JP2015088792A - Vibrator, base substrate manufacturing method, oscillator, electronic device, and moving body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vibrator, a base substrate manufacturing method, an oscillator, an electronic apparatus and a moving body, capable of reducing damage of a vibration element.SOLUTION: A vibrator 1 includes a vibration element 2 and a base substrate 51 disposed opposite to the vibration element 2. The base substrate 51 further includes a recess part 511 disposed on the principal plane of the vibration element 2 side and an extension part 512 extending inside the recess part 511. The extension part 512 is disposed to overlap with a free end part of the vibration element 2 in the plan view of the base substrate 51.

Description

  The present invention relates to a vibrator, a method for manufacturing a base substrate, an oscillator, an electronic device, and a moving body.

Conventionally, vibrators using quartz have been known. Such a vibrator is widely used as a reference frequency source, a transmission source, and the like of various electronic devices because of excellent frequency temperature characteristics.
For example, the vibrator described in Patent Document 1 includes a tuning fork type vibration element and a package that accommodates the vibration element. The package includes a base substrate and a lid, and the base substrate has a recess for securing a necessary gap with the vibration element.

By forming such a recess, for example, even when an external force in the thickness direction is applied to the vibrator due to a drop impact or the like, and the vibration element is bent in the thickness direction, the vibration element does not contact the base, The vibration element can be prevented from being damaged by the contact. However, not contacting the base substrate means that excessive deformation in the thickness direction of the vibration element is allowed, and the vibration element may be damaged by this excessive deformation.
Therefore, the vibrator of Patent Document 1 has a problem that it is impossible to prevent the vibration element from being damaged.

JP 2011-41069 A

  An object of the present invention is to provide a vibrator, a method for manufacturing a base substrate, an oscillator, an electronic device, and a moving body that can reduce breakage of a vibration element.

SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.
[Application Example 1]
The vibrator according to this application example includes a vibrating element including one end and the other end opposite to the one end in plan view;
A base substrate to which the one end side of the vibration element is attached;
Including
The base substrate is
A recess provided in the main surface on the vibration element side;
A projecting portion projecting into the recess;
Have
The overhanging portion is arranged to overlap the other end side of the vibration element in a plan view of the base substrate.
Thereby, a vibrator capable of reducing breakage of the vibration element is obtained.

[Application Example 2]
In the vibrator according to this application example, it is preferable that in the overhang portion, the main surface and the inner surface of the recess overlap each other in a plan view of the base substrate.
Thereby, the structure of an overhang | projection part becomes easy.
[Application Example 3]
In the vibrator according to this application example, it is preferable that the thickness of the protruding portion is thinner than the thickness of the proximal end portion.
Thereby, the front-end | tip part of an overhang | projection part can be made easy to bend.

[Application Example 4]
In the vibrator according to this application example, it is preferable that a buffer portion is provided in the overhang portion.
Thereby, the breakage of the vibration element can be reduced more effectively.
[Application Example 5]
In the vibrator of this application example, it has a convex portion provided in the concave portion,
The concave portion is preferably positioned so as to overlap the other end side of the vibration element in a plan view of the base substrate.
Thereby, the breakage of the vibration element can be reduced more effectively.

[Application Example 6]
In the vibrator according to this application example, the vibration element includes a base and a vibrating arm extending from the base.
The vibrating arm is provided with a bottomed groove extending along the extending direction, and an adjustment film for mass adjustment disposed on the tip side opposite to the base,
In a plan view of the base substrate, it is preferable that a region between the adjustment film and the groove overlaps the protruding portion.
Thereby, breakage of the vibration element (particularly peeling of the adjustment film) can be reduced more effectively.

[Application Example 7]
In the vibrator according to this application example, the vibration element includes a base and a vibrating arm extending from the base.
The vibrating arm is provided with a bottomed groove extending along the extending direction, and an adjustment film for mass adjustment disposed on the tip side opposite to the base,
In a plan view of the base substrate, a region between the adjustment film and the groove overlaps with the overhang portion, and the mass adjustment portion of the adjustment film is between the overhang portion and the convex portion. It is preferable to overlap with the region.
Thereby, breakage of the vibration element (particularly peeling of the adjustment film) can be reduced more effectively.

[Application Example 8]
In the vibrator according to this application example, it is preferable that the base substrate is made of a glass material.
As a result, the base substrate can be manufactured at low cost and the overhang portion can be easily formed.

[Application Example 9]
The base substrate manufacturing method of this application example includes a step of forming a recess on one surface of the substrate;
Removing the side surface of the concave portion so as to squeeze, and forming an overhanging portion projecting into the concave portion.
Thereby, when the vibration element is supported on the surface on which the concave portion is formed such that the tip portion faces the concave portion, damage to the vibration element can be reduced.

[Application Example 10]
In the base substrate manufacturing method according to this application example, it is preferable that in the step of forming the overhang portion, the overhang portion is formed by wet etching the substrate.
Thereby, an overhang | projection part can be formed easily.
[Application Example 11]
The oscillator of this application example includes the vibrator of this application example,
And a circuit.
Thereby, a highly reliable oscillator can be obtained.

[Application Example 12]
An electronic apparatus according to this application example includes the vibrator according to this application example.
As a result, a highly reliable electronic device can be obtained.
[Application Example 13]
The moving body according to this application example includes the vibrator according to this application example.
Thereby, a mobile body with high reliability is obtained.

1 is a cross-sectional view showing a vibrator according to a first embodiment of the present invention. FIG. 2 is a top view of the vibrator shown in FIG. 1. 2A and 2B are diagrams for explaining electrode arrangement of a vibration element included in the vibrator illustrated in FIG. 1, in which FIG. 2A is a top view and FIG. It is the sectional view on the AA line in FIG. FIG. 2 is a cross-sectional view for explaining functions of a recess and an overhang formed in a base substrate included in the vibrator shown in FIG. 1. FIG. 2 is a cross-sectional view for explaining functions of a recess and an overhang formed in a base substrate included in the vibrator shown in FIG. 1. FIG. 8 is a cross-sectional view for explaining the method for manufacturing the vibrator shown in FIG. 1. FIG. 8 is a cross-sectional view for explaining the method for manufacturing the vibrator shown in FIG. 1. FIG. 8 is a cross-sectional view for explaining the method for manufacturing the vibrator shown in FIG. 1. FIG. 8 is a cross-sectional view for explaining the method for manufacturing the vibrator shown in FIG. 1. It is sectional drawing which shows the vibrator | oscillator concerning 2nd Embodiment of this invention. FIG. 12 is a plan view of the vibrator shown in FIG. 11. FIG. 6 is a cross-sectional view showing a vibrator according to a third embodiment of the invention. FIG. 14 is a plan view of the vibrator shown in FIG. 13. It is a top view which shows the vibrator | oscillator which concerns on 4th Embodiment of this invention. It is sectional drawing which shows the vibrator | oscillator concerning 5th Embodiment of this invention. It is sectional drawing which shows the vibrator | oscillator which concerns on 6th Embodiment of this invention. It is sectional drawing which shows the vibrator | oscillator concerning 7th Embodiment of this invention. FIG. 19 is a plan view showing the vibrator shown in FIG. 18. FIG. 19 is a partial enlarged cross-sectional view of the vibrator illustrated in FIG. 18. It is sectional drawing which shows suitable embodiment of the oscillator of this invention. 1 is a perspective view illustrating a configuration of a mobile (or notebook) personal computer to which an electronic apparatus of the present invention is applied. It is a perspective view which shows the structure of the mobile telephone (PHS is also included) to which the electronic device of this invention is applied. It is a perspective view which shows the structure of the digital still camera to which the electronic device of this invention is applied. It is a perspective view which shows the motor vehicle to which the mobile body of this invention is applied.

Hereinafter, a vibrator, a method for manufacturing a base substrate, an oscillator, an electronic device, and a moving body of the present invention will be described in detail based on embodiments shown in the accompanying drawings.
1. Resonator <First Embodiment>
FIG. 1 is a cross-sectional view showing a vibrator according to the first embodiment of the present invention. FIG. 2 is a top view of the vibrator shown in FIG. 3A and 3B are diagrams for explaining the electrode arrangement of the vibration element included in the vibrator shown in FIG. 1, in which FIG. 3A is a top view and FIG. 4 is a cross-sectional view taken along line AA in FIG. FIG. 5 and FIG. 6 are cross-sectional views for explaining the functions of the concave portion and the protruding portion formed in the base substrate of the vibrator shown in FIG. 7 to 10 are cross-sectional views for explaining a method of manufacturing the vibrator shown in FIG. In FIGS. 1 and 2, for convenience of explanation, illustration of electrodes included in the vibration element is omitted.
As shown in FIG. 1, the vibrator 1 includes a vibration element 2 and a package 5 that houses the vibration element 2. Hereinafter, the vibration element 2 and the package 5 will be sequentially described in detail.

-Vibration element-
As shown in FIGS. 2 and 3, the vibration element 2 includes a piezoelectric substrate 3 and an electrode 4 formed on the surface of the piezoelectric substrate 3.
Examples of the constituent material of the piezoelectric substrate 3 include piezoelectric materials such as quartz, lithium tantalate, and lithium niobate. Among these, it is preferable to use quartz as the constituent material of the piezoelectric substrate 3. By using quartz, the vibration element 2 having excellent frequency temperature characteristics as compared with other materials can be obtained. Hereinafter, a case where the piezoelectric substrate 3 is made of quartz will be described.

  The piezoelectric substrate 3 has a plate shape that extends in the XY plane defined by the Y axis (mechanical axis) and the X axis (electrical axis), which are crystal axes of the quartz substrate, and has a thickness in the Z axis (optical axis) direction. I am doing. That is, the piezoelectric substrate 3 is composed of a Z-cut quartz plate. The Z-axis preferably coincides with the thickness direction of the piezoelectric substrate 3, but is slightly (for example, less than about 15 °) with respect to the thickness direction from the viewpoint of reducing the frequency temperature change near room temperature. You may tilt.

  Such a piezoelectric substrate 3 has a tuning fork shape, and includes a base portion 31 and a pair of vibrating arms 32 and 33 extending from the base portion 31. The base 31 has a plate shape having a spread in the XY plane and having a thickness in the Z-axis direction. On the other hand, the vibrating arms 32 and 33 extend in the + Y-axis direction from the base 31 so as to be aligned in the X-axis direction and parallel to each other. Each of the vibrating arms 32 and 33 has a longitudinal shape, and a base end thereof is a fixed end connected to the base portion 31 and a tip end thereof is a free end. Further, wide hammer heads 321 and 331 are provided at the distal ends of the vibrating arms 32 and 33.

  Also, bottomed grooves 322 and 332 extending in the Y-axis direction are formed on the upper surfaces of the vibrating arms 32 and 33, and the bottom surfaces of the vibrating arms 32 and 33 are provided to extend in the Y-axis direction. Bottom grooves 323 and 333 are formed. By providing the grooves 322, 323, 332, 333, the thermoelastic loss is reduced and the vibration characteristics of the vibration element 2 are improved. These grooves 322, 323, 332, and 333 have base ends extending to the vicinity of the base portion 31, and distal ends extending to the vicinity of the hammer heads 321 and 331. As described above, when the tips of the grooves 322, 323, 332, 333 extend to the vicinity of the hammer heads 321, 331, the stress concentration around the tips of the grooves 322, 323, 332, 333 is alleviated and an impact is applied. The risk of breakage and chipping that occurs during the process is reduced. Further, when the base ends of the grooves 322, 323, 332, 333 extend to the vicinity of the base portion 31, stress concentration around the boundary portion between the vibrating arms 32, 33 and the base portion 31 is alleviated. Therefore, for example, the risk of breakage or chipping that occurs when an impact is applied is reduced.

As shown in FIGS. 3A and 3B, the electrode 4 includes a drive signal electrode 41, a drive ground electrode 42, a drive signal terminal 43, and a drive ground terminal 44.
The drive signal electrode 41 is formed on the upper and lower surfaces (inner peripheral surfaces of the grooves 322 and 323) of the vibrating arm 32. Further, the drive signal electrode 41 is formed on both side surfaces of the vibrating arm 33. The drive signal electrodes 41 formed on both side surfaces of the vibrating arm 33 are electrically connected via a conductive portion formed at the tip of the hammer head 331. The conductive portion formed on the hammer head 331 functions as an adjustment film 45 for adjusting the frequency of the vibration element 2 by adjusting the mass of the vibration arm 33. The adjustment film 45 is formed integrally with the drive signal electrode 41.
The drive signal terminal 43 is formed on the lower surface of the base 31. The drive signal terminal 43 is electrically connected to the drive signal electrode 41 via a drive signal wiring formed on the base 31.

  The driving ground electrode 42 is formed on the upper and lower surfaces (inner peripheral surfaces of the grooves 332 and 333) of the vibrating arm 33. Further, the drive ground electrode 42 is formed on both side surfaces of the vibrating arm 32. The drive ground electrodes 42 formed on both side surfaces of the vibrating arm 32 are electrically connected via a conductive portion formed at the tip of the hammer head 321. The conductive portion formed on the hammer head 321 functions as an adjustment film 46 for adjusting the frequency of the vibration element 2 by adjusting the mass of the vibration arm 32. The adjustment film 46 is formed integrally with the drive ground electrode 42.

The drive ground terminal 44 is formed on the lower surface of the base 31. The drive ground terminal 44 is electrically connected to the drive ground electrode 42 via a drive ground wiring formed on the base 31.
When a drive signal is applied between the drive signal terminal 43 and the drive ground terminal 44, an electric field is generated between the drive signal electrode 41 and the drive ground electrode 42 formed on the vibration arms 32 and 33, and each vibration arm It vibrates in so-called “X reverse phase mode” so that 32 and 33 repeat to approach and separate from each other.
The structure of the electrode 4 (including the adjustment films 45 and 46) is not particularly limited as long as it has conductivity, but for example, a metallized layer (underlayer) such as Cr (chromium) or W (tungsten) It can be composed of a metal film in which films such as Ni (nickel), Au (gold), Ag (silver), and Cu (copper) are laminated.

−Package−
The package 5 includes a plate-shaped base substrate 51 and a box-shaped lid (lid body) 52 having a recess 521 that opens downward. The base substrate 51 and the lid 52 are joined together, whereby the opening of the recess 521 is closed by the base substrate 51. The package 5 has an airtight housing space S formed by closing the recess 521 with the base substrate 51, and the vibration element 2 is housed in the housing space S. For example, the inside of the accommodation space S may be in a reduced pressure (preferably vacuum) state, or an inert gas such as nitrogen, helium, or argon may be enclosed.

The base substrate 51 and the lid 52 are preferably made of various glass materials such as quartz glass, soda lime glass, Tempax glass, and Pyrex glass (where “Pyrex” is a registered trademark). According to the glass material, the base substrate 51 and the lid 52 with good shape accuracy can be manufactured easily and inexpensively.
When the base substrate 51 and the lid 52 are made of a glass material, anodic bonding can be used as a method for bonding them. In the case of using anodic bonding, as shown in FIG. 1, a bonding film 53 made of a material capable of anodic bonding such as aluminum or silicon is disposed between the base substrate 51 and the lid 52.

  As shown in FIG. 4, connection terminals 611 and 621 are formed on the upper surface of the base substrate 51, and mounting terminals 612 and 622 are formed on the lower surface. Further, through electrodes 613 and 623 that penetrate the base substrate 51 in the thickness direction are formed in the base substrate 51, and the connection terminals 611 and the mounting terminals 612 are electrically connected by the through electrodes 613. Thus, the connection terminal 621 and the mounting terminal 622 are electrically connected. The connection terminals 611 and 621, the mounting terminals 612 and 622, and the through electrodes 613 and 623 are not particularly limited as long as they have conductivity. For example, Cr (chrome), Ni (nickel), It can be constituted by a metal film in which a film such as Au (gold), Ag (silver), or Cu (copper) is laminated on a base layer such as W (tungsten).

The vibration element 2 is fixed to the base substrate 51 at the base 31 with conductive adhesives 63 and 64. That is, the vibration element 2 is cantilevered by the base substrate 51. The conductive adhesive 63 is provided in contact with the drive signal terminal 43 and the connection terminal 611, whereby the drive signal terminal 43 and the connection terminal 611 are electrically connected. Similarly, the conductive adhesive 64 is provided in contact with the drive ground terminal 44 and the connection terminal 621, whereby the drive ground terminal 44 and the connection terminal 621 are electrically connected.
The conductive adhesives 63 and 64 are not particularly limited as long as they have adhesiveness and conductivity. For example, conductive fillers such as metal fillers (metal particles such as silver particles and copper particles) and carbon fibers are used. A mixed silicone-based, epoxy-based, acrylic-based, polyimide-based adhesive or the like can be used.

  In addition, the base substrate 51 includes a recess 511 that opens to the upper surface, and an overhang 512 that protrudes into the recess 511. As shown in FIG. 2, the recess 511 has the tip ends (the other end side) of the vibrating arms 32 and 33 in a plan view of the base substrate 51 (a plan view from the Z-axis direction; hereinafter simply referred to as a plan view). ) Inside. As shown in FIG. 5, the concave portion 511 has vibrating arms 32, 33 when an external force in the Z-axis direction is applied to the vibrator 1 due to, for example, an impact at the time of dropping, and the vibrating element 2 is bent in the Z-axis direction. And an escape portion for avoiding contact with the base substrate 51. As a result, it is possible to prevent (or reduce) damage to the vibrating arms 32 and 33 due to contact with the base substrate 51.

  Further, as illustrated in FIG. 2, the overhanging portion 512 is provided so as to protrude from the outer edge portion of the concave portion 511 on the −Y axis side toward the + Y axis side. As shown in FIG. 1, the overhanging portion 512 has an upper surface 512a and a lower surface 512b that protrude into the recess 511 and overlap each other in plan view. The upper surface 512 a is configured by the upper surface of the base substrate 51, and the lower surface 512 b is configured by the inner peripheral surface of the recess 511.

  The lower surface 512b is inclined with respect to the XY plane (a plane including the X axis and the Y axis), and an angle θ formed by the upper surface 512a and the lower surface 512b is an acute angle (less than 90 °). Therefore, the overhanging portion 512 gradually decreases in thickness (length in the Z-axis direction) toward the distal end side that is the opening side, and is more distal than the proximal end portion that is opposite to the opening side (opening portion). Side) is thinner. In particular, the distal end portion of the overhang portion 512 is sufficiently thin and easily bent in the Z-axis direction. In order to make the overhanging portion 512 easily bendable in the Z-axis direction, the thickness of the tip portion of the overhanging portion 512 is preferably 50 μm or less, although it depends on the material of the base substrate 51. Moreover, the said front-end | tip part can be prescribed | regulated as a range of about 100 micrometers from the front-end | tip of the overhang | projection part 512, for example.

  The overhanging portion 512 is provided at a position overlapping the distal end portions of the vibrating arms 32 and 33 in plan view. Further, the tip 512c of the overhanging portion 512 overlaps the region S2 between the adjustment film 45 of the hammer head 321 and the grooves 322 and 323 and the region S3 between the adjustment film 46 of the hammer head 331 and the grooves 332 and 333. In the position. Such an overhanging portion 512 functions as a restricting portion that restricts the bending of the vibration element 2 in the Z-axis direction.

  That is, as shown in FIG. 5, for example, when an external force in the Z-axis direction is applied to the vibrator 1 due to an impact at the time of dropping or the like, and the vibration element 2 is bent in the Z-axis direction, the vibrating arms 32 and 33 are excessively Prior to deformation, the tip of the overhang 512 is contacted. Therefore, breakage and breakage due to excessive deformation of the vibrating arms 32 and 33 can be effectively prevented. Furthermore, when the vibrating arms 32 and 33 hit the overhanging portion 512, the tip of the overhanging portion 512 is bent in the Z-axis direction as shown in FIG. Therefore, breakage and breakage of the vibrating arms 32 and 33 due to contact with the overhanging portion 512 can be effectively prevented. In this way, by providing the overhanging portion 512, it is possible to effectively prevent the vibrating arms 32 and 33 from being destroyed or damaged.

  In particular, in the present embodiment, since the tip 512c of the overhanging portion 512 is provided at a position overlapping the areas S2 and S3 of the hammer heads 321 and 331 in plan view, the vibration element 2 has the Z-axis as described above. When bent in the direction, the regions S <b> 2 and S <b> 3 come into contact with the tip of the overhanging portion 512. As described above, since the electrode 4 (including the adjustment films 45 and 46) is not formed in the regions S2 and S3, the electrode 4 may be damaged even if the regions S2 and S3 come into contact with the overhanging portion 512. Absent. Furthermore, since the regions S2 and S3 are wider than the base end portions of the vibrating arms 32 and 33 and the grooves 322, 323, 332, and 333 are not formed, the regions of the vibrating arms 32 and 33 that have high mechanical strength. It is. Therefore, the vibrating arms 32 and 33 can be more effectively prevented from being damaged by bringing the regions S2 and S3 into contact with the overhanging portion 512.

The vibrator 1 has been described above.
Next, a method for manufacturing the vibrator 1 will be described. The method for manufacturing the vibrator 1 includes a first step for facilitating the base substrate 51 and the lid 52, a second step for mounting the vibration element 2 on the base substrate 51, and a third step for bonding the lid 52 to the base substrate 51. And a fourth step of dividing the plurality of vibrators 1 into individual pieces.

[First step]
First, a method for manufacturing the base substrate 51 will be described. The method of manufacturing the base substrate 51 includes a step of forming the recess 511 on one surface of the substrate 510, a step of removing the side surface of the recess 511 so as to crawl and forming an overhanging portion 512 that projects into the recess 511, Forming the electrode 4.
First, as shown in FIG. 7A, a substrate 510 made of a glass material is facilitated. The substrate 510 has a wafer shape, and a plurality of base substrates 51 can be obtained from the substrate 510. The substrate 510 is previously adjusted to a predetermined thickness (the thickness of the base substrate 51) by a process such as polishing.

Next, as shown in FIG. 7B, a mask M <b> 1 having openings corresponding to the recesses 511 is formed on the upper surface and the lower surface of the substrate 510. The mask M1 can be formed using a photolithography technique and an etching technique. Next, as shown in FIG. 7C, the substrate 510 is wet etched to form a recess 511.
Next, after removing the mask M1, as shown in FIG. 7D, a mask M2 having an opening on the side surface on the −Y axis side of the recess 511 is formed. The mask M2 can be formed using a photolithography technique and an etching technique. Next, as shown in FIG. 8A, the substrate 510 is wet-etched and removed so as to cover a part of the side surface of the recess 511, thereby forming an overhanging portion 512 thereon. Here, by performing wet etching in this step, a sufficiently thin overhanging portion 512 can be easily formed using the isotropy of etching of the glass material.

  Next, for example, a first through hole for forming the through electrodes 613 and 623 and a second through hole for hermetic sealing are formed by laser processing, etching, or the like, and the inside of the first through hole is made of a metal material. Through electrodes 613 and 623 are formed by filling. Further, the connection terminals 611 and 621 are formed on the upper surface of the substrate 510, and the mounting terminals 612 and 622 are formed on the lower surface. For example, the connection terminals 611 and 621 and the mounting terminals 612 and 622 are formed by forming a metal film on the upper and lower surfaces of the substrate 510 by sputtering, vapor deposition, or the like, and patterning the metal film using a photolithography technique and an etching technique. Can be formed.

Next, a bonding film 53 for anodic bonding is formed on the upper surface of the substrate 510. The bonding film 53 can be formed, for example, by forming a metal film made of aluminum or silicon on the upper surface of the substrate 510 by sputtering, vapor deposition, or the like, and patterning the metal film using a photolithography technique and an etching technique. . However, the bonding film 53 may be formed on the lid 52 side.
As described above, as shown in FIG. 8B, a substrate 510 integrally including a plurality of base substrates 51 is obtained.

Next, a method for manufacturing the lid 52 will be described.
First, as shown in FIG. 9A, a lid substrate 520 made of a glass material is facilitated. The lid substrate 520 has a wafer shape, and a plurality of lids 52 can be obtained from the lid substrate 520. The lid substrate 520 is adjusted in advance to a predetermined thickness (the thickness of the lid 52) by processing such as polishing.

Next, as shown in FIG. 9B, a mask M <b> 3 having openings corresponding to the recesses 521 is formed on the upper and lower surfaces of the lid substrate 520. The mask M3 can be formed using a photolithography technique and an etching technique. Next, as shown in FIG. 9C, the lid substrate 520 is wet-etched to form a recess 521.
As described above, the lid substrate 520 integrally including the plurality of lids 52 is obtained.

[Second step]
Next, the vibration element 2 is mounted on the substrate 510 using the conductive adhesives 63 and 64 as shown in FIG. In this state, as described above, the concave portion 511 is positioned so as to include the tip ends of the vibrating arms 32 and 33 in the plan view, and the projecting portion 512 is connected to the tip portions of the vibrating arms 32 and 33 in plan view. It is provided so that it may overlap.

[Third step]
Next, as shown in FIG. 10B, the lid substrate 520 and the substrate 510 are anodically bonded so that the vibration element 2 is accommodated in the recess 521 of the lid substrate 520. Next, although not shown, the housing space S is brought into a vacuum state (or a gas-filled state) through the second through-hole for hermetic sealing formed in the substrate 510, and the sealing made of Au—Ge is used. The second through hole is closed with a stopper or the like. Thereby, the accommodation space S is hermetically sealed and maintained in a predetermined atmosphere.

[Fourth step]
Next, as shown in FIG. 10C, the plurality of vibrators 1 are separated into pieces using laser processing or a dicing saw.
Thereafter, if necessary, the adjustment films 45 and 46 are irradiated with laser through the lid 52, and a part of the adjustment films 45 and 46 is removed to adjust the mass of the vibrating arms 32 and 33, thereby vibrating. The drive frequency of the element 2 may be adjusted.
Thus, the vibrator 1 is obtained.
In the above-described manufacturing method, the wafer-like substrate 510 and the lid substrate 520 are used. However, the present invention is not limited to this. For example, the manufacturing is performed using the base substrate 51 and the lid 52 that are separated into pieces. May be.

Second Embodiment
FIG. 11 is a cross-sectional view showing a vibrator according to the second embodiment of the present invention. 12 is a plan view of the vibrator shown in FIG. In FIGS. 11 and 12, for convenience of explanation, illustration of electrodes included in the vibration element is omitted.
Hereinafter, the second embodiment will be described with a focus on differences from the above-described embodiment, and description of similar matters will be omitted.
The second embodiment is the same as the first embodiment described above except that a buffer portion is provided on the upper surface of the base substrate. In FIG. 11 and FIG. 12, the same reference numerals are given to the same configurations as those in the above-described embodiment.

  As shown in FIG. 11 and FIG. 12, in the vibrator 1 of the present embodiment, a film-shaped buffer portion 7 that is more flexible than the base substrate 51 is provided on the upper surface of the overhang portion 512 (the outer edge portion of the recess portion 511). ing. Such a buffer portion 7 functions to relieve and absorb the impact when the vibrating element 2 is bent in the Z-axis direction and the vibrating arms 32 and 33 come into contact with the overhanging portion 512 to interpose between them. have. Therefore, breakage and breakage of the vibrating arms 32 and 33 due to contact with the overhanging portion 512 can be further effectively prevented.

  A material having a Young's modulus lower than that of the base substrate 51 can be used as the buffer portion 7. For example, Cr (chrome), Ni (nickel), W (tungsten), Au (gold), Ag (silver) can be used. Various metal materials such as Cu (copper) and various resin materials can be used. Among these, it is preferable that the buffer portion 7 is made of the same metal material as the connection terminals 611 and 612. Accordingly, the configuration of the vibrator 1 is simplified, and the buffer portion 7 can be manufactured in the same process as the connection terminals 611 and 612. Therefore, the manufacture of the vibrator 1 is simplified.

The thickness of the buffer portion 7 varies depending on the material, but is preferably about 10 μm to 50 μm. Thereby, the function as the buffer portion 7 can be sufficiently exerted, and the bending deformation of the overhang portion 512 is not hindered.
Also according to the second embodiment, the same effects as those of the first embodiment described above can be exhibited.

<Third Embodiment>
FIG. 13 is a cross-sectional view showing a vibrator according to the third embodiment of the present invention. FIG. 14 is a plan view of the vibrator shown in FIG. In FIG. 13 and FIG. 14, for convenience of explanation, illustration of electrodes included in the vibration element is omitted.
Hereinafter, the third embodiment will be described with a focus on differences from the above-described embodiment, and description of similar matters will be omitted.

The third embodiment is the same as the first embodiment described above except that the arrangement of the overhanging portions is different. In FIG. 13 and FIG. 14, the same reference numerals are given to the same configurations as those in the above-described embodiment.
As shown in FIGS. 13 and 14, in the vibrator 1 of the present embodiment, the overhanging portion 512 is provided so as to protrude from the outer edge portion on the + Y-axis side of the recess 511 toward the −Y-axis side. Further, the adjustment films 46 and 45 provided on the hammer heads 321 and 331 are provided so as to exclude the regions S4 and S5 on the tip side of the hammer heads 321 and 331, and the overhanging portion 512 is seen in a plan view. The front end 512c is located so as to overlap the regions S4 and S5.
Also according to the third embodiment, the same effects as those of the first embodiment described above can be exhibited.

<Fourth embodiment>
FIG. 15 is a plan view showing a vibrator according to the fourth embodiment of the present invention. In FIG. 15, for convenience of explanation, illustration of electrodes included in the vibration element is omitted.
Hereinafter, the fourth embodiment will be described with a focus on differences from the above-described embodiment, and description of similar matters will be omitted.
The fourth embodiment is the same as the first embodiment described above except that the shape of the vibrating element (vibrating arm) is different. In FIG. 15, the same reference numerals are given to the same components as those in the above-described embodiment.

As shown in FIG. 15, in the vibrator 1 of this embodiment, the hammer heads 321 and 331 are omitted from the vibrating arms 32 and 33. Even in this case, the tip 512c of the overhanging portion 512 is positioned so as to overlap the regions S2 and S3.
According to the fourth embodiment, the same effect as that of the first embodiment described above can be exhibited.

<Fifth Embodiment>
FIG. 16 is a cross-sectional view showing a vibrator according to the fifth embodiment of the invention. In FIG. 16, for convenience of explanation, illustration of electrodes included in the vibration element is omitted.
Hereinafter, the fifth embodiment will be described with a focus on differences from the above-described embodiments, and description of similar matters will be omitted.
The fifth embodiment is the same as the first embodiment described above except that the configuration of the base substrate 51 is different. In FIG. 16, the same reference numerals are given to the same components as those in the above-described embodiment.

As shown in FIG. 16, in the vibrator 1 of this embodiment, the base substrate 51 has a two-layer laminated structure in which a first substrate 51A and a second substrate 51B are laminated. And the overhang | projection part 512 is formed of the 2nd board | substrate 51B located in an upper side. According to such a configuration, the base substrate 51 having the recess 511 and the overhanging portion 512 can be easily obtained by laminating the first substrate 51A and the second substrate 51B that are patterned in advance.
According to the fifth embodiment, the same effect as that of the first embodiment described above can be exhibited.

<Sixth Embodiment>
FIG. 17 is a cross-sectional view showing a vibrator according to the sixth embodiment of the invention. In FIG. 17, for convenience of explanation, illustration of electrodes included in the vibration element is omitted.
Hereinafter, the sixth embodiment will be described with a focus on differences from the above-described embodiment, and description of similar matters will be omitted.
The sixth embodiment is the same as the first embodiment described above except that the configurations of the base substrate 51 and the lid 52 are different. In FIG. 17, the same reference numerals are given to the same configurations as those in the above-described embodiment.

As shown in FIG. 17, in the vibrator 1 of the present embodiment, the base substrate 51 has a box shape having a recess 516 opened on the upper surface, and the lid 52 has a plate shape. The lid 52 closes the opening of the recess 516 and is bonded to the base substrate 51. Note that the vibration element 2 is fixed to the bottom surface of the recess 516, and the recess 511 and the overhanging portion 512 are formed on the bottom surface of the recess 516.
Also according to the sixth embodiment, the same effects as those of the first embodiment described above can be exhibited.

<Seventh embodiment>
FIG. 18 is a cross-sectional view showing a vibrator according to the seventh embodiment of the invention. FIG. 19 is a plan view showing the vibrator shown in FIG. 20 is a partially enlarged cross-sectional view of the vibrator shown in FIG. 18 and 19, for convenience of explanation, illustration of electrodes included in the vibration element is omitted.

Hereinafter, the seventh embodiment will be described with a focus on differences from the above-described embodiment, and description of similar matters will be omitted.
The seventh embodiment is the same as the first embodiment described above except that the configuration of the base substrate is different. In FIG. 18, FIG. 19, and FIG. 20, the same reference numerals are given to the same configurations as those in the above-described embodiment.

  As shown in FIGS. 18 and 19, in the vibrator 1 of the present embodiment, the base substrate 51 has a convex portion 513 provided so as to protrude from the bottom surface of the concave portion 511. The upper surface of the convex portion 513 is substantially flush with the upper surface of the base substrate 51. Moreover, the convex part 513 is provided in the position which overlaps with the front-end | tip part (hammer heads 321 and 331) of the vibrating arms 32 and 32 by planar view. Further, the convex portion 513 is formed so that the width of the base portion (the length in the Y-axis direction) is sufficiently narrow, and is easily bent in the Y-axis direction. Further, a protruding portion 515 protruding in the + Y-axis direction is formed at the tip of the convex portion 513. Similar to the overhanging portion 512, the overhanging portion 515 is easily bent in the Z-axis direction.

Moreover, the buffer part 7 is formed in the upper surface of the overhang | projection parts 512 and 515, respectively. However, the buffer part 7 may be omitted.
According to the base substrate 51 having such a configuration, when the external force in the Z-axis direction is applied to the vibrator 1 due to, for example, an impact at the time of dropping or the like, and the vibration element 2 is bent in the Z-axis direction, the vibrating arms 32 and 33 Contacts the tip of the overhang 515 before it deforms excessively. When the vibrating arms 32 and 33 hit the overhanging portion 515, the overhanging portion 515 bends in the Z-axis direction, and the convex portion 513 on which the overhanging portion 515 is formed bends in the Y-axis direction. Absorbed.

When the external force in the Z-axis direction is large, the vibrating arms 32 and 33 come into contact with the overhanging portion 512 after contacting the overhanging portion 515. In addition, since the effect acquired by contact with the overhang | projection part 512 is as above-mentioned, the description is abbreviate | omitted.
As described above, by providing the convex portion 513 in the concave portion 511, the vibration arms 32 and 33 can be excessively restricted from being deformed in two stages, so that the vibration arms 32 and 33 are not broken or damaged due to excessive deformation. It can prevent more effectively.

Here, as described in the first embodiment described above, in the vibrator 1, the adjustment films 45 and 46 are irradiated with laser through the lid 52 as necessary, and a part of the adjustment films 45 and 46 is formed. The drive frequency of the vibration element 2 may be adjusted by removing and adjusting the mass of the vibrating arms 32 and 33.
After such frequency adjustment, as shown in FIG. 20, burrs 452 and 462 may be formed around the mass adjusting portions 451 and 461 removed by laser irradiation. The burrs 452 and 462 are considered to be formed by reattaching a metal material vaporized or melted by laser irradiation around the burrs. Such burrs 452 and 462 are very fragile and easily peel off. If the burrs 452 and 462 are peeled off from the adjustment films 45 and 46, the mass of the vibrating arms 32 and 33 is changed, and accordingly, the driving frequency of the vibrating element 2 is also changed.

Therefore, in the present embodiment, the mass adjustment unit is disposed between the projecting part 512 and the convex part 513 (position shifted from the convex part 513) in plan view so that the burrs 452 and 462 do not contact the base substrate 51. 451 and 461 are located. In other words, the mass of the vibrating arms 32 and 33 is adjusted by irradiating a laser to a region that does not overlap the convex portions 513 of the adjustment films 45 and 46. Thereby, for example, even when the vibration element 2 is bent in the Z-axis direction due to an impact at the time of dropping and the vibrating arms 32 and 33 are in contact with the overhanging portions 512 and 515, the burrs 452 and 462 are not in contact with the base substrate 51. The peeling of the burrs 452 and 462 can be effectively reduced.
Also according to the seventh embodiment, the same effect as that of the first embodiment described above can be exhibited.

2. Oscillator Next, an oscillator to which the vibrator of the present invention is applied will be described.
FIG. 21 is a cross-sectional view showing a preferred embodiment of the oscillator of the present invention.
An oscillator 100 illustrated in FIG. 21 includes a vibrator 1 and an IC chip 110 for driving the vibration element 2. Hereinafter, the oscillator 100 will be described with a focus on differences from the above-described vibrator, and description of similar matters will be omitted.

  As shown in FIG. 21, in the oscillator 100, a recess 517 is formed in the base substrate 51, and the IC chip 110 is fixed to the recess 517 by a brazing material or the like. The IC chip 110 is electrically connected to a plurality of internal terminals 120 formed on the bottom surface of the recess 517. The plurality of internal terminals 120 include one connected to the connection terminals 611 and 621 and one connected to an external terminal (not shown). The IC chip 110 has an oscillation circuit for controlling driving of the vibration element 2. When the vibration element 2 is driven by the IC chip 110, a signal having a predetermined frequency can be extracted.

3. Next, an electronic device to which the vibrator of the present invention is applied will be described.
FIG. 22 is a perspective view showing a configuration of a mobile (or notebook) personal computer to which the electronic apparatus of the present invention is applied. In this figure, a personal computer 1100 includes a main body portion 1104 provided with a keyboard 1102 and a display unit 1106 provided with a display portion 1108. The display unit 1106 is rotated with respect to the main body portion 1104 via a hinge structure portion. It is supported movably. Such a personal computer 1100 has a built-in vibrator 1 that functions as a filter, a resonator, a reference clock, and the like.

  FIG. 23 is a perspective view showing a configuration of a mobile phone (including PHS) to which the electronic apparatus of the invention is applied. In this figure, a cellular phone 1200 includes a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and a display portion 1208 is disposed between the operation buttons 1202 and the earpiece 1204. Such a cellular phone 1200 incorporates the vibrator 1 that functions as a filter, a resonator, and the like.

  FIG. 24 is a perspective view showing the configuration of a digital still camera to which the electronic apparatus of the present invention is applied. In this figure, connection with an external device is also simply shown. Here, an ordinary camera sensitizes a silver halide photographic film with a light image of a subject, whereas a digital still camera 1300 photoelectrically converts a light image of a subject with an imaging device such as a CCD (Charge Coupled Device). An imaging signal (image signal) is generated.

  A display unit 1310 is provided on the back of a case (body) 1302 in the digital still camera 1300, and is configured to perform display based on an imaging signal from the CCD. The display unit 1310 displays a subject as an electronic image. Functions as a viewfinder. A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302.

  When the photographer confirms the subject image displayed on the display unit and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308. In the digital still camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302. As shown in the figure, a television monitor 1430 is connected to the video signal output terminal 1312 and a personal computer 1440 is connected to the input / output terminal 1314 for data communication as necessary. Further, the imaging signal stored in the memory 1308 is output to the television monitor 1430 or the personal computer 1440 by a predetermined operation. Such a digital still camera 1300 incorporates a vibrator 1 that functions as a filter, a resonator, or the like.

  In addition to the personal computer (mobile personal computer) shown in FIG. 22, the mobile phone shown in FIG. 23, and the digital still camera shown in FIG. Inkjet printers), laptop personal computers, televisions, video cameras, video tape recorders, car navigation devices, pagers, electronic notebooks (including those with communication functions), electronic dictionaries, calculators, electronic game devices, word processors, workstations, televisions Telephone, crime prevention TV monitor, electronic binoculars, POS terminal, medical equipment (for example, electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish detector, various measuring devices, instruments Class (eg, vehicle, aircraft) Gauges of a ship), can be applied to a flight simulator or the like.

4). Next, a moving body to which the vibrator of the present invention is applied will be described.
FIG. 25 is a perspective view showing an automobile to which the moving body of the present invention is applied. A vibrator 1500 is mounted on the automobile 1500. The vibrator 1 is a keyless entry, immobilizer, car navigation system, car air conditioner, anti-lock brake system (ABS), air bag, tire pressure monitoring system (TPMS), engine control, hybrid car, The present invention can be widely applied to electronic control units (ECUs) such as battery monitors for electric vehicles, vehicle body posture control systems, and the like.

  As described above, the vibrator, the manufacturing method of the base substrate, the oscillator, the electronic device, and the moving body of the present invention have been described based on the illustrated embodiment, but the present invention is not limited to this, and the configuration of each part is It can be replaced with any configuration having a similar function. In addition, any other component may be added to the present invention. Moreover, you may combine each embodiment suitably.

In the above-described embodiment, an example in which a tuning fork type vibration element having a base and two vibration arms is used as the vibration element has been described. However, the vibration element is not limited to this, for example, a thickness A so-called “AT cut vibrator” using sliding vibration may be used.
In the above-described embodiment, one overhanging portion is provided so as to overlap the two vibrating arms. However, the overhanging portion is divided into two and one overhanging portion is replaced with one vibrating arm. And the other overhanging part may be arranged so as to overlap the other vibrating arm.

  In the above-described embodiment, the configuration in which the vibration element is supported on the package by the adhesive has been described. However, the method for supporting the vibration element is not limited thereto. That is, for example, as in a CSP (MAT) structure, a frame-shaped intermediate layer that supports the vibration element is formed integrally with the vibration element, and the intermediate layer is sandwiched between the base substrate and the lid, so that the vibration element The structure may be such that is supported by a package.

  DESCRIPTION OF SYMBOLS 1 ... Vibrator 2 ... Vibrating element 3 ... Piezoelectric substrate 31 ... Base 32 ... Vibrating arm 321 ... Hammer head 322, 323 ... Groove 33 ... Vibrating arm 331 ... Hammer head 332, 333 ... Groove 4 ... Electrode 41 ... Drive signal electrode 42 ... Drive ground electrode 43 ... Drive signal terminal 44 ... Drive ground terminal 45, 46 ... Adjustment film 451, 461 ... Mass adjustment part 452, 462 ... Burr 5 …… Package 51 …… Base substrate 51A …… First substrate 51B …… Second substrate 510 …… Substrate 511 …… Recessed portion 512 …… Overhanging portion 512a …… Upper surface 512b …… Lower surface 512c …… Tip 513 …… Convex part 515... Overhang part 516... Concave part 517... Concave part 52... Lid 53 ... Bonding film 611, 621 ... Connection terminal 612, 622. Mounting terminals 613, 623 ... Penetration electrodes 63, 64 ... Conductive adhesive 7 ... Buffer part 100 ... Oscillator 110 ... IC chip 120 ... Internal terminal 520 ... Lid substrate 521 ... Recess 1100 ... Personal Computer 1102 …… Keyboard 1104 …… Main body 1106 …… Display unit 1108 …… Display unit 1200 …… Mobile phone 1202 …… Operation buttons 1204 …… Earpiece 1206 …… Speaker 1208 …… Display unit 1300 …… Digital Still camera 1302 …… Case 1304 …… Light receiving unit 1306 …… Shutter button 1308 …… Memory 1310 …… Display unit 1312 …… Video signal output terminal 1314 …… Input / output terminal 1430 …… TV monitor 1440 …… Personal computer Over 1500 ...... automobile M1, M2, M3 ...... mask S ...... housing space S2, S3, S4, S5 ...... region theta ...... angle

Claims (13)

A vibrating element including one end and the other end opposite to the one end in plan view;
A base substrate to which the one end side of the vibration element is attached;
Including
The base substrate is
A recess provided in the main surface on the vibration element side;
A projecting portion projecting into the recess;
Have
The vibrator, wherein the protruding portion is disposed so as to overlap the other end side of the vibration element in a plan view of the base substrate.   2. The vibrator according to claim 1, wherein in the projecting portion, the main surface and an inner surface of the concave portion overlap each other in a plan view of the base substrate.   3. The vibrator according to claim 1, wherein the protruding portion has a distal end portion thinner than a proximal end portion.   The vibrator according to claim 1, wherein a buffer portion is provided in the overhang portion. Having a convex portion provided in the concave portion;
5. The vibrator according to claim 1, wherein the recess is positioned so as to overlap the other end side of the vibration element in a plan view of the base substrate. The vibrating element includes a base and a vibrating arm extending from the base.
The vibrating arm is provided with a bottomed groove extending along the extending direction, and an adjustment film for mass adjustment disposed on the tip side opposite to the base,
5. The vibrator according to claim 1, wherein a region between the adjustment film and the groove overlaps with the protruding portion in a plan view of the base substrate. The vibrating element includes a base and a vibrating arm extending from the base.
The vibrating arm is provided with a bottomed groove extending along the extending direction, and an adjustment film for mass adjustment disposed on the tip side opposite to the base,
In a plan view of the base substrate, a region between the adjustment film and the groove overlaps with the overhang portion, and the mass adjustment portion of the adjustment film is between the overhang portion and the convex portion. The vibrator according to claim 5, wherein the vibrator overlaps with the region.   The vibrator according to claim 1, wherein the base substrate is made of a glass material. Forming a recess on one surface of the substrate;
Removing the side surface of the concave portion so as to squeeze, and forming an overhanging portion projecting into the concave portion.   The method of manufacturing a base substrate according to claim 9, wherein in the step of forming the overhanging portion, the overhanging portion is formed by wet etching the substrate. A vibrator according to any one of claims 1 to 8,
And an oscillator.   An electronic apparatus comprising the vibrator according to claim 1.   A moving body comprising the vibrator according to claim 1.

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