to 4 mm.
A ratio L / H of the length L to the height H in the radial direction of the substrate is set to 0.8 to 2. 2. The rotating disk cutter according to claim 1, wherein a bottom area of the tip-shaped abrasive layer is smaller than an upper area. 3. The rotating disk cutter according to claim 2, wherein one or both of the front surface and the rear surface of the tip-shaped abrasive layer in the cutter rotation direction are inclined.