JP2020096111A - Capacitor module for pulse power supply - Google Patents

Abstract

To provide a capacitor module for a pulse power supply with improved heat dissipation by eliminating a problem caused by insufficient solder rise.SOLUTION: Between a positive side printed circuit board 201P and a negative side printed circuit board 201N, in which circuit patterns are formed internally, capacitors C1 to C5 are arranged via plastic spacers S11P to S53P and S11N to S53N. An entire capacitor module is fixed by soldering lead wires T1P to T5P of each capacitor to the board 201P and lead wires T1N to T5N to the board 201N, respectively, drilling threaded holes that are female screws inside each end of the insulating posts 241 to 245 arranged between the boards 201P and 201N, and inserting and tightening resin screws 251P to 255P, 251N to 255N into screw insertion holes drilled in the boards 201P and 201N via resin washers 261P to 265P, 261N to 265N.SELECTED DRAWING: Figure 1

Description

The present invention relates to a capacitor module used in a pulse power supply circuit.

As a pulse width modulation type pulse power source of high speed/high voltage output, a circuit system using a PFL (Pulse Forming Line), a PFN (Pulse Forming Network; pulse forming circuit), or a Blumlein is also considered. However, in particular, the rise/fall time is as short as several tens of nanoseconds, a short pulse width output up to several hundred nanoseconds is required, and pulse width modulation can be easily performed. Is effective.

FIG. 5 shows a circuit configuration example of the method. FIG. 5 shows an example of a high-speed/high-voltage generating pulse power supply circuit, where C is a capacitor connected in parallel to the DC power supply 10. A switch SW1, resistors R1 and R2, and a switch SW2 are sequentially connected in series between the positive electrode and the negative electrode of the capacitor C. A load 20 is connected between the common connection point of the resistors R1 and R2 and the negative electrode of the capacitor C. L in the figure represents a stray inductance between the DC power supply 10 and the load 20.

When power is supplied from the outside by the DC power supply 10 or the like and a voltage drop is considered due to the responsiveness of the DC power supply 10, the capacitor C is inserted. The resistors R1 and R2 are inserted to prevent stray inductance L and ringing generated by the load 20.

The resistors R1 and R2 may not be inserted if the influence of ringing can be ignored, or if the element is not damaged even if an overvoltage occurs due to ringing. When the load 20 is a resistive load, the resistor R2 and the switch SW2 are unnecessary, but when energy is left on the load side such as a capacitive load and it is desired to lower the voltage, the resistor R2 and the switch SW2 are required.

FIG. 6 shows a timing chart of the switches SW1 and SW2 in FIG. When it is desired to supply energy to the load 20 and raise the load side voltage (Vload), the switch SW1 is turned on and the switch SW2 is turned off ((2) in the figure). After that, when it is desired to lower the voltage on the load side, the switch SW1 is turned off and the switch SW2 is turned on ((1) in the figure).

When used mainly for plasma generation, the voltage applied to the load 20 is a high voltage (several kV to several tens kV). Since the voltage applied to the capacitor C in FIG. 5 is almost the same as the load-side voltage Vload, the capacitor C needs to have a high withstand voltage, and the structure also needs to be designed in consideration of the withstand voltage.

Further, when a voltage drop is considered due to the responsiveness of the DC power supply 10, a capacity of several hundreds nF to several μF is required, so that the necessary capacity can be obtained by connecting in parallel. FIG. 7 shows a structural example of a capacitor module used in the circuit of FIG. As high-voltage capacitors, there are ceramic capacitors, film capacitors and the like. When a lead wire type capacitor is selected, each capacitor is connected to the board by soldering to reduce inductance.

FIG. 7 shows an example in which a capacitor module is constructed using a plurality of lead-type cylindrical capacitors, (a) is a plan view, (b) is a front view, and (c) is a right side view. There is.

101P is a positive electrode side printed circuit board having a circuit pattern (circuit wiring) formed therein, and 101N is a negative electrode side printed circuit board having a circuit pattern (circuit wiring) formed therein.

Cylindrical capacitors C1 to C5 are arranged at predetermined intervals between the positive electrode side printed circuit board 101P and the negative electrode side printed circuit board 101N.

The positive electrode side printed circuit board 101P and one end faces in the axial direction of the capacitors C1 to C5 are in close contact with each other, and the positive electrode side lead wires T1P to T5P protruding from the end faces are soldered to the circuit patterns inside the positive electrode side printed circuit board 101P. ..

The negative electrode side printed circuit board 101N and the other axial end faces of the capacitors C1 to C5 are in close contact with each other, and the negative electrode side lead wires T1N to T5N protruding from the end faces are respectively soldered to the circuit patterns inside the negative side printed circuit board 101N. ..

110P and 110N are terminal blocks of the capacitor module, which are electrically connected to the respective circuit patterns of the positive and negative side printed circuit boards 101P and 101N.

In the circuit of FIG. 5, wiring from the capacitor module (C) to the DC power supply 10 and the switches (SW1, SW2) is required. The wiring from the capacitor module (C) to the switches (SW1, SW2) influences the rise time and the fall time of the output pulse voltage due to the inductance. Therefore, as shown in FIG. 8 showing the wiring of the circuit of FIG. It should be 120. In consideration of connecting the twisted pair wire 120 to the terminal block, the terminal blocks 110P and 110N of the capacitor module are arranged to face each other as shown in FIG.

An example of a conventional capacitor module is described in Patent Document 1, and a circuit board connection structure for soldering a capacitor to a printed pattern of a printed circuit board is described in Patent Document 2, for example.

Japanese Patent No. 5503003 JP, 2018-117077, A

The capacitor C used in the high-speed/high-voltage generation pulse power supply circuit as shown in FIG. 5 needs to have a high withstand voltage, and the structure also needs to be designed in consideration of the withstand voltage. If a lead wire type capacitor is selected, each capacitor is soldered to the board to reduce the inductance.

When the structure is such that the positive electrode side printed circuit board 101P, the negative electrode side printed circuit board 101N and the capacitors C1 to C5 are in close contact with each other as shown in FIG. However, in the portion (2) shown on the back side of the substrate, the positive-side printed circuit board 101P and the end face on the positive side of the capacitor C5 are in close contact with each other, resulting in insufficient solder wicking, causing a problem. ..

Further, when the heat generated by the capacitor is large due to the increase of the ripple current, the heat radiation performance deteriorates at the contact surface between the capacitor and the substrate.

These problems similarly occur in the lead wires T1P to T5P and T1N to T5N of all the capacitors C1 to C5.

Further, when stress is applied in the direction of the thick arrow in FIG. 7A during assembly or the like, the lead wires (T1P to T5P, T1N to T5N) of the capacitor are easily cut.

Further, since the terminal blocks (110P, 110N) are installed only at two places, the wirings from the DC power supply (for example, the DC power supply 10 in FIG. 8) and the switches (for example, the switches SW1 and SW2 in FIG. 8) are concentrated, Wiring becomes complicated.

The present invention solves the above problems, and an object of the present invention is to provide a capacitor module for a pulse power supply, which solves a problem caused by insufficient soldering and improves heat dissipation.

The pulse power supply capacitor module according to claim 1 for solving the above-mentioned problems is a capacitor module used in a pulse power supply circuit,
A plurality of capacitors having a positive electrode side lead wire projecting from one axial end surface and a negative electrode side lead wire projecting from the other axial end surface of the cylindrical capacitor body,
A positive electrode side printed circuit board, which is disposed so as to face one end surface in the axial direction of each capacitor, and a positive electrode side lead wire of each capacitor is soldered to a circuit pattern formed inside;
A negative electrode side printed circuit board, which is arranged opposite to the other axial end surface of each capacitor, and a negative electrode side lead wire of each capacitor is soldered to a circuit pattern formed inside,
Spacers respectively arranged between the one axial end surface and the positive electrode side printed circuit board of each capacitor, and between the other axial direction end surface and the negative electrode side printed circuit board,
A plurality of fixing mechanisms for fixing between the positive electrode side printed circuit board and the negative electrode side printed circuit board.

The capacitor module for pulse power supply according to claim 2 is the capacitor module according to claim 1,
The fixing mechanism and the capacitor are bonded by a potting material.

The pulse power supply capacitor module according to claim 3 is the capacitor module according to claim 1 or 2,
A plurality of positive electrode side terminal blocks connected to the circuit pattern of the positive electrode side printed circuit board, to which wiring for connecting from the capacitor module to the positive electrode bus of the pulse power supply circuit is connected,
A plurality of negative electrode side terminal blocks connected to the circuit pattern of the negative electrode side printed circuit board and to which wiring for connecting the capacitor module to the negative electrode bus bar of the pulse power supply circuit is connected.

The capacitor module for pulsed power supply according to claim 4 is the capacitor module according to any one of claims 1 to 3, wherein
The spacer disposed between the one axial end surface of each capacitor and the positive electrode side printed circuit board has a capacitor contact portion that contacts the one axial end surface of the capacitor and a distance that is set from the capacitor contact portion. A substrate contact portion that is formed and contacts the positive electrode side printed circuit board; and an insertion protrusion portion that protrudes from the substrate contact portion and that is inserted into a hole formed in the positive electrode side printed circuit board. Composed of
The spacer disposed between the other axial end surface of each capacitor and the negative electrode side printed circuit board has a capacitor contact portion that abuts on the other axial end surface of the capacitor and a distance that is set from the capacitor contact portion. A substrate contact portion that is formed and abuts on the negative electrode side printed circuit board; and an insertion protrusion portion that protrudes from the substrate contact portion and is inserted into a hole formed in the negative electrode side printed circuit board. It is characterized by being configured.

The capacitor module for pulse power supply according to claim 5 is the capacitor module according to any one of claims 1 to 4,
The plurality of fixing mechanisms include an insulating support pillar inserted between the positive electrode side printed circuit board and the negative electrode side printed circuit board, a contact portion of the insulating support pillar with the positive electrode side printed circuit board and a negative electrode side printed circuit board. It is characterized in that each of the contact portions is provided with a tightening tool that tightens in the intermediate direction between the positive electrode side printed circuit board and the negative electrode side printed circuit board.

A pulse power supply capacitor module according to claim 6 is the capacitor module according to any one of claims 1 to 4, wherein
The plurality of fixing mechanisms include a resistor inserted between the positive electrode side printed circuit board and the negative electrode side printed circuit board, and a contact portion of the resistor element with the positive electrode side printed circuit board and a negative electrode side printed circuit board. It is characterized in that each of the contact portions is provided with a tightening tool that tightens in the intermediate direction between the positive electrode side printed circuit board and the negative electrode side printed circuit board.

A capacitor module for pulse power supply according to claim 7 is the capacitor module according to any one of claims 1 to 6, wherein
Of the two divided areas of the positive and negative electrode side printed boards, the number of capacitors provided in one area is 2n+1 (n is an integer of 1 or more), the number of fixing mechanisms is 2n, and the other area is provided. It is characterized in that the number of capacitors is 2n, the number of fixing mechanisms is 2n+1, and the capacitors are arranged so that the lines connecting the cylindrical centers of the capacitors form a triangular lattice.

The pulse power supply capacitor module according to claim 8,
The one area|region of one set of capacitor modules of Claim 7 is arrange|positioned so that the other area|region may adjoin one area|region of another one set of capacitor modules formed identically with the said one set of capacitor modules, and a plurality of sets may be arranged. It is characterized in that the capacitor modules are arranged close to each other.

(1) According to the invention described in claims 1 to 8, since the spacer is provided, insufficient soldering may occur at a portion where the positive electrode lead wire and the negative electrode lead wire of the capacitor are soldered. It is avoided, and the problem due to insufficient soldering is solved.

In addition, the spacer secures a space between the capacitor and the printed circuit board on the positive electrode side and the printed circuit board on the negative electrode side without adhering to each other.
(2) According to the invention described in claim 2, since the potting material is used for adhesion, the burden on the positive electrode side lead wire and the negative electrode side lead wire of the capacitor is reduced even when stress is applied to the capacitor module. be able to.
(3) According to the invention as set forth in claim 3, since a total of four or more terminal blocks are provided, wiring for connecting to the pulse power supply circuit is not concentrated and complication can be avoided.
(4) According to the invention described in claim 4, since the insertion protrusion of the spacer is inserted into the hole on the substrate side, the position of the spacer does not deviate and becomes unstable.
(5) According to the invention described in claims 5 and 6, since the fixing mechanism includes the fastener, the entire capacitor module can be firmly fixed.
(6) According to the invention described in claim 6, the number of parts can be reduced by using, for example, the discharge resistor that constitutes the pulse power supply circuit as the resistor of the fixing mechanism, and the discharge resistor is included. Miniaturization can be realized.
(7) According to the invention described in claim 7, since the lines connecting the cylindrical centers of the respective capacitors are arranged in a triangular lattice shape, one set of capacitor modules can be miniaturized.
(8) According to the invention as set forth in claim 8, when a plurality of capacitor modules are arranged and a plurality of sets of capacitor modules are arranged, no wasteful space is created at a place where the capacitor modules are close to each other. The entire module can be downsized.

The structure of the capacitor module of Example 1 of this invention is represented, (a) is a top view, (b) is a front view, (c) is a right view. The structure of the capacitor module of Example 2 of this invention is represented, (a) is a top view, (b) is a front view, (c) is a right view. The structure of the capacitor module of Example 3 of this invention is represented, (a) is a top view, (b) is a front view, (c) is a right view. The block diagram of the spacer used by the Example of this invention. The circuit diagram which shows an example of a pulse width modulation type pulse power supply. 6 is a timing chart of switches SW1 and SW2 in the circuit of FIG. An example of the structure of the conventional capacitor module is represented, (a) is a top view, (b) is a front view, (c) is a right side view. Explanatory drawing which shows the example of wiring to the capacitor module in the circuit of FIG.

Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited to the following embodiments.

In the first embodiment, a resin spacer is provided between the axial end surface of the cylindrical capacitor and the substrate in order to improve insufficient solder wicking and heat dissipation of the capacitor in the portion (2) of FIG. 7B described above. To secure a space, an insulating column is provided between the positive electrode side substrate and the negative electrode side substrate, the capacitor is pressed and fixed from above and below, and the insulating column and the capacitor are partially bonded with a potting material.

1A and 1B show the structure of a capacitor module according to the first embodiment. FIG. 1A is a plan view, FIG. 1B is a front view, and FIG. 1C is a right side view.

In FIG. 1, 201P is a rectangular positive side printed circuit board having a circuit pattern (circuit wiring) formed therein, and 201N is a rectangular negative side printed circuit board having a circuit pattern (circuit wiring) formed therein. is there.

Between the positive electrode side printed circuit board 201P and the negative electrode side printed circuit board 201N, a plurality of cylindrical capacitors (five capacitors in this embodiment) C1 to C5 are arranged via a plurality of resin spacers described later. There is.

1A, the arrangement state of the capacitors C1 to C5 is divided into two with the line connecting the centers of both short sides of the positive electrode side printed circuit board 201P as a boundary line, and divided into two. Three capacitors C1 to C3 are arranged in the area on one side, and two capacitors C4 and C5 are arranged in the area on the other side. The capacitors C1 to C5 are arranged at a predetermined distance from each other and the lines connecting the cylinder centers of the capacitors are arranged in a triangular lattice pattern.

Three resin spacers (spacers of the present invention) S11P to S13P are arranged at a predetermined distance between one end surface of the capacitor C1 in the axial direction and the positive printed board 201P, and the other end surface of the capacitor C1 in the axial direction and the negative electrode are arranged. Three resin spacers S11N to S13N are arranged at predetermined distances between the side printed circuit boards 201N.

As shown in FIG. 4A, the resin spacers S11P to S13P on the positive electrode side are continuous with the capacitor contact portion 221 that is in contact with one axial end surface of the capacitor C1 and the capacitor contact portion 221. A body portion 222 formed to have a predetermined length, a board contact portion 223 formed at an end portion in the length direction of the body portion 222, and contacting the positive electrode side printed circuit board 201P, and the board contact portion 223. An insertion protrusion 224 that is inserted into a hole (not shown) that is provided so as to protrude and that corresponds to the position of the resin spacer on the positive electrode side printed circuit board 201P, and from the end of the insertion protrusion 224. The positive electrode side printed circuit board 201P is provided with a tip portion 225 protruding from the outer surface side.

As shown in FIG. 4B, the resin spacers S11N to S13N on the negative electrode side are continuous with the capacitor contact portion 231 that contacts the other axial end surface of the capacitor C1 and the capacitor contact portion 231. A body portion 232 formed to have a predetermined length, a board contact portion 233 formed at an end portion in the length direction of the body portion 232 and abutting against the negative printed board 201N, and the board contact portion 233. From the end of the insertion protrusion 234, which is inserted into a hole (not shown) that is provided so as to project and form a portion corresponding to the position of the resin spacer on the negative electrode side printed circuit board 201N. The negative electrode side printed circuit board 201N is provided with a tip portion 235 protruding from the outer surface side.

T1P is a positive electrode side lead wire protruding from the center of one end face in the axial direction of the cylindrical capacitor C1, and its tip is soldered to a circuit pattern formed inside the positive electrode side printed circuit board 201P.

T1N is a negative electrode side lead wire protruding from the center of the other axial end surface of the cylindrical capacitor C1, and its tip is soldered to a circuit pattern formed inside the negative electrode side printed board 201N.

The arrangement of the capacitors and the resin spacers on the capacitors C2 to C5 side is the same as the arrangement of the capacitors C1 side.

That is, three positive electrode side resin spacers S21P to S23P and three negative electrode side resin spacers S21N to S23N are arranged in the same manner as above on the capacitor C2 side, and three positive electrode side resin spacers S21N to S23N are arranged on the capacitor C3 side. The resin spacers S31P to S33P and the three negative electrode side resin spacers S31N to S33N are arranged in the same manner as described above, and the three positive electrode side resin spacers S41P to S43P and the three negative electrode side resin are disposed on the capacitor C4 side. Spacers S41N to S43N are arranged in the same manner as described above, and three positive electrode side resin spacers S51P to S53P and three negative electrode side resin spacers S51N to S53N are arranged in the same manner as above on the capacitor C5 side. There is.

The resin spacers S21P to S23P, S31P to S33P, S41P to S43P, and S51P to S53P on the positive electrode side have the capacitor contact portion 221, the body portion 222, and the substrate contact portion 223 shown in FIG. An insertion protrusion 224 and a tip portion 225 are provided.

The resin spacers S21N to S23N, S31N to S33N, S41N to S43N, and S51N to S53N on the negative electrode side are the capacitor contact portion 231, the body portion 232, the substrate contact portion 233, shown in FIG. An insertion protrusion 234 and a tip portion 235 are provided.

Positive electrode side lead wires T2P to T5P protruding from the center of each axial end surface of the capacitors C2 to C5 are soldered to a circuit pattern formed inside the positive electrode side printed circuit board 201P in the same manner as T1P.

Negative electrode side lead wires T2N to T5N projecting from the centers of the other axial end faces of the capacitors C2 to C5 are soldered to the circuit pattern formed inside the negative electrode side printed circuit board 201N, as in the case of T1N.

A cylindrical insulating pillar is provided between the positive electrode side printed circuit board 201P and the negative electrode side printed circuit board 201N, near each long side of the printed circuit board 201P, 201N, and at a predetermined distance from each of the capacitors C1 to C5. 241-245 are inserted. Resin screws (for example, Bs sems; cross-headed pan head machine screw) and resin washers as tightening tools are provided on the outer surface of each of the printed circuit boards 201P and 201N at positions facing both ends of the insulating columns 241-245. It is provided and fixes the entire capacitor module by these (the fixing mechanism of the present invention).

That is, for example, in the case of the insulating support 243 side, screw holes that are female screws are bored inside both ends of the insulating support 243, and both ends of the insulating support 243 of the positive electrode side printed circuit board 201P and the negative electrode side printed circuit board 201N. A screw insertion hole (not shown) is also formed in each of the portions abutted with each other.

Then, the foot portions of the resin screws 253P and 253N are inserted into the screw insertion holes of the board through the resin washers 263P and 263N, and the screw holes and the resin screws 253P and 253N are bored inside both ends of the insulating support 243. The insulating support 243 and each of the printed circuit boards 201P and 201N are attached by screwing.

The screw holes, screw insertion holes, resin screws, and resin washers have the same structure on the side of the insulating columns 241, 242, 244, 245.

By tightening the resin screws 251P to 255P and 251N to 255N on both ends of the insulating columns 241-245, the axial end faces of the capacitors C1 to C5 have resin spacers S11P to S13P, S21P to S23P, S31P to S33P. , S41P to S43P, S51P to S53P and S11N to S13N, S21N to S23N, S31N to S33N, S41N to S43N, and S51N to S53N, are pressed and fixed by the printed circuit boards 201P and 201N.

The positive electrode side terminal block 210P-1 and the negative electrode side terminal block 210N-1 face each other at a portion between the capacitor C1 and the insulating support 243 on the surfaces of the positive electrode side printed circuit board 201P and the negative electrode side printed circuit board 201N which face each other. The positive electrode side terminal block 210P-2 and the negative electrode side terminal block 210N-2 are attached to face each other between the capacitors C3 and the insulating columns 245.

The capacitors C1 to C5 and the insulating columns 241-245 are partially bonded (resin potting) by a potting material 270.

In the configuration of FIG. 1, a space is secured between each of the positive electrode side printed circuit board 201P and the negative electrode side printed circuit board 201N and both axial end faces of the capacitors C1 to C5 by the resin spacers. It is possible to reduce the occurrence of insufficient soldering in the portion (2) (the lead wire of the capacitor and the soldered portion of the substrate on the rear surface side of the substrate).

Further, since the positive electrode side printed circuit board 201P, the negative electrode side printed circuit board 201N and the axial end faces of the capacitors C1 to C5 are not in close contact with each other, the heat dissipation is also improved.

Further, since the insulating props 241-245, the resin screws 251P-255P, 251N-255N, and the resin washers 261P-265P, 261N-265N constitute a fixing mechanism, the entire capacitor module can be firmly fixed.

Moreover, when stress is applied to the capacitor module in the direction indicated by the thick arrow in FIG. 7A, the lead wires of the capacitor are easily cut, but the insulating columns 241 to 245 and the capacitors C1 to C5 are partially separated by the potting material 270. By adhesively bonding, the load on the lead wire can be reduced even when stress is applied. Moreover, since the terminal blocks (210P-1, 210P-2, 210N-1, 210N-2) are provided at four places, the wiring to the DC power source and the switch on the pulse power source circuit side does not become complicated.

Further, the insertion protrusions 224, 234 of the resin spacers S11P to S13P, S21P to S23P, S31P to S33P, S41P to S43P, S51P to S53P and S11N to S13N, S21N to S23N, S31N to S33N, S41N to S43N, S51N to S53N. Since (FIGS. 4(a) and 4(b)) are configured to be inserted into the holes formed in the positive electrode side printed circuit board 201P and the negative electrode side printed circuit board 201N, the positions of the spacers are displaced and become unstable. There is no such thing.

Further, the size of the space between the positive electrode side printed circuit board 201P, the negative electrode side printed circuit board 201N and both axial end faces of the capacitors C1 to C5, that is, the capacitor contacting parts 221 and 231 of the spacer shown in FIG. The length between 223 and 233 and the number of spacers to be arranged are arbitrarily determined according to the size and number of capacitors, the size of the printed circuit board, and the like.

For example, the formation of the body portions 222 and 232 of each spacer may be omitted, or the tip portions 225 and 235 may be removed. The overall shape of each spacer may be a shape other than the shape shown in FIG.

In the second embodiment, as the fixing mechanism, the resistors 341 to 345 (resistors) and the resistance mounting portions 350P and 350N are used as shown in FIG. 2 instead of the insulating columns 241 to 245 of FIG. 1 to form a capacitor module. ..

2A and 2B show the structure of a capacitor module according to the second embodiment. FIG. 2A is a plan view, FIG. 2B is a front view, and FIG. 2C is a right side view. There is.

Cylindrical resistance mounting portions 350P and 350N are fixed to both ends of the resistors 341 to 345, respectively. Inside the resistance mounting portions 350P and 350N, screw holes that are female screws are formed in the axial direction of the cylinder, and the screw tightening is performed by the resin screw and the resin washer as in the case of FIG. It fixes the entire capacitor module.

That is, for example, in the case of the resistor 343 and the resistance mounting portions 350P and 350N, the foot portions of the resin screws 253P and 253N are inserted into the screw insertion holes of the substrate via the resin washers 263P and 263N, and the resistance mounting portions 350P and 350N are further inserted. By screwing the screw holes formed inside and the resin screws 253P, 253N, the resistor 343, the resistance mounting portions 350P, 350N, and the printed circuit boards 201P, 201N are mounted.

The screw holes, screw insertion holes, resin screws, and resin washers have the same configuration on the resistors 341, 342, 344, 345, and the resistor mounting portions 350P, 350N side.

By tightening the resin screws 251P to 255P, 251N to 255N on both ends of the resistor mounting portions 350P and 350N, the axial end faces of the capacitors C1 to C5 are resin spacers S11P to S13P, S21P to S23P, S31P to. The printed boards 201P and 201N are pressed and fixed via S33P, S41P to S43P, S51P to S53P and S11N to S13N, S21N to S23N, S31N to S33N, S41N to S43N, and S51N to S53N.

Also in the configuration of FIG. 2, the same operation and effect as the capacitor module of FIG. 1 can be obtained.

Further, in the configuration of FIG. 1, when a discharging resistor is required, it is necessary to prepare the resistor externally, and the size becomes large. However, by using the discharging resistor for the resistors 341 to 345 of FIG. Since the resistor can be incorporated in the capacitor module and integrated, the number of parts can be reduced and the overall size of the device can be reduced.

In the third embodiment, the number of capacitors provided in one of the two divided areas of the positive-side printed board 201P and the negative-side printed board 201N is 2n+1 (n is an integer of 1 or more), and the number of fixing mechanisms is 2. 2n, the number of capacitors provided in the other area is 2n, the number of fixing mechanisms is 2n+1, and the capacitors are arranged so that the lines connecting the centers of the respective cylinders form a triangular lattice to form one set of capacitor modules. However, when it is desired to increase the capacitance, the capacitor modules having the same structure and configuration are arranged adjacent to each other.

3A and 3B show the structure of a capacitor module according to the third embodiment, FIG. 3A is a plan view, FIG. 3B is a front view, and FIG. 3C is a right side view. There is.

The positive side printed circuit board 201P of FIG. 3A is divided into two parts by using a line connecting the centers of both short sides as a boundary line, one of the two parts is defined as a region (1), and the other side is defined as a region (1). 2). The area (1) is provided with 2n+1 (n is an integer of 1 or more) capacitors and 2n fixing mechanisms, and in the example of FIG. 3, an insulating support is provided, and the area (2) is provided with 2n capacitors and 2n+1. A fixing mechanism (an insulating support column in the example of FIG. 3) is provided and arranged so that the lines connecting the cylindrical centers of the respective capacitors form a triangular lattice shape to form a set of capacitor modules 500-1. ..

Note that FIG. 3 shows the case where n is 1, the capacitors on the area (1) side are 2n+1=3, the insulating columns are 2n=2, and the capacitors on the area (2) are 2n=2. , 2n+1=3 insulating columns are arranged.

When it is desired to increase the capacity, the area (1) side of another set of capacitor modules 500-2, which is configured the same as one set of capacitor modules 500-1, is adjacent to the area (2) side of the capacitor module 500-1. To arrange.

Although FIG. 3 shows the arrangement of two sets of capacitor modules, the arrangement is the same as above when three or more sets of capacitor modules are provided.

According to the configuration of FIG. 3, no wasted space is created at a place where the capacitor modules are close to each other, so that the entire capacitor module can be downsized. Further, also in the third embodiment, the same operation and effect as those of the first and second embodiments can be obtained.

10... DC power supply 20... Load 120... Twisted pair wire 201P... Positive side printed circuit board 201N... Negative side printed circuit board 210P-1, 210P-2... Positive side terminal block 210N-1, 210N-2... Negative side terminal block 221, 231 ... Capacitor contact part 222, 232... Body part 223, 233... Substrate contact part 224, 234... Inserting projection part 225, 235... Tip part 241 to 245... Insulating support column 251P-255P, 251N-255N... Resin screw 261P- 265P, 261N to 265N... Resin washer 270... Potting material 341 to 345... Resistor 350P, 350N... Resistor mounting portion 500-1, 500-2... Capacitor module C1 to C5... Capacitor S11P to S13P, S21P to S23P, S31P to S33P , S41P to S43P, S51P to S53P, S11N to S13N, S21N to S23N, S31N to S33N, S41N to S43N, S51N to S53N... Resin spacer T1P to T5P... Positive electrode side lead wire T1N to T5N... Negative electrode side lead wire

Claims (8)

A capacitor module used in a pulse power supply circuit,
A plurality of capacitors having a positive electrode side lead wire projecting from one axial end surface and a negative electrode side lead wire projecting from the other axial end surface of the cylindrical capacitor body,
A positive electrode side printed circuit board, which is disposed so as to face one end surface in the axial direction of each capacitor, and a positive electrode side lead wire of each capacitor is soldered to a circuit pattern formed inside;
A negative electrode side printed circuit board, which is arranged opposite to the other axial end surface of each capacitor, and a negative electrode side lead wire of each capacitor is soldered to a circuit pattern formed inside,
Spacers respectively arranged between the one axial end surface and the positive electrode side printed circuit board of each capacitor, and between the other axial direction end surface and the negative electrode side printed circuit board,
A plurality of fixing mechanisms for fixing between the positive electrode side printed circuit board and the negative electrode side printed circuit board,
A capacitor module for a pulse power supply, which is characterized by including. The capacitor module for a pulse power supply according to claim 1, wherein the fixing mechanism and the capacitor are bonded by a potting material. A plurality of positive electrode side terminal blocks connected to the circuit pattern of the positive electrode side printed circuit board, to which wiring for connecting from the capacitor module to the positive electrode bus of the pulse power supply circuit is connected,
A plurality of negative electrode side terminal blocks connected to the circuit pattern of the negative electrode side printed circuit board, wiring for connecting from the capacitor module to the negative electrode bus bar of the pulse power supply circuit is connected,
The pulse power supply capacitor module according to claim 1 or 2, further comprising: The spacer disposed between the one axial end surface of each capacitor and the positive electrode side printed circuit board has a capacitor contact portion that contacts the one axial end surface of the capacitor and a distance that is set from the capacitor contact portion. A substrate contact portion that is formed and contacts the positive electrode side printed circuit board; and an insertion protrusion portion that protrudes from the substrate contact portion and that is inserted into a hole formed in the positive electrode side printed circuit board. Composed of
The spacer disposed between the other axial end surface of each capacitor and the negative electrode side printed circuit board has a capacitor contact portion that abuts on the other axial end surface of the capacitor and a distance that is set from the capacitor contact portion. A substrate contact portion that is formed and abuts on the negative electrode side printed circuit board; and an insertion protrusion portion that protrudes from the substrate contact portion and is inserted into a hole formed in the negative electrode side printed circuit board. The pulse power supply capacitor module according to any one of claims 1 to 3, wherein The plurality of fixing mechanisms include an insulating support pillar inserted between the positive electrode side printed circuit board and the negative electrode side printed circuit board, a contact portion of the insulating support pillar with the positive electrode side printed circuit board and a negative electrode side printed circuit board. The pulse power supply according to any one of claims 1 to 4, further comprising: a tightening tool that tightens each contact part in an intermediate direction between the positive electrode side printed circuit board and the negative electrode side printed circuit board. Capacitor module. The plurality of fixing mechanisms include a resistor inserted between the positive electrode side printed circuit board and the negative electrode side printed circuit board, and a contact portion of the resistor element with the positive electrode side printed circuit board and a negative electrode side printed circuit board. The pulse power supply according to any one of claims 1 to 4, further comprising: a tightening tool that tightens each contact part in an intermediate direction between the positive electrode side printed circuit board and the negative electrode side printed circuit board. Capacitor module. The number of capacitors provided in one region of the two divided regions of the printed circuit board on the positive electrode side and the printed circuit board on the negative electrode side is 2n+1 (n is an integer of 1 or more), the number of fixing mechanisms is 2n, and the number is provided in the other region. The number of capacitors is 2n, the number of fixing mechanisms is 2n+1, and the capacitors are arranged so that the lines connecting the cylindrical centers of the capacitors are in a triangular lattice shape to form a set of capacitor modules. 7. The capacitor module for pulse power supply according to any one of 1 to 6. The one area|region of one set of capacitor modules of Claim 7 is arrange|positioned so that the other area|region may adjoin one area|region of another one set of capacitor modules formed identically with the said one set of capacitor modules, and a plurality of sets may be arranged. A capacitor module for a pulse power supply, characterized in that the capacitor modules are arranged close to each other.

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