JP2012079733A - Electronic component circuit board - Google Patents

Abstract

Disclosed is a technique for setting a desired temperature distribution of a heat dissipating means in a heat dissipating means for commonly dissipating a plurality of heat generating components.
A first IC and a second IC are mounted on a substrate. The second IC 4 is a component that generates a larger amount of heat than the first IC 3. A heat sink 5 is mounted on the first IC 3 and the second IC 4 in common, and is fixed to the substrate 2 with screws 8. A substantially U-shaped slit 6 is formed in the heat radiating plate 5 so as to surround the first IC 3 having a small calorific value.
[Selection] Figure 1

Description

  The present invention relates to an electronic component circuit board, and more particularly, to an electronic component circuit board including a plurality of heat generating components attached on the substrate and a heat radiating plate attached to the heat generating components in common.

  In recent years, the progress of downsizing and thinning of electronic devices has greatly progressed, and along with this, the temperature rise due to the denseness of ICs (integrated circuits) such as heat generating components such as microcomputers has become a big problem. To solve this problem, as shown in FIG. 4, in the conventional type electronic component circuit board 11, the heat sink 15 is attached to the first and second ICs 13 and 14 mounted on the board 12 by screws 18. It has been. In this case, heat generation between the first and second ICs 13 and 14 affects each other, and a heat generating component with a smaller heat generation amount, for example, a heat generating component with a larger heat generation amount from the first IC 13. Therefore, there is a problem that the heat radiation effect is lower than that in the case where only one heat-generating component is radiated by a single heat radiating plate.

  As one of the means for solving such problems caused by the uneven distribution of heat, one or more slits are provided in a direction perpendicular to the direction of thermal expansion, so that distortion is caused between the ceramic substrate and the heat sink. There is a technology that enables printing without unevenness. In this technique, the shape change of the heat sink due to thermal expansion is reduced by adding a slit to the heat sink.

  Naturally, as shown in the electronic component circuit board 21 of FIG. 5, the first and second ICs 13 and 14 can be radiated by the individual heat sinks 15a and 15b, but the number of components, cost reduction, etc. From a viewpoint, the structure by one heat sink is calculated | required.

Japanese Utility Model Publication No. 59-94845

  By the way, in the technique disclosed in Patent Document 1, the shape change of the heat radiating plate due to thermal expansion is suppressed to prevent distortion, but no measures are disclosed for the heat radiating structure. In other words, there is no disclosure of a technique for how to dissipate heat for a product including a plurality of heat generating components on a substrate.

  In view of the above problems, an object of the present invention is to provide a technique for making a desired distribution of the temperature distribution of the heat dissipating means in the heat dissipating means for commonly dissipating a plurality of heat generating components.

The apparatus which concerns on this invention is related with an electronic component circuit board provided with the several heat-emitting component attached on the board | substrate, and the heat sink attached to the said several heat-emitting component in common. In this electronic component circuit board, the heat radiating plate is provided with a slit that inhibits heat transfer in a path between the plurality of heat generating components.
Further, the slit inhibits heat transfer in a path between the plurality of heat generating components and a heat generating component having a relatively large heat generation amount in a region where the heat generating component having a relatively small heat generation amount is attached. It may be provided as follows.
Another apparatus according to the present invention is an integrated circuit component comprising first and second integrated circuit components mounted on a substrate and a heat sink commonly mounted on the first and second integrated circuit components. The first integrated circuit component generates a larger amount of heat than the second integrated circuit component, and has a substantially rectangular shape in plan view when mounted on the substrate. The board has a slit formed so as to surround the first integrated circuit component, and the slit is the second integrated circuit among the four sides of the substantially rectangular shape of the first integrated circuit component. It is a shape that is not formed in the vicinity of the side farthest from.

  An object of the present invention is to provide a technique for making a desired distribution of the temperature distribution of a heat dissipating means in a heat dissipating means for commonly dissipating a plurality of heat generating components.

It is a figure which shows typically the electronic component circuit board based on embodiment of this invention. It is a figure which shows the temperature distribution of the electronic component circuit board based on embodiment of this invention compared with a prior art example. It is the figure which showed the example of the slit shape based on embodiment of this invention. It is a figure which shows typically the electronic component circuit board based on a prior art. It is a figure which shows typically the electronic component circuit board based on a prior art.

  Next, a mode for carrying out the present invention (hereinafter referred to as “embodiment”) will be specifically described with reference to the drawings.

  FIG. 1 is a view showing an electronic component circuit board 1 according to the present embodiment, FIG. 1 (a) is a plan view, and FIG. 1 (b) is a cross-sectional view taken along line AA in FIG. 1 (a). Is shown.

  As illustrated, a first IC 3 and a second IC 4 are mounted on the substrate 2. Here, the first IC 3 is a component that generates a relatively small amount of heat, and the second IC 4 is a component that generates a larger amount of heat than the first IC 3. In addition, the magnitude comparison of the calorific value may be based on the maximum calorific value or may be based on the average calorific value of the assumed operation. The first IC 3 and the second IC 4 have a rectangular shape when viewed from above.

  A heat sink 5 is mounted on the first IC 3 and the second IC 4 in common, and is fixed to the substrate 2 with screws 8. In addition, between the 1st IC3 and 2nd IC4, and the heat sink 5, the heat sink sheet (not shown) may be interposed as needed in order to make them closely_contact | adhere.

  The heat radiating plate 5 is provided with a slit 6 so as to block the first IC 3 and the second IC 4. Specifically, a substantially U-shaped slit 6 is formed so as to surround the first IC 3 having a small heat generation amount. At this time, no slit 6 is formed in the vicinity of the left side of the shape of the first IC 3. That is, the U-shaped opening is on the opposite side of the second IC 4 and is far away.

  By providing the slit 6 having such a configuration in the heat radiating plate 5, the temperature of the second IC 4, which is a heat generating element having a large heat generation amount, can be lowered compared to the conventional case, while the heat generation having a small heat generation amount. The temperature of the first IC 3 that is the body can be raised. As a result, variations in the temperature distribution of the entire heat sink 5 can be reduced and improved in a uniform direction.

  FIG. 2 shows a simulation result of the heat dissipation effect. 2A shows an example of temperature distribution related to the electronic component circuit board 1 having the structure shown in FIG. 1, and FIG. 2B relates to the electronic component circuit board 11 having the structure shown in FIG. An example of temperature distribution is shown. Here, only the conditions for the presence or absence of the slit 6 are different.

  As shown in the figure, the first IC 3 with a small calorific value has a slightly higher temperature than the conventional configuration. However, the temperature decreases slightly in the second IC 4. Furthermore, in the region between the first IC 3 and the second IC 4 (the region from the slit 6 to the second IC 4), it can be confirmed that the temperature is considerably lowered. Thus, by providing the slit 6 in the vicinity of the first IC 3, it is possible to reduce variations in temperature distribution in the entire heat sink 5. Also, the heat dissipation effect can be separated and operated. That is, it becomes easy to control the heat dissipation effect for each heat generating component.

  The shape of the slit 6 is not limited to the U-shape, and for example, a hole may be provided to change the heat conduction path to control heat separation, concentration, and the like. Further, the thickness may be changed by partially thickening, thinning, or uneven processing. Further, the material may be partially changed to a material having low thermal conductivity, or a material containing bubbles may be employed. Further, it may be partially bent, folded, or bonded or screwed with a plurality of heat dissipation materials. Furthermore, the surface area of the heat radiating portion may be changed by partially providing fins or the like. Furthermore, the above shapes can be combined. In addition, in FIG. 3, the example of a shape of the applicable slit 6 is shown. The type of slit 6 to be applied depends on the amount of heat generated by each of the first IC 3 and the second IC 4, how much the temperature distribution variation is to be reduced, and the manufacturing process and cost. It is determined.

  The present invention has been described based on the embodiments. This embodiment is an exemplification, and it will be understood by those skilled in the art that various modifications can be made to combinations of these components, and such modifications are also within the scope of the present invention.

1 Electronic Component Circuit Board 2 Board 3 First IC
4 Second IC
5 Heat sink 6 Slit

Claims (3)

An electronic component circuit board comprising a plurality of heat generating components mounted on a substrate and a heat sink commonly mounted on the plurality of heat generating components,
The electronic component circuit board, wherein the heat radiating plate is provided with a slit that obstructs heat transfer in a path between the plurality of heat generating components.   The slit inhibits heat transfer in a path between the plurality of heat generating components and the heat generating component having a relatively large heat generation amount in a region where the heat generating component having a relatively small heat generation amount is attached. The electronic component circuit board according to claim 1, wherein the electronic component circuit board is provided. An integrated circuit component comprising first and second integrated circuit components mounted on a substrate, and a heat sink commonly mounted on the first and second integrated circuit components,
The first integrated circuit component has a larger calorific value than the second integrated circuit component and exhibits a substantially rectangular shape in plan view when mounted on the substrate;
The heat sink has a slit formed so as to surround the first integrated circuit component,
The slit is a shape that is not formed in the vicinity of the side farthest from the second integrated circuit among the four sides of the substantially rectangular shape of the first integrated circuit component. .

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