JP2021048191A - Imprint device and manufacturing method of article - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an advantageous technique for accurately controlling the alignment between a mold and a substrate. An imprinting apparatus for molding an imprint material on a substrate using a mold has a detection unit for detecting an image formed by a mold mark of the mold and a substrate mark of the substrate, and the mold mark. It includes a mechanism including a first member having a first mark imitated and a second member having a second mark imitating the substrate mark, and a control unit for controlling the alignment of the mold and the substrate. The control unit relatively drives the first member and the second member to change the relative positions of the first mark and the second mark, while using the first mark and the second mark. By causing the detection unit to detect the reference image formed by, information indicating the relationship between the change in the relative position and the change in the detection result of the reference image by the detection unit is generated, and the information and the detection unit are generated. The alignment is controlled based on the detection result of the image. [Selection diagram] Fig. 1

Description

The present invention relates to an imprinting apparatus and a method for manufacturing an article.

An imprint device is attracting attention as one of the lithography devices for forming a pattern on a substrate. The imprint device cures the imprint material in a state where the mold and the imprint material on the substrate are in contact with each other, and peels the mold from the cured imprint material to form a pattern of the imprint material on the substrate. can do.

In the imprinting apparatus, for example, a moiré image formed by a mark (mold mark) provided on a mold and a mark (board mark) provided on a substrate is detected by a detection unit, and the mold is formed based on the detection result. Alignment with the substrate can be performed. In Reference 1, a reference mark for generating a sine wave signal similar to a moire image formed by a mold mark and a substrate mark is provided on the substrate stage, and the reference mark is detected (imaged) by a detection unit based on the result. A method for evaluating the performance of the detection unit is disclosed.

Japanese Unexamined Patent Publication No. 2015-15408

The detection result of the image formed by the mold mark and the substrate mark by the detection unit often does not match the design of those marks due to, for example, a detection error of the detection unit or a manufacturing process. Therefore, the relationship between the change in the relative position between the mold mark and the substrate mark and the change in the image detection result by the detection unit is obtained in advance, and the mold and the substrate are aligned based on the information indicating the relationship. Is preferable. However, in a typical imprinting apparatus, it is difficult to accurately control the relative position between the mold and the substrate when the mold and the imprint material on the substrate are not in contact with each other. Therefore, if the mold mark and the substrate mark are used in the acquisition of the relationship, the relationship cannot be obtained accurately, and the alignment accuracy between the mold and the substrate may decrease. Further, in the method described in Cited Document 1, a reference mark for generating one sine wave signal is used, and the sine wave signal cannot be changed, so that the relationship cannot be obtained.

Therefore, an object of the present invention is to provide an advantageous technique for accurately controlling the alignment between the mold and the substrate.

In order to achieve the above object, the imprinting apparatus as one aspect of the present invention is an imprinting apparatus for molding an imprint material on a substrate by using a mold, and the mold mark provided on the mold and the above. A detection unit that detects an image formed by a substrate mark provided on a substrate, a first member having a first mark imitating the mold mark, and a second member having a second mark imitating the substrate mark. The first member includes a mechanism capable of relatively driving the first member and the second member, and a control unit for controlling the alignment of the mold and the substrate. While relatively driving the member and the second member to change the relative positions of the first mark and the second mark, the reference image formed by the first mark and the second mark is displayed. By causing the detection unit to detect, information indicating the relationship between the change in the relative position and the change in the detection result of the reference image by the detection unit is generated, and the information and the detection result of the image by the detection unit are obtained. It is characterized in that the alignment is controlled based on the above.

Further objects or other aspects of the invention will be manifested in the preferred embodiments described below with reference to the accompanying drawings.

According to the present invention, for example, it is possible to provide an advantageous technique for accurately controlling the alignment between the mold and the substrate.

Schematic diagram showing the configuration of the imprinting apparatus of the first embodiment The figure which shows the configuration example of the detection part The figure which shows the modification of the detection part The figure which shows the structural example of the light source part The figure which shows the deformation example of a light source part The figure which shows the example of the positional relationship between the pupil intensity distribution of the illumination part of a detection part, and the numerical aperture of an image pickup part. The figure which shows the structural example of a diffraction grating The figure which shows the structural example of the mold mark Mm and the substrate mark Mw. The figure which shows the other structural example of the mold mark Mm and the substrate mark Mw. The figure which illustrated the simulation result of the primary diffraction efficiency of the substrate mark Mw. Flowchart showing imprint processing Flow chart showing the process of generating calibration information using the calibration mechanism The figure which shows the detection signal acquired from the detection part, and the calibration information. The schematic diagram which shows the structure of the imprint apparatus of 2nd Embodiment The figure which shows the manufacturing method of an article

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. The following embodiments do not limit the invention according to the claims. Although a plurality of features are described in the embodiment, not all of the plurality of features are essential to the invention, and the plurality of features may be arbitrarily combined. Further, in the attached drawings, the same or similar configurations are designated by the same reference numbers, and duplicate explanations are omitted.

<First Embodiment>
The imprint device is a device that forms a pattern of a cured product to which the uneven pattern of the mold is transferred by bringing the imprint material supplied on the member into contact with the mold and applying energy for curing to the imprint material. Is. For example, an imprinting apparatus supplies an imprint material onto a substrate and cures the imprint material in a state where a mold having an uneven pattern is brought into contact with the imprint material on the substrate. Then, by widening the distance between the mold and the substrate and peeling (releasing) the mold from the cured imprint material, a pattern layer of the imprint material can be formed on the substrate. Such a series of processes is called "imprint process".

As the imprint material, a curable composition (sometimes referred to as an uncured resin) that cures when energy for curing is applied is used. Electromagnetic waves, heat, etc. are used as the energy for curing. The electromagnetic wave is, for example, light such as infrared rays, visible rays, and ultraviolet rays whose wavelength is selected from the range of 10 nm or more and 1 mm or less.

The curable composition is a composition that is cured by irradiation with light or by heating. Of these, the photocurable composition that is cured by light may contain at least a polysynthetic compound and a photopolymerization initiator, and may contain a non-heavy synthetic compound or a solvent, if necessary. The non-heavy synthetic compound is at least one selected from the group of sensitizers, hydrogen donors, internal release mold release agents, surfactants, antioxidants, polymer components and the like.

The imprint material is applied in the form of a film on the substrate by a spin coater or a slit coater. Alternatively, the liquid injection head may be applied on the substrate in the form of droplets or in the form of islands or films formed by connecting a plurality of droplets. The viscosity of the imprint material (viscosity at 25 ° C.) is, for example, 1 mPa · s or more and 100 mPa · s or less.

In the present specification and the accompanying drawings, the direction is shown in the XYZ coordinate system in which the direction parallel to the surface of the substrate is the XY plane. The directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are the X-direction, Y-direction, and Z-direction, and the rotation around the X-axis, the rotation around the Y-axis, and the rotation around the Z-axis are θX and θY, respectively. , ΘZ. Control or drive with respect to the X-axis, Y-axis, and Z-axis means control or drive with respect to a direction parallel to the X-axis, a direction parallel to the Y-axis, and a direction parallel to the Z-axis, respectively. Further, the control or drive regarding the θX axis, the θY axis, and the θZ axis relates to the rotation around the axis parallel to the X axis, the rotation around the axis parallel to the Y axis, and the rotation about the axis parallel to the Z axis, respectively. Means control or drive. The position is information that can be specified based on the coordinates of the X-axis, Y-axis, and Z-axis, and the posture is information that can be specified by the values of the θX-axis, θY-axis, and θZ-axis. Positioning means controlling position and / or posture. Alignment can include control of the position and / or orientation of at least one of the substrate and mold.

[Configuration of imprint device]
Next, the imprinting apparatus 100 of the first embodiment according to the present invention will be described. FIG. 1 is a schematic view showing the configuration of the imprinting apparatus 100 of the first embodiment. The imprint device 100 includes, for example, an imprint head 10 (mold holding mechanism) for holding the mold M, a substrate stage 20 (board holding mechanism) for holding and moving the substrate W, a supply unit 30, and a curing unit. 40, a detection unit 50, and a control unit CNT may be included.

The mold M is usually made of a material capable of transmitting ultraviolet rays such as quartz, and a part of the area (pattern area) protruding toward the substrate on the surface on the substrate side is an imprint material on the substrate. A pattern of irregularities to be transferred to is formed. Further, as the substrate W, glass, ceramics, metal, semiconductor, resin or the like is used, and if necessary, a member made of a material different from the substrate may be formed on the surface thereof. Specific examples of the substrate W include a silicon wafer, a compound semiconductor wafer, and quartz glass. Further, before applying the imprint material, if necessary, an adhesion layer may be provided in order to improve the adhesion between the imprint material and the substrate.

The imprint head 10 drives the mold M (mold holding portion 11) in the Z direction so as to change the distance between the mold M and the substrate W, for example, the mold holding portion 11 that holds the mold M by a vacuum force or the like. The mold drive unit 12 may be included. The mold drive unit 12 may include a plurality of actuators. In the case of the present embodiment, the imprint head 10 drives the mold M in the Z direction to bring the mold M into contact with the imprint material on the substrate, and to peel the mold M from the cured imprint material. The mold removal process can be performed. Further, the imprint head 10 (mold drive unit 12) is not limited to the function of driving the mold M in the Z direction, but also has a function of driving the mold M in the XY direction and the θ direction (rotational direction around the Z axis) and the mold. It may be configured to have a function of changing the inclination (tilt) of M. That is, the mold driving unit 12 has the mold M on a plurality of axes (for example, three axes of Z axis, θX axis, and θY axis, preferably X axis, Y axis, Z axis, θX axis, θY axis, and θZ axis. It may be configured to drive about 6 axes).

The substrate stage 20 may include, for example, a substrate chuck 21 that holds the substrate W by a vacuum force or the like, and a substrate driving unit 22 that drives the substrate W in the XY directions. The substrate drive unit 22 may include a plurality of actuators. In the case of the present embodiment, by driving the substrate W in the XY directions by the substrate stage 20, the substrate W can be positioned with respect to the mold M and the substrate W can be positioned with respect to the supply unit 30. Further, the substrate stage 20 (board driving unit 22) is not limited to the function of driving the substrate W in the XY direction, but also has a function of driving the substrate in the Z direction and the θ direction and a function of changing the inclination (tilt) of the substrate W. May be configured to have. That is, the substrate driving unit 22 uses the substrate W as a plurality of axes (for example, three axes of X-axis, Y-axis, and θZ-axis, preferably X-axis, Y-axis, Z-axis, θX-axis, θY-axis, and θZ-axis. It may be configured to drive about 6 axes).

Here, in the imprinting apparatus 100 of the present embodiment, the distance between the mold M and the substrate W in the contact step and the mold release step can be changed by driving the mold M in the Z direction with the imprint head 10. However, it is not limited to that. For example, the substrate W may be driven in the Z direction by the substrate stage 20, or the mold M and the substrate W may be driven relative to each other in the Z direction by both the imprint head 10 and the substrate stage 20. You may. Further, in the imprinting apparatus 100 of the present embodiment, the alignment of the mold M and the substrate W in the XY direction can be performed by driving the substrate W in the XY direction on the substrate stage 20, but the present invention is not limited to this. Absent. For example, the imprint head 10 may drive the mold M in the XY direction, or both the imprint head 10 and the substrate stage 20 may drive the mold M and the substrate W relative to each other in the XY direction. You may be imprinted.

The supply unit 30 (discharge unit, dispenser) supplies the imprint material R (for example, uncured resin) on the substrate. In the present embodiment, an ultraviolet curable resin having a property of being cured by irradiation with ultraviolet rays can be used as the imprint material R. Further, the cured portion 40 (irradiated portion) emits light through the mold M to the imprint material R on the substrate in a state where the mold M and the imprint material R on the substrate are in contact with each other during the imprint process. The imprint material is cured by irradiating it with (for example, ultraviolet rays).

The detection unit 50 includes an alignment scope for detecting an image (for example, moire fringes, interference fringes) formed by the mold mark Mm provided on the mold M and the substrate mark Mw provided on the substrate W, and the light of the image. Outputs a signal (detection signal) according to the intensity. For example, a plurality of detection units 50 may be provided and may be configured to be movable according to the position (XY direction) of the mark pair including the mold mark Mm and the substrate mark Mw. As a result, the control unit CNT obtains the relative position (XY direction) between the mold mark Mm and the substrate mark Mw based on the detection signals from each detection unit 50, and controls the alignment between the mold M and the substrate W. be able to. The specific configuration of each detection unit 50 will be described later.

The control unit CNT is composed of, for example, a computer having a processing unit PRC represented by a CPU or the like, a memory MRY, or the like, and controls each unit of the imprint device 100 to control the imprint processing. The imprint process may include, for example, a supply process, a contact process, an alignment process, a curing process, a mold release process, and the like.

The supply step is a process of supplying the imprint material R onto the substrate by the supply unit 30 while driving the substrate W in the XY directions by the substrate drive unit 22 (board stage 20). The contact process is a process in which the mold M is driven by the mold driving unit 12 (imprint head 10) to narrow the distance between the mold M and the substrate W, so that the mold M and the imprint material R on the substrate are brought into contact with each other. is there. In the alignment step, the detection unit 50 detects an image formed by the mold mark Mm and the substrate mark Mw, and based on the detection result, the mold M and / or the substrate drive unit 22 causes the mold M and the substrate to detect the image. This is a process for aligning with W (XY direction). The curing step is a process of curing the imprint material R on the substrate by applying energy for curing (for example, irradiating light) to the imprint material R on the substrate by the curing unit 40. The mold release step is a process of peeling the mold M from the cured imprint R by driving the mold M by the mold driving unit 12 to widen the distance between the mold M and the substrate W.

Here, the alignment step is not limited to the process of adjusting the relative position between the pattern region of the mold M and the shot region of the substrate W, and the mold M and the substrate W are reduced so that the shape difference between the pattern region and the shot region is reduced. It may include a process of transforming at least one of the above. In this case, the imprinting apparatus 100 may be provided with a deformation mechanism (not shown) that deforms at least one of the mold M and the substrate W. The deformation mechanism includes, for example, a mold deformation mechanism that deforms the mold M by applying a force to the side surface of the mold M, and / or a substrate deformation mechanism that deforms the substrate W by heating the substrate W by irradiation with light or the like. Can include.

[Configuration of detector]
Next, a specific configuration of each detection unit 50 will be described. FIG. 2 is a diagram showing a configuration example of each detection unit 50. Each detection unit 50 may include an imaging unit 51 that captures an image formed by the mold mark Mm and the substrate mark Mw, and an illumination unit 52 that illuminates the mold mark Mm and the substrate mark Mw with illumination light.

The illumination unit 52 may include a light source unit 53, a drive circuit 54 for driving the light source unit 53, and an optical system 56a. The light source unit 53 may include, for example, at least one of a laser (eg, a semiconductor laser), a halogen lamp, a light emitting diode (LED), a high pressure mercury lamp and a metal halide lamp, but preferably includes a laser. The wavelength of the illumination light generated by the light source unit 53 is preferably a wavelength that does not cure the imprint material R. The drive circuit 54, for example, supplies a drive signal including an AC component to the light source unit 53 to drive the light source unit 53.

The detection unit 50 may include a prism 55 and an optical system 56b as an optical system shared by the illumination unit 52 and the imaging unit 51. The illumination light from the light source unit 53 can illuminate the imaging field of view of the imaging unit 51 via the prism 55 and the optical system 56b. As a result, the mold mark Mm and the substrate mark Mw can be illuminated by the illumination light.

The image pickup unit 51 may include an image pickup element (image sensor) 57 and an optical system 58. The reflected light from the mold mark Mm and the substrate mark Mw illuminated by the illumination unit 52 can enter the image pickup device 57 via the optical system 56b, the prism 55, and the optical system 58. The image pickup device 57 captures an image formed on the image pickup surface of the image pickup device 57 by the mold mark Mm and the substrate mark Mw, and outputs a detection signal (image data may be output). The pupil surface of the illumination unit 52 and the pupil surface of the imaging unit 51 may be arranged on the same surface, and the reflection surface of the prism 55 may be arranged at or near the pupil surface.

As an example, the mold mark Mm and the substrate mark Mw are each composed of a diffraction grating including a lattice pattern. Then, an image of the diffracted light from the mold mark Mm illuminated by the illumination light and the diffracted light from the substrate mark Mw, that is, a moire image (interference fringes, moire fringes) is formed on the imaging surface of the image pickup element 57. The amount of light of the moire image depends on the diffraction efficiency of the mold M and the substrate W (more specifically, the mold mark Mm and the substrate mark Mw). Since the diffraction efficiency changes periodically with respect to the wavelength, there are a wavelength at which a moire image can be efficiently formed and a wavelength at which a moire image is difficult to form. Light with a wavelength at which it is difficult to form a moire image can be noise.

As an example, the prism 55 is configured by laminating two optical members, and the reflective film 55a is arranged on the laminating surface. The reflective film 55a reflects light in the peripheral region of the pupil of the illumination unit 52. Further, the reflective film 55a has an aperture that functions as an aperture diaphragm that defines the size of the pupil (or detection NA: NAo) of the imaging unit 51. The prism 55 may be a half prism having a semipermeable membrane on the bonded surface. Alternatively, instead of the prism 55, a plate-shaped optical element having a reflective film on the surface may be adopted. Here, instead of the configuration shown in FIG. 2, the reflective film 55a is configured so as to reflect the light in the central region in the pupil of the illumination unit 52 and transmit the light in the peripheral region, and the illumination unit 52 and the imaging unit 52. The arrangement of 51 may be exchanged.

FIG. 3 is a diagram showing a modified example of the detection unit 50. In the example shown in FIG. 3, the pupil of the illumination unit 52 is arranged at a position away from the reflection surface of the prism 55, and the diaphragm 59a is arranged on the pupil surface of the illumination unit 52. Further, the pupil of the imaging unit 51 is arranged at a position away from the reflecting surface of the prism 55, and the diaphragm 59b is arranged on the pupil surface of the imaging unit 51. The prism 55 may be a half prism in which two optical members are bonded together and a semipermeable membrane is arranged on the bonded surface.

FIG. 4 is a diagram showing a detailed configuration example of the light source unit 53. The light source unit 53 may have a plurality of light sources 60a to 60d. The plurality of light sources 60a to 60d may be composed of a laser (for example, a semiconductor laser). However, the plurality of light sources 60a to 60d may include at least two types of light sources selected from a plurality of types of light sources such as lasers, halogen lamps, light emitting diodes (LEDs), high pressure mercury lamps and metal halide lamps. The drive circuit 54 may include a plurality of drive elements that each drive a plurality of light sources 60a to 60d.

The light source unit 53 may include a plurality of optical systems 61a to 61d corresponding to the plurality of light sources 60a to 60d, respectively. Each of the plurality of optical systems 61a to 61d may be composed of, for example, one or a plurality of lenses. The light emitted from the plurality of light sources 60a to 60d passes through the plurality of optical systems 61a to 61d and is then combined by the plurality of optical elements 62a to 62d. In one example, the optical elements 62a are mirrors and the optical elements 62b-62d are dichroic mirrors or half mirrors. When the wavelength bands of the light generated by the light sources 60a to 60d differ by, for example, about 50 nm or more, they can be combined using a dichroic mirror. If the wavelengths of the light generated by the light sources 60a to 60d are the same or close to each other and cannot be efficiently combined by the dichroic mirror, they can be combined by using a half mirror. In the configuration shown in FIG. 4, the lights from the plurality of light sources 60a to 60d are combined one by one. For example, two lights from the plurality of light sources 60a to 60d are combined and the plurality of combined lights are combined. After the is generated, a plurality of synthetic lights may be synthesized one by one.

The intensity of the light synthesized by the plurality of optical elements 62a to 62d can be adjusted by the ND filter 64. The ND filter 64 is an element whose intensity of light to be passed can be adjusted. For example, the transmittance of the ND filter 64 can be determined by the type and thickness of the metal film applied to quartz. The transmittance may be adjusted by providing a plurality of ND filters 64 having different transmittances and arranging one ND filter 64 selected from them in the optical path. Alternatively, one ND filter 64 may have a configuration in which the transmittance differs depending on the light passing position, and the light passing position may be changed according to the target light intensity. The intensity of the light emitted from the light source unit 53 may be adjusted by adjusting the drive currents of the plurality of light sources 60a to 60d instead of changing by the ND filter 64. Alternatively, the intensity of the light emitted from the light source unit 53 may be adjusted by a combination of the change by the ND filter 64 and the adjustment of the drive currents of the plurality of light sources 60a to 60d.

The light that has passed through the ND filter 64 can be supplied to the fiber 66 after passing through the diffuser plate 65. The light generated by a laser such as a semiconductor laser has a narrow wavelength band of several nm and may be a light source that generates coherence light with a uniform vector, so noise (speckle noise) is generated in the image observed by interference. It can occur. By rotating the diffuser plate 65 to change the state of the waveform over time, the observed speckle noise is reduced. The light emitted from the fiber 66 becomes the light emitted from the light source unit 53.

In the example shown in FIG. 4, light is emitted from only one fiber 66. Instead of such an example, as illustrated in FIG. 5, the light is divided by arranging the half mirrors 63a to 63c in the optical path, and a plurality of lights are emitted through the plurality of fibers 66a to 66d. It may be configured to be. In this case, the ND filter 64 and the diffuser plate 65 may be provided for each of the plurality of fibers 66a to 66d. Specifically, as shown in FIG. 5, a plurality of ND filters 64a to 64d and a plurality of diffusion plates 65a to 65d may be provided.

FIG. 6 is a diagram showing an example of the positional relationship between the pupil intensity distribution (IL1 to IL4) of the illumination unit 52 of the detection unit 50 and the numerical aperture NAo of the imaging unit 51. In the example shown in FIG. 6, the pupil intensity distribution of the illumination unit 52 includes a first pole IL1, a second pole IL2, a third pole IL3, and a fourth pole IL4. With this configuration, the mold mark Mm and the substrate mark Mw are illuminated from the ± Y direction by the light from the first pole IL1 and the second pole IL2, and in the ± X direction by the light from the third pole IL3 and the fourth pole IL4. Can be illuminated from. By arranging the reflective film 55a that functions as an aperture diaphragm on the pupil surface of the illumination unit 52 as shown in FIG. 2, or by arranging the diaphragm 59a on the pupil surface of the illumination unit 52 as shown in FIG. A plurality of poles (first pole IL1 to fourth pole IL4) can be formed from one light source unit 53. When forming a pupil intensity distribution having a plurality of poles (peaks) in this way, the detection unit 50 can be simplified or miniaturized because a plurality of light source units are not required.

[Mark detection principle]
Next, the principle of generating a moire image formed by the mold mark Mm and the substrate mark Mw, and a method of obtaining the relative position between the mold mark Mm and the substrate mark Mw using the moire image will be described. 7 (a) to 7 (b) are diagrams showing a configuration example of diffraction gratings G1 and G2 having slightly different lattice pattern periods (lattice pitches) from each other. The diffraction grating G1 is adopted for, for example, the type mark Mm, and has a lattice pattern in which a plurality of line elements extending in the Y direction are arranged in the X direction at the first lattice pitch. Further, the diffraction grating G2 is adopted for, for example, the substrate mark Mw, and has a lattice pattern in which a plurality of line elements extending in the Y direction are arranged in the X direction at a second lattice pitch different from the first lattice pitch.

When these diffraction gratings G1 and G2 are superposed, a pattern (moire) having a period reflecting the periodic difference between the diffraction gratings is caused by the interference between the diffracted lights from the two diffraction gratings, as shown in FIG. 7 (c). Image) occurs. The phase (bright and dark positions) of the moire image changes according to the relative positions of the diffraction gratings. For example, when the relative positions of the diffraction gratings G1 and G2 are slightly shifted in the X direction, the moire image shown in FIG. 7 (c) changes as shown in FIG. 7 (d). Since the phase of this moire image changes at a period larger than the size of the relative position where the two diffraction gratings actually changed, even if the resolution of the detection unit 50 (imaging unit 51) is low, the relative of the two diffraction gratings It is possible to magnify and detect the target misalignment.

Here, in order to detect the moire image, the diffraction gratings G1 and G2 are detected in a bright field (the diffraction gratings G1 and G2 are illuminated from the vertical direction, and the diffracted light diffracted in the vertical direction by the diffraction gratings G1 and G2 is emitted. The case of (detection) will be described. In this case, the detection unit 50 (imaging unit 51) also detects the 0th-order light from the diffraction gratings G1 and G2. Since the 0th-order light causes a factor of lowering the contrast of the moire image, the detection unit 50 does not detect the 0th-order light (that is, illuminates the diffraction gratings G1 and G2 with oblique incidence), that is, the diffraction grating G1. , It is preferable to have a configuration for detecting G2 in a dark field. Of the diffraction gratings G1 and G2, one of the diffraction gratings G1 and G2 is a checkerboard-shaped diffraction grating as shown in FIG. 8A, and the other diffraction grating is shown in FIG. 8 so that the moire image can be detected even in the dark field configuration. It is preferable to use a diffraction grating as shown in (b). The diffraction grating shown in FIG. 8A includes a pattern periodically arranged in the measurement direction (X direction) and a pattern periodically arranged in the direction orthogonal to the measurement direction (Y direction).

With reference to FIGS. 6 and 8 (a) to 8 (b), the light from the first pole IL1 and the second pole IL2 is applied to the diffraction grating and diffracted in the Y direction by the checkerboard-shaped diffraction grating. It also diffracts in the X direction. Further, the light diffracted in the X direction by the diffraction gratings having slightly different periods is incident on the detection region (NAo) on the pupil of the image pickup unit 51 with the relative position information in the X direction, and is detected by the image pickup device 57 (). (Imagine).

In the relationship between the pupil intensity distribution shown in FIG. 6 and the diffraction grating shown in FIGS. 8 (a) to 8 (b), the light from the third pole IL3 and the fourth pole IL4 is used for detecting the relative position of the diffraction grating. Not used. However, when detecting the relative position of the diffraction grating shown in FIGS. 8C to 8D, the light from the third pole IL3 and the fourth pole IL4 is used to detect the relative position of the diffraction grating, and the second pole is detected. Light from the 1st pole IL1 and the 2nd pole IL2 is not used to detect the relative position of the diffraction grating. Further, the set of the diffraction gratings shown in FIGS. 8 (a) to 8 (b) and the set of the diffraction gratings shown in FIGS. 8 (c) to 8 (d) are arranged in the same field of view of the imaging unit 51 and simultaneously 2 The pupil intensity distribution shown in FIG. 6 is useful when detecting relative positions in one direction.

FIG. 9 is a diagram showing other configuration examples of the mold mark Mm and the substrate mark Mw. It is assumed that the outer frame A in FIG. 9 is the imaging field of view of the detection unit 50 (imaging unit 51), and the detection unit 50 can detect (observe) the range of the outer frame A at once. For example, the mold mark Mm may include, as mark elements, a rough inspection mark Mm ₁ having an arbitrary shape, and detailed inspection marks Mm ₂ and Mm ₃ having a diffraction grating. Further, the substrate mark Mw may include, as mark elements, a rough inspection mark Mw ₁ having an arbitrary shape, and detailed inspection marks Mw ₂ and Mw ₃ having a diffraction grating.

The rough (rough) relative position D1 between the mold mark Mm and the substrate mark Mw is the _{geometric center position of the mold mark Mm at the rough inspection mark Mm 1 and} the geometrical position of the substrate mark Mw at the rough inspection mark Mw ₁ . It can be obtained based on the central position. Since the rough inspection marks Mm ₁ and Mw ₁ can be miniaturized, rough alignment using marks having a small occupied area is possible. An intensity ratio may occur in the mark image captured by the difference between the reflectance of the rough inspection mark Mm _{1 and} the reflectance of the _{rough inspection mark Mw 1.} When the intensity ratio is large, if the intensity of the illumination light is adjusted so that the mark image having a weak intensity has an appropriate intensity, the mark image having a high intensity is saturated and a measurement error may occur. Therefore, the intensity ratio between the two mark images should be suppressed.

Next, a moire image (moire image on the left side) formed by _{the detailed examination mark Mm 2} of the mold mark Mm and the detailed _{examination mark Mw 2} of the substrate mark Mw will be described. The close examination marks Mm ₂ and Mw ₂ are composed of periodic grid patterns as shown in FIGS. 8 (c) to 8 (d), and the cycles (grid pitch) in the measurement direction (Y direction) are slightly different from each other. When superimposed, a moire image is formed in the Y direction. Further, the shift direction of the moire image when the relative position of these marks changes differs depending on the difference between the period of the detailed examination mark Mm _{2 and} the period of the detailed examination mark Mw _{2. For example, when the period of the detailed examination mark Mm 2} of the mold mark Mm is slightly larger than the period of the detailed examination mark Mw ₂ of the substrate mark Mw, the substrate W shifts relatively in the + Y direction with respect to the mold M. , The moire image (bright and dark position) shifts in the + Y direction. _{On the contrary, when the period of the detailed examination mark Mm 2} of the mold mark Mm is slightly smaller than the period of the detailed examination mark Mw ₂ of the substrate mark Mw, the substrate W shifts relatively in the + Y direction with respect to the mold M. Then, the moire image (the position of light and dark) shifts in the −Y direction.

Next, a moire image (moire image on the right side) formed by _{the detailed examination mark Mm 3} of the mold mark Mm and the detailed _{examination mark Mw 3} of the substrate mark Mw will be described. The close examination marks Mm ₃ and Mw ₃ are obtained by exchanging the cycles of the close examination marks Mm ₂ and Mw _{2 in the measurement direction.} Therefore, when the relative positions of the mold M and the substrate W change, the positions of light and dark in the moiré image on the left side and the moiré image on the right side change in opposite directions. By using the two moire images configured in this way, the relative position between the mold mark Mm and the substrate mark Mw (for example, the difference in the position of the dark part) from the relative positional deviation D2 (for example, the difference in the position of the dark part) of the two moire images ( The relative position between the mold M and the substrate W) can be obtained accurately.

_{Here, even if the relative positions of the detailed examination marks Mm 2} and Mm ₃ of the mold mark Mm and the detailed _{examination marks Mw 2} and Mw ₃ of the substrate mark Mw are deviated by the period of the moire image, the detailed examination mark can be used. It is not possible to recognize (detect) the deviation for the cycle. _{Therefore, in the example shown in FIG. 9, the rough inspection marks Mm 1} and Mw ₁ that can determine the relative position between the mold M and the substrate with a lower accuracy than the detailed inspection mark are used. By using the rough inspection marks Mm ₁ and Mw ₁ , the position of the close inspection mark can be specified, and the positional deviation of the moire image on the close inspection mark can be confirmed. Conceptually explaining the detailed inspection mark and the rough inspection mark, for example, when the relative position between the mold mark Mm and the substrate mark Mw is represented by a two-digit value, the tens digit is based on the detection result of the rough inspection mark. The first digit can be determined based on the detection result of the close examination mark.

Further, the reflectances of the mold mark Mm and the substrate mark Mw may differ for each wavelength depending on the material constituting the mark, the shape of the pattern constituting the mark, the thickness of the mark, the structure of the substrate, and the like. FIG. 10 is a diagram illustrating a simulation result of the primary diffraction efficiency of the substrate mark Mw. Here, a substrate W having a structure in which a second layer for newly forming a pattern is arranged on the first layer on which the substrate mark Mw is formed is assumed. Since there is a new second layer on the first layer on which the substrate mark Mw is formed, the illumination light from the illumination unit 52 of the detection unit 50 passes through the second layer and is reflected by the substrate mark Mw, and further. The light that has passed through the second layer is detected by the image pickup unit 51 (imaging element 57) as reflected light. In the simulation results shown in FIG. 10, the diffraction efficiency tends to be low near a wavelength of 500 nm, and the diffraction efficiency tends to be high near a wavelength of 750 nm. In this result, the absorption of light by the substances constituting the second layer and the thickness of the second layer contribute to it. Therefore, in order to detect the substrate mark Mw on the substrate W, it is advantageous to use light having a wavelength of 750 nm or more.

[Alignment of mold and substrate]
Next, a step of aligning the mold M and the substrate W will be described. For example, the control unit CNT causes the detection unit 50 to detect a moire image formed by the mold mark Mm (detailed inspection mark) and the substrate mark Mw (detailed examination mark), and the detection result (detection signal obtained from the detection unit 50). ), The relative position between the mold mark Mm and the substrate mark Mw is obtained. As a result, the control unit CNT can control the alignment between the mold M and the substrate W based on the obtained relative position.

Here, the detection result of the moire image formed by the mold mark Mm and the substrate mark Mw by the detection unit 50 does not match the design of those marks due to, for example, the detection error of the detection unit 50 or the manufacturing process. There are many. Therefore, information (calibration information) indicating the relationship between the change in the relative position between the mold mark Mm and the substrate mark Mw and the change in the detection result of the moire image by the detection unit 50 is obtained in advance, and the mold is molded based on the calibration information. It is preferable to align the M with the substrate W. However, in a typical imprinting apparatus, it is difficult to accurately control the relative position between the mold M and the substrate W when the mold M and the imprint material R on the substrate are not in contact with each other. Therefore, if the mold mark Mm and the substrate mark Mw are used in the acquisition of the calibration information, it may be difficult to accurately obtain the relationship between the change in the relative position and the change in the detection result of the moire image.

For example, in a typical imprinting apparatus, the relative position between the imprint head 10 and the substrate stage 20 is measured instead of directly measuring the relative position between the mold M and the substrate W. Therefore, when the mold M is misaligned with respect to the imprint head 10 (placement error) or the board W is misaligned with respect to the board stage 20 (placement error), the relative positions of the mold mark Mm and the board mark Mw are set. It can be difficult to measure accurately. Further, in a typical imprinting apparatus, in a state where the mold M and the imprinting material R on the substrate are in contact with each other, the imprinting material is irradiated with weak light to slightly increase the viscosity of the imprinting material R. , The relative positioning accuracy between the mold M and the substrate W is improved. That is, when the mold M and the imprint material R on the substrate are not in contact with each other, the relative position between the mold M and the substrate W, that is, the relative position between the mold mark Mm and the substrate mark Mw is controlled with high accuracy. Can be difficult.

Therefore, the imprint device 100 of the present embodiment has a dedicated mechanism (calibration mechanism 70) for acquiring calibration information. The calibration mechanism 70 includes, for example, as shown in FIGS. 1A to 1B, a first member 71 having a first mark 71a, a second member 72 having a second mark 72a, a drive unit 73, and the like. The measuring unit 74 and the moving unit 75 may be included.

The first member 71 may be formed, for example, by forming (drawing) the first mark 71a on a glass plate having a size smaller than that of the mold M and the substrate W. The first mark 71a is a mark imitating the mold mark Mm, and may be composed of, for example, a grid pattern having the same grid pitch (first grid pitch) as the mold mark Mm. Further, the second member 72 may be formed, for example, by forming (drawing) the second mark 72a on a glass plate having a size smaller than that of the mold M and the substrate W. The second mark 72a is a mark imitating the substrate mark Mw, and may be configured by, for example, a lattice pattern having a lattice pitch (second lattice pitch) similar to that of the substrate mark Mw. Here, the first mark 71a and the second mark 72a may be formed on the first member 71 and the second member 72, respectively, by undergoing the same manufacturing process as the mold M and the substrate W.

The first member 71 and the second member 72 may be arranged at intervals at which a moire image (reference image) can be formed between the first mark 71a and the second mark 72a. For example, the first member 71 and the second member 72 are narrower than the maximum distance formed between the mold M and the substrate W (that is, the distance when the mold M and the substrate W are most separated in the Z direction). It is preferable to arrange them at intervals. More preferably, the mold M and the imprint material R on the substrate are arranged at a distance equal to or less than the distance between the mold M and the substrate W in a state where they are in contact with each other. As a result, the positional relationship (Z direction) between the mold mark Mm and the substrate mark Mw detected by the detection unit 50 in the alignment between the mold M and the substrate W is reproduced by the first mark 71a and the second mark 72a. be able to.

The drive unit 73 includes, for example, an actuator, and may be configured to relatively drive the first member 71 and the second member 72. In the case of the present embodiment, the drive unit 73 is configured to be able to drive the second member 72 with respect to the first member 71. The drive unit 73 may be configured so that the positioning accuracy of the relative positions of the first member 71 and the second member 72 is higher than the positioning accuracy of the relative positions of the mold M and the substrate W. That is, the drive unit 73 may include an actuator having higher positioning accuracy than the actuators used for the mold drive unit 12 and the board drive unit 22. For example, the drive unit 73 may include an actuator that can change the relative positions of the first member 71 and the second member 72 on the order of nm.

The measuring unit 74 measures the relative position between the first member 71 (first mark 71a) and the second member 72 (second mark 72a). It is preferable that the measuring unit 74 has higher measurement accuracy than the measuring mechanism that measures the relative position between the mold M (imprint head 10) and the substrate W (board stage 20). The measuring unit 74 of the present embodiment reads the scale 76 provided on at least one of the first member 71 and the second member 72 (both in the example shown in FIG. 1), thereby causing the first member 71 and the second member 72. It is an encoder (encoder head) that measures the relative position with. However, the measuring unit 74 is not limited to the encoder, and for example, at least one of the first member 71 and the second member 72 is irradiated with light (laser light), and the first member is based on the reflected light. It may be an interferometer that measures the relative position between the 71 and the second member 72.

The moving unit 75 holds each part (first member 71, second member 72, driving unit 73, measuring unit 74) of the calibration mechanism 70, and sits on the surface plate 1 (on the surface plate) on which the substrate stage 20 moves. It is configured to be movable. For example, as shown in FIG. 1B, the moving unit 75 arranges the first mark 71a and the second mark 72a in the imaging field of view of the detecting unit 50 (imaging unit 51) when generating calibration information. Can move like. For example, when a plurality of detection units 50 are provided in the imprint device 100, the first mark 71a and the second mark 72a can be moved so as to be arranged in the imaging field of view of each detection unit 50 (imaging unit 51). Can be configured.

The control unit CNT generates calibration information using the calibration mechanism 70 configured as described above. For example, the control unit CNT controls the moving unit 75 so that the first mark 71a and the second mark 72a are arranged in the imaging field of view of the detection unit 50 of the plurality of detection units 50 for generating calibration information. .. At this time, the control unit CNT may move not only the calibration mechanism 70 (moving unit 75) but also the detection unit 50 itself, or may move the detection unit 50 instead of the calibration mechanism 70 (moving unit 75). Good. Then, the control unit CNT relatively drives the first member 71 and the second member 72 by the drive unit 73 to change the relative positions of the first mark 71a and the second mark 72a, while changing the relative position of the first mark 71a. The detection unit 50 is made to detect the reference image (moire image) formed by the second mark 72a and the second mark 72a. At this time, the control unit CNT causes the measuring unit 74 to measure the relative position between the first member 71 (first mark 71a) and the second member 72 (second mark 72a). As a result, information indicating the relationship between the change in the relative position between the first mark 71a and the second mark 72a and the change in the detection result of the reference image by the detection unit 50 can be generated as calibration information.

[Imprint processing]
The imprint process of this embodiment will be described. FIG. 11 is a flowchart showing the imprint process of the present embodiment, and FIG. 12 is a flowchart showing the process of generating the proof information by using the proofreading mechanism 70. Each step of the flowchart shown in FIGS. 11 to 12 can be controlled by the control unit CNT.

First, the imprint process will be described with reference to FIG.
In S1, the control unit CNT determines whether or not to generate the calibration information. For example, the control unit CNT can determine that the calibration information is generated when the conditions of the manufacturing process are changed, the lot is changed, the type of the mold M is changed, and the like. Further, the control unit CNT may determine that the calibration information is newly generated when a predetermined time has elapsed since the last generation of the calibration information. If it is determined that the calibration information is not generated, the process proceeds to S2, and if it is determined that the calibration information is generated, the process proceeds to S11 in the flowchart of FIG. The process of generating the calibration information shown in the flowchart of FIG. 12 will be described later.

In S2, the control unit CNT carries the mold M into the imprint head 10 by a mold transfer mechanism (not shown) (mold transfer step). In S3, the control unit CNT carries the board W into the board stage 20 by a board transfer mechanism (not shown) (board carry-in step). In S4, the control unit CNT imprints on the target shot region of the substrate W by discharging the imprint material R to the supply unit 30 while relatively moving the supply unit 30 and the substrate W by the substrate stage 20. Material R is supplied (supply process). In S5, the control unit CNT moves the substrate stage 20 so that the target shot area is arranged below the mold M, and the imprint head 10 narrows the distance between the mold M and the substrate W so that the mold M and the substrate W are on the substrate. Contact with the imprint material of (contact process). In S6, the control unit CNT waits until the imprint material is filled in the pattern recess of the mold M (filling step).

In S7, the control unit CNT causes the detection unit 50 to detect an image formed by the mold mark Mm and the substrate mark Mw, and controls the alignment between the mold M and the substrate W based on the detection result (alignment). Process). For example, the control unit CNT obtains the relative position (XY direction) between the mold mark Mm and the substrate mark Mw from the image detection result (detection signal) by the detection unit 50 based on the calibration information. The relative position is obtained for each of a plurality of mark pairs including the mold mark Mm and the substrate mark Mw. As a result, the control unit CNT aligns the mold M and the substrate W so that the mold mark Mm and the substrate mark Mw are at the target relative positions based on the obtained relative positions. The alignment step is a process of adjusting the relative position between the pattern region of the mold M and the shot region of the substrate W, and at least one of the mold M and the substrate W so as to reduce the shape difference between the pattern region and the shot region. It may include a process of deformation. Further, the alignment step may be performed in parallel with the contact step (S5) and the filling step (S6).

In S8, the control unit CNT irradiates the imprint material R with light by the curing unit 40 in a state where the mold M and the imprint material R on the substrate are in contact with each other to cure the imprint material R. (Curing step). In S9, the control unit CNT widens the distance between the mold M and the substrate W by the imprint head 10 and peels the mold M from the cured imprint material (mold release step). In S10, the control unit CNT determines whether or not the shot area (next shot area) to be imprinted next is on the substrate. If there is a next shot area, the process proceeds to S4, and if there is no next shot area, the process ends.

Next, the process of generating calibration information using the calibration mechanism 70 will be described with reference to FIG. Each step of the flowchart of FIG. 12 can be executed when it is determined in the step of S1 of the flowchart of FIG. 11 that calibration information is to be generated. Further, each step of the flowchart of FIG. 12 can be performed in a state where the mold M is not held by the imprint head 10.

In S11, the control unit CNT retracts the substrate stage 20 from below the detection unit 50, and as shown in FIG. 1 (b), the first mark 71a and the second mark 71a and the second mark 71a and the second mark 71a and the second mark 71a and the second The calibration mechanism 70 is moved so that the mark 72a is arranged. At this time, the control unit CNT moves the detection unit 50 itself in addition to (or instead of) the calibration mechanism 70 so that the first mark 71a and the second mark 72a are arranged in the imaging field of view of the detection unit 50. May be good. In S12, the control unit CNT sets the illumination conditions of the detection unit 50 (illumination unit 52). For example, the control unit CNT acquires a predetermined lighting condition based on a manufacturing process or the like for use in the alignment process of the imprint process, and transmits the lighting condition to the detection unit 50 (illumination unit 52). Set.

In S13, the control unit CNT causes the detection unit 50 to detect a moire image (reference image) formed by the first mark 71a and the second mark 72a, and acquires a detection signal from the detection unit 50 as the detection result. .. In S14, the control unit CNT causes the measurement unit 74 of the calibration mechanism 70 to measure the relative position between the first member 71 (first mark 71a) and the second member 72 (second mark 72a). In S15, the control unit CNT stores (saves data) the detection signal obtained in S13 and the relative position (measurement result of the measurement unit 74) obtained in S14 in association with each other. Here, if the control unit CNT determines that the contrast of the moire image is not within the permissible range based on the detection result of the moire image in S13, even if the illumination conditions such as the intensity of the illumination light are changed. Good.

In S16, whether or not the control unit CNT has detected the moire image (S13) and measured the relative position (S14) in all of a plurality of states in which the relative positions of the first mark 71a and the second mark 72a are different from each other. To judge. The plurality of states can be set in advance by the amount of relative position shift or the like according to the accuracy of the calibration information and the period (design value) of the moire image that can be formed. If it is determined that the moire image detection (S13) and the relative position measurement (S14) are not performed in all of the plurality of states, the process proceeds to S17. In S17, the control unit CNT changes the relative positions of the first member 71 (first mark 71a) and the second member 72 (second mark 72a) by a predetermined shift amount by the drive unit 73 of the calibration mechanism 70. After the end of S17, the process proceeds to S13. On the other hand, in S16, when it is determined that the moire image is detected (S13) and the relative position is measured (S14) in all of the plurality of states, the process proceeds to S18. In S18, the control unit CNT calibrates the information indicating the correspondence between the change in the relative position of the first mark 71a and the second mark 72a and the change in the detection signal based on the results in the steps S13 to S17. Generate (update) as information.

Here, the generation of the calibration information in S18 will be described with reference to FIG. FIG. 13 is a diagram showing a detection signal acquired from the detection unit 50 and calibration information generated based on the detection signal. FIG. 13 (a) shows the calibration information generated by the conventional method, and FIG. 13 (b) shows the calibration information generated by the method of the present embodiment. Further, in FIGS. 13 (a) to 13 (b), the left figure shows the detection signal, and the right figure shows the relationship between the relative positions of the two marks (diffraction gratings) and the index value. The index value represents the detection signal shown in the left figure as one value, and can be called a “measured value” because it is a value measured from the detection signal, for example. As an example, the control unit CNT may obtain the phase difference between the reference signal and the detection signal (for example, the number of pixels between the peak of the reference signal and the peak of the detection signal) as an index value. For example, in FIG. 9, the reference signal can be set as a signal obtained by the detection unit 50 when the light and dark positions of the moiré image on the left side and the moiré image on the right side match.

In the conventional method, for example, the mold mark Mm is transferred to the imprint material R on the substrate through the imprint process, and a moire image formed by the substrate mark Mw and the mold mark Mm transferred to the imprint material R is formed. Calibration information is generated by causing the detection unit 50 to detect it. In such a conventional method, as shown in the left figure of FIG. 13A, only one detection signal 201 can be obtained from the detection unit 50, so that only one index value 211 can be obtained. .. In this case, as shown in the right figure of FIG. 13A, the relationship between the change in the relative position of the two marks and the change in the index value (change in the detection signal) cannot be obtained from one index value. .. That is, it is not possible to determine whether the relationship is straight, curved, or has an intercept. Further, it is conceivable to change the relative positions of the two marks to perform the imprint processing a plurality of times, but this is complicated and the device is stopped during that time, which is disadvantageous in terms of throughput.

On the other hand, in the method of the present embodiment, by using the calibration mechanism 70, a plurality of detection signals 221 to 224 are easily acquired as shown in the left figure of FIG. 13 (b), and a plurality of detection signals 221 to 224 are used. A plurality of index values 231 to 234 can be obtained respectively. Therefore, as shown in the right figure of FIG. 13B, the relative positions of the two marks (first mark 71a and second mark 72a) are located by obtaining approximate lines for a plurality of index values 231 to 234. The relationship between the change and the change in the index value (change in the detection signal) can be obtained. As a result, information indicating the relationship can be generated as calibration information.

As described above, the imprinting apparatus 100 of the present embodiment includes a first member 71 having a first mark 71a imitating a mold mark Mm and a second member 72 having a second mark 72a imitating a substrate mark Mw. It has a calibration mechanism 70 including. By using such a calibration mechanism 70, calibration information can be generated accurately and easily. Therefore, the alignment between the mold M and the substrate W can be performed accurately based on the calibration information.

<Second Embodiment>
A second embodiment according to the present invention will be described. In the first embodiment, when the proofreading mechanism is used to generate the proofreading information, it is necessary to retract the substrate stage 20, so that it is difficult to generate the proofreading information in parallel with the imprint processing. Therefore, in the present embodiment, a device configuration capable of generating calibration information in parallel with the imprint process (for example, a process other than the alignment process) will be described. It should be noted that this embodiment basically inherits the first embodiment unless otherwise specified.

FIG. 14 is a schematic view showing the configuration of the imprinting apparatus 200 of the second embodiment. Compared with the imprinting apparatus 100 of the first embodiment, the imprinting apparatus 200 of the present embodiment has an optical system 80 and a half mirror HM added, and the detection unit 50 is formed by the mold mark Mm and the substrate mark Mw. The image is detected via the optical system 80 and the half mirror HM. Further, in the imprint device 200 of the present embodiment, the proofreading mechanism 70 is arranged on, for example, the support member 2 that supports the imprint head 10.

When generating calibration information, the control unit CNT moves the detection unit 50 so that the first mark 71a and the second mark 72a are arranged in the imaging field of view of the detection unit 50 (imaging unit 51). At this time, the control unit CNT may move the calibration mechanism 70 (moving unit 75) on the support member 2. With such a configuration, when generating the calibration information, it is not necessary to carry out the mold M from the imprint head 10 or retract the substrate stage 20, so that the calibration information can be generated more efficiently. ..

<Embodiment of manufacturing method of goods>
The method for manufacturing an article according to the embodiment of the present invention is suitable for producing an article such as a microdevice such as a semiconductor device or an element having a fine structure, for example. The method for manufacturing an article of the present embodiment includes a step of forming a pattern on an imprint material supplied (coated) to a substrate by using the above-mentioned imprint device (imprint method), and a pattern is formed by such a step. Includes the process of processing the substrate. Further, such a manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, flattening, etching, resist peeling, dicing, bonding, packaging, etc.). The method for producing an article of the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

The pattern of the cured product formed by using the imprint device is used permanently for at least a part of various articles or temporarily in manufacturing various articles. The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, a mold, or the like. Examples of the electric circuit element include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. Examples of the mold include a mold for imprinting.

The pattern of the cured product is used as it is as a constituent member of at least a part of the above-mentioned article, or is temporarily used as a resist mask. The resist mask is removed after etching, ion implantation, or the like in the substrate processing process.

Next, a specific manufacturing method of the article will be described. As shown in FIG. 15A, a substrate 1z such as a silicon wafer on which a work material 2z such as an insulator is formed on the surface is prepared, and subsequently, a substrate 1z such as a silicon wafer is introduced into the surface of the work material 2z by an inkjet method or the like. The printing material 3z is applied. Here, a state in which a plurality of droplet-shaped imprint materials 3z are applied onto the substrate is shown.

As shown in FIG. 15B, the imprint mold 4z is opposed to the imprint material 3z on the substrate with the side on which the uneven pattern is formed facing. As shown in FIG. 15C, the substrate 1z to which the imprint material 3z is applied is brought into contact with the mold 4z, and pressure is applied. The imprint material 3z is filled in the gap between the mold 4z and the work material 2z. In this state, when light is irradiated through the mold 4z as energy for curing, the imprint material 3z is cured.

As shown in FIG. 15D, when the mold 4z and the substrate 1z are separated from each other after the imprint material 3z is cured, a pattern of the cured product of the imprint material 3z is formed on the substrate 1z. The pattern of the cured product has a shape in which the concave portion of the mold corresponds to the convex portion of the cured product and the convex portion of the mold corresponds to the concave portion of the cured product, that is, the uneven pattern of the mold 4z is transferred to the imprint material 3z. It will be done.

As shown in FIG. 15E, when etching is performed using the pattern of the cured product as an etching resistant mask, the portion of the surface of the work material 2z that has no cured product or remains thin is removed, and the groove 5z is formed. Become. As shown in FIG. 15 (f), when the pattern of the cured product is removed, an article in which the groove 5z is formed on the surface of the work material 2z can be obtained. Here, the pattern of the cured product is removed, but it may be used as a film for interlayer insulation contained in a semiconductor element or the like, that is, as a constituent member of an article, without being removed even after processing.

The invention is not limited to the above embodiments, and various modifications and modifications can be made without departing from the spirit and scope of the invention. Therefore, a claim is attached to make the scope of the invention public.

10: Imprint head, 20: Board stage, 50: Detection unit, 70: Calibration mechanism, 71: First member, 71a: First mark, 72: Second member, 72a: Second mark, 73: Drive unit, 74: Measuring unit, 100: Imprinting device

Claims (12)

An imprinting device that molds an imprint material on a substrate using a mold.
A detection unit that detects an image formed by a mold mark provided on the mold and a substrate mark provided on the substrate, and a detection unit.
The first member having the first mark imitating the mold mark and the second member having the second mark imitating the substrate mark are included, and the first member and the second member can be relatively driven. Mechanism and
A control unit that controls the alignment of the mold and the substrate,
Including
The control unit
A reference formed by the first mark and the second mark while relatively driving the first member and the second member to change the relative positions of the first mark and the second mark. By causing the detection unit to detect the image, information indicating the relationship between the change in the relative position and the change in the detection result of the reference image by the detection unit is generated.
An imprint device characterized in that the alignment is controlled based on the information and the detection result of the image by the detection unit. The type mark and the first mark each include a grid pattern having a first grid pitch.
The imprinting apparatus according to claim 1, wherein the substrate mark and the second mark each include a grid pattern having a second grid pitch different from the first grid pitch. The imprint according to claim 1 or 2, wherein the positioning accuracy of the relative position between the first member and the second member in the mechanism is higher than the positioning accuracy of the relative position between the mold and the substrate. Printing device. Any one of claims 1 to 3, wherein the first member and the second member are arranged at a distance narrower than the maximum distance formed between the mold and the substrate. The imprinting device described in. The first member and the second member are arranged at a distance equal to or less than the distance between the mold and the substrate in a state where the mold and the imprint material on the substrate are in contact with each other. The imprinting apparatus according to any one of claims 1 to 4. The imprinting apparatus according to any one of claims 1 to 5, wherein the first member and the second member are smaller than the mold and the substrate, respectively. The mechanism includes a measuring unit that measures a relative position between the first member and the second member.
The imprint device according to any one of claims 1 to 6, wherein the control unit generates the information based on the measurement result of the measurement unit. A claim characterized in that the measuring unit measures a relative position between the first member and the second member by reading a scale provided on at least one of the first member and the second member. Item 7. The imprinting apparatus according to item 7. The measuring unit is characterized in that at least one of the first member and the second member is irradiated with light, and the relative position between the first member and the second member is measured based on the reflected light. The imprinting apparatus according to claim 7. The mechanism includes a moving portion that can hold and move the first member and the second member.
One of claims 1 to 9, wherein the control unit moves the first member and the second member below the detection unit by the moving unit when generating the information. The imprinting device described in. It further includes a stage that holds the substrate and can move on the surface plate.
The imprint device according to claim 10, wherein the mechanism is configured to be movable on the surface plate by the moving portion. A forming step of forming a pattern on a substrate by using the imprinting apparatus according to any one of claims 1 to 11.
Including a processing step of processing the substrate on which a pattern is formed in the forming step.
A method for producing an article, which comprises producing an article from the substrate processed in the processing step.

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