JP2004054337A - IC chip package - Google Patents

Abstract

Provided is an IC chip mounted body that can communicate at any position without being affected by a surrounding metal object such as a position on a metal surface and a position not on a metal surface.
An IC chip mounting body including an antenna circuit and an IC, wherein the antenna circuit has an IC connected thereto, a dielectric layer located near the antenna circuit, and a magnetically permeable metal material located outside the dielectric layer An IC chip mounted body comprising: a non-conductive magnetically permeable layer 4 including: and a conductive layer 5 located further outside the non-conductive and magnetically permeable layer.
[Selection diagram] Fig. 1

Description

【００６６】
【発明の効果】
本発明のＩＣチップ実装体は、アンテナ回路およびＩＣを備えたＩＣチップ実装体であって、ＩＣを接続したアンテナ回路、アンテナ回路近傍に位置する誘電体層、誘電体層の外側に位置する透磁性金属材料を含む非導電性透磁性層、非導電性透磁性層の更に外側に位置する導電性層を備えたので、金属表面上及び金属表面上でない位置等、周囲金属物体の影響を受けずに、いずれの位置においても通信が可能となっている。
【図面の簡単な説明】
【図１】本発明の非接触ＩＣタグの一実施例の断面図である。
【図２】本発明の非接触ＩＣタグの別の一実施例の断面図である。
【図３】フリーの場合のＩＣタグの通信の可否の評価を行う評価試験装置の概要を示す概略図。
【図４】金属板上に貼り付けた場合のＩＣタグの通信の可否の評価を行う評価試験装置の概要を示す概略図。
【符号の説明】
１　　　インレットシート用支持体
２　　　中間層
３　　　回路パターン
４　　　非導電性透磁性層
５　　　導電性層
６　　　ＩＣ[0001]
TECHNICAL FIELD OF THE INVENTION
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact type IC chip mounted body used for a ticket, a telephone card, a luggage tag, etc., which performs data communication and the like by external radio waves, and is further used for a bank card, a point card, and the like. The present invention relates to a combination type IC chip package having both functions of a contact type IC chip package and the non-contact type described above.
[0002]
These IC chip mounted bodies are also called data carriers, and are generally called IC cards. However, they are not necessarily in the form of a card, but also in the form of a sheet-like tag attached to an object, a tag enclosed in a container, or the like. Various types of carriers such as a wristwatch type are also included. Also in this specification, the IC chip mounted body is used as including an IC card or a form other than the card form.
[0003]
[Prior art]
2. Description of the Related Art In recent years, small electronic devices having an IC chip mounted thereon as a new information recording medium for commuter passes and the like used for personal information management, physical distribution management, commuting to work, and the like have been becoming popular. Particularly, a card-type large-capacity variable information recording medium called an IC card which is convenient for portable use has begun to spread widely.
IC cards are broadly classified into three types: contact type, non-contact type, and combination type having both functions. A contact type IC card is provided with a metal terminal for data exchange electrically connected to an IC chip on a surface of the card, and performs data exchange with an external reader through the terminal. It is. Currently, the disposable type is widely distributed as a telephone card in Europe and the like, and experiments using a rewritable information type as a money card are being conducted in various countries. In particular, it has attracted attention as a card used in financial relations.
[0004]
On the other hand, a non-contact type IC card is used as a recording medium that replaces a ticket having a magnetic recording layer provided on one side, such as a conventional ticket, a commuter pass, etc., since data exchange is performed in a non-contact manner via radio waves. Have been. In particular, it is not necessary to take out the tickets one by one at the time of passing the ticket gate, and data can be exchanged even from a regular baggage or a bag, so that it is expected that the convenience is greatly improved.
In the physical distribution field as well, management by IC carriers called RFID (Radio Frequency Identification) tags, which replace data with barcodes and magnetic recordings and exchange data with mobile objects by radio waves, is becoming mainstream. .
[0005]
[Problems to be solved by the invention]
When such a non-contact IC tag is attached to a metal housing or used near a metal object, there is a problem that communication with a reader / writer becomes impossible due to the influence of the metal.
[0006]
An object of the present invention is to solve the above problems and to provide an IC chip mounted body that can communicate at any position without being affected by surrounding metal objects such as a position on a metal surface and a position not on a metal surface. Is to do.
[0007]
[Means for Solving the Problems]
An IC chip mounted body according to the present invention is an IC chip mounted body including an antenna circuit and an IC, the antenna circuit having the IC connected thereto, a dielectric layer located near the antenna circuit, and located outside the dielectric layer. A non-conductive magnetically permeable layer containing a magnetically permeable metal material; and a conductive layer located further outside the non-conductive magnetically permeable layer.
Further, the non-conductive magnetically permeable layer is preferably a layer containing a magnetically permeable metal material in an island shape.
Further, the magnetically permeable metal material is preferably at least one material selected from silicon steel, sendust alloy, Fe-Al alloy, electromagnetic soft iron, carbonyl iron, amorphous alloy and permalloy.
Further, it is preferable that the dielectric layer is substantially a support for the inlet sheet located between the antenna circuit and the non-conductive magnetically permeable layer.
It is also preferable that the dielectric layer is substantially an intermediate layer located between the antenna circuit and the non-conductive magnetically permeable layer.
[0008]
BEST MODE FOR CARRYING OUT THE INVENTION
The inventors basically form a structure of a dielectric layer, a non-conductive metal permeable layer, and a conductive layer between an IC chip mounted body and a metal housing to which the IC chip mounted body is attached. As a result, they have found that the above problem can be solved, and have come to be able to provide the IC chip mounted body of the present invention.
As a core part of the IC chip mounted body, a coil-shaped, dipole-shaped, flat-plate-shaped or the like antenna circuit portion for exchanging signals and power between an IC called an inlet sheet and the outside is provided on a support.
[0009]
The present invention can be used in any of a non-contact type and a combination type IC chip mounted body. Among them, a non-contact type IC tag suitable for using the present invention and a circuit substrate used therein Will be described.
First, the steps from the formation of the circuit substrate to the formation of the inlet sheet will be described.
[0010]
1. Process from circuit substrate to forming inlet sheet
A circuit substrate is formed by forming a circuit pattern on the support of the inlet sheet by etching, another method, or a combination thereof. A sheet in which electronic components such as an IC chip, a capacitor, and an antenna circuit are mounted or formed on the circuit substrate is referred to as an “inlet sheet”.
[0011]
Hereinafter, (1) the manufacturing process from the circuit substrate to the inlet sheet of the present invention will be described in order, and then (2) the assembly of the IC card will be described.
First, the metal foil and the support constituting the circuit substrate will be described in detail.
Inlet manufacturing and process
[0012]
(Metal foil)
The metal foil used is an aluminum foil, copper foil, gold foil, silver foil, zinc foil, nickel foil, tin foil, manufactured by electrolytic method, rolling method, precision rolling method, stamping method (mainly for arts and crafts), Alloy foils and the like are preferred.
Generally, it is preferable that these metal foils are subjected to an easy-adhesion treatment on a side to be adhered to the base material. The larger the unevenness due to the easy bonding treatment, the higher the bonding strength, but if it is too large, the strength of the metal foil may be weak. When a thin metal foil is used, fine irregularities may occur on the surface of the metal foil, which may cause a problem in reproducibility of fine lines.
[0013]
In addition, since the surface of the metal foil is usually oxidized by air, it is preferable to perform an antioxidation treatment. On the other hand, aluminum is stabilized by the formation of an aluminum oxide film on its surface, and does not require any special surface treatment.
[0014]
Generally, the metal foil used for the etching pattern is often a copper foil or an aluminum foil. There are two types of copper foil: rolled copper foil (including precision rolling) and electrolytic copper foil.
Rolled copper foil has good mechanical strength against repeated bending, and is suitable for wiring of movable parts such as a hard disk of a computer and a printer. Electrolytic copper foil has poor bending resistance compared to rolled copper foil, but is inexpensive. In the example of the IC mounted body used in the present invention, the bent IC chip is not used, so that even an electrolytic copper foil can be sufficiently used.
[0015]
Aluminum foil is manufactured by rolling. Aluminum is preferably stretchable compared to copper and easily connected when mechanically caulked. The cost is about 1/5, which is very preferable from the viewpoint of cost reduction.
However, the specific resistance of aluminum is about 1.5 times higher than that of copper. Therefore, in order to obtain the same resistance value, it is necessary to increase the thickness and the width of the circuit.
[0016]
(Support for inlet sheet)
The support for the inlet sheet is selected from an electrically insulating material. The support can be roughly divided into a rigid substrate and a flexible substrate.
Rigid substrates are manufactured by impregnating aramid fibers or glass fiber sheets with a thermosetting resin such as an epoxy resin, and paper with a thermosetting resin such as a phenol resin, and applying heat and pressure to cure them. The rigid substrate has a high elastic modulus against mechanical stress.
[0017]
On the other hand, a flexible substrate is a film-like support on which circuits are provided, and is used for printer heads, wiring in cars, etc. It is used.
As the support, paper, non-woven fabric, woven fabric, film, glass epoxy substrate, paper phenol substrate, and the like can be used, and a circuit pattern is formed by etching, printing, conducting wire, vapor deposition, plating, or the like of a metal foil. Any material may be used for the circuit board, but in terms of cost, general-purpose films such as PET (polyethylene terephthalate), PEN (polyethylene tenaphthalate), PPS (polyphenylene sulfide), PBT (polybutylene terephthalate), PC (Polycarbonate), ABS (acrylonitrile-butadiene-styrene), PVC (polyvinyl chloride), PET-G (modified polyester resin obtained by polymerizing at least three components of ethylene glycol, terephthalic acid and 1,4-cyclohexanedimethanol), A material made of a material such as PP (polypropylene), PE (polyethylene), or polyimide is preferable.
[0018]
Further, it is preferable that the surface of the support for the inlet sheet that adheres to the metal foil layer, the conductive ink and the like be subjected to easy adhesion treatment. That is, an easy adhesion treatment is to perform a surface treatment for improving the adhesion strength by providing surface irregularities by chemical treatment or physical treatment on the surface of the inlet sheet support that adheres to those circuits.
[0019]
[Inlet sheet]
After a part of the metal foil of the circuit substrate obtained by bonding the support and the metal foil as described above is removed by etching to form a circuit pattern including a necessary antenna circuit, the circuit pattern of the IC chip is formed. An inlet sheet can be obtained by mounting the formed base material. The inlet sheet is a heart part when assembling a non-contact type IC tag described below.
[0020]
The formation of the circuit pattern including the antenna circuit can be performed as follows. Provide a photosensitive resin layer on the metal foil of the circuit base material, print the circuit pattern on the photosensitive resin layer using a mask of a circuit pattern formed by a negative or positive photographic film or chromium film, or print or lettering The circuit pattern is drawn directly on the metal foil of the circuit substrate by the various methods described above. By using the circuit pattern thus formed as a mask, unnecessary metal parts except for the circuit pattern part are melted out by so-called etching using a ferric chloride solution or a caustic soda solution or the like, so that necessary metal foil is used. By forming the circuit pattern 3, an etching circuit substrate can be manufactured.
[0021]
The circuit substrate can also be made from a circuit substrate in which metal foils are bonded on both sides. With such a circuit substrate, it is possible to form a planar capacitor on the circuit substrate. A planar capacitor is a very useful component when performing tuning for accurately adjusting the frequency in a non-contact type IC tag. A circuit substrate in which metal foils are bonded on both sides can be used by forming a three-dimensional circuit by conducting both metal foils by a method of conducting through through-hole plating, mechanical and welding.
In addition to the method of forming a circuit pattern including an antenna circuit by the above-described etching method, a circuit pattern can be formed by the following method. Therefore, a circuit pattern including an antenna circuit can be formed by using such a method alone or in combination.
[0022]
[Conductive ink]
This is a method in which a metal powder such as silver or copper is mixed with a resin and printed by screen printing or the like to form an antenna circuit or the like. Since the resistance value at the same cross-sectional area is about 10 times higher than that of the metal foil, it may not be used depending on the chip used.
[0023]
[Metal wire]
Although the material is the cheapest, the mounting of the bare chip requires a high level of technology, and when the resistance value is almost the same as that of the etching circuit, the problem is that the wire diameter becomes considerably large.
[0024]
[plating]
Since the circuit is formed through a base material such as nonwoven fabric or nylon mesh, the thickness of the metal can be increased, but it is basically the same as single-sided etching, and bare chips have been miniaturized recently. Although there is a drawback in that it is difficult to mount a circuit directly on a circuit and a planar capacitor cannot be provided, the cost is relatively low and there is a possibility that it will be widely used in the future.
[0025]
[Metal powder]
This method applies metal powder directly in a circuit pattern, but has low productivity and high cost.
[0026]
[Evaporation]
This method heats a metal into a vapor in a high vacuum and deposits it on a film, etc., but the thickness of the metal film is thin, and the IC chip currently in use has too high a resistance value of the antenna, making it difficult to obtain a communication distance. There is a problem.
On the other hand, there is a method called sputtering. This method is similar to the above-described vapor deposition method, except that a small amount of a rare gas such as argon is put in a high vacuum, and the rare gas molecules are made to collide with a metal called a target at a high speed to attach the metal to the substrate. By using this method, it is possible to obtain a metal film having a sufficient thickness for driving an IC chip, as compared with a vapor deposition method.
[0027]
[Connection between IC and circuit pattern]
According to the present invention, a bare chip is thermocompression-bonded with a connecting resin such as ACF (anisotropic conductive film), ACP (anisotropic conductive paste), NCP (non-conductive paste), or heated using metal such as solder. A connection method, a connection method using a conductive adhesive containing a metal powder such as silver or copper, and a conventional connection method such as ultrasonic bonding, welding, and thermocompression bonding between metals can be used.
When the package chip described below is used, the connection with the antenna circuit is performed in the same manner as described above by using a method of heating and connecting using a metal such as solder, or containing a metal powder such as silver or copper. It is possible to use a connection method using a conductive adhesive to be used, or a conventional connection method such as ultrasonic bonding, welding, or thermocompression bonding between metals.
[0028]
Hereinafter, components such as ICs for producing the inlet sheet will be briefly described.
[IC]
Examples of the IC chip used in the present invention include a bare chip in a band of 135 KHz, 4.9 MHz, 6.5 MHz, 13.56 MHz, 2.54 GHz or the like. The IC used for the IC chip mounting body is in the form of a bare chip in which only bumps are provided on the chip. The chip is die-bonded to a lead frame material that can also be used for the terminal part, and the pad between the chip and the lead frame is connected with gold wires. After being wired, it is supplied in a form called a package chip which is sealed with an epoxy resin or the like or fixed on a film having terminals. Recently, an IC called a CSP (chip size package) having a shape similar to a bare chip has been developed. This CSP in which a bare chip is resin-sealed and a new electrode is provided is a technique conceived because the degree of integration of a semiconductor has recently been improved, and the CSP can also be used as the IC chip of the present invention.
[0029]
2. IC tagging materials / process
The materials and processes used from the above-described inlet sheet to the IC tag will be described below.
FIG. 1 shows a basic configuration diagram of an IC tag. FIG. 1 is a cross-sectional view of an example of the non-contact IC tag of the present invention. A cover layer 8 is formed on one surface of an inlet sheet (mainly composed of a support 1, a circuit pattern 3, and an IC 6) via an adhesive layer 10a. Are joined. The intermediate layer 2, the non-conductive magnetically permeable layer 4, and the conductive layer 5 are laminated on the opposite side of the inlet sheet from the coating layer 8. The coating layer 8 may be provided with a printing layer and a protective layer 7 outside the printing layer. Adhesive layers 10b, 10c, 10d, and 10e for joining the layers are provided between the layers as appropriate.
[0030]
(Coating layer)
The coating layer 8 is the outermost base material of the completed IC tag, and may further include a printing layer, a magnetic layer, a protective layer 7 and the like as necessary. Film or sheet polyester, polycarbonate, ABS, PET-G, polyvinyl chloride, polyethylene, polypropylene, nylon, polyimide, polystyrene, polymer alloy, engineering plastic, etc. plastic film, paper, net, nonwoven fabric, etc. A composite, a substrate in which glass fiber or paper is impregnated with an epoxy resin or the like can be used. Also, depending on the layered configuration of the tag, it may also serve as a support. The coating layer may be transparent, translucent, or opaque depending on the application. Most of translucent and opaque plastic films are distributed. White pigments such as titanium oxide, calcium carbonate, silica, and organic pigments are kneaded in the resin, or the surface is printed or coated with a concealed layer. Is provided. Further, a functional surface coat such as heat sensitivity, thermal transfer, and ink jet may be applied.
[0031]
Note that general information such as ruled lines, instructions, and service marks can be printed on the covering layer. Examples of the printing method include a printing method and a printing method such as offset printing, gravure printing, letterpress printing, screen printing, and flexographic printing, and various methods can be used for printing ink and drying thereof. UV printing in which UV irradiation and drying are preferred.
[0032]
As a method for displaying necessary information such as a name, a serial number, and a delivery destination on the coating layer, printing can be performed using a recording device. Examples of the recording device include printers such as an ink jet system, an ink ribbon system, a thermal transfer system, an electrophotographic system, a thermal recording system, and a pressure recording system, an impact system dot printer, a copying machine, and a laser marking machine.
[0033]
(Adhesive layer)
The adhesive layers 10a, 10b, 10c, 10d, and 10e are layers having a function of adhering the inlet sheet support 1 and the coating layer 8, and the intermediate layer 2 and the non-conductive magnetically permeable layer 4 and the like. The adhesive resin used for the adhesive layer is a thermosetting resin such as an epoxy resin, a commonly used dry laminating adhesive such as polyester, ABS, acrylic, or polyurethane, or a hot melt resin and a thermosetting resin. , A moisture-curable resin, and a line-curable resin are preferred. In some cases, the adhesive layer can adhere each film with a wet laminating adhesive.
When the tag is to be attached to a metal surface or a metal-coated surface, an adhesive having a higher adhesiveness, that is, a so-called adhesive is used for the adhesive layer 10e. The adhesive is provided on the base material, sandwiched between release papers 13 coated with a release agent, and peeled off when the IC tag is actually attached to the article.
[0034]
The release agent is preferably a water-dispersible release agent, for example, a polybutadiene rubber-based, styrene-butadiene copolymer-based, alkyd-silicone copolymer, acryl-silicone copolymer-based release treatment agent, In addition to inks containing release agents such as release varnish and medium, waxes such as acrylate resin latex, zinc stearate, calcium stearate, stearic acid amide, ethylene-bisstearic acid amide, paraffin, polyethylene, and polypropylene And mixtures of the above waxes with water-soluble polymers such as polyvinyl alcohol. These release agents may be used alone or in combination of two or more.
[0035]
Among the adhesives, so-called pressure-sensitive adhesives include rubber-based, acrylic-based, and silicone-based adhesives, and solvent-type, emulsion-type, and hot-melt-type adhesives are used as molds. In order to form an adhesive layer, the adhesive is applied to a release sheet, dried if necessary to form an adhesive layer, and then it may be bonded to a surface substrate or may be directly applied to the surface substrate. . In the case where a heat-sensitive recording layer is provided as a surface substrate, the former method of once applying to a release sheet is preferred.
[0036]
As an adhesive coating device, for example, a roll coater, a knife coater, a bar coater, a die coater, a comma coater, a lip coater, a reverse gravure coater, a vario gravure coater, and the like are used as appropriate. 5 to 50 g / m in dry weight ² Although it is adjusted within the range, it is necessary to have an adhesive force between the base sheet and the adherend that does not peel off when attached to the adherend.
[0037]
As the base material of the release sheet covering the adhesive, high-density base paper such as glassine paper, clay-coated paper, kraft paper, or high-quality paper, for example, casein, dextrin, starch, carboxymethylcellulose, methylcellulose, ethylcellulose, hydroxyethylcellulose, With natural polymers such as polyvinyl alcohol, styrene-butadiene copolymer, methyl methacrylate-butadiene copolymer, ethylene-vinyl chloride copolymer, ethylene-vinyl acetate copolymer, acrylate ester copolymer, or synthetic resin , A release base material provided with a filler layer containing a pigment as a main component, or a polylaminate paper obtained by laminating polyethylene or the like on kraft paper or woodfree paper, or a polypropylene or polyethylene terephthalate film, etc. , Solvent type There is a release agent such as a solvent-free silicone resin or fluorine resin on a dry weight 0.05 to 3 g / m ² After coating, a release agent layer is formed by heat curing or ionizing radiation curing. The coating device for applying the release agent is not particularly limited, but, for example, a bar coater, a direct gravure coater, an offset gravure coater, an air knife coater, a multi-stage roll coater or the like is appropriately used.
[0038]
[Intermediate layer: dielectric layer]
As the intermediate layer 2, a layer mainly made of a polymer material described later is used. This layer mainly acts as the dielectric layer of the present invention. When the above-described inlet sheet and the later-described non-conductive magnetically permeable layer 4 are overlapped, the resonance point shifts to a lower frequency side because the non-conductive and magnetically permeable layer 4 has a relatively large dielectric constant. In order to prevent this, it was found that it is good to interpose the intermediate layer 2 having a low dielectric constant (ε) between the inlet sheet and the non-conductive magnetically permeable layer. The capacitance (C) is represented by C∝ε, and is proportional to the dielectric constant. The lower the dielectric constant, the lower the capacitance.
The resonance point frequency (f) is f∝1 / C ^1/2 And is inversely proportional to the square root of the capacitance. When the capacitance decreases, the resonance point increases. According to this principle, it is possible to reduce the dielectric constant of the dielectric layer, that is, to reduce the floating capacitance of the inlet sheet, and to reduce the resonance point shifted to the low frequency side due to the non-conductive magnetically permeable layer. It is intended to return to the high frequency side.
[0039]
Although it has been described above that the intermediate layer mainly functions as a dielectric layer, this is present in a layer interposed between the circuit pattern 3 including the antenna circuit and the non-conductive magnetically permeable layer 4 and in the vicinity of the circuit pattern 3. If the layers have dielectric properties, they are collectively described as acting as a dielectric layer, and so have been described. That is, these layers near the antenna circuit also contribute as dielectric layers when the dielectric constant is small.
Actually, the contribution as a dielectric layer is small because, for example, an adhesive layer for bonding each layer other than the intermediate layer is thin. Among these layers, the intermediate layer 2 and the inlet sheet support 1 mainly function as dielectric layers in that they are relatively thick layers and are located near the antenna circuit.
[0040]
However, what should be noted here is the position of the inlet sheet support 1 in the IC tag. FIG. 2 is a cross-sectional view of another example of the non-contact IC tag of the present invention. In FIG. 2, the inlet sheet support 1 has a circuit pattern including an antenna circuit as compared with the inlet direction of FIG. This is an example of a non-contact IC tag that is located on the side of the non-conductive magnetically permeable layer with respect to No. 3. When the support 1 for the inlet sheet is interposed between the circuit pattern 3 and the non-conductive magnetically permeable layer 4 as shown in FIG. 2, the contribution as the dielectric layer becomes larger, but as shown in FIG. When the sheet support 1 is not interposed between the circuit pattern 3 and the non-conductive magnetically permeable layer, the contribution as the dielectric layer is relatively small. Therefore, it is the intermediate layer and / or the support for the inlet sheet that ultimately acts substantially as the dielectric layer of the present invention. The intermediate layer having a sufficient thickness located between the antenna circuit and the non-conductive magnetically permeable layer substantially becomes a dielectric layer. Similarly, a sufficiently thick inlet sheet support located between the antenna circuit and the non-conductive magnetically permeable layer is also substantially a dielectric layer. After all, in order to obtain the effect of the present invention, it is important to select such a structure and the material and thickness of the intermediate layer and the support for the inlet sheet. In addition to these combinations, it is necessary to select in consideration of combinations with parameters such as an IC chip to be used and a frequency of a radio wave to be used.
[0041]
The material of each layer is selected to control the floating capacitance of the intermediate layer and the support for the inlet sheet. Films and papers such as polyethylene, chlorinated polyethylene, polypropylene, polyurethane, acrylic, styrene, PET, PEN, PET-G, ABS, PVC, polyvinyl chloride, EVA, polycarbonate, alloy, etc. Alternatively, a mixture of these materials and commonly used organic or inorganic materials such as silica, calcium carbonate, titanium oxide, and carbon black can also be used. In particular, among these, polypropylene and polyethylene are more preferably used because they have a relatively low dielectric constant and a low cost.
[0042]
Each adhesive layer also functions in principle as a dielectric layer, but since it is usually very thin, its contribution as a dielectric layer is very small.
Further, by including a large amount of voids in the dielectric layer such as the intermediate layer and the support for the inlet sheet, the influence of air having a low dielectric constant can be more strongly affected. Examples of such a material include a film in which a pigment is kneaded and stretched to form a large number of voids, for example, YUPO (synthetic paper manufactured by YUPO Corporation), foamed PET film, paper, foamed paper, nonwoven fabric, cloth, and the like. Is mentioned.
[0043]
(Non-conductive magnetically permeable layer)
The non-conductive magnetically permeable layer plays a role of transmitting a signal from the reader / writer to the antenna circuit by passing the signal through the main layer before being reflected by the conductive layer. As the non-conductive magnetically permeable layer 4, a non-conductive sheet made by kneading metal magnetic powder or flakes having high magnetic permeability into a resin is used. In order to improve the transmission when the signal from the reader / writer is weak, especially the initial permeability μ of the non-conductive magnetically permeable layer _a Is preferably large. Therefore, the initial magnetic permeability μ of the initial non-conductive magnetically permeable layer _a Is greater than 1, preferably 2 or more. In practice, a magnetically permeable metal material having a high magnetic permeability exists discontinuously without being continuously connected. In other words, a layer containing magnetic powder is formed in an island shape with the resin portion as the sea so that electric conductivity does not occur. Here, the electric conductivity means a volume resistance value of 10 ² A value of about Ω · cm is used as a boundary, and a value higher than this value is regarded as non-conductive.
[0044]
This means that if an electrically conductive amorphous alloy sheet is used instead of a non-conductive magnetically permeable layer, for example, radio waves emitted from a reader / writer will be reflected on the conductive amorphous alloy sheet surface, and This is considered to be inconvenient because no signal and power are supplied to the antenna.
Magnetic powder and flakes can be considered as the shape of the magnetically permeable metal material. As specific materials, silicon steel, sendust alloy, Fe-Al alloy, electromagnetic soft iron, amorphous alloy, permalloy, and carbonyl iron can be used.
[0045]
As the sendust / Fe-Al alloy, alpalm, hypermal, sendust, super sendust, or the like is used. As the soft magnetic iron, industrial pure iron, armco steel, low carbon steel, or the like is used. Cobalt-based, iron-based, and nickel-based amorphous alloys can be used. The composition of the amorphous alloy contains Co, Fe, and Ni in a total amount of 70 to 98% by weight as a main component, and contains B, Si, and P in a total amount of 2 to 30% by weight, and further contains Al, Mn, Zr, and Nb. . As the permalloy, 78-Permalloy, 45-Permalloy, 36-Permalloy, Cr-Permalloy, Mo-Permalloy, Supermalloy and the like can be used.
[0046]
The resin which is the other component used for the non-conductive magnetically permeable layer is polyethylene, chlorinated polyethylene, polypropylene, polyurethane, acrylic, styrene, PET, PEN, PET-G, ABS, PVC, PVC, EVA Any resin such as polycarbonate, alloy, and the like, which is generally used by mixing a pigment or the like, can be used.
[0047]
Other materials include auxiliary agents for improving the affinity (adhesion) between the resin and the magnetic powder, and antioxidants, lubricants, release agents, defoamers, wetting agents, curing agents, and UV absorbers. An additive necessary for the manufacturing process or an additive for improving durability and convenience may be included.
[0048]
The method of manufacturing the non-conductive magnetically permeable layer is roughly classified into two methods. One method is to apply a magnetic coating material on a base material sheet, and the other is to knead a magnetic resin into a liquid-like resin by using a device such as a kneader or the like to form a sheet. .
When manufactured by a coating method, the porcelain powder used is a metal powder, and when used as a water-based paint, the metal powder reacts with water. Therefore, coating using a solvent is common. When the non-conductive magnetically permeable layer is formed by coating, the thickness of the non-conductive magnetically permeable layer obtained by one coating is small, and it is necessary to apply the non-conductive magnetically permeable layer many times depending on the type of magnetic powder used.
[0049]
The method of forming the non-conductive magnetically permeable layer into which the resin and the magnetic powder are kneaded can be produced by the same method as that for producing a normal resin film. For example, when the resin is melted by heat and formed into a liquid state to form a sheet, the resin containing the high-temperature magnetic powder is extruded by an extruder or the like, and the sheet is formed into a sheet by uniaxial stretching, biaxial stretching or no stretching. Since 100% of the resin has a high viscosity and is quickly set by cooling, it is easy to produce a thick sheet unlike the coating method.
In addition, by using a magnetic metal powder having good magnetic permeability, the thickness of the non-conductive magnetically permeable layer can be reduced, and when applied to a surface with a curvature, the stress applied to the bonding surface can be reduced. When adhered to a metal surface, it is difficult to peel off over a long period of time.
[0050]
(Conductive layer)
Assuming that the conductive layer 5 is attached to the metal housing, the conductive layer 5 is provided in advance, and the communication performance is improved both in the case where the conductive layer 5 is located on the metal housing and in the case where the metal is not in the surroundings. It is provided so as not to change.
Volume resistance value 10 ² Ωcm or less is defined as having electrical conductivity, as the conductive layer, aluminum, copper, zinc, metal foil such as alloy, silver, copper, metal powder such as alloy dispersed in resin A conductive ink, a carbon sheet, a carbon ink print sheet, a conductive resin sheet, a conductive polymer sheet such as polyacetylene, or the like can be used. More preferably, the volume resistance value is 10 ^-2 A metal conductive layer of about Ω · cm or less can obtain good communication characteristics.
[0051]
The size of each of the above-described layers, the dielectric layer, the non-conductive magnetically permeable layer, and the conductive layer may be a size that substantially overlaps the antenna circuit of the circuit pattern. Normally, each layer is formed into a sheet having substantially the same size as the outer edge of the non-contact IC chip mounting body.
[0052]
[Lamination]
To assemble as a tag, the above constituent materials are bonded together. Since the non-conductive magnetically permeable layer 4 has an effect of blocking a signal from a reader / writer, this tag has a front and a back. When the surface on the inlet sheet side of the non-conductive magnetically permeable layer 4 is taken as the front surface, the opposite surface is the surface on which the adhesive layer 10e that adheres to the adherend is provided and becomes the back surface. Comparing the communication with the reader / writer from the front side and the back side, if the signal of the reader / writer is weak, it may not be possible to read from the back side.
The conductive layer 5 is provided on the back surface side. Since the conductive layer makes the same condition as the state where the tag is always located on the metal, a stable resonance point can be obtained even when the tag is not in contact with the metal surface such as in the metal or in the space.
[0053]
The bonding of the constituent materials may be performed by using sheet-shaped materials or by using materials supplied by rolls.
When using an adhesive or each layer material provided with an adhesive in advance, the release paper is peeled off and bonded with a rubber nip roll or the like so that air does not enter. In this case, care should be taken not to apply more pressure than necessary because the chip is mounted on the inlet sheet. Since various materials are bonded together, several steps are required.
[0054]
When using a hot melt adhesive, it is possible to sandwich a solid adhesive sheet between the materials and bond them at once by hot pressing. In this method, a material having no heat resistance cannot be used.
It is also possible to bond each material while applying an adhesive. It is similar to the method of bonding with an adhesive, but sometimes heat is applied to cure the adhesive. As compared with the method using an adhesive, the adhesive strength between layers can be improved and the thickness unevenness of the inlet sheet can be reduced, but the process becomes complicated and the yield decreases.
In addition, these methods can be combined as appropriate to be bonded.
[0055]
[Punching]
In order to tag one by one from the molded sheet, it can be cut into individual card shapes by a Thomson blade or a male and female blade attached to an electric, pneumatic or hydraulic press.
In such a case, a plastically deformable material such as a metal foil or a thick and soft resin sheet such as a non-conductive magnetically permeable layer is cut at the same time.
[0056]
【Example】
Hereinafter, the present invention will be described more specifically with reference to Examples, but of course, the present invention is not limited thereto.
[0057]
(Example 1)
In Example 1, a non-contact IC tag was manufactured. The first embodiment will be described with reference to FIG. 1 described above. As shown in FIG. 1, a circuit pattern 3 including an aluminum foil loop antenna is provided on an inlet sheet substrate 1 (thickness: 50 μm) using PET by an etching method, and a through-hole portion is further provided as a circuit board. A film-like curable resin layer is temporarily attached to the electrical connection terminals of the circuit board, and the bare IC chips 6 are temporarily placed thereon in a face-down manner, and then the curable resin layer is cured. Used the inlet of the configuration. This inlet was an ISO15693-compliant inlet sheet (trade name: TagIT HFI mini, manufactured by Texas Instruments).
[0058]
Next, a pigment ink-compatible YUPO (inorganic pigment +) in which an adhesive layer was provided on one side having a configuration in which the coating layer 8 and the adhesive layer 10a were combined on the surface on which the inlet chip obtained by the above operation was not mounted. Synthetic paper made of polypropylene) inkjet tack paper (Yupo part thickness 80 μm, inkjet receiving layer thickness 30 μm, adhesive layer thickness 20 μm, manufactured by YUPO CORPORATION) was laminated. An adhesive layer (20 μm in thickness) was formed as an adhesive layer 10b on YUPO (inorganic pigment + synthetic paper made of polypropylene, trade name: SGS110, 110 μm in thickness, manufactured by YUPO Corporation) to be the intermediate layer 2 on the opposite side of the ink jet receiving inlet. The sheets provided were bonded together. A magnetic sheet made by kneading silicon steel powder as a magnetic metal in chlorinated polyethylene to be a non-conductive magnetically permeable layer 4 which has been processed to provide an adhesive layer on both sides as the adhesive layers 10c and 10d (trade name: noise countermeasure sheet PE72) FDK, non-conductive magnetically permeable layer thickness 250 μm, volume resistivity 10 ⁶ Ω · cm, μ _a : 20, each adhesive layer thickness of 45 µm) was attached to the intermediate layer 2. Next, a metal foil sheet (trade name: Aluminum Tape 8166, manufactured by SLIONTEC, aluminum part thickness: 30 μm, in which an aluminum foil serving as the conductive layer 5 has been subjected to an adhesive process as an adhesive layer 10 e and a release paper process as a release paper 13) An adhesive layer thickness of 20 μm) was bonded to the non-conductive magnetically permeable layer.
Next, the sheet obtained as described above was punched into a size of 30 mm × 54 mm with a Thomson blade to obtain a non-contact type IC tag.
In FIGS. 1 and 2, each layer is drawn in parallel. However, especially in the vicinity of the IC 6, since the thickness of the IC is larger than that of the adhesive layer, the coating layer and the intermediate layer may be locally dented. The thickness is absorbed so that the entire surface is processed so as not to have irregularities.
[0059]
(Example 2)
A non-contact IC tag of Example 2 was produced in the same manner as in Example 1 except that the inlet sheet was stacked such that the chip mounting surface was located on the coating layer side.
[0060]
(Comparative Example 1)
A non-contact IC tag was produced in the same manner as in Example 1 except that the intermediate layer 2 and the adhesive layer 10b were not used in producing the non-contact IC tag of Example 1.
[0061]
(Comparative Example 2)
A non-contact IC tag was produced in the same manner as in Example 1 except that the conductive layer 5 and the adhesive layer 10e were not used in the production of the non-contact IC tag of Example 1.
[0062]
(Comparative Example 3)
Instead of a non-conductive magnetically permeable layer, a conductive amorphous alloy ribbon (trade name: amorphous magnetic shield tape, manufactured by Hitachi Ferrite Electronics Co., Ltd., amorphous alloy part thickness 20 μm, adhesive layer thickness 45 μm, volume resistance value 1.3) × 10 ^-6 A non-contact IC tag was produced in the same manner as in Example 1 except that Ω · m) was used.
[0063]
(Evaluation)
The samples prepared in Examples and Comparative Examples were measured by the following method.
[0064]
Communication availability
Communication was performed using the evaluation test apparatus shown in FIGS. The measurement was performed by connecting a weak reader / writer 142 (RI-K10-001A, manufactured by Texas Instruments) to a PC 141 (personal computer). The evaluation test was performed in two states: a case where the non-contact IC tag 103 was affixed on a metal plate 104 (a SUS304 plate having a size of 5 cm square and 1 mm thick) and a case where the non-contact IC tag 103 was free (a state where the string was hung in the air). FIG. 4 shows an outline of an evaluation test apparatus when the apparatus is attached to a metal plate. FIG. 3 shows an outline of the evaluation test apparatus in a state where it is suspended from the support rod (not shown) by the string 101 in the air. In each state, ○ indicates that the data could be read out within a range of 0 to 10 mm between the antenna of the reader / writer and the tag, and X indicates that the data could not be read. The above measurement results are summarized in Table 1 below.
[0065]
[Table 1]

[0066]
【The invention's effect】
The IC chip mounted body of the present invention is an IC chip mounted body including an antenna circuit and an IC, the antenna circuit having the IC connected thereto, a dielectric layer located near the antenna circuit, and a transparent layer located outside the dielectric layer. Since it has a non-conductive magnetically permeable layer containing a magnetic metal material and a conductive layer located further outside the non-conductive and magnetically permeable layer, it is affected by surrounding metal objects, such as on the metal surface and at positions not on the metal surface. Instead, communication is possible at any position.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of one embodiment of a non-contact IC tag of the present invention.
FIG. 2 is a sectional view of another embodiment of the non-contact IC tag of the present invention.
FIG. 3 is a schematic diagram showing an outline of an evaluation test apparatus for evaluating whether or not communication of an IC tag is possible in a free case.
FIG. 4 is a schematic diagram showing an outline of an evaluation test apparatus for evaluating whether communication of an IC tag is possible when the IC tag is attached to a metal plate.
[Explanation of symbols]
1 Inlet sheet support
2 Middle layer
3 Circuit pattern
4 Non-conductive magnetically permeable layer
5 conductive layer
6 IC

Claims (5)

An IC chip mounted body including an antenna circuit and an IC, wherein the antenna circuit is connected to the IC, a dielectric layer located near the antenna circuit, and a non-conductive transparent material including a magnetically permeable metal material located outside the dielectric layer. An IC chip package comprising a magnetic layer and a conductive layer located further outside the non-conductive magnetically permeable layer. 2. The IC chip package according to claim 1, wherein the non-conductive magnetically permeable layer is a layer containing a magnetically permeable metal material in an island shape. 3. The IC chip mounted body according to claim 1, wherein the magnetically permeable metal material is at least one material selected from silicon steel, sendust alloy, Fe-Al alloy, soft magnetic iron, carbonyl iron, amorphous alloy and permalloy. The IC chip package according to any one of claims 1 to 3, wherein the dielectric layer is a support for the inlet sheet substantially located between the antenna circuit and the non-conductive magnetically permeable layer. The IC chip package according to any one of claims 1 to 4, wherein the dielectric layer is an intermediate layer located substantially between the antenna circuit and the non-conductive magnetically permeable layer.

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