JP2024051090A - Light emitting module and method for manufacturing the same - Google Patents

Abstract

To provide a light-emitting module that suppresses emitted light from being scattered, and a method of manufacturing the light-emitting module.SOLUTION: A light-emitting module comprises: a plurality of light-emitting elements 1; a first substrate 10 having a first external connection terminal 11 and a second external connection terminal 12 arranged on one side and the other side across an element mount region 13 where the light-emitting elements are mounted; a second substrate 20 having a first wire connection terminal 21 and a second wire connection terminal 22 arranged along one side and the other side across a substrate mount region 23 where the first substrate is mounted; a plurality of first wires 31 electrically connecting the first external connection terminal and first wire connection terminal; a plurality of second wires 32 electrically connecting the second external connection terminal and the second wire connection terminal; and dark-color coating resin 40 covering the first wire and second wire and encircling the element mount region at an adjacent position, the coating resin being made different in height between a top of a first wire and the wire, and between a top of a second wire and the wire.SELECTED DRAWING: Figure 3

Description

This disclosure relates to a light-emitting module and a method for manufacturing the light-emitting module.

Conventionally, light-emitting modules using multiple light-emitting elements have been used as light sources for in-vehicle devices and projectors. When using a light-emitting module, light is irradiated via a lens on the optical path. In the light-emitting module, the black resin is placed away from the light extraction surface of the light-emitting element, so that the surface of the resin can be processed and light reflection can be prevented (see, for example, Patent Document 1).

JP 2017-212301 A

However, in conventional light emitting modules, the light emitting element and the black resin are separated from each other, so that the suppression of scattered light is insufficient and there is a demand for an improvement in the light extraction efficiency.
An object of the embodiments according to the present disclosure is to provide a light-emitting module that suppresses scattered light and has excellent light extraction efficiency, and a method for manufacturing the light-emitting module.

A light-emitting module according to an embodiment of the present disclosure includes a first substrate having a plurality of light-emitting elements and an element mounting area for mounting and electrically connecting the plurality of light-emitting elements, and further having, outside the element mounting area, a plurality of first external connection terminals arranged on one side of the element mounting area and a plurality of second external connection terminals arranged on the other side opposite the element mounting area; a second substrate having a substrate mounting area for mounting the first substrate, and further having, outside the substrate mounting area, a plurality of first wire connection terminals arranged along one side of the substrate mounting area and a plurality of second wire connection terminals arranged along the other side opposite the substrate mounting area; a plurality of first wires electrically connecting the first external connection terminals and the first wire connection terminals and arranged along one side of the first substrate;
The device comprises a plurality of second wires which electrically connect the second external connection terminal and the second wire connection terminal and are arranged along the other side of the first substrate, and a dark colored coating resin which covers the plurality of first wires and the plurality of second wires and surrounds the element mounting area at adjacent positions, wherein, in a cross-sectional view at a position connecting the tops of the plurality of first wires, the height of the coating resin between adjacent first wires is lower than the height at the point where the first wires are arranged, and, in a cross-sectional view at a position connecting the tops of the plurality of second wires, the height of the coating resin between adjacent second wires is lower than the height at the point where the second wires are arranged.

A method for manufacturing a light-emitting module according to an embodiment of the present disclosure includes the steps of mounting a plurality of light-emitting elements on an element mounting area of a first substrate, mounting and connecting the first substrate to a substrate mounting area of a second substrate, connecting a plurality of first external connection terminals arranged on one side of the element mounting area of the first substrate outside the element mounting area of the first substrate with a plurality of first wires, and connecting a plurality of second external connection terminals arranged on the other side opposite to the one side across the element mounting area of the first substrate outside the element mounting area of the first substrate with a plurality of second wires, and connecting a plurality of second wires, the plurality of second external connection terminals arranged on the other side opposite to the one side across the element mounting area of the second substrate outside the substrate mounting area of the second substrate with a plurality of second wires. The method includes the steps of forming a dark-colored first resin frame in a position adjacent to and surrounding the element mounting region on the inside of the plurality of first external connection terminals and the plurality of second external connection terminals, and forming a dark-colored second resin frame on the second substrate in a position surrounding the first substrate on the outside of the plurality of first wires and the plurality of second wires, and filling the space between the first resin frame and the second resin frame with a dark-colored coating resin having a lower viscosity than the first resin frame and the second resin frame, and the coating resin is formed so that, in a cross-sectional view taken along a line connecting the tops of the plurality of first wires, the height of the coating resin between adjacent first wires is lower than the height at the point where the first wire is arranged, and, in a cross-sectional view taken along a line connecting the tops of the plurality of second wires, the height of the coating resin between adjacent second wires is lower than the height at the point where the second wire is arranged.

According to an embodiment of the present disclosure, it is possible to provide a light-emitting module that suppresses scattered light and has excellent light extraction efficiency, and a method for manufacturing the same.

1 is a perspective view showing a schematic view of an entire light-emitting module according to an embodiment; 1 is a plan view showing a schematic view of an entire light-emitting module according to an embodiment; 3 is a cross-sectional view taken along line III-III in FIG. 2. FIG. 4 is a cross-sectional view of a portion taken along line IV-IV in FIG. 2 . 3 is an enlarged cross-sectional view showing a schematic enlargement of the second wire and the coating resin in FIG. 2 . FIG. 3 is a cross-sectional view taken along line VIA-VIA in FIG. 2. 3 is a cross-sectional view taken along line VIB-VIB in FIG. 2. 3 is an enlarged cross-sectional view showing a schematic enlargement of a portion taken along line VII-VII in FIG. 2. 1 is a plan view showing a schematic state of a first wire, a second wire, and a third wire after removing the coating resin between the first resin frame and the second resin frame in the light-emitting module according to the embodiment; FIG. 4 is a flowchart illustrating a method for manufacturing a light emitting module according to an embodiment. 4 is a plan view showing a schematic diagram of a first substrate in a manufacturing method of a light emitting module according to an embodiment. FIG. 1 is a plan view of a first substrate, showing a schematic state in which a light-emitting element is mounted on an element mounting region in a manufacturing method for a light-emitting module according to an embodiment. FIG. 4 is a schematic diagram showing an enlarged view of a portion of an alignment state of light-emitting elements in a manufacturing method for a light-emitting module according to an embodiment; 4 is a plan view showing a schematic diagram of a second substrate in the manufacturing method of the light emitting module according to the embodiment; FIG. 10 is a plan view showing a state in which a first substrate is placed on a substrate placement area of a second substrate in a manufacturing method for a light emitting module according to an embodiment; FIG. 1 is a plan view showing a schematic state in which a first wire is connected to a first external connection terminal and a first wire connection terminal, a second wire is connected to a second external connection terminal and a second wire connection terminal, and a third wire is connected to a first drive terminal and a second drive terminal in a manufacturing method of a light-emitting module according to an embodiment. 10 is a plan view showing a state in which a first resin frame and a second resin frame have been formed in the manufacturing method of the light-emitting module according to the embodiment. FIG. 1 is an explanatory diagram showing a cross section of a light-emitting module according to an embodiment of the present invention, illustrating a difference in height between the position of the top of a first wire and the position between the wires in the coating resin. FIG. 13 is an explanatory diagram showing a cross section of another embodiment for explaining the difference in height between the position of the top of the first wire and the position between the wires in the coating resin of the light-emitting module according to the embodiment. FIG. 13 is an explanatory diagram showing a cross section of another embodiment for explaining the difference in height between the position of the top of the first wire and the position between the wires in the coating resin of the light-emitting module according to the embodiment. FIG. 11 is a cross-sectional view illustrating a modified example of the second substrate of the light-emitting module according to the embodiment. FIG.

The light emitting device according to the embodiment will be described below with reference to the drawings. Note that the size and positional relationship of the components shown in each drawing may be exaggerated for clarity of explanation. Also, the dimensions and position of each component may not strictly match between the plan view and the corresponding cross-sectional view. Furthermore, in the following explanation, up, down, left, right, front, back, and rear are relative directions and do not indicate absolute directions. In principle, the same names and symbols indicate the same or similar components, and detailed explanations may be omitted as appropriate.

First Embodiment
[Configuration of the Light-Emitting Device]
The configuration of a light emitting device according to an embodiment will be described with reference to FIGS.
FIG. 1 is a perspective view that typically shows the entire light-emitting module according to the embodiment. FIG. 2 is a plan view that typically shows the light-emitting module according to the embodiment. FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2. FIG. 4 is a cross-sectional view of a portion taken along line IV-IV in FIG. 2. FIG. 5 is an enlarged cross-sectional view that typically shows the second wire and the coating resin in FIG. 2. FIG. 6A is a cross-sectional view taken along line VIA-VIA in FIG. 2. FIG. 6B is a cross-sectional view taken along line VIB-VIB in FIG. 2. FIG. 7 is an enlarged cross-sectional view that typically shows the portion taken along line VII-VII in FIG. 2. FIG. 8 is a plan view that typically shows the state of the first wire, the second wire, and the third wire after removing the coating resin between the first resin frame and the second resin frame in the light-emitting module according to the embodiment.

The light-emitting module 100 has a plurality of light-emitting elements 1, an element mounting area 13 on which the plurality of light-emitting elements 1 are electrically connected and mounted, a first substrate 10 having a plurality of first external connection terminals 11 arranged on one side of the element mounting area 13 outside the element mounting area 13 and a plurality of second external connection terminals 12 arranged on the other side opposite the element mounting area 13, and a substrate mounting area 23 (see FIG. 10D) on which the first substrate 10 is mounted, and a plurality of first wire connection terminals 21 arranged along one side of the substrate mounting area 23 outside the substrate mounting area 23. and a second substrate 20 having a plurality of second wire connection terminals 22 arranged along the other side located on the opposite side of the substrate mounting area 23; a plurality of first wires 31 electrically connecting the first external connection terminal 11 and the first wire connection terminal 21 and arranged along one side of the first substrate 10; a plurality of second wires 32 electrically connecting the second external connection terminal 12 and the second wire connection terminal 22 and arranged along the other side of the first substrate 10; and a dark-colored coating resin 40 covering the plurality of first wires 31 and the plurality of second wires 32 and surrounding the element mounting area 13 at an adjacent position.

The coating resin 40 is formed so that, in a cross-sectional view at a position where the tops 31a of the plurality of first wires 31 are connected, the height of the coating resin 40 between adjacent first wires is lower than the height at the point where the first wires 31 are disposed, and, in a cross-sectional view at a position where the tops 32a of the plurality of second wires 32 are connected, the height of the coating resin 40 between adjacent second wires is lower than the height at the point where the second wires 32 are disposed. Note that the light-emitting module 100 is provided with a wavelength conversion member 5 on the light extraction surface side of the light-emitting element 1, and a reflective member 7 covering the side surface of the light-emitting element 1.
That is, the light emitting module 100 includes a plurality of light emitting elements 1, a first substrate 10 on which the light emitting elements 1 are mounted and which has a first external connection terminal 11 and a second external connection terminal 12, a second substrate 20 on which the first substrate 10 is mounted and which has a first wire connection terminal 21 and a second wire connection terminal 22, a first wire 31 and a second wire 32 which electrically connect the first substrate 10 and the second substrate 20, a rectangular ring-shaped coating resin 40 provided around the light emitting elements 1 of the first substrate 10 so as to cover the first wire 31 and the second wire 32, a reflective member 7 which covers the side surface of the light emitting elements 1, and a wavelength conversion member 5 provided on the light extraction surface of the light emitting elements 1. Each component will be described below.

(First Substrate)
The first substrate 10 includes a flat support member, an element mounting region 13 on which wiring is formed and arranged on the upper surface and inside of the support member, a first external connection terminal 11, and a second external connection terminal 12. The first substrate 10 is a semiconductor substrate such as silicon, and the portions of the upper surface where the wiring is not exposed are covered with an insulating film. The wiring forms a semiconductor integrated circuit.
The element mounting area 13 is an area where the light emitting element 1 and the protective element are mounted and wiring is arranged to configure a predetermined electric circuit. The element mounting area 13 in a plan view can be a rectangular area. This element mounting area 13 is a rectangular area. The element mounting area 13 is also an area located between the first external connection terminal 11 and the second external connection terminal 12, and is equivalent to the wavelength conversion member 5 described below, or is an area surrounding the portion to which the light emitting element 1 is connected.
A plurality of first external connection terminals 11 are formed on one long side of the rectangular element mounting region 13 outside the element mounting region 13. The first external connection terminals 11 are terminals for connecting one end of the first wires 31. As an example, the first external connection terminals 11 are formed individually in a rectangular shape and spaced apart from each other and aligned in a row along one long side of the element mounting region 13. The first external connection terminals 11 can be aligned at equal intervals. The interval at which the first external connection terminals 11 are aligned can be 20 μm or more and 100 μm or less.
The second external connection terminals 12 are formed on the outside of the element mounting region 13 along the other long side of the rectangular element mounting region 13 (the side located on the opposite side of the element mounting region 13 from the one long side described above). The second external connection terminals 12 are terminals for connecting one end of the second wire 32. Here, as an example, the second external connection terminals 12 are formed individually in a rectangular shape and spaced apart from each other and aligned in a row along the other long side of the element mounting region 13. The second external connection terminals 12 can be aligned at equal intervals. The interval at which the second external connection terminals 12 are aligned can be 20 μm or more and 100 μm or less. The interval at which the first external connection terminals 11 are aligned with each other and the interval at which the second external connection terminals 12 are aligned with each other may be aligned with each other.

In addition, here, as an example, the first substrate 10 is formed with first driving terminals 15 for driving the light-emitting elements 1 arranged outside and spaced apart from the external connection terminals. The first driving terminals 15 are to be connected to third wires 33, which will be described later.
In addition, the light-emitting elements 1 mounted on the first substrate 10 may be aligned vertically and horizontally in a plurality of units, and the plurality of light-emitting elements 1 may be connected by wiring across one first external connection terminal 11 and one second external connection terminal 12, so that the wiring pattern may be such that the plurality of light-emitting elements 1 are connected in series or parallel in groups of a predetermined number of units.
The first external connection terminal 11 and the second external connection terminal 12 are provided on the upper surface of the support member, and can be formed using, for example, a metal such as Cu, Ag, Au, Al, Pt, Ti, W, Pd, Fe, Ni, or an alloy thereof. Such first external connection terminal 11 and second external connection terminal 12 can be formed by electrolytic plating, electroless plating, vapor deposition, sputtering, or the like. Furthermore, for example, when Au bumps are used to mount the light-emitting element 1, the use of Au on the outermost surface of the wiring improves the bonding with the light-emitting element 1.

(Second Substrate)
The second substrate 20 includes a flat base material, a substrate mounting area 23 arranged on the upper surface of the base material, a first wire connection terminal 21 , and a second wire connection terminal 22 .
The substrate mounting area 23 is an area on which the first substrate 10 is mounted via a bonding member. The substrate mounting area 23 is located, for example, between the first wire connecting terminal 21 and the second wire connecting terminal 22, and is set as an area having the same area as the area of the first substrate 10. If the first substrate 10 is rectangular in a plan view, the substrate mounting area 23 can also be rectangular.
A plurality of first wire connection terminals 21 are formed on one long side of the rectangular substrate mounting area 23 outside the substrate mounting area 23. The first wire connection terminals 21 are terminals for connecting the other ends of the first wires 31. Here, as an example, the first wire connection terminals 21 are each formed in a rectangular shape and spaced apart from each other and aligned in a row along one long side of the substrate mounting area 23. The first wire connection terminals 21 can be aligned at equal intervals. The interval at which the first wire connection terminals 21 are aligned can be 50 μm or more and 200 μm or less.
The second wire connection terminals 22 are formed on the other long side (the side opposite to the one long side across the substrate mounting area 23) of the rectangular substrate mounting area 23, outside the substrate mounting area 23. The second wire connection terminals 22 are terminals for connecting the other ends of the second wires 32. Here, as an example, the second wire connection terminals 22 are formed individually in a rectangular shape and spaced apart from each other and aligned in a row along the other long side of the substrate mounting area 23. The second wire connection terminals 22 can be aligned at equal intervals. The interval at which the second wire connection terminals 22 are aligned can be 50 μm or more and 200 μm or less. The interval at which the first wire connection terminals 21 are aligned with each other and the interval at which the second wire connection terminals 22 are aligned with each other may be the same.
The first wire connection terminal 21 and the second wire connection terminal 22 are provided on the upper surface of the substrate and can be formed, for example, using the same material and forming method as the first external connection terminal 11 and the second external connection terminal 12 already described.

The substrate is preferably made of a material with high heat dissipation properties, and more preferably, a material with high light blocking properties and substrate strength. Specific examples include ceramics such as alumina, aluminum nitride, and mullite, resins such as phenolic resin, epoxy resin, polyimide resin, BT resin (bismaleimide triazine resin), and polyphthalamide (PPA), and composite materials composed of resin and metal or ceramics. The substrate mounting area 23 of the substrate uses a bonding material for bonding the first substrate 10, such as Ag sintered body, solder, and adhesive resin. The substrate may be flat, or a substrate may have a cavity on the upper surface and a heat dissipation member inserted into the cavity.

The first wire 31 and the second wire 32 may be conductive wires made of metals such as gold, copper, platinum, and aluminum, or alloys containing at least these metals. In particular, it is preferable to use gold, which has excellent heat resistance. The diameter of the wire is preferably 15 μm or more and 70 μm or less, and more preferably 23 μm or more and 45 μm or less. Here, the third wire 33 is used to handle the driving signal for turning on and off the light-emitting element 1. The third wire 33 is connected to connect the first driving terminal 15 formed on the first substrate 10 outside the first external connection terminal 11 and the second driving terminal 16 formed on the second substrate 20. The third wire 33 is made of the same material as the first wire 31 or the second wire 32, except for the length of the wiring.

The first wires 31 connected to the first external connection terminals 11 and the first wire connection terminals 21 can be arranged so as to be perpendicular to the long sides of the first substrate 10 in a plan view. The second wires 32 connected to the second external connection terminals 12 and the second wire connection terminals 22 can be arranged so as to be perpendicular to the long sides of the first substrate 10 in a plan view.
Furthermore, among the aligned first wires 31, the first wires 31 located at the center may be arranged so as to be perpendicular to the long side of the first substrate 10 in a planar view as described above, while the first wires 31 located at the ends may be arranged obliquely to the long side of the first substrate 10 in a planar view. The same applies to the second wires 32.
The interval at which the multiple first wires 31 are aligned may be the same as or different from the interval at which the multiple first wires 31 are aligned. The interval at which the first wires 31 are aligned may be 20 μm or more and 100 μm or less. The interval at which the second wires 32 are aligned may be 20 μm or more and 100 μm or less. The interval at which the first wires 31 are aligned and the interval at which the second wires 32 are aligned may be the same.

(Light Emitting Element)
The light-emitting element 1 has, for example, a substantially rectangular shape in plan view, includes a light-transmitting substrate and a semiconductor laminate, and has a pair of electrodes on the surface of the semiconductor laminate. The light-emitting element 1 is preferably provided with a pair of positive and negative electrodes on the same side. This allows the light-emitting element 1 to be flip-chip mounted on the first substrate 10. In this case, the surface opposite to the surface on which the pair of electrodes are formed becomes the main light extraction surface of the light-emitting element 1. In the light-emitting module 100, the light-emitting elements 1 are used aligned at predetermined intervals in the row and column direction.
The light-emitting element 1 can be selected from those with any wavelength. For example, the blue-green light-emitting element 1 can be selected from those using ZnSe, nitride semiconductors (In _x Al _y Ga _1-X-Y N, 0≦X, 0≦Y, X+Y≦1), or GaP. The red light-emitting element 1 can be preferably made of nitride semiconductors represented by GaAlAs and AlInGaP. Furthermore, semiconductor light-emitting elements made of materials other than these can also be used. The composition, emission color, size, number, and the like of the light-emitting element 1 used can be appropriately selected according to the purpose.

(Protection element)
The light-emitting module 100 may include a semiconductor element (e.g., a protective element) different from the light-emitting element 1. The protective element is provided to protect the light-emitting element 1 from electrostatic discharge. A Zener diode can be suitably used as the protective element. The protective element may not be provided depending on the application of the light-emitting module. When a semiconductor element other than the light-emitting element 1, such as a protective element or a transistor for driving and controlling the light-emitting element 1, is provided on the first substrate 10, it is preferable to place it between the element mounting region 13 and the first resin frame 41.

(Joining member)
As shown in Fig. 7, the light-emitting element 1 is bonded to the wiring provided on the upper surface of the first substrate 10 by a bonding member, which is a conductive member for mechanically and electrically bonding. When flip-chip mounting the light-emitting element 1 on the first substrate 10, metal bumps made of metal materials such as Au, Ag, Cu, and Al, such as wire bumps and plated bumps, can be used as the bonding member. The metal bumps may be provided in advance so as to bond to the n-side electrode and p-side electrode of the light-emitting element 1 or to each wiring before bonding the light-emitting element 1 to the first substrate 10. In this case, the light-emitting element 1 can be bonded to the first substrate 10 by ultrasonic bonding.
The joining member may be a solder such as an AuSn alloy or a Sn-based lead-free solder. In this case, the light-emitting element 1 can be joined to the first substrate 10 by a reflow method. The joining member may be a conductive adhesive made of a resin containing conductive particles.
The bonding member can be formed by plating, and the material used can be, for example, copper.

(Reflective Member)
The reflective member 7 is a member that covers the side surface of the light-emitting element 1, as shown in Figs. 3, 4, and 7. The reflective member 7 is provided to seal the light-emitting element 1 and protect the light-emitting element 1 from external forces, dust, gas, and the like, and to improve the heat resistance, weather resistance, and light resistance of the light-emitting element 1 and the like. In addition, the reflective member 7 can reflect the light emitted from the side surface of the light-emitting element 1 and emit it from the upper surface of the wavelength conversion member 5, which is the light-emitting surface of the light-emitting module 100. For this reason, the light extraction efficiency of the light-emitting module 100 can be improved, the boundary between the light-emitting area and the non-light-emitting area becomes clear without being blurred (the cut-off is improved), and the contrast ratio between the light-emitting area and the non-light-emitting area is also improved. In addition, the reflective member 7 is provided away from the coating resin 40 (first resin frame 41).

The reflective member 7 is preferably made of a soft resin with a relatively low elasticity and excellent shape-following ability. The reflective member 7 is preferably made of a resin material having good transparency and insulation, such as a thermosetting resin such as an epoxy resin or a silicone resin. The reflective member 7 is preferably made of a white resin that is imparted with light reflectivity by including particles of a light-reflecting material in the base resin. The light-reflecting material may be, for example, titanium oxide, aluminum oxide, zinc oxide, barium carbonate, barium sulfate, boron nitride, aluminum nitride, or glass filler. The reflective member 7 can be made of a white resin to impart light reflectivity. The reflective member 7 is not limited to being a reflective material as a member that covers the side surface of the light-emitting element 1, and may be a material (black resin) that has light absorption properties.

Before providing the reflective member 7, an underfill may be provided on the lower surface of the light-emitting element 1 and the upper surface of the first substrate 10. The underfill fills the space between the upper surface of the first substrate 10 and the lower surface of the light-emitting element 1, and is provided to a height that covers part of the side surface of the light-emitting element 1. When providing an underfill, the reflective member 7 is formed on top of the underfill. The underfill can be made of the same resin or light-reflective material as the reflective member 7.

(Wavelength conversion member)
The wavelength conversion member 5 is provided on the upper surface side of the plurality of light-emitting elements 1. The wavelength conversion member 5 is substantially rectangular in plan view and contains a material capable of converting the light emitted from the light-emitting element 1 and extracting it to the outside. The side surface of the wavelength conversion member 5 may be covered with a light-shielding member. When the side surface of the wavelength conversion member 5 is covered with a light-shielding member, the contrast ratio between the light-emitting area and the non-light-emitting area is improved. In addition, the side surface of the wavelength conversion member 5 may not be covered with a light-shielding member. In this case, light is not absorbed by the side surface of the wavelength conversion member 5, so that light extraction is improved.
The wavelength conversion member 5 has a generally rectangular shape larger than the aggregate of all the light emitting elements 1 aligned in a plan view, and is disposed so as to encompass and cover the element mounting region 13 in which the light emitting elements 1 are disposed.

The wavelength conversion member 5 contains a light diffusing material and a wavelength conversion material (e.g., phosphor) that converts at least a part of the light incident from the light emitting element 1 into light of a different wavelength in a translucent material. Examples of the wavelength conversion member 5 include film (sheet)-shaped, plate-shaped, and layer-shaped materials applied by spraying, etc. Specific examples of the wavelength conversion material include sintered bodies of phosphors and YAG glass, which contains phosphor powder in resin, glass, other inorganic materials, etc. The sintered body of phosphors may be formed by sintering only the phosphor, or may be formed by sintering a mixture of phosphor and sintering aid. When sintering a mixture of phosphor and sintering aid, it is preferable to use an inorganic material such as silicon oxide, aluminum oxide, or titanium oxide as the sintering aid. This makes it possible to suppress discoloration and deformation of the sintering aid due to light and heat even if the light emitting element 1 has a high output. The higher the transparency of the wavelength conversion member 5, the more preferable it is. The thickness of the wavelength conversion member 5 is not particularly limited and can be changed as appropriate, but can be, for example, about 50 μm or more and 300 μm or less.

The phosphor can be appropriately selected from phosphors used in this field. For example, phosphors that can be excited by blue light-emitting elements or ultraviolet light-emitting elements include yttrium aluminum garnet phosphors activated with cerium (Ce:YAG), lutetium aluminum garnet phosphors activated with cerium (Ce:LAG), nitrogen-containing calcium aluminosilicate phosphors activated with europium and/or chromium (CaO-Al ₂ O ₃ -SiO ₂ ), silicate phosphors activated with europium ((Sr,Ba) ₂ SiO ₄ ), β-sialon phosphors, CASN phosphors, nitride phosphors such as SCASN phosphors, KSF phosphors (K ₂ SiF ₆ :Mn), sulfide phosphors, quantum dot phosphors, etc. By combining these phosphors with blue light-emitting elements or ultraviolet light-emitting elements, light-emitting devices of various colors (for example, white light-emitting devices) can be manufactured. In the case of light-emitting module 100 capable of emitting white light, the type and concentration of the phosphor contained in wavelength conversion member 5 is adjusted to produce white light. The concentration of the phosphor contained in wavelength conversion member 5 is, for example, about 5 to 50 mass %. Examples of light diffusing materials that can be contained in wavelength conversion member 5 include titanium oxide, barium titanate, aluminum oxide, and silicon oxide.

(Coating resin)
The coating resin 40 is formed of a dark-colored resin that covers the first wire 31 and the second wire 32 and surrounds the element mounting region 13 at adjacent positions. The adjacent positions here refer to a distance of 100 μm to 500 μm. Here, the coating resin 40 is formed so as to cover the third wire 33 as well. The coating resin 40 is formed so as to cover the periphery with a frame that is a ring-shaped rectangle (a frame whose inner and outer peripheries in a plan view are both rectangular). Since the coating resin 40 is disposed away from the wavelength conversion member 5, the light contrast with the wavelength conversion member 5 that is the light extraction surface becomes clear (that is, when the coating resin 40 and the wavelength conversion member 5 are in contact with each other, the light emitted from the wavelength conversion member 5 penetrates the coating resin 40, so that the area of the coating resin 40 also appears to be illuminated, and the boundary between the light-emitting area and the non-light-emitting area becomes blurred, and the contrast ratio between the light-emitting area and the non-light-emitting area deteriorates). The distance between the wavelength conversion member 5 and the coating resin 40 is preferably 100 μm or more and 500 μm or less. If it is less than 100 μm, the light from the light emitting element is likely to penetrate into the coating resin 40, and if it does penetrate, the contrast ratio between the light emitting area and the non-light emitting area will deteriorate as described above. If it is more than 500 μm, the package size will be large and the cost will increase.

Similarly, the distance between the reflective member 7 and the coating resin 40 is preferably 100 μm or more and 500 μm or less.
The distance between the wavelength conversion member 5 and the coating resin 40 may be equal to or different from the distance between the reflective member 7 and the coating resin 40 .
In addition, in the region of the long side of the coating resin 40 covering the first wire 31 and the second wire 32, the width is formed to be wide so as to cover the wire from the end of the wire on the external connection terminal side to the end of the wire on the wire connection terminal side, and the width is formed to be narrow in the region of the short side of the coating resin 40. Furthermore, the coating resin 40 is formed so that the top position 40MX is higher in the region of the long side than in the region of the short side. The coating resin 40 is high on the long side of the first substrate 10 and low on the short side. In particular, since the height of the coating resin 40 on the short side is low, light from the light emitting element can be emitted to the outside without being blocked by the coating resin 40, and light extraction is improved. Furthermore, the amount of resin can be reduced by lowering the height of the coating resin 40 on the short side. The coating resin 40 is formed so that the top position 40MX is higher than the top of the first resin frame 41 described later. The top position 40MX of the coating resin 40 may be higher than the top of the first resin frame 41.

The coating resin 40 is formed so that, in a cross-sectional view at a position where the tops 31a of the first wires 31 are connected, the height of the coating resin 40 between adjacent first wires is lower than the height of the coating resin 40 at the point where the first wires 31 are arranged. Also, the coating resin 40 is formed so that, in a cross-sectional view at a position where the tops 32a of the second wires 32 are connected, the height of the coating resin 40 between adjacent second wires is lower than the height of the coating resin 40 at the point where the second wires 32 are arranged. Therefore, the coating resin 40 is formed so that the tops 31a of the first wires 31 and the tops 32a of the second wires 32 are higher at the positions 40a, and the coating resin 40 is lower at the positions 40b between the wires, and the cross-sectional shape is formed so that it has repeated unevenness. By making the heights of the coating resin 40 different in a cross-sectional view at the positions of the tops 31a of the first wires 31 and the tops 32a of the second wires 32, the light from the light-emitting element 1 is more likely to be emitted to the outside. This is because light arriving at the point where the height of the coating resin 40 between the wires is lower is released to the outside without hitting the coating resin 40. In comparison, if the height of the coating resin 40 between the wires is about the same as the height of the coating resin 40 at the point where the wires are arranged, the light arriving between the wires hits the coating resin 40, resulting in reduced light extraction. In addition, the coating resin 40 is dark in color, so it can absorb light (scattered light) that bounces off the lens. In addition, light that bounces off the lens and is incident perpendicularly (or at an angle close to perpendicular) on the top surface of the coating resin 40 is absorbed more than on a flat surface because the top surface of the coating resin 40 has an uneven shape.

In addition, the height difference of the uneven shape of the coating resin 40 at the position 40a at the top 31a of the first wire 31 and the position 40b between the wires, and the height difference of the uneven shape of the coating resin 40 at the position 40a at the top 32a of the second wire 32 and the position 40b between the wires become gentler toward the inner periphery side and the outer periphery side of the frame-shaped coating resin 40. And, at the outer periphery end of the frame, it is formed so as to be flush with the frame without height difference. On the other hand, it is preferable that the height difference of the uneven shape of the coating resin 40 remains at the inner periphery end side of the frame. By leaving the height difference of the uneven shape of the coating resin 40, the amount of light from the light emitting element that hits the coating resin 40 is reduced, and light extraction is improved.
In addition, the position 40MX of the top of the coating resin 40 and the position 40a of the coating resin 40 on the top 31a of the first wire 31 may be the same position or different positions.
It is preferable that the uneven shape of the coating resin 40 in a cross-sectional view at the position where the apexes 31a of the first wires 31 are connected is similar to the uneven shape of the coating resin 40 in a cross-sectional view at the position where the apexes 32a of the second wires 32 are connected. By making the shapes similar, it is possible to make the light appear symmetrical.

The coating resin 40 may be made of, for example, a translucent base material containing a dark-colored material that does not easily absorb or reflect light. The coating resin 40 may be made of, for example, a resin base material, which contains pigments, carbon powder, carbon black, or graphite and has light-absorbing particles dispersed therein to give it a dark black color. The base resin may be a thermosetting resin such as epoxy resin or silicone resin. The dark-colored carbon powder or pigment may be a light-absorbing black or nearly black color.

The coating resin 40 may be provided between a first resin frame 41 provided to surround the element mounting region 13 on the first substrate 10 at adjacent positions, and a second resin frame 42 provided on the second substrate 20 to surround the first substrate 10 outside the first wires 31 and the second wires 32. That is, the coating resin 40 may be formed by first providing a frame-shaped resin dam and filling the frame. The first resin frame 41 and the second resin frame 42 are formed to a predetermined height by providing resin with adjusted viscosity so that it overlaps in the height direction. For example, the first resin frame 41 and the second resin frame 42 are formed by forming a frame-shaped circle of resin adjusted to a predetermined viscosity from a nozzle on the substrate, and repeating this process to overlap the resin to reach the predetermined height.

The height of the second resin frame 42 may be higher than the height of the first resin frame when compared on the same plane. By making the second resin frame higher, it is possible to prevent the coating resin 40 from overflowing outside the second resin frame. The resin used here may be a thermosetting resin such as an epoxy resin or a silicone resin. It is preferable that the coating resin 40 filled in the first resin frame 41 and the second resin frame 42 after forming the frames has a lower viscosity than the viscosity of the first resin frame 41 and the second resin frame 42. It is also possible to form the coating resin 40 by filling the gap between the first resin frame 41 and the second resin frame 42 multiple times.
When the first substrate 10 is rectangular and the first external connection terminals 11, the second external connection terminals 12, the first wire connection terminals 21 and the second wire connection terminals 22 are arranged on the long side of the first substrate 10, it is preferable that the distance between the first resin frame 41 and the second resin frame 42 is narrower on the short side of the first substrate 10 than on the long side of the first substrate 10. This makes the top of the coating resin 40 provided on the short side of the first substrate 10 lower than the top of the coating resin 40 provided on the long side of the first substrate 10, improving light extraction.

The light emitting module 100 having the above configuration can be used, for example, as a light source for the headlights of a vehicle, ship, or aircraft. The light emitting module 100 may have a lens system arranged on the optical path. The light emitting module 100 turns on the light emitting elements 1 with an external power switch. The light emitting module 100 is configured so that some or all of the preset light emitting elements 1 can be turned on and off. The light sent from the light emitting module 100 exits the wavelength conversion member 5 along the optical path and is sent to a lens system arranged on the optical path.

In the light-emitting module 100, the coating resin 40 has a different height at the position 40a of the top 31a of the first wire 31 and the position 40b between the first wires, and further has a different height at the position 40a of the top 32a of the second wire 32 and the position 40b between the second wires, to form an uneven shape. Therefore, the light directed toward the position where the coating resin 40 is low is released to the outside, improving light extraction. In addition, in the light-emitting module 100, the scattered light reflected and returned from the lens system arranged on the light path can be absorbed by the coating resin 40 formed adjacent to the light-emitting surface. In addition, the light reflected and returned from the lens system that is incident perpendicularly (or at an angle close to perpendicularly) on the upper surface of the coating resin 40 is absorbed more than a flat surface because the upper surface of the coating resin 40 has an uneven shape. Therefore, the light-emitting module 100 suppresses scattered light returning from the lens system and has good light extraction efficiency.

[Method of manufacturing the light-emitting device]
Next, a method for manufacturing the light emitting module will be described with reference to FIGS.
FIG. 9 is a flow chart for explaining the manufacturing method of the light emitting module according to the embodiment. FIG. 10A is a plan view showing a first substrate in the manufacturing method of the light emitting module according to the embodiment. FIG. 10B is a plan view of the first substrate showing a state in which the light emitting element is mounted on the element mounting area in the manufacturing method of the light emitting module according to the embodiment. FIG. 10C is a schematic diagram showing an enlarged part of the alignment state of the light emitting element in the manufacturing method of the light emitting module according to the embodiment. FIG. 10D is a plan view showing a second substrate in the manufacturing method of the light emitting module according to the embodiment. FIG. 10E is a plan view of the second substrate showing a state in which the first substrate is mounted on the substrate mounting area of the second substrate in the manufacturing method of the light emitting module according to the embodiment. FIG. 10F is a plan view showing a state in which the first wire is connected to the first external connection terminal and the first wire connection terminal, the second wire is connected to the second external connection terminal and the second wire connection terminal, and the third wire is connected to the first drive terminal 15 and the second drive terminal 16 in the manufacturing method of the light emitting module according to the embodiment. 10GF is a plan view showing a state in which the first resin frame and the second resin frame are formed in the manufacturing method of the light-emitting module according to the embodiment. Note that the light-emitting elements 1 are placed with a predetermined interval therebetween, but the interval is omitted in the figures other than FIG. 10C due to size.

The manufacturing method of the light-emitting module includes an element mounting process S11 in which a plurality of light-emitting elements 1 are mounted and connected to the element mounting area 13 of the first substrate 10, a first substrate mounting process S13 in which the first substrate 10 is mounted on the substrate mounting area 23 of the second substrate 20, and a plurality of first external connection terminals 11 arranged on one side of the element mounting area 13 outside the element mounting area 13 of the first substrate 10 and a plurality of first wire connection terminals 21 arranged along one side of the element mounting area 13 outside the substrate mounting area 23 of the second substrate 20 by a plurality of first wires 31, and a plurality of second external connection terminals 12 arranged on the other side opposite to the one side across the element mounting area 13 outside the element mounting area 13 of the first substrate 10 and a substrate mounting process S14 in which the first substrate 10 is mounted on the substrate mounting area 23 outside the substrate mounting area 23 of the second substrate 20. The method includes a wire connection process S14, which is a process of connecting a plurality of second wires 32 to a plurality of second wire connection terminals 22 arranged along one side of the element mounting area 23 and the other side located opposite the side of the element mounting area 23; a resin frame formation process S15, which is a process of forming a dark-colored first resin frame 41 on the first substrate 10 in a position adjacent to and surrounding the element mounting area 13 and inside the plurality of first external connection terminals 11 and the plurality of second external connection terminals 12, and forming a dark-colored second resin frame 42 on the second substrate 20 in a position surrounding the first substrate 10 and outside the plurality of first wires 31 and the plurality of second wires 32; and a resin filling process S16, which is a process of filling the space between the first resin frame 41 and the second resin frame 42 with a dark-colored coating resin 40 having a lower viscosity than the first resin frame 41 and the second resin frame 42.

The light-emitting module manufacturing method also includes a wavelength conversion member forming step S17, which is a step of forming a wavelength conversion member 5 on the upper surface side of the multiple light-emitting elements, after the resin filling step S16 in which the coating resin 40 is filled. Furthermore, the light-emitting module manufacturing method includes a reflective member forming step S12, which is a step of forming a reflective member 7 that reflects light on each side of the multiple light-emitting elements 1, before the first substrate mounting step S13. Each step will be described below.

The element placement process S11 is a process of placing and connecting a plurality of light-emitting elements 1 to the element placement area 13 of the first substrate 10. In the element placement process S11, after attaching a plurality of light-emitting elements 1 to a sapphire substrate, the plurality of light-emitting elements are transferred to a support substrate, and an individual piece is prepared by dicing or the like to a size corresponding to the element placement area 13 of the first substrate 10. The individual pieces are bonded to the element placement area 13. In addition, the first external connection terminal 11 and the second external connection terminal 12 and wiring are formed on the first substrate 10 before the light-emitting element 1 is placed. The first external connection terminal 11 and the second external connection terminal 12 can be formed by attaching a metal foil such as Cu or Al, applying a paste of metal powder such as Cu or Ag, plating with Cu, or the like. In addition, the wiring electrically connected to the light-emitting element 1 can be patterned by an etching method, a printing method, or the like. The light-emitting element 1 can be electrically bonded to the element placement area 13 on the first substrate 10 by a plating method. The light-emitting elements 1 are arranged in a matrix with a certain distance between them.

The reflective member forming process S12 is a process of forming a reflective member to cover the side surface of the light-emitting element 1 after the light-emitting element 1 is mounted on the element mounting area 13 of the first substrate 10. When the reflective member forming process S12 is performed, after the light-emitting element 1 is mounted on the first substrate 10, a reflective member, for example, a white resin is filled between the light-emitting elements 1 to provide a reflective member on the side surface of the light-emitting element 1. In the reflective member forming process S12, it is preferable to provide a mask on the upper surface of the light-emitting element 1 before filling with the white resin. Removing the mask after filling with the white resin can prevent the white resin from being formed on the upper surface of the light-emitting element 1.

The first substrate placement process S13 is a process of placing the first substrate 10 on the substrate placement area 23 of the second substrate 20. In the first substrate placement process S13, the first substrate 10 on which the light-emitting element 1 is placed is bonded to the substrate placement area 23 of the second substrate 20 by a bonding material such as sintered Ag. Note that the second substrate 20 is pre-formed with wiring such as the first wire connection terminal 21 and the second wire connection terminal 22. In addition, when the third wire 33 is used, the first drive terminal 15 and the second drive terminal 16 are also formed.

The wire connecting step S14 is a step of connecting the first external connection terminals 11 of the first substrate 10 to the first wire connection terminals 21 of the second substrate 20 with a plurality of first wires 31, and connecting the second external connection terminals 12 of the first substrate 10 to the second wire connection terminals 22 of the second substrate 20 with a plurality of second wires 32. In the wire connecting step S14, a third wire 33 is connected to the first drive terminal 15 of the first substrate 10 and the second drive terminal 16 of the second substrate 20.
It is preferable that the wire is first connected to the first external connection terminal 11 provided on the first substrate 10, and then connected to the first wire connection terminal 21 provided on the second substrate. By connecting the wires in this order, it is possible to form a shape in which the top of the wire is raised.

The resin frame forming process S15 is a process of forming a dark-colored first resin frame 41 on the first substrate 10 at a position adjacent to and surrounding the element mounting region 13 on the inside of the plurality of first external connection terminals 11 and the plurality of second external connection terminals 12, and forming a dark-colored second resin frame 42 on the second substrate 20 at a position surrounding the first substrate 10 on the outside of the plurality of first wires 31 and the plurality of second wires 32. The resin frame forming process S15 may form the first resin frame 41 first and then form the second resin frame 42, or may form the second resin frame 42 and then form the first resin frame 41. Alternatively, the resin frame forming process S15 may form the first resin frame 41 and the second resin frame 42 approximately simultaneously. In the resin frame forming process S15, the first resin frame 41 and the second resin frame 42 are formed by applying resin having a viscosity that has been adjusted in advance from a nozzle that applies the resin. When forming the first resin frame 41 and the second resin frame 42, resin is applied from a nozzle multiple times, and the resin is layered to achieve a predetermined height.

The resin filling step S16 is a step of filling the space between the first resin frame 41 and the second resin frame 42 with a dark-colored coating resin having a lower viscosity than the first resin frame 41 and the second resin frame 42. In the resin filling step S16, the resin may be provided between the first resin frame 41 and the second resin frame 42 by filling once, or may be provided by filling multiple times. The top position 40MX of the coating resin 40 formed by the resin filling step S16 is formed so as to be higher than the top 41a of the first resin frame 41. In order to make the top position 40MX of the coating resin 40 higher than the top 41a of the first resin frame 41, it is preferable, as an example, to fill again before the filled resin is completely cured, and to repeat this until a predetermined height is reached. In addition, the coating resin 40 is formed so that the top of the long side area formed in the rectangular frame shape is higher than the top of the short side area.

Furthermore, when the coating resin 40 is filled, it may be applied along the direction in which the multiple first wires 31 are arranged, and also along the direction in which the multiple second wires 32 are arranged. In this case, the coating resin 40 is applied only to the region where the gap between the first resin frame and the second resin frame is wide, so that the coating resin filled in the region where the gap between the first resin frame and the second resin frame is wide flows to fill the region where the gap between the first resin frame and the second resin frame is narrow.
By doing this, the operation of the nozzle supplying the resin when filling the coating resin 40 can be minimized, thereby improving work efficiency, and further, the coating resin 40 can be prevented from spilling out outside the second resin frame 42.
When filling the wire with the coating resin 40, it is preferable to apply the coating resin 40 from directly above the top of the wire. This makes it easier for the top of the wire to be coated with the coating resin 40.

The resin frame forming process S15 and the resin filling process S16 are collectively a coating resin forming process. The first resin frame 41 and the second resin frame 42 are, for example, silicone resin. The resin to be filled is, for example, epoxy resin. The viscosity of the uncured resin material of the coating resin can be adjusted by the amount of solvent used in the resin material and the amount of appropriate filler added. Furthermore, in this process, forming the first resin frame 41 and the second resin frame 42 includes the placement of uncured or preferably partially cured resin material, and is not limited to the completion of full curing.

The coating resin 40 is formed so that, when viewed in cross section at a position where the tops of the multiple first wires are virtually connected, the height of position 40b of the coating resin 40 between adjacent first wires is lower than the height of position 40a of the coating resin 40 at the point where the first wire 31 is positioned, and when viewed in cross section at a position where the tops of the multiple second wires 32 are virtually connected, the height of position 40b of the coating resin 40 between adjacent second wires 32 is lower than the height of position 40a of the coating resin 40 at the point where the second wire 32 is positioned.
The coating resin 40 forms alternating high and low portions at the tops and between the first wires 31 and at the tops and between the wires of the second wires 32, providing a dark uneven state adjacent to the light extraction surface.

The wavelength conversion member forming process S17 is a process of forming the wavelength conversion member 5 on the upper surface side of the multiple light emitting elements 1. In the wavelength conversion member forming process S17, the wavelength conversion member 5 is formed adjacent to and separated from the inner surface of the coating resin 40. Note that the inner surface of the coating resin 40 indicates the same position as the inner surface of the first resin frame 41. The wavelength conversion member 5 is formed to a predetermined size in advance and is joined to the light extraction surface of the light emitting element 1 via a joining member. Since the wavelength conversion member 5 is adjacent to and separated from the coating resin 40, the wavelength conversion member 5, which is the light extraction surface, is easily seen and the contrast of light is clear. Note that in the specification, "separate" is described as a wording expression indicating that they are separated from each other, as is clear from the relationship between the coating resin 40 and the wavelength conversion member 5 shown in FIG. 12.

In the light emitting module 100, the position 40a of the coating resin 40 at the top 31a of the first wire 31 and the top 32a of the second wire 32, and the position 40b between the wires can be adjusted as shown in Figures 11A to 11C. Note that the position 40a of the coating resin 40 at the top 31a of the first wire 31 and the position 40b of the coating resin between the wires, and the position 40a of the coating resin 40 at the top 32a of the second wire 32 and the position 40b of the coating resin 40 between the wires are shown in the same way in the cross-sectional view, so the configuration on the first wire 31 side will be described as a representative and the configuration on the second wire 32 side will be omitted.

11A , position 40a of top 31a of first wire 31 in coating resin 40 is formed to be higher than position 40b of coating resin 40 between the wires. This height difference L1 is formed to be large in a cross-sectional view at a position where each top 31a of first wire 31 is virtually connected, and is formed to become smaller toward one end side or the other end side of first wire 31.
As shown in Fig. 11B, the position 40a1 of the coating resin 40 at the top 31a of the first wire 31 is formed to be higher than the position 40b1 of the coating resin 40 between the wires. The height difference L2 of the coating resin 40 is smaller than that of the configuration of Fig. 11A, the position 40b1 of the coating resin 40 between the wires is substantially the same as the upper surface of the first wire 31, and the thickness of the coating resin 40 at the position 40a1 at the top 31a of the first wire 31 is formed to be thicker than the thickness of Fig. 11A. With this configuration, the wire can be reliably covered with the coating resin 40, and the quality of the product can be improved. Note that the uneven state is formed gently due to the height difference L2 of the coating resin 40 when Fig. 11A is assumed to be the reference.

As shown in Fig. 11C, the position 40a2 of the coating resin 40 at the top 31a of the first wire 31 is formed to be higher than the position 40b2 of the coating resin 40 between the wires. The height difference L3 of the coating resin 40 is larger than that of the configuration of Fig. 11A, the position 40b2 of the coating resin 40 between the wires is lower than the lower surface of the first wire 31, and the thickness of the position 40a2 of the coating resin 40 at the top 31a of the first wire 31 is formed to be thinner than the thickness of Fig. 11A. Note that the uneven state is formed so that the height difference is large when Fig. 11A is assumed as the standard due to the height difference L3 of the coating resin 40. By making the height difference large in this way, light from the light-emitting element 1 can easily pass through, and the efficiency of light extraction can be increased.
As described above, the coating resin 40 can suppress scattered light by forming height differences L, L1, L2 between positions 40a, 40a1, 40a of the top 31a of the first wire 31 and positions 40b, 40b1, 40b2 between the wires, and the greater the height difference, the greater the possibility of absorbing scattered light.

12, the second substrate 20A may have a recess 24 formed in the center, and the substrate mounting area 23A may be set within the recess 24. In this manner, the light-emitting module 100A can have a small overall thickness by forming the recess 24 in the second substrate 20A and setting the substrate mounting area 23A.
Although the light emitting device and the manufacturing method thereof according to the present invention have been specifically described above by way of the embodiment of the invention, the gist of the present invention is not limited to these descriptions and should be broadly interpreted based on the claims. Furthermore, it goes without saying that various changes and modifications based on these descriptions are also included in the gist of the present invention.

The light-emitting module 100 according to the embodiment of the present disclosure can be used in a variety of light sources, such as headlights for vehicles, ships, and aircraft, and in projector devices.

REFERENCE SIGNS LIST 1 Light emitting element 5 Wavelength conversion member 7 Reflective member 10 First substrate 11 First external connection terminal 12 Second external connection terminal 13 Element mounting area 15 First drive terminal 16 Second drive terminal 20, 20A Second substrate 21 First wire connection terminal 22 Second wire connection terminal 23 Substrate mounting area 24 Recess 31 First wire 31a Top of first wire 32 Second wire 32a Top of second wire 33 Third wire 40 Coating resin 41 First resin frame 42 Second resin frame 100, 100A Light emitting module S11 Element mounting process S12 Reflective member forming process S13 First substrate mounting process S14 Wire connection process S15 Resin frame forming process S16 Resin filling process S17 Wavelength conversion member forming process

Claims (14)

A plurality of light emitting elements;
a first substrate having an element mounting area on which the plurality of light-emitting elements are mounted and electrically connected, and further having a plurality of first external connection terminals arranged on one side of the element mounting area and a plurality of second external connection terminals arranged on the other side opposite to the element mounting area, outside the element mounting area;
a second substrate having a substrate mounting area on which the first substrate is mounted, and further having a plurality of first wire connection terminals arranged along one side of the substrate mounting area outside the substrate mounting area, and a plurality of second wire connection terminals arranged along the other side located on the opposite side of the substrate mounting area;
a plurality of first wires electrically connecting the first external connection terminals and the first wire connection terminals and arranged along one side of the first substrate;
a plurality of second wires electrically connecting the second external connection terminals and the second wire connection terminals and arranged along the other side of the first substrate;
a dark-colored coating resin that covers the first wires and the second wires and surrounds the element mounting region at adjacent positions;
A light-emitting module in which, when viewed in cross-section at a position where the tops of the multiple first wires are connected, the height of the coating resin between adjacent first wires is lower than the height at the point where the first wires are arranged, and, when viewed in cross-section at a position where the tops of the multiple second wires are connected, the height of the coating resin between adjacent second wires is lower than the height at the point where the second wires are arranged. The light-emitting module according to claim 1, wherein the coating resin is provided between a first resin frame provided to surround the element mounting area on the first substrate at adjacent positions, and a second resin frame provided on the second substrate to surround the first substrate outside the first wires and the second wires. The light-emitting module according to claim 2, wherein the first resin frame and the second resin frame are each formed by stacking a plurality of resin frames in the height direction. The light-emitting module according to claim 2 or 3, wherein a wavelength conversion member is disposed on the upper surface side of the plurality of light-emitting elements, and the wavelength conversion member is provided in a position adjacent to the first resin frame. The light-emitting module according to any one of claims 2 to 4, wherein a reflective member that reflects light is provided on the side surfaces of the plurality of light-emitting elements. The light-emitting module according to claim 5, wherein the reflective member is spaced apart from the first resin frame. The light-emitting module according to any one of claims 2 to 6, wherein the coating resin is formed so that its top is higher than the top of the first resin frame. the first substrate is rectangular;
the first external connection terminals, the second external connection terminals, the first wire connection terminals, and the second wire connection terminals are disposed on a long side of the first substrate,
The light-emitting module according to claim 2 , wherein the distance between the first resin frame and the second resin frame is narrower on the short side of the first substrate than on the long side of the first substrate. The light-emitting module according to claim 8, wherein the top of the coating resin provided on the short side of the first substrate is lower than the top of the coating resin provided on the long side of the first substrate. The light-emitting module according to any one of claims 1 to 9, wherein the coating resin is a dark black color obtained by adding a pigment or carbon powder to a base resin. placing a plurality of light emitting elements on an element mounting region of a first substrate;
placing and connecting the first substrate to a substrate placement area of a second substrate;
a step of connecting, with a plurality of first wires, a plurality of first external connection terminals arranged on one side of the element mounting area of the first substrate outside the element mounting area and a plurality of first wire connection terminals arranged along one side of the element mounting area of the second substrate outside the substrate mounting area, and connecting, with a plurality of second wires, a plurality of second external connection terminals arranged on the other side opposite to the one side across the element mounting area of the first substrate outside the substrate mounting area and a plurality of second wire connection terminals arranged along the other side opposite to the one side across the substrate mounting area of the second substrate outside the substrate mounting area;
forming a dark-colored first resin frame on the first substrate at a position adjacent to and surrounding the element mounting region and inside the plurality of first external connection terminals and the plurality of second external connection terminals, and forming a dark-colored second resin frame on the second substrate at a position outside the plurality of first wires and the plurality of second wires and surrounding the first substrate;
and filling a gap between the first resin frame and the second resin frame with a dark-colored coating resin having a lower viscosity than the first resin frame and the second resin frame,
A method for manufacturing a light-emitting module, wherein the coating resin is formed so that, when viewed in cross section along a line connecting the tops of the multiple first wires, the height of the coating resin between adjacent first wires is lower than the height at the point where the first wires are positioned, and when viewed in cross section along a line connecting the tops of the multiple second wires, the height of the coating resin between adjacent second wires is lower than the height at the point where the second wires are positioned. The method for manufacturing a light-emitting module according to claim 11, wherein the coating resin is applied along the direction in which the first wires are arranged and also along the direction in which the second wires are arranged. forming a wavelength conversion member on an upper surface side of the plurality of light emitting elements after the step of filling the coating resin;
The method for manufacturing a light emitting module according to claim 11 or 12, wherein the wavelength conversion member is formed adjacent to and spaced apart from the first resin frame. A method for manufacturing the light-emitting module described in any one of claims 11 to 13, comprising a step of forming a reflective member that reflects light on each side of the plurality of light-emitting elements after a step of mounting and connecting the plurality of light-emitting elements to the element mounting area of the first substrate.

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