JP2000059000A - Spacer for printed board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a spacer for printed board which can be mounted automatically on a printed board with high workability. SOLUTION: When a suction nozzle 4 is passed through and suck to a tapped hole 18 of an FG spacer 10 and the spacer 10 is heated, after the spacer 10 is placed on a target position on the main board 30 of a mounting line, a solder plate 22 on the main board 30 and the creamy solder on ground patterns 42a and 42b melt and the spacer 10 is soldered to the main board 30. Since the spacer 10 is provided with the tapped hole 18 and solder plate 22, the spacer 10 can be sucked by means of the nozzle 40 and automatically mounted on the main board 30. Therefore, the workability of the mounting work of the spacer 10 on the main board 30 is improved drastically. In addition, since the solder plate 22 melts and a clearance section 20 is opened when the spacer 10 is heated at reflowing time, a screw 36 can be inserted into the tapped hole 18 without hindrance, even after the spacer 10 has been mounted on the main board 30.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention belongs to the technical field of printed circuit board spacers.

[0002]

2. Description of the Related Art A printed board spacer is used to secure an appropriate space between printed boards or between a printed board and a housing. As a conventional printed circuit board spacer, for example, a metal cylindrical spacer 102 as illustrated in FIG. 7, a hexagonal bar-shaped spacer 104 having a female screw hole 104a, and the like have been used. The reason why the spacer such as a cylindrical shape is used is to insert a screw 106 and the like for connecting to the printed circuit board 110 as illustrated in FIG. 7C.

[0003]

However, since it is cylindrical and perforated, suction cannot be performed under negative pressure, and automatic mounting cannot be performed. For this reason, mounting on a printed circuit board is a manual operation, and workability is poor.

[0004]

According to a first aspect of the present invention, there is provided a printed circuit board spacer having a first face plate provided with a through hole, and a first face plate opposed to the first face plate. A second face plate disposed at a position where
A connecting part for connecting the first face plate and the second face plate is a printed circuit board spacer made of metal, and a cutout portion is provided at a position facing the through hole of the second face plate, and is melted by heating. Alternatively, a suction member that is deformable or easily penetrates is provided laterally in the missing portion.

[0005] A through hole is provided in the first face plate of the printed circuit board spacer, and a cutout portion is provided in the second face plate. In addition, a suction member that is melted or deformed by heating or that can easily penetrate is provided horizontally in the missing portion. When mounting the printed circuit board spacer on the printed circuit board, insert the suction nozzle from the through hole and suction the suction member to lift the printed circuit board spacer and transport it to the target position on the printed circuit board, When the suction by the nozzle is released, the printed board spacer can be placed at the target position. The mounting is completed when the printed board spacer is fixed to the printed board by, for example, soldering.

If a solder layer is provided on the surface of the second face plate opposite to the first face plate, the printed board on which the printed board spacer is mounted at the target position can be mounted. Heating with a hot-air circulation heating furnace, infrared heating, or the like allows the printed circuit board spacer to be soldered to the printed circuit board, which is suitable for automatic mounting. The solder layer is
For example, it can be provided by plating or applying cream solder.

If a material which melts or deforms by heating is used as the suction member, the suction member melts or deforms due to the heating during soldering, and the missing portion is opened. Bolts or the like for connecting the printed board to be arranged and the printed board spacer or the printed board on the second face plate side can be inserted into the through-hole and the missing portion. Of course, the suction member may be melted or deformed by heating separately from the soldering.

Alternatively, an easily penetrable material such as a film or a foil may be used as the adsorbing member. Since such a suction member can easily penetrate a bolt or the like, for example, a bolt for connecting a printed board disposed on the first face plate side to a printed board spacer or a printed board on the second face plate side is used. There is no hindrance to penetration.

As described above, since the suction by the negative pressure is possible and the automatic mounting can be performed, the workability in mounting on the printed circuit board is remarkably improved. The missing portion may be provided in, for example, a through-hole shape, a notch shape, an opening shape, or the like. The low-melting point metal according to the second aspect, the resin film according to the third aspect, or the like can be used as the adsorption member. Solder is exemplified as the low-melting point metal. However, a metal having the same temperature as that of solder (for example, a metal that can be melted or deformed by a hot-air circulation heating furnace for soldering, infrared heating, or the like can be used. As the film, a polyethylene film is exemplified, but it is preferable that the film is melted or deformed by heating at the time of soldering similarly to the case of the low melting point metal.

If solder is used as the suction member, the molten solder solders the second face plate to the printed board, etc., thus reinforcing the attachment of the printed board spacer. As a method of providing the suction member on the second face plate, fitting, press-fitting, inserting, embedding, inserting, or the like can be adopted, and adhesion or adhesion using an adhesive or an adhesive tape can also be adopted. Note that these are merely examples, and there is no particular limitation.

According to a fourth aspect of the present invention, there is provided the printed circuit board spacer according to any one of the first to third aspects, wherein the through hole is provided about a center line of substantially the weight of the printed circuit board spacer. Therefore, it is possible to prevent the printed circuit board spacer from being tilted when lifted by negative pressure suction by the nozzle, and as a result, it is possible to more accurately mount the printed circuit board at the target position on the printed circuit board.

[0012]

Embodiments of the present invention will be described below with reference to the drawings.

[0013]

This embodiment is an example in which the present invention is applied to an FG spacer which is a part of a path for a frame ground (frame ground, FG). As shown in FIG. 1, an FG spacer 10 as a printed board spacer of the present embodiment is used.
The upper face plate 12 corresponding to the first face plate, a pair of vertical face plates 14 corresponding to the connecting portion connected to the end of the upper face plate 12, and the fourth 2
The bottom plate 16 corresponding to the face plate is provided. Top plate 12
A screw hole 18 corresponding to a through hole is provided in the center of the screw hole 18, and a peripheral wall portion of the screw hole 18 is hung below the upper surface plate 12 as shown in FIG. Also, the lower plate 16
A gap 20 corresponding to the missing portion is formed between the gaps.
This gap portion 20 is closed by a solder plate 22 which is a low melting point metal and corresponds to a suction member. The lower surface 16a of the lower plate 16 is plated with solder.

As shown in FIGS. 2 and 3, the FG spacer 10 is, for example, a main board (printed board).
The lower plate 16 is fixed to 30 by soldering 32,
For example, a small board (printed board) 34 is placed on the upper plate 12, and the small board 34 and the FG spacer 10 are connected by screws 36. In this state, the solder plate 22 has flowed down from the gap 20 due to melting, and the tip of the screw 36 penetrates the gap 20 to the hole 38 provided in the main board 30 as shown in FIG. Has reached.

Next, the FG spacer 10 is attached to the main board 3.
The procedure for mounting on 0 will be described. As shown in FIG. 4, the FG spacer 10 before mounting is protected by a film such as polyethylene (taping). The suction nozzle 40 is passed through the screw hole 18 of the FG spacer 10,
The tip is brought into contact with the solder plate 22 and sucked by a negative pressure, transported to the main board 30 of the mounting line, and mounted on a target position on the main board 30 (component mounting).

At the target position on the main board 30,
As shown in FIG. 5, ground patterns 42a and 42b are arranged at locations corresponding to the lower surface plate 16 and the solder plate 22. In the case of the present embodiment, the ground patterns 42a, 42
b is coated with cream solder (see FIG. 5B). The cream solder applied to the ground pattern 42a is for soldering the lower plate 16 and the main board 30. On the other hand, the cream solder applied to the ground pattern 42b improves the flow of the solder into this portion and ensures conduction between the ground pattern 42b and the FG spacer 10 by the solder. When the ground pattern 42b is not provided, it is not necessary to apply cream solder between the ground patterns 42a (FIG. 5).
(C)).

As shown in FIG. 4, the main board 30 on which the FG spacer 10 is mounted is heated, for example, in a hot air circulation type heating furnace, and the heating causes the ground pattern 42.
a, 42b cream solder, lower surface 16a of lower plate 16
And the solder plate 22 is melted (reflow). Subsequently, the main board 30 is cooled and the molten solder is solidified.
0 is soldered 32 (completed). At this time, since the solder derived from the solder plate 22 flows on the main board 30 and solidifies, the strength of the soldering 32 is increased, and the number of feet increases, which is also effective in preventing the FG spacer 10 from being displaced. It is.

As described above, this FG spacer 10
Since the screw hole 18 and the solder plate 22 are provided, suction by the suction nozzle 40 is possible, and the automatic mounting as described above is possible, so that mounting workability is dramatically improved. Further, since the solder plate 22 is melted by the heating at the time of reflow and the gap portion 20 is opened, there is no problem in inserting the screw 36 after mounting.

Screw hole 18 for passing suction nozzle 40
Is provided at the center of the upper surface plate 12 about the center line of the weight of the FG spacer 10, so that the FG spacer 10 can be prevented from being tilted when lifted by the negative pressure suction by the suction nozzle 40. It can be placed very accurately at a target position on the board 30.

The embodiments of the present invention have been described with reference to the embodiments. However, the present invention is not limited to the embodiments, and various modifications can be made without departing from the gist of the present invention. Needless to say. For example, as shown in FIG. 6A, the shape of the spacer for a printed circuit board may be a cylindrical spacer 50, or a flange portion 52 corresponding to the second face plate may protrude outward. Further, as shown in FIG. 3B, a screw may be screwed to the printed circuit board on the lower plate side.

[Brief description of the drawings]

FIG. 1 is a perspective view of an FG spacer according to an embodiment.

FIG. 2 is a perspective view of a state of using the FG spacer of the embodiment.

FIG. 3 is a sectional view of a main part of FIG. 2;

FIG. 4 is an explanatory diagram of a procedure for automatically mounting the FG spacer according to the embodiment.

FIG. 5 is an explanatory diagram of a ground pattern of a main board on which the FG spacer of the embodiment is mounted.

FIG. 6 is an exemplary view of another printed circuit board spacer.

FIG. 7 is an explanatory view of a shape of a conventional printed circuit board spacer.

[Description of Signs] 10 ... FG spacer (printer board spacer) 12 ... Top plate (first face plate) 14 ... Vertical plate (connecting portion) 16 ... Bottom plate (second face plate) 16a ... Bottom surface 18 ... Screw hole (Penetrating hole) 20: gap portion (missing portion) 22: solder plate (adsorption member, low melting point metal) 30: main board 34: small substrate 38: hole 40: suction nozzle 42a: ground pattern 42b: ground pattern

Claims (5)

[Claims] 1. A first face plate provided with a through hole, a second face plate arranged at a position facing the first face plate, and connecting the first face plate and the second face plate. The connection portion is a printed circuit board spacer made of metal, and a cutout portion is provided at a position facing the through hole of the second face plate, and is melted or deformed by heating or can be easily penetrated. A spacer for a printed circuit board, wherein a suction member is provided laterally in the missing portion. 2. The printed circuit board spacer according to claim 1, wherein the suction member is made of a low melting point metal. 3. The printed circuit board spacer according to claim 1, wherein the suction member is a resin film. 4. The printed circuit board spacer according to claim 1, wherein said through hole is provided about a center line of substantially the weight of said printed circuit board spacer. Spacer. 5. The printed circuit board spacer according to claim 1, wherein a solder layer is provided on a surface of the second face plate opposite to the first face plate. Printed circuit board spacer.