JP2019148435A - Physical quantity sensor manufacturing method - Google Patents

Abstract

An object of the present invention is to prevent damage to structures such as a movable electrode and a fixed electrode that may occur when a conductive film (equipotential wiring) of the movable electrode and the fixed electrode is removed. A step of joining a member to be processed to a substrate, etching the member to be processed in a state where the fixed part and the member to be processed are electrically connected by a conductor part, and connecting the fixed part to the fixed part by a conductor part. Forming the movable portion in an electrically connected state; and arranging the conductor portion outside a lid housing the movable portion and the fixed portion, and joining the lid to the substrate. And bonding the lid to the substrate, and then etching the conductor to electrically separate the movable part and the fixed part from each other. [Selection diagram] FIG.

Description

  The present invention relates to a method for manufacturing a physical quantity sensor.

  In recent years, as a physical quantity sensor for detecting a physical quantity, a sensor element having a movable electrode and a fixed electrode arranged in a comb-like shape and facing each other is detected, and the physical quantity is detected based on the capacitance between these two electrodes. Capacitance type sensors have been proposed.

  As such a sensor, for example, Patent Document 1 discloses a micro electro mechanical system (MEMS) in which a comb-like movable electrode finger and a fixed electrode finger are arranged as a sensor element with a gap therebetween. Sensors and manufacturing methods are described. In the MEMS sensor and the manufacturing method described in Patent Document 1, a first element piece including a movable electrode finger and a fixed electrode finger electrically connected by a conductive film (equipotential wiring) on a substrate is formed. And a second processing step of removing the conductive film and separating the movable electrode finger and the fixed electrode finger thereafter.

JP 2013-140085 A

  However, in the manufacturing method of the MEMS sensor described in Patent Document 1 described above, the element is removed while removing the conductive film (equipotential wiring) after the formation of the element piece including the movable electrode and the fixed electrode (first processing step). The pieces are cut into individual pieces (second processing step). As described above, when the conductive film (equipotential wiring) is removed after the movable electrode and the fixed electrode are formed, the conductive film (equipotential wiring) is removed because structures such as the movable electrode and the fixed electrode are exposed. At this time, there is a possibility that structures such as the movable electrode and the fixed electrode are damaged.

  The physical quantity sensor manufacturing method of the present application includes a substrate, a movable portion that is displaceable with respect to the substrate, and a fixed portion that is fixed to the substrate and is disposed so as to be spaced apart and opposed to the movable portion. A method for manufacturing a sensor, comprising: joining a workpiece to the substrate; etching the workpiece in a state where the fixed portion and the workpiece are electrically connected by a conductor; A step of forming the movable portion in a state of being electrically connected to the fixed portion by a conductor portion; and the conductor portion is disposed outside a lid that houses the movable portion and the fixed portion, and the lid And bonding the lid to the substrate, etching the conductor portion, and electrically separating the movable portion and the fixed portion from each other. It is characterized by that.

  In the method of manufacturing a physical quantity sensor described above, it is preferable that the method includes a step of dividing the substrate into pieces, and the conductor portion is disposed outside a region to be cut out by the separation.

  In the above-described physical quantity sensor manufacturing method, the conductor portion is preferably formed of titanium tungsten (TiW).

  In the physical quantity sensor manufacturing method described above, the physical quantity sensor includes a connection terminal including a first metal layer and a second metal layer arranged outside the connected lid, and the second metal layer includes the substrate and the substrate. Preferably, the conductor portion is provided between the first metal layer and the conductor portion includes the same material as that of the second metal layer.

  In the above-described physical quantity sensor manufacturing method, the conductor portion is preferably provided between the connection terminal and the lid.

  In the physical quantity sensor manufacturing method described above, the connection terminal includes a first connection terminal connected to the movable part and a second connection terminal connected to the fixed part, and the first connection terminal and the It is preferable that the conductor portion is provided between the second connection terminal.

The top view which shows the physical quantity sensor which concerns on 1st Embodiment of this invention. FIG. 2 is a cross-sectional view taken along line AA in FIG. 1. The BB sectional view taken on the line in FIG. CC sectional view taken on the line in FIG. The flowchart which shows the manufacturing process of a physical quantity sensor. The top view for demonstrating the manufacturing method of a physical quantity sensor. The top view for demonstrating the manufacturing method of a physical quantity sensor. The top view for demonstrating the manufacturing method of a physical quantity sensor. The top view for demonstrating the manufacturing method of a physical quantity sensor. The top view for demonstrating the manufacturing method of a physical quantity sensor. The top view for demonstrating the manufacturing method of a physical quantity sensor. The top view for demonstrating the manufacturing method of a physical quantity sensor. The top view which shows the modification 1 of an electroconductive part. The top view which shows the modification 2 of an electroconductive part. The top view which shows the modification 3 of an electroconductive part. Sectional drawing which shows schematic structure of a physical quantity sensor device. The functional block diagram which shows schematic structure of a composite sensor. The disassembled perspective view which shows schematic structure of an inertial measurement unit. The perspective view which shows the example of arrangement | positioning of the inertial sensor element of an inertial measurement unit. The top view which shows the structure of a portable electronic device typically. The functional block diagram which shows schematic structure of a portable electronic device. The perspective view which shows typically the structure of the mobile personal computer which is an example of an electronic device. The perspective view which shows typically the structure of the smart phone (mobile telephone) which is an example of an electronic device. The perspective view which shows the structure of the digital still camera which is an example of an electronic device. The perspective view which shows the structure of the motor vehicle which is an example of a mobile body.

  Hereinafter, this embodiment will be described. In addition, this embodiment demonstrated below does not unduly limit the content of this invention described in the claim. In addition, all the configurations described in the present embodiment are not necessarily essential configuration requirements of the present invention.

<Physical quantity sensor>
(Configuration of physical quantity sensor)
First, the configuration of the physical quantity sensor according to the embodiment of the present invention will be described with reference to FIGS. 1, 2, 3, and 4. FIG. 1 is a plan view showing a physical quantity sensor according to the first embodiment of the present invention. 2 is a cross-sectional view taken along line AA in FIG. 3 is a cross-sectional view taken along line BB in FIG. 4 is a cross-sectional view taken along the line CC in FIG.

  In the following, for convenience of explanation, the three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis, a direction parallel to the X axis is referred to as an “X axis direction”, and a direction parallel to the Y axis is referred to as a “Y axis direction. The direction parallel to the Z axis is also referred to as the “Z axis direction”. Further, the tip end side of each axis in the arrow direction is also referred to as “plus (+) side”, and the opposite side is also referred to as “minus (−) side”. Further, the Z axis direction plus side is also referred to as “upper”, and the Z axis direction minus side is also referred to as “lower”.

  A physical quantity sensor 1 shown in FIG. 1 is an acceleration sensor that can detect an acceleration Ax in the X-axis direction. Such a physical quantity sensor 1 is provided on the board 2, the sensor element 3 that detects the acceleration Ax (physical quantity) in the X-axis direction, and the lid that is joined to the board 2 so as to cover the sensor element 3. 10. In addition, in FIG. 1, the state which looked through the cover body 10 is shown.

  The board | substrate 2 has the recessed part 21 opened to the upper surface. The recess 21 is formed so as to overlap the sensor element 3 in a plan view from the Z-axis direction. Such a recess 21 functions as an escape portion for preventing contact between the sensor element 3 and the substrate 2. Further, the substrate 2 has groove portions 25, 26, 27, 28, and 29 opened on the upper surface. The groove portions 25, 26, 27, 28, 29 have, for example, a planar shape corresponding to the planar shapes of the wirings 75, 76, 77, 78 and the connection terminal (pad electrode) P. In the groove portions 25, 26, 27, wirings 75, 76, 77 are arranged. In addition, the groove part 28 is a groove | channel corresponding to the connection terminal P mentioned later, and a part (2nd metal layer) of wiring 75,76,77 is arrange | positioned among them. In addition, the groove 29 is provided with a wiring 78 that connects the wirings 75, 76, and 77 to form a conductor portion. Moreover, the groove part 29 and the wiring 78 are provided outside the area | region excised when separating the physical quantity sensor 1 into pieces.

  The wirings 75, 76, and 77 are electrically connected to the sensor element 3, respectively. One end of each of the wirings 75, 76, 77 is exposed to the outside of the lid body 10, and is electrically connected to the connection terminal (pad electrode) P on the outside of the lid body 10. Is electrically connected to the wiring 78 as a conductor portion. That is, the wirings 75, 76, and 77 function as wirings for electrically connecting the sensor element 3 and the connection terminal P, respectively.

  The connection terminal P is disposed outside the lid body 10, is disposed so as to overlap with the groove portion 28 connected to the groove portions 25, 26, and 27, and wirings 75, 76, and 77 are disposed in the groove portions 25, 26, and 27, respectively. And are electrically connected. The connection terminal P includes a second metal layer disposed on the substrate 2 side and a first metal layer 79 disposed on the upper side of the second metal layer (on the side opposite to the substrate 2). In other words, the second metal layer is provided between the substrate 2 and the first metal layer 79. The second metal layer includes the same material as the wirings 75, 76, 77 and the wiring 78 as the conductor portion. For example, ITO (Indium Tin Oxide), aluminum, gold, platinum, or the like can be applied to the first metal layer 79. Such a connection terminal P functions as a connection terminal with the outside of the physical quantity sensor 1, and a bonding wire is connected to the upper surface thereof (see FIG. 16 described later).

  The wiring 78 is exposed to the outside of the lid body 10, and once electrically connected to the wiring 75, 76, 77, a part of the wiring 78 is removed, whereby the wiring 75, 76, 77 is individually connected. Configured as wiring. The wiring 78 is preferably configured using, for example, titanium tungsten (TiW). Thus, by using the wiring 78 using titanium tungsten (TiW), a part of the wiring 78 as a conductor portion can be easily removed by etching. Note that the groove 29 where the wiring 78 is removed remains connected to the grooves 25, 26, and 27. Further, the wiring 78 as the conductor provided in the groove 29 will be described in detail in a manufacturing method described later.

  As such a substrate 2, for example, a glass substrate made of a glass material containing alkali metal ions such as sodium ions (for example, borosilicate glass such as Pyrex (registered trademark) glass or Tempax (registered trademark) glass). Can be used. Thereby, as described later, the sensor element 3 and the substrate 2 can be bonded by anodic bonding, and these can be firmly bonded. However, the substrate 2 is not limited to a glass substrate, and for example, a silicon substrate or a ceramic substrate may be used. When a silicon substrate is used, it is preferable to use a high-resistance silicon substrate or a silicon substrate having a silicon oxide film (insulating oxide) formed on the surface by thermal oxidation or the like from the viewpoint of preventing a short circuit. .

  Note that the thickness of the substrate 2 in the case of using silicon is not particularly limited, but is preferably 50 μm or more and 400 μm or less, for example. As a result, the sensor element 3 can be reduced in size (reduced height) while ensuring sufficient strength. Moreover, the board | substrate 2 can be thinned in the below-mentioned joining process. The substrate 2 is more preferably 10 μm or more and 100 μm or less.

  As shown in FIG. 2, the lid 10 has a recess 11 that opens to the lower surface side. Such a lid 10 is bonded to the upper surface of the substrate 2 so that the sensor element 3 is accommodated in the recess 11. A storage space S for storing the sensor element 3 is formed by the lid 10 and the substrate 2. The storage space S is preferably filled with an inert gas such as nitrogen, helium, and argon, and is about 1/10 to 1 atm at the operating temperature (about −40 ° C. to 120 ° C.). By setting the storage space S to about 1/10 to 1 atm, the viscous resistance is increased and the damping effect is exhibited, so that the vibration of the sensor element 3 can be quickly converged. Therefore, the detection accuracy of the acceleration Ax of the physical quantity sensor 1 is improved.

  Such a lid 10 is formed from a silicon substrate. However, the lid 10 is not limited to a silicon substrate, and may be formed of, for example, a glass substrate or a ceramic substrate. Moreover, it does not specifically limit as a joining method of the board | substrate 2 and the cover body 10, What is necessary is just to select suitably according to the material of the board | substrate 2 and the cover body 10, For example, the joining surface activated by anodic bonding and plasma irradiation Examples include activation bonding for bonding together, bonding using a bonding material such as glass frit, diffusion bonding for bonding metal films formed on the upper surface of the substrate 2 and the lower surface of the lid 10, and the like. In the present embodiment, as shown in FIG. 2, the substrate 2 and the lid body 10 are bonded via a glass frit 19 (low melting point glass).

  As shown in FIG. 1, the sensor element 3 is provided on the upper surface of the substrate 2. The sensor element 3 is a movable structure 3A as a movable portion that can be displaced with respect to the substrate 2, and a first fixed that is fixed to the upper surface of the substrate 2, spaced apart from the movable structure 3A, and opposed to it. A structure 3B and a second fixed structure 3C. The movable structure 3A includes a pair of fixed portions 31 and 32 fixed to the upper surface of the substrate 2, a movable base portion 33 disposed between the fixed portions 31 and 32 and positioned on the concave portion 21, and a movable base. It has a pair of spring parts 34 and 35 which connect the part 33 and the fixed parts 31 and 32, and a plurality of movable electrode fingers 36 which protrude from the movable base part 33 to both sides in the Y-axis direction. In such a movable structure 3A, when the acceleration Ax in the X-axis direction is applied, the movable base portion 33 is displaced in the X-axis direction while elastically deforming the spring portions 34 and 35.

  On the other hand, the first fixed structure 3 </ b> B is fixed to the upper surface of the substrate 2 and has a plurality of first fixed electrode fingers 37 extending in the Y-axis direction. A plurality of second fixed electrode fingers 38 that are fixed and extend in the Y-axis direction are provided. Each first fixed electrode finger 37 is positioned on the X-axis direction plus side with respect to the corresponding movable electrode finger 36 and is opposed to the movable electrode finger 36 so as to be separated from each other. The movable electrode finger 36 is positioned on the minus side in the X-axis direction and is spaced apart from the movable electrode finger 36. In other words, one movable electrode finger 36 is disposed between a pair of first fixed electrode fingers 37 and second fixed electrode fingers 38.

  The movable structure 3 </ b> A is electrically connected to the wiring 75 in the fixed portion 31, each first fixed electrode finger 37 is electrically connected to the wiring 76, and each second fixed electrode finger 38 is connected to the wiring 77. And are electrically connected.

  Such a sensor element 3 is patterned by etching (particularly dry etching) a conductive silicon substrate (workpiece) doped with impurities such as phosphorus (P), boron (B), arsenic (As), for example. By doing so, it can be formed. The sensor element 3 is bonded to the upper surface of the substrate 2 by anodic bonding. However, the material of the sensor element 3 and the bonding method between the sensor element 3 and the substrate 2 are not particularly limited.

  The configuration of the physical quantity sensor 1 has been described above. When the physical quantity sensor 1 operates, for example, a voltage is applied to the movable structure 3A via the wiring 75, and the first fixed electrode fingers 37 and the second fixed electrode fingers 38 are connected to the QV via the wirings 76 and 77, for example. It is connected to an amplifier (charge voltage conversion circuit). A capacitance Ca is formed between each first fixed electrode finger 37 and each movable electrode finger 36, and a capacitance Cb is formed between each second fixed electrode finger 38 and each movable electrode finger 36. Is done.

  When acceleration Ax is applied to the physical quantity sensor 1, the movable base portion 33 is displaced in the X-axis direction while elastically deforming the spring portions 34 and 35 based on the magnitude of the acceleration Ax. Along with this displacement, the gap between the first fixed electrode finger 37 and the movable electrode finger 36 and the gap between the second fixed electrode finger 38 and the movable electrode finger 36 change, and with this displacement, the capacitance Ca , Cb change. Therefore, the acceleration Ax can be detected based on the changes in the capacitances Ca and Cb.

  Note that the capacitance Cb decreases as the capacitance Ca increases, and conversely, the capacitance Cb increases as the capacitance Ca decreases. Therefore, a differential calculation (a signal corresponding to the magnitude of the electrostatic capacitance Ca) obtained from the wiring 76 and a detection signal (a signal corresponding to the magnitude of the electrostatic capacitance Cb) obtained from the wiring 77 are performed. By performing the subtraction process (Ca-Cb), the noise can be canceled and the acceleration Ax can be detected with higher accuracy.

(Manufacturing method of physical quantity sensor)
Next, a method for manufacturing the physical quantity sensor 1 according to the embodiment will be described with reference to FIGS. FIG. 5 is a flowchart showing the manufacturing process of the physical quantity sensor. 6 to 12 are plan views for explaining a method of manufacturing a physical quantity sensor.

  As shown in the flowchart of FIG. 5, the manufacturing method of the physical quantity sensor 1 according to the embodiment includes a preparation step S <b> 101 for preparing the substrate 2 and a bonding step for bonding the silicon substrate 30 that is a base material of the sensor element 3 to the substrate 2. S102, a sensor element forming step S103 for patterning the silicon substrate 30 by dry etching to form the sensor element 3, a lid joining step S104 for joining the lid 10 to the substrate 2, and a wiring 78 as a conductor portion A conductor portion etching step S105 for removing the portion and a singulation step S106. Hereinafter, each process is demonstrated one by one.

[Preparation Step S101]
First, as shown in FIG. 6, a glass substrate 20 as a base material of the substrate 2 is prepared. The glass substrate 20 includes a plurality of individualized regions K arranged in a matrix, and each individualized region K is formed with a recess 21 and grooves 25, 26, 27, 28, 29. . Next, wirings 75, 76, 77, 78 are arranged in the groove portions 25, 26, 27, 29 in each singulated region K. Further, in each singulated region K, the first metal layer 79 containing the same material as the wirings 75, 76, 77, 78 is electrically connected to the wirings 75, 76, 77 in the groove 28 corresponding to the connection terminal P. And place it. In addition, the groove part 29 and the wiring 78 are arrange | positioned outside the area | region excised when separating the physical quantity sensor 1 into pieces. The first metal layer 79 may be provided with the same material as the wirings 75, 76, 77, 78.

[Jointing step S102]
Next, as shown in FIG. 7, a silicon substrate 30 (member to be processed) serving as a base material of the sensor element 3 is prepared, and the silicon substrate 30 is bonded to the upper surface of the glass substrate 20. The bonding method between the silicon substrate 30 and the glass substrate 20 is not particularly limited, but in the present embodiment, bonding is performed by an anodic bonding method. Next, after thinning the silicon substrate 30 using CMP (chemical mechanical polishing) as necessary, the silicon substrate 30 is doped with impurities such as phosphorus (P), boron (B), and arsenic (As) (diffusion). ) To provide conductivity. However, the order of doping impurities is not particularly limited, and may be before the silicon substrate 30 is thinned or before the silicon substrate 30 is bonded to the glass substrate 20.

[Sensor element forming step S103]
Next, as shown in FIG. 8, a hard mask HM having dry etching resistance is formed on the upper surface of the silicon substrate 30. The hard mask HM includes, for example, a mask 360 corresponding to each movable electrode finger 36, masks 370 and 380 corresponding to each first fixed electrode finger 37, and each second fixed electrode finger 38, and A mask 300 or the like corresponding to the movable base portion 33 is formed corresponding to the shape of the sensor element 3. The hard mask HM can be formed, for example, by patterning a silicon oxide film formed by thermally oxidizing the surface of the silicon substrate 30. However, the constituent material and the forming method of the hard mask HM are not particularly limited as long as the function can be exhibited.

  Next, the silicon substrate 30 is dry-etched through the hard mask HM. As a result, as shown in FIG. 9, the sensor element 3 is formed from the silicon substrate 30 for each singulated region K. The dry etching method is not particularly limited. For example, a dry Bosch method combining an etching process using a reactive plasma gas and a deposition process can be used.

  Here, as shown in FIGS. 9 and 10, the movable structure 3 </ b> A constituting the sensor element 3, the first fixed structure 3 </ b> B and the second fixed structure 3 </ b> C are disposed in the grooves 25, 26, and 27. The wirings 75, 76 and 77 are electrically connected. Furthermore, the wirings 75, 76, 77 are electrically connected by a wiring 78 as a conductor portion disposed in the groove 29. As a result, the movable structure 3A, the first fixed structure 3B, and the second fixed structure 3C constituting the sensor element 3 are electrically at the same potential, and the silicon substrate 30 ( The charges stored in the movable structure 3A, the first fixed structure 3B, and the second fixed structure 3C) can be made uniform for each singulated region K. That is, the charging to the movable structure 3A, the first fixed structure 3B, and the second fixed structure 3C can be suppressed, the influence on the measurement accuracy due to the charging to each part can be reduced, and the acceleration The physical quantity sensor 1 can detect Ax with high accuracy. Note that the movable structure 3A, the first fixed structure 3B, and the second fixed structure 3C have the same potential until a part of the wiring 78 as the conductor portion is removed by the conductor portion etching step S105 shown in FIG. It has become.

[Cover Bonding Step S104]
Next, as shown in FIG. 11, a silicon substrate 30 b serving as a base material of the lid 10 is prepared, and the silicon substrate 30 b is bonded to the upper surface of the glass substrate 20 through the glass frit 19. The silicon substrate 30b is provided with a concave portion 11 (see FIGS. 2 and 3) of the lid 10 that opens to the lower surface side for each individual region K (not shown), and the sensor element 3 is provided in the concave portion 11. Is housed.

[Conductor Etching Step S105]
Next, as shown in FIG. 12, a part of the wiring 78 as the conductor portion is removed by etching. In this step, an etching mask including the first metal layer 79 of the connection terminal P disposed outside the silicon substrate 30 serving as a base material of the lid body 10 and the lid body 10 is provided, and wet etching, or A part of the wiring 78 is removed by dry etching. As a result, the wirings 75, 76, 77 electrically connected by the wiring 78 are separated, and accordingly, the movable structure 3A, the first fixed structure 3B, and the second fixed structure 3C are electrically connected. To be separated. If the wirings 75, 76, 77 located outside the silicon substrate 30 have the same configuration as that of the connection terminal P, that is, the configuration of the second metal layer and the first metal layer 79, Since the silicon substrate 30 and the first metal layer 79 to be formed can be used as an etching mask, it is not necessary to form a mask when the wiring 78 is removed, and the manufacturing process can be simplified.

[Individualization step S106]
Next, the glass substrate 20 is cut along the scribe line L shown in FIG. Through the above steps, a plurality of separated physical quantity sensors 1 (see FIG. 1) are obtained.

  The structure of the physical quantity sensor 1 and the manufacturing method thereof have been described above. According to such a physical quantity sensor 1, the first fixed structure 3 </ b> B and the second fixed structure 3 </ b> C are electrically connected by the wiring 78 as a conductor portion arranged outside the lid body 10 joined to the substrate 2. A movable structure 3A in a connected state is provided. After the lid 10 is joined to the substrate 2, the wiring structure 78 is etched to electrically separate the movable structure 3A from the first fixed structure 3B and the second fixed structure 3C. Thereby, when part or all of the wiring 78 is removed by etching, the movable structure 3A, the first fixed structure 3B, and the second fixed structure 3C are protected by the lid 10, so that the movable structure Damage to 3A, the first fixed structure 3B, and the second fixed structure 3C can be reduced.

  In addition, since the conductor portion (wiring 78) is disposed outside the region to be cut out by the individualization in the individualization step S106, the region to be cut out by the individualization can be reduced, and the substrate 2 can be reduced in size. Manufacturing efficiency can be improved.

(Modification of conductor part)
In the embodiment described above, the wiring 78 (groove portion 29) as the conductor portion is disposed outside the connection terminal P in the X-axis direction, in other words, disposed on the opposite side to the sensor element 3 with respect to the connection terminal P. However, the arrangement configuration of the conductor portion can be a form as shown in Modification 1, Modification 2, and Modification 3 shown below. Hereinafter, modification examples relating to the configuration of the wiring 78 (groove portion 29) as the conductor portion will be sequentially described with reference to FIG. 13, FIG. 14, and FIG. FIG. 13 is a plan view showing Modification Example 1 of the conductive portion. FIG. 14 is a plan view showing Modification Example 2 of the conductive portion. FIG. 15 is a plan view showing Modification Example 3 of the conductive portion. Note that, in the description related to the following modifications, the same configurations as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof is omitted.

[Modification 1]
First, Modification 1 of the conductor portion will be described with reference to FIG. As illustrated in FIG. 13, the physical quantity sensor 1 a including the conductor portion of Modification 1 includes a wiring 78 a serving as a conductor portion and a groove 29 a in which the wiring 78 a is disposed. The groove 29a and the wiring 78a are provided between the connection terminal P and the lid body 10 in the X-axis direction.

  Specifically, the groove part 29a is disposed between the groove part 25 and the groove part 26 and between the groove part 25 and the groove part 27, and is connected to each of the groove parts 25, 26, and 27. The wiring 78 a is disposed between the wiring 75 and the wiring 76 and between the wiring 75 and the wiring 77, and is connected to each of the wirings 75, 76, 77, between the wiring 75 and the wiring 76, and with the wiring 75. Part of the wiring 77 is removed. Note that the wiring 78a in FIG. 13 shows a state in which a part of the wiring 78a has been removed in the same method as the conductor etching step S105 in the method of manufacturing the physical quantity sensor 1 described above.

  According to the configuration of the conductor portion (wiring 78a) according to the first modification example, it is outside the region to be excised when the physical quantity sensor 1a is separated, and between the connection terminal P and the lid body 10. Since the conductor portion (wiring 78a) is disposed, the substrate 2 can be reduced in size, and the manufacturing efficiency of the physical quantity sensor 1a can be increased.

[Modification 2]
Next, Modification Example 2 of the conductor portion will be described with reference to FIG. As illustrated in FIG. 14, the physical quantity sensor 1 b including the conductor portion of Modification 2 includes a wiring 78 b serving as a conductor portion and a groove portion 29 b in which the wiring 78 b is disposed. The groove 29b and the wiring 78b are provided between the connection terminals P.

  Specifically, the groove 29b includes a first connection terminal P1 that is a connection terminal P connected to the movable structure 3A that constitutes the sensor element 3, a first fixed structure 3B that constitutes the sensor element 3, and a second connection structure P. It arrange | positions between the 2nd connection terminal P2 which is the connection terminal P connected with each of 3 C of fixed structures. And the groove part 29b is connected with the groove part 28 which comprises the 1st connection terminal P1 and the 2nd connection terminal P2.

  The wiring 78b includes a second metal layer (not shown) of the first connection terminal P1 connected to the wiring 75 and a second metal layer (not shown) of the second connection terminal P2 connected to the wiring 76. Are connected. The wiring 78b includes a second metal layer (not shown) of the first connection terminal P1 connected to the wiring 75 and a second metal layer (not shown) of the second connection terminal P2 connected to the wiring 77. Is connected. A part of the wiring 78b is removed between the first connection terminal P1 and the second connection terminal P2. Note that the wiring 78b in FIG. 14 shows a state in which a part thereof is removed in the same method as the conductor etching step S105 in the method of manufacturing the physical quantity sensor 1 described above.

  According to the configuration of the conductor portion (wiring 78b) according to the second modification, the conductor portion (wiring 78b) is arranged between the first connection terminal P1 and the second connection terminal P2, and thus the arrangement area is increased. The conductor portion (wiring 78b) can be provided without any problem. Therefore, the substrate 2 can be further reduced in size, and the manufacturing efficiency of the physical quantity sensor 1b can be increased.

[Modification 3]
Next, Modification 3 of the conductor portion will be described with reference to FIG. As shown in FIG. 15, the conductor portion (wiring 78) of Modification 3 is arranged outside the connection terminal P in the X-axis direction, and in the singulation step S106 in the manufacturing method of the physical quantity sensor 1 described above. When the glass substrate 20 is cut along the scribe line L1, it is provided at a position that is outside the singulated region K.

  The groove 29 and the wiring 78 are connected to the grooves 25, 26, 27 and the wirings 75, 76, 77 extending from the connection terminals P. A part of the wiring 78 is removed by the same method as the conductor etching step S105 in the method for manufacturing the physical quantity sensor 1 described above.

  According to the configuration of the conductor portion (wiring 78a) according to Modification 3 described above, when the glass substrate 20 is cut along the scribe line L1 in the singulation step S106 in the manufacturing method of the physical quantity sensor 1, Since it is provided at a position outside the region to be excised when separated into individual pieces outside the individualized region K, the region to be excised by the individualization can be reduced. Thereby, the board | substrate 2 can be reduced in size and the manufacturing efficiency of the physical quantity sensor 1 can be improved.

<Physical quantity sensor device>
Next, a physical quantity sensor device including the physical quantity sensor 1 will be described with reference to FIG. FIG. 16 is a cross-sectional view illustrating a schematic configuration of the physical quantity sensor device. In FIG. 16, for convenience of explanation, the X axis, the Y axis, and the Z axis are illustrated as three axes orthogonal to each other. The direction parallel to the X axis is “X axis direction”, and is parallel to the Y axis. The direction is referred to as “Y-axis direction”, and the direction parallel to the Z-axis is referred to as “Z-axis direction”. The + (plus) Z-axis side that is the lid side is also referred to as “upper” or “upper”, and the − (minus) Z-axis side that is the opposite side is also referred to as “lower” or “lower”.

  As shown in FIG. 16, the physical quantity sensor device 200 including the physical quantity sensor 1 described above can be used as a uniaxial acceleration sensor that can independently detect acceleration in one direction. Such a physical quantity sensor device 200 includes a package 220, a physical quantity sensor 1 housed in the package 220, and an IC (integrated circuit) 240 as a circuit element disposed on the physical quantity sensor 1. The lower surface 220r of the physical quantity sensor 1 is joined to the inner side of the package 220 (accommodating space 217) by a resin adhesive 188 as

  The package 220 is connected to the third base member 213 through the sealing member 214 and the base 210 composed of the first base member 211, the second base member 212, and the third base member 213. And a lid 215 that is formed. The first base material 211, the second base material 212, and the third base material 213 are stacked in this order to form the base portion 210. The first base material 211 has a flat plate shape, the second base material 212 and the third base material 213 are annular bodies from which the central portion is removed, and the peripheral edge of the upper surface of the third base material 213 In addition, a sealing member 214 such as a seal ring or low melting point glass is formed.

  In the package 220, a recess (cavity) that accommodates the physical quantity sensor 1 is formed by the second base material 212 and the third base material 213 that are annular bodies from which the central portion is removed. The package 220 and the opening of these recesses (cavities) are closed by the lid 215 to provide a storage space (internal space) 217 that is a sealed space, and the physical quantity sensor 1 is stored in the storage space 217. be able to. As described above, the physical quantity sensor 1 is housed in the housing space 217 provided between the package 220 and the lid body 215, whereby a compact physical quantity sensor device 200 can be obtained. A part of the wiring pattern and electrode pads (terminal electrodes) formed on the base portion 210 including the first base material 211 and the second base material 212 are not shown.

  As a constituent material of the first base material 211, the second base material 212, and the third base material 213, ceramic or the like is preferably used. Note that as the constituent material of the first base material 211, the second base material 212, and the third base material 213, glass, resin, metal, or the like may be used in addition to ceramic. Moreover, as a constituent material of the lid 215, for example, a metal material such as Kovar, a glass material, a silicon material, a ceramic material, a resin material, or the like can be used.

  A plurality of internal terminals 219 are arranged on the upper surface of the second base material 212, and a plurality of external terminals 216 are arranged on the outer bottom surface 210 r of the package 220, which is the lower surface of the first base material 211. Yes. Each internal terminal 219 is electrically connected to a corresponding external terminal 216 via an internal wiring (not shown) formed in the base portion 210. The internal terminal 219 and the external terminal 216 are made of, for example, a metal wiring material such as tungsten (W) or molybdenum (Mo) that is screen-printed at a predetermined position and baked, and then nickel (Ni), gold ( It can be formed by a method of plating such as Au).

  In the physical quantity sensor 1, the lower surface 220 r of the physical quantity sensor 1 is connected to the connection pad 189 on the upper surface 210 f of the first base material 211 constituting the base portion 210 by the resin adhesive 188, and stored in the storage space 217 of the package 220. Has been. The accommodation space 217 of the package 220 is hermetically sealed in a reduced-pressure atmosphere lower than atmospheric pressure or an inert gas atmosphere such as nitrogen, argon, or helium.

  The IC 240 is disposed on the upper surface of the physical quantity sensor 1 (on the lid body 10 (see FIG. 2)) via the adhesive layer 241. The adhesive layer 241 is not particularly limited as long as the IC 240 can be fixed on the physical quantity sensor 1. For example, solder, silver paste, a resin adhesive (die attach material), or the like can be used.

  In the IC 240, for example, a drive circuit that drives the physical quantity sensor 1, a detection circuit that detects the acceleration Ax based on a signal from the physical quantity sensor 1, and an output that converts a signal from the detection circuit into a predetermined signal and outputs the signal. Circuits etc. are included. The IC 240 has a plurality of electrode pads (not shown) on the upper surface, and each electrode pad is electrically connected to the internal terminal 219 of the second base material 212 via the bonding wire 242, and the other electrodes The pad is electrically connected to the connection terminal P of the physical quantity sensor 1 through the bonding wire 243. Thereby, the physical quantity sensor 1 can be controlled.

  According to the physical quantity sensor device 200 described above, since the physical quantity sensor 1 described above and the IC 240 that can control the physical quantity sensor 1 are housed in one package 220, the physical quantity sensor 1 has the effect of the physical quantity sensor 1. A compact physical quantity sensor device 200 can be obtained.

  Note that the configuration of the physical quantity sensor device 200 is not limited to the above configuration, and for example, the physical quantity sensor device 200 and the IC 240 can be packaged with, for example, an epoxy-based mold resin.

<Composite sensor>
Next, a configuration example of a composite sensor including the above-described physical quantity sensor 1 will be described with reference to FIG. FIG. 17 is a functional block diagram showing a schematic configuration of the composite sensor. In the following description, an example using the physical quantity sensor 1 including the sensor element 3 that detects acceleration according to the first embodiment will be described.

  As shown in FIG. 17, the composite sensor 900 includes an X-axis acceleration sensor 950x, a Y-axis acceleration sensor 950y, and a Z-axis acceleration sensor 950z using the physical quantity sensor 1 including the sensor element 3 capable of detecting acceleration as described above. And an angular velocity sensor 920 including an angular velocity sensor element. The X-axis acceleration sensor 950x, the Y-axis acceleration sensor 950y, and the Z-axis acceleration sensor 950z can each measure acceleration in one axis direction with high accuracy. The angular velocity sensor 920 includes three angular velocity sensor elements in order to measure angular velocities in three axial directions. The composite sensor 900 includes, for example, a drive circuit that drives the X-axis acceleration sensor 950x, the Y-axis acceleration sensor 950y, and the Z-axis acceleration sensor 950z, the X-axis acceleration sensor 950x, the Y-axis acceleration sensor 950y, and the Z-axis acceleration. A control including a detection circuit that detects acceleration in the X-axis, Y-axis, and Z-axis directions based on a signal from the sensor 950z, an output circuit that converts a signal from the detection circuit into a predetermined signal, and the like. A circuit part (IC) can be provided.

  According to such a composite sensor 900, the X-axis acceleration sensor 950x, the Y-axis acceleration sensor 950y, and the Z-axis acceleration sensor 950z configured by the physical quantity sensor 1 including the sensor element 3 capable of detecting acceleration as described above, The composite sensor 900 can be easily configured with the angular velocity sensor 920. For example, acceleration data and angular velocity data can be acquired.

<Inertial measurement unit>
Next, an inertial measurement unit (IMU) will be described with reference to FIGS. FIG. 18 is an exploded perspective view showing a schematic configuration of the inertial measurement unit. FIG. 19 is a perspective view showing an arrangement example of inertial sensor elements of the inertial measurement unit. In the following description, an example using the physical quantity sensor 1 capable of detecting the acceleration Ax will be described.

  As shown in FIG. 18, the inertial measurement unit 3000 includes an outer case 301, a joining member 310, a sensor module 325 including an inertial sensor element, and the like. In other words, the sensor module 325 is joined (inserted) with the joining member 310 interposed in the interior 303 of the outer case 301. The sensor module 325 includes an inner case 320 and a substrate 315. In order to make the explanation easier to understand, the part names are the outer case and the inner case, but may be referred to as the first case and the second case.

  The outer case 301 is a pedestal obtained by cutting aluminum into a box shape. The material is not limited to aluminum, and other metals such as zinc and stainless steel, resins, or composite materials of metals and resins may be used. Similar to the overall shape of the inertial measurement unit 3000 described above, the outer shape of the outer case 301 is a rectangular parallelepiped in plan view, and each has a through hole (an idiot hole) in the vicinity of two apexes located in the diagonal direction of the square. ) 302 is formed. The hole is not limited to the through hole (idiot hole) 302. For example, a notch that can be screwed with a screw (notch is formed in the corner portion of the outer case 301 where the through hole (idiot hole) 302 is located). (Structure to be formed) may be formed and screwed, or a flange (ear) may be formed on the side surface of the outer case 301 and the flange portion may be screwed.

  The outer case 301 is a box shape with a rectangular parallelepiped outer shape, and an inner portion 303 (inner side) is an inner space (container) surrounded by a bottom wall 305 and a side wall 304. In other words, the outer case 301 has a box shape with one surface facing the bottom wall 305 as an opening surface, and covers most of the opening portion of the opening surface (so as to close the opening portion). 325 is accommodated, and the sensor module 325 is exposed from the opening (not shown). Here, the opening surface facing the bottom wall 305 is the same surface as the upper surface 307 of the outer case 301. In addition, the planar shape of the inside 303 of the outer case 301 is a hexagonal shape with the corners of the two apexes of the square chamfered, and the two chamfered apexes correspond to the positions of the through holes (stupid holes) 302. Yes. In addition, in the cross-sectional shape (thickness direction) of the interior 303, the bottom wall 305 is formed with a first joint surface 306 as a bottom wall that is one step higher than the central portion at the periphery of the interior 303, that is, the interior space. . That is, the first joint surface 306 is a part of the bottom wall 305 and is a stepped portion formed in a ring shape so as to surround the central portion of the bottom wall 305 in a plan view. This is a surface having a small distance from the opening surface (the same surface as the upper surface 307).

  In addition, although the example in which the outer shape of the outer case 301 is a rectangular parallelepiped with a substantially square planar shape and a box shape without a lid has been described, the outer shape of the outer case 301 is not limited to this, and the planar shape of the outer case 301 is, for example, a hexagon or eight It may be a polygon such as a square, the corner of the polygon may be chamfered, or may be a planar shape with curved sides. Further, the planar shape of the inside 303 (inside) of the outer case 301 is not limited to the hexagon described above, but may be a square (square) such as a square, or another polygon such as an octagon. Further, the outer shape of the outer case 301 and the planar shape of the inner portion 303 may be similar or may not be similar.

  The inner case 320 is a member that supports the substrate 315 and has a shape that fits inside the outer case 301. Specifically, in a plan view, it is a hexagonal shape in which the corners of the two apexes of the square are chamfered, and provided in the opening 321 that is a rectangular through hole and a surface on the side that supports the substrate 315. A recess 331 is formed. The two chamfered apexes correspond to the position of the through hole (idiot hole) 302 of the outer case 301. The height in the thickness direction (Z-axis direction) is lower than the height from the upper surface 307 of the outer case 301 to the first joint surface 306. In the preferred example, the inner case 320 is also formed by cutting out aluminum, but other materials may be used similarly to the outer case 301.

  On the back surface of the inner case 320 (the surface on the outer case 301 side), guide pins for positioning the substrate 315 and support surfaces (both not shown) are formed. The substrate 315 is set (positioned and mounted) on the guide pins and the support surface and bonded to the back surface of the inner case 320. Details of the substrate 315 will be described later. A peripheral edge portion of the back surface of the inner case 320 is a second bonding surface 322 formed of a ring-shaped plane. The second joint surface 322 is substantially the same shape as the first joint surface 306 of the outer case 301 in a plan view, and when the inner case 320 is set on the outer case 301, the second joint surface 322 is sandwiched between the two members. Two faces will face each other. In addition, about the structure of the outer case 301 and the inner case 320, it is one Example, It is not limited to this structure.

  With reference to FIG. 19, the structure of the board | substrate 315 with which the inertial sensor was mounted is demonstrated. As shown in FIG. 19, the substrate 315 is a multilayer substrate in which a plurality of through holes are formed, and a glass epoxy substrate (glass epoxy substrate) is used. Note that the substrate is not limited to the glass epoxy substrate, and may be a rigid substrate on which a plurality of inertial sensors, electronic components, connectors, and the like can be mounted. For example, a composite substrate or a ceramic substrate may be used.

  A connector 316, an angular velocity sensor 317z, a physical quantity sensor 1 as an acceleration sensor, and the like are mounted on the surface of the substrate 315 (the surface on the inner case 320 side). The connector 316 is a plug-type (male) connector and includes two rows of connection terminals arranged at an equal pitch in the X-axis direction. Preferably, the connection terminals are 10 pins in a row and 20 pins in a total of 2 rows, but the number of terminals may be appropriately changed according to the design specifications.

  An angular velocity sensor 317z as an inertial sensor is a gyro sensor that detects a uniaxial angular velocity in the Z-axis direction. As a preferred example, a vibration gyro sensor that uses quartz as a vibrator and detects an angular velocity from a Coriolis force applied to a vibrating object is used. Note that the present invention is not limited to the vibration gyro sensor, and any sensor that can detect angular velocity may be used. For example, a sensor using ceramic or silicon may be used as the vibrator.

  In addition, an angular velocity sensor 317x that detects a uniaxial angular velocity in the X-axis direction is mounted on the side surface in the X-axis direction of the substrate 315 so that the mounting surface (mounting surface) is orthogonal to the X-axis. Similarly, an angular velocity sensor 317y that detects the uniaxial angular velocity in the Y-axis direction is mounted on the side surface of the substrate 315 in the Y-axis direction so that the mounting surface (mounting surface) is orthogonal to the Y-axis.

  The angular velocity sensors 317x, 317y, and 317z are not limited to the configuration using three angular velocity sensors for each axis, and may be any sensors that can detect the angular velocity of three axes, and three devices with one device (package). A sensor device capable of detecting (detecting) the angular velocity of the shaft may be used.

  The physical quantity sensor 1 described above uses, for example, a capacitance type acceleration sensor element 3 (for example, see FIG. 1) that can detect (detect) acceleration in one axial direction, for example, a silicon substrate processed by the MEMS technology. Note that, if necessary, a physical quantity sensor to which an acceleration sensor element capable of detecting acceleration in the biaxial directions of the X axis and the Y axis or an acceleration sensor element capable of detecting acceleration in the triaxial direction can be used.

  A control IC 319 as a control unit is mounted on the back surface of the substrate 315 (the surface on the outer case 301 side). The control IC 319 is an MCU (Micro Controller Unit) and includes a storage unit including a nonvolatile memory, an A / D converter, and the like, and controls each unit of the inertial measurement unit 3000. The storage unit stores a program that defines the order and contents for detecting acceleration and angular velocity, a program that digitizes detection data and incorporates it into packet data, and accompanying data. A plurality of other electronic components are mounted on the substrate 315.

  According to the inertial measurement unit 3000 as described above, since the physical quantity sensor 1 described above is used, it is possible to provide the inertial measurement unit 3000 that enjoys the effect of the physical quantity sensor 1.

<Portable electronic devices>
Next, a portable electronic device using the physical quantity sensor 1 will be described in detail based on FIG. 20 and FIG. Hereinafter, a wristwatch-type activity meter (active tracker) will be described and described as an example of a portable electronic device.

  As shown in FIG. 20, a wrist device 1000 that is a wristwatch-type activity meter (active tracker) is attached to a part (subject) such as a wrist of a user with bands 1032 and 1037 and the like. And wireless communication is possible. The physical quantity sensor 1 according to the present invention described above is incorporated in the wrist device 1000 together with a sensor for measuring an angular velocity as an acceleration sensor 113 (see FIG. 21) that measures acceleration.

  The wrist device 1000 includes a case 1030 in which at least the acceleration sensor 113 and the angular velocity sensor 114 (see FIG. 21) are accommodated, and a processing unit 100 that is accommodated in the case 1030 and processes output data from the acceleration sensor 113 and the angular velocity sensor 114. (See FIG. 21), a display unit 150 accommodated in the case 1030, and a translucent cover 1071 that closes the opening of the case 1030. A bezel 1078 is provided outside the case 1030 of the translucent cover 1071 of the case 1030. A plurality of operation buttons 1080 and 1081 are provided on the side surface of the case 1030. Hereinafter, further detailed description will be given with reference to FIG.

  The acceleration sensor 113 detects accelerations in the three-axis directions that intersect each other (ideally orthogonally), and outputs a signal (acceleration signal) corresponding to the magnitude and direction of the detected three-axis acceleration. Further, the angular velocity sensor 114 detects each angular velocity in three axial directions that intersect (ideally orthogonal) each other, and outputs a signal (angular velocity signal) corresponding to the magnitude and direction of the detected three axial angular velocity. To do.

  The wrist device 1000 includes a GPS (Global Positioning System) sensor 110. GPS is also called a global positioning system, and is a satellite positioning system for measuring the current position on the earth based on a plurality of satellite signals. The GPS has a function of performing positioning calculation using GPS time information and orbit information, acquiring a user's position information, a function of measuring a user's movement distance and movement locus, and a time correction function of a clock function. . The GPS sensor 110 can measure the current position on the earth based on satellite signals from GPS satellites.

  In the liquid crystal display (LCD) constituting the display unit 150, for example, position information using the GPS sensor 110 or the geomagnetic sensor 111, a moving amount / acceleration sensor 113, an angular velocity sensor 114, or the like is used according to various detection modes. The exercise information such as the amount of exercise, the biological information such as the pulse rate using the pulse sensor 115, or the time information such as the current time is displayed. Note that the environmental temperature using the temperature sensor 116 can also be displayed.

  The communication unit 170 performs various controls for establishing communication between the user terminal and an information terminal (not shown). The communication unit 170 includes, for example, Bluetooth (registered trademark) (including BTLE: Bluetooth Low Energy), Wi-Fi (registered trademark) (Wireless Fidelity), Zigbee (registered trademark), NFC (Near field communication), and ANT + (registered). (Trademark) and the like, and a connector corresponding to a communication bus standard such as USB (Universal Serial Bus).

  The processing unit 100 (processor) is configured by, for example, an MPU (Micro Processing Unit), a DSP (Digital Signal Processor), an ASIC (Application Specific Integrated Circuit), or the like. The processing unit 100 executes various processes based on a program stored in the storage unit 140 and a signal input from the operation unit 120 (for example, the operation buttons 1080 and 1081). The processing by the processing unit 100 includes data processing for each output signal of the GPS sensor 110, the geomagnetic sensor 111, the pressure sensor 112, the acceleration sensor 113, the angular velocity sensor 114, the pulse sensor 115, the temperature sensor 116, and the time measuring unit 130, and the display unit 150. Display processing for displaying an image on the screen, sound output processing for outputting sound to the sound output unit 160, communication processing for communicating with the information terminal via the communication unit 170, power control processing for supplying power from the battery 180 to each unit, etc. Is included.

Such a wrist device 1000 can have at least the following functions.
1. Distance: The total distance from the start of measurement is measured by a highly accurate GPS function.
2. Pace: Displays the current running pace from the measured pace distance.
3. Average speed: Calculate and display the average speed from the start to the present.
4). Elevation: The altitude is measured and displayed by the GPS function.
5. Stride: Steps are measured and displayed even in tunnels where GPS signals do not reach.
6). Pitch: Measures and displays the number of steps per minute.
7). Heart rate: The heart rate is measured and displayed by the pulse sensor.
8). Slope: Measures and displays the slope of the ground during mountain training and trail runs.
9. Auto lap: lap measurement is automatically performed when a predetermined distance or time is set.
10. Exercise calorie consumption: Displays the calorie consumption.
11. Number of steps: Displays the total number of steps from the start of exercise.

  Note that the wrist device 1000 can be widely applied to a running watch, a runner's watch, a multi-sports runner's watch such as a duathlon or a triathlon, an outdoor watch, and a satellite positioning system such as a GPS watch equipped with GPS.

  In the above description, GPS (Global Positioning System) is used as the satellite positioning system, but other Global Navigation Satellite System (GNSS) may be used. For example, one or more satellite positioning systems such as EGNOS (European Geostationary-Satellite Navigation Overlay Service), QZSS (Quasi Zenith Satellite System), GLONASS (GLObal NAvigation Satellite System), GALILEO, BeiDou (BeiDou Navigation Satellite System) May be used. Also, using satellite-based augmentation systems (SBAS) such as WAAS (Wide Area Augmentation System) and EGNOS (European Geostationary-Satellite Navigation Overlay Service) as at least one of the satellite positioning systems Also good.

  Since such a portable electronic device includes the physical quantity sensor 1 and the processing unit 100, it is compact and has excellent reliability.

[Electronics]
Next, an electronic device using the physical quantity sensor 1 will be described in detail with reference to FIGS.

  First, a mobile personal computer that is an example of an electronic device will be described with reference to FIG. FIG. 22 is a perspective view schematically illustrating a configuration of a mobile personal computer that is an example of an electronic apparatus.

  In this figure, a personal computer 1100 includes a main body portion 1104 provided with a keyboard 1102 and a display unit 1106 provided with a display portion 1108. The display unit 1106 is rotated with respect to the main body portion 1104 via a hinge structure portion. It is supported movably. Such a personal computer 1100 includes a physical quantity sensor 1 that functions as an angular velocity sensor, and the control unit 1110 can perform control such as posture control based on detection data of the physical quantity sensor 1.

  FIG. 23 is a perspective view schematically illustrating a configuration of a smartphone (mobile phone) that is an example of the electronic apparatus.

  In this figure, a smart phone 1200 incorporates the physical quantity sensor 1 described above. Detection data (acceleration data) detected by the physical quantity sensor 1 is transmitted to the control unit 1201 of the smartphone 1200. The control unit 1201 includes a CPU (Central Processing Unit), recognizes the attitude and behavior of the smartphone 1200 from the received detection data, and changes the display image displayed on the display unit 1208. It is possible to sound a warning sound or a sound effect, or drive a vibration motor to vibrate the main body. In other words, motion sensing of the smartphone 1200 can be performed, and the display content can be changed or sound or vibration can be generated from the measured posture or behavior. In particular, when a game application is executed, a realistic sensation can be experienced.

  FIG. 24 is a perspective view illustrating a configuration of a digital still camera which is an example of an electronic apparatus. In this figure, connection with an external device is also simply shown.

  In this figure, a display unit 1310 is provided on the back of the case (body) 1302 of the digital still camera 1300, and the display unit 1310 performs display based on an image pickup signal from the CCD. It also functions as a viewfinder that displays images. A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302.

  When the photographer confirms the subject image displayed on the display unit 1310 and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308. In this digital still camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302. As shown in the figure, a television monitor 1430 is connected to the video signal output terminal 1312 and a personal computer 1440 is connected to the input / output terminal 1314 for data communication as necessary. Further, the imaging signal stored in the memory 1308 is output to the television monitor 1430 or the personal computer 1440 by a predetermined operation. Such a digital still camera 1300 has a built-in physical quantity sensor 1 that functions as an acceleration sensor, and the control unit 1316 can perform control such as camera shake correction based on detection data of the physical quantity sensor 1.

  Since such an electronic device includes the physical quantity sensor 1 and the control units 1110, 1201, and 1316, it is compact and has excellent reliability.

  In addition to the personal computer of FIG. 22, the smartphone (mobile phone) of FIG. 23, and the digital still camera of FIG. Inkjet printers), laptop personal computers, televisions, video cameras, video tape recorders, car navigation devices, pagers, electronic notebooks (including those with communication functions), electronic dictionaries, calculators, electronic game devices, word processors, workstations, televisions Telephone, crime prevention TV monitor, electronic binoculars, POS terminal, medical equipment (for example, electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish detector, various measuring devices, instruments Type (e.g., vehicle, Aircraft, ship instrumentation), flight simulators, seismometers, pedometers, inclinometers, vibrometers that measure hard disk vibrations, robot and drone attitude control devices such as robots, drones, and inertial navigation for automatic driving of automobiles The present invention can be applied to control devices that are used.

[Moving object]
Next, a moving body using the physical quantity sensor 1 is shown in FIG. 25 and will be described in detail. FIG. 25 is a perspective view illustrating a configuration of an automobile which is an example of a moving body.

  As shown in FIG. 25, the physical quantity sensor 1 is built in the automobile 1500, and for example, the movement (position) and posture of the vehicle body 1501 can be detected by the physical quantity sensor 1. The detection signal of the physical quantity sensor 1 is supplied to a vehicle body posture control device 1502 that controls the movement and posture of the vehicle body. The vehicle body posture control device 1502 detects the posture of the vehicle body 1501 based on the signal, and according to the detection result. The hardness of the suspension can be controlled, and the brakes of the individual wheels 1503 can be controlled. The physical quantity sensor 1 also includes a keyless entry system, immobilizer, car navigation system, car air conditioner, anti-lock brake system (ABS), airbag, tire pressure monitoring system (TPMS: Tire Pressure Monitoring System), It can be widely applied to an electronic control unit (ECU) such as an engine control system (engine system), a control device for inertial navigation for automatic driving, and a battery monitor of a hybrid vehicle or an electric vehicle.

  In addition to the above examples, the physical quantity sensor 1 applied to the moving body is, for example, remote control or autonomous such as movement and posture control of a biped robot or train, a radio control airplane, a radio control helicopter, and a drone. It is used in the movement and attitude control of the flying aircraft, movement and attitude control of agricultural machinery (agricultural machinery) or construction machinery (construction machinery), control of rockets, artificial satellites, ships, AGVs (automated guided vehicles), etc. be able to. As described above, the physical quantity sensor 1 and each control unit (not shown) are incorporated in realizing the movement (position) and posture control of various moving bodies.

  Since such a moving body includes the physical quantity sensor 1 and a control unit (for example, a vehicle body posture control device 1502 as a posture control unit), it is compact and has excellent reliability.

  As described above, the physical quantity sensor, the physical quantity sensor device, the composite sensor, the inertial measurement unit, the portable electronic device, the electronic device, and the moving body have been described based on the illustrated embodiment, but the present invention is not limited to this. The configuration of each unit can be replaced with any configuration having the same function. In addition, any other component may be added to the present invention.

  In the above-described embodiment, the X axis, the Y axis, and the Z axis are orthogonal to each other. However, the X axis is not limited to this as long as they intersect with each other. The Y axis may be slightly inclined with respect to the normal direction of the XZ plane, or the Z axis may be slightly inclined with respect to the normal direction of the XY plane. Note that “slightly” means a range in which the physical quantity sensor 1 can exert its effect, and a specific inclination angle (numerical value) varies depending on the configuration and the like.

  Below, the content derived | led-out from embodiment mentioned above is described as each aspect.

  [Aspect 1] A method of manufacturing a physical quantity sensor according to this aspect includes a substrate, a movable portion that is displaceable with respect to the substrate, a fixed portion that is fixed to the substrate and is spaced apart and opposed to the movable portion. A process for joining a workpiece to the substrate, and the workpiece in a state where the fixed portion and the workpiece are electrically connected by a conductor portion. Etching the member and forming the movable portion in a state of being electrically connected to the fixed portion by the conductor portion; and placing the conductor portion outside the lid that houses the movable portion and the fixed portion. Disposing and bonding the lid to the substrate; and after bonding the lid to the substrate, etching the conductor and electrically separating the movable portion and the fixed portion; ,have.

  According to this aspect, the movable portion in a state of being electrically connected to the fixed portion is formed by the conductor portion, the conductor portion is disposed outside the lid body that houses the movable portion and the fixed portion, and the lid body is the substrate. After joining, the movable part and the fixed part are electrically separated by etching the conductor part. Thereby, when etching a conductor part, since a movable part and a fixed part are protected by the cover body, damage to a movable part or a fixed part can be reduced.

  [Aspect 2] In the method of manufacturing a physical quantity sensor according to the above aspect, the physical quantity sensor includes a step of dividing the substrate into pieces, and the conductor portion is disposed outside the region to be cut by the separation.

  According to this aspect, since the conductor portion is disposed outside the region to be cut by singulation, the region to be cut by singulation can be reduced, and the manufacturing efficiency can be improved by downsizing the substrate. be able to.

  [Aspect 3] In the method of manufacturing a physical quantity sensor according to the above aspect, the conductor portion is formed of titanium tungsten (TiW).

  According to this aspect, the conductor portion can be easily removed by etching.

  [Aspect 4] In the method of manufacturing a physical quantity sensor according to the above aspect, the second metal has a connection terminal including a first metal layer and a second metal layer disposed outside the connected lid. The layer is provided between the substrate and the first metal layer, and the conductor portion includes the same material as the second metal layer.

  According to this aspect, since the lid and the first metal layer can be used as an etching mask, it is not necessary to form a mask when removing the conductor portion, and the manufacturing process can be simplified.

  [Aspect 5] In the method of manufacturing a physical quantity sensor according to the above aspect, the conductor portion is provided between the connection terminal and the lid.

  According to this aspect, since the conductor portion is disposed between the connection terminal and the lid body outside the region to be cut by singulation, the manufacturing efficiency can be increased by downsizing the substrate or the like. .

  [Aspect 6] In the method of manufacturing a physical quantity sensor according to the above aspect, the connection terminal includes a first connection terminal connected to the movable part and a second connection terminal connected to the fixed part, The conductor portion is provided between the first connection terminal and the second connection terminal.

  According to this aspect, the conductor portion can be disposed between the first connection terminal and the second connection terminal, that is, without increasing the arrangement area. Thereby, further miniaturization of a board | substrate etc. can be implement | achieved and manufacturing efficiency can further be raised.

  DESCRIPTION OF SYMBOLS 1, 1a, 1b ... Physical quantity sensor, 2 ... Board | substrate, 3 ... Sensor element, 3A ... Movable structure, 3B ... 1st fixed structure, 3C ... 2nd fixed structure, 10 ... Cover, 11 ... Recessed part, 19 ... Glass frit, 21 ... Recess, 25, 26, 27, 28, 29 ... Groove, 30 ... Silicon substrate, 31, 32 ... Fixed part, 33 ... Movable base part, 34, 35 ... Spring part, 36 ... Movable electrode finger 37 ... first fixed electrode finger, 38 ... second fixed electrode finger, 75, 76, 77, 78 ... wiring (second metal layer), 79 ... first metal layer, 200 ... physical quantity sensor device, 900 ... composite sensor , 1000 ... wrist device, 1100 ... personal computer, 1200 ... smart phone, 1300 ... digital still camera, 1500 ... automobile, 3000 ... inertial measurement unit, L, L1 ... scribe line, ... connection terminal, P1 ... first connecting terminal, P2 ... second connecting terminal.

Claims (6)

A physical quantity sensor manufacturing method comprising: a substrate; a movable portion that can be displaced with respect to the substrate; and a fixed portion that is fixed to the substrate and that is spaced apart and opposed to the movable portion.
Bonding a workpiece to the substrate;
Etching the workpiece in a state where the fixed portion and the workpiece are electrically connected by a conductor portion, and the movable portion in a state of being electrically connected to the fixed portion by the conductor portion Forming, and
Disposing the conductor part on the outside of a lid that houses the movable part and the fixed part, and bonding the lid to the substrate;
And manufacturing the physical quantity sensor, comprising: a step of etching the conductor portion and electrically separating the movable portion and the fixed portion after joining the lid to the substrate. Method. A step of separating the substrate into pieces,
The method of manufacturing a physical quantity sensor according to claim 1, wherein the conductor portion is disposed outside a region cut out by the singulation.   The method of manufacturing a physical quantity sensor according to claim 1, wherein the conductor portion is made of titanium tungsten (TiW). A connection terminal including a first metal layer and a second metal layer disposed outside the connected lid,
The second metal layer is provided between the substrate and the first metal layer,
The said conductor part contains the same material as the said 2nd metal layer, The manufacturing method of the physical quantity sensor as described in any one of Claim 1 thru | or 3 characterized by the above-mentioned.   The method of manufacturing a physical quantity sensor according to claim 4, wherein the conductor portion is provided between the connection terminal and the lid. The connection terminal includes a first connection terminal connected to the movable part and a second connection terminal connected to the fixed part,
The method of manufacturing a physical quantity sensor according to claim 4, wherein the conductor portion is provided between the first connection terminal and the second connection terminal.

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