JP2019118073A - Vibration device, manufacturing method of vibration device, electronic device, and moving body - Google Patents

Abstract

To provide a vibration device, a manufacturing method of the vibration device, an electronic device, and a moving body capable of reducing mounting stress applied to the vibration element when a package is mounted after the frequency of the vibration element has been adjusted, and reducing frequency fluctuation of the vibration element due to mounting stress.SOLUTION: A vibration device 1 includes a base 51, a first relay board 4 attached to the base, a second relay board 3 attached to the first relay board, and a vibration element 2 disposed so as to sandwich the second relay board between the first relay board and the vibration element and attached to the second relay board. The second relay board is electrically connected to the vibration element, and has a terminal located in a region overlapping the first relay board and not overlapping the vibration element in plan view.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a vibration device, a method of manufacturing the vibration device, an electronic device, and a mobile body.

  The crystal oscillator described in Patent Document 1 includes a package, an IC chip housed in the package, a substrate for measurement, and a crystal vibrating element. In such a crystal oscillator, first, the frequency of the quartz crystal vibrating element is adjusted with the quartz crystal vibrating element fixed to the measurement substrate, and then the frequency of the quartz crystal vibrating element is fixed again with the measuring substrate fixed to the package. Make adjustments.

JP, 2015-195593, A

  However, in such a method of adjusting the frequency of the crystal vibrating element, the frequency of the crystal vibrating element is adjusted in a state where the crystal vibrating element is fixed to the measurement substrate, and then the crystal vibrating element is fixed to fix the measurement substrate to the package. Frequency will fluctuate due to mounting stress. As a result, frequency adjustment of the crystal vibrating element after fixing the package becomes complicated.

  An object of the present invention is to provide a vibration device and a vibration device manufacturing method capable of reducing the mounting stress applied to the vibration device and reducing the frequency fluctuation of the vibration device due to the mounting stress when mounting the package after performing frequency adjustment of the vibration device. , Electronic equipment and mobile.

  The present invention has been made to solve at least a part of the above-mentioned problems, and can be realized as the following application example.

The vibration device of this application example has a base,
A first relay board attached to the base;
A second relay board attached to the first relay board;
And a vibrating element disposed so as to sandwich the second relay board between the first relay board and the second relay board,
The second relay substrate is electrically connected to the vibrating element, and has a terminal located in a region overlapping with the first relay substrate and not overlapping the vibrating element in plan view. It features.
Thereby, the oscillation frequency of the vibrating element can be measured through the terminal of the second relay substrate, and therefore, the frequency adjustment of the vibrating element can be performed. Thereafter, when the first relay substrate is mounted on the base (package), the mounting stress applied to the second relay substrate and the vibrating element is reduced, and the frequency fluctuation of the vibrating element after frequency adjustment is suppressed.

In the vibrating device according to the application example, it is preferable that the terminal is disposed on a surface of the second relay substrate on the vibrating element side.
As a result, the probe (terminal for inspection) can be easily applied to the terminal, and the frequency measurement of the vibrating element can be facilitated.

In the vibration device of this application example, the second relay substrate is
A first portion attached to the first relay substrate;
A second portion in which the vibrating element is disposed;
It is preferable to have the connection part which connects the said 1st part and the said 2nd part.
This makes it difficult for the stress generated due to the deformation of the first relay substrate or the base to be transmitted to the vibrating element. Therefore, the fluctuation of the frequency characteristic of the vibrating element can be suppressed.

In the vibration device of this application example, the connection portion is
The third part,
A first beam portion connecting the first portion and the third portion on a first axis;
It is preferable to have the 2nd beam part which connects the 2nd part and the 3rd part on the 2nd axis which intersects the 1st axis.
As a result, the stress caused by the deformation of the first relay substrate or the base is less likely to be transmitted by the vibrating element. Therefore, it is possible to more effectively suppress the fluctuation of the frequency characteristic of the vibrating element.

In the vibration device of this application example, the first portion has a frame shape,
The third portion has a frame shape and is located inside the first portion,
Preferably, the second portion is located inside the third portion.
Thereby, the second relay board can be miniaturized.

In the vibration device of this application example, the first portion is
It is preferable that the first relay substrate is attached to the first relay substrate via bonding members on both sides with respect to the first axis.
Thus, the second relay substrate is stably supported by the first relay substrate.

In the vibrating device according to this application example, it is preferable that the terminal be disposed so as to overlap the bonding member in plan view.
Thereby, the bending of the 2nd relay substrate at the time of pressing a terminal on a probe can be controlled. Therefore, the stress generated due to the deformation of the second relay substrate at the time of frequency measurement is difficult to be transmitted to the vibrating element, and the frequency measurement of the vibrating element can be performed more accurately.

In the vibration device according to this application example, it is preferable that a bonding portion to be attached to the base of the first relay substrate be disposed in a region not overlapping with the second relay substrate and the vibration element in plan view. .
As a result, it is difficult for the stress generated by the deformation of the base to be transmitted to the second relay substrate and the vibrating element. Therefore, the mounting stress applied to the second relay substrate and the vibrating element is reduced, and the frequency fluctuation of the vibrating element is suppressed.

In the vibration device according to the application example, the lid is joined to the base so as to accommodate the first relay substrate, the second relay substrate, and the vibration element between the base and the first relay substrate. preferable.
Thereby, the first relay substrate, the second relay substrate, and the vibration element can be protected.

In the vibrating device according to the application example, the first relay substrate is preferably a circuit element having a drive circuit of the vibrating element.
Thereby, the vibration element can be easily driven.

In the method of manufacturing the vibration device according to this application example, the second relay board is sandwiched between the first relay board, the second relay board attached to the first relay board, and the first relay board. Preparing a laminated structure having a vibration element disposed on the second relay substrate and disposed on the second relay substrate.
Measuring the frequency of the vibrating element;
The second relay substrate is electrically connected to the vibrating element, and has a terminal located in a region overlapping with the first relay substrate and not overlapping the vibrating element in plan view,
In the step of measuring the frequency of the vibrating element, frequency measurement of the vibrating element is performed through the terminal.
Thus, frequency adjustment becomes possible by measuring the frequency of the vibrating element before being stored in the package. Thereafter, when the first relay substrate is mounted on the base (package), the mounting stress applied to the second relay substrate and the vibrating element is reduced, and the frequency fluctuation of the vibrating element after frequency adjustment is suppressed.

In the method of manufacturing the vibration device of the application example, the method is performed prior to the step of preparing the laminated structure,
It is preferable to have the process of measuring the frequency of the said vibration element in the state which is not supported by the said 2nd relay substrate.
As a result, since the frequency of the vibration element can be measured before it becomes a laminated structure, it is possible to roughly adjust the frequency and to finely adjust the frequency of the vibration element after it becomes a laminated structure. Therefore, the processing amount of the excitation electrode in the state of being a laminated structure can be reduced, and damage to the first relay substrate can be reduced.

In the method of manufacturing a vibrating device according to the application example, the vibrating element includes a vibrating substrate, a first excitation electrode disposed on one of the main surfaces of the vibrating substrate, and a second on the other main surface. And an excitation electrode,
In the step of measuring the frequency of the vibrating element in a state not supported by the second relay substrate, the first excitation electrode is processed,
In the step of measuring the frequency of the vibrating element in the state of the laminated structure, it is preferable to process the second excitation electrode.
Thereby, the first and second excitation electrodes can be processed to adjust the frequency of the vibration element, and the mass difference between them can be reduced. Therefore, the deterioration of the vibration characteristic of the vibration element can be suppressed.

In the method of manufacturing the vibration device of the application example, the method is performed after the step of measuring the frequency of the vibration element in the state of the laminated structure,
Disposing the first relay substrate on a base;
Bonding a lid to the base so as to accommodate the laminated structure between the base and the base.
Thereby, the laminated structure can be protected from moisture, dust, impact and the like.

The electronic device of this application example is characterized by including the vibration device of the above application example.
As a result, the effects of the vibration device of the application example can be obtained, and a highly reliable electronic device can be obtained.

The mobile unit of this application example is characterized by including the vibration device of the above application example.
As a result, the effects of the vibration device of the above application example can be enjoyed, and a highly reliable moving body can be obtained.

It is a sectional view showing a vibration device concerning a 1st embodiment of the present invention. It is a top view which shows the vibration device of FIG. 1 at the time of removing a lid. It is a top view which shows a relay board. It is a bottom view showing a relay board. It is a top view which shows the modification of a relay substrate. It is a top view which shows the modification of a relay substrate. It is a top view which shows a vibration element. It is a bottom view showing a vibration element. It is a figure explaining the cut angle of crystal. It is a perspective view which shows the relationship of the crystallographic axis of a relay substrate and a vibrating element. It is a bottom view showing a lamination structure. It is a flowchart which shows the manufacturing process of the vibration device shown in FIG. It is a top view for explaining the manufacturing method of a vibration device. It is sectional drawing for demonstrating the manufacturing method of a vibration device. It is a side view for explaining the manufacturing method of a vibration device. It is sectional drawing for demonstrating the manufacturing method of a vibration device. It is a perspective view showing a jig used for manufacture of a vibration device. It is sectional drawing for demonstrating the manufacturing method of a vibration device. It is sectional drawing for demonstrating the manufacturing method of a vibration device. It is a perspective view showing the electronic equipment concerning a 2nd embodiment of the present invention. It is a perspective view showing the electronic equipment concerning a 3rd embodiment of the present invention. It is a perspective view showing the electronic equipment concerning a 4th embodiment of the present invention. It is a perspective view showing the mobile concerning a 5th embodiment of the present invention.

  Hereinafter, a vibrating device, a method of manufacturing the vibrating device, an electronic device, and a moving body according to the present invention will be described in detail based on embodiments shown in the attached drawings.

First Embodiment
FIG. 1 is a cross-sectional view showing a vibrating device according to a first embodiment of the present invention. FIG. 2 is a top view of the vibrating device of FIG. 1 with the lid removed. FIG. 3 is a top view showing the relay substrate. FIG. 4 is a bottom view showing the relay board. 5 and 6 are top views showing modified examples of the relay board. FIG. 7 is a top view showing the vibrating element. FIG. 8 is a bottom view showing the vibrating element. FIG. 9 is a diagram for explaining a cut angle of crystal. FIG. 10 is a perspective view showing the relationship between the relay substrate and the crystal axis of the vibrating element. FIG. 11 is a bottom view showing the laminated structure. FIG. 12 is a flow chart showing a manufacturing process of the vibration device shown in FIG. FIG. 13 is a plan view for explaining the method of manufacturing the vibration device. 14 to 16 are cross-sectional views for explaining the method of manufacturing the vibration device. FIG. 17 is a perspective view showing a jig used for manufacturing the vibration device. 18 and 19 are cross-sectional views for explaining the method of manufacturing the vibration device. In the following, for convenience of explanation, the upper side in FIG. 1 is also referred to as “upper”, and the lower side is also referred to as “lower”. Further, the crystal axis of quartz crystal will be described as an X axis (electrical axis), a Y axis (mechanical axis) and a Z axis (optical axis). Moreover, the planar view seen from the up-down direction in FIG. 1 is also only called "planar view" below.

  As shown in FIGS. 1 and 2, the vibration device 1 includes a vibration element 2, a second relay substrate 3, a first relay substrate 4, and a package 5 for housing these. Here, since the first relay substrate 4 is intended to reduce the mounting stress applied to the vibration device 2 when the vibration device 2 and the second relay substrate 3 are mounted on the package 5, An insulating substrate on which the wiring electrode is disposed, for example, a silicon single plate or a silicon laminated plate may be used. In the present embodiment, a circuit element having a drive circuit of the vibration element 2 is used as the first relay substrate 4. Since the circuit element is formed of a silicon substrate, it can sufficiently function as the first relay substrate 4 of the present embodiment. Hereinafter, for convenience of explanation, the first relay substrate 4 is also referred to as “circuit element 4”, and the second relay substrate 3 is also referred to as “relay substrate 3”.

  In the package 5, the relay substrate 3 is located below the circuit element 4, the vibrating element 2 is located below the relay substrate 3, and the circuit element 4, the relay substrate 3 and the vibrating element 2 are in the thickness direction of the package 5 ( In the vertical direction). As described above, by arranging the circuit element 4, the relay substrate 3, and the vibration element 2 in an overlapping manner, the planar spread of the vibration device 1 can be suppressed, and the vibration device 1 can be miniaturized. The vibrating element 2 is attached to the relay substrate 3, the relay substrate 3 is attached to the circuit element 4, and the circuit element 4 is attached to the package 5. Thus, by interposing the relay substrate 3 between the package 5 and the circuit element 4 and the vibrating element 2, for example, deformation (stress) due to thermal deflection or the like of the package 5 or the circuit element 4 is transmitted to the vibrating element 2. This becomes difficult, and the deterioration (variation) of the vibration characteristic of the vibration element 2 can be suppressed. Hereinafter, the laminate of the circuit element 4, the relay substrate 3, and the vibration element 2 is also referred to as a laminate structure 10. Hereinafter, each part of the vibration device 1 will be sequentially described in detail.

[package]
As shown in FIG. 1, the package 5 has a storage space S inside, and in the storage space S, the vibration element 2, the relay substrate 3 and the circuit element 4 are stored. Therefore, the package 5 can suitably protect the vibration element 2, the relay substrate 3 and the circuit element 4 from impact, dust, heat, moisture (water) and the like. Such a package 5 has a lid 52 (lid) joined to the upper surface of the base 51 so as to form a storage space S between the base 51 and the base 51 to which the vibrating element 2, the relay substrate 3 and the circuit element 4 are attached. Body) and.

  The base 51 is in the form of a cavity having a recess 511 opened on the top surface thereof. Further, the recess 511 has a first recess 511 a opened in the upper surface of the base 51 and a second recess 511 b opened in the bottom of the first recess 511 a. On the other hand, the lid 52 is plate-like, and is joined to the upper surface of the base 51 so as to close the opening of the concave portion 511. As described above, the opening of the concave portion 511 is closed by the lid 52 to form the housing space S, and the resonator element 2, the relay substrate 3 and the circuit element 4 are housed in the housing space S. The storage space S is hermetically sealed and is in a reduced pressure state (preferably in a state closer to vacuum). Thereby, the vibration element 2 can be driven stably. However, the atmosphere of the storage space S is not particularly limited, and may be atmospheric pressure, for example.

  It does not specifically limit as a constituent material of the base 51, For example, various ceramics, such as aluminum oxide, can be used. In this case, the base 51 can be manufactured by firing a laminate of ceramic sheets (green sheets). On the other hand, the constituent material of the lid 52 is not particularly limited, but it is preferable that the constituent material of the base 51 and the linear expansion coefficient are similar. For example, when the constituent material of the base 51 is a ceramic as described above, it is preferable to use an alloy such as Kovar.

  The base 51 also has a plurality of internal terminals 53 disposed on the bottom of the first recess 511 a and a plurality of external terminals 54 disposed on the bottom of the base 51. Each of the plurality of internal terminals 53 is electrically connected to a predetermined external terminal 54 through an internal wiring (not shown) formed inside the base 51. The plurality of internal terminals 53 are electrically connected to the circuit element 4 via the conductive connection bumps B1.

[Circuit element]
The circuit element 4 is, for example, a semiconductor circuit board in which various circuit elements are formed on a silicon substrate, and as shown in FIG. 1, the circuit element 4 is disposed in the package 5 with the active surface 40 facing downward. The circuit element 4 is fixed to the upper surface of the first recess 511 a of the package 5 via the conductive connection bump B 1. Further, the circuit element 4 has a plurality of terminals 41, 42 disposed on the active surface 40, and among the plurality of terminals 41, the plurality of terminals 41 are electrically connected to the predetermined internal terminals 53 via the connection bumps B1. Connected. Such a circuit element 4 includes, for example, a drive circuit 49 (oscillation circuit to oscillate) that drives the vibration element 2.

  The connection bump B1 is not particularly limited as long as it has conductivity and bondability, but it is preferable to use, for example, various metal bumps such as gold bumps, silver bumps, and copper bumps. As a result, outgassing from the connection bumps B1 can be prevented, and environmental changes (in particular, pressure increase) in the storage space S can be effectively suppressed.

  The junctions (i.e., the plurality of terminals 41) to be attached to the base 51 of the circuit element 4 overlap the relay substrate 3 and the vibrating element 2 in plan view (plan view from the normal direction of the circuit element 4). It is arranged in the area where As a result, the stress generated by the deformation of the package 5 is less likely to be transmitted to the relay substrate 3 and the vibrating element 2. Therefore, the mounting stress applied to the relay substrate 3 and the vibrating element 2 is reduced, and the frequency fluctuation of the vibrating element 2 is suppressed.

[Relay board]
As shown in FIG. 1, the relay substrate 3 is interposed between the circuit element 4 and the vibrating element 2. The relay substrate 3 mainly has a function of making it difficult to transmit the stress generated by the deformation of the package 5 or the circuit element 4 to the vibrating element 2.

  As shown in FIGS. 3 and 4, the relay substrate 3 includes a substrate 31 and a pair of wires 38 and 39 disposed on the substrate 31. The substrate 31 has a gimbal shape. Specifically, the substrate 31 has a frame-shaped support portion 32 (first portion) fixed to the circuit element 4 and a frame-shaped first swing portion 33 (third portion) located inside the support portion 32. And a second swinging portion 34 (second portion) located inside the first swinging portion 33 and to which the vibrating element 2 is fixed, and a pair connecting the support portion 32 and the first swinging portion 33 The beam portion 35 (first beam portion) and the pair of beam portions 36 (second beam portions) connecting the first swinging portion 33 and the second swinging portion 34 are provided. Among these portions, the first swinging portion 33 and the beam portions 35 and 36, which are portions positioned between the support portion 32 and the second swinging portion 34, are configured by the support portion 32 and the second swinging portion 34. The connection part 37 to connect is comprised.

  The support portion 32 has a rectangular frame shape, and has four edge portions 321, 322, 323, 324. Then, the support portion 32 is active in the circuit element 4 via the two connection bumps B2 at the central portions in the extending direction of the edge portions 321 and 322 facing each other (opposite to the center O). It is fixed to the surface 40. As described above, by fixing both sides of the support portion 32 to the circuit element 4, the posture of the relay substrate 3 is stabilized, and unnecessary displacement, vibration, and the like of the relay substrate 3 can be suppressed. However, the number and the arrangement of the connection bumps B2 are not particularly limited. For example, the connection bumps B2 may be arranged at each corner of the support portion 32 or may be arranged only on one side with respect to the center O.

  The connection bump B2 is not particularly limited as long as it has conductivity and bondability, but it is preferable to use, for example, various metal bumps such as a gold bump, a silver bump, and a copper bump. As a result, outgassing from the connection bumps B2 can be prevented, and environmental changes (in particular, pressure increase) in the storage space S can be effectively suppressed.

  Further, the first swinging portion 33 located inside the support portion 32 has a rectangular frame shape, and has four edge portions 331, 332, 333, and 334. In addition, the second rocking portion 34 located inside the first rocking portion 33 has a rectangular plate shape (single plate shape), and has four edge portions 341, 342, 343, and 344. There is. The vibrating element 2 is fixed to the lower surface of the second swinging portion 34 via the conductive connection bump B3.

  Further, the pair of beam portions 35 are located on both sides of the first swinging portion 33, and connect the first swinging portion 33 and the support portion 32 so as to support the first swinging portion 33 at both ends. There is. Specifically, one beam 35 connects central portions in the extending direction of the edge portions 323 and 333, and the other beam portion 35 connects central portions in the extending direction of the edge portions 324 and 334. Connected Therefore, the first swinging portion 33 can swing around the first axis L1 (a line connecting the pair of beam portions 35) formed by the pair of beam portions 35 with respect to the support portion 32. .

  Further, the pair of beam portions 36 are located on both sides of the second swinging portion 34, and the second swinging portion 34 and the first swinging portion 33 are provided so as to support the second swinging portion 34 in a double support manner. Connected Specifically, one beam portion 36 connects central portions in the extending direction of the edge portions 331 and 341, and the other beam portion 36 connects central portions in the extending direction of the edge portions 332 and 342. Connected Therefore, the second swinging portion 34 is formed of a pair of beam portions 36 with respect to the first swinging portion 33, and a second axis L2 (a line segment connecting the pair of beam portions 36) intersecting the first axis L1. ) Can swing around.

  According to the substrate 31 having such a configuration, it is possible to meander the stress transmission path from the support portion 32 fixed to the circuit element 4 to the second rocking portion 34 to which the vibration element 2 is fixed. And the transmission path can be secured longer. Therefore, the stress generated by the deformation of the package 5 or the circuit element 4 is effectively absorbed / relaxed between the support portion 32 and the second rocking portion 34, and transmitted to the vibration element 2 on the second rocking portion 34. Can be effectively suppressed. Therefore, a change in the drive characteristics of the vibration element 2 (especially, a change in resonance frequency) hardly occurs, and the vibration element 2 can exhibit excellent vibration characteristics.

  In particular, in the present embodiment, the first axis L1 and the second axis L2 are orthogonal to each other in plan view of the relay substrate 3, and the intersection point of the first axis L1 and the second axis L2 is the substrate 31. It coincides with the center O of. Thus, the first swinging portion 33 is supported by the support portion 32 in a well-balanced manner, and the second swinging portion 34 is supported by the first swinging portion 33 in a balanced manner. As a result, the vibration of the vibration element 2 fixed to the second rocking portion 34 can be effectively suppressed.

  Such a substrate 31 is formed by patterning a quartz substrate by etching (in particular, wet etching). In the present embodiment, the substrate 31 is formed of a Z-cut quartz substrate, and the normal lines of both main surfaces of the substrate 31 coincide with the Z axis (optical axis) which is the crystal axis of quartz. The substrate 31 is formed from the Z-cut quartz substrate because the etching preferentially proceeds in comparison with the X axis (electrical axis) and the Y axis (mechanical axis) which are the other crystal axes of quartz, ie, the Z axis (optical axis). Thus, the etching time can be shortened. In addition, since the etching surface (side surface formed by etching) becomes sharper, the relay substrate 3 can be formed with excellent dimensional accuracy. In the present embodiment, although the first axis L1 is parallel to the X axis and the second axis L2 is parallel to the Y axis, the present invention is not limited thereto.

  Thus, by forming the substrate 31 from a quartz substrate, the same material as the vibration substrate 21 of the vibration element 2 can be obtained. Therefore, the thermal expansion coefficients of the substrate 31 and the vibration substrate 21 become equal to each other, and stress is not easily generated in the vibration element 2. However, the substrate 31 is not particularly limited, and quartz substrates other than Z-cut quartz substrates, for example, X-cut quartz substrates, Y-cut quartz substrates, AT-cut quartz substrates, BT-cut quartz substrates, SC-cut quartz substrates, ST-cut quartz It may be formed of a substrate or the like. Further, the substrate 31 is not limited to one formed of a quartz substrate, and may be formed of, for example, a piezoelectric substrate other than quartz, a silicon substrate, a resin substrate, a metal substrate, a ceramic substrate or the like.

  The wiring 38 is mainly routed from the support portion 32 of the substrate 31 to the second swinging portion 34, and one end thereof is a terminal 381 positioned on the support portion 32, and the other end is the second swing portion The terminal 382 is located at 34. Further, the wiring 38 has a terminal 389 located in the middle thereof. Similarly, the wiring 39 is mainly routed from the support portion 32 of the substrate 31 to the second swinging portion 34, and one end thereof is a terminal 391 located in the support portion 32, and the other end is the second The terminal 392 is located at the swinging portion 34. The wiring 39 also has a terminal 399 located in the middle thereof. The terminals 381 and 391 are respectively located on the upper surface of the substrate 31 and electrically connected to the terminals 42 of the circuit element 4 through the connection bumps B2. On the other hand, the terminals 382 and 392 are respectively located on the lower surface of the substrate 31 and electrically connected to the vibrating element 2 through the conductive connection bumps B3. Thus, the relay substrate 3 having the wires 38 and 39 facilitates the electrical connection between the vibration element 2 and the circuit element 4. Terminals 389 and 399 are terminals used to measure the frequency of the vibrating element 2, and these will be described in detail later.

  As mentioned above, although relay board 3 was explained, as composition of relay board 3, it is not limited to the above-mentioned composition. For example, as shown in FIG. 5, in the substrate 31, the first swinging portion 33 and the beam portion 36 are omitted, and the second swinging portion 34 is connected to the support portion 32 via the beam portion 35. It may be That is, the connection portion 37 may be configured by the beam portion 35. Also by such a configuration, the stress transmission path can be secured as long as possible. Therefore, the stress generated by the deformation of the package 5 or the circuit element 4 is effectively absorbed / relaxed between the support portion 32 and the second rocking portion 34, and transmitted to the vibration element 2 on the second rocking portion 34. Can be effectively suppressed.

  Further, as shown in FIG. 6, the substrate 31 may have a single plate shape instead of the gimbal shape. Moreover, although the support part 32 and the 1st rocking | fluctuation part 33 each comprise cyclic | annular form, the one part of the circumferential direction may be missing. The first and second axes L1 and L2 may not be orthogonal (that is, they may intersect at an angle other than 90 °), and the intersection of the first and second axes L1 and L2 is , And may not coincide with the center O of the substrate 31. Further, one of the pair of beam portions 35 may be omitted, and one of the pair of beam portions 36 may be omitted. Further, in the present embodiment, the first rocking portion 33 is rockable with respect to the support portion 32, and the second rocking portion 34 is rockable with respect to the first rocking portion 33. For example, the beam portion 35 may be hard, and the first swinging portion 33 may not be able to swing relative to the support portion 32. The beam portion 36 may be substantially hard. The second swinging portion 34 may not be able to swing with respect to the first swinging portion 33.

[Vibration element]
The vibrating element 2 has a vibrating substrate 21 and an electrode 22 disposed on the vibrating substrate 21 as shown in FIGS. 7 and 8. The vibrating substrate 21 is made of a piezoelectric material, and in particular, is made of quartz in the present embodiment. As a result, the vibration element 2 having excellent frequency temperature characteristics as compared to other piezoelectric materials can be obtained. The piezoelectric material is not limited to quartz, and for example, lithium niobate (LiNbO ₃ ), lithium tantalate (LiTaO ₃ ), lead zirconate titanate (PZT), lithium tetraborate (Li ₂ B ₄ O) ₇ ), langasite (La ₃ Ga ₅ SiO ₁₄ ), potassium niobate (KNbO ₃ ), gallium phosphate (GaPO ₄ ), gallium arsenide (GaAs), aluminum nitride (AlN), zinc oxide (ZnO, Zn ₂ O) ₃ ), barium titanate (BaTiO ₃ ), lead titanate (PbPO ₃ ), sodium potassium niobate ((K, Na) NbO ₃ ), bismuth ferrite (BiFeO ₃ ), sodium niobate (NaNbO ₃ ), titanate bismuth _{(Bi 4 Ti 3 O 12)} , bismuth sodium titanate _{(Na 0.5} i _0.5 may be TiO ₃₎ or the like.

  The vibrating substrate 21 has a thickness shear vibration mode, and in the present embodiment, is formed of an AT-cut quartz substrate. As shown in FIG. 9, the AT-cut quartz substrate is a “rotated Y-cut quartz substrate” cut along a plane obtained by rotating the XZ plane about the X axis by an angle θ (= 35 ° 15 ′). Since the AT-cut quartz substrate has third-order frequency temperature characteristics, forming the vibrating substrate 21 from the AT-cut quartz substrate results in the vibrating element 2 having excellent temperature characteristics. In the following, the Y-axis and the Z-axis rotated about the X-axis in correspondence with the angle θ will be referred to as the Y′-axis and the Z′-axis. That is, the vibration substrate 21 has a thickness in the Y ′ axis direction and a spread in the XZ ′ plane direction.

  The electrode 22 has an excitation electrode 221 disposed on the upper surface of the vibration substrate 21 and an excitation electrode 222 disposed on the lower surface opposite to the excitation electrode 221. Further, the electrode 22 electrically connects a pair of terminals 223 and 224 disposed on the upper surface of the vibrating substrate 21, a wiring 225 electrically connecting the terminal 223 and the excitation electrode 221, a terminal 224 and the excitation electrode 222. And a wire 226 connected to the Then, by applying a drive signal (alternating voltage) between the excitation electrodes 221 and 222, the vibration substrate 21 vibrates in a thickness shear manner.

  Such a vibration element 2 is fixed to the second swinging portion 34 of the relay substrate 3 via the pair of conductive connection bumps B3. Further, the terminal 223 of the vibrating element 2 and the terminal 382 of the relay substrate 3 are electrically connected via one connection bump B3, and the terminal 224 of the vibrating element 2 and the terminal 392 of the relay substrate 3 are the other. They are electrically connected via the connection bumps B3. Therefore, the vibrating element 2 is electrically connected to the circuit element 4 through the wirings 38 and 39 of the relay substrate 3.

  As mentioned above, although the vibration element 2 was demonstrated, the structure of the vibration element 2 is not limited to the above-mentioned structure. For example, the vibration element 2 may have a mesa shape in which the vibration area of the vibration substrate 21 (the area between the excitation electrodes 221 and 222) protrudes from the periphery, or conversely, the vibration area is from the periphery It may be a recessed reverse mesa type. In addition, bevel processing for grinding the periphery of the vibrating substrate 21 or convex processing for forming the upper surface and the lower surface as convex surfaces may be applied. The vibrating element 2 is not limited to one vibrating in the thickness shear vibration mode, and may be, for example, a vibrating element 2 in which a plurality of vibrating arms bend and vibrate in the in-plane direction (tuning fork vibration). The vibrating arm may be a vibrating element 2 that vibrates in an out-of-plane direction (walk vibration).

  As described above, the substrate 31 of the relay substrate 3 and the vibration substrate 21 of the vibration element 2 are both made of quartz, but in the vibration device 1, as shown in FIG. The crystal axes of the substrate 21 are offset from each other. That is, the X-axis of the substrate 31 extends in a direction different from the X-axis of the vibrating substrate 21, the Y-axis of the substrate 31 extends in a direction different from the Y-axis of the vibrating substrate 21, and the Z-axis of the substrate 31 corresponds to the vibrating substrate 21. Extends in a direction different from the Z axis of Thus, for example, mechanical resonance points (resonance frequencies) of the vibrating substrate 21 and the substrate 31 can be separated as compared with the case where the crystal axes of the vibrating substrate 21 and the substrate 31 coincide with each other. Therefore, it is possible to suppress occurrence of unintended vibration in the relay substrate 3 by resonating with the vibration of the vibration element 2, and the vibration characteristic of the vibration element 2 is lowered by the vibration of the relay substrate 3. Can be suppressed.

  In particular, in the present embodiment, the X axis of the substrate 31 is inclined about both the Y axis and the Z axis with respect to the X axis of the vibrating substrate 21, and the Y axis of the substrate 31 is the Y of the vibrating substrate 21. The Z axis of the substrate 31 is tilted about both the X axis and the Y axis with respect to the Z axis of the vibration substrate 21 with respect to the axis. That is, the crystal axis of the substrate 31 and the crystal axis of the vibrating substrate 21 are in a relation of torsion. Therefore, the above-described effect becomes more remarkable, and the mechanical resonance point (resonance frequency) between the vibration substrate 21 and the substrate 31 can be further separated. Therefore, it is possible to more effectively suppress the occurrence of unintended vibrations in relay board 3 in resonance with the vibration of vibrating element 2, and the vibration characteristic of vibrating element 2 is degraded by the vibration of relay board 3. Can be more effectively suppressed.

  The relationship between the crystal axes of the substrate 31 and the vibrating substrate 21 is not particularly limited. For example, two of the X, Y, and Z axes of the substrate 31 correspond to the corresponding axes of the vibrating substrate 21. As long as they are inclined, the remaining one axis may coincide with each other. In addition, the X axis, the Y axis, and the Z axis of the substrate 31 may coincide with the X axis, the Y axis, and the Z axis of the vibrating substrate 21, respectively.

  The relay substrate 3 will be described again. As shown in FIG. 11, the relay substrate 3 has terminals 389 and 399 disposed on the lower surface (the surface on the side where the vibration element 2 is disposed). The terminal 389 is formed as a part of the wiring 38, and the terminal 399 is formed as a part of the wiring 39. Therefore, the terminals 389 and 399 are electrically connected to the vibrating element 2 respectively.

  The terminals 389 and 399 each function as a frequency measurement terminal used to measure the frequency of the vibrating element 2. In this manner, by arranging the terminals 389 and 399 for frequency measurement on the relay substrate 3, for example, in a state where the vibration element 2 is joined to the circuit element 4 via the relay substrate 3 (state of the laminated structure 10) Since the oscillation frequency can be monitored by driving the vibration element 2 using the terminals 389 and 399, the frequency of the vibration element 2 can be adjusted in this state. Therefore, the frequency adjustment of the vibration element 2 can be finished before placing in the package 5, and thereafter, when the circuit element 4 is mounted on the base 51 (package 5), mounting stress applied to the relay substrate 3 and the vibration element 2 This reduces the frequency fluctuation of the vibrating element 2 after frequency adjustment. Further, even if the frequency of the vibration element 2 is out of the specification, the package 5 is not wasted. Therefore, according to the vibration device 1, the manufacturing cost can be reduced.

  Further, the terminals 389 and 399 are disposed on the lower surface of the substrate 31 in a plan view of the relay substrate 3 so as to overlap with the circuit element 4 and not to overlap with the vibrating element 2. In the present embodiment, the terminals 389 and 399 are disposed in a region outside the vibrating element 2 on the lower surface of the substrate 31 in plan view of the relay substrate 3. As a result, when measuring the frequency of the vibrating element 2, the probe can be easily pressed against the terminals 389 and 399 without being disturbed by the circuit element 4 or the vibrating element 2. Therefore, measurement of the resonant frequency of the vibration element 2 can be easily performed.

  The terminal 389 is disposed at the edge 321 of the support 32, and the terminal 399 is disposed at the edge 322 of the support 32. Thus, by arranging the terminals 389 and 399 in the support portion 32, the terminals 389 and 399 can be sufficiently separated from the vibrating element 2 in a plan view. Therefore, it becomes easier to press the probe on the terminals 389 and 399. In particular, in the present embodiment, the terminals 389 and 399 overlap with the connection bumps B2 in plan view. As a result, the terminals 389 and 399 are supported by the connection bump B2, and bending (deformation) of the relay substrate 3 when the probe is pressed against the terminals 389 and 399 can be suppressed. Therefore, when the frequency of the vibration element 2 is measured, it is possible to effectively suppress the stress (stress which is not generated in the state of the vibration device 1) generated due to the deformation of the relay substrate 3 being applied to the vibration element 2 be able to. Therefore, the frequency measurement of the vibrating element 2 can be performed with high accuracy.

  However, the arrangement of the terminals 389 and 399 is not particularly limited. For example, both of the terminals 389 and 399 may be arranged at the edge 321 or both. Further, the terminals 389 and 399 may be disposed at the edge portions 323 and 324, may be disposed at the first swinging portion 33, or may be disposed at the second swinging portion 34. .

  The vibration device 1 has been described above. As described above, such a vibration device 1 includes the base 51, the circuit element 4 (first relay board) attached to the base 51, and the relay board 3 (second relay) attached to the circuit element 4. The relay substrate 3 is disposed between the substrate and the circuit element 4 so as to sandwich the relay substrate 3, and includes the vibration element 2 attached to the relay substrate 3. Further, the relay substrate 3 is electrically connected to the vibrating element 2 and has terminals 389 and 399 positioned in a region overlapping the circuit element 4 and not overlapping the vibrating element 2 in plan view. According to such a configuration, since the vibration element 2 can be driven via the terminals 389 and 399 to monitor the oscillation frequency, vibration is performed before the vibration element 2 (laminated structure 10) is housed in the package 5 The frequency of the element 2 can be adjusted. Thereafter, when the circuit element 4 is mounted on the base 51 (package 5), mounting stress applied to the relay substrate 3 and the vibrating element 2 is reduced, and the frequency fluctuation of the vibrating element 2 after frequency adjustment is suppressed. Further, even if the frequency of the vibration element 2 is out of specification, at least the package 5 is not wasted. Therefore, according to the vibration device 1, the manufacturing cost can be reduced. Further, by providing the terminals 389 and 399, the terminal 41 may not be used when adjusting the frequency of the vibration element 2. Therefore, the contamination of the terminal 41 is suppressed, and the electrical connection between the terminal 41 and the internal terminal 53 can be made favorable. The terminals 389 and 399 may be located outside the vibrating element 2 in plan view as a region that does not overlap the vibrating element 2 in plan view.

  Further, as described above, the terminals 389 and 399 are disposed on the surface (lower surface) of the relay substrate 3 on the side of the vibrating element 2. As a result, when adjusting the frequency of the vibrating element 2, the probe can be easily pressed against the terminals 389 and 399 without being disturbed by the circuit element 4 or the vibrating element 2. Therefore, adjustment of the resonant frequency of the vibrating element 2 can be easily performed.

  Further, as described above, the relay substrate 3 includes the support portion 32 (first portion) attached to the circuit element 4 and the second swing portion 34 (second portion) in which the vibration element 2 is disposed. And a connection portion 37 connecting the support portion 32 and the second swinging portion 34. Thereby, the transmission path of the stress from the support part 32 to the 2nd rocking part 34 can be lengthened. Therefore, stress generated by deformation of the base 51 and the circuit element 4 is effectively absorbed / relaxed between the support portion 32 and the second rocking portion 34, and transmitted to the vibration element 2 on the second rocking portion 34. Can be effectively suppressed. Therefore, a change in the drive characteristics of the vibration element 2 (especially, a change in resonance frequency) hardly occurs, and the vibration element 2 can exhibit excellent vibration characteristics.

  In particular, in the present embodiment, the connection portion 37 includes the beam portion 35 (third portion) which connects the first swing portion 33 (third portion), the support portion 32 and the first swing portion 33 on the first axis L1. 1 beam portion), and a beam portion 36 (second beam portion) connecting the first swinging portion 33 and the second swinging portion 34 on a second axis L2 intersecting the first axis L1. ing. Thereby, since the transmission path of the stress from the support portion 32 to the second rocking portion 34 can be made to meander, the transmission path becomes longer. Therefore, stress generated by deformation of the base 51 is more effectively absorbed and relaxed between the support portion 32 and the second rocking portion 34, and transmitted to the vibrating element 2 on the second rocking portion 34. It can be effectively suppressed. Therefore, the change of the drive characteristic of the vibration element 2 (especially the fluctuation of the resonance frequency) is less likely to occur, and the vibration element 2 can exhibit more excellent vibration characteristics.

  In addition, as described above, the support portion 32 has a frame shape, and the first swinging portion 33 has a frame shape, and is positioned inside the support portion 32, and the second swing portion 34 has a first shape. It is located inside the rocking portion 33. As a result, the first and second rocking portions 33 and 34 can be disposed in a space-saving manner, and the relay substrate 3 can be miniaturized. However, the configuration of the relay substrate 3 is not limited to this. For example, the first and second swinging portions 33 and 34 may be disposed outside the support portion 32.

  Further, as described above, the support portion 32 is attached to the circuit element 4 via the connection bumps B2 (bonding member) on both sides with respect to the first axis L1 in the direction intersecting the first axis L1. There is. Thus, the relay substrate 3 is supported by the circuit element 4 in a stable posture. Therefore, the posture of the vibration element 2 is stabilized, and the vibration characteristic is improved.

  Further, as described above, the terminals 389 and 399 are disposed to overlap with the connection bump B2 in plan view. As a result, the terminals 389 and 399 are supported by the connection bump B2, and bending (deformation) of the relay substrate 3 when the probe is pressed against the terminals 389 and 399 can be suppressed. Therefore, when the frequency adjustment of the vibration element 2 is performed, it is possible to effectively suppress the stress (stress which is not generated in the state of the vibration device 1) generated due to the deformation of the relay substrate 3 being applied to the vibration element 2 be able to. Therefore, the frequency adjustment of the vibrating element 2 can be performed with high accuracy.

  Further, as described above, the bonding portions (the plurality of terminals 41) to be attached to the base 51 of the circuit element 4 are disposed in a region not overlapping with the relay substrate 3 and the vibrating element 2 in plan view. As a result, the stress generated by the deformation of the package 5 is less likely to be transmitted to the relay substrate 3 and the vibrating element 2. Therefore, the mounting stress applied to the relay substrate 3 and the vibrating element 2 is reduced, and the frequency fluctuation of the vibrating element 2 is suppressed.

  Further, as described above, the vibration device 1 is joined to the base 51 so as to house the circuit element 4, the relay substrate 3 and the vibration element 2 (the laminated structure 10) between the base 51 and the lid 52 ( Have a lid). Thereby, the circuit element 4, the relay substrate 3 and the vibrating element 2 (laminated structure 10) can be suitably protected from impact, dust, heat, moisture (water) and the like.

  Further, as described above, in the vibration device 1, the first relay substrate is the circuit element 4 including the drive circuit 49 of the vibration element 2. Thereby, the vibration element 2 can be driven easily.

  Next, a method of manufacturing the above-described vibration device 1 (a method of adjusting the frequency of the vibration element 2) will be described. In the method of manufacturing the vibration device 1, as shown in FIG. 12, a wafer preparation step S1 of preparing a wafer 20 on which the vibration element 2 is formed, and a first frequency measurement of measuring the frequency of the vibration element 2 in the wafer 20 state. Step S2; separating step S3 for separating the vibrator element 2 from the wafer 20; laminated structure forming step S4 for arranging the vibrator element 2 on the circuit element 4 via the relay substrate 3; It has a second frequency measurement step S5 of measuring the frequency of the element 2, a laminated structure fixing step S6 of arranging the laminated structure 10 on the base 51, and a lid bonding step S7 of bonding the lid 52 to the base 51. ing. Each of these steps will be sequentially described below.

[Wafer preparation step S1]
First, a thin wafer 20 made of an AT-cut quartz plate is prepared, and the wafer 20 is patterned by etching (dry etching, wet etching or the like) to form a plurality of vibration substrates 21 in the wafer 20. Next, a metal film is formed on the surface of the vibrating substrate 21, and the metal film is patterned by etching (dry etching, wet etching or the like) to form the electrode 22 on the vibrating substrate 21. Thereby, as shown in FIG. 13, the wafer 20 in which the some vibration element 2 was formed is obtained. In the state of the wafer 20, the electrode 22 is drawn from the vibrating element 2 to the portion of the frame supporting the vibrating element 2, and the probe (electrode pin) is applied to the portion to vibrate the vibrating element on the wafer 20. It is designed to be able to drive two.

[First Frequency Measurement Step S2]
Next, the frequency of each vibrating element 2 is measured on the wafer 20, and the frequency adjustment of each vibrating element 2 is performed according to the result. Specifically, as shown in FIG. 14, the excitation electrode 221 is irradiated with the ion beam IB through the mask M, and a part of the excitation electrode 221 is removed (film thickness is reduced), so that the frequency of the vibrating element 2 is obtained. Adjust the The irradiation of the ion beam IB is preferably performed while applying a drive signal to the vibrating element 2 through the probe to drive the vibrating element 2 and measuring the resonant frequency of the vibrating element 2. As a result, the resonance frequency of the vibration element 2 can be easily adjusted to a predetermined value. The method of measuring the resonant frequency of the vibrating element 2 is not particularly limited. For example, while changing the frequency of the drive signal applied to the vibrating element 2 with an FFT analyzer, the amplitude of the vibrating element 2 is The resonant frequency of the vibrating element 2 can be measured by measuring with a velocity flow velocity meter.

  The frequency adjustment amount of the vibration element 2 in this step is not particularly limited, but for example, when the difference between the resonance frequency of the vibration element 2 before adjustment and the target resonance frequency is Δf [Hz], 0.25 Δf It is preferably not less than 0.75 Δf, more preferably not less than 0.4 Δf and not more than 0.6 Δf, and still more preferably 0.5 Δf. Thereby, in this process, the frequency of the vibrating element 2 can be sufficiently adjusted. In addition, the frequency adjustment in this process is prevented from being excessive, and the frequency of the vibration element 2 can be more reliably matched with the target frequency in the second frequency measurement process S5 to be performed later.

  In the present embodiment, the frequency of the vibrating element 2 is adjusted by irradiating the ion beam IB to the excitation electrode 221 and removing a part of the excitation electrode 221. However, the present invention is not limited to this. The frequency of the vibration element 2 may be adjusted by irradiating the excitation electrode 222 to remove the part of the excitation electrode 222, or by irradiating the ion beam IB to both of the excitation electrodes 221 and 222 to excite the excitation electrode 221. , 222 may be removed to adjust the frequency of the vibration element 2. Further, in the present embodiment, the excitation electrode 221 is irradiated with the ion beam IB while measuring the resonant frequency of the vibrating element 2, but the present invention is not limited thereto. For example, a process of measuring the resonant frequency of the vibrating element 2 The step of irradiating the excitation electrode 221 with the ion beam IB may be repeated alternately.

[Separating step S3]
Next, the vibrating element 2 is broken from the wafer 20 and the vibrating element 2 is detached from the wafer 20. However, the method of separating the vibration element 2 from the wafer 20 is not particularly limited, and may be cut, for example.

[Laminated Structure Forming Step S4]
Next, as shown in FIG. 15, the vibrating element 2 is fixed to the relay substrate 3 via the connection bumps B3, and the relay substrate 3 is fixed to the circuit element 4 via the connection bumps B2. Thereby, the laminated structure 10 in which the circuit element 4, the relay substrate 3 and the vibration element 2 are laminated is obtained. The vibrating element 2 is fixed to the relay substrate 3 such that the excitation electrode 221 faces the circuit element 4 side. Thus, the excitation electrode 222 can be irradiated with the ion beam IB in the subsequent second frequency measurement step S5, so the excitation electrodes 221 and 222 are processed in a well-balanced manner by the first and second frequency measurement steps S2 and S5. can do.

[Second Frequency Measurement Step S5]
Next, the frequency of the vibrating element 2 is measured in the state of the laminated structure 10, and the frequency adjustment of the vibrating element 2 is performed according to the result. For example, the reason why the frequency of the vibrating element 2 is not adjusted to a predetermined value in the first frequency measurement step S2 is that the vibrating element 2 is fixed to the relay board 3 and the relay board 3 is fixed to the circuit element 4. This is because mounting stress may occur and the frequency of the vibrating element 2 may change. By performing this process, the frequency of the vibrating element 2 can be adjusted more accurately.

  In this step, as shown in FIG. 16, the excitation electrode 222 is irradiated with the ion beam IB through the mask M, and a part of the excitation electrode 222 is removed (film thickness is reduced). adjust. Moreover, this process is performed in the state which mounted the laminated structure 10 in the jig | tool 9 as shown in FIG. 17, for example. The jig 9 has a probe 91, and when the laminated structure 10 is placed on the jig 9, the probe 91 is in contact with the terminals 389 and 399 of the relay substrate 3. Further, the jig 9 has an opening 92 for avoiding contact with the vibration element 2. According to such a jig 9, since a drive signal can be applied to the vibrating element 2 via the probe 91, frequency adjustment of the vibrating element 2 can be easily performed. As described above, since the terminals 389 and 399 are disposed in a region not overlapping the vibrating element 2, the laminated structure 10 has a structure in which the probes 91 can be easily brought into contact with the terminals 389 and 399.

  The irradiation of the ion beam IB is preferably performed while applying a drive signal to the vibrating element 2 via the probe 91 to drive the vibrating element 2 and measuring the resonant frequency of the vibrating element 2. As a result, the resonance frequency of the vibration element 2 can be easily adjusted to a predetermined value. In addition, it does not specifically limit as a measuring method of the resonant frequency of the vibrating element 2, For example, the same method as 1st frequency measurement process S2 mentioned above can be used.

  Here, since the frequency of the vibrating element 2 is adjusted to some extent in the first frequency measurement step S2, the amount of frequency adjustment in this step is reduced, and the attack on the relay substrate 3 and the circuit element 4 by the ion beam IB is correspondingly Is reduced. Therefore, damage to the relay substrate 3 and the circuit element 4 can be reduced, and breakage (failure) of the relay substrate 3 and the circuit element 4 can be effectively suppressed.

  The excitation electrode 221 is processed in the first frequency measurement step S2, and the excitation electrode 222 is processed in the second frequency measurement step S5. Thus, the excitation electrodes 221 and 222 can be processed in a well-balanced manner, and the mass difference between the excitation electrodes 221 and 222 can be reduced. Therefore, the vibration element 2 capable of stable driving can be obtained. In particular, the frequency adjustment of about 0.5 Δf is performed in the first frequency measurement step S2, and the frequency adjustment of the remaining 0.5 Δf is performed in the second frequency measurement step, so that the mass difference between the excitation electrodes 221 and 222 is It can be further reduced.

  In the present embodiment, the frequency of the vibrating element 2 is adjusted by irradiating the ion beam IB to the excitation electrode 222 and removing a part of the excitation electrode 222. However, the present invention is not limited to this. The frequency of the vibrating element 2 may be adjusted by irradiating the excitation electrode 221 with a part of the excitation electrode 221 to remove the part of the excitation electrode 221. In this case, the vibrating element 2 may be fixed to the relay substrate 3 so that the excitation electrode 222 faces the circuit element 4 in the laminated structure forming step S4. Further, in the present embodiment, the excitation electrode 222 is irradiated with the ion beam IB while measuring the resonant frequency of the vibrating element 2, but the present invention is not limited thereto. For example, a process of measuring the resonant frequency of the vibrating element 2 The step of irradiating the excitation electrode 222 with the ion beam IB may be repeated alternately.

[Laminated structure fixing step S6]
Next, as shown in FIG. 18, the circuit element 4 is fixed to the base 51 via the connection bumps B1. As described above, since the vibrating element 2 is fixed to the circuit element 4 via the relay substrate 3, stress from the base 51 or the circuit element 4 is not easily applied to the vibrating element 2. Therefore, it is difficult to change the frequency of the vibration element 2 by fixing the circuit element 4 to the base 51 (it is a slight amount even if it changes), and after fixing the circuit element 4 to the base 51, the frequency of the vibration element 2 is further There is no need to adjust. Therefore, it is possible to finish adjusting the frequency of the vibrating element 2 before fixing the vibrating element 2 to the base 51. Even if the frequency of the vibrating element 2 is out of specification, discarding at the stage of the laminated structure 10 And at least the base 51 is not wasted. Therefore, according to such a manufacturing method, the manufacturing cost of the vibration device 1 can be reduced.

[Lid bonding step S7]
Next, as shown in FIG. 19, the lid 52 is joined to the base 51. Thereby, the package 5 which accommodates the laminated structure 10 is formed, and the vibration device 1 is obtained.

  Heretofore, the manufacturing method of the vibration device 1 has been described. As described above, the method of manufacturing such a vibration device 1 is arranged so as to sandwich the relay substrate 3 between the circuit element 4, the relay substrate 3 attached to the circuit element 4, and the circuit element 4. The step of preparing the laminated structure 10 having the resonator element 2 attached to the relay substrate 3 (the laminated structure forming step S4) and the step of measuring the frequency of the resonator element 2 (the second frequency measuring step S5 ) And. Further, the relay substrate 3 is electrically connected to the vibrating element 2 and has terminals 389 and 399 positioned in a region overlapping the circuit element 4 and not overlapping the vibrating element 2 in plan view. Then, in the step of measuring the frequency of the vibrating element 2 (second frequency measuring step S5), the frequency measurement of the vibrating element 2 is performed via the terminals 389 and 399. According to such a method, since the vibration element 2 can be driven via the terminals 389 and 399 to monitor the oscillation frequency, vibration is performed before the vibration element 2 (laminated structure 10) is accommodated in the package 5 The frequency of the element 2 can be adjusted. Thereafter, when the circuit element 4 is mounted on the base 51 (package 5), mounting stress applied to the relay substrate 3 and the vibrating element 2 is reduced, and the frequency fluctuation of the vibrating element 2 after frequency adjustment is suppressed. Even if the frequency of the vibration element 2 is out of specification, it can be discarded before fixing to the base 51, and at least the base 51 is not wasted. Therefore, according to such a manufacturing method, the manufacturing cost of the vibration device 1 can be reduced. Further, the terminals 389 and 399 do not have to be used in the second frequency measurement step S5. Therefore, the contamination of the terminal 41 is suppressed, and in the laminated structure fixing step S6, the terminal 41 and the internal terminal 53 can be electrically connected more reliably and at low resistance.

  Further, as described above, the method of manufacturing the vibration device 1 is performed prior to the laminated structure forming step S4 of preparing the laminated structure 10, and the frequency of the vibration element 2 is not supported by the relay substrate 3 It has 1st frequency measurement process S2 to measure. As a result, the amount of frequency adjustment in the second frequency measurement step S5 is reduced, and the attack on the relay substrate 3 and the circuit element 4 by the ion beam IB is reduced accordingly. Therefore, damage to the relay substrate 3 and the circuit element 4 received in the second frequency measurement step S5 can be reduced, and damage (failure) of the relay substrate 3 and the circuit element 4 can be effectively suppressed.

  Further, as described above, the vibration element 2 is arranged on the vibration substrate 21 and the excitation electrode 221 (first excitation electrode) arranged on one main surface of the vibration substrate 21 and the other main surface. And an excitation electrode 222 (second excitation electrode). And in 1st frequency measurement process S2 which measures the frequency of vibration element 2 in the state where it is not supported by relay board 3, excitation electrode 221 is processed and the frequency of vibration element 2 is measured in the state of laminated structure 10 In the second frequency measurement step S5, the excitation electrode 222 is processed. Thus, the excitation electrodes 221 and 222 can be processed in a well-balanced manner, and the mass difference between the excitation electrodes 221 and 222 can be reduced. Therefore, the vibration element 2 capable of stable driving can be obtained.

  Further, as described above, the method of manufacturing the vibration device 1 is performed after the second frequency measurement step S5 of measuring the frequency of the vibration element 2 in the state of the laminated structure 10, and places the circuit element 4 on the base 51. It has a lid bonding step S7 of bonding the lid 52 (lid) to the base 51 so as to store the multilayer structure 10 between the stacked structure fixing step S6 and the base 51. Thereby, the laminated structure 10 can be protected from moisture, dust, impact, and the like.

Second Embodiment
Next, an electronic device according to a second embodiment of the present invention will be described.

  FIG. 20 is a perspective view showing an electronic device according to a second embodiment of the present invention.

  A mobile type (or notebook type) personal computer 1100 shown in FIG. 20 is an application of an electronic device provided with the vibration device of the present invention. In this figure, the personal computer 1100 comprises a main unit 1104 having a keyboard 1102 and a display unit 1106 having a display unit 1108. The display unit 1106 is rotated relative to the main unit 1104 via a hinge structure. It is mounted movable. Such a personal computer 1100 incorporates, for example, a vibrating device 1 used as an oscillator.

  Such a personal computer 1100 (electronic device) has the vibration device 1. Therefore, the effects of the vibration device 1 described above can be obtained, and high reliability can be exhibited.

Third Embodiment
Next, an electronic device according to a third embodiment of the present invention will be described.

  FIG. 21 is a perspective view showing an electronic device according to a third embodiment of the present invention.

  A mobile phone 1200 (including a PHS) shown in FIG. 21 is an application of an electronic device provided with the vibration device of the present invention. The mobile phone 1200 includes an antenna (not shown), a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206. A display unit 1208 is disposed between the operation button 1202 and the earpiece 1204. . Such a mobile phone 1200 incorporates, for example, a vibrating device 1 used as an oscillator.

  Such a mobile phone 1200 (electronic device) includes the vibration device 1. Therefore, the effects of the vibration device 1 described above can be obtained, and high reliability can be exhibited.

Fourth Embodiment
Next, an electronic device according to a fourth embodiment of the present invention will be described.

  FIG. 22 is a perspective view showing an electronic device according to a fourth embodiment of the present invention.

  The digital still camera 1300 shown in FIG. 22 is an application of an electronic device provided with the vibration device of the present invention. A display unit 1310 is provided on the back of the case (body) 1302, and is configured to perform display based on an imaging signal from a CCD, and the display unit 1310 functions as a finder for displaying an object as an electronic image. A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the rear side in the drawing) of the case 1302. Then, when the photographer confirms the subject image displayed on the display unit 1310 and presses the shutter button 1306, the imaging signal of the CCD at that time is transferred and stored in the memory 1308. Such a digital still camera 1300 incorporates, for example, the vibration device 1 used as an oscillator.

  Such a digital still camera 1300 (electronic device) has the vibration device 1. Therefore, the effects of the vibration device 1 described above can be obtained, and high reliability can be exhibited.

  The electronic device according to the present invention may be, for example, a smartphone, a tablet terminal, a watch (including a smart watch), an inkjet discharge device (for example, an inkjet printer), in addition to the personal computer, the mobile phone and the digital still camera described above. Laptop type personal computers, TVs, wearable terminals such as HMDs (head mounted displays), video cameras, video tape recorders, car navigation devices, pagers, electronic organizers (including communication functions), electronic dictionaries, calculators, electronic game devices , Word processor, work station, video phone, television monitor for crime prevention, electronic binoculars, POS terminal, medical equipment (eg electronic thermometer, sphygmomanometer, blood glucose meter, electrocardiogram measuring device, ultrasound diagnostic device, electronic endoscope), Group detector, various measuring instruments, mobile terminal the base station equipment, instruments (e.g., gages for vehicles, aircraft, and ships), a flight simulator, a network server or the like.

Fifth Embodiment
Next, a mobile unit according to a fifth embodiment of the present invention will be described.

  FIG. 23 is a perspective view showing a mobile unit according to the fifth embodiment of the present invention.

  An automobile 1500 shown in FIG. 23 is an automobile to which a mobile body provided with the vibration device of the present invention is applied. The automobile 1500 incorporates, for example, the vibration device 1 used as an oscillator. The vibration device 1 is, for example, keyless entry, immobilizer, car navigation system, car air conditioner, antilock brake system (ABS), air bag, tire pressure monitoring system (TPMS: Tire Pressure Monitoring System), engine control, hybrid The present invention can be widely applied to electronic control units (ECUs) such as battery monitors of automobiles and electric vehicles, and vehicle attitude control systems.

  Such a car 1500 (mobile body) has the vibration device 1. Therefore, the effects of the vibration device 1 described above can be obtained, and high reliability can be exhibited.

  The moving body is not limited to the car 1500, and can be applied to, for example, an airplane, a ship, an AGV (unmanned carrier), a biped robot, an unmanned airplane such as a drone, and the like.

  The vibration device, the method of manufacturing the vibration device, the electronic device, and the moving body according to the present invention have been described above based on the illustrated embodiments, but the present invention is not limited to this. It can be replaced with any configuration having a function. In addition, any other component may be added to the present invention. The present invention may be a combination of any two or more configurations (features) of the above-described embodiments.

  In the above-described embodiment, the configuration in which the vibration device is applied to the oscillator has been described. However, the present invention is not limited thereto. For example, the vibration device may be applied to a physical quantity sensor capable of detecting physical quantities such as acceleration and angular velocity. . In this case, an element having a drive vibration mode and a detection vibration mode excited according to the received physical quantity is used as the vibration element 2, and the circuit element 4 drives the vibration element 2 in the drive vibration mode. A drive circuit and a detection circuit for detecting a physical quantity based on a signal obtained from the detection vibration mode of the vibration element 2 may be formed.

  DESCRIPTION OF SYMBOLS 1 ... vibration device, 10 ... laminated structure, 2 ... vibration element, 20 ... wafer, 21 ... vibration substrate, 22 ... electrode, 221, 222 ... excitation electrode, 223, 224 ... terminal, 225, 226 ... wiring, 3 ... Relay substrate, 31 ... substrate, 32 ... support portion, 321, 322, 323, 324 ... edge portion, 33 ... first swing portion, 331, 332, 333, 334 ... edge portion, 34 ... second swing portion, 341, 342, 343, 344: edge, 35, 36: beam, 37: connection, 38: wiring, 381, 382, 389, terminals, 39: wiring, 391, 392, 399, terminals, 4: circuit Element 40 40 active surface 41 42 terminal 49 drive circuit 5 package 51 base 51 511 concave portion 511 a first concave portion 511 b second concave portion 52 lid 53 internal terminal , 54 ... external terminal, 9 ... recovery , 91: probe, 92: opening, 1100: personal computer, 1102: keyboard, 1104: main body, 1106: display unit, 1108: display, 1200: mobile phone, 1202: operation button, 1204: earpiece, 1206 ... A mouthpiece, 1208 ... display unit, 1300 ... digital still camera, 1302 ... case, 1304 ... light receiving unit, 1306 ... shutter button, 1308 ... memory, 1310 ... display unit, 1500 ... automobile, B1, B2, B3 ... connection Bump, IB: Ion beam, L1: First axis, L2: Second axis, M: Mask, O: Center, S: Storage space, S1: Wafer preparation process, S2: First frequency measurement process, S3: Detachment process , S4: stacked structure forming step, S5: second frequency measurement step, S6: stacked structure fixing step, 7 ... lid bonding process, theta ... angle

Claims (16)

Base and
A first relay board attached to the base;
A second relay board attached to the first relay board;
And a vibrating element disposed so as to sandwich the second relay board between the first relay board and the second relay board,
The second relay substrate is electrically connected to the vibrating element, and has a terminal located in a region overlapping with the first relay substrate and not overlapping the vibrating element in plan view. Vibration device to feature.   The vibration device according to claim 1, wherein the terminal is disposed on a surface of the second relay substrate on the vibration element side. The second relay board is
A first portion attached to the first relay substrate;
A second portion in which the vibrating element is disposed;
The vibration device according to claim 1, further comprising: a connection portion connecting the first portion and the second portion. The connection is
The third part,
A first beam portion connecting the first portion and the third portion on a first axis;
The vibration device according to claim 3, further comprising: a second beam portion connecting the second portion and the third portion on a second axis intersecting the first axis. The first portion has a frame shape,
The third portion has a frame shape and is located inside the first portion,
The vibration device according to claim 4, wherein the second portion is located inside the third portion. The first part is
The vibration according to any one of claims 3 to 5, wherein the vibration is a direction intersecting with the first axis, and is attached to the first relay substrate via bonding members on both sides with respect to the first axis. device.   The vibrating device according to claim 6, wherein the terminal is disposed so as to overlap the bonding member in a plan view.   The junction part for attaching to the said base of the said 1st relay substrate is arrange | positioned in planar view in the area | region which does not overlap with the said 2nd relay substrate and the said vibration element in any one of Claim 1 thru | or 7 Vibration device as described.   The lid according to any one of claims 1 to 8, further comprising a lid joined to the base so as to accommodate the first relay substrate, the second relay substrate, and the vibration element between the base and the first relay substrate. Vibration device according to.   The vibration device according to any one of claims 1 to 9, wherein the first relay substrate is a circuit element having a drive circuit of the vibration element. The second relay board is disposed so as to be held between the first relay board, the second relay board attached to the first relay board, and the first relay board, and is attached to the second relay board Preparing a laminated structure having a vibrating element,
Measuring the frequency of the vibrating element;
The second relay substrate is electrically connected to the vibrating element, and has a terminal located in a region overlapping with the first relay substrate and not overlapping the vibrating element in plan view,
In the step of measuring the frequency of the vibrating element, the frequency measurement of the vibrating element is performed through the terminal. It is performed prior to the step of preparing the laminated structure,
The method of manufacturing a vibrating device according to claim 9, comprising the step of measuring the frequency of the vibrating element in a state of being not supported by the second relay substrate. The vibration element includes a vibration substrate, a first excitation electrode disposed on one main surface of the vibration substrate, and a second excitation electrode disposed on the other main surface,
In the step of measuring the frequency of the vibrating element in a state not supported by the second relay substrate, the first excitation electrode is processed,
The method of manufacturing a vibrating device according to claim 12, wherein the second excitation electrode is processed in the step of measuring the frequency of the vibrating element in the state of the laminated structure. After the step of measuring the frequency of the vibrating element in the state of the laminated structure,
Disposing the first relay substrate on a base;
The method according to any one of claims 11 to 13, further comprising the step of: bonding a lid to the base so as to store the laminated structure between the base and the base.   An electronic device comprising the vibration device according to any one of claims 1 to 10.   A movable body comprising the vibration device according to any one of claims 1 to 10.

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