JP2019153611A - module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the heat dissipation characteristic of heat generated from a heat-generating component in a module provided with a heat-dissipating member, and to prevent the heat from the heat-dissipating member from affecting other parts. A module 1a is sealed with a multilayer wiring board 2, a plurality of components 3a to 3d mounted on an upper surface 20a of the multilayer wiring board 2, a sealing resin layer for sealing each component 3a to 3d, and a sealing resin layer. A heat sink 5 provided on the upper surface side of the waterproof resin layer is provided, and the heat sink 5 is adjacent to each component 3a to 3d when viewed from a direction perpendicular to the upper surface 20a of the multilayer wiring board 2. It has a region that overlaps with each of the parts 3a to 3d. Further, slits 11a to 11c are formed in the heat radiating plate 5 along the peripheral edges of the parts 3a to 3c. [Selection diagram] Fig. 2

Description

The present invention relates to a module including a heat dissipation member.

  Various modules are mounted on a mother board of an electronic device such as a communication terminal device. In this type of module, various chip components are mounted on a wiring board, and these chip components are sealed with resin. Among chip parts, there are parts that generate heat when the module is used, such as semiconductor elements such as ICs. Modules that can dissipate heat generated from mounted components have been proposed because the characteristics may deteriorate when heat accumulates in the module. For example, as illustrated in FIG. 8, in the module 100 described in Patent Document 1, a plurality of components 102 are mounted on the upper surface 101 a of the wiring substrate 101. Each component 102 is sealed with a sealing resin layer 103, and the sealing resin layer 103 is covered with an electromagnetic shield 104. Further, a heat dissipation layer 105 is laminated on the electromagnetic shield 104 on the upper surface 103 a of the sealing resin layer 103.

JP 2017-45932 A (see paragraphs 0051-0053, 0059-0061, FIG. 12, etc.)

  However, in the conventional module 100, since the heat dissipation layer 105 is laminated over the entire upper surface 103a of the sealing resin layer 103, heat generated from some of the components 102 having high heat generation properties is transmitted through the heat dissipation layer 105. May affect other parts.

  The present invention has been made in view of the above-described problems, and in a module provided with a heat radiating member, heat from the heat radiating member is improved to other components while improving heat radiating characteristics of heat generated from the heat generating component. The purpose is to make it difficult to influence.

  In order to achieve the above-described object, a module of the present invention includes a wiring board, first and second components mounted on the main surface of the wiring board, a contact surface that contacts the wiring board, and A sealing resin layer that seals the first component and the second component, and a heat dissipating member provided on the facing surface of the sealing resin layer. The heat dissipation member, when viewed from a direction perpendicular to the main surface of the wiring board, between the first component, the second component, and the first component and the second component, It has the area | region which overlaps with each, The slit is formed in the area | region which overlaps between the said 1st component and the said 2nd component of the said heat radiating member, It is characterized by the above-mentioned.

  According to this configuration, since the heat dissipation member is disposed so as to overlap each of the first component, the second component, and between the first component and the second component, the heat dissipation characteristics of the module are improved. Furthermore, since the slit is formed in the region overlapping between the first component and the second component of the heat dissipation member, for example, when one of the first component and the second component is a heat generating component, the one component It is possible to suppress the heat from the other component from affecting the other component via the heat dissipating member.

  The slit may be formed closer to the first part. According to this configuration, for example, when the first component is a heat generating component and the first component and the second component are close to each other, the heat generated from the first component is transmitted to the second component via the heat dissipation member. It is possible to suppress the influence.

  The slit may be formed closer to the second part. According to this configuration, when the first component is a heat-generating component, the heat generated from the first component affects the second component via the heat dissipation member regardless of the distance between the first component and the second component. Can be suppressed.

  The slit may be formed along the periphery of the first component when viewed from a direction perpendicular to the main surface of the wiring board. According to this configuration, for example, when the first component is a heat generating component, it is possible to make it difficult for heat generated from the first component to be transmitted to the second component via the heat dissipation member.

  The slit may be formed so as to surround the periphery of the first component. According to this configuration, for example, when the first component is a heat generating component, it is possible to make it difficult for heat generated from the first component to be transmitted to the second component via the heat dissipation member.

  Further, the slit may be formed along a peripheral edge of the second component when viewed from a direction perpendicular to the main surface of the wiring board. According to this configuration, for example, when the first component is a heat generating component, it is possible to make it difficult for heat generated from the first component to be transmitted to the second component via the heat dissipation member.

  Further, the slit may be formed so as to surround the periphery of the second component. According to this configuration, for example, when the first component is a heat generating component, it is possible to make it difficult for heat generated from the first component to be transmitted to the second component via the heat dissipation member.

  The slit may include a first slit formed near the first component and a second slit formed near the second component. According to this configuration, regardless of the distance between the first component and the second component, the heat generated from one of the first component and the second component is transmitted to the other component via the heat dissipation member. It can be surely suppressed.

  And a shielding film that covers at least the facing surface of the sealing resin layer and a side surface connecting the edges of the facing surface and the contact surface, and the heat dissipation member is disposed on the shielding film. It may be provided. According to this configuration, since the surface of the sealing resin layer is covered with the shield film, the shielding characteristics for the first component and the second component are improved.

  According to the present invention, since the heat dissipation member is disposed so as to overlap each other between the first component, the second component, and the first component and the second component, the heat dissipation characteristics of the module are improved. Furthermore, since the slit is formed in the region overlapping between the first component and the second component of the heat dissipation member, for example, when one of the first component and the second component is a heat generating component, the one component It is possible to suppress the heat from the other component from affecting the other component via the heat dissipating member.

It is sectional drawing of the module concerning 1st Embodiment of this invention. It is a top view of the module of FIG. It is a figure which shows the modification of the module of FIG. It is a top view of the module concerning a 2nd embodiment of the present invention. It is a figure which shows the modification of the module of FIG. It is a top view of the module concerning a 3rd embodiment of the present invention. It is a figure which shows the modification of the module of FIG. It is sectional drawing of the conventional module.

<First Embodiment>
The module 1a according to the first embodiment of the present invention will be described with reference to FIG. 1 and FIG. 1 is a cross-sectional view of the module 1a, which is a cross-sectional view taken along the line AA of FIG. 2, and FIG. 2 is a plan view of the module 1a.

  As shown in FIG. 1, a module 1a according to this embodiment includes a multilayer wiring board 2 (corresponding to the “wiring board” of the present invention) and a plurality of components 3a to 3 mounted on the upper surface 20a of the multilayer wiring board 2. 3d, the sealing resin layer 4 laminated on the upper surface 20a of the multilayer wiring board 2, the shield film 6 covering the surface of the sealing resin layer 4, and the heat sink provided on the upper surface 4a of the sealing resin layer 4 5 and mounted on, for example, a mother board of an electronic device using a high-frequency signal.

  The multilayer wiring board 2 is formed by laminating a plurality of insulating layers 2a to 2c formed of, for example, a low-temperature co-fired ceramic, a high-temperature co-fired ceramic, glass epoxy resin, or the like. On the upper surface 20a of the multilayer wiring board 2 (corresponding to the “main surface of the wiring board” of the present invention), mounting electrodes 7 for mounting the components 3a to 3d are formed. A plurality of external electrodes 8 for external connection are formed on the lower surface 20 b of the multilayer wiring board 2. Various internal wiring electrodes 9 are formed between the adjacent insulating layers 2a to 2c, and the internal wiring electrodes 9 formed in different insulating layers 2a to 2c are connected to each other inside the multilayer wiring board 2. A plurality of via conductors 10 for connection are formed. The mounting electrode 7, the external electrode 8, and the internal wiring electrode 9 are all formed of a metal generally employed as a wiring electrode such as Cu, Ag, or Al. Each via conductor 10 is made of a metal such as Ag or Cu. Each mounting electrode 7 and each external electrode 8 may be subjected to Ni / Au plating, Ni / Pd / Au plating, or Ni / Sn plating, respectively.

  The components 3a to 3d are constituted by semiconductor elements such as IC and PA (power amplifier), and chip components such as a chip inductor, a chip capacitor, and a chip resistor. The multilayer wiring board 2 is formed by a general surface mounting technique such as solder bonding. To be implemented. In this embodiment, among the components 3a to 3d, the component 3a is a component that generates a large amount of heat when the module 1a is energized (corresponding to the “first component” of the present invention), and the component 3b and the component 3c are heated. It is provided as a part whose characteristics change due to the influence (corresponding to the “second part” of the present invention).

  The sealing resin layer 4 is formed of a resin generally employed as a sealing resin such as an epoxy resin, and seals the components 3a to 3d. The sealing resin layer 4 includes a lower surface 4b (corresponding to the “contact surface of the sealing resin layer” of the present invention) that contacts the multilayer wiring board 2 and an upper surface 4a that faces the lower surface 4b (“ Corresponding to the “opposing surface of the sealing resin layer”) and the side surface 4c.

  The shield film 6 covers the surface (the upper surface 4 a and the side surface 4 c) of the sealing resin layer 4 and the side surface 20 c of the multilayer wiring board 2, and serves as a ground electrode (not shown) exposed on the side surface 20 c of the multilayer wiring board 2. Connected.

  The shield film 6 can be formed in a multilayer structure having an adhesion film laminated on the upper surface 4a of the sealing resin layer 4, a conductive film laminated on the adhesion film, and a protective film laminated on the conductive film. (Not shown). Here, the adhesion film is provided to increase the adhesion strength between the conductive film and the sealing resin layer 4 and can be formed of a metal such as SUS, for example. The conductive film is a layer that bears the substantial shielding function of the shield film 6 and can be formed of, for example, any one of Cu, Ag, and Al. The protective film is provided to prevent the conductive film from being corroded or scratched, and can be formed of, for example, SUS.

  The heat radiating plate 5 (corresponding to the “heat radiating member” of the present invention) is disposed on a portion of the shield film 6 that covers the upper surface 4 a of the sealing resin layer 4. In this embodiment, the area of the main surface of the heat sink 5 is substantially the same as the area of the upper surface 4a of the sealing resin layer 4, and is a plane viewed from a direction perpendicular to the upper surface 20a of the multilayer wiring board 2. It has a region that overlaps all the components 3a to 3d in view. In addition, three slits 11 a to 11 c that penetrate the thickness direction of the heat radiating plate 5 are formed in the heat radiating plate 5. The first slit 11a is formed along the periphery of the component 3a (heat generating component) in plan view and surrounds the periphery of the component 3a. The second slit 11b is formed along the periphery of the component 3b in plan view and surrounds the periphery of the component 3b. The third slit 11c is formed along the periphery of the component 3c in plan view and surrounds the periphery of the component 3c. Accordingly, in a plan view, slits 11a and 11b are formed in a region between the component 3a (heat generating component) and the component 3b of the heat sink 5, and the component 3a (heat generating component) and the component 3c of the heat sink 5 are formed. Slits 11a and 11c are formed in the area between the two.

  In addition, the heat sink 5 is formed with metals, such as Cu and Al. As a method for forming the heat sink 5, for example, there is a method in which a metal plate or a metal foil is disposed and fixed on the shield film 6 and the slits 11 a to 11 c are formed by laser processing. As another forming method, the heat sink 5 is formed by plating on the portion of the shield film 6 that covers the upper surface 4a of the sealing resin layer 4, and then the slits 11a to 11c are formed using laser processing, photolithography, or the like. There is also a method of forming. Alternatively, after attaching a metal plate or metal foil to the top surface of the module 1a after the shield film 6 is formed (the portion covering the upper surface 4a of the sealing resin layer 4 in the shield film 6), the slits 11a to 11c are formed. A resist may be formed in a portion other than the planned position to be formed, the slit portion may be etched, and then the resist may be removed. Or in the structure where the heat sink 5 is connected as shown in FIGS. 3, 5, and 7 (a structure in which a part is not separated), the heat sink 5 in which the slits 11 a to 11 c are formed in advance is pasted. Also good.

  Therefore, according to the above-described embodiment, when viewed from the direction perpendicular to the upper surface 20a of the multilayer wiring board 2, the heat sink 5 has a large area having a region where all the mounted components (components 3a to 3d) overlap. Therefore, the heat dissipation characteristics of the module 1a are improved. Further, slits 11a and 11b are formed in a region between the component 3a (heat generating component) and the component 3b of the heat sink 5, and a region between the component 3a (heat generating component) and the component 3c of the heat sink 5 is formed. Since the slits 11 a and 11 c are formed, the heat from the component 3 a that is a heat-generating component can be prevented from affecting the other components 3 b and 3 c through the heat radiating plate 5.

  Moreover, since the slit 11a is formed along the periphery of the component 3a, the heat generated from the component 3a can be made difficult to be transmitted to the other components 3b to 3d via the radiator plate 5. Furthermore, the slit 11b is formed along the periphery of the component 3b, and the slit 11c is formed along the periphery of the component 3c. If it does in this way, the heat which generate | occur | produces from the components 3a can further be made hard to transmit to the components 3b and 3c. Moreover, the heat from the component 3a is transferred to the other components 3b to 3d by completely separating the portions disposed on the components 3a to 3c of the heat sink 5 and other portions by the slits 11a to 11c. The effect of making it difficult to communicate is further improved.

(Modification of module 1a)
In the first embodiment described above, each of the slits 11a to 11c is formed in a shape that surrounds the entire circumference of the target components 3a to 3c. For example, as shown in FIG. Alternatively, the target parts 3a to 3c may not be completely surrounded, but may be surrounded in a partially broken state. At this time, it is preferable that the interrupted portion is not disposed in a region between the component 3a (heat generating component) and the component 3b or a region between the component 3a and the component 3c. Even if it does in this way, the effect equivalent to 1st Embodiment can be acquired. In this case, the slits 11 a to 11 c may be formed before the heat sink 5 is disposed on the shield film 6.

Second Embodiment
A module 1b according to the second embodiment of the present invention will be described with reference to FIG. FIG. 4 is a plan view of the module 1b and corresponds to FIG. 2 of the first embodiment.

  The module 1b according to this embodiment differs from the module 1a according to the first embodiment described with reference to FIGS. 1 and 2 in that the configuration of the heat sink 5 is different as shown in FIG. Since other configurations are the same as those of the module 1a of the first embodiment, the description thereof is omitted by attaching the same reference numerals.

  In this case, in the first embodiment, the slits 11a to 11c (three in total) are provided along the periphery of each of the components 3a to 3c, but in this embodiment, along the periphery of the component 3a that is a heat generating component. Only the slit 11a formed in this way is formed. In other words, in the first embodiment, among the three slits 11a to 11c arranged in the region between the component 3a and the component 3b and the region between the component 3a and the component 3c, the heat generating component. Only the slit 11a arranged at a position near the component 3a is formed.

  According to this configuration, when the distance between the component 3a that is a heat generating component and the components 3b and 3c that are desired to avoid the influence of heat is short, it is suitable for making it difficult for the heat from the component 3a to be transmitted to the components 3b and 3c. Yes.

(Modification of module 1b)
In the second embodiment described above, the slit 11a is formed in a shape surrounding the entire circumference of the component 3a. For example, as shown in FIG. 5, the slit 11a does not completely surround the component 3a, but a part thereof. You may make it surround in the state which interrupted. At this time, it is preferable that the interrupted portion is not disposed in a region between the component 3a (heat generating component) and the component 3b or a region between the component 3a and the component 3c. Even if it does in this way, the effect equivalent to 2nd Embodiment can be acquired. In this case, the slit 11 a may be formed before the heat radiating plate 5 is disposed on the shield film 6.

<Third Embodiment>
A module 1c according to a third embodiment of the present invention will be described with reference to FIG. FIG. 6 is a plan view of the module 1c and corresponds to FIG. 2 of the first embodiment.

  The module 1c according to this embodiment is different from the module 1a of the first embodiment described with reference to FIGS. 1 and 2 in that the configuration of the heat sink 5 is different as shown in FIG. Since other configurations are the same as those of the module 1a of the first embodiment, the description thereof is omitted by attaching the same reference numerals.

  In the first embodiment, slits 11a to 11c (three in total) are provided along the peripheral edges of the components 3a to 3c. On the other hand, in this embodiment, the slit 11b formed along the periphery of the component 3b and the slit 11c formed along the periphery of the component 3c are formed, but along the periphery of the component 3a that is a heat generating component. The formed slit 11a is not provided. In other words, in the first embodiment, the three slits 11a to 11c arranged in the region between the component 3a and the component 3b and the region between the component 3a and the component 3c are not heat generating components. Only two slits 11b and 11c arranged at positions close to the component 3b and the component 3c are formed.

  According to this configuration, it is possible to make it difficult for heat from the component 3a to be transmitted to the components 3b and 3c regardless of the distance between the component 3a that is a heat generating component and the components 3b and 3c that are desired to avoid the influence of heat.

(Modification of module 1c)
In the above-described third embodiment, the slit 11b and the slit 11c are formed in a shape surrounding the entire circumference of the component 3b and the component 3c. For example, as shown in FIG. 7, the slit 11b and the slit 11c are each a target component. Instead of completely surrounding 3b and 3c, it may be surrounded in a state where a part thereof is interrupted. At this time, it is preferable that the interrupted portion is not disposed in a region between the component 3a (heat generating component) and the component 3b or a region between the component 3a and the component 3c. Even if it does in this way, the effect equivalent to 3rd Embodiment can be acquired. In this case, the slit 11 b and the slit 11 c may be formed before the heat radiating plate 5 is disposed on the shield film 6.

  The present invention is not limited to the above-described embodiments, and various modifications other than those described above can be made without departing from the spirit of the invention. For example, you may combine the structure of each above-mentioned embodiment and modification.

  In each of the above-described embodiments, the case where the heat generating component (component 3a) and the component (components 3b and 3c) that are easily affected by heat are adjacent to each other has been described. The present invention can also be applied when there is an interposition. In this case, if a slit is provided in a desired portion of the region between the heat generating component (component 3a) and the component 3b and the region between the heat generating component (component 3a) and the component 3c in plan view, respectively. Good.

  Moreover, in each above-mentioned embodiment, although the heat sink 5 was demonstrated as an example of a heat radiating member, it does not necessarily need to be plate-shaped.

  In each of the above-described embodiments, the shield film 6 may not be provided.

  In addition, the present invention can be applied to various modules including a heat radiating member that radiates heat generated from components mounted on a wiring board.

1a to 1c module 2 multilayer wiring board (wiring board)
3a Part (first part)
3b, 3c parts (second parts)
4 Sealing resin layer 5 Heat sink (heat dissipation member)
11a-11c (slit)

Claims (9)

A wiring board;
A first component and a second component mounted on the main surface of the wiring board;
A sealing resin layer that has a contact surface that contacts the wiring board and a facing surface that faces the contact surface, and seals the first component and the second component;
A heat dissipating member provided on the facing surface of the sealing resin layer,
The heat dissipation member, when viewed from a direction perpendicular to the main surface of the wiring board, between the first component, the second component, and the first component and the second component, Each has an overlapping area,
A module in which a slit is formed in a region of the heat dissipation member that overlaps between the first part and the second part.   The module according to claim 1, wherein the slit is formed closer to the first component.   The module according to claim 1, wherein the slit is formed closer to the second component.   The module according to claim 2, wherein the slit is formed along a peripheral edge of the first component when viewed from a direction perpendicular to the main surface of the wiring board.   The module according to claim 4, wherein the slit is formed so as to surround a periphery of the first component.   The module according to claim 3, wherein the slit is formed along a peripheral edge of the second component when viewed from a direction perpendicular to the main surface of the wiring board.   The module according to claim 6, wherein the slit is formed so as to surround a periphery of the second component.   The module according to claim 1, wherein the slit includes a first slit formed closer to the first component and a second slit formed closer to the second component. A shield film that covers at least the opposing surface of the sealing resin layer and the side surface connecting the opposing surface and the edges of the contact surface;
The module according to claim 1, wherein the heat radiating member is disposed on the shield film.

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