JP2019008989A - ソケット及び検査治具 - Google Patents
ソケット及び検査治具 Download PDFInfo
- Publication number
- JP2019008989A JP2019008989A JP2017123757A JP2017123757A JP2019008989A JP 2019008989 A JP2019008989 A JP 2019008989A JP 2017123757 A JP2017123757 A JP 2017123757A JP 2017123757 A JP2017123757 A JP 2017123757A JP 2019008989 A JP2019008989 A JP 2019008989A
- Authority
- JP
- Japan
- Prior art keywords
- insulating support
- contact probe
- socket
- inspection
- inspection substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007689 inspection Methods 0.000 title claims abstract description 86
- 239000000758 substrate Substances 0.000 claims abstract description 65
- 239000000523 sample Substances 0.000 claims abstract description 55
- 238000009423 ventilation Methods 0.000 claims abstract description 22
- 239000011810 insulating material Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- 238000012360 testing method Methods 0.000 description 32
- 239000004065 semiconductor Substances 0.000 description 19
- 238000009833 condensation Methods 0.000 description 7
- 230000005494 condensation Effects 0.000 description 7
- 230000007547 defect Effects 0.000 description 7
- 238000005259 measurement Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 125000006850 spacer group Chemical group 0.000 description 5
- 238000007664 blowing Methods 0.000 description 4
- 230000008014 freezing Effects 0.000 description 3
- 238000007710 freezing Methods 0.000 description 3
- 238000007791 dehumidification Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical class O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000011358 absorbing material Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
- H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Connecting Device With Holders (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017123757A JP2019008989A (ja) | 2017-06-23 | 2017-06-23 | ソケット及び検査治具 |
| TW107115044A TW201906258A (zh) | 2017-06-23 | 2018-05-03 | 插座及檢查輔助具 |
| PCT/JP2018/022431 WO2018235676A1 (ja) | 2017-06-23 | 2018-06-12 | ソケット及び検査治具 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017123757A JP2019008989A (ja) | 2017-06-23 | 2017-06-23 | ソケット及び検査治具 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2019008989A true JP2019008989A (ja) | 2019-01-17 |
Family
ID=64737064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017123757A Pending JP2019008989A (ja) | 2017-06-23 | 2017-06-23 | ソケット及び検査治具 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2019008989A (zh) |
| TW (1) | TW201906258A (zh) |
| WO (1) | WO2018235676A1 (zh) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110726918B (zh) * | 2019-09-25 | 2022-04-05 | 苏州韬盛电子科技有限公司 | 阻抗匹配结构的半导体芯片测试同轴插座及其制备方法 |
| TWI745775B (zh) * | 2019-11-01 | 2021-11-11 | 美商第一檢測有限公司 | 晶片測試裝置及晶片測試系統 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003297989A (ja) * | 2002-04-05 | 2003-10-17 | Moldec Kk | 集積回路用冷却装置及び集積回路装着用組立体 |
| JP2004311304A (ja) * | 2003-04-09 | 2004-11-04 | Yamaichi Electronics Co Ltd | Ｂｇａ形ｉｃパッケージ用ソケット |
| JP2007198835A (ja) * | 2006-01-25 | 2007-08-09 | Murata Mfg Co Ltd | 高周波特性測定治具 |
| JP6475479B2 (ja) * | 2014-11-27 | 2019-02-27 | 株式会社ヨコオ | 検査ユニット |
-
2017
- 2017-06-23 JP JP2017123757A patent/JP2019008989A/ja active Pending
-
2018
- 2018-05-03 TW TW107115044A patent/TW201906258A/zh unknown
- 2018-06-12 WO PCT/JP2018/022431 patent/WO2018235676A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018235676A1 (ja) | 2018-12-27 |
| TW201906258A (zh) | 2019-02-01 |
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