JP2019134352A - Circuit pattern, RFID inlay, RFID label, and RFID medium - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simplify a manufacturing process of an RFID inlay. A circuit pattern includes a base material and an antenna portion formed in a coil shape on the surface of the base material, and the antenna portion has a first end portion led out inside a coil of the antenna portion. The antenna portion has a second end portion led out to the outside of the coil, and the first end portion and the second end portion are folded so as to face each other via the base material, and the first end portion is formed. It has a front surface on which a portion is formed and a back surface on which the second end portion is formed. [Selection diagram] Fig. 1

Description

The present invention relates to a circuit pattern applied to an RFID inlay.

  In the fields of product manufacture, management, distribution, etc., tags that are printed on the product with information on the product visibly printed, and labels that are printed on the product with information on the product visibly visible and affixed to the product etc. are used. Yes. In recent years, RFID (Radio Frequency Identification) technology for transmitting and receiving information by non-contact communication from an IC chip in which identification information is written has been applied to various fields, and is also spreading in these fields.

  RFID includes an electromagnetic induction system using a 135 kHz band, a 13.56 MHz band, and a radio wave system using a UHF band. When the communication distance is relatively short like a non-contact IC card, the electromagnetic induction method is frequently used.

  In the electromagnetic induction method, an induced electromotive force is obtained by electromagnetic induction using a coil antenna in which a start end and a termination end are connected to form a closed circuit.

  An example of a method for manufacturing a coil antenna for HF band RFID is as follows. First, a base film such as PET having a metal foil bonded on one side is prepared. Next, a coiled antenna pattern is formed by etching. Subsequently, the inner peripheral end and the outer peripheral end of the coil antenna are electrically connected by a jumper wire.

JP 2001-312709 A

  In the above-described method, a process of forming a circuit with a metal foil, that is, an etching process of the metal foil, a process of forming a bridge part, and a process of preparing a jumper wire for the bridge part are necessary, and the work is complicated. It was.

  Therefore, an object of the present invention is to simplify the manufacturing process of an RFID inlay.

According to an aspect of the present invention, there is provided a circuit pattern used for an RFID inlay, comprising: a base material; and an antenna portion formed in a coil shape on the surface of the base material, wherein the antenna portion is the antenna. A first end portion led out to the inside of the coil of the portion and a second end portion led out to the outside of the coil of the antenna portion, and in a state where a part of the base material is folded, An end portion and the second end portion are formed to face each other with the base material interposed therebetween.

  According to these aspects, it is only necessary to form a circuit pattern on one side of the base material, so that the manufacturing process can be simplified.

FIG. 1 is an external view for explaining an RFID inlay having a circuit pattern according to an embodiment of the present invention. 2 is a cross-sectional view taken along line II-II in FIG. FIG. 3 is a plan view for explaining a state in which the RFID inlay shown in FIG. 1 is folded at the folding line BL with the surface of the base member 11 on which the antenna portion 12 is formed facing outward. 4 is a cross-sectional view taken along line IV-IV in FIG. FIG. 5 is a cross-sectional view illustrating the connection portion 14 formed in the RFID inlay according to the present embodiment. FIG. 6 is a cross-sectional view illustrating an RFID label according to an embodiment of the present invention. FIG. 7 is a cross-sectional view illustrating an RFID label according to an embodiment of the present invention. FIG. 8 is a cross-sectional view illustrating an RFID medium according to an embodiment of the present invention. FIG. 9 is a plan view for explaining a modification of the embodiment of the present invention. 10 is a cross-sectional view taken along line XX in FIG.

[Circuit pattern and RFID inlay]
A circuit pattern 1 and an RFID inlay 10 according to an embodiment of the present invention will be described.

  FIG. 1 is an external view illustrating an RFID inlay 10 including a circuit pattern 1 according to an embodiment of the present invention. 2 is a cross-sectional view taken along line II-II in FIG.

  In the present embodiment, the RFID inlay 10 is a circuit pattern 1 on which an IC chip 20 with RFID (Radio Frequency Identification) specifications is mounted. In addition to labels, RFID media such as tags and wristbands can be formed by applying predetermined processing to the RFID inlay 10. Details of the RFID label and the RFID medium will be described later.

  First, the circuit pattern 1 which concerns on this embodiment is demonstrated.

  The circuit pattern 1 includes a base material 11 and an antenna unit 12 disposed on the surface of the base material 11. The antenna unit 12 is attached to the surface of the base material 11. The antenna unit 12 may be formed by etching.

  The antenna unit 12 is formed in a coil shape on the surface of the substrate 11. The antenna unit 12 includes a first end 121 that is led out inside the coil C, and a second end 122 that is led out outside the coil C of the antenna unit 12.

  The IC chip 20 is mounted at a specific position of the coiled antenna portion 12 with an anisotropic conductive adhesive E.

  FIG. 1 shows a fold line BL when the base material 11 is folded, and a first portion 11A and a second portion 11B. In the present embodiment, the coil C of the antenna unit 12 is formed in the first portion 11A.

  The first end portion 121 is formed with a first connection portion 121 c for electrical connection with the second end portion 122. Further, the second end portion 122 is formed with a second connection portion 122 c for electrical connection with the first end portion 121.

  FIG. 3 is a plan view illustrating a state (folded state) in which the RFID inlay 10 shown in FIG. 1 is folded at the folding line BL with the surface of the substrate 11 on which the antenna portion 12 is formed facing outward. is there.

  4 is a cross-sectional view taken along line IV-IV in FIG.

  As shown in FIG. 3, the base material 11 is folded in a mountain fold at the fold line BL with the first portion 11 </ b> A and the second portion 11 </ b> B facing the surface on which the antenna portion 12 is formed.

  In addition, as shown in FIG. 4, the first end 121 and the second end 122 of the antenna unit 12 are in a state where the base 11 is folded in a mountain fold with the surface on which the antenna unit 12 is formed outside. And are formed so as to face each other with the base material 11 interposed therebetween.

  FIG. 5 is a cross-sectional view illustrating the connection portion 14 formed in the RFID inlay 10 according to the present embodiment. At predetermined positions of the first end portion 121 and the second end portion 122, through-holes that penetrate the first end portion 121 and the second end portion 122 and the base material 11 are formed.

  As shown in FIG. 5, the through holes formed in the first end 121 and the second end 122 of the circuit pattern 1 are communicated in a folded state to form the opening 11 h. When the circuit pattern 1 is folded, a conductive material is disposed in the opening 11h, whereby the connection portion 14 is formed, and the first connection portion 121c and the second connection portion 122c are electrically connected.

  The first connection part 121c and the second connection part 122c extend the metal foil that forms the first end part 121 and the second end part 122 of the circuit pattern 1 together with the base material 11 by caulking using a caulking jig or the like. May be conducted.

  The first end portion 121 and the second end portion 122 are electrically connected by the connecting portion 14 to form a closed circuit and can function as an antenna.

  Next, details of each configuration in the circuit pattern 1 will be described.

  Materials applicable as the substrate 11 include paper such as high-quality paper and coated paper, a single resin film such as polyvinyl chloride, polyethylene terephthalate, polypropylene, polyethylene, and polyethylene naphthalate, or a laminate of a plurality of these resin films. A multilayer film is mentioned.

  Moreover, it is preferable that the thickness of the base material 11 is 25 micrometers or more and 300 micrometers or less. In the case of using paper as the substrate 11, it can be 50 μm or more and 260 μm or less in the above range, and is usually preferably 70 μm or more and 110 μm or less. Moreover, when using a resin film as the base material 11, it can be 25 micrometers or more and 200 micrometers or less within the said range. From these, it can select suitably according to a use.

  Moreover, it is preferable that the antenna part 12 is formed with metal foil. As the metal constituting the metal foil, any conductive metal that is usually used for forming the antenna portion can be used. As an example, copper and aluminum can be cited.

  In the present embodiment, it is preferable to use an aluminum foil from the viewpoint of followability to folding of the base material 11 and the viewpoint of reducing the manufacturing cost. Further, from the viewpoint of the entire thickness of the RFID inlay 10 or the entire thickness when formed on the RFID medium, and the manufacturing cost, the thickness of the metal foil is preferably 3 μm or more and 25 μm or less. In this embodiment, an aluminum foil having a thickness of 20 μm is used.

  Moreover, the antenna part 12 may be formed by applying a metal powder-containing paste. Furthermore, the conductive material may be printed by inkjet.

  In this embodiment, the pattern of the antenna part 12 cuts metal foil using the die roll in which the convex blade part of the shape of the outer periphery line of the antenna part 12 was formed, and the anvil roller which backs up a die roll, for example. Can be formed.

  Examples of the pressure-sensitive adhesive applicable to the pressure-sensitive adhesive layer 13 include an acrylic pressure-sensitive adhesive, a urethane-based pressure-sensitive adhesive, a silicone-based pressure-sensitive adhesive, and a rubber-based pressure-sensitive adhesive.

  In the present embodiment, the pressure-sensitive adhesive layer 13 is formed, for example, by applying a pressure-sensitive adhesive on the substrate 11 using a plate roller on which a convex pattern corresponding to the shape of the antenna unit 12 is formed. Can do.

  The pressure-sensitive adhesive layer 13 can be applied by flexographic printing or screen printing in addition to such relief printing.

  From the viewpoint of forming the pressure-sensitive adhesive layer 13 by printing, it is preferable to use an ultraviolet curable pressure-sensitive adhesive as the pressure-sensitive adhesive.

  The thickness of the pressure-sensitive adhesive layer 13 is preferably 3 μm or more and 25 μm or less. If it is 3 μm or more, a sufficient adhesive force for adhering the antenna unit 12 can be obtained, and if it is 25 μm or less, it does not protrude beyond the outer peripheral line of the antenna unit 12 due to pressurization. From this viewpoint, the thickness of the adhesive A is more preferably 3 μm or more and 10 μm or less.

  The adhesive strength of the adhesive is preferably 500 gf / 25 mm or more, more preferably 800 gf / 25 mm or more, and still more preferably 1000 gf / 25 mm or more in the 180 ° peel test (JIS Z 0237). The upper limit value of the adhesive strength is preferably 2000 gf / 25 mm.

  According to the circuit pattern 1 and the RFID inlay 10 described above, the first end 121 and the second end 122 are formed so as to face each other with the base 11 in a state where a part of the base 11 is folded. Has been.

  For this reason, in the circuit pattern 1 and the RFID inlay 10 according to the present embodiment, after the antenna portion 12 is formed on one surface of the base material 11, the base material 11 is folded so that the antenna portion 12 is on the outside. As a result, a state before electrical connection can be obtained.

  Therefore, unlike the prior art, it is not necessary to form circuit patterns on the front surface and the back surface of the base material, and the manufacturing process can be simplified.

  In addition, according to the present embodiment, when forming a coiled circuit, since the base material 11 also serves as an insulating layer, an insulating measure is applied to a portion that crosses the circuit itself when the ends are electrically connected to each other. There is no need to provide jumper wires.

  Further, in the circuit pattern 1 and the RFID inlay 10 according to the present embodiment, the through-hole formed in the first end 121 and the through-hole formed in the second end 122 in a state where the base material 11 is folded. And an opening 11h is formed, and a connecting portion 14 made of a conductive material is formed in the opening 11h. For this reason, the manufacturing process of the RFID inlay 10 can be simplified.

[RFID label (1)]
FIG. 6 is a cross-sectional view illustrating the RFID label 100 according to the embodiment of the present invention.

  An RFID label 100 according to this embodiment includes the RFID inlay 10 described above, a separator 40, and an outer base material 50.

  The separator 40 is temporarily attached to the surface of the RFID inlay 10 on which the coil C of the antenna portion 12 of the first portion 11 </ b> A is formed via the adherend adhesive 61.

  Further, the outer substrate 50 has a printing surface, and the pressure-sensitive adhesive for outer substrate or the outer substrate 50 with the printing surface facing outward on the surface on which the second end portion 122 of the second portion 11B is formed. The outer base material adhesive 62 is laminated.

  The RFID label 100 having the above configuration can be attached to the adherend surface of the adherend so that the separator 40 is peeled off and the antenna portion 12 formed in the first portion 11A is directed to the adherend.

[RFID label (2)]
FIG. 7 is a cross-sectional view illustrating an RFID label 200 according to an embodiment of the present invention.

  The RFID label 200 according to the present embodiment includes the above-described RFID inlay 10, the separator 40, and the outer base material 50. On the contrary to the RFID label 100, the outer base material 50 having a printing surface is the first portion 11A. On the surface on which the antenna portion 12 is formed, the outer surface base material adhesive or the outer base material adhesive 62 is laminated with the printing surface facing outward.

  Further, the separator 40 is temporarily attached to the surface of the second portion 11B on which the second end portion 122 is formed via the adherend adhesive 61.

  When the separator 40 is peeled off, the RFID label 200 having the above configuration can be attached to the adherend surface of the adherend with the second portion 11B facing the adherend.

[RFID medium]
FIG. 8 is a cross-sectional view illustrating an RFID medium 300 according to an embodiment of the present invention. The RFID medium 300 is obtained by sandwiching the RFID inlay 10 described above between a first outer base material 71 and a second outer base material 72.

  The first outer substrate 71 is laminated on the surface of the RFID inlay 10 on which the antenna portion 12 of the first portion 11A is formed via an adhesive for outer substrate or an adhesive 81 for outer substrate.

  Further, the second outer base material 72 is laminated on the surface of the RFID inlay 10 where the second end portion 122 of the second portion 11B is formed via an adhesive for outer base material or an adhesive 81 for outer base material. ing.

  In FIG. 8, it is described that there is a gap between the end portion of the first outer base material 71 and the end portion of the second outer base material 72. The RFID inlay 10 is sealed with an adhesive applied between the outer base materials 72.

  At least one surface of the first outer base material 71 and the second outer base material 72 is a printing surface.

  As the RFID medium 300 shown in FIG. 8, a so-called tag can be cited. The tag is used by being attached to an apparel product or the like with a thread or a tag pin.

  An example of the RFID medium 300 is a wristband. The wristband is formed so as to be fastened to the user's arm, and can be used as an inpatient identification in a hospital or as an admission ticket at a concert or event.

[Other Embodiments]
The above-described embodiment of the present invention only shows a part of application examples of the present invention, and is not intended to limit the technical scope of the present invention to the specific configuration of the above-described embodiment.

  In the present embodiment, the pattern of the coil C of the antenna unit 12 shown in FIGS. 1 and 3 is not limited to the illustrated one. The present invention is applicable when both ends of a circuit pattern are electrically connected across the circuit itself.

  In the present embodiment, a fold line BL is defined at a symmetrical position that divides the base material 11 into a first portion 11A and a second portion 11B. However, the folding line BL is not limited to the illustrated position.

  In this embodiment, the case where the 1st part 11A and the 2nd part 11B of the base material 11 were equally divided by the folding line BL was demonstrated. However, the first portion 11 </ b> A and the second portion 11 </ b> B of the substrate 11 do not have to be line symmetric with respect to the folding line BL.

  The second portion 11B folded toward the first portion 11A may be a region where at least the second end portion 122 and the second connection portion 122c can be formed. That is, for example, in the second portion 11B illustrated in FIG. 1, there may be no blank portion other than the region where the second end portion 122 is disposed.

  In the present embodiment, the first end portion 121 led out to the inside of the coil C is cut out together with a part of the base material 11, and the second end portion 122 side led out to the outside of the coil C of the antenna portion 12. May be folded.

  FIG. 9 is a plan view for explaining a modification of the embodiment of the present invention. 10 is a cross-sectional view taken along line XX in FIG. 9 and 10, components having the same configuration and the same function as those in FIGS. 1 and 2 are denoted by the same reference numerals.

  As shown in FIG. 9, the circuit pattern 2 and the RFID inlay 90 shown as a modification of the present embodiment are led out to the first end portion 123 led out of the coil C and the coil C of the antenna unit 12. And a second end portion 124.

  In the circuit pattern 2 and the RFID inlay 90, the first end portion 123 is cut out together with a part of the base material 11 at the notch portion N indicated by the dotted line, with the fold line BL indicated by the one-dot chain line in FIG. The antenna portion 12 is formed so as to be folded toward the back surface side.

  The position where the first end 123 and the second end 124 face each other with the base material 11 in a state in which the notch N that is a part of the base material 11 on which the first end 123 is formed is folded. It is in.

  According to the circuit pattern 2 and the RFID inlay 90 having the above-described configuration, when forming a coiled circuit, the base material 11 also serves as an insulating layer, so that the circuit itself is crossed when the ends are electrically connected. There is no need to take insulation measures or provide jumper wires for the parts to be used.

  In the present embodiment, the description has been given of the production of the circuit pattern 2 by sticking an aluminum foil to the substrate 11, but the circuit pattern 2 can also be produced by etching an aluminum foil or a copper foil.

DESCRIPTION OF SYMBOLS 1 Circuit pattern 2 Circuit pattern 10 RFID inlay 11 Base material 11A 1st part 11B 2nd part 11h Opening part 12 Antenna part 13 Adhesive layer 14 Connection part 20 IC chip 40 Separator 50 Outer base material 61 Adhesive 62 for adherends Adhesive for outer substrate 71 First outer substrate 72 Second outer substrate 81 Adhesive for outer substrate 90 RFID inlay 100 RFID label 121 First end 121c First connecting portion 122 Second end 122c First 2 connection part 123 1st end part 124 2nd end part 200 RFID label 300 RFID medium BL Folding N Notch

Claims (10)

A circuit pattern used for RFID inlay,
A substrate;
An antenna portion formed in a coil shape on the surface of the base material,
The antenna unit is
A first end led to the inside of the coil of the antenna part;
A second end led to the outside of the coil of the antenna part,
A circuit pattern formed so that the first end and the second end are opposed to each other with the base material in a state where a part of the base material is folded. The circuit pattern according to claim 1,
A circuit formed so that the first end and the second end are opposed to each other with the base in a state where the base is folded with the surface on which the antenna portion is formed outside. pattern. The circuit pattern according to claim 1 or 2,
The circuit pattern in which the through-hole which penetrates each of the said 1st end part and the said 2nd end part and the said base material in each predetermined position of the said 1st end part and the said 2nd end part was formed. The circuit pattern according to claim 3,
A circuit pattern in which a conductive material is disposed in the through holes communicating with each other in a state in which a part of the base material is folded. The circuit pattern according to any one of claims 1 to 3,
A circuit pattern in which the first end and the second end are electrically connected by caulking. The circuit pattern according to any one of claims 1 to 5,
A circuit pattern in which the antenna portion is formed of a metal foil. The circuit pattern according to claim 6,
A circuit pattern in which the antenna portion is formed of an aluminum foil. RFID inlay,
A base member, and an antenna portion formed in a coil shape on the surface of the base member, wherein the antenna portion is provided on the coil end of the antenna portion and on the coil end of the antenna portion. A second end portion that is led out, and is formed such that the first end portion and the second end portion face each other with the base material in a state in which a part of the base material is folded. Circuit pattern,
An IC chip electrically connected to the antenna unit;
RFID inlay with An RFID label having an RFID inlay,
A base member, and an antenna portion formed in a coil shape on the surface of the base member, wherein the antenna portion is provided on the coil end of the antenna portion and on the coil end of the antenna portion. A second end portion that is led out, and is folded so that the first end portion and the second end portion face each other with the base material therebetween, and the surface on which the first end portion is formed, A circuit pattern having a back surface on which a second end is formed;
The RFID inlay comprising an IC chip electrically connected to the antenna unit;
A separator temporarily attached to either one of the front surface and the back surface of the RFID inlay via an adhesive for adherend;
An outer substrate having a printing surface laminated via an adhesive for outer substrate or an adhesive for outer substrate on the surface opposite to the surface on which the separator is temporarily attached;
RFID label having An RFID medium having an RFID inlay,
A base member, and an antenna portion formed in a coil shape on the surface of the base member, wherein the antenna portion is provided on the coil end of the antenna portion and on the coil end of the antenna portion. A second end portion that is led out, and is folded so that the first end portion and the second end portion face each other with the base material therebetween, and the surface on which the first end portion is formed, A circuit pattern having a back surface on which a second end is formed;
The RFID inlay comprising an IC chip electrically connected to the antenna unit;
A first outer substrate laminated on the surface of the RFID inlay via an adhesive for outer substrate or an adhesive for outer substrate;
A second outer substrate laminated on the back surface of the RFID inlay via an adhesive for outer substrate or an adhesive for outer substrate;
An RFID medium having:

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